Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01K—ELECTRIC INCANDESCENT LAMPS
  • H01K1/00—Details
  • H01K1/42—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp
  • H01K1/46—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp supported by a separate part, e.g. base, cap
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01K—ELECTRIC INCANDESCENT LAMPS
  • H01K1/00—Details
  • H01K1/36—Seals between parts of vessel, e.g. between stem and envelope
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01K—ELECTRIC INCANDESCENT LAMPS
  • H01K1/00—Details
  • H01K1/42—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp
  • H01K1/44—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp directly applied to, or forming part of, the vessel
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01K—ELECTRIC INCANDESCENT LAMPS
  • H01K1/00—Details
  • H01K1/62—One or more circuit elements structurally associated with the lamp
  • H01K1/66—One or more circuit elements structurally associated with the lamp with built-in fuse
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B3/00—Ohmic-resistance heating
  • H05B3/0033—Heating devices using lamps
  • H05B3/0038—Heating devices using lamps for industrial applications

Definitions

• Embodiments of the present disclosure generally relate to an apparatus for thermally processing a substrate.
• embodiments of the present disclosure relate to an adapter for lamps used as a source of heat radiation in a rapid thermal processing (RTP) chamber.
• RTP rapid thermal processing
• thermal radiation is generally used to rapidly heat a substrate in a controlled environment to a maximum temperature of up to about 1350°C. This maximum temperature is maintained for a specific amount of time ranging from less than one second to several minutes depending on the particular process. The substrate is then cooled to room temperature for further processing.
• High voltage, e.g., about 40 volts to about 130 volts, tungsten halogen lamps are commonly used as the source of heat radiation in RTP chambers.
• Current lamp assembly designs include a lamp body, a bulb and a base coupling to the lamp body.
• the lamp base mates to a receptacle on a printed circuit board (PCB) structure, facilitating easy removal and replacement of the lamp assembly.
• PCB printed circuit board
• Embodiments of the disclosure generally relate to an improved adapter for lamps used as a source of heat radiation in a rapid thermal processing (RTP) chamber.
• a lamp assembly is provided.
• the lamp assembly includes a capsule having a filament disposed therein, a press seal coupling to the capsule, and an adapter having a receptacle contoured to receive at least a portion of the press seal, wherein the press seal is removably engaged with the adapter.
• a lamp assembly for use in a thermal processing chamber.
• the lamp assembly includes a lamp element comprising a capsule having a filament disposed therein, a press seal extending from the capsule, a first filament lead and a second filament lead, the first and second filament leads extend from the filament to a first metal foil and a second metal foil disposed within the press seal, respectively, and a first electrically conductive lead and a second electrically conductive lead, the first and second electrically conductive leads electrically connect the first and second metal foils to respective electrically conductive receptacles formed in a printed circuit board (PCB) structure positioned external to the lamp assembly, and an adapter having an opening at first and second ends thereof, wherein the opening at the first end has a receptacle contoured to receive at least a portion of the press seal, and the receptacle is configured to removably engage with the press seal.
• PCB printed circuit board
• an adapter for a lamp element includes an elongate body having a first end and a second end opposing the first end, wherein an opening at the first end has a receptacle contoured to receive at least a seal portion of a lamp element to be removably engaged with the elongate body, wherein the seal portion encapsulates and creates a hermetic seal about a metal foil connected to a filament of the lamp element.
• Figure 1 is a schematic, cross-sectional view of a thermal processing chamber having an array of lamp assemblies.
• Figure 6B is a schematic perspective view of Figure 6A. DETAILED DESCRIPTION
• the adapter may optionally provide a fuse (and/or electrical receptacles for the lamp element) which can be replaced from the side, top, or bottom of the adapter.
• the adapter provides a receptacle for receiving a portion of the lamp element.
• the receptacle is contoured and may be coated to aid in directing thermal radiation to the target in a controlled manner.
• the adapter may provide thermal conductive features and a cooling path to facilitate heat transfer from the lamp element to the outside world. As a result, the lamp can be operated so that critical parts are at a temperature low enough to permit long lamp life. Details of various embodiments are discussed below.
• Each zone can be independently controlled to provide fine control of the radial profile of heat delivered to the substrate 164.
• the radiation source 188 is capable of rapidly heating the substrate 164 for thermal processing, for example at a rate of from about 50°C/s to about 280°C/s.
• a cooling fluid such as, for example, water
• Figure 2 illustrates a top view of the array 196 of lamp assemblies 20 in lamp assembly housings 204 in the cooling chamber 212. Cooling fluid travels in the space 236 between the lamp assembly housings 204, and may be directed by baffles 240 to ensure an effective fluid flow to transfer heat from the lamp assemblies 20 in the lamp assembly housings 204.
• a vacuum pump 248 is provided to reduce the pressure in the lamp assembly housings 204. The vacuum pump 248 is coupled to the lamp assembly housings 204 by a conduit 252 in the cylindrical sidewall 224 and grooves in the bottom wall 220 of the cooling chamber 212.
• the RTP chamber 100 may further include a printed circuit board (PCB) structure 297 on top of the upper cooling fluid chamber wall 216.
• the PCB structure 297 may include receptacles 299 configured to receive electrical connectors of the lamp assembly 20.
• the PCB structure 297 may also include electrical traces and other electrical elements to deliver power and signals to the lamp assemblies 20 from the multi-zone lamp driver 276 and controller 272. Each of the plurality of lamp assemblies 20 is inserted into the PCB structure 297 for electrical connection through the driver 276 to a power supply source (not shown).
• the adapter 306 may have a general tubular or cylindrical body, or elongate body having some of its cross sectional periphery matching the cross sectional periphery of the lamp head where the lamp is normally inserted.
• the adapter 306 has a first end 304 and a second end 314 opposing the first end 304.
• the first end 304 of the adapter 306 has a receptacle 324 contoured to receive the bottom portion of the lamp element 302, for example the press seal 312.
• the lamp element 302 generally includes a light transmissive capsule 308 that contains a filament 310, and a press seal 312 coupling to the light transmissive capsule 308.
• the filament 310 electrically connects to metal foils 318a, 318b disposed within the press seal 312 by filament leads 316a, 316b, respectively.
• the press seal 312 encapsulates and creates a hermetic seal about the metal foils 318a, 318b.
• the metal foils 318a, 318b may extend out of the press seal 312.
• the metal foils 318a, 318b are in electrical communication with optional electrical connectors 320a, 320b via electrically conductive wires or leads 322a, 322b extending through the adapter 306.
• the adapter 306 have channels 332a, 332b configured to allow the passage of the electrically conductive wires or leads 322a, 322b.
• the channels 332a, 332b may extend from the receptacle 324 in a direction along a longitudinal axis 303 of the adapter. In some cases where the electrical conductors are sufficiently insulated and do not require additional cooling, the channels 332a and 332b may be connected to form one channel.
• the second end 314 of the adapter 306 may be sealed with a plug 330.
• the electrical connectors 320a, 320b extend through and out of the plug 330 to insert into respective electrically conductive receptacles 299 formed within the PCB structure 297 for distributing power to the filament 310.
• the electrically conductive wires or leads 322a, 322b may connect to the electrical connectors 320a, 320b as shown in Figure 3.
• the at least one of the electrically conductive wires or leads 322a, 322b of the lamp element 302 may have an engagement feature configured to be engaged with electrically conductive receptacles 299 formed within the PCB structure 297.
• the lamp element 302 for example the press seal 312, may have a corresponding groove 328 formed in the exterior surface of the press seal 312.
• the mating extension 326 snaps into the groove 328 and locks them into place.
• a portion or the entire press seal 312 is received within the receptacle 324. While not discussed, it is contemplated that the adapter 306 and the lamp element 302 may have any other suitable engagement features to allow easy, fast replacement and attachment of the adapter and/or the lamp element.
• the height of the adapter 306 may vary depending upon the length of the lamp element 302 (i.e., capsule 308 and/or the press seal 312) and the configuration of thermal processing chamber. In certain types of thermal processing chamber, a constant distance is required between the lamp assembly and a chamber dome of the thermal processing chamber to provide uniform radiant heating of the substrate. In such a case, the adapter 306 may be made at a uniform size and configured to engage with the lamp element 302 at different heights. Alternatively, the adapter 306 may be made with different heights to engage with the lamp element 302 made with the same height.
• the adapter 306 may have a height of about 5 mm to about 240 mm, such as about 8 mm to about 100 mm, for example about 10 mm to about 20 mm, about 20 mm to about 30 mm, about 30 mm to about 40 mm, about 40 mm to about 50 mm, about 50 mm to about 60 mm, about 60 mm to about 70 mm, about 70 mm to about 80 mm, about 80 mm to about 90 mm, about 90 mm to about 100 mm.
• the interior surface 317 of the receptacle 324 may be made conical, cylindrical, hemispherical or arcuate in shape and coated with a light reflecting material such as aluminum, protected aluminum, gold or gold-plated aluminum, or even a diffuse reflective material such as titania, alumina, silica, zirconia, or hafnia.
• the top surface of the receptacle 324 described herein refers to the surface facing the bulb while the interior surface 317 refers to the surface in close proximity to the press seal 312.
• a gas gap 350 may be provided between the press seal 312 and the interior surface 317 of the adapter 306. The gas gap 350 serves as a cooling path to facilitate heat transfer from the lamp element 302 to the outside world.
• the gas gap 350 is about 0.005 mm to about 1 mm.
• the wall thickness of the adapter 306, particularly the wall surrounding the press seal 312, may be about 0.5 mm to about 30 mm. It should be noted that the wall thickness may vary for rectangular cross section press seals in circular cross section adapter.
• a combination of one or more of these approaches greatly facilitates transfer of heat away from the lamp bulb and lamp element to the cooling fluid flowing through the lamphead housing surrounding the plurality of lamp assemblies.
• the temperature of the press seal 312 can be kept below about 350°C. As a result, bulb life of the lamp assembly is improved.
• the lamp element 302 may or may not have a fuse (not shown) in the light transmissive capsule 308 or the press seal 312.
• the fuse is generally provided to limit arcing and potential explosion in the lamp during lamp failure.
• the fuse may be provided external to the light transmissive capsule 308 and the press seal 312 to prevent undesirable cracking or breaking of the capsule during lamp failure.
• the lamp element 302 is a simple capsule/fuse style (i.e., the adapter does not contain a fuse and the fuse is incorporated internal or external to the lamp element 302), the fuse can be replaced along with the lamp element 302.
• the adapter 306 may optionally provide a fuse to be connected to the electrically conductive wires or leads 322a, 322b.
• the lamp element may make electrical connection to receptacles inside the adapter rather than directly to the PCB.
• the fuse can be made separated from the adapter 306 and be replaced through the side or the second end 314 or even the top of the adapter 306, as will be discussed in further detail below with respect to Figures 6A and 6B.
• the lamp element 302 may include additional components to provide sufficient rigidity to the electrically conductive wires or leads 322a, 322b to absorb the compressive forces applied during insertion of the lamp assembly 300 into the PCB structure 297 (i.e., prevents the fuse from undergoing compression).
• additional components to provide sufficient rigidity to the electrically conductive wires or leads 322a, 322b to absorb the compressive forces applied during insertion of the lamp assembly 300 into the PCB structure 297 (i.e., prevents the fuse from undergoing compression).
• the fuse may be optionally incorporated in other parts of the circuit, e.g., the PCB board, and not required in the lamp element 302 or the adapter 306.
• FIGS 4A-4F are schematic depictions of exemplary lamp element designs that may be used to engage with the adapter 306 according to embodiments of the disclosure.
• the lamp element 400 depicted in each of these Figures generally includes a quartz capsule 402 housing a tungsten filament 404.
• Tungsten leads 406a, 406b extend from the filament 404 and are each attached (e.g., welded) to molybdenum foil 408a, 408b.
• Molybdenum leads 410a, 410b are attached (e.g., welded) and extend from the molybdenum foil 408a, 408b.
• a quartz press seal 412 encapsulates and creates a hermetic seal about the molybdenum foil 408a, 408b.
• the molybdenum leads 410a, 41 Ob extend out of the press seal 412.
• a conductive pin 414 is attached ⁇ e.g., welded) to the lead 410b.
• an insulative sleeve 416 ⁇ e.g., ceramic or plastic sleeve
• a fuse 418 e.g., a conductive pin 420 are attached to the lead 410a.
• the fuse 418 composition may be from the same family of metals used for lamp fuses, such as nickel, zinc, copper, silver, aluminum, and alloys thereof.
• the conductive pin 414 and the conductive pin 420 extend through the channels 332a, 332b formed within the adapter 306 and are inserted into or engaged with respective electrically conductive receptacles 299 formed within the PCB structure 297 for connection to a power supply.
• the insulative sleeve 416 may have a thin metallic layer 422 deposited over the inner surface 417 of the sleeve 416.
• the equivalent cross-section of the metallic layer 422 (normal to the current flow) approximately corresponds to that of a fuse wire or ribbon designed for this application.
• the metallic layer 422 composition may be from the same family of metals used for lamp fuses, e.g., nickel, zinc, copper, silver, aluminum, and alloys thereof.
• the lead 410a and the conductive pin 420 are electrically connected to the metallic layer 422, e.g., soldered, brazed, interference fitted or compression fitted.
• the thin metallic layer 422 is constructed to act as the fuse 418.
• the insulative sleeve 416 may have a thin metallic trace 424 deposited along one side of the inner surface 417 of the sleeve 416.
• the lead 410a and the conductive pin 420 are fixed to the sleeve 416 in electrical contact with the trace 424, which acts as the fuse 418.
• the lead 410a and the conductive pin 420 may be attached to the sleeve 416 using a ceramic compound, a high temperature epoxy, a high temperature phenolic resin, or shrink tubing, for example.
• the trace 424 can be extended to cover the entire inner diameter for a short axial extent at the top and bottom of the insulative sleeve 416 to permit attachment of the sleeve 416 to the conductive pin 420 and the lead 410a by snldfirinn nr brazing.
• a wire fuse 418 is attached (e.g., welded, soldered) to the lead 410a and extends through the insulative sleeve 416.
• the fuse 418 is further attached ⁇ e.g., welded, soldered) to the conductive pin 420.
• each of the lamp elements 400 depicted in Figures 4A-4C provides for connection between the leads 410a, 410b and the conductive pins 414, 420 to be inserted into or engaged with the PCB structure 297 shown in Figure 1 , without requiring the use of ceramic potting compound or any thermal conductivity compound in the lamp elements 400 as opposed to prior art high voltage, tungsten halogen lamps. In most cases, the ceramic potting compound or thermal conductivity compound may be eliminated from the lamp assembly even after the lamp element 400 is engaged with the inventive adapter as discussed in Figures 3, 5 and 6.
• the insulative tube configuration can provide the rigidity to absorb the compressive forces applied during insertion of the conductive pins 414, 420 into the PCB structure 297.
• each of the Figures 4A-4C depicts a conductive pin 414 attached to the lead 410b
• the lead 410b is attached to an additional insulative sleeve 416 ⁇ e.g., ceramic or plastic sleeve), an additional fuse 418, and an additional conductive pin 420 in the same manner as shown with regard to lead 410a.
• each of the pins 414 and 420 may be configured to be compatible with mating receptacles 299 formed in the PCB structure 297.
• FIG. 5 is a front schematic, cross-sectional view of an exemplary lamp assembly 500 according to embodiments of the disclosure for use in an RTP chamber, such as the RTP chamber 100.
• the lamp assembly 500 may be used in place of the lamp assembly 20 shown in Figure 1 .
• the lamp assembly 500 generally includes a lamp element 501 and an adapter 513.
• the lamp element 501 may be a simple capsule/fuse style, i.e., the adapter 513 does not contain a fuse and the fuse is made external to the lamp element 501 .
• the lamp element 501 includes a capsule 502 housing a filament 504, and a press seal 512 coupling to the capsule 502.
• the capsule 502 may have a variety of shapes, including but not limited to tubular, conical, spherical, and multi-arcuate shapes.
• the press seal 512 may have a shape corresponding to that of the capsule 502 or may be in any shape to allow extension of filament leads 506a, 506b from the filament 504 to metal foils 508a, 508b.
• the press seal 512 is of elongate substantially rectangular shape.
• Metal leads 510a, 510b are attached to (e.g., welded) and extended from the metal foil 508a, 508b through and outside of the press seal 512.
• the press seal 512 encapsulates and creates a hermetic seal about the metal foils 508a, 508b.
• the adapter 513 may have a general tubular or cylindrical body having a first end 523 facing the press seal 512 and a second end 525 opposing the first end 523.
• the cylindrical body provides ease of manufacture, although other cross- sectional shapes, such as square, rectangular, triangular and multi-arcuate shapes, are possible.
• the adapter 513 may have channels 527, 529 configured to allow the passage of the metal leads 510a, 510b. Similar to the adapter 306 ( Figure 3), the adapter 513 is configured to removably engage with the press seal 512.
• the adapter 513 has a receptacle 509 contoured to receive at least a portion of the press seal 512.
• the adapter 513 may have an outer diameter of about 2 mm to about 50 mm, for example about 10 mm to about 35 mm, and an inner diameter of about 1 mm to about 49 mm, for example about 9 mm to about 34 mm.
• the wall thickness of the adapter 513, particularly the wall surrounding the press seal 512, may be about 0.5 mm to about 30 mm.
• a higher thermal conductivity compound may be presented between the press seal 512 and the receptacle 509.
• the thermal conductivity compound may have a thermal conductivity of about 1 -2 W/(K-m) to about 150 W/(m-k) or higher, for example exceeding 200 W/(m-K).
• Some possible materials may include, but are not limited to MgPO , ZrSiO 4 , ZrO2, MgO, AI 3 N , and S1O2.
• the same thermal conductivity compound may also form on exposed surfaces of the channels 527, 529 to allow cooling of the metal leads 510a, 510b extending therethrough.
• the lamp element 501 may or may not provide a fuse.
• Figure 5 illustrates an embodiment where the fuse is provided external to the lamp capsule 502.
• the metal leads 510a, 510b may include additional components as discussed above with respect to Figures 4A-4F to provide sufficient rigidity to the metal leads 510a, 510b to absorb the compressive forces applied during insertion of the lamp assembly 500 into the PCB structure 297 (i.e., prevents the fuse from undergoing compression).
• the metal lead 510b may be connected to a conductive pin 514, which extends through the adapter 513 to be inserted into or engaged with the mating receptacle 299 formed in the PCB structure 297.
• the conductive pin 514, the insulative sleeve 516, the fuse 518, and the conductive pin 520 provide a rigid, conductive extension for inserting the lamp assembly 500 into the printed circuit board (PCB) structure 297.
• PCB printed circuit board
• Figure 6A depicts a schematic sectional view of an exemplary lamp assembly 600 according to another embodiment of the disclosure.
• Figure 6B is a schematic perspective view of Figure 6A.
• Figure 6A is generally similar in concept to Figures 3 and 5 except that the adapter 613 is configured to provide with a fuse that can be replaced from the side or bottom of the adapter 613.
• the lamp assembly 600 generally includes a lamp element 601 and an adapter 613.
• the lamp element 601 may be a simple capsule style, i.e., the lamp element 601 does not contain a fuse and the fuse is provided by the adapter 613.
• the lamp element 601 includes a capsule 602 housing a filament 604, and a press seal 612 coupling to the capsule 602.
• the press seal 612 may be in any shape to allow extension of filament leads 606a, 606b from the filament 604 to metal foils 608a, 608b.
• the press seal 612 is of elongate substantially rectangular shape (better seen in Figure 6B).
• Metal leads 610a, 610b are attached to ⁇ e.g., welded) and extended from the metal foil 608a, 608b through and outside of the press seal 612.
• the press seal 612 encapsulates and creates a hermetic seal about the metal foils 608a, 608b.
• the adapter 613 may have sockets 627, 629 extending within the adapter 613 in a direction along a longitudinal axis 603 of the adapter 613.
• the sockets 627, 629 are configured to allow for the insertion of the metal leads 610a, 610b.
• the sockets 627, 629 may incorporate retention feature to be engaged or disengaged with corresponding retention features provided on the metal leads 610a, 610b.
• the retention features disclosed in this disclosure may include laterally operative elements such as a contact spring, a spring-loaded member, a slider, a notch or groove, etc.
• the sockets 627, 629 may be in electrical connection with respective conductive pins 620, 614 formed through the adapter 613.
• the adapter 613 may have an outer diameter of about 2 mm to about 50 mm, for example about 10 mm to about 35 mm, and an inner diameter of about 1 mm to about 49 mm, for example about 9 mm to about 34 mm.
• the wall thickness of the adapter 613, particularly the wall surrounding the press seal 612, may be about 0.5 mm to about 30 mm.
• a higher thermal conductivity compound may be presented between the press seal 612 and the receptacle 609.
• the thermal conductivity compound may have a thermal conductivity of about 1 -2 W/(K-m) to about 150 W/(m-k) or higher, for example exceeding 200 W/(m-K).
• Some possible materials may include, but are not limited to MgPO , ZrSiO , ZrO 2 , MgO, AI 3 N 4 , and SiO 2 .
• the same or a different thermal conductivity compound may be formed on exposed surfaces of the sockets 627, 629 to allow cooling of the metal leads 610a, 610b extending therethrough.
• fuses 618a, 618b are electrically attached (e.g., welded) between the conductive pins 620, 614 and electrical connectors 620, 622.
• either one of the fuses 618a, 618b may be replaced with a conductive wire or lead.
• the adapter 613 may provide one or more cut-outs 652 sized enough to allow access to fuses 618a, 618b for service through the cut-out 652 of the adapter 613.
• the cut-out 652 may be formed in the sidewall 633 of the cylindrical body of the adapter 613.
• the fuses 618a, 618b can be replaced through the second end 625 of the adapter 613.
• Embodiments of the lamp assembly discussed in Figures 3, 5 and 6A-6B may be beneficial to certain thermal processing chambers having an improved PCB structure configured to allow an easy, fast replacement of the lamp assembly, without moving the entire lamphead assembly or the PCB structure.
• the PCB structure 297 may be provided with a plurality of openings (corresponding to the locations of the lamp assemblies) sized to allow the passage of the lamp assembly, such as lamp assemblies 300, 500, and 600, therethrough for fast lamp replacement and ease of service of the lamphead assembly.
• the electrical connectors of the lamp assemblies 300, 500, and 600 may have electrical connection features configured in electrical communication with electrical contact terminals provided within or around the openings to securely position and power the lamps in the lamp assembly from a power source.
• Benefits of the present disclosure include an easy, fast replacement of a lamp element by making the lamp element removably engaged with the adapter so that the lamp element and/or the adapter can be individually replaced.
• Making the adapter and the lamp element removable from each other and interchangeable in the lamp assembly reduces lamp replacement cost once the adapter is purchased.
• the adapter may provide an optional fuse which can be replaced from the side or bottom of the adapter.
• the adapter may provide a receptacle contoured and may be coated to aid in directing thermal radiation to the target in a controlled manner.
• the adapter may provide features and a cooling path to facilitate heat transfer from the lamp element to the outside world. As a result, the lamp can be operated with press seal temperature low enough to permit long lamp life.

Landscapes

• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
• Non-Portable Lighting Devices Or Systems Thereof (AREA)
• Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
• Discharge Lamps And Accessories Thereof (AREA)

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• 2014
  • 2014-11-18 KR KR1020197036953A patent/KR102127688B1/ko active Active
  • 2014-11-18 KR KR1020167019604A patent/KR102058012B1/ko active Active
  • 2014-11-18 CN CN201910809633.XA patent/CN110645553B/zh active Active
  • 2014-11-18 JP JP2016541311A patent/JP6431073B2/ja active Active
  • 2014-11-18 CN CN201480068623.0A patent/CN106133888B/zh active Active
  • 2014-11-18 WO PCT/US2014/066192 patent/WO2015094542A1/en not_active Ceased
  • 2014-11-18 US US14/546,103 patent/US9922815B2/en not_active Expired - Fee Related
  • 2014-12-01 TW TW103141632A patent/TWI677647B/zh active
• 2018
  • 2018-03-14 US US15/921,281 patent/US10319579B2/en active Active

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