WO2015089998A1 - Oled用薄膜封装结构、oled器件以及显示装置 - Google Patents

Oled用薄膜封装结构、oled器件以及显示装置 Download PDF

Info

Publication number
WO2015089998A1
WO2015089998A1 PCT/CN2014/078273 CN2014078273W WO2015089998A1 WO 2015089998 A1 WO2015089998 A1 WO 2015089998A1 CN 2014078273 W CN2014078273 W CN 2014078273W WO 2015089998 A1 WO2015089998 A1 WO 2015089998A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
oled
encapsulation structure
inorganic
inorganic film
Prior art date
Application number
PCT/CN2014/078273
Other languages
English (en)
French (fr)
Inventor
孙力
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/415,481 priority Critical patent/US9472784B2/en
Priority to EP14859325.4A priority patent/EP3086381B1/en
Publication of WO2015089998A1 publication Critical patent/WO2015089998A1/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • H10K50/8445Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations
    • H10K59/8731Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/874Passivation; Containers; Encapsulations including getter material or desiccant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/10Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00Coating on the layer surface
    • B32B2255/20Inorganic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/726Permeability to liquids, absorption
    • B32B2307/7265Non-permeable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00Containers; Receptacles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206Organic displays, e.g. OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/311Flexible OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates
    • H10K77/111Flexible substrates

Definitions

  • O Package structure OLED device and display device
  • the present invention relates to the field of electroluminescence, and in particular to a thin film encapsulation structure for an OLED (Organic Light-Emitting Diode), an OLED device, and a display device.
  • OLED Organic Light-Emitting Diode
  • organic electroluminescent displays have received increasing attention.
  • Organic electroluminescent displays are characterized by thinness, wide viewing angle, low power consumption, fast response, flexible display, and the like. Since it is an active light-emitting device, it is considered to have a great advantage in displaying high-definition and high-speed video, and has been moving in practical directions in recent years.
  • the core component of an organic electroluminescent display is an organic electroluminescent device, BP: OLED unit
  • the organic film layer of the OLED unit in the organic electroluminescent device is easily destroyed by water and oxygen attack, and therefore needs to be protected by a water-oxygen-encapsulated package structure.
  • a high-resistance hard-package substrate such as glass
  • the metal sheet is packaged, that is, on the outside of the OLED unit, the substrate carrying the OLED unit is bonded by the encapsulant, and a confined space in which water and oxygen are difficult to penetrate is formed between the two substrates.
  • the above method can effectively protect the OLED unit, but it is not suitable for flexible devices.
  • a technical solution to provide a film having a certain water repellency outside the OLED unit but usually a dense film has a poor bending property, such as a SiOx film; and a film having good bending properties has a poor water repellency, such as a polymer film.
  • An object of the present invention is to provide a thin film package structure for an OLED having good waterproof effect, an OLED device, and a display device.
  • a thin film encapsulation structure for an OLED comprising a package for OLED a flexible film of the unit, the flexible film comprising at least one inorganic film and at least one organic film alternately laminated with the at least one inorganic film, wherein each of the at least one organic film is one
  • each of the at least one inorganic film includes a plurality of inorganic film portions that are not connected to each other.
  • a plurality of cavities for disengaging the inorganic film portions from each other are disposed between the plurality of inorganic film portions.
  • the cavity is disposed in an inorganic film between two organic films, and the inorganic film is divided into a plurality of unconnected strip-shaped inorganic film portions extending along the organic film.
  • the shape of the strip-shaped inorganic film portion is advantageous from the viewpoint of convenient processing.
  • a plurality of the plurality of the cavities are respectively provided with a moisture absorbent layer.
  • the moisture absorbent layer can guide the penetration of water molecules, and on the other hand, adsorb water molecules on the path of water molecules permeation, which is advantageous for improving the water repellency of the thin film encapsulation structure for the OLED.
  • the moisture absorbent layer in the cavity is in contact with an adjacent organic film to divide the inorganic film into a plurality of unconnected inorganic film portions.
  • a plurality of cavities in the inorganic film are arranged in a staggered manner with a plurality of cavities in adjacent inorganic films.
  • This structure is advantageous for the improvement of water repellency, and can effectively prevent the formation of a water permeable passage between the cavity of the upper and lower layers or the layer of the moisture absorbent.
  • the thickness of the inorganic film is the same as the thickness of the moisture absorbent layer.
  • the thickness of the inorganic film is smaller than the thickness of the organic film, so that the organic film can coat the inorganic film, thereby ensuring the strength and durability of the film package structure for OLED.
  • a substrate for supporting the OLED unit is further included, and the flexible film is enclosed with the substrate to form a receiving cavity for accommodating the OLED unit.
  • the inorganic film contains an inorganic material having water repellency
  • the material of the organic film contains an organic film-forming material having water repellency
  • the inorganic film comprises alumina, silica, magnesia, titania, silicon nitride, silicon oxynitride and/or molybdenum oxide, etc.; the organic film comprises polyacrylate, polyimide and/or Polyethylene, etc.
  • the moisture absorbent layer comprises calcium oxide, silica gel and/or porous silicon, and the like.
  • the total area of the inorganic film portion in the at least one inorganic film is larger than the total area of the cavity to improve water repellency.
  • One embodiment of the present invention provides an OLED device including an OLED unit and a thin film package structure for an OLED that encapsulates the OLED unit as described above.
  • Another embodiment of the present invention provides a display device including the above OLED device.
  • the inorganic film is divided into a plurality of small-area inorganic film portions which are not connected to each other, the probability of fracture during bending is lowered, and the
  • FIG. 1 is a schematic structural view of a thin film encapsulation structure for an OLED according to Embodiment 1 of the present invention
  • FIG. 2 is a schematic structural view of a thin film encapsulation structure for an OLED according to an embodiment of the invention: :::::::
  • FIG. 3 is a partially enlarged schematic structural view of a flexible film according to an embodiment of the present invention. detailed description
  • an embodiment of the thin film encapsulation structure for an OLED of the present invention includes a flexible film 1 for wrapping the OLED unit 30, and the flexible film 1 includes an inorganic film 2 and an inorganic film.
  • a plurality of cavities 4 for dividing the inorganic film 2 are disposed in the inorganic film 2 between the two organic films 3, and the cavity 4 divides the inorganic film 2 into extending along the extending direction of the organic film 3.
  • the shape of the above-mentioned inorganic film portion 21 is not limited to the strip shape shown in the drawing, and may be other regular or irregular shapes as long as they are not connected to each other.
  • the specific material of the inorganic membrane 2 may be any suitable inorganic material having water repellency, such as: alumina, silica, magnesia, titania, silicon nitride, silicon oxynitride and/or oxygen. Molybdenum, etc.
  • the specific material of the organic film 3 may be any suitable organic film-forming material having water repellency, and optionally a flexible organic film-forming material, which may be further selected, such as: polyacrylate, polyimide and/or Or polyethylene, etc.
  • the same or different materials may be used for each of the organic film 3 and each of the inorganic films 2.
  • the specific number of layers of the organic film 3 and the inorganic film 2 can be selected as needed.
  • the total area of the inorganic film portion 21 is larger than the total area of the cavity 4, which is advantageous for improving water repellency.
  • a plurality of cavities 4 may be respectively disposed in the plurality of cavities 4.
  • the moisture absorbent layer 5 may be provided in all of the cavities, or a moisture absorbent layer may be provided in a part of the cavities as needed.
  • the material of the moisture absorbent layer 5 may be any suitable material having hygroscopicity, and may alternatively be: calcium oxide, silica gel and/or porous silicon or the like.
  • An embodiment of the thin film encapsulation structure for an OLED of the present invention optionally, wherein the moisture absorbent layer 5 in the cavity 4 is in contact with the organic film 3 on both sides of the inorganic film 2, respectively, to divide the inorganic film 2 into organic A plurality of unconnected inorganic film portions 21 extending in the extending direction of the film 3.
  • An embodiment of the OLED thin film encapsulation structure of the present invention optionally, wherein a plurality of cavities 4 or a moisture absorbent layer 5 in an inorganic film 2 and a plurality of cavities 4 or moisture absorbent in the adjacent inorganic film 2 Layer 5 is staggered and is not correct.
  • Such a structure is advantageous for the improvement of the water repellency thereof, and can effectively prevent the formation of a water permeable passage between the cavity 4 of the upper and lower layers or the moisture absorbent layer 5.
  • An embodiment of the thin film encapsulation structure for an OLED of the present invention wherein the thickness of the inorganic film 2 is the same as the thickness of the moisture absorbent layer 5, thereby facilitating the respective inorganic film portions 21 and the moisture absorbent layer 5 adjacent thereto.
  • the bonding property of the organic film 3 is improved, thereby improving the water repellency of the flexible film 1.
  • An embodiment of the thin film encapsulation structure for an OLED of the present invention wherein the thickness of the inorganic film 2 is smaller than the thickness of the organic film 3, so that the organic film 3 can coat the inorganic film 2, thereby ensuring the strength and durability of the thin film encapsulation structure for the OLED. .
  • an embodiment of the thin film encapsulation structure for an OLED of the present invention includes Embodiment 1 - a flexible film 1.
  • the flexible film 1 is completely coated on the OLED unit 30.
  • the flexible film 1 is not completely covered by the OLED unit 30, and further includes a substrate 10 for supporting the OLED unit 30.
  • the flexible film 1 is enclosed with the substrate 10 to form a receiving cavity 20 for accommodating the OLED unit 30. .
  • the substrate 10 can be a substrate that is commonly used in the art.
  • the OLED device of the present invention comprises an OLED unit and a thin film encapsulation structure for an OLED of the embodiment of the invention in which the OLED unit is packaged.
  • the display device of the present invention includes the OLED device of the present invention.
  • the thin film encapsulation structure for OLED of the present invention has an inorganic film formed into a discontinuous structure in a multi-layer package structure, and a moisture absorbent layer is coated in a cavity of the same inorganic film.
  • the hollow arrow in Fig. 3 shows a route for water molecule erosion.
  • the thin film encapsulation structure for OLED of the present invention guides the penetration of water molecules on the one hand, and adsorbs water molecules on the path of water molecules permeation on the other hand, thereby increasing the multi-layer lamination. Water barrier of the film package structure. Since the inorganic film is divided into a plurality of small-area unconnected inorganic film portions, the probability of breakage during the bending process is lowered, and the water repellency can be substantially maintained.
  • the inorganic film in the thin film encapsulation structure for OLEDs of the first embodiment and the second embodiment may be formed by physical or chemical deposition; then a metal mask may be used or dry etching or stripping may be used to form a regular discontinuous arrangement.
  • the moisture absorbent layer can be formed by coating or physical deposition, and finally finally arranged in the gap of the inorganic layer by ashing, peeling, dry etching, etc.; then spraying, scraping, etc.
  • the precursor of the organic film is prepared and cured by ultraviolet curing or heat to form an organic film; then the inorganic film, the moisture absorbent layer and the organic film are repeatedly produced, and finally the film package structure for OLED of each embodiment of the present invention can be obtained.
  • the thin film encapsulation structure for an OLED, the OLED device, and the display device of the embodiments of the present invention employ an inorganic film and an organic film alternately laminated with the inorganic film, and the inorganic film adopts a discontinuous structure to achieve better water repellency; Simple and easy to prepare.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)

Abstract

一种OLED用薄膜封装结构,包括用于封装OLED单元的柔性薄膜,所述柔性薄膜(1)包括至少一层无机膜(2)以及与所述至少一层无机膜交替层叠的至少一层有机膜(3),其中,所述至少一层有机膜(3)中的每层有机膜是一个整体,所述至少一层无机膜(2)中的每层无机膜包括不连接的多个无机膜部分。显示装置,包括所述OLED器件。OLED用薄膜封装结构、OLED器件以及显示装置,采用无机膜以及与无机膜交替层叠的有机膜,无机膜采用非连续的结构,实现了更好的阻水性。

Description

O 奠封装结构、 OLED器件以及显示装置 技术领域
本发明涉及电致发光领域, 特别是涉及一种 OLED ( Organic Light-Emitting Diode) 用薄膜封装结构、 OLED器件以及显示装置。 背景技术
近年来, 作为一种新的平板显示器, 有机电致发光显示器受到越来越多 的关注。 有机电致发光显示器的特征是轻薄、 宽视角、 功耗低、 响应速度快、 可实现柔性显示等。 由于其是主动发光型器件, 在显示高清晰高速度视频方 面被认为具有很大的优势, 并且最近几年正朝着实用的方向发展。 有机电致 发光显示器的核心部件是有机电致发光器件, BP: OLED单元
有机电致发光器件中的 OLED单元的有机膜层容易因为受到水氧侵蚀而 失效, 因此需要利用阻隔水氧的封装结构进行保护, 通常, 业内采用高阻水 性的硬质封装基板 (如玻璃, 金属片) 进行封装, 即在 OLED单元的外部, 通过封装胶将承载 OLED单元的基板粘合, 在两片基板之间形成水氧难以渗 透的密闭空间。 上述方法可有效保护 OLED单元, 但不适用于柔性器件。 因 此也有技术方案在 OLED单元外设置具有一定阻水性的薄膜, 但通常致密的 薄膜, 其弯折性不好, 如 SiOx薄膜; 而弯折性好的薄膜其阻水性不好, 如聚 合物膜。 也有技术方案在 OLED单元外设置有机膜和无机膜多层膜交叠的多 层薄膜的封装结构, 以获得较好的阻水性和弯折性, 但是多层薄膜的封装结 构的膜层数多, 制造工艺步骤多, 制造时间长, 并且严重依赖于膜层质量, 尤其是无机膜层的质量, 而大面积的无机膜在弯折过程中容易断开, 形成新 的水分子侵蚀的通道, 由此造成封装结构的性能劣化。 发明内容
本发明的目的在于提供一种防水效果好的 OLED用薄膜封装结构、 OLED 器件以及显示装置。
根据本发明实施例的一种 OLED用薄膜封装结构, 包括用于封装 OLED 单元的柔性薄膜, 所述柔性薄膜包括至少一层无机膜以及与所述至少一层无 机膜交替层叠的至少一层有机膜, 其中, 所述至少- 层有机膜中的每层有机 膜是一个整体, 所述至少一层无机膜中的每层无机膜包括相互不连接的多个 无机膜部分。 所述 OLED用薄膜封装结构, 由于无机膜被分割成多个小面积 的不连接的无机膜部分,因此弯折过程中断裂的几率降低,提高了所述 OLED 用薄膜封装结构的阻水性。
可选择的, 在所述多个无机膜部分之间设置有用于使所述无机膜部分相 互不连接的多个空腔。
可选择的, 所述空腔设置在两层有机膜之间的无机膜内, 将所述无机膜 分割为沿所述有机膜延伸的多个不连接的条形无机膜部分。 该条形的无机膜 部分形状从方便加工方面是有利的。
可选择的, 多个所述空腔内分别设置有吸湿剂层。 该吸湿剂层一方面可 以引导水分子渗透, 另一方面在水分子渗透的路径上吸附水分子, 这样有利 于提高所述 OLED用薄膜封装结构的阻水性。
可选择的, 所述空腔内的吸湿剂层与相邻的有机膜相接触, 以将所述无 机膜分割为多个不连接的无机膜部分。
可选择的, 所述无机膜内的多个空腔与相邻的无机膜内的多个空腔相错 开布置。 该结构有利于其阻水性的提高, 可以有效防止上下层的空腔或吸湿 剂层之间形成透水通路。
可选择的, 所述无机膜的厚度与吸湿剂层的厚度相同。
可选择的, 所述无机膜的厚度小于所述有机膜的厚度, 从而使有机膜能 够包覆无机膜, 进而保证 OLED用薄膜封装结构的强度和耐用性。
可选择的, 还包括用于承托所述 OLED单元的基板, 所述柔性薄膜与所 述基板围合形成用于容纳所述 OLED单元的容纳腔。
可选择的, 所述无机膜包含具有阻水性的无机材料, 所述有机膜的材料 包含具有阻水性的有机可成膜材料。
可选择的, 所述无机膜包含氧化铝, 二氧化硅, 氧化镁, 二氧化钛, 氮 化硅, 氮氧化硅和 /或氧化钼等; 所述有机膜包含聚丙烯酸酯, 聚亚酰胺和 / 或聚乙烯等。 可选择的, 吸湿剂层包含氧化钙, 硅胶和 /或多孔硅等。
可选择的, 所述至少一层无机膜中所述无机膜部分的总面积大于所述空 腔的总面积, 以提高阻水性。
本发明的一个实施例, 提供一种 OLED器件, 包括 OLED单元以及如上 所述的封装所述 OLED单元的 OLED用薄膜封装结构。
本发明的另一个实施例,提供一种显示装置,其包括上述的 OLED器件。 本发明的所述 OLED用薄膜封装结构, 由于无机膜被分割成多个小面积 的相互不连接的无机膜部分, 因此弯折过程中断裂的几率降低, 提高了所述
OLED用薄膜封装结构的阻水性。 附图说明
图 1为发明实施例一的 OLED用薄膜封装结构的结构示意图;
图 2为发明实施例.:::::的 OLED用薄膜封装结构的结构示意图;
图 3为本发明实施例的柔性薄膜的局部放大结构示意图。 具体实施方式
下面结合附图和具体实施例对本发明作进一步说明, 以使本领域的技术 人员可以更好的理解本发明并能予以实施, 但所举实施例不作为对本发明的 限定。
实施例一
如图 1、 图 3所示, 本发明的 OLED用薄膜封装结构的实施例, 包括用 于包裹 OLED单元 30的柔性薄膜 1,柔性薄膜 1包括无机膜 2以及与无机膜
2交替层叠的有机膜 3,两有机膜 3之间的无机膜 2内设置有用于分割无机膜 2的多个空腔 4,空腔 4将无机膜 2分割为沿有机膜 3延伸方向延伸的多个不 连接的条形的无机膜部分 21。
上述无机膜部分 21的形状不仅限于图中所示的条形,也可以是其他规则 或不规则的形状, 只要它们之间相互不连接即可。
无机膜 2的具体材料可以为任何具有阻水性的适合的无机材料, 可选择 的, 如: 氧化铝, 二氧化硅, 氧化镁, 二氧化钛, 氮化硅, 氮氧化硅和 /或氧 化钼等。
有机膜 3的具体材料可以为任何具有阻水性的适合的有机可成膜材料, 可选择的是柔性的有机成膜材料, 进-一步可选择的, 如: 聚丙烯酸酯, 聚亚 酰胺和 /或聚乙烯等。
根据需要, 对于设置有多层有机膜 3和多层无机膜 2的柔性薄膜 1, 各 有机膜 3和各无机膜 2可以采用相同的或不同的材料。 有机膜 3和无机膜 2 的具体层数可以根据需要选择。
本发明的 OLED用薄膜封装结构的实施例, 可选择的, 无机膜部分 21 的总面积大于空腔 4的总面积, 这对于提高阻水性是有利的。
本发明的 OLED用薄膜封装结构的实施例, 可选择的, 其中, 多个空腔 4内可以分别设置有吸湿剂层 5。 可以在所有空腔中设置吸湿剂层 5, 也可以 根据需要在部分空腔中设置吸湿剂层。
所述吸湿剂层 5的材料可以为任何具有吸湿性的适合的材料, 可选择地 为: 氧化钙, 硅胶和 /或多孔硅等。
本发明的 OLED用薄膜封装结构的实施例, 可选择的, 其中, 空腔 4内 的吸湿剂层 5与无机膜 2的两侧的有机膜 3分别接触, 以将无机膜 2分割为 沿有机膜 3的延伸方向延伸的多个不连接的无机膜部分 21。
本发明的 OLED薄膜封装结构的实施例, 可选择的, 其中, 一个无机膜 2内的多个空腔 4或吸湿剂层 5与相邻的无机膜 2内的多个空腔 4或吸湿剂 层 5错开布置, 均不正对。 这样的结构有利于其阻水性的提高, 可以有效防 止上下层的空腔 4或吸湿剂层 5之间形成透水通路。
本发明的 OLED用薄膜封装结构的实施例, 可选择的, 其中, 无机膜 2 的厚度与吸湿剂层 5的厚度相同, 从而有利于各无机膜部分 21和吸湿剂层 5 与它们相邻的有机膜 3的结合性的提高, 从而提高柔性薄膜 1的阻水性。
本发明的 OLED用薄膜封装结构的实施例, 其中, 无机膜 2的厚度小于 有机膜 3的厚度, 从而使有机膜 3能够包覆无机膜 2, 进而保证 OLED用薄 膜封装结构的强度和耐用性。
实施例二
结合图 2和图 3所示, 本发明的 OLED用薄膜封装结构的实施例, 包括 实施例-一的柔性薄膜 1。实施例一中,柔性薄膜 1完全包覆于 OLED单元 30。 在本实施例中, 柔性薄膜 1没有完全包覆于 OLED单元 30, 还包括用于承托 OLED单元 30的基板 10, 柔性薄膜 1与基板 10围合形成用于容纳 OLED单 元 30的容纳腔 20。
所述基板 10可以为本领域中常用的基板。 本发明的 OLED器件,包括 OLED单元以及封装所述 OLED单元的本发 明实施例的的 OLED用薄膜封装结构。
本发明的显示装置, 包括本发明的 OLED器件。
本发明的 OLED用薄膜封装结构在多层叠封装结构中将无机膜制作成不 连续的结构, 并且在同-一无机膜的空腔中涂覆吸湿剂层。 图 3中的空心箭头 示出了为水分子侵蚀的路线, 本发明的 OLED用薄膜封装结构一方面引导水 分子渗透, 另一方面在水分子渗透的路径上吸附水分子, 这样提高多叠层薄 膜封装结构的阻水性。 由于无机膜被分割成多个小面积的不连接的无机膜部 分, 因此弯折过程中断裂的几率降低, 能基本维持阻水性。
上述实施例一和实施例二的 OLED用薄膜封装结构中的无机膜可以通过 物理或化学沉积的方式制成; 然后可以使用金属掩膜板或者干刻、 剥离的方 法形成规则的不连续排布;吸湿剂层可以通过涂布或者物理沉积的方式制成, 接着通过灰化、 剥离、 干刻等方法最终使其仅排布于无机层的间隙中; 然后 用喷涂, 刮涂等方式在其上制备有机膜的前驱物, 并通过紫外线固化或加热 固化, 形成有机膜; 然后重复制作上述无机膜、 吸湿剂层和有机膜, 最终可 得本发明的各实施例的 OLED用薄膜封装结构。
本发明的各实施例的 OLED用薄膜封装结构、 OLED器件以及显示装置, 采用无机膜以及与无机膜交替层叠的有机膜, 无机膜采用非连续的结构, 实 现了更好的阻水性; 同时结构简单, 便于制备。
以上所述仅是本发明的优选实施方式, 应当指出, 对于本技术领域的普 通技术人员来说, 在不脱离本发明原理的前提下, 还可以作出若干改进和润 饰, 这些改进和润饰也应视为本发明的保护范围。

Claims

禾 tl
1. 一种 OLED用薄膜封装结构, 包括用于封装 OLED单元的柔性薄膜, 所述柔性薄膜包括至少一层无机膜以及与所述至少一层无机膜交替层叠的至 少- 层有机膜, 其中, 所述至少一层有机膜中的每层有机膜是一个整体, 所 述至少- 层无机膜中的每层无机膜包括不连接的多个无机膜部分。
2. 根据权利要求 1所述的 OLED用薄膜封装结构, 其中, 在所述多个无 机膜部分之间设置有用于使所述无机膜部分相互不连接的多个空腔。
3. 根据权利要求 2所述的 OLED用薄膜封装结构, 其中, 所述空腔设置 在两层有机膜之间的无机膜内, 将所述无机膜分割为沿所述有机膜延伸的多 个不连接的条形无机膜部分。
4. 根据权利要求 2或 3所述的 OLED用薄膜封装结构, 其中, 部分或全 部所述空腔内设置有吸湿剂层。
5. 根据权利要求 2〜4任一项所述的 OLED用薄膜封装结构, 其中, 所 述空腔内的吸湿剂层与相邻的有机膜相接触, 以将所述无机膜分割为多个不 连接的无机膜部分。
6. 根据权利要求 2〜5任一项所述的 OLED用薄膜封装结构, 其中, 所 述无机膜内的多个空腔与相邻的无机膜内的多个空腔相错开布置。
7. 根据权利要求 4或 5所述的 OLED用薄膜封装结构, 其中, 所述无机 膜的厚度与吸湿剂层的厚度相同。
8. 根据权利要求 1〜7任一项所述的 OLED用薄膜封装结构, 其中, 所 述无机膜的厚度小于所述有机膜的厚度。
9. 根据权利要求 1〜8任一项所述的 OLED用薄膜封装结构, 其中, 还 包括用于承托所述 OLED单元的基板, 所述柔性薄膜与所述基板围合形成用 于容纳所述 OLED单元的容纳腔。
10. 根据权利要求 1〜9任一项所述的 OLED用薄膜封装结构, 其中, 所 述无机膜包含具有阻水性的无机材料, 所述有机膜包含具有阻水性的有机可 成膜材料。
11. 根据权利要求 1〜10任一项所述的 OLED用薄膜封装结构, 其中, 所述无机膜包含氧化铝, 二氧化硅, 氧化镁, 二氧化钛, 氮化硅, 氮氧 化硅和 /或氧化钼;
所述有机膜包含聚丙烯酸酯, 聚亚酰胺和 /或聚乙烯。
12. 根据权利要求 1〜11任一项所述的 OLED用薄膜封装结构, 其中, 吸湿剂层包含氧化钙, 硅胶和 /或多孔硅。
13. 根据权利要求 1〜12任一项所述的 OLED用薄膜封装结构, 其中, 所述至少一层无机膜中所述无机膜部分的总面积大于所述空腔的总面积。
14. 一种 OLED器件, 其中, 包括 OLED单元以及如权利要求 1〜13任 一项所述的封装所述 OLED单元的 OLED用薄膜封装结构。
15. -一种显示装置, 其中, 包括权利要求 14所述的 OLED器件。
PCT/CN2014/078273 2013-12-20 2014-05-23 Oled用薄膜封装结构、oled器件以及显示装置 WO2015089998A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US14/415,481 US9472784B2 (en) 2013-12-20 2014-05-23 Packaging structure for OLED having inorganic and organic films with moisture absorbent layers
EP14859325.4A EP3086381B1 (en) 2013-12-20 2014-05-23 Thin-film encapsulation structure for oled, oled device and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310711653.6A CN103715366A (zh) 2013-12-20 2013-12-20 Oled薄膜封装结构、oled器件以及显示装置
CN201310711653.6 2013-12-20

Publications (1)

Publication Number Publication Date
WO2015089998A1 true WO2015089998A1 (zh) 2015-06-25

Family

ID=50408155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/078273 WO2015089998A1 (zh) 2013-12-20 2014-05-23 Oled用薄膜封装结构、oled器件以及显示装置

Country Status (4)

Country Link
US (1) US9472784B2 (zh)
EP (1) EP3086381B1 (zh)
CN (1) CN103715366A (zh)
WO (1) WO2015089998A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018533178A (ja) * 2015-12-31 2018-11-08 シェンジェン ロイオル テクノロジーズ カンパニー リミテッドShenzhen Royole Technologies Co., Ltd. パッケージ構造、フレキシブルディスプレイスクリーン、及びパッケージ構造の製造方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103715366A (zh) * 2013-12-20 2014-04-09 京东方科技集团股份有限公司 Oled薄膜封装结构、oled器件以及显示装置
CN104269426A (zh) 2014-09-01 2015-01-07 京东方科技集团股份有限公司 一种显示面板及其制备方法和显示装置
JP2016072127A (ja) * 2014-09-30 2016-05-09 ソニー株式会社 有機el表示装置およびその製造方法、並びに電子機器
CN104538425B (zh) * 2014-12-19 2018-01-12 上海天马微电子有限公司 一种阻挡膜及其制作方法、显示装置
KR102417119B1 (ko) * 2015-02-11 2022-07-06 삼성디스플레이 주식회사 플렉서블 디스플레이 장치
US9614183B2 (en) 2015-04-01 2017-04-04 Apple Inc. Organic light-emitting diode displays with crack detection and crack propagation prevention circuitry
CN104733507B (zh) * 2015-04-09 2018-05-01 京东方科技集团股份有限公司 柔性显示装置和柔性显示装置的封装方法
CN104900812A (zh) * 2015-04-23 2015-09-09 京东方科技集团股份有限公司 薄膜封装结构及其制作方法和显示装置
CN105206763B (zh) * 2015-10-21 2018-01-23 京东方科技集团股份有限公司 柔性显示器及其制造方法
CN105355645B (zh) * 2015-11-06 2019-07-26 上海天马微电子有限公司 一种柔性显示面板及其制造方法、显示装置
JP2017152256A (ja) * 2016-02-25 2017-08-31 株式会社ジャパンディスプレイ 表示装置
CN105702624A (zh) * 2016-03-30 2016-06-22 武汉华星光电技术有限公司 叠层柔性基板及制作方法
CN106997930B (zh) * 2017-03-03 2019-04-12 上海天马有机发光显示技术有限公司 柔性显示面板及显示装置
CN106848106B (zh) * 2017-04-19 2019-03-29 京东方科技集团股份有限公司 有机电致发光装置封装结构及其制作方法、显示装置
CN107195794B (zh) * 2017-06-06 2019-07-30 京东方科技集团股份有限公司 一种柔性显示基板及其制作方法、显示面板、显示装置
CN109585669B (zh) * 2017-09-29 2024-05-17 京东方科技集团股份有限公司 薄膜封装结构及其制备方法
CN107863454A (zh) * 2017-11-21 2018-03-30 武汉华星光电半导体显示技术有限公司 柔性oled显示面板及其封装方法
CN108305954B (zh) * 2018-01-24 2020-07-31 武汉华星光电半导体显示技术有限公司 Oled器件的薄膜封装方法及oled器件
US20190229299A1 (en) * 2018-01-24 2019-07-25 Wuhan China Star Optoelecronics Semiconductor Display Technology Co., LTd. Thin-film packaging method for an oled device and oled device
CN110085740B (zh) * 2018-01-25 2022-01-11 绵阳京东方光电科技有限公司 柔性基板及其制作方法、面板以及电子装置
US11655536B2 (en) * 2018-03-20 2023-05-23 Sharp Kabushiki Kaisha Film forming mask and method of manufacturing display device using same
CN108565360A (zh) * 2018-04-10 2018-09-21 深圳市华星光电技术有限公司 一种oled显示装置及其制备方法
CN108428731B (zh) * 2018-05-17 2021-01-01 武汉华星光电半导体显示技术有限公司 柔性oled显示面板及柔性oled显示装置
CN109346622A (zh) * 2018-10-19 2019-02-15 武汉华星光电半导体显示技术有限公司 Oled阵列基板及其制作方法
CN109671750B (zh) * 2018-12-13 2021-04-20 云谷(固安)科技有限公司 一种显示面板、显示面板的制备方法及制备设备
JP6814230B2 (ja) * 2019-01-11 2021-01-13 株式会社Joled 発光パネル、発光装置および電子機器
CN111192972A (zh) * 2019-03-18 2020-05-22 广东聚华印刷显示技术有限公司 薄膜封装结构及其制备方法和显示装置
CN109872631B (zh) * 2019-03-18 2021-04-27 京东方科技集团股份有限公司 一种可拉伸显示模组及其制作方法和显示设备
CN111341940A (zh) * 2020-03-18 2020-06-26 上海晶合光电科技有限公司 一种oled器件封装结构及其制备方法
CN113013352B (zh) * 2021-01-29 2023-07-21 固安翌光科技有限公司 一种薄膜封装结构及有机光电器件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101859792A (zh) * 2009-02-26 2010-10-13 三星移动显示器株式会社 有机发光二极管显示器及其制造方法
KR20120075055A (ko) * 2010-12-28 2012-07-06 엘지디스플레이 주식회사 유기전계발광표시장치
US20130037792A1 (en) * 2010-01-04 2013-02-14 Samsung Display Co., Ltd. Organic light emitting diode display
CN203134801U (zh) * 2012-11-21 2013-08-14 京东方科技集团股份有限公司 一种oled显示装置
CN103325953A (zh) * 2012-03-19 2013-09-25 瀚宇彩晶股份有限公司 有机发光二极管封装及其封装方法
CN103715366A (zh) * 2013-12-20 2014-04-09 京东方科技集团股份有限公司 Oled薄膜封装结构、oled器件以及显示装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006014591A2 (en) * 2004-07-08 2006-02-09 Itn Energy Systems, Inc. Permeation barriers for flexible electronics
KR100647340B1 (ko) * 2006-01-11 2006-11-23 삼성전자주식회사 평판표시장치
KR20080006304A (ko) * 2006-07-12 2008-01-16 삼성전자주식회사 유기 발광 표시 장치 및 그 제조 방법
US7663312B2 (en) * 2006-07-24 2010-02-16 Munisamy Anandan Flexible OLED light source
JP2009076232A (ja) * 2007-09-19 2009-04-09 Fujifilm Corp 環境感受性デバイス、環境感受性素子の封止方法
CN101128074A (zh) * 2007-09-20 2008-02-20 清华大学 一种有机电致发光器件及其制备方法
JP2009092908A (ja) * 2007-10-09 2009-04-30 Canon Inc 表示装置及びその製造方法
JP4920548B2 (ja) * 2007-10-31 2012-04-18 株式会社 日立ディスプレイズ 表示装置
KR101492630B1 (ko) * 2008-06-10 2015-03-03 엘지디스플레이 주식회사 유기발광다이오드 표시소자
KR101097318B1 (ko) * 2009-11-25 2011-12-21 삼성모바일디스플레이주식회사 유기 발광 소자 및 이의 제조 방법
KR20110114325A (ko) * 2010-04-13 2011-10-19 삼성모바일디스플레이주식회사 표시 장치
EP2445028A1 (en) * 2010-10-25 2012-04-25 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Opto-electric device and method of manufacturing an opto-electric device
KR101863853B1 (ko) * 2011-07-29 2018-06-04 삼성디스플레이 주식회사 유기 발광 표시장치 및 그 제조방법
CN102437288A (zh) * 2011-11-16 2012-05-02 四川长虹电器股份有限公司 有机电致发光器件的封装结构
CN103165821A (zh) * 2011-12-08 2013-06-19 上海天马微电子有限公司 Oled显示模组封装结构
CN103258955B (zh) * 2012-02-20 2016-02-03 中国科学院微电子研究所 有机电子器件的封装方法
TWI520215B (zh) * 2012-09-19 2016-02-01 友達光電股份有限公司 元件基板及其製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101859792A (zh) * 2009-02-26 2010-10-13 三星移动显示器株式会社 有机发光二极管显示器及其制造方法
US20130037792A1 (en) * 2010-01-04 2013-02-14 Samsung Display Co., Ltd. Organic light emitting diode display
KR20120075055A (ko) * 2010-12-28 2012-07-06 엘지디스플레이 주식회사 유기전계발광표시장치
CN103325953A (zh) * 2012-03-19 2013-09-25 瀚宇彩晶股份有限公司 有机发光二极管封装及其封装方法
CN203134801U (zh) * 2012-11-21 2013-08-14 京东方科技集团股份有限公司 一种oled显示装置
CN103715366A (zh) * 2013-12-20 2014-04-09 京东方科技集团股份有限公司 Oled薄膜封装结构、oled器件以及显示装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3086381A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018533178A (ja) * 2015-12-31 2018-11-08 シェンジェン ロイオル テクノロジーズ カンパニー リミテッドShenzhen Royole Technologies Co., Ltd. パッケージ構造、フレキシブルディスプレイスクリーン、及びパッケージ構造の製造方法
US10673021B2 (en) 2015-12-31 2020-06-02 Shenzhen Royole Technologies Co., Ltd. Package structure, flexible display screen, and method for manufacturing package structure

Also Published As

Publication number Publication date
EP3086381A4 (en) 2017-08-23
EP3086381B1 (en) 2020-10-28
US9472784B2 (en) 2016-10-18
US20160043347A1 (en) 2016-02-11
CN103715366A (zh) 2014-04-09
EP3086381A1 (en) 2016-10-26

Similar Documents

Publication Publication Date Title
WO2015089998A1 (zh) Oled用薄膜封装结构、oled器件以及显示装置
US20230272534A1 (en) Display apparatus and method of manufacturing the same
CN104183783B (zh) 具有柔性基板的有机发光显示装置
EP2804231B1 (en) Organic light-emitting diode display, an electronic device including the same, and method of manufacturing said organic light-emitting diode display
US8569951B2 (en) Organic light-emitting display apparatus and method of manufacturing the same
JP2021182553A (ja) 表示装置
KR102482077B1 (ko) 유기발광표시장치 및 그 제조방법
CN104103665B (zh) 有机发光显示设备和制造它的方法
WO2017059609A1 (zh) 柔性显示装置的制作方法及制得的柔性显示装置
TWI524809B (zh) 用於可撓性顯示裝置之基板部分、製造基板部分之方法以及製造包含基板之有機發光顯示裝置之方法
US9306071B2 (en) Organic light-emitting display device including a flexible TFT substrate and stacked barrier layers
WO2014101814A1 (zh) 一种柔性衬底
JP2011124213A (ja) 有機発光ディスプレイ装置及びその製造方法
JP2010027599A (ja) 有機発光ディスプレイ装置及びその製造方法
TWI610431B (zh) 柔性封裝襯底及其製造方法和使用該襯底的oled封裝方法
US9356257B2 (en) Organic light-emitting display apparatus and method of manufacturing the same
WO2020206980A1 (zh) 柔性oled显示装置及制备方法
CN110112313B (zh) 一种柔性器件的超薄复合封装薄膜结构及制备方法
WO2020029351A1 (zh) 一种复合膜层及制作方法、oled显示面板的制作方法
CN107331790A (zh) 一种oled显示面板及其封装方法、oled显示装置
TW201423977A (zh) 用於顯示面板的母面板及使用該母面板製造顯示面板之方法
WO2020228491A1 (zh) Oled显示屏、显示面板及其制作方法
WO2015062288A1 (zh) 复合膜及其制造方法以及包括该复合膜的封装结构
KR101992495B1 (ko) 유연기판 소재용 측면 봉지재
CN214457725U (zh) 一种聚酰亚胺薄膜层压体及显示器

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14415481

Country of ref document: US

REEP Request for entry into the european phase

Ref document number: 2014859325

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2014859325

Country of ref document: EP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14859325

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE