TWI677647B - 用於可換式電燈之適配器以及包括用於可換式電燈之適配器的燈具組件 - Google Patents
用於可換式電燈之適配器以及包括用於可換式電燈之適配器的燈具組件 Download PDFInfo
- Publication number
- TWI677647B TWI677647B TW103141632A TW103141632A TWI677647B TW I677647 B TWI677647 B TW I677647B TW 103141632 A TW103141632 A TW 103141632A TW 103141632 A TW103141632 A TW 103141632A TW I677647 B TWI677647 B TW I677647B
- Authority
- TW
- Taiwan
- Prior art keywords
- adapter
- conductive
- guide
- pressing seal
- insulating sleeve
- Prior art date
Links
- 238000003825 pressing Methods 0.000 claims abstract description 76
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 55
- 239000011888 foil Substances 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000011324 bead Substances 0.000 claims description 2
- 238000004891 communication Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 239000002775 capsule Substances 0.000 abstract description 20
- 230000005855 radiation Effects 0.000 abstract description 19
- 238000012545 processing Methods 0.000 abstract description 17
- 239000007789 gas Substances 0.000 description 28
- 239000000758 substrate Substances 0.000 description 24
- 238000001816 cooling Methods 0.000 description 14
- 230000006835 compression Effects 0.000 description 13
- 238000007906 compression Methods 0.000 description 13
- 238000012546 transfer Methods 0.000 description 13
- 230000013011 mating Effects 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000012809 cooling fluid Substances 0.000 description 10
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 238000000429 assembly Methods 0.000 description 8
- 230000000712 assembly Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- 235000012239 silicon dioxide Nutrition 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000010453 quartz Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910006501 ZrSiO Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004880 explosion Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000005339 levitation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- -1 tungsten halogen Chemical class 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/42—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp
- H01K1/46—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp supported by a separate part, e.g. base, cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/36—Seals between parts of vessel, e.g. between stem and envelope
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/42—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp
- H01K1/44—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp directly applied to, or forming part of, the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/62—One or more circuit elements structurally associated with the lamp
- H01K1/66—One or more circuit elements structurally associated with the lamp with built-in fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
- Discharge Lamps And Accessories Thereof (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361918451P | 2013-12-19 | 2013-12-19 | |
| US61/918,451 | 2013-12-19 | ||
| US14/546,103 | 2014-11-18 | ||
| US14/546,103 US9922815B2 (en) | 2013-12-19 | 2014-11-18 | Adapter for replaceable lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201530050A TW201530050A (zh) | 2015-08-01 |
| TWI677647B true TWI677647B (zh) | 2019-11-21 |
Family
ID=53400803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103141632A TWI677647B (zh) | 2013-12-19 | 2014-12-01 | 用於可換式電燈之適配器以及包括用於可換式電燈之適配器的燈具組件 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9922815B2 (enExample) |
| JP (1) | JP6431073B2 (enExample) |
| KR (2) | KR102127688B1 (enExample) |
| CN (2) | CN110645553B (enExample) |
| TW (1) | TWI677647B (enExample) |
| WO (1) | WO2015094542A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10405375B2 (en) * | 2013-03-11 | 2019-09-03 | Applied Materials, Inc. | Lamphead PCB with flexible standoffs |
| US10271383B2 (en) | 2015-10-13 | 2019-04-23 | Applied Materials, Inc. | Lamp base adapter design for baseless lamps |
| US12449327B2 (en) * | 2022-07-19 | 2025-10-21 | Applied Materials, Inc. | Method and apparatus for lamp housing crack detection |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1435979A (en) * | 1972-09-19 | 1976-05-19 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Halogen incandescent lamp |
| US4570104A (en) * | 1982-11-02 | 1986-02-11 | U.S. Philips Corporation | Electric lamp having a fuse in a feed-through molding |
| US6075318A (en) * | 1997-03-11 | 2000-06-13 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluelampen Mbh | Halogen incandescent lamp having a socket |
| US20030076026A1 (en) * | 2001-10-23 | 2003-04-24 | Trent Carl Douglas | Thin walled lamp with tungsten halogen capsule and pyrophoric fuse |
| US20050286243A1 (en) * | 2004-06-25 | 2005-12-29 | Applied Materials, Inc. | Lamp assembly having flexibly positioned rigid plug |
| US20060066193A1 (en) * | 2004-09-27 | 2006-03-30 | Applied Materials, Inc. | Lamp array for thermal processing exhibiting improved radial uniformity |
| JP2007200806A (ja) * | 2006-01-30 | 2007-08-09 | Harison Toshiba Lighting Corp | ハロゲンランプ、ランプ装置 |
| TW200845104A (en) * | 2007-02-15 | 2008-11-16 | Applied Materials Inc | Lamp for rapid thermal processing chamber |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3256507A (en) * | 1964-05-01 | 1966-06-14 | Gen Electric | Base end structure for electric lamps or similar devices |
| JPS52154080U (enExample) * | 1976-05-19 | 1977-11-22 | ||
| CA1214202A (en) * | 1982-11-02 | 1986-11-18 | Victor R. Noteleteirs | Electric lamp |
| DE3600991A1 (de) * | 1986-01-15 | 1987-07-16 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Hochdruckentladungslampe und verfahren zu ihrer herstellung |
| US5155336A (en) | 1990-01-19 | 1992-10-13 | Applied Materials, Inc. | Rapid thermal heating apparatus and method |
| DE19548521A1 (de) * | 1995-12-22 | 1997-06-26 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lampen-Reflektor-Einheit |
| US6582253B1 (en) * | 2000-06-01 | 2003-06-24 | Kenneth Lau | Lock-in compact fluorescent lamp (CFL) adaptor |
| US6350964B1 (en) | 2000-11-09 | 2002-02-26 | Applied Materials, Inc. | Power distribution printed circuit board for a semiconductor processing system |
| JP4828031B2 (ja) * | 2001-03-02 | 2011-11-30 | 東京エレクトロン株式会社 | ランプ、ランプを用いた熱処理装置 |
| US6653782B2 (en) * | 2001-12-27 | 2003-11-25 | Koninklijke Philips Electronics N.V. | Fuse and safety switch for halogen incandescent lamps |
| JP2005524199A (ja) * | 2002-04-26 | 2005-08-11 | フェニックス・ランプス・インディア・リミテッド | 白熱電気ランプ及びソケットのアセンブリ |
| JP2003331613A (ja) * | 2002-05-17 | 2003-11-21 | Yazaki Corp | 自動車用電球の接続構造 |
| US6947665B2 (en) | 2003-02-10 | 2005-09-20 | Axcelis Technologies, Inc. | Radiant heating source with reflective cavity spanning at least two heating elements |
| JP4254296B2 (ja) * | 2003-03-25 | 2009-04-15 | ニプロ株式会社 | 自動車用電球 |
| KR20050067835A (ko) * | 2003-12-29 | 2005-07-05 | 삼성전자주식회사 | 프로세스 챔버의 램프 어셈블리 |
| KR200383667Y1 (ko) | 2004-01-06 | 2005-05-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 일체형 열 싱크를 구비한 할로겐 램프 어셈블리 및 상기 할로겐 램프 어셈블리를 포함하는 기판 처리 챔버 |
| US7522822B2 (en) * | 2004-01-06 | 2009-04-21 | Robert Trujillo | Halogen lamp assembly with integrated heat sink |
| DE102004006438A1 (de) * | 2004-02-09 | 2005-08-25 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Fahrzeugscheinwerferlampe |
| DE102004037381A1 (de) * | 2004-08-02 | 2006-03-16 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Kittlos gesockelte Lampe |
| US8045334B2 (en) * | 2005-10-21 | 2011-10-25 | Koninklijke Philips Electronics N.V. | Component adapted for being mounted on a substrate and a method of mounting a surface mounted device |
| US7612491B2 (en) * | 2007-02-15 | 2009-11-03 | Applied Materials, Inc. | Lamp for rapid thermal processing chamber |
| DE202008016865U1 (de) * | 2008-12-19 | 2010-02-11 | Osram Gesellschaft mit beschränkter Haftung | Elektrische Lampe mit einem Außenkolben und einer Einbaulampe |
| US8102110B2 (en) * | 2009-02-04 | 2012-01-24 | Iwasaki Electric Co., Ltd. | Lamp with outer bulb |
| JP5343949B2 (ja) * | 2010-09-15 | 2013-11-13 | ウシオ電機株式会社 | ベース付きフィラメントランプ |
| KR101118154B1 (ko) | 2011-07-04 | 2012-03-12 | (주) 예스티 | 기판의 열처리장치용 램프 |
| DE202013007411U1 (de) * | 2013-08-16 | 2013-09-03 | Osram Gmbh | Elektrische Lampe und zugehöriges Herstellverfahren |
-
2014
- 2014-11-18 KR KR1020197036953A patent/KR102127688B1/ko active Active
- 2014-11-18 KR KR1020167019604A patent/KR102058012B1/ko active Active
- 2014-11-18 CN CN201910809633.XA patent/CN110645553B/zh active Active
- 2014-11-18 JP JP2016541311A patent/JP6431073B2/ja active Active
- 2014-11-18 CN CN201480068623.0A patent/CN106133888B/zh active Active
- 2014-11-18 WO PCT/US2014/066192 patent/WO2015094542A1/en not_active Ceased
- 2014-11-18 US US14/546,103 patent/US9922815B2/en not_active Expired - Fee Related
- 2014-12-01 TW TW103141632A patent/TWI677647B/zh active
-
2018
- 2018-03-14 US US15/921,281 patent/US10319579B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1435979A (en) * | 1972-09-19 | 1976-05-19 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Halogen incandescent lamp |
| US4570104A (en) * | 1982-11-02 | 1986-02-11 | U.S. Philips Corporation | Electric lamp having a fuse in a feed-through molding |
| US6075318A (en) * | 1997-03-11 | 2000-06-13 | Patent-Treuhand-Gesellschaft Fuer Elektrische Gluelampen Mbh | Halogen incandescent lamp having a socket |
| US20030076026A1 (en) * | 2001-10-23 | 2003-04-24 | Trent Carl Douglas | Thin walled lamp with tungsten halogen capsule and pyrophoric fuse |
| US20050286243A1 (en) * | 2004-06-25 | 2005-12-29 | Applied Materials, Inc. | Lamp assembly having flexibly positioned rigid plug |
| US20060066193A1 (en) * | 2004-09-27 | 2006-03-30 | Applied Materials, Inc. | Lamp array for thermal processing exhibiting improved radial uniformity |
| JP2007200806A (ja) * | 2006-01-30 | 2007-08-09 | Harison Toshiba Lighting Corp | ハロゲンランプ、ランプ装置 |
| TW200845104A (en) * | 2007-02-15 | 2008-11-16 | Applied Materials Inc | Lamp for rapid thermal processing chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017511953A (ja) | 2017-04-27 |
| WO2015094542A1 (en) | 2015-06-25 |
| KR102127688B1 (ko) | 2020-06-29 |
| WO2015094542A8 (en) | 2016-09-09 |
| CN106133888A (zh) | 2016-11-16 |
| KR102058012B1 (ko) | 2020-01-22 |
| US9922815B2 (en) | 2018-03-20 |
| CN106133888B (zh) | 2019-10-01 |
| JP6431073B2 (ja) | 2018-11-28 |
| CN110645553A (zh) | 2020-01-03 |
| CN110645553B (zh) | 2020-09-29 |
| US20180204715A1 (en) | 2018-07-19 |
| US10319579B2 (en) | 2019-06-11 |
| US20150179425A1 (en) | 2015-06-25 |
| TW201530050A (zh) | 2015-08-01 |
| KR20190141267A (ko) | 2019-12-23 |
| KR20160102242A (ko) | 2016-08-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10026630B2 (en) | Retention and insulation features for lamp | |
| CN101617191B (zh) | 用于快速热处理腔室的灯 | |
| JP5865531B2 (ja) | 急速熱処理チャンバ用のランプ | |
| TWI677647B (zh) | 用於可換式電燈之適配器以及包括用於可換式電燈之適配器的燈具組件 | |
| US10820379B2 (en) | Lamp base adapter design for baseless lamps | |
| US10405375B2 (en) | Lamphead PCB with flexible standoffs |