WO2015074366A1 - 光模块散热结构及电子产品 - Google Patents

光模块散热结构及电子产品 Download PDF

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Publication number
WO2015074366A1
WO2015074366A1 PCT/CN2014/074959 CN2014074959W WO2015074366A1 WO 2015074366 A1 WO2015074366 A1 WO 2015074366A1 CN 2014074959 W CN2014074959 W CN 2014074959W WO 2015074366 A1 WO2015074366 A1 WO 2015074366A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
optical module
wall
casing
dissipation structure
Prior art date
Application number
PCT/CN2014/074959
Other languages
English (en)
French (fr)
Inventor
黄书亮
刘早猛
翟立谦
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP14864147.5A priority Critical patent/EP2990845B1/en
Publication of WO2015074366A1 publication Critical patent/WO2015074366A1/zh
Priority to US14/980,458 priority patent/US9739960B2/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4272—Cooling with mounting substrates of high thermal conductivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs

Definitions

  • the present invention relates to the field of optical communications, and in particular, to a heat dissipation structure of an optical module and an electronic product having the heat dissipation structure of the optical module. Background technique
  • the upper cover and the bottom cover have a plurality of convex structures, and each electronic device needs to be heat-dissipated. Since each device requires a uniform shell-to-face heat dissipation, it has a certain gap tolerance. This gap tolerance requires a thicker heat-conducting material that is applied to the surface of the device and conducted to the chassis for heat dissipation.
  • many products use optical modules for data transmission. Optical modules, such as the Light Transmit Secondary Module (TOSA), are installed between the upper cover and the bottom case. Due to the high density of the optical module, the optical module and the upper cover are caused.
  • TOSA Light Transmit Secondary Module
  • the present invention is used to solve the problem that the gap between the optical module and the product casing is large, and the heat conductive material cannot meet the heat dissipation requirement of the optical module.
  • the present invention provides a heat dissipation structure of the optical module, which can reduce the gap between the optical module and the casing. Tolerance, improve heat transfer efficiency.
  • the present invention provides a heat dissipation structure of an optical module, which is disposed in a casing.
  • the heat dissipation structure of the optical module includes an optical module, an elastic component, a fixed wall, and a heat dissipation wall, and the fixed wall and the heat dissipation wall are connected.
  • the optical module is disposed between the fixed wall and the heat dissipation wall, and the elastic member is elastically resisted between the fixed wall and the optical module, and the elastic force of the elastic component
  • the optical module is brought into close contact with the heat dissipation wall to improve heat dissipation efficiency of the heat dissipation structure of the optical module.
  • the front end of the optical module is provided with a joint portion
  • the rear end of the optical module is provided with a first bonding portion
  • the joint portion passes through the fixed wall.
  • the first bonding portion is in close contact with the heat dissipation wall.
  • the top of the optical module further includes a second bonding portion, and the second bonding portion is in close contact with the casing.
  • the casing is made of a metal material.
  • the first bonding portion and the heat dissipation wall are coated with a heat conductive material.
  • the heat pipe is further disposed on the heat dissipation wall, and the heat emitted by the light module is transmitted to the casing.
  • the heat pipe includes a first portion and a second portion, and an insertion slot is formed between the heat dissipation wall and the casing, and the heat pipe is The second portion is received in the insertion slot, and the first portion of the heat dissipation tube is interposed between the optical module and the heat dissipation wall.
  • the heat pipe is
  • the optical module heat dissipation structure further includes a thermoelectric cooling module, the thermoelectric cooling module includes a control portion and a chip, and the control portion is electrically connected to the circuit board in the casing
  • the chip is fixed between the heat dissipation wall and the casing, the chip includes a cold surface and a hot surface, the cold surface is attached to the heat dissipation wall, and the hot surface is attached to the cabinet.
  • the elastic element includes a first 4 holding portion, a second 4 holding portion, and a connecting portion, wherein the connecting portion is connected to the first resisting portion and the second portion
  • the first abutting portion is configured to abut the fixed wall
  • the second abutting portion is configured to abut the optical module, the first abutting portion and the second portion
  • Each of the resisting portions is provided with an opening slot
  • a front end of the optical module is provided with a joint portion, and the joint portion is received in the open slot and passes through the fixed wall.
  • the elastic element includes a pair of springs, and the front end of the optical module is provided with a joint portion, and each of the springs is abutted between the fixed wall and the optical module.
  • the joint portion passes through the fixed wall, and the pair of springs are symmetrically distributed on both sides of the joint portion.
  • the present invention provides an electronic product comprising a housing and an optical module heat dissipation structure according to any one of the above embodiments provided in the housing.
  • the heat dissipation structure and the electronic product of the optical module provided by the invention ensure that the optical module is in contact with the heat dissipation wall connected to the casing through the elastic force of the elastic component, thereby improving the heat dissipation effect of the optical module and satisfying The heat dissipation requirements of the optical module increase the life of the optical module.
  • FIG. 1 is a schematic diagram of a heat dissipation structure of an optical module disposed inside an electronic product according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a heat dissipation structure of an optical module disposed inside an electronic product according to an embodiment of the present invention, including a heat dissipation tube structure;
  • FIG. 3 is a schematic diagram of a heat dissipation structure of an optical module disposed inside an electronic product according to an embodiment of the present invention, including a heat dissipation tube and a thermoelectric cooling module structure;
  • FIG. 4 is a side view showing a structure in which an elastic member of a heat dissipation structure of an optical module is connected between a light module and a fixed wall in an embodiment of the present invention
  • Figure 5 is a front view showing the structure of the elastic member shown in Figure 4 connected between the optical module and the fixed wall;
  • FIG. 6 is a schematic diagram of a heat dissipation structure of an optical module disposed inside an electronic product according to another embodiment of the present invention.
  • the present invention provides an optical module heat dissipation structure 100.
  • the electronic product 200 should be disposed, and the optical module heat dissipation structure 100 is disposed in the casing 22 of the electronic product 200.
  • the optical module heat dissipation structure 100 includes an optical module 10, an elastic component 20, a fixed wall 30, and a heat dissipation wall 40.
  • the fixed wall 30 and the heat dissipation wall 40 are connected to the casing 22, and the optical module 10 is provided.
  • the elastic member 20 elastically resists between the fixed wall 30 and the optical module 10 between the fixed wall 30 and the heat dissipation wall 40.
  • the elastic force of the elastic member 20 causes the optical module 10 is in close contact with the heat dissipation wall 40 to improve the heat dissipation efficiency of the heat dissipation structure 100 of the optical module.
  • the optical module 20 is a Transmitter Optical Subassembly (TOSA).
  • the optical module heat dissipation structure 100 and the electronic product 200 provided by the present invention the optical module 10 is brought into close contact with the heat dissipation wall 40 by the elastic force of the elastic member 20, so that the optical module 10 is in contact with the heat dissipation wall 40 connected to the casing 22, thereby
  • the heat dissipation effect of the optical module 10 is improved, the heat dissipation requirement of the optical module 10 is met, and the life of the optical module 10 is improved.
  • the front end of the optical module 10 is provided with a joint portion 12, and the rear end of the optical module 10 is provided with a first bonding portion 14, and the joint portion 12 extends through the fixed wall 30
  • the housing 22 extends from the housing 22 of the electronic product 200 for signal transmission with other electronic products.
  • the first bonding portion 14 abuts the heat dissipation wall 40.
  • the invention realizes that the rear portion of the optical module 10 is closely attached to the heat dissipation wall 40 for heat dissipation, and the elastic member 30 is mounted at the fixed wall 30 for the front end joint portion 12 to protrude, that is, the fixed wall 30 has the positioning joint portion 12 at the same time. And the function of the elastic member 30 is installed. Therefore, the structure of the heat dissipation structure 100 of the optical module of the present invention is simple, and at the same time, the electronic product 200 provided by the present invention has the advantage of low cost.
  • the casing 22 includes an upper casing 222 and a lower casing 224, and the fixed wall 30 extends from the lower casing 224 toward the inside of the casing 22, and the heat dissipation wall 40 is from the upper
  • the housing 222 extends toward the inside of the casing 22, and the optical module 10 further includes a second bonding portion 16, and the second bonding portion 16 abuts the upper casing 222.
  • the second bonding portion 16 is disposed at the top of the optical module 10, and the upper casing 222 selects a material with good heat dissipation properties, such as a metal or a ceramic material having good thermal conductivity, and the heat dissipation wall 40 and the upper casing 222 are integrally formed.
  • the second bonding portion 16 of the top of the optical module 10 and the first bonding portion 14 of the rear end are perpendicular to each other, and the heat dissipation wall 40 is perpendicular to the inner surface of the upper casing 222.
  • a close-fitting structure can be formed between the top of the optical module 10 and the upper casing 222, and between the rear end of the optical module 10 and the heat dissipation wall 40.
  • the electronic product 200 also includes a circuit board 26 that is coupled to the lower housing 224, and the rear end of the optical module 10 is electrically coupled to the circuit board 26 by wires 261.
  • the first bonding portion 14 and the heat dissipation wall 40 are coated with a heat conductive material 50. Since the first bonding portion 14 is in surface contact with the heat dissipation wall 40, a small gap is formed between the first bonding portion 14 and the heat dissipation wall 40 due to the problem of flatness.
  • the heat conductive material 50 is thinner, and coating between the first bonding portion 14 and the heat dissipation wall 40 can reduce the interface thermal resistance and improve the heat dissipation performance.
  • a thermally conductive material 50 is also applied between the second abutment portion 16 and the upper casing 222.
  • the heat dissipation structure 100 further includes a heat dissipation tube 60.
  • the heat dissipation tube 60 is embedded in the heat dissipation wall 40, and the heat emitted by the light module 10 is transmitted to the The casing 22.
  • the arrangement of the heat pipe 60 facilitates heat conduction to the upper casing 222 to improve heat transfer efficiency.
  • the heat dissipation pipe 60 includes a first portion 62 and a second portion 64.
  • the heat dissipation wall 40 and the casing 22 form an insertion groove 44, and the second portion 64 of the heat dissipation pipe 60 is received in the heat dissipation pipe 60.
  • the first portion 62 of the heat dissipation tube 60 is interposed between the optical module 10 and the heat dissipation wall 40.
  • the combination of the second portion 64 of the heat pipe 60 and the insertion groove 44 allows the heat pipe 60 to be easily positioned during mounting to the casing 22. When installing, the second portion 64 is first inserted into the insertion groove 44, and the heat pipe is simultaneously made.
  • the first portion 62 of the 60 is abutted against the heat dissipation wall 40, and the optical module 10 is mounted within the casing 22.
  • the heat pipe 60 is L-shaped and made of a metal material, and is fixed to the casing 22 by welding.
  • the heat pipe 60 can also be fixed to the casing 22 by a pipe clamp or the like.
  • the optical module heat dissipation structure 100 further includes a thermoelectric cooling module 70.
  • the thermoelectric cooling module 70 includes a control unit 72 and a chip 74.
  • the control unit 72 is electrically connected.
  • the chip 74 is fixed between the heat dissipation wall 40 and the casing 22, and the chip 74 includes a cold surface 742 and a hot surface 744, the cold surface 742 is attached to the heat dissipation wall 40, and the hot surface 744 is attached to the casing 22.
  • the thermoelectric cooling module 70 can further increase the cooling temperature difference, improve the heat dissipation performance, and ensure the performance and life of the optical module 10.
  • the elastic member 20 is an integrally formed elastic piece structure, and the elastic member 20 includes a first abutting portion 22, a second abutting portion 24, and a connection. - a portion 26, the connecting portion 26 is connected between the first abutting portion 22 and the second abutting portion 24, the first abutting portion 22 is for abutting the fixed wall 30,
  • the second abutting portion 24 is configured to abut the optical module 10, and the first abutting portion 22 and the second abutting portion 24 are respectively provided with an opening slot 28, and the front end of the optical module 10 is provided.
  • the joint portion 12 is received in the open groove 28 and passes through the fixed wall 30.
  • the elastic member 20 has the advantages of simple structure and easy installation by the integrally formed elastic piece structure. When the mounting, the joint portion 12 of the optical module 10 is inserted into the opening groove 28 of the elastic member 20, that is, the elastic member 20 is realized. Positioning.
  • the elastic member 20 includes a pair of springs 29 , and a front end of the optical module 10 is provided with a joint portion 12 , and the joint portion 12 passes through the fixed wall 30 .
  • the pair of springs 29 are symmetrically distributed on both sides of the joint portion 12.
  • the symmetrical distribution of the pair of springs 29 provides stability and balance of the elastic force of the resilient member 20.
  • the fixing of the ends of the spring 29 can be achieved by screw fixing.

Abstract

一种光模块散热结构（100），设置于机壳（22）内，所述光模块散热结构（100）包括光模块（10）、弹性元件（20）、固定墙（30）及散热墙（40），所述固定墙（30）及所述散热墙（40）均连接于所述机壳（22），所述光模块（10）设于所述固定墙（30）与所述散热墙（40）之间，所述弹性元件（20）弹性抵持于所述固定墙（30）与所述光模块（10）之间，所述弹性元件（20）的弹力使得所述光模块（10）紧贴于所述散热墙（40），以提高所述光模块散热结构（100）的散热效率。一种电子产品，所述电子产品包括所述光模块散热结构。所述光模块散热结构及电子产品之光模块（10）紧贴至散热墙（40），提高了光模块的散热效果，能够满足光模块的散热需求，提高了光模块的寿命。

Description

一 一 光模块散热结构及电子产品
本申请要求于 2013 年 11 月 20 日提交中国专利局、 申请号为 201310589282.9, 发明名称为 "光模块散热结构及电子产品" 的中国专利申请 的优先权， 其全部内容通过引用结合在本申请中。 技术领域
本发明涉及光通信领域，尤其涉及一种光模块的散热结构及具有所述光模 块散热结构的电子产品。 背景技术
通信设备中， 为适应产品内部单板上各电子器件高度不同，上盖和底壳有 很多凸起结构，各电子器件需要贴壳散热。 由于各器件均需要统一的贴壳共面 散热， 造成有一定的间隙公差。 这个间隙公差， 就需要厚度较大的导热材料， 涂覆在器件表面上， 传导至机壳散热。 光通信领域中， 很多产品利用光模块进 行数据传输， 光模块， 例如： 光发射次模块（ TOSA )， 安装在上盖和底壳之间， 由于光模块的密度大， 导致光模块与上盖或底壳之间存在较大的间隙， 则需要 导热材料填充间隙， 由于导热材料本身的热阻值也很大， 不能很好得满足光模 块的散热需求， 导致光模块寿命受损。 发明内容
本发明用于解决现有技术中光模块与产品机壳之间间隙大，导热材料不能 满足光模块散热需求的问题， 本发明提供一种光模块散热结构， 能够减少光模 块与机壳的间隙公差， 提升传热效率。
为了实现上述目的， 本发明实施方式提供如下技术方案：
一方面， 本发明提供了一种光模块散热结构， 设置于机壳内， 所述光模块 散热结构包括光模块、 弹性元件、 固定墙及散热墙， 所述固定墙及所述散热墙 均连接于所述机壳， 所述光模块设于所述固定墙与所述散热墙之间， 所述弹性 元件弹性抵持于所述固定墙与所述光模块之间，所述弹性元件的弹力使得所述 光模块紧贴于所述散热墙， 以提高所述光模块散热结构的散热效率。 - - 在第一种可能的实施方式中， 所述光模块的前端设有接头部， 所述光模块 的后端设有第一贴合部， 所述接头部穿过所述固定墙， 所述第一贴合部紧贴所 述散热墙。
结合第一种可能的实施方式，在第二种可能的实施方式中， 所述光模块的 顶部还包括第二贴合部， 所述第二贴合部紧贴所述机壳。
结合第二种可能的实施方式，在第三种可能的实施方式中， 所述机壳为金 属材质。
结合第一种可能的实施方式，在第四种可能的实施方式中， 所述第一贴合 部与所述散热墙之间涂覆导热材料。
在第五种可能的实施方式中，还包括散热管， 所述散热管镶嵌于所述散热 墙， 将所述光模块所散发的热传导至所述机壳。
结合第五种可能的实施方式，在第六种可能的实施方式中， 所述散热管包 括第一部分和第二部分， 所述散热墙与所述机壳之间形成插入槽， 所述散热管 之第二部分收容于所述插入槽内，所述散热管之第一部分夹设于所述光模块与 所述散热墙之间。
结合第六种可能的实施方式，在第七种可能的实施方式中， 所述散热管呈
L形。
在第八种可能的实施方式中， 所述光模块散热结构还包括热电致冷模块， 所述热电致冷模块包括控制部和芯片，所述控制部电连接至所述机壳内的电路 板上，所述芯片固定于所述散热墙与所述机壳之间，所述芯片包括冷面和热面， 所述冷面贴合至所述散热墙， 所述热面贴合至所述机壳。
在第九种可能的实施方式中， 所述弹性元件包括第一 4氏持部、第二 4氏持部 和连接部， 所述连接部连接在所述第一抵持部和所述第二抵持部之间， 所述第 一抵持部用于抵持所述固定墙， 所述第二抵持部用于抵持所述光模块， 所述第 一抵持部和所述第二抵持部均设有开口槽， 所述光模块前端设有接头部， 所述 接头部收容在所述开口槽内并穿过所述固定墙。
在第十种可能的实施方式中， 所述弹性元件包括一对弹簧， 所述光模块前 端设有接头部，每个所述弹簧均抵接于所述固定墙与所述光模块之间， 所述接 头部穿过所述固定墙， 所述对弹簧对称分布于所述接头部的两侧。 - - 另一方面，本发明还提供一种电子产品， 所述电子产品包括机壳及设置于 所述机壳内的上述实施方式中的任意一项所述的光模块散热结构。
本发明提供的光模块散热结构及电子产品，通过弹性元件的弹力使得光模 块紧贴至散热墙，使得光模块与连接至机壳的散热墙之间接触，从而提高光模 块的散热效果， 满足光模块的散热需求， 提高光模块的寿命。 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所 需要使用的附图作简单地介绍，显而易见地， 下面描述中的附图仅仅是本发明 的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
为了更清楚地说明本发明的技术方案，下面将对实施方式中所需要使用的 附图作简单地介绍，显而易见地， 下面描述中的附图仅仅是本发明的一些实施 方式， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以 如这些附图获得其他的附图。
图 1 是本发明一种实施方式中的设于电子产品内部的光模块散热结构的 示意图；
图 2是本发明一种实施方式中的设于电子产品内部的光模块散热结构的 示意图， 其中包括散热管结构；
图 3 是本发明一种实施方式中的设于电子产品内部的光模块散热结构的 示意图， 其中包括散热管及热电致冷模块结构；
图 4 本发明一种实施方式中的光模块散热结构之弹性元件连接于光模块 与固定墙之间的结构侧视图；
图 5是图 4所示的之弹性元件连接于光模块与固定墙之间的结构的主视图 态； 及
图 6 是本发明另一种实施方式中的设于电子产品内部的光模块散热结构 的示意图。 具体实施方式 - - 下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进 行清楚、 完整地描述。
如图 1所示，本发明提供了一种光模块散热结构 100，应该用电子产品 200， 光模块散热结构 100设置于电子产品 200的机壳 22内。 所述光模块散热结构 100包括光模块 10、 弹性元件 20、 固定墙 30及散热墙 40， 所述固定墙 30及 所述散热墙 40均连接于所述机壳 22， 所述光模块 10设于所述固定墙 30与所 述散热墙 40之间， 所述弹性元件 20弹性抵持于所述固定墙 30与所述光模块 10之间， 所述弹性元件 20的弹力使得所述光模块 10紧贴于所述散热墙 40， 以提高所述光模块散热结构 100的散热效率。 具体而言， 所述光模块 20为光 发射次模块（Transmitter Optical Subassembly, TOSA )。
本发明提供的光模块散热结构 100及电子产品 200， 通过弹性元件 20的 弹力使得光模块 10紧贴至散热墙 40， 使得光模块 10与连接至机壳 22的散热 墙 40之间接触，从而提高光模块 10的散热效果， 满足光模块 10的散热需求， 提高光模块 10的寿命。
本实施方式中， 所述光模块 10的前端设有接头部 12， 所述光模块 10的 后端设有第一贴合部 14， 所述接头部 12穿过所述固定墙 30伸出机壳 22， 接 头部 12伸出电子产品 200机壳 22用于与外界其它电子产品实现信号传输，所 述第一贴合部 14紧贴所述散热墙 40。 本发明实现了光模块 10的后部贴紧散 热墙 40进行散热， 并且在供前端的接头部 12伸出的固定墙 30处安装弹性元 件 30，也就是， 固定墙 30同时具备定位接头部 12及安装弹性元件 30的作用， 因此本发明光模块散热结构 100的结构简单，同时使得本发明提供的电子产品 200具有低成本的优势。
进一步地， 所述机壳 22包括上壳体 222和下壳体 224， 所述固定墙 30自 所述下壳体 224向所述机壳 22的内部延伸， 所述散热墙 40自所述上壳体 222 向所述机壳 22的内部延伸， 所述光模块 10还包括第二贴合部 16， 所述第二 贴合部 16紧贴所述上壳体 222。 具体而言， 第二贴合部 16设置在光模块 10 的顶部， 上壳体 222选择散热性能好的材料， 例如金属或导热性能好的陶瓷材 料等， 散热墙 40与上壳体 222—体成型， 光模块 10的顶部的第二贴合部 16 与后端的第一贴合部 14相互垂直， 散热墙 40与垂直于上壳体 222的内表面， - - 藉此， 光模块 10的顶部与上壳体 222之间， 及光模块 10的后端与散热墙 40 之间均能够形成紧密贴合的结构。 电子产品 200还包括电路板 26， 电路板 26 连接于下壳体 224， 光模块 10的后端通过导线 261电连接至电路板 26。
本实施方式中， 所述第一贴合部 14与所述散热墙 40之间涂覆导热材料 50。 由于第一贴合部 14与散热墙 40之间为面接触， 由于平面度的问题导致第 一贴合部 14与散热墙 40相互贴紧后，二者之间会产生很小的间隙， 所述导热 材料 50较薄， 涂覆在第一贴合部 14与散热墙 40之间能够减低界面热阻， 提 升散热性能。 同样， 第二贴合部 16与上壳体 222之间亦涂覆导热材料 50。
请参阅图 2， 本发明优选的实施方式中， 光模块散热结构 100还包括散热 管 60， 所述散热管 60镶嵌于所述散热墙 40， 将所述光模块 10所散发的热传 导至所述机壳 22。 散热管 60的设置利于将热传导至上壳体 222散热， 提升传 热效率。
本实施方式中， 所述散热管 60包括第一部分 62和第二部分 64， 所述散 热墙 40与所述机壳 22之间形成插入槽 44， 所述散热管 60之第二部分 64收 容于所述插入槽 44内， 所述散热管 60之第一部分 62夹设于所述光模块 10 与所述散热墙 40之间。散热管 60的第二部分 64与插入槽 44的结合，使得散 热管 60安装至机壳 22的过程中， 容易定位， 安装时， 先将第二部分 64插入 插入槽 44内， 同时使得散热管 60的第一部分 62紧靠散热墙 40， 再将光模块 10安装在机壳 22内。 具体而言， 散热管 60呈 L形， 且为金属材料制成， 通 过焊接的方式固定于机壳 22， 散热管 60也可以通过管夹等其它的方式固定至 机壳 22。
请参阅图 3， 本发明优选的实施方式中， 所述光模块散热结构 100还包括 热电致冷模块 70， 所述热电致冷模块 70包括控制部 72和芯片 74， 所述控制 部 72电连接至所述机壳 22内的电路板 26上，所述芯片 74固定于所述散热墙 40与所述机壳 22之间， 所述芯片 74包括冷面 742和热面 744， 所述冷面 742 贴合至所述散热墙 40， 所述热面 744贴合至所述机壳 22。 热电致冷模块 70 能够进一步加大制冷温差， 提升散热性能， 保证光模块 10的性能及寿命。
请同时参阅图 4及图 5， 具体的实施方式中， 所述弹性元件 20为一体成 型的弹片结构， 所述弹性元件 20包括第一抵持部 22、 第二抵持部 24和连接 - - 部 26， 所述连接部 26连接在所述第一抵持部 22和所述第二抵持部 24之间， 所述第一抵持部 22用于抵持所述固定墙 30， 所述第二抵持部 24用于抵持所 述光模块 10， 所述第一抵持部 22和所述第二抵持部 24均设有开口槽 28， 所 述光模块 10前端设有接头部 12， 所述接头部 12收容在所述开口槽 28内并穿 过所述固定墙 30。 所述弹性元件 20通过一体成型的弹片结构设计具有结构简 单， 便于安装的优点， 安装时， 将光模块 10的接头部 12卡入弹性元件 20的 开口槽 28内， 即实现了弹性元件 20的定位。
请参阅图 6， 本发明另一实施方式中， 所述弹性元件 20包括一对弹簧 29， 所述光模块 10前端设有接头部 12， 所述接头部 12穿过所述固定墙 30， 所述 对弹簧 29对称分布于所述接头部 12的两侧。 一对弹簧 29的对称分布使得弹 性元件 20的弹力具有稳定性和均衡性。弹簧 29的两端的固定方式可以通过螺 丝固定的方式实现。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技 术人员来说， 在不脱离本发明原理的前提下， 还可以做出若干改进和润饰， 这 些改进和润饰也视为本发明的保护范围。

Claims

权 利 要 求
1.一种光模块散热结构， 设置于机壳内， 其特征在于， 所述光模块散热结 构包括光模块、 弹性元件、 固定墙及散热墙， 所述固定墙及所述散热墙均连接 于所述机壳， 所述光模块设于所述固定墙与所述散热墙之间， 所述弹性元件弹 性抵持于所述固定墙与所述光模块之间，所述弹性元件的弹力使得所述光模块 紧贴于所述散热墙， 以提高所述光模块散热结构的散热效率。
2.如权利要求 1所述的光模块散热结构， 其特征在于， 所述光模块的前端 设有接头部， 所述光模块的后端设有第一贴合部， 所述接头部穿过所述固定墙 伸出所述机壳， 所述第一贴合部紧贴所述散热墙。
3.如权利要求 2所述的光模块散热结构， 其特征在于， 所述光模块还包括 第二贴合部， 所述第二贴合部紧贴所述机壳。
4.如权利要 2所述的光模块散热结构， 其特征在于， 所述第一贴合部与所 述散热墙之间涂覆导热材料。
5.如权利要求 1所述的光模块散热结构， 其特征在于， 所述光模块散热结 构还包括散热管， 所述散热管镶嵌于所述散热墙，将所述光模块所散发的热传 导至所述机壳。
6.如权利要求 5所述的光模块散热结构， 其特征在于， 所述散热管包括第 一部分和第二部分， 所述散热墙与所述机壳之间形成插入槽， 所述散热管之第 二部分收容于所述插入槽内，所述散热管之第一部分夹设于所述光模块与所述 散热墙之间。
7.如权利要求 6 所述的光模块散热结构， 其特征在于， 所述散热管呈 L 形。
8.如权利要求 1所述的光模块散热结构， 其特征在于， 所述光模块散热结 构还包括热电致冷模块， 所述热电致冷模块包括控制部和芯片， 所述控制部电 连接至所述机壳内的电路板上， 所述芯片固定于所述散热墙与所述机壳之间， 所述芯片包括冷面和热面， 所述冷面贴合至所述散热墙， 所述热面贴合至所述 机壳。
9.如权利要求 1所述的光模块散热结构， 其特征在于， 所述弹性元件包括 第一抵持部、第二抵持部和连接部， 所述连接部连接在所述第一抵持部和所述 第二抵持部之间， 所述第一抵持部用于抵持所述固定墙， 所述第二抵持部用于 抵持所述光模块， 所述第一抵持部和所述第二抵持部均设有开口槽， 所述光模 块前端设有接头部， 所述接头部收容在所述开口槽内并穿过所述固定墙。
10. 如权利要求 1所述的光模块散热结构， 其特征在于， 所述弹性元件 包括一对弹簧，每个所述弹簧均抵接于所述固定墙与所述光模块之间， 所述光 模块前端设有接头部， 所述接头部穿过所述固定墙， 所述对弹簧对称分布于所 述接头部的两侧。
11. 一种电子产品， 包括机壳， 其特征在于， 所述电子产品还包括设置 于所述机壳内的如权利要求 1-10任意一项所述的光模块散热结构。
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