WO2015093087A1 - Appareil à lampe et appareil d'éclairage - Google Patents

Appareil à lampe et appareil d'éclairage Download PDF

Info

Publication number
WO2015093087A1
WO2015093087A1 PCT/JP2014/069752 JP2014069752W WO2015093087A1 WO 2015093087 A1 WO2015093087 A1 WO 2015093087A1 JP 2014069752 W JP2014069752 W JP 2014069752W WO 2015093087 A1 WO2015093087 A1 WO 2015093087A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
heat
substrate
emitting element
light emitter
Prior art date
Application number
PCT/JP2014/069752
Other languages
English (en)
Japanese (ja)
Inventor
淳一 木宮
石田　正純
一斎 樋口
大塚　誠
Original Assignee
東芝ライテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝ライテック株式会社 filed Critical 東芝ライテック株式会社
Priority to CN201490001029.5U priority Critical patent/CN205424858U/zh
Publication of WO2015093087A1 publication Critical patent/WO2015093087A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • Embodiments of the present invention relate to a lamp device in which heat generated in a light emitter is dissipated through a radiator and a lighting device including the lamp device.
  • a light emitting module (light emitting body) is disposed in a housing having an opening on one end and a base on the other end.
  • the light emitting module is thermally connected to the base part.
  • the lamp device is attached such that the base portion is in surface contact with the lighting fixture. That is, the heat generated in the light emitting module is conducted to the base part, and the heat is conducted from the base part to the lighting fixture side to dissipate heat.
  • the light emitting module has a substrate and a light emitting element mounted on the substrate, such as an LED. And in order to make thermal resistance of the nozzle
  • the lamp device of the embodiment includes a housing, a light emitter, and a heat radiator.
  • the housing is formed in an annular shape with a central portion opened in the front-rear direction.
  • the light emitter is formed having a substrate and a light emitting element mounted on the substrate.
  • the heat dissipator has an end face on one end side that is larger than the maximum diameter of the region where the light emitting element of the substrate is mounted, a heat dissipating face is formed on the end face on the other end side, and the light emitter emits light to the front side of the housing It is attached to a housing so that it does.
  • the heat generated in the light emitter is thermally conducted so as to spread from the end face on one end side of the heat sink to the end face on the other end side, so that the heat dissipation of the light emitter can be improved. I can expect.
  • FIG. 1A is a diagram illustrating a lamp device according to an embodiment.
  • FIG. 1B is a schematic top view of the lamp device according to the embodiment.
  • FIG. 1C is a schematic front view of the lamp device according to the embodiment.
  • FIG. 2 is a schematic exploded perspective view seen from the lower side of the lamp device.
  • FIG. 3 is a schematic exploded perspective view seen from the upper side of the lamp device.
  • FIG. 4 is a schematic diagram showing heat conduction in the radiator.
  • FIG. 5 is a partially cutaway schematic front view of the lighting device.
  • the lamp device 1 is attached to and detached from a base with a heat dissipation structure provided in the device main body, and as shown in FIGS. 1A to 3, a housing 2, a light emitter 3, a heat radiator 4 and a cover. 5 is formed.
  • a housing 2 a light emitter 3
  • a heat radiator 4 a heat radiator 4
  • a cover. 5 is formed.
  • description will be given with one end side of the lamp device 1 and the light irradiation side as the front side, and the other end side and the opposite side to the light irradiation direction as the rear side.
  • the housing 2 is formed in an annular shape from an insulating material such as a synthetic resin such as polybutylene terephthalate resin, and as shown in FIG. 2, the peripheral surface portion 6, the opening 7 on the front side of the peripheral surface portion 6 and the peripheral surface portion. 6 has a flat plate portion 8 on the rear side.
  • the flat plate portion 8 is formed in a flat shape, and a substantially cylindrical protruding portion 9 to which the heat radiating body 4 is attached protrudes from the flat plate portion 8 in the rearward direction so that the center portion is opened in the front-rear direction.
  • Dowels 11 having mounting holes 10 are provided on the inner peripheral surface side of the protruding portion 9 at 120 ° intervals in the circumferential direction. Further, as shown in FIG.
  • the notches 12 are provided on the rear side of the protruding portion 9 at intervals of 120 ° in the circumferential direction.
  • a plurality of lamp pins 13 are provided on the flat plate portion 8 so as to protrude perpendicularly to the rear side direction.
  • the plurality of lamp pins 13 includes a pair of lamp pins for power supply, a lamp pin for sensors, a dummy lamp pin, and the like.
  • the light-emitting body 3 is arrange
  • the light emitter 3 is also referred to as a light emitting module, and as shown in FIG. 2, the light emitter 3 includes a substrate 14 and a plurality of light emitting elements 15 mounted on the one surface 14 a side of the substrate 14. .
  • the substrate 14 is made of a material such as metal, ceramics, or resin having excellent thermal conductivity.
  • a wiring pattern (not shown) for electrically connecting the light emitting element 15 is formed on the one surface 14a side of the substrate 14, and connectors 16 and 16 electrically connected to the wiring pattern are mounted. Yes.
  • Connected to the connectors 16 and 16 are lead wires 17 and 17 electrically connected to a pair of lamp pins 13 and 13 for power supply.
  • the light emitting element 15 uses, for example, an SMD (Surface Mount Device) package in which an LED chip is sealed with a sealing resin containing a phosphor, and emits white light when energized.
  • the plurality of light emitting elements 15 are densely arranged in an array that forms a substantially circular shape on the one surface 14 a of the substrate 14.
  • the light emitting element 15 may be a COB (Chip On Board) method in which a plurality of LED chips are mounted on one surface 14a of the substrate 14 and are integrally sealed with a sealing resin containing a phosphor.
  • another semiconductor light emitting element such as an EL element may be used.
  • the light emitter 3 is thermally coupled to the radiator 4 in the housing 2. That is, as shown in FIG. 3, the other surface 14b of the substrate 14 is in close contact with the radiator 4 via the insulating sheet 18 having high thermal conductivity.
  • the insulating sheet 18 is made of, for example, a silicone resin and is formed in a disk having a predetermined thickness.
  • the heat radiator 4 is integrally formed of a material such as a metal such as aluminum die casting, ceramics, or a resin having excellent thermal conductivity. As shown in FIG. 1A, FIG. 1B, FIG. 1C and FIG. 2, the radiator 4 is flat and circular on the end face on one end side of the main body 19 including the solid truncated cone.
  • the light emitting body connecting portion 20 and the main body portion 19 are formed so as to have a circular heat radiating portion 21 having a diameter larger than that of the light emitting body connecting portion 20 on the end faces on the other end side.
  • the outer peripheral surface 19a of the main body 19 is set at, for example, an inclination angle of 45 ° with respect to the end surface on the other end side.
  • recesses 22 that avoid interference with the boss 11 of the housing 2 are formed at intervals of 120 ° in the circumferential direction.
  • hub 24 which has the screw hole 23 is formed so that it may hang down from the thermal radiation part 21, and the key 25 integrated with the thermal radiation part 21 and the boss
  • a plurality of key grooves 26 are formed on the outer peripheral surface 21 c of the heat radiating portion 21.
  • a shallow concave portion 28 into which the heat radiating sheet 27 is fitted is formed on the surface 21 a of the heat radiating portion 21.
  • the recess 28 is formed in a regular hexagon having the same shape as the heat dissipation sheet 27, and is formed as large as possible on the surface 21 a of the heat dissipation portion 21.
  • the heat dissipation sheet 27 is fitted in the recess 28.
  • a position where the heat radiation sheet 27 is attached to the surface 21 a of the heat radiation portion 21 is configured as a heat radiation surface 19 b of the heat radiator 19.
  • the thickness of the heat radiation sheet 27 is set so as to slightly protrude from the surface 21a of the heat radiation portion 21.
  • the heat dissipating sheet 27 is made of an insulating and elastic resin such as a silicone resin.
  • the heat dissipating body 4 has a main body 19 inserted into the inside of the protruding portion 9 of the housing 2 and a key 25 fitted into the notch 12 of the protruding portion 9.
  • the boss 11 of the housing 2 and the boss 24 of the radiator 4 are in direct contact with each other.
  • a screw (not shown) is completely screwed into the screw hole 23 of the boss 24 from the mounting hole 10 of the boss 11.
  • the heat radiating body 4 is fixed to the housing 2.
  • the radiator 4 is attached to the housing 2
  • the light emitter connecting portion 20 of the radiator 4 and the inner surface 8 b (shown in FIG. 2) of the flat plate portion 8 of the housing 2 are substantially the same surface. It has become a shape.
  • the light emitter 3 is disposed on the light emitter connection portion 20 of the radiator 4 with an insulating sheet 18 interposed therebetween.
  • the illuminant 3 is in close contact with the illuminant connection part 20 via the insulating sheet 18 on the other surface 14 b side of the substrate 14 by the cover 5.
  • the radiator 4 is attached to the rear side of the casing 2 so that the light emitter 3 emits light to the front side of the casing 2.
  • the radiator 4 is formed such that the light emitter connecting portion 20 that is the end face on one end side is larger than the maximum diameter D of the region of the substrate 14 where the light emitting element 15 is mounted.
  • a base 29 (shown in FIG. 1C) having a predetermined standard size is constituted by the rear side including the protruding portion 9 of the housing 2 and the heat radiating portion 21 of the heat radiating body 4.
  • a glass plate 30, a rubber damper 31, and a ring body 32 are interposed between the light emitter 3 and the cover 5.
  • the cover 5 is formed in a circular dish shape from a synthetic resin such as polycarbonate resin, and is attached to the housing 2 so as to cover the opening 7 of the housing 2.
  • a circular irradiation opening 33 is formed at the center of the cover 5.
  • the inner surface 5b of the cover 5 has a pair of arc-shaped wall portions 34, 34 in the vicinity of the irradiation opening 33 and a pair of locking wall portions 35, 35 between the arc-shaped wall portions 34, 34 in the rearward direction. Is formed to protrude.
  • a locking piece portion 39 having a plurality of fitting wall portions 36 and 37 and a claw portion 38 is formed in the vicinity of the outer peripheral edge 5c so as to protrude rearward.
  • the locking piece portions 39 are provided at 120 ° intervals in the circumferential direction of the cover 5.
  • the outer surface 5a of the cover 5 has a finger hooking portion 40 for facilitating the turning operation of the lamp device 1 attached to and detached from the base (socket) and the lamp device 1 to the base.
  • Alignment marks 41 are provided so as to make insertion easy.
  • a glass plate 30, a rubber damper 31, and a ring body 32 are disposed inside the pair of arcuate wall portions 34, 34 and the pair of locking wall portions 35, 35 of the cover 5.
  • the glass plate 30 is made of translucent tempered glass, is formed in a circular shape, and is placed on the inner surface 5 b of the cover 5.
  • the rubber damper 31 is made of, for example, a silicone resin, is formed in a substantially cylindrical shape, and has elasticity.
  • the ring body 32 is made of, for example, polycarbonate resin and is formed in a substantially cylindrical shape. The ring body 32 is formed in a size that surrounds the light emitting element 15 of the light emitting body 3.
  • the cover 5 is fitted into the opening 7 of the housing 2, and the claw portion 38 of the locking piece 39 is formed inside the peripheral surface portion 6 so as to protrude inward from the peripheral surface portion 6. It is locked to. Thereby, the cover 5 is firmly attached to the housing 2.
  • the glass plate 30 is pressed against the inner surface 5 b of the cover 5 to close the irradiation opening 33. Further, the elasticity of the rubber damper 31 presses the ring body 32, the substrate 14 of the light emitter 3, and the insulating sheet 18, so that the insulating sheet 18 is in close contact with the light emitter connecting portion 20 of the heat radiating body 4.
  • the surface 14 b is in close contact with the insulating sheet 18.
  • the lamp device 1 of the present embodiment configured as described above is attached to and detached from the lighting device 51 shown in FIG.
  • the lighting device 51 is a downlight embedded in a ceiling or the like, and covers the device main body 52, the socket 53 attached to the lower surface of the device main body 52, the lamp device 1 attached to the socket 53, and the lamp device 1. Is formed with a decorative frame 54 attached to the lower surface side of the apparatus main body 52.
  • the apparatus main body 52 is formed by, for example, aluminum die casting, and has a large number of radiation fins 56 on a relatively thick flat plate-like mounting plate 55.
  • a top plate 57 is attached to the upper surface 52a, and a terminal block 58 to which an output line of an external lighting device is connected is provided on the top plate 57.
  • An annular groove 59 is formed in the mounting plate 55, and a decorative frame 54 is fitted and fixed to the annular groove 59.
  • the decorative frame 54 is made of, for example, AES resin and is formed in a substantially cylindrical shape having a flange portion 60. On the outer surface 54a of the decorative frame 54, a reinforcing piece 61 is provided over the circumference, and a plurality of mounting springs 62 for fixing the lighting device 51 to the ceiling or the like, three in this embodiment, are provided.
  • the socket 53 includes a socket main body 63 formed in an annular shape with an insulating synthetic resin such as polycarbonate resin, and a pair of terminals for power supply (not shown) arranged in the socket main body 63. In the case of dimming support, a plurality of dimming terminals are also provided.
  • a circular insertion hole is formed through which the base portion 29 (projecting portion 9) of the lamp device 1 is inserted.
  • a plurality of connection holes into which the lamp pins 13 of the lamp device 1 are inserted are formed in the bottom surface of the socket body 63 in the shape of a long hole along the circumferential direction.
  • a terminal is disposed above each connection hole, and the lamp pin 13 of the lamp device 1 inserted into the connection hole is electrically connected to the terminal.
  • a plurality of keys project from the inner peripheral surface of the socket body 63, and a plurality of substantially L-shaped key grooves are formed.
  • the key and key groove of the socket 53 and the key groove 26 and key 25 of the lamp device 1 are provided at corresponding positions. Then, by fitting the key 25 and key groove 26 of the lamp device 1 to the key groove and key of the socket 53 and inserting the base portion 29 of the lamp device 1 into the socket 53 and rotating the lamp device 1, the lamp device 1. Is detachably attached to the socket 53.
  • the socket 53 is supported on the mounting plate 55 of the apparatus main body 52 by a support mechanism.
  • a support mechanism In this support mechanism, when the base portion 29 of the lamp device 1 is mounted on the socket 53, the upper surface of the base portion 29, that is, the surface 21 a side (heat dissipation sheet 27) of the heat radiating portion 21 of the radiator 4 is The mounting plate 55 is pressed to conduct heat.
  • the socket 53 is connected to the terminal block 58 by a power line 64 so that the output of the lighting device is supplied to the terminal of the socket 53.
  • the heat generated in the light emitter 15 is thermally conducted from the substrate 14 to the light emitter connection portion 20 of the radiator 4 through the insulating sheet 18.
  • a region inside the light emitting elements 15 densely arranged on the substrate 14 serves as a heat source.
  • heat conduction is performed while spreading at an angle of 45 ° from the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 toward the surface 21 a of the heat radiating portion 21. I will do it.
  • the maximum diameter of the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20 is A
  • the maximum diameter of the heat radiating surface 19 b is B
  • the thickness of the radiator 4 is T.
  • the radiator 4 is formed so that the thickness T further satisfies the relational expression T ⁇ A / 4. That is, the heat that spreads at an angle of 45 ° from the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20 toward the surface 21 a side of the heat dissipation portion 21 is the thickness of the heat radiator 4. If the length T is equal to or greater than A / 4, the heat spreading from the center of the region 66 and the heat spreading from the periphery of the region 66 are overlapped to conduct heat to the surface 21 a of the heat radiating portion 21.
  • the heat radiating surface 19b is soaked and easily conducted to the mounting plate 55 of the apparatus main body 52, and the heat generated in the light emitter 3 can be efficiently radiated. Therefore, the temperature rise of the light emitter 3 is further suppressed, and the life of the LED device 1 is extended.
  • the radiator 4 has the thickness T, the maximum diameter of the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20 is A, and the heat radiator.
  • the thickness T of the radiator 4 is formed so as to satisfy the relational expression T ⁇ A / 4, the heat generated in the light emitter 3 is thermally conducted to the heat radiating surface 19b substantially uniformly.
  • the heat radiating surface 19b can be soaked to dissipate heat, whereby the heat radiating property of the light emitter 3 is further improved, and the life of the light emitter 3 and the lamp device 1 can be further extended.
  • the illuminating device 51 has the effect that the lamp device 1 can be used over time and the running cost can be reduced by extending the life of the lamp device 1.
  • the heat radiator 4 has a structure for conducting heat so that heat generated in the light emitter 3 spreads from the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20 to the heat radiation surface 19b.
  • the shape of the outer peripheral surface 19a of the main body 19 is not particularly limited. That is, a protrusion such as a protrusion or an uneven portion may be formed on the outer peripheral surface 19 a of the main body 19.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Un appareil à lampe (1) comprend : un logement annulaire (2) comportant une partie centrale ouverte dans la direction avant-arrière; un corps d'émission de lumière (3) comportant un substrat (14) et un élément électroluminescent (15) monté sur le substrat (14); et un corps de dissipation de chaleur (4) comportant une surface d'extrémité du côté d'une première extrémité plus grande qu'un diamètre maximum d'une région du substrat (14) dans laquelle est monté l'élément électroluminescent (15), la surface d'extrémité du côté de l'autre extrémité étant pourvue d'une surface de dissipation de chaleur (19b) formée sur celle-ci, et comportant le corps d'émission de lumière (3) fixé au logement (2) d'une manière telle que le corps d'émission de lumière émet une lumière vers la surface avant du logement (2). Le corps de dissipation de chaleur (4) est formé de manière à satisfaire les expressions relationnelles B > A, T = (B-A)/2 et T ≥ A/4, où (T) est une épaisseur entre la surface d'extrémité du côté de la première extrémité et la surface d'extrémité du côté de l'autre extrémité, (A) est une taille correspondant à la région comportant l'élément électroluminescent (15) monté sur le substrat (14) sur la surface d'extrémité du côté de la première extrémité et (B) est une taille de la surface de dissipation de chaleur (19b) formée sur la surface d'extrémité du côté de l'autre extrémité.
PCT/JP2014/069752 2013-12-19 2014-07-25 Appareil à lampe et appareil d'éclairage WO2015093087A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201490001029.5U CN205424858U (zh) 2013-12-19 2014-07-25 灯装置以及照明装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013262416A JP6256750B2 (ja) 2013-12-19 2013-12-19 ランプ装置および照明装置
JP2013-262416 2013-12-19

Publications (1)

Publication Number Publication Date
WO2015093087A1 true WO2015093087A1 (fr) 2015-06-25

Family

ID=53402445

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/069752 WO2015093087A1 (fr) 2013-12-19 2014-07-25 Appareil à lampe et appareil d'éclairage

Country Status (4)

Country Link
JP (1) JP6256750B2 (fr)
CN (1) CN205424858U (fr)
TW (1) TWI616615B (fr)
WO (1) WO2015093087A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168365A (ja) * 2016-03-17 2017-09-21 アイリスオーヤマ株式会社 照明装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109156A (ja) * 2010-11-18 2012-06-07 Toshiba Lighting & Technology Corp ランプ装置および照明器具
JP2012216307A (ja) * 2011-03-31 2012-11-08 Toshiba Lighting & Technology Corp ランプ装置および照明器具
JP2013045708A (ja) * 2011-08-25 2013-03-04 Panasonic Corp 照明器具
WO2013046319A1 (fr) * 2011-09-27 2013-04-04 東芝ライテック株式会社 Lampe et appareil d'éclairage

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM345187U (en) * 2008-06-06 2008-11-21 Ya-Hui Chen Illumination lamp
CN202598170U (zh) * 2010-07-16 2012-12-12 东芝照明技术株式会社 灯装置以及照明装置
EP2481973B1 (fr) * 2011-01-31 2014-07-23 Toshiba Lighting & Technology Corporation Appareil d'éclairage et luminaire
JP2014086159A (ja) * 2012-10-19 2014-05-12 Toshiba Lighting & Technology Corp 照明器具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109156A (ja) * 2010-11-18 2012-06-07 Toshiba Lighting & Technology Corp ランプ装置および照明器具
JP2012216307A (ja) * 2011-03-31 2012-11-08 Toshiba Lighting & Technology Corp ランプ装置および照明器具
JP2013045708A (ja) * 2011-08-25 2013-03-04 Panasonic Corp 照明器具
WO2013046319A1 (fr) * 2011-09-27 2013-04-04 東芝ライテック株式会社 Lampe et appareil d'éclairage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168365A (ja) * 2016-03-17 2017-09-21 アイリスオーヤマ株式会社 照明装置

Also Published As

Publication number Publication date
TWI616615B (zh) 2018-03-01
TW201525359A (zh) 2015-07-01
JP2015118848A (ja) 2015-06-25
JP6256750B2 (ja) 2018-01-10
CN205424858U (zh) 2016-08-03

Similar Documents

Publication Publication Date Title
JP5582305B2 (ja) ランプ装置および照明器具
JP5534219B2 (ja) ランプ装置および照明器具
JP5799850B2 (ja) ランプ装置および照明器具
JP2009004130A (ja) 照明装置
WO2014119169A1 (fr) Dispositif d'éclairage à led
JP2014154230A (ja) ランプ装置、発光装置および照明装置
JP2012109155A (ja) 照明器具
CA2886730C (fr) Appareil d'eclairage encastre mince
JP2011204444A (ja) 発光装置および照明器具
JP2010073569A (ja) ランプ装置および照明器具
JP6197996B2 (ja) ランプ装置および照明器具
JP6256750B2 (ja) ランプ装置および照明装置
KR20100005008U (ko) 개방형 방열구조를 갖는 엘이디 램프
JP6264546B2 (ja) ランプ装置および照明装置
JP6451946B2 (ja) 照明装置
JP5674065B2 (ja) 電球形ランプ
JP5620595B2 (ja) 電球型の照明装置
JP5448011B2 (ja) 発光素子ランプ及び照明器具
JP6075542B2 (ja) 発光装置および照明装置
JP2017062934A (ja) ランプ装置および照明装置
JP2012227057A (ja) ランプユニット及びランプソケット
KR101918182B1 (ko) 엘이디 전구
JP2016181436A (ja) 照明装置
JP5132824B2 (ja) 照明装置
JP5501430B2 (ja) 照明装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14872490

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14872490

Country of ref document: EP

Kind code of ref document: A1