WO2015093087A1

WO2015093087A1 - Lamp apparatus and lighting apparatus

Info

Publication number: WO2015093087A1
Application number: PCT/JP2014/069752
Authority: WO
Inventors: 淳一木宮; 石田　正純; 一斎樋口; 大塚　誠
Original assignee: 東芝ライテック株式会社
Priority date: 2013-12-19
Filing date: 2014-07-25
Publication date: 2015-06-25
Also published as: JP2015118848A; TWI616615B; CN205424858U; JP6256750B2; TW201525359A

Abstract

A lamp apparatus (1) is provided with: an annular housing (2) having a center part thereof opened in the front-rear direction; a light emitting body (3) having a substrate (14), and a light emitting element (15) mounted on the substrate (14); and a heat dissipating body (4), which has one end-side end surface larger than a maximum diameter of a substrate (14) region where the light emitting element (15) is mounted, the other end-side end surface having a heat dissipating surface (19b) formed thereon, and which has the light emitting body (3) attached to the housing (2) such that the light emitting body outputs light to the front side of the housing (2). The heat dissipating body (4) is formed so as to satisfy relational expressions of B>A, T=(B-A)/2, and T≥A/4, where (T) is a thickness from the one end-side end surface to the other end-side end surface, (A) is a size corresponding to the region having the light emitting element (15) mounted on the substrate (14) on the one end side-end surface, and (B) is a size of the heat dissipating surface (19b) formed on the other end-side end surface.

Description

Lamp device and lighting device

Embodiments of the present invention relate to a lamp device in which heat generated in a light emitter is dissipated through a radiator and a lighting device including the lamp device.

Conventionally, flat lamp devices such as a lamp device using a GH76p-type base have been proposed. In this lamp device, a light emitting module (light emitting body) is disposed in a housing having an opening on one end and a base on the other end. The light emitting module is thermally connected to the base part. The lamp device is attached such that the base portion is in surface contact with the lighting fixture. That is, the heat generated in the light emitting module is conducted to the base part, and the heat is conducted from the base part to the lighting fixture side to dissipate heat.

The light emitting module has a substrate and a light emitting element mounted on the substrate, such as an LED. And in order to make thermal resistance of the nozzle | cap | die part from a board | substrate to a lighting fixture as small as possible, the height of a nozzle | cap | die part is made small (for example, refer patent document 1).

JP 2012-216307 A

However, if the height of the base part is small, heat is easily transferred from the heat source to the lighting fixture, but the contact surface between the base part and the lighting fixture cannot be used as a heat dissipation path sufficiently, and the contact surface of the base part. The heat transfer from the lamp to the lighting fixture is inefficient.

It is an object of the present invention to provide a lamp device that efficiently dissipates heat from a light emitter and a lighting device that is equipped with the lamp device.

The lamp device of the embodiment includes a housing, a light emitter, and a heat radiator.

The housing is formed in an annular shape with a central portion opened in the front-rear direction. The light emitter is formed having a substrate and a light emitting element mounted on the substrate. The heat dissipator has an end face on one end side that is larger than the maximum diameter of the region where the light emitting element of the substrate is mounted, a heat dissipating face is formed on the end face on the other end side, and the light emitter emits light to the front side of the housing It is attached to a housing so that it does. The heat dissipating body has a thickness T from one end face to the other end face, A a size corresponding to a region of the end face substrate on which the light emitting element is mounted, and an end face on the other end side. Assuming that the size of the heat radiation surface formed in is B, it is formed so as to satisfy the relational expressions B> A, T = (BA) / 2, and T ≧ A / 4.

According to the lamp device of the present embodiment, the heat generated in the light emitter is thermally conducted so as to spread from the end face on one end side of the heat sink to the end face on the other end side, so that the heat dissipation of the light emitter can be improved. I can expect.

FIG. 1A is a diagram illustrating a lamp device according to an embodiment. FIG. 1B is a schematic top view of the lamp device according to the embodiment. FIG. 1C is a schematic front view of the lamp device according to the embodiment. FIG. 2 is a schematic exploded perspective view seen from the lower side of the lamp device. FIG. 3 is a schematic exploded perspective view seen from the upper side of the lamp device. FIG. 4 is a schematic diagram showing heat conduction in the radiator. FIG. 5 is a partially cutaway schematic front view of the lighting device.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The lamp device 1 according to this embodiment is attached to and detached from a base with a heat dissipation structure provided in the device main body, and as shown in FIGS. 1A to 3, a housing 2, a light emitter 3, a heat radiator 4 and a cover. 5 is formed. In each figure, description will be given with one end side of the lamp device 1 and the light irradiation side as the front side, and the other end side and the opposite side to the light irradiation direction as the rear side.

The housing 2 is formed in an annular shape from an insulating material such as a synthetic resin such as polybutylene terephthalate resin, and as shown in FIG. 2, the peripheral surface portion 6, the opening 7 on the front side of the peripheral surface portion 6 and the peripheral surface portion. 6 has a flat plate portion 8 on the rear side. The flat plate portion 8 is formed in a flat shape, and a substantially cylindrical protruding portion 9 to which the heat radiating body 4 is attached protrudes from the flat plate portion 8 in the rearward direction so that the center portion is opened in the front-rear direction. Yes. Dowels 11 having mounting holes 10 are provided on the inner peripheral surface side of the protruding portion 9 at 120 ° intervals in the circumferential direction. Further, as shown in FIG. 3, the notches 12 are provided on the rear side of the protruding portion 9 at intervals of 120 ° in the circumferential direction. A plurality of lamp pins 13 are provided on the flat plate portion 8 so as to protrude perpendicularly to the rear side direction. The plurality of lamp pins 13 includes a pair of lamp pins for power supply, a lamp pin for sensors, a dummy lamp pin, and the like. And the light-emitting body 3 is arrange | positioned inside the surrounding surface part 6. FIG.

The light emitter 3 is also referred to as a light emitting module, and as shown in FIG. 2, the light emitter 3 includes a substrate 14 and a plurality of light emitting elements 15 mounted on the one surface 14 a side of the substrate 14. . The substrate 14 is made of a material such as metal, ceramics, or resin having excellent thermal conductivity. A wiring pattern (not shown) for electrically connecting the light emitting element 15 is formed on the one surface 14a side of the substrate 14, and

connectors

16 and 16 electrically connected to the wiring pattern are mounted. Yes. Connected to the

connectors

16 and 16 are

lead wires

17 and 17 electrically connected to a pair of

lamp pins

13 and 13 for power supply.

The light emitting element 15 uses, for example, an SMD (Surface Mount Device) package in which an LED chip is sealed with a sealing resin containing a phosphor, and emits white light when energized. The plurality of light emitting elements 15 are densely arranged in an array that forms a substantially circular shape on the one surface 14 a of the substrate 14. The light emitting element 15 may be a COB (Chip On Board) method in which a plurality of LED chips are mounted on one surface 14a of the substrate 14 and are integrally sealed with a sealing resin containing a phosphor. Alternatively, another semiconductor light emitting element such as an EL element may be used.

The light emitter 3 is thermally coupled to the radiator 4 in the housing 2. That is, as shown in FIG. 3, the other surface 14b of the substrate 14 is in close contact with the radiator 4 via the insulating sheet 18 having high thermal conductivity. The insulating sheet 18 is made of, for example, a silicone resin and is formed in a disk having a predetermined thickness.

The heat radiator 4 is integrally formed of a material such as a metal such as aluminum die casting, ceramics, or a resin having excellent thermal conductivity. As shown in FIG. 1A, FIG. 1B, FIG. 1C and FIG. 2, the radiator 4 is flat and circular on the end face on one end side of the main body 19 including the solid truncated cone. The light emitting body connecting portion 20 and the main body portion 19 are formed so as to have a circular heat radiating portion 21 having a diameter larger than that of the light emitting body connecting portion 20 on the end faces on the other end side. The outer peripheral surface 19a of the main body 19 is set at, for example, an inclination angle of 45 ° with respect to the end surface on the other end side.

Further, on the outer peripheral surface 19a of the main body 19, recesses 22 that avoid interference with the boss 11 of the housing 2 are formed at intervals of 120 ° in the circumferential direction. And in the recessed part 22, the boss | hub 24 which has the screw hole 23 is formed so that it may hang down from the thermal radiation part 21, and the key 25 integrated with the thermal radiation part 21 and the boss | hub 24 protrudes somewhat outward from the thermal radiation part 21 Is formed. A plurality of key grooves 26 are formed on the outer peripheral surface 21 c of the heat radiating portion 21. As shown in FIG. 3, a shallow concave portion 28 into which the heat radiating sheet 27 is fitted is formed on the surface 21 a of the heat radiating portion 21. As shown in FIG. 1B, the recess 28 is formed in a regular hexagon having the same shape as the heat dissipation sheet 27, and is formed as large as possible on the surface 21 a of the heat dissipation portion 21.

The heat dissipation sheet 27 is fitted in the recess 28. A position where the heat radiation sheet 27 is attached to the surface 21 a of the heat radiation portion 21 is configured as a heat radiation surface 19 b of the heat radiator 19. As shown in FIG. 1A or 1C, the thickness of the heat radiation sheet 27 is set so as to slightly protrude from the surface 21a of the heat radiation portion 21. The heat dissipating sheet 27 is made of an insulating and elastic resin such as a silicone resin.

3, the heat dissipating body 4 has a main body 19 inserted into the inside of the protruding portion 9 of the housing 2 and a key 25 fitted into the notch 12 of the protruding portion 9. At this time, the boss 11 of the housing 2 and the boss 24 of the radiator 4 are in direct contact with each other. In this state, a screw (not shown) is completely screwed into the screw hole 23 of the boss 24 from the mounting hole 10 of the boss 11. Thereby, the heat radiating body 4 is fixed to the housing 2. In a state where the radiator 4 is attached to the housing 2, in this embodiment, the light emitter connecting portion 20 of the radiator 4 and the inner surface 8 b (shown in FIG. 2) of the flat plate portion 8 of the housing 2 are substantially the same surface. It has become a shape.

The light emitter 3 is disposed on the light emitter connection portion 20 of the radiator 4 with an insulating sheet 18 interposed therebetween. The illuminant 3 is in close contact with the illuminant connection part 20 via the insulating sheet 18 on the other surface 14 b side of the substrate 14 by the cover 5. Thus, the radiator 4 is attached to the rear side of the casing 2 so that the light emitter 3 emits light to the front side of the casing 2.

The radiator 4 is formed such that the light emitter connecting portion 20 that is the end face on one end side is larger than the maximum diameter D of the region of the substrate 14 where the light emitting element 15 is mounted. In addition, as shown in FIG. 1A, the radiator 4 has a thickness T between the light emitter connection portion 20 and the surface 21a of the heat dissipation portion 21, and a region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20. If the maximum diameter of the board mounting surface 19c as a size corresponding to A is A and the maximum diameter as the size of the heat radiating surface 19b is B, the relational expressions B> A and T = (BA) / 2 are satisfied. It is formed to have a solid truncated cone. The radiator 4 is further formed to satisfy the relational expression of T ≧ A / 4.

A base 29 (shown in FIG. 1C) having a predetermined standard size is constituted by the rear side including the protruding portion 9 of the housing 2 and the heat radiating portion 21 of the heat radiating body 4. As shown in FIG. 3, a glass plate 30, a rubber damper 31, and a ring body 32 are interposed between the light emitter 3 and the cover 5.

The cover 5 is formed in a circular dish shape from a synthetic resin such as polycarbonate resin, and is attached to the housing 2 so as to cover the opening 7 of the housing 2. A circular irradiation opening 33 is formed at the center of the cover 5. The inner surface 5b of the cover 5 has a pair of arc-shaped

wall portions

34, 34 in the vicinity of the irradiation opening 33 and a pair of locking

wall portions

35, 35 between the arc-shaped

wall portions

34, 34 in the rearward direction. Is formed to protrude. Further, on the inner surface 5b of the cover 5, a locking piece portion 39 having a plurality of

fitting wall portions

36 and 37 and a claw portion 38 is formed in the vicinity of the outer peripheral edge 5c so as to protrude rearward. The locking piece portions 39 are provided at 120 ° intervals in the circumferential direction of the cover 5.

Further, as shown in FIG. 2, the outer surface 5a of the cover 5 has a finger hooking portion 40 for facilitating the turning operation of the lamp device 1 attached to and detached from the base (socket) and the lamp device 1 to the base. Alignment marks 41 are provided so as to make insertion easy.

3, a glass plate 30, a rubber damper 31, and a ring body 32 are disposed inside the pair of

arcuate wall portions

34, 34 and the pair of locking

wall portions

35, 35 of the cover 5. The glass plate 30 is made of translucent tempered glass, is formed in a circular shape, and is placed on the inner surface 5 b of the cover 5. The rubber damper 31 is made of, for example, a silicone resin, is formed in a substantially cylindrical shape, and has elasticity. The ring body 32 is made of, for example, polycarbonate resin and is formed in a substantially cylindrical shape. The ring body 32 is formed in a size that surrounds the light emitting element 15 of the light emitting body 3.

In FIG. 2, the cover 5 is fitted into the opening 7 of the housing 2, and the claw portion 38 of the locking piece 39 is formed inside the peripheral surface portion 6 so as to protrude inward from the peripheral surface portion 6. It is locked to. Thereby, the cover 5 is firmly attached to the housing 2. At this time, due to the elasticity of the rubber damper 31, the glass plate 30 is pressed against the inner surface 5 b of the cover 5 to close the irradiation opening 33. Further, the elasticity of the rubber damper 31 presses the ring body 32, the substrate 14 of the light emitter 3, and the insulating sheet 18, so that the insulating sheet 18 is in close contact with the light emitter connecting portion 20 of the heat radiating body 4. The surface 14 b is in close contact with the insulating sheet 18.

The lamp device 1 of the present embodiment configured as described above is attached to and detached from the lighting device 51 shown in FIG. The lighting device 51 is a downlight embedded in a ceiling or the like, and covers the device main body 52, the socket 53 attached to the lower surface of the device main body 52, the lamp device 1 attached to the socket 53, and the lamp device 1. Is formed with a decorative frame 54 attached to the lower surface side of the apparatus main body 52.

The apparatus main body 52 is formed by, for example, aluminum die casting, and has a large number of radiation fins 56 on a relatively thick flat plate-like mounting plate 55. A top plate 57 is attached to the upper surface 52a, and a terminal block 58 to which an output line of an external lighting device is connected is provided on the top plate 57. An annular groove 59 is formed in the mounting plate 55, and a decorative frame 54 is fitted and fixed to the annular groove 59.

The decorative frame 54 is made of, for example, AES resin and is formed in a substantially cylindrical shape having a flange portion 60. On the outer surface 54a of the decorative frame 54, a reinforcing piece 61 is provided over the circumference, and a plurality of mounting springs 62 for fixing the lighting device 51 to the ceiling or the like, three in this embodiment, are provided.

The socket 53 includes a socket main body 63 formed in an annular shape with an insulating synthetic resin such as polycarbonate resin, and a pair of terminals for power supply (not shown) arranged in the socket main body 63. In the case of dimming support, a plurality of dimming terminals are also provided.

In the center of the socket body 63, a circular insertion hole is formed through which the base portion 29 (projecting portion 9) of the lamp device 1 is inserted. A plurality of connection holes into which the lamp pins 13 of the lamp device 1 are inserted are formed in the bottom surface of the socket body 63 in the shape of a long hole along the circumferential direction. A terminal is disposed above each connection hole, and the lamp pin 13 of the lamp device 1 inserted into the connection hole is electrically connected to the terminal.

A plurality of keys project from the inner peripheral surface of the socket body 63, and a plurality of substantially L-shaped key grooves are formed. The key and key groove of the socket 53 and the key groove 26 and key 25 of the lamp device 1 are provided at corresponding positions. Then, by fitting the key 25 and key groove 26 of the lamp device 1 to the key groove and key of the socket 53 and inserting the base portion 29 of the lamp device 1 into the socket 53 and rotating the lamp device 1, the lamp device 1. Is detachably attached to the socket 53.

The socket 53 is supported on the mounting plate 55 of the apparatus main body 52 by a support mechanism. In this support mechanism, when the base portion 29 of the lamp device 1 is mounted on the socket 53, the upper surface of the base portion 29, that is, the surface 21 a side (heat dissipation sheet 27) of the heat radiating portion 21 of the radiator 4 is The mounting plate 55 is pressed to conduct heat.

Also, the socket 53 is connected to the terminal block 58 by a power line 64 so that the output of the lighting device is supplied to the terminal of the socket 53.

Next, the operation of the embodiment of the present invention will be described.

In FIG. 5, when predetermined power is supplied from the lighting device to the terminal block 58, power is supplied to the lamp pins 13 and 13 for power supply of the lamp device 1 through the socket 53. The light emitting element 15 of the light emitter 3 is turned on when a predetermined current flows, generates heat, and emits white light. The white light passes through the glass plate 30 and is emitted from the irradiation opening 33 of the cover 5, and illuminates the external space on the floor surface side from the irradiation opening 65 of the decorative frame 54 of the lighting device 51.

And the heat generated in the light emitter 15 is thermally conducted from the substrate 14 to the light emitter connection portion 20 of the radiator 4 through the insulating sheet 18. In the light emitting body 3, a region inside the light emitting elements 15 densely arranged on the substrate 14 serves as a heat source. As shown in FIG. 4, in the light emitter connection portion 20, heat conduction is performed while spreading at an angle of 45 ° from the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 toward the surface 21 a of the heat radiating portion 21. I will do it.

In the radiator 4, the maximum diameter of the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20 is A, the maximum diameter of the heat radiating surface 19 b is B, and the thickness of the radiator 4 is T. Then, a solid truncated cone satisfying the relational expression T = (BA) / 2 is included. Therefore, the heat from the heat source of the light emitter 3 spreads toward the entire area of the heat radiating surface 19b. Then, the heat is conducted to the mounting plate 55 of the apparatus main body 52 through the heat dissipation sheet 27 (not shown) and is radiated from the heat radiation fins 56 of the apparatus main body 52. Thereby, the heat | fever of the light-emitting body 3 in the lamp device 1 is thermally radiated efficiently, and the temperature rise of the light-emitting body 3 is suppressed.

Further, the radiator 4 is formed so that the thickness T further satisfies the relational expression T ≧ A / 4. That is, the heat that spreads at an angle of 45 ° from the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20 toward the surface 21 a side of the heat dissipation portion 21 is the thickness of the heat radiator 4. If the length T is equal to or greater than A / 4, the heat spreading from the center of the region 66 and the heat spreading from the periphery of the region 66 are overlapped to conduct heat to the surface 21 a of the heat radiating portion 21. As a result, the heat radiating surface 19b is soaked and easily conducted to the mounting plate 55 of the apparatus main body 52, and the heat generated in the light emitter 3 can be efficiently radiated. Therefore, the temperature rise of the light emitter 3 is further suppressed, and the life of the LED device 1 is extended.

According to the lamp device 1 of the present embodiment, the radiator 4 has the thickness T, the maximum diameter of the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20 is A, and the heat radiator. Assuming that the maximum diameter of the surface 19b is B, it is configured to have a solid truncated cone satisfying the relational expressions of B> A and T = (BA) / 2. Is thermally conducted so that it spreads from the light emitter connecting portion 20 to the surface 21a of the heat radiating portion 21 in the heat radiating body 4, and is released from the entire area of the surface 21a, thereby improving the heat dissipation of the light emitting body 3. Have.

Further, since the thickness T of the radiator 4 is formed so as to satisfy the relational expression T ≧ A / 4, the heat generated in the light emitter 3 is thermally conducted to the heat radiating surface 19b substantially uniformly. The heat radiating surface 19b can be soaked to dissipate heat, whereby the heat radiating property of the light emitter 3 is further improved, and the life of the light emitter 3 and the lamp device 1 can be further extended.

And the illuminating device 51 has the effect that the lamp device 1 can be used over time and the running cost can be reduced by extending the life of the lamp device 1.

The heat radiator 4 has a structure for conducting heat so that heat generated in the light emitter 3 spreads from the region 66 corresponding to the region where the light emitting element 15 is mounted on the substrate 14 of the light emitter connection portion 20 to the heat radiation surface 19b. If there is, the shape of the outer peripheral surface 19a of the main body 19 is not particularly limited. That is, a protrusion such as a protrusion or an uneven portion may be formed on the outer peripheral surface 19 a of the main body 19.

Further, the above-described embodiment is presented as an example, and is not intended to limit the scope of the invention. The novel embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. This embodiment and its modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Claims

An annular housing having a central portion opened in the front-rear direction;
A light emitter having a substrate and a light emitting element mounted on the substrate;
The end surface on one end side is larger than the maximum diameter of the area where the light emitting element is mounted on the substrate, a heat radiation surface is formed on the end surface on the other end side, and the light emitter emits light to the front side of the housing A heat dissipating body attached to the housing;
The thickness of the radiator from the end face on one end side to the end face on the other end side is T, and the size corresponding to the area of the end face on the one end side where the light emitting element is mounted is A, When the size of the heat radiating surface formed on the end surface on the other end side is B, it is formed so as to satisfy the relational expressions B> A, T = (BA) / 2 and T ≧ A / 4. A lamp device characterized by that.
A lamp device according to claim 1;
An apparatus main body having a socket for mounting the lamp apparatus;
An illumination device comprising: