WO2015093308A1 - 円筒基材、原盤、及び原盤の製造方法 - Google Patents

円筒基材、原盤、及び原盤の製造方法 Download PDF

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Publication number
WO2015093308A1
WO2015093308A1 PCT/JP2014/082171 JP2014082171W WO2015093308A1 WO 2015093308 A1 WO2015093308 A1 WO 2015093308A1 JP 2014082171 W JP2014082171 W JP 2014082171W WO 2015093308 A1 WO2015093308 A1 WO 2015093308A1
Authority
WO
WIPO (PCT)
Prior art keywords
master
cylindrical base
base material
cylindrical
resist layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2014/082171
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
穣 村本
正尚 菊池
俊一 梶谷
孝聡 音羽
高橋　康弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to US15/026,509 priority Critical patent/US10207470B2/en
Priority to DE112014004375.3T priority patent/DE112014004375B4/de
Priority to CN201480043133.5A priority patent/CN105408265B/zh
Priority to KR1020157035938A priority patent/KR101635338B1/ko
Publication of WO2015093308A1 publication Critical patent/WO2015093308A1/ja
Anticipated expiration legal-status Critical
Priority to US15/950,596 priority patent/US11090886B2/en
Priority to US17/393,963 priority patent/US12097675B2/en
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
    • B29C41/28—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length by depositing flowable material on an endless belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
    • B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/261—Preparing a master, e.g. exposing photoresist, electroforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2909/00—Use of inorganic materials not provided for in groups B29K2803/00 - B29K2807/00, as mould material
    • B29K2909/08—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/34—Masking

Definitions

  • the state of the exposure beam changes as the surface properties (waviness, roughness) and outer shape (roundness) of the cylindrical quartz substrate change.
  • the pattern accuracy deteriorates due to the interaction between the distortion of the quartz substrate and the heat generation of the inorganic resist.
  • FIG. 1 is a perspective view showing an outline of a cylindrical base material.
  • 2A is a perspective view showing an example of the configuration of the roll master
  • FIG. 2B is an enlarged plan view of a part of the surface of the roll master shown in FIG. 2A.
  • FIG. 3 is a schematic view showing an example of the configuration of an exposure apparatus for producing a roll master.
  • FIG. 4 is a schematic view showing an example of the configuration of an etching apparatus for producing a roll master.
  • FIG. 5A is a cross-sectional view showing an outline of a cylindrical base material
  • FIG. 5B is a cross-sectional view showing an outline of a cylindrical base material with a resist layer formed on the outer peripheral surface
  • FIG. 5C is an exposure of the resist layer.
  • the amplitude of waviness with a period of 10 mm or less in the circumferential direction on the outer peripheral surface of the cylindrical substrate 11 is preferably less than 100 nm, and more preferably 50 nm or less.
  • the circumferential period on the outer peripheral surface of the cylindrical base material 11 is 10 mm or less.
  • the amplitude of the undulation is less than 100 nm, the focus servo mechanism of the exposure apparatus can follow, and the size variation of the exposure pattern can be suppressed. For example, when a moth-eye-shaped antireflection pattern is exposed, an antireflection characteristic having a uniform in-plane distribution can be obtained.
  • the circumferential undulation on the outer peripheral surface of the cylindrical substrate 11 can be obtained by measuring the coordinate data of the cylindrical curved surface using, for example, a stylus type surface shape roughness measuring machine.
  • Examples of the exposure apparatus that can be used in the exposure process and the etching apparatus that can be used in the etching process include apparatuses having the following configuration examples.
  • the mirror 23 is composed of a polarization beam splitter, and has a function of reflecting one polarization component and transmitting the other polarization component.
  • the polarized light component transmitted through the mirror 23 is received by the photodiode 24, and the electro-optic element 22 is controlled based on the received light signal, and the phase modulation of the laser light 20 is performed.
  • a substrate 61 such as a sheet is wound around the substrate supply roll 51 in a roll shape, and is arranged so that the substrate 61 can be continuously fed through the guide roll 53.
  • the take-up roll 52 is disposed so as to take up the laminate having the resin layer 62 having the concavo-convex shape transferred by the transfer device.
  • the guide rolls 53 and 54 are arranged on a conveyance path in the transfer unit so that the laminated body of the base body 61 and the resin layer 62 can be conveyed.
  • the nip roll 55 is arranged so that the substrate 61 fed from the substrate supply roll 51 and coated with the photocurable resin composition can be nipped with the roll-shaped master 10.
  • the master 10 has a transfer surface for forming the resin layer 62.
  • the peeling roll 56 is disposed so that the resin layer 62 obtained by curing the photocurable resin composition can be peeled off from the transfer surface of the master 10.
  • Example 2 when the amplitude of the waviness with a period of 10 mm or less in the circumferential direction on the outer peripheral surface of the cylindrical base material is less than 100 nm, it is possible to suppress the variation in size of the exposure pattern, and the reflected light intensity distribution was uniform.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electromagnetism (AREA)
  • Ophthalmology & Optometry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Glass Melting And Manufacturing (AREA)
PCT/JP2014/082171 2013-12-20 2014-12-04 円筒基材、原盤、及び原盤の製造方法 Ceased WO2015093308A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US15/026,509 US10207470B2 (en) 2013-12-20 2014-12-04 Cylindrical base, master and master manufacturing method
DE112014004375.3T DE112014004375B4 (de) 2013-12-20 2014-12-04 Zylindrische Basis, Master, Verfahren zur Herstellung eines Masters und Verfahren zur Herstellung eines optischen Elements
CN201480043133.5A CN105408265B (zh) 2013-12-20 2014-12-04 圆筒基体材料、原盘及原盘的制造方法
KR1020157035938A KR101635338B1 (ko) 2013-12-20 2014-12-04 원통 기재, 원반 및 원반의 제조 방법
US15/950,596 US11090886B2 (en) 2013-12-20 2018-04-11 Cylindrical base, master and master manufacturing method
US17/393,963 US12097675B2 (en) 2013-12-20 2021-08-04 Cylindrical base, master and master manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013264358A JP5848320B2 (ja) 2013-12-20 2013-12-20 円筒基材、原盤、及び原盤の製造方法
JP2013-264358 2013-12-20

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US15/026,509 A-371-Of-International US10207470B2 (en) 2013-12-20 2014-12-04 Cylindrical base, master and master manufacturing method
US15/950,596 Division US11090886B2 (en) 2013-12-20 2018-04-11 Cylindrical base, master and master manufacturing method

Publications (1)

Publication Number Publication Date
WO2015093308A1 true WO2015093308A1 (ja) 2015-06-25

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PCT/JP2014/082171 Ceased WO2015093308A1 (ja) 2013-12-20 2014-12-04 円筒基材、原盤、及び原盤の製造方法

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Country Link
US (3) US10207470B2 (enExample)
JP (1) JP5848320B2 (enExample)
KR (1) KR101635338B1 (enExample)
CN (2) CN105408265B (enExample)
DE (1) DE112014004375B4 (enExample)
TW (1) TWI530467B (enExample)
WO (1) WO2015093308A1 (enExample)

Families Citing this family (5)

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Publication number Priority date Publication date Assignee Title
JP6818479B2 (ja) 2016-09-16 2021-01-20 デクセリアルズ株式会社 原盤の製造方法
WO2019165435A1 (en) * 2018-02-26 2019-08-29 Carpe Diem Technologies, Inc. System and method for constructing a roller-type nanoimprint lithography (rnil) master
TWI822997B (zh) * 2020-05-08 2023-11-21 光群雷射科技股份有限公司 無縫全像圖圖案轉移方法
CN113625526A (zh) * 2020-05-08 2021-11-09 光群雷射科技股份有限公司 无缝全像图图案转移方法
DE102023122606A1 (de) * 2023-08-23 2025-02-27 scia Systems GmbH Optische Linse und Verfahren zum Ionenätzen einer gekrümmten Oberfläche eines Substrats

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JP2002167227A (ja) * 2000-11-30 2002-06-11 Shinetsu Quartz Prod Co Ltd 光学用合成石英ガラスの熱処理用容器および熱処理方法
JP2009199086A (ja) * 2009-02-23 2009-09-03 Sony Corp 光学素子およびその製造方法、ならびに光学素子作製用複製基板およびその製造方法
JP2011020360A (ja) * 2009-07-16 2011-02-03 Konica Minolta Holdings Inc 微細な凹凸パターンを有するフィルム構造体の形成方法、微細な凹凸パターンを有するフィルム構造体、太陽エネルギー収集用プリズムシート及び立体視ディスプレイ用光学フィルム
JP2013133277A (ja) * 2011-12-23 2013-07-08 J-Plasma Gmbh ロッドレンズの製造方法および製造装置

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JP4366193B2 (ja) * 2002-04-15 2009-11-18 長瀬産業株式会社 スタンパ原盤の製造方法及びスタンパの製造方法
JP2004308822A (ja) * 2003-04-09 2004-11-04 Ntn Corp 円筒ころ軸受
JP2005064143A (ja) * 2003-08-08 2005-03-10 Seiko Epson Corp レジストパターンの形成方法、配線パターンの形成方法、半導体装置の製造方法、電気光学装置及び電子機器
WO2009148138A1 (ja) * 2008-06-05 2009-12-10 旭硝子株式会社 ナノインプリント用モールド、その製造方法および表面に微細凹凸構造を有する樹脂成形体ならびにワイヤグリッド型偏光子の製造方法
JP4596072B2 (ja) * 2008-12-26 2010-12-08 ソニー株式会社 微細加工体の製造方法、およびエッチング装置
JP5664471B2 (ja) * 2010-06-28 2015-02-04 信越化学工業株式会社 半導体用合成石英ガラス基板の製造方法
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Publication number Priority date Publication date Assignee Title
JP2002167227A (ja) * 2000-11-30 2002-06-11 Shinetsu Quartz Prod Co Ltd 光学用合成石英ガラスの熱処理用容器および熱処理方法
JP2009199086A (ja) * 2009-02-23 2009-09-03 Sony Corp 光学素子およびその製造方法、ならびに光学素子作製用複製基板およびその製造方法
JP2011020360A (ja) * 2009-07-16 2011-02-03 Konica Minolta Holdings Inc 微細な凹凸パターンを有するフィルム構造体の形成方法、微細な凹凸パターンを有するフィルム構造体、太陽エネルギー収集用プリズムシート及び立体視ディスプレイ用光学フィルム
JP2013133277A (ja) * 2011-12-23 2013-07-08 J-Plasma Gmbh ロッドレンズの製造方法および製造装置

Also Published As

Publication number Publication date
TW201529505A (zh) 2015-08-01
US12097675B2 (en) 2024-09-24
CN107894691A (zh) 2018-04-10
DE112014004375T5 (de) 2016-06-09
US20180281239A1 (en) 2018-10-04
US20160214282A1 (en) 2016-07-28
JP2015120611A (ja) 2015-07-02
KR20160009066A (ko) 2016-01-25
KR101635338B1 (ko) 2016-06-30
DE112014004375B4 (de) 2017-03-16
CN105408265A (zh) 2016-03-16
US11090886B2 (en) 2021-08-17
US10207470B2 (en) 2019-02-19
JP5848320B2 (ja) 2016-01-27
TWI530467B (zh) 2016-04-21
US20210387429A1 (en) 2021-12-16
CN105408265B (zh) 2018-03-27

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