WO2015053141A1 - Dc-dcコンバータ装置 - Google Patents
Dc-dcコンバータ装置 Download PDFInfo
- Publication number
- WO2015053141A1 WO2015053141A1 PCT/JP2014/076241 JP2014076241W WO2015053141A1 WO 2015053141 A1 WO2015053141 A1 WO 2015053141A1 JP 2014076241 W JP2014076241 W JP 2014076241W WO 2015053141 A1 WO2015053141 A1 WO 2015053141A1
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- pair
- potential side
- circuit board
- low
- converter device
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-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L1/00—Supplying electric power to auxiliary equipment of vehicles
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
- H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/33569—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
- H02M3/33576—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer
- H02M3/33592—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements having at least one active switching element at the secondary side of an isolation transformer having a synchronous rectifier circuit or a synchronous freewheeling circuit at the secondary side of an isolation transformer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
- B60L2210/00—Converter types
- B60L2210/10—DC to DC converters
- B60L2210/12—Buck converters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/01—Resonant DC/DC converters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
- H02M3/325—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal
- H02M3/335—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/33569—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only having several active switching elements
- H02M3/33573—Full-bridge at primary side of an isolation transformer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/72—Electric energy management in electromobility
Definitions
- the present invention relates to a DC-DC converter device.
- high-voltage storage batteries for driving power
- inverters for driving the motor by converting the DC high-voltage output of the high-voltage storage battery to AC high-voltage output Device
- DC-DC converter device that converts DC high voltage output of high voltage storage battery to DC low voltage output and supplies power to low voltage loads such as vehicle lights and radios, and as auxiliary power source for low voltage load
- a low-voltage storage battery is installed.
- a DC-DC converter device is a high voltage switching circuit that converts a high DC voltage into an AC voltage, a transformer that converts the AC high voltage into an AC low voltage, and converts the low voltage AC voltage into a DC voltage.
- a low voltage rectifier circuit and an output terminal for outputting a voltage converted voltage are provided.
- the low voltage rectifier circuit includes a choke coil and a smoothing capacitor element for smoothing the DC output voltage.
- the filter circuit which consists of a reactor and a capacitor
- Patent Document 1 a semiconductor element or a rectifying element is arranged at a position facing the substrate and connected via an insert bus bar for electrical connection.
- the semiconductor element and the insert bus bar are arranged at a position facing the substrate, the substrate area can be reduced, but it is difficult to reduce the mounting area.
- a DC-DC converter device includes a metal base, a primary high voltage circuit having a plurality of switching elements mounted on the metal base, and a secondary low voltage circuit having at least a pair of rectifying elements.
- the transformer is connected between the voltage circuit and performs power conversion between the high voltage and the low voltage, and the metal base is disposed at a predetermined interval, and the high voltage circuit and the low voltage circuit are mounted.
- the drive circuit board includes at least a pair of drive signal wiring patterns for supplying a drive signal to the drive signal terminals of at least the pair of rectifying elements S, and a main current to at least the high potential side terminals of the pair of rectifying elements.
- at least the pair of rectifying elements are disposed in contact with the metal base so as to be able to conduct heat, and the pair of output terminals on the secondary side of the transformer 250 are connected to one end of at least the pair of high potential side metal conductors.
- Each other end of the high potential side metal conductor is connected to at least a pair of high potential side main current wiring patterns, and the at least one pair of high potential side main current wiring patterns has at least a pair of high potential side terminals of the rectifying elements. Is connected.
- a single drive circuit board is disposed at a predetermined interval from a metal base, and a high voltage switching circuit and a low voltage rectifier circuit are mounted on the drive board, and a high voltage switching element and a low voltage rectifier are mounted.
- the rectifying element is brought into contact with one surface of the metal base to be cooled, so that the size can be reduced.
- FIG. 2 is an external exploded perspective view of the DC-DC converter device according to the embodiment.
- (A) is a plan view of the embodiment of the DC-DC converter device of FIG. 2
- (b) is a side view seen from the direction of the arrow III. The top view which expands a part of FIG. The side view seen from the arrow V direction of FIG.
- the DC-DC converter device is used in electric vehicles, plug-in hybrid vehicles, and the like.
- a high voltage storage battery is mounted as a power source for the traveling motor, and a low voltage storage battery for operating auxiliary equipment such as a light and a radio is mounted.
- the DC-DC converter device includes a high voltage switching circuit, a low voltage rectifier circuit, and a transformer that connects both of these circuits, and converts the high voltage of the high voltage storage battery into a low voltage or the low voltage of the low voltage storage battery. The power conversion to high voltage.
- the DC-DC converter device of the present invention has a single insulating drive circuit board disposed at a predetermined interval from a metal base, and a high voltage switching circuit and a low voltage rectifier circuit are mounted on the drive board.
- the high voltage switching element and the low voltage rectifying element are brought into contact with one surface of the metal base for cooling, thereby reducing the size.
- FIG. 1 is a circuit diagram of a DC-DC converter device 100 of the present invention.
- the DC-DC converter device 100 includes a high-voltage side switching circuit (high-voltage side circuit) 210 that converts a high-voltage DC voltage into an AC voltage, a transformer 250 that converts an AC high voltage into an AC low voltage, and a low-voltage A low voltage side rectifier circuit (low voltage side circuit) 220 for converting an AC voltage into a DC voltage is provided.
- the high voltage side switching circuit 210 and the low voltage side rectifier circuit 220 are subjected to switching control by the control circuit 240.
- a resonance coil 203 (Lr) is connected between the high-voltage side switching circuit 210 and the transformer 250, and the high-voltage side switching is performed using the combined inductance of the resonance coil 203 and the leakage inductance of the transformer 250.
- the zero voltage switching of the MOSFET constituting the circuit 210 is enabled.
- a filter coil 207 (L1) and a filter capacitor 205 (C1) are provided on the output side of the low voltage side rectifier circuit 220 in order to remove noise superimposed on the output voltage.
- the resonance coil 203, the filter coil 207, and the filter capacitor 205 can be omitted.
- the high voltage side switching circuit 210 includes four MOSFETs H1 to H4 connected as an H bridge type and a smoothing input capacitor 202 (Cin). Each MOSFET H1 to H4 is provided with a snubber capacitor in parallel. By performing phase shift PWM control on the four MOSFETs H1 to H4 of the high voltage side switching circuit 210, an AC voltage is generated on the primary side of the transformer 250.
- the low-voltage side rectifier circuit 220 has two rectification phases composed of MOSFETs S1 and S2, and a smoothing circuit composed of a choke coil 206 (Lout) and a smoothing capacitor 208 (Cout).
- the high potential side wirings of the respective rectifying phases that is, the drain side wirings of the MOSFETs S1 and S2, are connected to secondary coil terminals 251 and 252 (see FIG. 4) of the transformer 250.
- a secondary side center tap terminal 253 (see FIG. 4) of the transformer 250 is connected to the choke coil 206 (Lout), and a smoothing capacitor 208 (Cout) is connected to the output side of the choke coil 206 (Lout).
- the low voltage side rectifier circuit 220 is also provided with a smoothing circuit including a filter coil 207 (L1) and a filter capacitor 205 (C1).
- the rectifying element is shown by two MOSFETs S1 and S2. 2 to 5 to be described later, the rectifying element is shown by six MOSFETs. The number of MOSFETs is appropriately determined in design.
- wirings 402A and 402B (see FIG. 4) for connecting the drain side wirings of the MOSFETs S1 and S2 and the secondary side coil force terminals 251 and 252 of the main transformer 250 are inserted bus bars as will be described later. It consists of one member 400 called. As will be described later, the insert bus bar 400 is disposed on the front surface of the drive circuit board 300, and the drains of the low-voltage rectifying elements S1 and S2 whose protrusions protruding on the back surface side are pressed and fixed to the surface of the metal base 10 are fixed. The terminal and the source terminal are electrically connected with solder.
- the DC-DC converter device 100 can also include an active clamp circuit for suppressing a surge voltage applied to the MOSFETs S1 and S2 of the low voltage side rectifier circuit 220.
- the active clamp circuit includes an active clamp MOSFET and an active clamp capacitor.
- FIG. 2 is an exploded perspective view of the DC-DC converter device 100 illustrated in FIG. 1
- FIG. 3 is a diagram illustrating an arrangement of components of the DC-DC converter device 100 illustrated in FIG.
- the DC-DC converter device 100 includes a metal base 10 made of metal having a rectangular shape, for example, aluminum die casting, and members constituting the DC-DC-converter circuit described with reference to FIG. . These members are covered with a top cover 1.
- a high voltage / low voltage circuit board assembly 300A, a transformer 250, a resonance coil 203, a choke coil 206, and a control circuit board assembly 600A are attached to the metal base 10.
- the metal base 10 is integrally formed with a GND terminal 10a for connecting a GND terminal for low voltage output.
- the metal base 10 has a high voltage connector (not shown) for inputting a high voltage voltage, a signal connector (not shown) for connecting a signal with an external electrical component, and an output terminal for outputting a low voltage output. (Not shown) is attached.
- a cooling unit is attached to the bottom surface of the metal base 10 via a seal member such as an O-ring.
- the cooling unit is provided with a cooling flow path, and the heat generating components in the DC-DC converter device 100 are cooled by the refrigerant flowing through the cooling flow path.
- the refrigerant a mixture of antifreeze and water in a ratio of 1: 1 is generally suitable, but other refrigerants can also be used.
- the cooling device for cooling the DC-DC converter device 100 is shown as an embodiment, and a cooling device using a cooling gas such as air may be used.
- the high-voltage / low-voltage circuit board assembly 300A includes a driving circuit board 300 including the components of the high-voltage side switching circuit 210 and the components of the low-voltage side rectifier circuit 220 described in FIG. It is implemented and configured. That is, MOSFETs H1 to H4 constituting the high voltage side switching circuit 210, smoothing input capacitors 202, electronic components such as a gate resistor (not shown), MOSFETs S1 and S2 constituting the low voltage side rectifier circuit 220, and the reactor 206 A smoothing capacitor 208 (Cout), a filter coil 207 and a filter capacitor 205 constituting a smoothing circuit, and electronic components such as a gate resistor (not shown) are mounted. The terminals of the MOSFETs H1 to H4 and S1 and S2 are electrically connected to the circuit pattern of the drive circuit board 300 by solder. The circuit pattern will be described later with reference to FIG.
- the MOSFETs H1 to H4 as switching elements mounted on the high voltage circuit region of the drive circuit board 300 and the MOSFETs S1 and S2 as rectifier elements mounted on the low voltage circuit region of the drive circuit board 300 are thermally conductive. It is fixed in close contact with the metal base 10 by a leaf spring 35 through a good insulating heat radiation sheet 32. The MOSFET is cooled by the refrigerant flowing through the cooling channel.
- MOSFET is pressed and fixed to the metal base 10 by a leaf spring 35, and its terminal penetrates the drive circuit board 300 and protrudes to the surface thereof.
- a wiring pattern is formed on the surface of the drive circuit board 300, and terminals penetrating the board are fixed to the circuit pattern with solder.
- the transformer 250, the choke coil 206, and the filter coil 207 are fixed on the metal base 10 by a fastening member.
- the metal base 10, the high voltage / low voltage circuit board assembly 300 ⁇ / b> A, the control circuit board assembly 600 ⁇ / b> A, the transformer 250, the choke coil 206 and the filter coil 207 are covered with a metal top cover 1.
- the control circuit board assembly 600A includes a drive signal generation circuit that generates drive signals for driving MOSFETs of the high-voltage side switching circuit 210 and the low-voltage side rectifier circuit 220 described in FIG. It is configured to be mounted on a substrate 600.
- the control circuit board assembly 600A is connected to the drive circuit of the drive circuit board assembly 300A by a direct connector. In addition to the direct connector, a flexible wiring board or a signal harness may be used for these connections.
- FIG. 3 (a) is a view of the mounting part of the metal base 10 as viewed from above
- FIG. 3 (b) is a side view as viewed from the side.
- the insert bus bar 400, the choke coil 206, and the filter capacitor 207 that constitute the low-voltage rectifier circuit 220 are referred to as mounting parts on the first surface side of the drive circuit board 300.
- the MOSFETs S ⁇ b> 1 and S ⁇ b> 2 that are the low voltage side rectifying elements are referred to as mounting components on the second surface side of the drive circuit board 300.
- the mounted components on the second surface side are arranged in close contact with the metal base 10, and all of them are arranged on the layer on the side of the main transformer 250.
- the drive circuit board 300 is disposed above the metal base 10 at a predetermined interval, and the rectifying MOSFETs S1 and S2 are closely arranged on the metal base 10 in the low voltage circuit area of the drive circuit board 300. is doing.
- FIG. 4 is an enlarged plan view showing the vicinity of the insert bus bar 400 and the main transformer 250 in FIG. 3, and FIG. 5 is a side view seen from the direction of arrow V in FIG.
- the two terminals 251 and 252 of the secondary side coil of the main transformer 250 and the high potential side drain terminals of the rectifying element MOSFETs S1 and S2 are connected by the insert bus bar 400, respectively.
- the insert bus bar 400 is manufactured by integrally molding two high potential side metal conductors 402A and 402B connected to the two terminals 251 and 252 of the main transformer 250, respectively.
- the insert bus bar 400 has a base 401 made of resin and two strip-shaped high potential side metal conductors 402A and 402B which are resin-molded on the base 401 and project from the base 401.
- the planes of the two high-potential side metal conductors 402A and 402B are opposed to each other at a predetermined distance.
- Projection terminals 402a to 402c projecting toward the drive circuit board 300 at a predetermined pitch are formed on the lower end surfaces of the high potential side metal conductors 402A and 402B.
- the insert bus bar 400 also has two low-potential side metal conductors 402C and 402D that are resin-molded on the base 401 and are disposed to face the high-potential side metal conductors 402A and 402B at a predetermined distance.
- the low potential side metal conductors 402C and 402D have a ground potential.
- the drive circuit board 300 includes drive signal wirings for transmitting drive signals for driving the MOSFETs S1 and S2, which are low voltage rectifier elements, that is, the first wiring pattern 301 and the MOSFETs S1 and S2.
- a main current wiring pattern for transmitting a main current that is, a second wiring pattern 302 and a third wiring pattern 303 are provided.
- the first wiring pattern 301 is connected to the gate terminals of the MOSFETs S1 and S2.
- the second wiring pattern 302 is connected to the drain terminals of the MOSFETs S1 and S2, and the third wiring pattern 303 is connected to the source terminals of the MOSFETs S1 and S2.
- the protrusions 402a to 402c of the insert bus bar 400 are inserted into the through holes of the drive circuit board 300, and are electrically connected to the high voltage wiring pattern 302 formed on the drive circuit board 300 by soldering.
- Terminal 251 is connected to the drain terminals of MOSFETs S1 and S2.
- the predetermined pitch between the through hole of the drive circuit board 300 and the terminals 402a to 402c of the insert bus bar 400 is the same value as the arrangement pitch of the MOSFETs that are rectifying elements.
- the insert bus bar 400 also has connection terminals 403 and 404 exposed from the mold resin of the base 401.
- Two coil terminals 251 and 252 of the main transformer 250 are fastened to the connection terminal 403 by bolts 111 and 112.
- An intermediate tap terminal 252 of the main transformer 250 and a bus bar 450 that connects the intermediate tap terminal 253 to the choke coil 206 are fastened together with bolts 113.
- Bus bar 450 extends across the surface of drive circuit board 300 at a predetermined distance and across choke coil 206. The other end of the bus bar 450 is connected to the input terminal of the choke coil 206.
- the output terminal of the choke coil 206 is connected to the filter coil 207 by a bus bar 451.
- a metal fixing plate 404 in which a spiral hole for fixing the insert bus bar 400 is formed is also exposed.
- the insert bus bar 400 is disposed on the surface of the drive circuit board 300, that is, the first surface, and is fixed to the drive circuit board 300 by passing the bolts 114 from the second surface side and screwing the bolts to the metal fixing plate 404. .
- one gate terminal for driving signal and two terminals for main current (drain terminal and source terminal) included in each of the MOSFETs S1 and S2 pass through the driving circuit board 300.
- the first wiring pattern 301 formed on the drive circuit board 300 that is, the low voltage circuit pattern is electrically connected to each terminal of the MOSFET penetrating from the terminal through hole to the upper surface by solder.
- the high potential side pattern of the main current circuit pattern formed on the drive circuit board 300 is connected to the drain terminal, and the low potential side pattern of the main current circuit pattern is connected to the source terminal by solder.
- the protruding terminals of the insert bus bar 400 are electrically connected to the high-potential side pattern and the low-potential side pattern of the main current circuit pattern formed on the drive circuit board 300 with solder.
- the two terminals 251 and 252 of the main transformer 250 and the drain terminals of the MOSFETs S1 and S2 that are rectifier elements are the high voltage of the main current on the circuit board 300.
- the side wiring pattern 302 and the insert bus bar 400 are used to connect each other.
- the source terminals of the MOSFETs S ⁇ b> 1 and S ⁇ b> 2 are connected to each other using the low potential wiring pattern 303 of the main current on the circuit board 300 and the insert bus bar 400.
- the drive circuit board 300 has a drive signal wiring pattern for transmitting a drive signal for driving the MOSFETs H1 to H4, which are high voltage switching elements, and the MOSFETs H1 to H4.
- a high-potential side wiring pattern and a low-potential side wiring pattern for main current for transmitting current are also formed.
- the three terminals of each of the MOSFETs H1 to H4 pass through the drive circuit board 300 and are electrically connected to the circuit pattern of the drive board 300 by solder as described above. Yes.
- the DC-DC converter device 100 has the following operational effects.
- the high voltage circuit 210 and the low voltage circuit 220 are mounted on the drive circuit board 300, and the drive circuit board 300 is disposed above the metal base 10.
- At least the pair of rectifying elements S1 and S2 are disposed in close contact with the metal base 10 below the drive circuit board 300.
- the installation area can be reduced, and the cost can be reduced by reducing the number of components. Further, the assembly workability can be improved by integrating the substrates.
- the transformer 250 is installed on the metal base 10, and the drive circuit board 300 is arranged at a position lower than the maximum height of the transformer 250. Therefore, the overall height of the DC-DC converter device 100 can be limited by the height of tall components such as the transformer 250, and the volume of the DC-DC converter device 100 can be reduced in combination with the effect of reducing the installation area.
- the drain terminals on the main current high potential side of at least the pair of rectifying elements S1 and S2 are connected to at least a pair of high potential side metal conductors 402A from at least a pair of second wiring patterns 302 for the high potential side main current. , 402B to two coil terminals 251 and 252 on the secondary side of the transformer. Therefore, the number of bus bars can be reduced.
- the low potential side terminals of at least the pair of rectifying elements S1 and S2 are fixed to the metal base 10 having the ground potential by the low potential side metal conductors 402C and 402D from the third wiring pattern 303 for the low potential side main current.
- the bus bar is unnecessary, which contributes to a reduction in the number of parts and cost.
- At least one end of the pair of low potential side metal conductors 402C and 402D is resin-molded on the base 401. Therefore, inadvertent discharge is prevented between the components and members mounted on the drive circuit board 300, the degree of freedom of arrangement of the components mounted on the drive circuit board 300 is increased, and the design is easy and contributes to downsizing. To do.
- the assembly workability is improved.
- the bases of the low potential side metal conductors 402C and 402D are integrated by a resin mold.
- the metal conductors 402A, 402B and 402C, 402D are separate parts, it is necessary to mount each metal conductor on the substrate.
- the metal conductors 402A to 402D integrated with the resin at the base 401 are fixed to the drive circuit board 300 with screws and fixed only with solder, so that a sub-assembly part is obtained.
- the substrate manufacturing process can be simplified.
- the bus bar wiring can be soldered at the time of sub-assembly of the board, the production efficiency in the final assembly process can be improved.
- the main current high potential side terminals of the rectifying elements S1 and S2 are connected to the secondary coil terminals 251 and 252 of the transformer by the high potential side metal conductors 402A and 402B from the second wiring pattern 302 for the high potential side main current.
- the main current low potential side terminal of the rectifying element is fixed to the metal base 10 having the ground potential by the low potential side metal conductors 402C and 402D from the third wiring pattern 303 for the low potential side main current. Therefore, the number of bus bars can be reduced, which contributes to cost reduction.
- the pitch of the protrusions 402a to 402c of the high potential side metal conductors 402A and 402B is made to coincide with the arrangement pitch of the rectifying elements.
- the low potential side metal conductors 402C and 402D are provided with the same protrusions at the same pitch, and the same effect can be obtained.
- (10) A configuration in which the metal conductors 402A to 402D are arranged on the first surface, that is, the front surface of the drive circuit board, and the rectifying element is arranged on the second surface side opposite to the first surface, that is, the back surface side.
- the components are arranged in a hierarchical structure, so that it is possible to fit within the position height of the transformer with a large mounting height in the electronic component, and the overall height of the device is suppressed, and a compact DC-DC converter device is provided. Can be provided.
- the drive signal transmitted on the metal substrate transmits the main current to the first wiring pattern 301 for transmitting the drive signal using the pattern on the wiring board and the rectifying element.
- the bus bar on the metal substrate can be eliminated, and the low-voltage rectifier circuit 220 can be integrated with the drive circuit substrate 300 together with the high-voltage switching circuit 210, so that the manufacturing cost can be reduced.
- the rectifying elements S1 and S2 are arranged in close contact with the metal base 10 on the side of the region where the transformer 250 of the metal base 10 is installed, and the wiring pattern of the drive circuit board 300 above the rectifying elements S1 and S2. Are connected to the metal conductors 402A and 402B.
- the bus bar 400 connected to the transformer 250 is connected to the drive circuit board 300 by soldering similarly to the rectifying element, and is connected to the transformer 250 across the side portion of the drive circuit board 300.
- the driving circuit board 300 is connected to the second wiring pattern 302 to which the high potential side terminal of the rectifying element is connected. Therefore, since the wiring pattern and the bus bar on the substrate can be made the shortest length, the volume of the apparatus can be effectively utilized.
- the DC-DC converter device of the embodiment can be modified and implemented as follows.
- the fixing method is arbitrary as long as mechanical fixing is possible.
- a protrusion shape may be provided on the resin portion of the insert bus bar 400 and the substrate may be fixed to the substrate by heat welding.
- a form of connection by welding or soldering may be employed.
- the soldering of the insert bus bar 400 is not limited, but may be reflow soldering on the second surface together with other mounted electrical components mounted on the first surface, which is the surface of the drive circuit board 300. From the viewpoint of simplifying the process, it is desirable.
- the resin used for the insert bus bar of this embodiment is a resin with high heat resistance (for example, PPS), but if the bus bar temperature does not become high, use an inexpensive resin with low heat resistance. May be.
- the insert bus bar 400 in which the high potential side metal conductor connecting the pair of output terminals 251 and 252 of the transformer 250 and the high potential side terminal for main current of the rectifying element is molded with resin has been described.
- the metal conductors 402A and 402B of the present invention may each be a single body without being resin-molded. The same applies to the low potential side metal conductors 402C and 402D.
- the insert bus bar 400 is described in which the high potential side metal conductor and the low potential side metal conductor are integrated by resin molding.
- the high-potential side metal conductor integrated by resin molding and the low-potential side metal conductor integrated by resin molding may be separately mounted on the drive circuit board 300.
- the low voltage rectifier circuit 220 is described as having a pair of rectifying elements S1 and S2, and a pair of high potential side metal conductors 402A and 402B and a pair of low potential side metal are correspondingly provided. Conductors 402C and 402D were used.
- the number of rectifying elements is not limited to a pair, and the number of corresponding metal conductors is not limited to a pair.
- a high-voltage switching circuit and a low-voltage rectifier circuit are mounted on a single drive circuit board, and the drive circuit board is disposed at a predetermined interval above a metal base on which a transformer is installed.
- the mounted rectifying element can be applied to various types of DC-DC converter devices which are reduced in size by being disposed in close contact with a metal base.
- Top cover 10 Metal base 10a GND terminals S1, S2, H1 to H4 MOS-FET 32 Insulating heat radiating sheet 35
- Leaf spring 100 DC-DC converter device 203
- Resonant coil 206 Choke coil 210 High voltage circuit 220
- Control circuit 250 Main transformer 251 High potential side terminal 252 Low potential side terminal 253
- Intermediate tap terminal 300 Drive circuit Substrate 300A Drive circuit board assembly 301
- Drive signal wiring pattern 302, 303 Main current wiring pattern 400 Insert bus bar 401
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Abstract
Description
そして、駆動回路基板には、少なくとも一対の整流素子Sの駆動信号用端子に駆動信号を供給するための少なくとも一対の駆動信号用配線パターンと、少なくとも一対の整流素子の高電位側端子に主電流を供給するための少なくとも一対の高電位側主電流用配線パターンと、前記少なくとも一対の整流素子の低電位側端子に主電流を供給するための少なくとも一対の低電位主電流用配線パターンとが形成されている。
さらに、少なくとも一対の整流素子は金属ベースに熱伝導可能に接して配設され、トランス250の二次側の一対の出力端子は少なくとも一対の高電位側金属導体の各一端に接続され、少なくとも一対の高電位側金属導体の各他端は少なくとも一対の高電位側主電流用配線パターンに接続され、前記少なくとも一対の高電位側主電流用配線パターンには少なくとも一対の整流素子の高電位側端子が接続されている。
本発明のDC-DCコンバータ装置は、とくに、金属ベースと所定間隔をあけて1枚の絶縁性駆動回路基板を配設し、この駆動基板上に高電圧スイッチング回路と低電圧整流回路を実装し、高電圧スイッチング素子と低電圧整流素子を金属ベースの一面に接触させて冷却するようにし、これにより、小型化を図るものである。
以下、図面を参照して、本発明のDC-DCコンバータ装置の一実施の形態について説明する。
図1は本発明のDC-DCコンバータ装置100の回路図である。このDC-DCコンバータ装置100は、高電圧の直流電圧を交流電圧に変換する高電圧側スイッチング回路(高電圧側回路)210、交流高電圧を交流低電圧に変換するトランス250、および低電圧の交流電圧を直流電圧に変換する低電圧側整流回路(低電圧側回路)220を備えている。高電圧側スイッチング回路210および低電圧側整流回路220は、制御回路240によりスイッチング制御が行われる。
なお、共振コイル203、フィルタコイル207およびフィルタコンデンサ205は省略することができる。
高電圧側スイッチング回路210は、Hブリッジ型として接続された4つのMOSFET H1~H4と平滑用入力コンデンサ202(Cin)とから構成されている。各MOSFET H1~H4には、スナバコンデンサが並列に設けられている。高電圧側スイッチング回路210の4つのMOSFET H1~H4を位相シフトPWM制御することで、トランス250の一次側には交流電圧が発生する。
低電圧側整流回路220は、MOSFET S1,S2で構成される二つの整流相と、チョークコイル206(Lout)および平滑用コンデンサ208(Cout)から構成される平滑回路とを有している。それぞれの整流相の高電位側配線、すなわちMOSFET S1,S2のドレイン側配線はトランス250の二次側のコイル端子251,252(図4参照)へ接続されている。トランス250の二次側センタタップ端子253(図4参照)は、チョークコイル206(Lout)に接続され、チョークコイル206(Lout)の出力側に平滑用コンデンサ208(Cout)が接続されている。また、低電圧側整流回路220には、フィルタコイル207(L1)とフィルタコンデンサ205(C1)から成る平滑回路も設けられている。
図2と図3を参照してDC-DCコンバータ装置100の全体構造を説明する。図2は、図1に図示されたDC-DCコンバータ装置100の分解斜視図、図3は、図2に図示されたDC-DCコンバータ装置100の構成部品の配置を示す図である。
上記DC-DCコンバータ装置100を冷却する冷却装置は、一実施の形態として示したものであり、他に、空気等の冷却気体を用いた冷却装置等を用いても差し支えはない。
駆動回路基板300の貫通孔とインサートバスバー400の端子402a~402cの所定ピッチは、整流素子であるMOSFETの配設ピッチと同じ値である。
(1)DC-DCコンバータ装置100は、駆動回路基板300に高電圧回路210と低電圧回路220を実装し、駆動回路基板300を金属ベース10の上方に配設した。そして、少なくとも一対の整流素子S1,S2は駆動回路基板300の下方において金属ベース10に密着して配置される。
このような実施形態のDC-DCコンバータ装置100によれば、設置面積を小さくすることができ、部品点数低減によるコストダウンを図ることができる。また、基板一体化による組立作業性の改善を図ることできる。
複数の金属導体402A,402Bや402C,402Dが別部品の場合、それぞれの金属導体を基板に搭載する必要がある。しかし、実施形態のように、基部401で樹脂にて一体化された金属導体402A~402Dを駆動回路基板300にねじで固着し、半田のみでの固定とすることにより、サブアセンブリ部品とすることができ、基板製造工程を簡略化することができる。更に基板のサブアセンブリ時にバスバー配線まで半田付けすることができるため、最終組立て工程での生産効率を向上させることができる。
(11)さらに駆動回路基板300を用いることで、金属基板上を伝達させていた駆動信号は配線基板上パターンを用いて駆動信号を伝達する第1配線パターン301、整流素子に主電流を伝達する第2配線パターン302および第3配線パターン303に接続される。これにより金属基板上のバスバーを廃止することが可能になり、さらに低電圧整流回路220を高電圧スイッチング回路210とともに駆動回路基板300に一体化させることができ、製造原価の低減が可能となる。
(1)インサートバスバー400を駆動回路基板300にねじ114で固定しているが、機械的固定が可能であれば、固定方法は任意である。例えば、インサートバスバー400の樹脂部に突起形状を設け、熱溶着による基板との固着としてもよい。あるいは、インサートバスバー400とトランス250を電気的に接続可能であれば、例えば溶接、半田にて接続する形態を取っても構わない。
(4)トランス250の一対の出力端子251,252と整流素子の主電流用高電位側端子を接続する高電位側金属導体を樹脂モールドしたインサートバスバー400で説明した。しかし、本発明の金属導体402A、402Bは樹脂モールドせず、それぞれ単体であってもよい。低電位側金属導体402C、402Dも同様である。
(5)以上では、高電位側金属導体と低電位側金属導体を樹脂モールドして一体化したインサートバスバー400として説明した。しかし、樹脂モールドして一体化した高電位側金属導体と、樹脂モールドして一体化した低電位側金属導体をそれぞれ別体として駆動回路基板300に実装してもよい。
10 金属ベース
10a GND端子
S1,S2、H1~H4 MOS-FET
32 絶縁放熱シート
35 板ばね
100 DC-DCコンバータ装置
203 共振コイル
206 チョークコイル
210 高電圧回路
220 低電圧回路
240 制御回路
250 主トランス
251 高電位側端子
252 低電位側端子
253 中間タップ端子
300 駆動回路基板
300A 駆動回路基板アセンブリ
301 駆動信号用配線パターン
302,303 主電流用配線パターン
400 インサートバスバー
401 基部
402 金属導体
402a~402c 突起
402A,402B 高電位側金属導体
402C,402D 低電位側金属導体
600 制御回路基板
600A 制御回路基板アセンブリ
Claims (8)
- 金属製のベースと、
前記金属製のベースに装着され、複数のスイッチング素子を有する一次側の高電圧回路と、
少なくとも一対の整流素子を有する二次側の低電圧回路との間に接続され、高電圧と低電圧との間で電力変換を行うトランスと、
前記金属製のベースと所定の間隔をあけて配設され、前記高電圧回路と前記低電圧回路が実装された駆動回路基板と、
前記トランスの二次側の一対の出力端子と前記低電圧回路の少なくとも一対の整流素子の高電位側端子とを接続する少なくとも一対の高電位側金属導体とを備え、
前記駆動回路基板には、前記少なくとも一対の整流素子の駆動信号端子に駆動信号を供給するための少なくとも一対の駆動信号用配線パターンと、前記少なくとも一対の整流素子の高電位側端子に主電流を供給するための少なくとも一対の高電位側主電流用配線パターンと、前記少なくとも一対の整流素子の低電位側端子に主電流を供給するための少なくとも一対の低電位主電流用配線パターンとが形成され、
前記少なくとも一対の整流素子は前記金属ベースに熱伝導可能に接して配設され、
前記トランスの二次側の一対の出力端子は前記少なくとも一対の高電位側金属導体の各一端に接続され、前記少なくとも一対の高電位側金属導体の各他端は少なくとも一対の前記高電位側主電流用配線パターンに接続され、前記少なくとも一対の高電位側主電流用配線パターンには前記少なくとも一対の整流素子の高電位側端子が接続されているDC-DCコンバータ装置。 - 請求項1に記載のDC-DCコンバータ装置であって、
前記駆動回路基板はトランスの最大高さより低い位置に配置されているDC-DCコンバータ装置。 - 請求項1または2に記載のDC-DCコンバータ装置であって、
前記少なくとも一対の高電位側金属導体は前記駆動回路基板に実装され、
前記少なくとも一対の高電位側金属導体の一端は、前記トランスの二次側の一対の出力端子に接続され、前記少なくとも一対の高電位側金属導体の他端は、前記駆動回路基板に形成された前記少なくとも一対の高電位側主電流用配線パターンに接続されるDC-DCコンバータ装置。 - 請求項3に記載のDC-DCコンバータ装置であって、
前記少なくとも一対の高電位側金属導体の一端は基部に樹脂モールドされて一体化されているDC-DCコンバータ装置。 - 請求項3または4に記載のDC-DCコンバータ装置であって、
前記少なくとも一対の整流素子の低電位側端子の各々は、前記駆動回路基板に形成された前記少なくとも一対の低電位主電流用配線パターンに接続され、
これらの配線パターンには、少なくとも一対の低電位側金属導体の他端が接続され、少なくとも一対の低電位側金属導体の一端はグランド電位を有する金属ベースに固定されているDC-DCコンバータ装置。 - 請求項5に記載のDC-DCコンバータ装置であって、
前記少なくとも一対の低電位側金属導体の一端は基部に樹脂モールドされて一体化されているDC-DCコンバータ装置。 - 請求項1または2に記載のDC-DCコンバータ装置であって、
前記少なくとも一対の高電位側金属導体は前記駆動回路基板に実装され、
前記少なくとも一対の高電位側金属導体の一端は、前記トランスの前記二次側の一対のコイル端子に接続され、
前記少なくとも一対の高電位側金属導体の他端は、前記駆動回路基板に形成された少なくとも一対の高電位側主電流用配線パターンに接続されるとともに、
前記少なくとも一対の低電位側金属導体は前記駆動回路基板に実装され、
前記少なくとも一対の低電位側金属導体の一端は前記駆動回路基板に形成された前記少なくとも一対の低電位主電流用配線パターンに接続され、
前記少なくとも一対の整流素子の低電位側端子は、前記駆動回路基板に形成された前記少なくとも一対の低電位主電流用配線パターンに接続され、
前記少なくとも一対の低電位側金属導体がグランド電位を有する金属ベースに固定されるDC-DCコンバータ装置。 - 請求項7に記載のDC-DCコンバータ装置であって、
前記少なくとも二対の金属導体の一端は樹脂モールドされて一体化されているDC-DCコンバータ装置。
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JP2016143818A (ja) * | 2015-02-04 | 2016-08-08 | ダイキン工業株式会社 | リアクトルを有する装置、及びリアクトル |
US10249428B2 (en) | 2015-02-04 | 2019-04-02 | Daikin Industries, Ltd. | Reactor |
JPWO2017115431A1 (ja) * | 2015-12-28 | 2018-03-15 | 三菱電機株式会社 | 回路基板、アクティブフィルタ装置、及び空気調和機 |
US10594204B2 (en) | 2015-12-28 | 2020-03-17 | Mitsubishi Electric Corporation | Circuit board, active filter device, and air conditioner |
CN114123810A (zh) * | 2020-08-27 | 2022-03-01 | 三菱电机株式会社 | 电力转换装置 |
US11695347B2 (en) | 2020-08-27 | 2023-07-04 | Mitsubishi Electric Corporation | Electric power converter |
CN114123810B (zh) * | 2020-08-27 | 2024-07-02 | 三菱电机株式会社 | 电力转换装置 |
Also Published As
Publication number | Publication date |
---|---|
EP3057216A4 (en) | 2017-06-28 |
US20160248333A1 (en) | 2016-08-25 |
JP6169181B2 (ja) | 2017-07-26 |
EP3057216B1 (en) | 2019-05-08 |
US9935558B2 (en) | 2018-04-03 |
JPWO2015053141A1 (ja) | 2017-03-09 |
EP3057216A1 (en) | 2016-08-17 |
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