CN110233029B - 一种大感量叠层片式电感器及其设计方法 - Google Patents

一种大感量叠层片式电感器及其设计方法 Download PDF

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CN110233029B
CN110233029B CN201910525759.4A CN201910525759A CN110233029B CN 110233029 B CN110233029 B CN 110233029B CN 201910525759 A CN201910525759 A CN 201910525759A CN 110233029 B CN110233029 B CN 110233029B
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苏桦
王鹏
唐晓莉
李元勋
荆玉兰
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    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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Abstract

本发明涉及电子元件制造领域,具体涉及一种大感量叠层片式电感器及其设计方法。本发明通过对整个器件的电极线圈设计构成一个完整的电感线圈,使得引出端与引入端均存在于同一介质层中。一方面,便于一些表贴器件或模组的连接;另一方面,该电极线圈的设计充分的利用了每层介质层单元的面积,综合工艺上的易操作性,将每个介质层的绕线圈数达到最大,在相同电感层数的条件下,远大于传统7/8,3/4,1/2面内电极绕制电感器的感量。

Description

一种大感量叠层片式电感器及其设计方法
技术领域
本发明涉及电子元件制造领域,具体涉及一种大感量叠层片式电感器及其设计方法。
背景技术
小型化和集成化已成为现今电子产品市场的发展趋势。为了满足这一市场的需求,可以预见的是叠层片式电感器也正朝着小尺寸化,轻型化等方向发展。如何在更小的体积下实现大的电感量,对于实现高感量的叠层片式电感器具有重要的意义。
传统的叠层片式电感器的制造一般都会采用改良磁性原材料的配方或者增加线圈这两种方式来提高电感量。但是,前者研发周期过长,同时提高材料磁导率后也会引起材料居里温度和截止频率下降等问题。而后者虽然可行但是也会受到电感器本身的尺寸厚度的限制,因此也限制了其适用的范围。
发明内容
针对上述存在问题或不足,为解决叠层片式电感器不能很好兼顾高电感量和性能以及小型化的问题,本发明提供了一种大感量叠层片式电感器及其设计方法,通过改变电感器的结构设计,充分利用空间面积来大幅度提高电感量的叠层片式电感器。
一种大感量叠层片式电感器,包括第一盖体、第二盖体和介质层。
所述介质层至少两层,设置于第一盖体和第二盖体之间,各介质层上均设置有电极线圈。
所述最上层介质层的电极线圈为一个,其两端均设有填充导体的通孔;其余介质层上的电极线圈为大小不同的两个,且彼此不相交(两面内电极线圈可通过缩小两电极引线之间的距离实现电感量的增益),各层的两个电极线圈除最下层介质层外,均设有一个填充导体的通孔,分别用于连通相邻上下介质层所载面内电极线圈;各电极线圈通过通孔连通构成一个完整的电感线圈。
所述最下层介质层的两个电极线圈分别作为整个电感器的引入与引出端,且不设置通孔;其中第一盖体和第二盖体是整个电感器的上下保护层,由没有印刷电极图案的介质层空膜片叠层形成。
进一步的,所述介质层采用的材料不仅限于铁氧体介质层材料,对于高频叠层电感采用非磁性介质材料。
其设计方法如下:
步骤1、首先形成靠近第一盖体的最下层介质层,在最下层介质层上制备两个大小不等,且彼此不相交的电极线圈,作为整个电感器的引入与引出端;
步骤2、在最下层面内电极线圈上方形成第二介质层,然后在第二介质层上与最下层面内引入与引出电极线圈的末端相对应的位置设置填充导体的通孔,使其与最下层层面内电极线圈相连通;
步骤3、在第二介质层上以其通孔位置为起始端位置,印刷面内电极线圈,使最下层面内电极线圈与第二层面内电极线圈相连通;
步骤4、采用以上重复的操作步骤依次完成后续介质层和其面内电极线圈,并通过该介质层上的通孔连接相邻面内电极线圈,直至完成完整的电感线圈;
步骤5、依次按第一盖体,最下层介质层,……最上层介质层,第二盖体的顺序叠层形成该大感量叠层片式电感器。
本发明通过对整个器件的电极线圈设计构成一个完整的电感线圈,使得引出端与引入端均存在于同一介质层中。一方面,便于一些表贴器件或模组的连接;另一方面,该电极线圈的设计充分的利用了每层介质层单元的面积,综合工艺上的易操作性,将每个介质层的绕线圈数达到最大,在相同电感层数的条件下,远大于传统7/8,3/4,1/2面内电极绕制电感器的感量。
附图说明
图1为本发明电感器结构示意图。
图2为本发明电感器的四种基本绕制方法示意图
图3为本发明电感器在相同尺寸下与传统绕线电感器的模型图。
图4为本发明电感器与传统绕线电感器仿真曲线图。
附图标记:第一盖体-1,第二盖体-2,介质层-3,电极线圈-4,通孔-5。第一外引脚-41,第二外引脚-42
具体实施方式
下面结合具体实施例与附图对本发明做进一步的详细说明。
本发明大感量叠层片式电感器包括第一盖体1、第二盖体2、介质层3。介质层3上承载有电极线圈4、通孔5,构成了基本的电感器模型。区别于现有的叠层片式电感器,本发明改变了传统的绕线结构,将电极线圈的引入线与引出线均置于同一介质层上,不仅如此,相对于常规相同尺寸的叠层片式电感器,本发明单层介质层内电极线圈的利用率更高。
如图1所示,第一盖体1与第二盖体2均为未通孔的介质材料的膜片,介质层3,除承载上下引出端的介质层无需通孔其余介质均为通孔的介质材料膜片,通孔5的位置如图1所示。图2中描绘了电极线圈的几种基本绕制方法,并可按照此循环规律依次增加印刷层数。
制作步骤如下:
步骤1、首先形成靠近第一盖体的最下层介质层,在最下层介质层上制备两个大小不等,且彼此不相交的3/4面内电极线圈,作为整个电感器的引入与引出端;
步骤2、在最下层面内电极线圈上方形成第二介质层,然后在第二介质层上与最下层面内引入与引出电极线圈的末端相对应的位置设置填充导体的通孔,使其与最下层层面内电极线圈相连通。
步骤3、在第二介质层上以其通孔位置为起始端位置,印刷面内电极线圈,使最下层面内电极线圈与第二层面内电极线圈相连通。
步骤4、采用以上重复的操作步骤依次完成后续介质层和其面内电极线圈,并通过该介质层上的通孔连接相邻面内电极线圈,直至完成完整的电感线圈;
步骤5、依次按第一盖体1,介质层3,第二盖体2的顺序叠层形成图1所示的叠层片式电感器。
图3为本发明电感器仿真模型以及在相同叠层数和封装尺寸下与传统的1/2面内电极,3/4面内电极,以及7/8面内电极的仿真模型示意图。图4为本发明以及所述常规三种模型的仿真结果。表1为本发明新型电感器在相同层数相同尺寸下与传统的1/2面内电极,3/4面内电极,以及7/8面内电极的相关参数对比。
图4直观的表示出,本发明电感器在相同封装尺寸时获得的感量远远大于常规结构的叠层电感器,在工艺条件允许的条件扩大两线圈中的内线圈尺寸感量还能够变得更大。从表1中可以看出在相同的绕线层数下,不仅该新型电感器感量要大于普通结构的叠层绕线电感,而且7/8面内电极绕制的电感器耐直流特性也要要差于本新型结构电感器的耐直流特性。
表1为本发明电感器与传统绕线电感器相关参数对比表。
Figure BDA0002098149820000031

Claims (4)

1.一种大感量叠层片式电感器,包括第一盖体、第二盖体和介质层,其特征在于:
所述介质层至少三层,设置于第一盖体和第二盖体之间,各介质层上均设置有面内电极线圈;
最上层介质层的面内电极线圈为一个,其两端均设有填充导体的通孔;其余介质层上的电极线圈为大小不同的两个,且彼此不相交,各层的两个电极线圈除最下层介质层外,均设有一个填充导体的通孔,分别用于连通相邻上下介质层所载面内电极线圈;各电极线圈通过通孔连通构成一个完整的电感线圈;
所述最下层介质层的两个面内电极线圈分别作为整个电感器的引入与引出端;其中第一盖体和第二盖体是整个电感器的上下保护层,由没有印刷电极图案的介质层空膜片叠层形成。
2.如权利要求1所述大感量叠层片式电感器,其特征在于:所述最下层介质层的两个面内电极线圈为3/4面内电极结构。
3.如权利要求1所述大感量叠层片式电感器,其特征在于:所述介质层在常规电感中采用的材料为铁氧体介质层材料,对于高频叠层电感采用非磁性介质材料。
4.如权利要求1所述大感量叠层片式电感器,其设计方法如下:
步骤1、首先形成靠近第一盖体的最下层介质层,在最下层介质层上制备两个大小不等,且彼此不相交的面内电极线圈,作为整个电感器的引入与引出端;
步骤2、在最下层面内电极线圈上方形成第二介质层,然后在第二介质层上与最下层的两个面内电极线圈相对应的位置设置填充导体的通孔,使其与最下层的面内电极线圈相连通;
步骤3、在第二介质层上以其通孔位置为起始端位置,印刷面内电极线圈,使最下层面内电极线圈与第二层面内电极线圈相连通;
步骤4、采用以上重复的操作步骤依次完成后续介质层和其面内电极线圈,并通过该介质层上的通孔连接相邻面内电极线圈,直至完成完整的电感线圈;
步骤5、依次按第一盖体,最下层介质层,……最上层介质层,第二盖体的顺序叠层形成该大感量叠层片式电感器。
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PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: A high-sensitivity stacked chip inductor and its design method

Granted publication date: 20210924

Pledgee: Ganzhou rural commercial bank Limited by Share Ltd.

Pledgor: Ganzhou Yanchuang Electronic Technology Co.,Ltd.

Registration number: Y2024980002104