WO2015037374A1 - Bobine d'induction et filtre à élimination de bande - Google Patents

Bobine d'induction et filtre à élimination de bande Download PDF

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Publication number
WO2015037374A1
WO2015037374A1 PCT/JP2014/071145 JP2014071145W WO2015037374A1 WO 2015037374 A1 WO2015037374 A1 WO 2015037374A1 JP 2014071145 W JP2014071145 W JP 2014071145W WO 2015037374 A1 WO2015037374 A1 WO 2015037374A1
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WIPO (PCT)
Prior art keywords
terminal electrode
coil conductor
conductor
lead pattern
coil
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PCT/JP2014/071145
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English (en)
Japanese (ja)
Inventor
用水邦明
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株式会社村田製作所
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Priority to CN201490000926.4U priority Critical patent/CN205680518U/zh
Publication of WO2015037374A1 publication Critical patent/WO2015037374A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/0026—Multilayer LC-filter
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H2007/013—Notch or bandstop filters

Definitions

  • the present invention relates to a multilayer chip type inductor and a band elimination filter used in various electronic circuits.
  • a laminated chip type inductor has a structure in which an insulating base material on which a coil conductor pattern is formed is laminated, and both ends of the coil conductor pattern are connected to terminal electrodes.
  • Patent Document 1 discloses a multilayer chip inductor in which a coil conductor pattern is disposed closer to the center of a chip than two terminal electrode formation positions, and the coil conductor pattern and the terminal electrode do not overlap in plan view. It is shown.
  • the stray capacitance generated between the coil conductor pattern and the terminal electrode is small, and the self-resonant frequency of the inductor can be increased.
  • Patent Document 1 there is a problem that an inductance obtained per element size is reduced because a region where a coil conductor pattern is formed is limited. There is a similar problem with a filter including an inductor.
  • An object of the present invention is to provide an inductor and a band elimination filter that can suppress a decrease in inductance while suppressing stray capacitance.
  • the inductor of the present invention is Coil conductors, terminal electrodes, and connection conductors connecting the coil conductors and the terminal electrodes are formed in a laminate of a plurality of base material layers,
  • the terminal electrode includes a first terminal electrode and a second terminal electrode formed on a common mounting surface,
  • the coil conductor is formed across a plurality of the base material layers,
  • the formation region of the coil conductor has a portion that overlaps the first terminal electrode in a plan view, and does not overlap the second terminal electrode.
  • the path length from the first terminal electrode to the coil conductor is shorter than the path length from the second terminal electrode to the coil conductor.
  • the coil conductor is formed across the plurality of base material layers so as to extend in a direction away from the mounting surface on which the terminal electrodes are formed in the stacking direction of the plurality of base material layers. And A portion of the connection conductor that connects the second terminal electrode and the coil conductor connects a portion of the coil conductor that is farthest from the mounting surface in the stacking direction to the second terminal electrode.
  • a configuration is preferred. With the above configuration, the number of turns of the coil conductor can be easily increased.
  • an auxiliary conductor conducting to the first terminal electrode is provided between the coil conductor and the first terminal electrode.
  • a part of the coil conductor is formed on the same plane as the terminal electrode and between the first terminal electrode and the second terminal electrode.
  • the coil conductors formed on the plurality of base material layers have a pattern that goes around substantially the same path in a plan view.
  • the coil conductor formed on the base material layer away from the first terminal electrode among the coil conductors is blocked by the coil conductor formed on the base material layer close to the first terminal electrode. The stray capacitance generated between the electrode and the coil conductor pattern is suppressed.
  • the formation area of the coil conductor is substantially rectangular in plan view,
  • the first terminal electrode and the second terminal electrode are substantially rectangular;
  • the first side of the coil conductor formation region overlaps in the longitudinal direction of the first terminal electrode in plan view, It is preferable that the second side facing the first side of the coil conductor forming region is parallel to the longitudinal direction of the second terminal electrode.
  • the band elimination filter of the present invention includes the inductor and a capacitor connected in parallel to the inductor,
  • the capacitor is A first lead pattern drawn from the middle of the coil conductor of the inductor;
  • a second lead pattern that is drawn from a position closer to the second terminal electrode on the circuit than the first lead pattern, and is formed to overlap the first lead pattern in plan view;
  • a third lead pattern that is drawn from a position closer to the first terminal electrode on the circuit than the first lead pattern and is formed so as to overlap the first lead pattern in plan view;
  • the first lead pattern, the second lead pattern, and the third lead pattern are formed outside the formation region of the coil conductor in a plan view.
  • the capacitor can be formed in an empty space other than the formation region of the coil conductor, and the band elimination characteristic can be obtained without increasing the size.
  • the second lead pattern is preferably a connection conductor that connects the second terminal electrode and the coil conductor.
  • the third lead pattern does not overlap the second terminal electrode in plan view. With this configuration, unnecessary stray capacitance generated between the second terminal electrode and the third lead pattern is suppressed, and a capacitance component that is equivalently connected between the first terminal electrode and the second terminal electrode is small. It is easy to obtain good band elimination characteristics.
  • the present invention there is almost no stray capacitance between the first terminal electrode and the coil conductor, and the stray capacitance generated between the second terminal electrode and the coil conductor is reduced.
  • a small inductor is constructed. Since the formation area of the coil conductor is relatively large, a desired inductance can be obtained without increasing the overall size. In addition, a small band elimination filter can be obtained.
  • FIG. 1 is an exploded perspective view of an inductor 101 according to the first embodiment.
  • FIG. 2 is an exploded plan view of each base material layer of the inductor 101.
  • FIG. 3 is a cross-sectional view of inductor 101 at the position indicated by the alternate long and short dash line in FIG.
  • FIG. 4 is an exploded plan view of the inductor 102 according to the second embodiment.
  • FIG. 5 is an exploded plan view of the inductor 103 according to the third embodiment.
  • FIG. 6 is an exploded plan view of the band elimination filter 104 according to the fourth embodiment.
  • FIG. 7 is a circuit diagram of the band elimination filter 104 shown in FIG. 8A and 8B are diagrams showing the results of simulating the frequency characteristics of the insertion loss of the band elimination filter 104.
  • FIG. FIG. 9 is an exploded plan view of the band elimination filter 105 according to the fifth embodiment.
  • FIG. 10 is a circuit diagram of the band elimination filter 105.
  • FIG. 1 is an exploded perspective view of the inductor 101 according to the first embodiment
  • FIG. 2 is an exploded plan view of each base material layer of the inductor 101
  • 3 is a cross-sectional view of the inductor 101 at the position indicated by the alternate long and short dash line in FIG.
  • the inductor 101 includes a laminated body 10 in which insulating base material layers 11 to 15 are laminated and integrated.
  • the laminated body 10 is formed with a coil conductor, a terminal electrode, and a connection conductor that connects the coil conductor and the terminal electrode.
  • the insulating base layers 11 to 15 are, for example, LCP resin (liquid crystal polymer), and in-plane coil conductors 21, 22, 23, and 24 are formed on the lower surfaces of the base layers 11, 12, 13, and 14, respectively.
  • Interlayer coil conductors 62, 63, and 64 are formed on the base material layers 12, 13, and 14, respectively.
  • the interlayer coil conductor 62 connects one ends of the in-plane coil conductors 21 and 22,
  • the interlayer coil conductor 63 connects one ends of the in-plane coil conductors 22 and 23,
  • the interlayer coil conductor 64 connects the in-plane coil conductors 23 and 24. Connect one end of each other.
  • a broken-line circle represents a connection position with a lower interlayer coil conductor.
  • the coil conductor is constituted by the in-plane coil conductors 21, 22, 23, 24 and the interlayer coil conductors 62, 63, 64.
  • the first terminal electrode 31 and the second terminal electrode 32 are formed on the lower surface of the base material layer 15, respectively.
  • an interlayer connection conductor 41 is formed on the base material layer 15 to connect the end portion of the in-plane coil conductor 24 formed on the base material layer 14 and the first terminal electrode 31. That is, the portion of the connection conductor that connects the in-plane coil conductor and the first terminal electrode 31 is configured by the interlayer connection conductor 41.
  • An in-plane connection conductor 51 continuous from the in-plane coil conductor 21 is formed on the lower surface of the base material layer 11.
  • Interlayer connection conductors 45, 46, 47 and 48 are formed on the base material layers 12, 13, 14 and 15. These interlayer connection conductors 45 to 48 connect the end portion of the in-plane connection conductor 51 and the second terminal electrode 32. That is, of the connection conductors, the portions connecting the coil conductors (in-plane coil conductors 21, 22, 23, 24 and interlayer coil conductors 62, 63, 64) and the second terminal electrode 32 are the in-plane connection conductor 51 and It is composed of interlayer connection conductors 45-48.
  • the coil conductor extends in the stacking direction of the plurality of base material layers 11 to 15 while rotating around the direction away from the mounting surface on which the terminal electrodes are formed. 11 is formed. A portion of the connecting conductor that connects the second terminal electrode 32 and the coil conductor connects the portion of the coil conductor that is farthest from the mounting surface in the stacking direction to the second terminal electrode 32.
  • the formation regions of the coil conductors 21 to 24 and 62 to 64 in a plan view are rectangular.
  • the in-plane coil conductors 21 to 24 formed on the plurality of base material layers 11 to 14 circulate on the same rectangular path in plan view.
  • the first side of the coil conductor formation region overlaps the first terminal electrode 31.
  • the coil conductor formation region does not overlap the second terminal electrode 32, and the second side opposite to the first side of the coil conductor formation region is parallel to the longitudinal direction of the second terminal electrode 32. That is, in FIG. 2, the coil conductor formation region indicated by a two-dot chain line is closer to the first terminal electrode 31 than the second terminal electrode 32.
  • the path length from the first terminal electrode 31 to the in-plane coil conductor 24 (the length in the layer direction of the interlayer connection conductor 41) is the path length from the second terminal electrode 32 to the in-plane coil conductor 21 (interlayer connection conductor 45). (The length in the layer direction of .about.48 and the length of the in-plane connecting conductor 51).
  • the above configuration can be rephrased as follows.
  • the in-plane coil conductor 24 adjacent (immediately above) in the layer direction to the first terminal electrode 31 in which the formation regions of the coil conductors 21 to 24 and 62 to 64 overlap in plan view is interposed via the interlayer connection conductor 41. Connected in the shortest distance.
  • the uppermost in-plane coil conductor 21 among the in-plane coil conductors 21 to 24 formed on the plurality of base material layers is connected to the interlayer connection conductors 45 to 48 and the in-plane connection. It is connected via the conductor 51.
  • the interlayer connection conductors 45 to 48 are arranged on a straight line extending in the stacking direction. Therefore, the area where the “connecting portion” (the in-plane connection conductor 51 and the interlayer connection conductors 45 to 48) and the second terminal electrode 32 overlap in a plan view is small.
  • the second terminal electrode 32 and the formation region of the coil conductors 21 to 24 having a large potential difference are separated from each other. Therefore, the second terminal electrode 32 and the coil conductors (21 to 21) represented by the circuit symbol of the capacitor in FIG. 24, 62 to 64) are small in stray capacitance. Further, since the potential difference between the first terminal electrode 31 and the in-plane coil conductor 24 is small, the stray capacitance generated between them is also small. Although stray capacitance tends to occur between the first terminal electrode 31 and the in-plane coil conductors 23 to 21, the in-plane coil conductors 23 to 21 are stacked on the first terminal electrode 31.
  • the stray capacitance generated between the coil conductors 23 to 21 and the first terminal electrode 31 is also small.
  • the in-plane coil conductor 24 is interposed between the in-plane coil conductor 23 and the first terminal electrode 31, the stray capacitance generated between the in-plane coil conductor 23 and the first terminal electrode 31 is reduced. The same applies to the in-plane coil conductors 22 and 21.
  • the manufacturing method of the inductance 101 is as follows. (1) The LCP film laminated with Cu foil is patterned by photolithography. (2) A hole formed by laser processing is formed at the position where the interlayer connection conductors 41, 45 to 48, 62 to 64 are formed, and the hole is filled with a conductive paste containing Su, Cu, Ni, Ag soot and the like. (3) The base material layers are laminated and integrated by heating and pressing, and the interlayer connection conductor is solidified and electrically connected to the Cu foil. (4) Dividing into individual pieces to obtain individual chip type inductors.
  • FIG. 4 is an exploded plan view of the inductor 102 according to the second embodiment.
  • the formation position of the interlayer connection conductor 41 is different from that of the first embodiment.
  • An in-plane coil conductor 24 and an auxiliary conductor 71 are formed on the base material layer 14.
  • the interlayer connection conductor 41 is electrically connected to the connection portion between the in-plane coil conductor 24 and the auxiliary conductor 71. That is, the auxiliary conductor 71 is electrically connected to both the coil conductors (21 to 24, 62 to 64) and the first terminal electrode 31.
  • the auxiliary conductor 71 is disposed so as to overlap the first terminal electrode 31 in plan view.
  • the auxiliary conductor 71 is formed to extend in the longitudinal direction of the first terminal electrode 31.
  • the auxiliary conductor 71 is electrically connected to the in-plane coil conductor 24 at one end, but the other end is opened (having an open end) and thus does not act as a part of the coil conductor.
  • the configuration of the other parts is the same as that of the inductor 101 shown in the first embodiment.
  • the auxiliary conductor 71 since the auxiliary conductor 71 has the same potential as the first terminal electrode 31, the stray capacitance that is to be generated between the first terminal electrode 31 and a part of the in-plane coil conductor 23 is the auxiliary conductor. It is shielded by 71 and its stray capacitance is suppressed. Although stray capacitance is also generated between the auxiliary conductor 71 and the in-plane coil conductor 23, the auxiliary conductor 71 is entirely at the same potential as the first terminal electrode 31. Is smaller than the capacitance generated between the in-plane coil conductors 24 to 23 shown in FIG. 2 in the first embodiment.
  • the number of turns of the coil conductor is somewhat reduced, but the stray capacitance can be further suppressed.
  • FIG. 5 is an exploded plan view of the inductor 103 according to the third embodiment. Similar to the inductors shown in the first and second embodiments, the inductor 103 includes a laminated body in which insulating base layers 11 to 15 are laminated and integrated. A coil conductor, a terminal electrode, and a connection conductor that connects the coil conductor and the terminal electrode are formed on the laminate.
  • the in-plane coil conductors 21, 22, 23, 24, and 25 are formed on the lower surfaces of the base material layers 11, 12, 13, 14, and 15, respectively.
  • Interlayer coil conductors 62, 63, 64, and 65 are formed on the base material layers 12, 13, 14, and 15, respectively.
  • the interlayer coil conductor 62 connects one ends of the in-plane coil conductors 21 and 22,
  • the interlayer coil conductor 63 connects one ends of the in-plane coil conductors 22 and 23
  • the interlayer coil conductor 64 connects the in-plane coil conductors 23 and 24.
  • the inter-layer coil conductor 65 connects one ends of the in-plane coil conductors 24 and 25 to each other.
  • the coil conductor is constituted by the in-plane coil conductors 21, 22, 23, 24, 25 and the interlayer coil conductors 62, 63, 64, 65.
  • the first terminal electrode 31 and the second terminal electrode 32 are formed on the lower surface of the base material layer 15, respectively.
  • an in-plane connection conductor 55 that connects the first terminal electrode 31 and the end of the in-plane coil conductor 25 in the plane is formed on the base material layer 15. That is, a portion of the connection conductor that connects the coil conductor and the first terminal electrode 31 is configured by the in-plane connection conductor 55.
  • An in-plane connection conductor 51 continuous from the in-plane coil conductor 21 is formed on the lower surface of the base material layer 11.
  • Interlayer connection conductors 45, 46, 47 and 48 are formed on the base material layers 12, 13, 14 and 15. These interlayer connection conductors 45 to 48 connect the end portion of the in-plane connection conductor 51 and the second terminal electrode 32.
  • the portion of the connection conductor that connects the coil conductor and the second terminal electrode 32 is constituted by the in-plane connection conductor 51 and the interlayer connection conductors 45 to 48.
  • the path length from the first terminal electrode 31 to the in-plane coil conductor 25 (the length of the in-plane connection conductor 55) is the path length from the second terminal electrode 32 to the in-plane coil conductor 21 (interlayer connection conductors 45 to 45). 48 in the layer direction and the length of the in-plane connection conductor 51).
  • a small inductor having a predetermined inductance can be configured.
  • FIG. 6 is an exploded plan view of the band elimination filter 104 according to the fourth embodiment.
  • the band elimination filter 104 includes a laminated body in which insulating base material layers 11 to 15 are laminated and integrated. In this example, it is used in a high frequency region such as 700 MHz to 5 GHz. Since it is necessary to increase the self-resonance frequency of the coil in the high frequency region, a low dielectric constant material such as LCP is used for the base material layer.
  • LCP low dielectric constant material
  • the band elimination filter 104 of this embodiment includes the configuration of the inductor 101 shown in FIG. 2 in the first embodiment, and is formed by additionally forming an electrode and the like for forming a capacitor on the multilayer body.
  • the inductors are constituted by the coil conductors 21, 22, 23, 24 and the interlayer coil conductors 62, 63, 64, and the portions connecting the coil conductor and the second terminal electrode 32 are the in-plane connection conductor 51 and the interlayer connection conductor 45.
  • the configuration including ⁇ 48 is the same as the inductor 101 shown in FIG.
  • first lead patterns 28a and 28b drawn from the middle of the coil conductor 22 are formed.
  • An in-plane connection conductor 51 that is a second lead pattern is formed on the base material layer 11.
  • the in-plane connection conductor 51 overlaps the first lead pattern 28a in plan view. Therefore, the capacitor C2 is formed in the facing portion between the in-plane connection conductor 51 that is the second lead pattern and the first lead pattern 28a.
  • the second lead pattern 51 is drawn from a position closer to the second terminal electrode 32 on the circuit than the first lead patterns 28a and 28b.
  • the base layer 14 is formed with a third lead pattern 26 drawn from the middle of the coil conductor 24.
  • a third lead pattern 27 that is electrically connected to the third lead pattern 26 is formed on the base material layer 13.
  • the third lead patterns 26 and 27 overlap the first lead pattern 28a in plan view. Therefore, the capacitor C1 is formed in the portion where the third lead pattern 27 and the first lead pattern 28a face each other.
  • the third lead patterns 26 and 27 are drawn from a position closer to the first terminal electrode 31 on the circuit than the first lead pattern.
  • the base layer 13 is provided with a second lead pattern 29 that is connected (conducted) to the in-plane connection conductor 51 that is the second lead pattern. Further, the base layer 12 is formed with a first lead pattern 28b extending from the first lead pattern 28a. The first lead pattern 28b overlaps the second lead pattern 29 in plan view. Therefore, the capacitor C3 is formed in the portion where the first lead pattern 28b and the second lead pattern 29 are opposed to each other.
  • the coil conductor is formed in the coil conductor formation region Zt.
  • the first lead patterns 28a and 28b, the second lead patterns 51 and 29, and the third lead patterns 26 and 27 are formed outside the coil conductor formation region Zs in plan view.
  • FIG. 7 is a circuit diagram of the band elimination filter 104 shown in FIG.
  • the symbols [B1] [B2] [A1] [A2] [A3] [A4] [A5] [A6] indicate the correspondence between each part of the circuit and each part of the conductor pattern. Further, reference numerals of circuit elements are shown in FIG. 6 with parentheses. In this way, the inductors L1a, L1b, and L2 are formed by a continuous coil, and the first, second, and third lead patterns are drawn from the middle of the coil conductor, and the capacitors C1, C2, and C3 are formed by facing them. To do.
  • the third lead pattern 26 is drawn from the base material layer 14 which is the fourth layer, but in order to increase the capacity with the first lead pattern 28a, A third lead pattern 27 is formed at a position close to the first lead pattern 28 a, and the third lead patterns 26 and 27 are connected by the interlayer connection conductor 66.
  • a predetermined capacitance is obtained with a small facing area by forming the second lead pattern and the first lead pattern in a comb shape in the stacking direction.
  • the third lead patterns 26 and 27 do not overlap the second terminal electrode 32 in plan view. Therefore, the capacitor (floating capacitance) C4 generated between the second terminal electrode 32 and the third lead patterns 26 and 27 is suppressed, and is equivalently connected between the first terminal electrode 31 and the second terminal electrode 32. There are few capacitance components.
  • a first LC parallel resonant circuit is configured by the inductor L1b and the capacitor C1
  • a second LC parallel resonant circuit is configured by the inductor L2 and the capacitors C2 and C3.
  • the band elimination characteristic is obtained by the two LC parallel resonance circuits.
  • FIG. 8A and 8B are diagrams showing the results of simulating the frequency characteristics of the insertion loss of the band elimination filter 104.
  • FIG. FIG. 8A and FIG. 8B show a change in characteristics by adjusting the capacitance of the capacitor C1 and the combined capacitance of the capacitor (C2 + C3).
  • characteristic IL1 indicates a case where the value of capacitor C4 is small
  • characteristic IL2 indicates a case where the value of capacitor C4 is large.
  • a second stop band is generated with a center frequency.
  • the stop band whose insertion loss is a predetermined value or less is represented by hatching.
  • the first stop band is widened by reducing the value of the capacitor C4.
  • the first and second stop bands can be determined by adjusting the values of the capacitor C1 and the capacitor (C2 + C3).
  • FIG. 9 is an exploded plan view of the band elimination filter 105 according to the fifth embodiment.
  • This band elimination filter 105 is an example in which the first lead pattern 28b and the second lead pattern 29 shown in FIG. 6 in the fourth embodiment are omitted.
  • FIG. 10 is a circuit diagram of the band elimination filter 105. Since there is no first lead pattern 28b and second lead pattern 29, there is no capacitor C3 shown in FIG.
  • the second lead pattern may be simplified in this way.
  • the insulating base layer is not limited to resin such as LCP, but may be, for example, LTCC dielectric ceramics or magnetic ceramics.
  • the inductor can be configured on the ceramic multilayer substrate by integrally firing after the base material layers are laminated.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Des électrodes de borne (31, 32) sont formées sur une couche (15) commune de matériau de base, un conducteur de bobine (21-24) est formé à travers une pluralité de couches de matériau de base (11-14), et la région de formation du conducteur de bobine dans une vue en plan comporte une partie chevauchant la première électrode de borne (31), et ne chevauche pas la seconde électrode de borne (32). Une longueur de trajet entre la première électrode de borne (31) et le conducteur de bobine (la longueur dans la direction de couche d'un conducteur de connexion intercouche (41)) est inférieure à une longueur de trajet entre la seconde électrode de borne (32) et le conducteur de bobine (la longueur dans la direction de couche des conducteurs de connexion intercouche (45-48) et la longueur d'un conducteur de connexion dans le plan (51)).
PCT/JP2014/071145 2013-09-13 2014-08-11 Bobine d'induction et filtre à élimination de bande WO2015037374A1 (fr)

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CN201490000926.4U CN205680518U (zh) 2013-09-13 2014-08-11 电感器以及频带去除滤波器

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CN106058395A (zh) * 2015-04-14 2016-10-26 Tdk株式会社 包含线圈和电容器的层叠复合电子部件
US20210280353A1 (en) * 2020-03-06 2021-09-09 Tdk Corporation Coil component
WO2024014212A1 (fr) * 2022-07-13 2024-01-18 株式会社村田製作所 Composant électronique

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CN109887707B (zh) * 2017-11-27 2022-04-12 株式会社村田制作所 层叠型线圈部件
JPWO2019171980A1 (ja) * 2018-03-09 2020-12-17 株式会社村田製作所 積層型トリプレクサ
CN110233029B (zh) * 2019-06-18 2021-09-24 电子科技大学 一种大感量叠层片式电感器及其设计方法
CN110233604A (zh) * 2019-07-10 2019-09-13 安徽安努奇科技有限公司 谐振单元制作方法和谐振单元

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JP2007012920A (ja) * 2005-06-30 2007-01-18 Neomax Co Ltd 積層インダクタ及びその製造方法並びにグリーンシート

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CN106058395A (zh) * 2015-04-14 2016-10-26 Tdk株式会社 包含线圈和电容器的层叠复合电子部件
CN106058395B (zh) * 2015-04-14 2019-04-02 Tdk株式会社 包含线圈和电容器的层叠复合电子部件
US20210280353A1 (en) * 2020-03-06 2021-09-09 Tdk Corporation Coil component
WO2024014212A1 (fr) * 2022-07-13 2024-01-18 株式会社村田製作所 Composant électronique

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