WO2015064709A1 - 接着テープ構造体及び接着テープ収容体 - Google Patents

接着テープ構造体及び接着テープ収容体 Download PDF

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Publication number
WO2015064709A1
WO2015064709A1 PCT/JP2014/078956 JP2014078956W WO2015064709A1 WO 2015064709 A1 WO2015064709 A1 WO 2015064709A1 JP 2014078956 W JP2014078956 W JP 2014078956W WO 2015064709 A1 WO2015064709 A1 WO 2015064709A1
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WO
WIPO (PCT)
Prior art keywords
tape
adhesive
adhesive tape
film
adhesive layer
Prior art date
Application number
PCT/JP2014/078956
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
和典 濱崎
太郎 花渕
幸一 中原
長谷川　剛
伸栄 渡邉
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020167010830A priority Critical patent/KR102285601B1/ko
Priority to CN201480059731.1A priority patent/CN105658752B/zh
Publication of WO2015064709A1 publication Critical patent/WO2015064709A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H19/00—Changing the web roll
    • B65H19/10—Changing the web roll in unwinding mechanisms or in connection with unwinding operations
    • B65H19/18—Attaching, e.g. pasting, the replacement web to the expiring web
    • B65H19/1842—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact
    • B65H19/1852—Attaching, e.g. pasting, the replacement web to the expiring web standing splicing, i.e. the expiring web being stationary during splicing contact taking place at a distance from the replacement roll
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/41—Winding, unwinding
    • B65H2301/412—Roll
    • B65H2301/4127—Roll with interleaf layer, e.g. liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/46—Splicing
    • B65H2301/462—Form of splice
    • B65H2301/4622—Abutting article or web portions, i.e. edge to edge
    • B65H2301/46222—Abutting article or web portions, i.e. edge to edge involving double butt splice, i.e. adhesive tape applied on both sides of the article or web portions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web
    • B65H2701/1942—Web supporting regularly spaced non-adhesive articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/87—Photovoltaic element manufacture, e.g. solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

Definitions

  • the present invention relates to a technique for lengthening an adhesive tape for joining a tab line of a solar cell.
  • a long adhesive tape for bonding various electronic components and the like is known.
  • Such an adhesive tape is formed on a narrow and long release sheet, and is shipped in a form wound on a reel in a roll shape.
  • the adhesive tape is pulled out from the reel and used.
  • the production line is temporarily stopped and the adhesive tape is replaced with the reel.
  • the present invention has been made in consideration of the problems of the conventional technology, and the object of the present invention is to make a significant increase in the adhesive tape without changing the existing raw fabric and the adhesive application mechanism.
  • An object of the present invention is to provide a technique capable of achieving an increase in length.
  • the present invention provides a plurality of adhesive tapes in which an adhesive layer and a release cover film are sequentially provided on a base film, and an adhesive layer and a release film are sequentially provided on a connecting substrate.
  • An adhesive tape structure connected via a connecting tape wherein an end portion of the base film of the adhesive tape and an end portion of the connecting base material of the connecting tape are bonded by a base-side adhesive member
  • the end portion of the release cover film of the adhesive tape and the end portion of the release film of the connecting tape are bonded by a release-side adhesive member, and the release cover film and the release film are integrally peeled off.
  • This is an adhesive tape structure.
  • connection base material of the said connection tape consists of a non-light-transmitting material.
  • adhesive layer of the said connection tape consists of a material different from the material of the adhesive bond layer of the said adhesive tape.
  • the adhesive layer of the connecting tape is also effective when the visible light transmittance is 70% or more.
  • peeling force of the adhesive layer of the said connection tape and a peeling film is 2 times or less of the peeling force of the adhesive layer of the said adhesive tape and a peeling cover film.
  • the present invention when the adhesive tape structure is transported via a guide roller, it is also effective when the tack force of the adhesive layer of the connecting tape with respect to the guide roller is 200 gf / 5 mm ⁇ or less.
  • the present invention is an adhesive tape container in which any of the above-described adhesive tape structures is wound around a reel member having a flange interval wider than the tape width of the adhesive tape structure by traverse winding.
  • the end portion of the base film of the adhesive tape and the end portion of the connecting base material of the connecting tape are bonded by the base material side adhesive member, and the end portion of the peeling cover film of the adhesive tape And the end portion of the release film of the connecting tape are bonded to each other by the release-side adhesive member, and the release cover film and the release film are integrally peeled off.
  • the configuration and function are the same as the conventional one, and the adhesive can be continuously applied to the adherend using an existing application device.
  • the connecting base material of the connecting tape is made of a non-translucent material
  • the connecting base material can be detected by the optical sensor, thereby skipping the connecting tape portion on the adherend.
  • the adhesive can be continuously applied.
  • the pressure-sensitive adhesive layer of the connecting tape is made of a material different from the material of the adhesive layer of the adhesive tape, for example, by using a non-curing resin or a cured resin only for the portion of the pressure-sensitive adhesive layer, Storage stability can be improved. Further, when the adhesive layer of the adhesive tape uses, for example, an expensive filler or the like, the production cost can be suppressed by forming the adhesive layer with a relatively inexpensive material.
  • the adhesive layer of the connecting tape has a visible light transmittance of 70% or more, even if the optical sensor is located on the adhesive layer side of the connecting tape, the adhesive tape is interposed through the adhesive layer.
  • the connected base material can be detected by the optical sensor.
  • the peeling cover film of an adhesive tape when the peeling force of the adhesive layer of a connection tape and a peeling film is 2.0 times or less of the peeling force of the adhesive layer of an adhesive tape and a peeling cover film, the peeling cover film of an adhesive tape
  • the release film can be smoothly peeled from the pressure-sensitive adhesive layer at a speed equivalent to the peeling speed.
  • the adhesive tape structure when the adhesive tape structure is transported via a guide roller, if the tack force of the adhesive layer of the connecting tape to the guide roller is 200 gf / 5 mm ⁇ or less, the adhesive layer of the connecting substrate When the adhesive contacts the guide roller, the adhesive does not transfer to the guide roller, and the adhesive tape structure can run smoothly.
  • the adhesive tape container of the present invention in which the adhesive tape structure described above is wound by traverse winding on a reel having a flange interval wider than the tape width of the adhesive tape structure, the adhesive tape structure is very long. Since the adhesive tape structure can be wound and pulled out smoothly, it is not necessary to frequently replace the reel in the adhesive tape application process, and production efficiency can be greatly improved.
  • FIG. 1A is a side configuration diagram of an embodiment of an adhesive tape structure according to the present invention
  • FIG. 1B is a side configuration diagram showing a main part of the adhesive tape structure
  • FIG. These are side surface block diagrams which expand and show the connection part of the adhesive tape structure.
  • the adhesive tape structure 1 of the present embodiment is a series of long ones in which a plurality of adhesive tapes 2 are connected via connecting tapes 3 respectively.
  • the adhesive tape 2 has the same configuration, and has a so-called three-layer structure in which an adhesive layer 21 and a release cover film 22 are sequentially provided on the entire surface of the base film 20.
  • the connecting tape 3 has the same configuration, and has a so-called three-layer structure in which the adhesive layer 31 and the release film 32 are sequentially provided on the entire surface of the connecting base material 30.
  • the connecting tape 3 is configured to be shorter than the adhesive tape 2.
  • the length of each adhesive tape 2 and the length of each connecting tape 3 may be the same or different.
  • the upper surface (surface opposite to the adhesive layer 21) of the end portion of the base film 20 of the adhesive tape 2, and the upper surface (surface opposite to the adhesive layer 31) of the end portion of the connection base material 30 of the connection tape 3; are bonded and connected by a base material side adhesive member 41. Furthermore, the upper surface (the surface opposite to the adhesive layer 21) of the end portion of the release cover film 22 of the adhesive tape 2 and the upper surface (the surface opposite to the adhesive layer 31) of the end portion of the release film 32 of the connecting tape 3 ) Is adhered by the peeling-side adhesive member 42.
  • the base film 20 of the adhesive tape 2 can use what consists of PET, for example.
  • the thickness of the base film 20 is not particularly limited, but a film having a thickness of 10 to 100 ⁇ m can be suitably used from the viewpoint of securing material strength and not increasing the winding diameter.
  • the width of the base film 20 is not particularly limited, but a film having a thickness of 20 to 2000 ⁇ m can be suitably used from the viewpoint of reliably covering various electronic components.
  • the upper surface of the base film 20 can also perform the peeling process by a silicone resin, for example.
  • a resin used for an adhesive for a normal adhesive tape particularly a thermosetting resin (for example, an epoxy resin, a phenoxy resin, a urethane resin, or the like) can be used.
  • the thickness of the adhesive layer 21 is not particularly limited, but it is more preferably set to 10 to 100 ⁇ m from the viewpoint of reliably connecting terminals having variations in the height of various electronic components.
  • the peeling cover film 22 of the adhesive tape 2 protects the adhesive layer 21 and is peeled off during use.
  • this peeling cover film 22 for example, a film made of PET can be used.
  • the thickness of the release cover film 22 is not particularly limited, but is preferably set to 10 to 100 ⁇ m from the viewpoint of securing material strength and not increasing the winding diameter.
  • the length of the adhesive tape 2 described above is not particularly limited, but the number of skips when using the adhesive tape structure 1 is reduced and the maximum application length of the application equipment for the adhesive tape 2 is taken into consideration. Then, the thing of 50-1000 m can be used conveniently.
  • connection base material 30 of the connection tape 3 what consists of a non-light-transmitting material which can be detected with an optical sensor can be used.
  • connection base material 30 what disperse
  • the thickness of the connection base material 30 is not particularly limited, from the viewpoint of preventing the occurrence of a step at the time of winding by ensuring a thickness equivalent to the base film 20 of the adhesive tape 2, Those having a thickness of 10 to 100 ⁇ m can be preferably used.
  • the width of the connecting substrate 30 is not particularly limited, but is equivalent to the width of the base film 20 of the adhesive tape 2 from the viewpoint of smooth winding, drawing and running of the adhesive tape structure 1. It is preferable to set so that.
  • the pressure-sensitive adhesive layer 31 of the connecting tape 3 is for smoothly peeling the release film 32 of the connecting tape 3. That is, as will be described later, the release film 32 of the connection tape 3 is peeled off together with the release cover film 22 of the adhesive tape 2, but between the release film 32 of the connection tape 3 and the connection base material 30. If there is no sticky substance, the speed of the release film 32 is temporarily increased when the release film 32 is peeled off, which may cause a shift in the transport speed of the production line.
  • the pressure-sensitive adhesive layer 31 of the present invention is for preventing such inconvenience.
  • the peeling force between the adhesive layer 31 of the connecting tape 3 and the peeling film 32 is 0.2 to 2.0 times the peeling force between the adhesive layer 21 and the peeling cover film 22 of the adhesive tape 2. More preferably, the configuration is as follows.
  • the peeling force between the adhesive layer 31 and the release film 32 of the connecting tape 3 is greater than 2.0 times the peeling force between the adhesive layer 21 and the release cover film 22 of the adhesive tape 2, the adhesive of the connecting tape 3.
  • the release film 32 may not be smoothly peeled off from the layer 31.
  • the pressure-sensitive adhesive layer 31 of the connecting tape 3 can use any resin having the same or different composition from the adhesive layer 21 of the adhesive tape 2.
  • the resin having a composition different from that of the adhesive layer 21 of the adhesive tape 2 include a silicone resin.
  • the thickness of the pressure-sensitive adhesive layer 31 for satisfying the above conditions is preferably set to 10 to 100 ⁇ m.
  • the pressure-sensitive adhesive layer 31 of the connecting tape 3 is a portion that is not originally transferred to the adherend and is skipped, only the portion of the pressure-sensitive adhesive layer 31 is a non-curing resin or a cured material. By using this resin, storage stability can be improved. Further, when the adhesive layer 21 of the adhesive tape 2 uses, for example, an expensive filler, the manufacturing cost can be suppressed by forming the pressure-sensitive adhesive layer 31 with a relatively inexpensive material.
  • the pressure-sensitive adhesive layer 31 can also be composed of a light transmissive material. That is, as described above, the connection base material 30 of the connection tape 3 can be detected by the optical sensor by configuring the connection base material 30 of the connection tape 3 from a non-translucent material. When located on the pressure-sensitive adhesive layer 31 side, light may be blocked by the pressure-sensitive adhesive layer 31 and the connection base material 30 may not be detected. Therefore, in such a case, the connecting base material 30 can be detected by the optical sensor through the adhesive layer 31 by forming the adhesive layer 31 of the connecting tape 3 from a light-transmitting material.
  • the adhesive layer 31 has a visible light transmittance (light More preferably, the transmittance is 70% or more.
  • the release film 32 of the connecting tape 3 protects the pressure-sensitive adhesive layer 31 and is peeled off during use.
  • a film made of PET can be used as the release film 32.
  • the thickness of the release film 32 is not particularly limited, but by ensuring a thickness equivalent to that of the release cover film 22 of the adhesive tape 2, it is possible to prevent a step from occurring during winding. From the viewpoint, it is more preferably set to 10 to 100 ⁇ m.
  • the length of the connecting tape 3 described above is not particularly limited, but is set to 5 to 100 cm from the viewpoint of being able to sense with an optical sensor and not reducing the transport speed of the production line as much as possible. More preferably.
  • the substrate-side adhesive member 41 firmly bonds the end of the base film 20 of the adhesive tape 2 and the end of the connecting substrate 30 of the connecting tape 3 with an adhesive 45 provided on the base 43.
  • an adhesive made of an acrylic resin can be used as a material of the adhesive 45.
  • the thing of a silicone resin type may also be used as the material of the adhesive 45. it can.
  • the length of the base material side adhesive member 41 mentioned above is not specifically limited, it has the adhesive force which connects the adhesive tape 2 and the connection tape 3 reliably, and is workability
  • the peeling-side adhesive member 42 firmly bonds the end portion of the peeling cover film 22 of the adhesive tape 2 and the end portion of the peeling film 32 of the connecting tape 3 with an adhesive 46 provided on the base 44.
  • an adhesive 46 for example, an adhesive made of acrylic resin can be used.
  • a silicone resin-based material may be used as the material of the adhesive 46. it can.
  • the length of the peeling side adhesive member 42 mentioned above is not specifically limited, it has the adhesive force which connects the adhesive tape 2 and the connection tape 3 reliably, and has the workability
  • a slight gap is provided between the end of the adhesive tape 2 and the end of the connecting tape 3. This is because the peeling cover film 22 of the adhesive tape 2 and the peeling film 32 of the connecting tape 3 are smoothly and integrally peeled, and a margin when the adhesive tape structure 1 is manufactured is taken into consideration.
  • the adhesive tape structure 1 of the present invention is obtained by connecting two or more of the above-described adhesive tapes 2 with the above-described connecting tape 3.
  • FIG. 2 is a diagram for explaining a process of thermocompression bonding an adhesive layer of an adhesive tape to an adherend using the adhesive tape structure of the present embodiment
  • FIGS. Explanatory drawing which shows the state which peels the peeling cover film of an adhesive tape, and the peeling film of a connection tape from a tape structure
  • FIG. 4 (a) (b) shows the state which detects the connection base material of a connection tape with an optical sensor.
  • FIG. 5 and FIG. 5 are explanatory views showing the relationship between the pressure-sensitive adhesive layer remaining on the adhesive tape structure and the guide roller.
  • the adhesive tape structure 1 is pulled out from the roll 1 ⁇ / b> A of the adhesive tape structure 1 wound around the reel member 10, the direction is changed via the drawing roller 11, and the peeling roller 12, the peeling cover film 22 of the adhesive tape 2 and the peeling film 32 of the connecting tape 3 are peeled off.
  • the peeling cover film 22 of the adhesive tape 2 is peeled off from the adhesive layer 21 by the operation of the peeling roller 12, but the peeling cover film 22 is peeled off by the peeling side adhesive member 42. Since it is adhered to the release film 32 of the connecting tape 3, the release cover film 22 of the adhesive tape 2 and the release film 32 of the connection tape 3 are integrally peeled off as shown in FIG. 3 (b). become.
  • the adhesive tape structure 1 is conveyed by the rollers 13 to 15 shown in FIG. 2, and a portion to be subjected to thermocompression bonding of the adhesive tape structure 1 is disposed between the thermocompression bonding head 16 and the adherend 17, Then, the thermocompression bonding head 16 is operated to transfer the adhesive layer 21 of the adhesive tape 2 to the adherend 17.
  • the optical sensor 5 detects the presence or absence of the non-translucent connecting base material 30 of the connecting tape 3 and detects the connecting base material 30, the connecting tape 3 is connected to the thermocompression bonding head 16 and the adherend 17.
  • the adhesive tape structure 1 is controlled so that the adhesive layer 31 of the connecting tape 3 is not transferred to the adherend 17.
  • the adhesive layer 31 of the connecting tape 3 is made of a light-transmitting material, so that the optical sensor 5 is positioned on the connecting base material 30 side of the connecting tape 3 (FIG. 4 ( a) see)
  • the connection substrate 30 can be detected by the optical sensor 5 via the adhesive layer 31. (See FIG. 4 (b)).
  • the adhesive tape structure 1 is changed in direction by the guide roller 18 shown in FIG. 2 and conveyed, and the adhesive tape structure 1 is wound up by the winding device 19.
  • connection tape 3 since the adhesive layer 31 of the connection tape 3 is not transcribe
  • the guide roller 18 may be made of silicone resin, or the surface of the guide roller 18 may be processed with a peelable resin such as silicone resin or polytetrafluoroethylene resin.
  • FIGS. 6A and 6C are intervals between the adhesive films wound around the core shaft portion of the reel member. It is explanatory drawing which shows.
  • the adhesive tape structure 1 is wound by traverse winding on the core shaft portion 54 of the reel member 53 having flanges 51 and 52 that are wider than the tape width of the adhesive tape structure 1. It is what has been.
  • the traverse winding refers to winding the long adhesive tape structure 1 on a core shaft portion 54 of the reel member 53 in a spiral manner at a predetermined pitch (interval).
  • the adhesive tape structure 1 is wound on the core shaft portion 54 of the reel member 53 so that the interval between the adjacent adhesive tape structures 1 becomes a predetermined value p (see FIG. 6B). Furthermore, the adhesive tape structure 1 is overlapped and wound on these adhesive tape structures 1 so that the interval between the adjacent adhesive tape structures 1 becomes a predetermined value p (see FIG. 6C).
  • the interval p between the adjacent adhesive tape structures 1 is such that there is no possibility that the adjacent adhesive tape structures 1 are bonded to each other by the adhesive protruding in the tape width direction, and when the adhesive tape structure 1 is wound up. It is better to set it to a value that does not cause roll-up.
  • the pressure-sensitive adhesive layer is made of the following resin A. That is, the composition of the resin A is 100 parts by weight of a silicone resin (SD4584PSA manufactured by Toray Dow Corning), 0.7 parts by weight of a curing agent (BY24-741 manufactured by Toray Dow Corning), and a silane coupling agent (Momentive Performance Materials A-187) 1 part by weight and platinum catalyst (Toray Dow Corning NC-25) 0.6 part by weight.
  • a silicone resin SD4584PSA manufactured by Toray Dow Corning
  • BY24-741 manufactured by Toray Dow Corning
  • silane coupling agent Momentive Performance Materials A-187
  • This composition was applied onto a connecting substrate by a bar coater, heated for 5 minutes at a temperature of 70 ° C., and further cured by heating for 4 minutes at 150 ° C. to form an adhesive layer having a thickness of 20 ⁇ m. Moreover, as a peeling film, what consists of 25 micrometers in thickness PET was used.
  • Example 2 A connecting tape was prepared under the same conditions as in Example 1 except that the adhesive layer was made of the following resin B.
  • the composition of the resin B is 30 parts by weight of phenoxy resin (manufactured by Nippon Steel Chemical Co., Ltd., YP-50), 20 parts by weight of liquid epoxy resin (manufactured by Mitsubishi Chemical Co., Ltd.), rubber component (SG80H, manufactured by Nagase Chemtech) 10 parts by weight, 40 parts by weight of a curing agent (Novacure 3941HP manufactured by Asahi Kasei Co., Ltd.), and 1 part by weight of a silane coupling agent (A-187 manufactured by Momentive Performance Materials).
  • Example 3 A connecting tape was prepared under the same conditions as in Example 1 except that 5% by weight of fused silica filler (FB-5D manufactured by Denka) was added to the resin A.
  • FB-5D fused silica filler
  • Example 4 A connecting tape was prepared under the same conditions as in Example 1 except that 10% by weight of the fused silica filler was added to the resin A.
  • the probe of the detection unit was ⁇ 5 mm, the probe was lowered at a speed of 30 mm / min and brought into contact with the pressure-sensitive adhesive layer, and the tack force when pressurized by 200 gf / 5 mm ⁇ and raised for 1 second was measured. .
  • the results are shown in Table 1.
  • the reel member of each adhesive tape structure was mounted on the apparatus shown in FIG. 2 and traveled, the release film was peeled off, and it was confirmed whether or not the optical sensor recognized the connecting substrate through the adhesive layer. .
  • the results are shown in Table 1.
  • the tape feed speed was 200 mm / sec
  • the tape feed pitch was 200 mm.
  • a digital fiber sensor (OMRON E3X-DA11-S) was used as the optical sensor, and the threshold was set to 1750.
  • Example 3 and Example 4 in which the ratio (Y / X) of the peeling force (Y) of the connecting tape to the peeling force (X) of the peeling tape of the adhesive tape is 2.0 or less, It peeled smoothly from the pressure-sensitive adhesive layer, and the peeling speed was equivalent to the peeling speed of the peeling cover film of the adhesive tape.
  • Example 1 and Example 2 in which the ratio (Y / X) of the peeling force (Y) of the peeling film of the connecting tape to the peeling force (X) of the peeling cover film of the adhesive tape is larger than 2.0. Peeled slightly later than the peelable cover film of the adhesive tape.
  • Example 1 to 3 having a light transmittance of 70% or more were reliably recognized by the light sensor.
  • Example 4 in which the light transmittance of the pressure-sensitive adhesive layer was 58%, it was rarely recognized (not more than once per 100 times) by the optical sensor.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Replacement Of Web Rolls (AREA)
PCT/JP2014/078956 2013-10-31 2014-10-30 接着テープ構造体及び接着テープ収容体 WO2015064709A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020167010830A KR102285601B1 (ko) 2013-10-31 2014-10-30 접착 테이프 구조체 및 접착 테이프 수용체
CN201480059731.1A CN105658752B (zh) 2013-10-31 2014-10-30 粘接带构造体及粘接带收纳体

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Application Number Priority Date Filing Date Title
JP2013227564A JP6333539B2 (ja) 2013-10-31 2013-10-31 接着テープ構造体及び接着テープ収容体
JP2013-227564 2013-10-31

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WO2015064709A1 true WO2015064709A1 (ja) 2015-05-07

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JP6322405B2 (ja) * 2013-12-10 2018-05-09 デクセリアルズ株式会社 接着テープ構造体及び接着テープ収容体
EP3418339B1 (en) * 2016-02-16 2020-07-15 Panasonic Intellectual Property Management Co., Ltd. Encased adhesive tape and method for manufacturing solar cell module
JP6689135B2 (ja) * 2016-05-20 2020-04-28 デクセリアルズ株式会社 接着テープ構造体
JP6668164B2 (ja) * 2016-05-20 2020-03-18 デクセリアルズ株式会社 接着テープ構造体
JP6696826B2 (ja) * 2016-05-20 2020-05-20 デクセリアルズ株式会社 接着テープ構造体
JP6696828B2 (ja) * 2016-05-20 2020-05-20 デクセリアルズ株式会社 接着テープ構造体
JP6783552B2 (ja) * 2016-05-20 2020-11-11 デクセリアルズ株式会社 接着テープ構造体
JP6696827B2 (ja) * 2016-05-20 2020-05-20 デクセリアルズ株式会社 接着テープ構造体
JP7164390B2 (ja) * 2018-10-19 2022-11-01 株式会社ヒラノテクシード 貼り付け装置
CN113613853B (zh) * 2019-03-31 2024-04-09 迪睿合株式会社 切缝装置、切缝方法和层叠带

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