WO2015033690A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

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Publication number
WO2015033690A1
WO2015033690A1 PCT/JP2014/069476 JP2014069476W WO2015033690A1 WO 2015033690 A1 WO2015033690 A1 WO 2015033690A1 JP 2014069476 W JP2014069476 W JP 2014069476W WO 2015033690 A1 WO2015033690 A1 WO 2015033690A1
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Prior art keywords
cooling device
ceramic material
heat
ceramic
cooling
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PCT/JP2014/069476
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English (en)
Japanese (ja)
Inventor
廣瀬　左京
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株式会社村田製作所
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Publication of WO2015033690A1 publication Critical patent/WO2015033690A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooling device.
  • a cooling device that combines a heat sink and a fan or Peltier element as described above makes the device relatively large and consumes power, making the device smaller and thinner, and lower power consumption (battery life). It is disadvantageous from the point of view. Therefore, development of a cooling device that can be used without a power source and is small is strongly desired.
  • a heat storage material that utilizes latent heat associated with electronic phase transition is known as a heat storage material that does not require electric power (Patent Document 2).
  • latent heat is the total amount of thermal energy required when the phase of a substance changes, and generally refers to the amount of heat absorbed and exothermed with the change of phase.
  • heat storage is to store heat, and cold insulation is to keep the temperature of the object low, and cooling means to lower the temperature of the object.
  • Such a material absorbs heat only in the vicinity of the object in contact with the object to be cooled, and it is clear that the entire cooling device cannot absorb heat and cannot fully utilize the capacity of the cooling device. It was. Therefore, although it can be used in an application in which the space insulated by the heat storage effect is kept for a long time, the temperature rises in a spike shape (steep) when sudden processing is performed like a CPU, for example. It has been found difficult to cool such things efficiently.
  • an object of the present invention is to provide a cooling device that does not require electric power, can be reduced in thickness and size, and has high efficiency and high response.
  • the present inventor is different from a surface in contact with an object to be cooled in a cooling device including a ceramic material that absorbs heat accompanying a crystal structure phase transition or a magnetic phase transition.
  • the inventors have found that the above-mentioned problems can be solved by making the temperatures indicating the latent heat of the ceramic materials at a distance different from each other, and have reached the present invention.
  • a cooling device comprising a ceramic material that absorbs heat, wherein the temperature indicative of the latent heat of the ceramic material at a first distance from the surface in contact with the object to be cooled is the object to be cooled.
  • a cooling device is provided that is different from a temperature indicative of the latent heat of the ceramic material at a second distance from the surface in contact with the surface.
  • a cooling device comprising a ceramic material that absorbs heat associated with a crystal structure phase transition, a magnetic phase transition, etc., the temperature indicating the latent heat of the ceramic material at different distances from the surface in contact with the object to be cooled.
  • FIGS. 1A to 1C are schematic cross-sectional views of a cooling device in which ceramic layers are laminated
  • FIG. 1D is a schematic cross-sectional view of a cooling device having a temperature gradient of phase transition.
  • FIG. 2 shows the results of differential scanning calorimetry in the experimental example.
  • FIG. 3 shows the temperature measurement result of the cooling test in the experimental example.
  • FIG. 4 is a schematic diagram for explaining the result of the cooling test in the experimental example.
  • cooling refers to cooling the cooling object by absorbing the heat generated in the cooling object, and absorbing the heat generated around the cooling object, so that the cooling object is heated. Both prevent it.
  • the temperatures related to latent heat and phase transition such as “temperature indicating latent heat” and “temperature for phase transition” mean the temperature indicating latent heat at the time of temperature rise and the temperature at which the phase transition at the time of temperature rise, unless otherwise specified. To do.
  • the temperature which shows a latent heat, and the temperature which changes a phase mean substantially the same temperature.
  • the cooling device of the present invention comprises a ceramic material that absorbs heat (hereinafter also simply referred to as “ceramic material”).
  • the ceramic material absorbs heat by absorbing latent heat.
  • the latent heat means latent heat accompanying a solid-solid phase transition, such as a crystal structure phase transition or a magnetic phase transition. Using the latent heat accompanying the phase transition of the ceramic material, the heat generated in the object to be cooled or the heat generated around the object to be cooled is absorbed to cool the object to be cooled.
  • the temperature indicating the latent heat is different between the ceramic material at the first distance from the surface in contact with the object to be cooled and the ceramic material at the second distance from the surface in contact with the object to be cooled. .
  • the first distance and the second distance are distances in a direction perpendicular to the surface of the cooling device that contacts the object to be cooled and away from the object to be cooled. It may be a distance.
  • the ceramic material is not particularly limited, and a known ceramic material that undergoes phase transition at a desired temperature can be used. A person skilled in the art can select an appropriate ceramic material according to the desired phase transition temperature, application, and the like.
  • the temperature at which the ceramic material undergoes phase transition is appropriately selected according to the object to be cooled, the purpose of cooling, and the like.
  • the phase transition should be performed at 30 to 100 ° C., preferably 40 to 60 ° C. Is preferred.
  • the ceramic material preferably has a latent heat amount of 5 J / g or more, more preferably 20 J / g or more.
  • the ceramic material preferably has a change in thermal conductivity before and after the phase transition. As a result, it is possible to realize a device that can be cooled more efficiently in terms of heat diffusion, heat dissipation, and heat storage, as well as cooling due to heat absorption caused by latent heat.
  • the ceramic material for electronic phase transition is not particularly limited, for example, ceramic material described in Patent Document 2, specifically, VO 2, LiMn 2 O 4 , LiVS 2, LiVO 2, NaNiO 2, LiRh 2 O 4 , V 2 O 3 , V 4 O 7 , V 6 O 11 , Ti 4 O 7 , SmBaFe 2 O 5 , EuBaFe 2 O 5 , GdBaFe 2 O 5 , TbBaFe 2 O 5 , DyBaFe 2 O 5 , HoBaFe 2 O 5 , YBaFe 2 O 5 , PrBaCo 2 O 5.5 , DyBaCo 2 O 5.54 , HoBaCo 2 O 5.48 , YBaCo 2 O 5.49 , A y VO 2 (wherein A is Li or Na, 0.1 ⁇ y ⁇ 2.0, in preferably 0.5 ⁇ y ⁇ 1.0), V 1-x M x O 2 ( wherein, M represents, W, Ta Mo, Nb
  • the ceramic material used in the cooling device of the present invention is an oxide containing vanadium V and M (where M is at least one selected from W, Ta, Mo and Nb),
  • M is at least one selected from W, Ta, Mo and Nb
  • the molar content of M is about 0 mol parts or more and about 5 mol parts or less. Note that M is not an essential component, and the content molar part of M may be 0.
  • the ceramic material used in the cooling device of the present invention is an oxide containing A (here, A is Li or Na) and vanadium V, where V is 100 mole parts.
  • a mole content of A is from about 50 mole parts to about 100 mole parts.
  • the ceramic material used in the cooling device of the present invention has a composition formula: V 1-x M x O 2 (Wherein, M is W, Ta, Mo or Nb, 0 ⁇ x ⁇ 0.05) Or the composition formula: A y VO 2 (Wherein, A is Li or Na, 0.5 ⁇ y ⁇ 1.0)
  • V 1-x M x O 2 wherein, M is W, Ta, Mo or Nb, 0 ⁇ x ⁇ 0.05
  • a y VO 2 wherein, A is Li or Na, 0.5 ⁇ y ⁇ 1.0
  • the ceramic material used in the cooling device of the present invention has a composition formula: V 1-x W x O 2 (Where 0 ⁇ x ⁇ 0.01) The substance shown by is included as a main component.
  • the main component means a component contained in the ceramic material by 50% by mass or more, particularly 60% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more, and further preferably 98% by mass. For example, it means 98.0 to 99.8% by mass.
  • Other components include VO x having a different oxygen content from VO 2 .
  • the temperature indicating the latent heat of the ceramic material that is, the temperature at which the ceramic material undergoes phase transition can be adjusted by the amount of the element to be added (dope).
  • a ceramic material has a composition formula: V 1-x W x O 2 When x is 0.005, the phase transition occurs at about 50 ° C., and when x is 0.01, the phase transition occurs at about 40 ° C.
  • the cooling device of the present invention may be a laminate in which two or more ceramic layers each made of a ceramic material that undergoes phase transition at different temperatures are laminated.
  • the ceramic layer may contain other components such as a resin and metal powder described below.
  • the thickness of the ceramic layer is not particularly limited, but is, for example, 0.05 mm to 5 mm, preferably 0.2 mm to 2 mm.
  • the thickness of each ceramic layer may be the same or different.
  • By reducing the thickness of the ceramic layer it is possible to increase the number of ceramic layers in a cooling device of the same thickness, so that the cooling device can have a more gradual phase transition temperature gradient. , Heat diffusion and cooling can be performed more efficiently.
  • the thickness of the ceramic layer is reduced in a cooling device having the same thickness, so that the manufacture is facilitated.
  • the thermal conductivity is also different, so by adjusting the composition and thickness, heat conduction can be improved and worsened to efficiently absorb and It is possible to design according to the object to be cooled and its external environment (such as a heating element nearby) by dissipating heat or efficiently absorbing and insulating heat.
  • the number of laminated ceramic layers is not particularly limited, and is appropriately determined according to the thickness of the cooling device, the thickness of the ceramic layer, and desired characteristics.
  • the number of ceramic layers is increased, it becomes possible to have a more gradual phase transition temperature gradient, and heat diffusion and cooling can be performed more efficiently.
  • the manufacture becomes easier.
  • overheating of the object to be cooled can be suppressed by arranging a thick sample having a low thermal conductivity when heat insulation is desired.
  • the order of stacking the ceramic layers is not particularly limited.
  • the ceramic layers may be stacked in order of increasing phase transition temperature (FIG. 1A), or the ceramic layers having a lower phase transition temperature may undergo phase transition. You may arrange
  • the layer closest to the object to be cooled is a layer that undergoes a phase transition at the temperature to be cooled and controlled
  • a layer farthest from the object to be cooled is a layer that undergoes a phase transition at the lowest temperature.
  • the upper layer absorbs the heat of the cooling target and completes the phase transition relatively early after the temperature of the cooling target starts to rise, and the entire device is cooled with high efficiency and responsiveness. It becomes possible to cool things. Also, in this case, in order to improve the heat diffusion as necessary, the metal foil or carbon sheet having a good thermal conductivity is inserted into or covered with the upper layer portion, the lower layer portion, or the inside, and the heat is more efficiently transferred. Conduction, cooling, and heat dissipation are possible. On the other hand, when heat is generated around the object to be cooled, especially the equipment on the upper layer side, the upper layer is slow to complete the phase transition by arranging a layer having a high temperature showing latent heat in the upper layer.
  • the cooling device by covering the cooling device with a material having a poor thermal conductivity (for example, resin) as necessary, it is possible to further suppress the temperature increase of the cooling target due to the effect of heat insulation. In either situation, if insulation is required, a highly insulating resin or the like may be inserted and covered as necessary.
  • a material having a poor thermal conductivity for example, resin
  • the cooling device of the present invention is such that the temperature at which the ceramic material exhibits latent heat is highest on the surface in contact with the object to be cooled (i.e., the lower part), and gradually decreases with increasing distance from the surface. It can be configured to be the lowest on the surface opposite to the surface in contact with (ie, the upper portion) (FIG. 1 (d)).
  • the upper portion As described above, so that it is possible to cool the cooling target with high efficiency and high response.
  • heat is generated around the object to be cooled, particularly the equipment on the upper side, it is possible to prevent the heat from being transmitted to the lower part by placing it in reverse, so that the object to be cooled is heated. Can be suppressed.
  • the ceramic material may be in the form of particles (powder).
  • the ceramic material By using the ceramic material as particles, the occurrence of cracks can be suppressed even when the phase transition is repeated, and the durability of the cooling device is enhanced.
  • the particle size of the ceramic material particles is not particularly limited.
  • the average particle size is 0.2 to 50 ⁇ m, preferably 0.5 to 50 ⁇ m.
  • Such an average particle diameter can be measured using a laser diffraction / scattering soot particle diameter / particle size distribution measuring apparatus or an electronic scanning microscope.
  • the average particle system is preferably 0.5 ⁇ m or more from the viewpoint of ease of handling, and is preferably 10 ⁇ m or less from the viewpoint of reducing the porosity between particles.
  • the cooling device of the present invention may include metal particles (for example, powder). Since the metal particles have higher thermal conductivity than the ceramic material, the heat of the object to be cooled can be efficiently transmitted to a wide area of the cooling device by using the metal particles.
  • a powder obtained by coating a ceramic particle with a metal using a chemical or physical method may be used.
  • the metal particles need only be in contact with the ceramic material.
  • the metal particles may be dispersed in the cooling device and may be present uniformly or non-uniformly.
  • the cooling device is composed of ceramic layers, it may be present in all ceramic layers, or may be present in some ceramic layers.
  • the ceramic material forming the layer is a lump, it can be dispersed therein, and when the ceramic material forming the layer is a particle, it can be present as a mixture of particles of ceramic material and metal particles.
  • the metal particles are not particularly limited as long as they have higher thermal conductivity than the ceramic material, and examples thereof include particles made of tin, nickel, copper, silver, aluminum, and the like. These metal particles may be used alone or in combination of two or more metal particles. Preferred metal particles are tin, silver, or copper particles.
  • the particle size of the metal particles (powder) is not particularly limited.
  • the average particle size is 0.5 to 100 ⁇ m, preferably 1 to 50 ⁇ m.
  • Such an average particle diameter can be measured using a laser diffraction / scattering soot particle diameter / particle size distribution measuring apparatus or a scanning electron microscope.
  • the average particle system is preferably 1 ⁇ m or more from the viewpoint of ease of handling, and is preferably 50 ⁇ m or less from the viewpoint of reducing the porosity between particles.
  • the mixing ratio of the ceramic material and the metal particles is not particularly limited.
  • the volume ratio is 8: 2 to 2: 8, preferably 6: 4 to 3: 7.
  • the volume ratio between the ceramic material and the metal particles can be obtained by measuring the respective weights and calculating the volume from the theoretical density.
  • the thermal conductivity inside the cooling device can be improved, and the cooling efficiency can be increased.
  • the strength of the cooling device after molding can be increased.
  • the amount of heat that can be absorbed can be increased by increasing the proportion of the ceramic material.
  • the cooling device of the present invention may contain a resin.
  • a resin By including a resin in the cooling device, flexibility can be given to the cooling device, and the strength of the cooling device can be increased.
  • the resin since the resin has a high resistance, the resistance of the cooling device can be increased by compounding, and there is an advantage that it is possible to suppress a short circuit or interference of radio waves.
  • the resin is not particularly limited, and examples thereof include acrylic resin, epoxy, polyester, silicon, polyurethane, polyethylene, polypropylene, polystyrene, nylon, polycarbonate, and polybutylene terephthalate.
  • the content of the resin is not particularly limited, but is preferably equal to or more than an amount capable of filling a gap between particles (including metal particles and ceramic material particles, if present). 10 to 60 parts by volume is preferable with respect to 100 parts by volume in total of the metal particles.
  • the cooling device of the present invention may have a heat conducting portion made of a material having a higher thermal conductivity than the ceramic material (hereinafter also referred to as “high heat conducting material”).
  • the heat conducting unit has a function of efficiently transferring heat generated in the object to be cooled to a wide area of the cooling device.
  • the high thermal conductivity material is not particularly limited as long as it has a higher thermal conductivity than the ceramic material, and examples thereof include metal materials and resins, preferably metal materials and composite materials thereof, graphite, and graphene sheets. Used.
  • the high thermal conductivity material is not particularly limited as long as it has a higher thermal conductivity than the ceramic material, but includes metal materials, resins, nitrides such as AlN, and oxides such as Al 2 O 3 , Metal materials and composite materials thereof, graphite, and graphene are preferable.
  • the metal material is not particularly limited, and examples thereof include tin, nickel, copper, bismuth, silver, iron, aluminum, and alloys containing them. This metal material may be the same metal as the metal particles or may be different. These metal materials may be used alone or in combination of two or more.
  • the shape and arrangement of the high heat conduction part are not particularly limited as long as the heat generated in the object to be cooled can be transmitted to a wide area of the cooling device.
  • the heat conducting part has a contact part with the object to be cooled, and is arranged so as to contact the ceramic material at a position away from the contact part.
  • the heat conducting part is disposed so as to surround the periphery of the cooling device, that is, can be disposed so as to package the ceramic material and the metal particles.
  • the cooling device of the present invention may have elasticity.
  • the cooling device can be fixed more easily and stably by being sandwiched between other members.
  • the method for imparting elasticity to the cooling device of the present invention is not particularly limited, and examples thereof include a method of containing a resin.
  • the shape of the cooling device of the present invention is not particularly limited, and may be, for example, a block shape or a sheet shape. If necessary, the surface of the device may be roughened to increase the surface area.
  • the cooling device By making the cooling device into a sheet shape, the surface area increases, so it becomes easier to release the absorbed heat to the outside. Moreover, when it is set as a sheet form, the softness
  • the manufacturing method of the cooling device of the present invention is not particularly limited.
  • the ceramic material constitutes the ceramic layer
  • the ceramic layer is separately formed using ceramic materials having different temperatures indicating phase transition. And it can produce by crimping
  • pastes containing ceramic materials having different temperatures exhibiting phase transition can be laminated and compression molded to obtain a laminate.
  • the laminate may be sintered by heat treatment after compression molding. In this case, it is possible to manufacture a cooling device in which the transition temperature is continuously changed by mutual diffusion of W or the like added for controlling the transition temperature during firing.
  • the cooling device of the present invention can be molded into a desired shape and can also be given flexibility, it can function as a cooling device and can also be used as another member such as a substrate, a case, or a cushioning material. Can be used.
  • V 2 O 3 Vanadium trioxide
  • V 2 O 5 vanadium pentoxide
  • WO 3 tungsten oxide
  • V: W: O It weighed so that it might become 0.995: 0.005: 2 (molar ratio), and it dry-mixed. Thereafter, heat treatment was performed at 1000 ° C. for 4 hours in a nitrogen / hydrogen / water atmosphere to prepare a powder of V 0.995 W 0.005 O 2 (0.5 at% W-doped VO 2 ) as a ceramic material.
  • pure water, partially stabilized zirconium (PSZ) balls, a dispersant (manufactured by San Nopco: SN5468) and the ceramic material powder obtained above are added to a polypot and pulverized and mixed for 24 hours. Thereafter, an acrylic binder, a plasticizer and an antifoaming agent were added and mixed again for 2 hours to obtain a sheet forming slurry.
  • PSZ partially stabilized zirconium
  • a sheet forming slurry was formed into a sheet to produce a green sheet, then cut into strips, and a ceramic single plate was produced by a crimping process.
  • This ceramic single plate is subjected to a degreasing treatment in the atmosphere at 300 ° C., and then sintered by heat treatment at 1000 ° C. for 4 hours in a nitrogen / hydrogen / water atmosphere to obtain a size of 20 mm ⁇ 20 mm ⁇ 5 mm.
  • a ceramic single plate cooling device was fabricated.
  • Cooling test A PTC (positive temperature coefficient) heater with an ultimate temperature of about 60 ° C. was used as a heating element, and heat conduction grease was applied to the surface of the PTC heater, and an ultrafine K thermocouple was applied thereon, and the above was produced from above.
  • the sintered ceramic single plate cooling device was pressed and fixed. Further, an ultrafine K thermocouple was attached to the upper surface of the cooling device (the surface opposite to the surface in contact with the PTC heater).
  • heat conduction grease was applied to the surface of another PTC heater for reference, and an ultrafine K thermocouple was attached (no cooling device).
  • the surface (contact surface) temperature of the PTC heater is slightly lowered by using the sintered ceramic single plate cooling device as compared with the case where this cooling device is not used.
  • the temperature of the upper surface of the cooling device has a large temperature difference from the contact surface and does not sufficiently contribute to heat absorption.
  • the heat of the PTC heater 4 is transmitted to the lower part of the sintered ceramic single plate 2 that is in contact with the PTC heater 4 (the x part in FIG. 4). It is thought that this is because the amount of heat transferred from the ceramic material of the x portion to the upper portion of the sintered ceramic single plate (y portion in FIG. 4) is reduced while absorbing the heat required for.
  • the cooling effect is seen for a while after the PTC heater is energized, but after 400 seconds, the cooling effect is hardly seen even though the temperature of the upper surface of the cooling device is low, and the merit of using the cooling device is small. It was confirmed.
  • the resulting ceramic material powder, pure water, partially stabilized zirconium (PSZ) balls, and a dispersant are added to a polypot and mixed for 24 hours, followed by acrylic binder, plasticizer and antifoam.
  • the agent was added and mixed again for 2 hours to obtain sheet forming slurries A to C corresponding to the ceramic materials A to C.
  • each of the sheet forming slurries A to C is formed into a sheet to produce green sheets A to C. Thereafter, each of the green sheets A to C is cut into strips, and about 1
  • the green sheets A to C were laminated to 6 mm, and the laminated green sheets A to C were pressure-bonded and cut in the order of A to C to prepare a laminate having a size of 20 mm ⁇ 20 mm ⁇ 5 mm.
  • Comparative Example 1 A laminate of Comparative Example 1 having a size of 20 mm ⁇ 20 mm ⁇ 5 mm was obtained in the same manner as Example 1 except that only the green sheet A was laminated.
  • Cooling test As a heating element, a PTC heater having an ultimate temperature of about 60 ° C. was used, heat conduction grease was applied to the heater surface, and an ultrafine K thermocouple was attached thereto. One cooling device was pressed and fixed. In the cooling device of Example 1, the green sheet C side was the cooling device side. For reference, an extra fine K thermocouple was attached to the surface of the heater without a cooling device.
  • the rated current was applied to the PTC heater using a DC power supply, and the temperature of the PTC heater surface after 200 seconds and 600 seconds was measured to evaluate the cooling effect.
  • the results are shown in Table 2.
  • the cooling device of Comparative Example 1 using only one kind of ceramic material shows a cooling effect at 200 seconds after energizing the PTC heater, but after 600 seconds, the cooling effect is seen. I can't. As described in the experimental example, this is considered to be because heat conduction is suppressed while the ceramic material is absorbing heat, and the vicinity of the upper surface of the cooling device cannot sufficiently contribute to heat absorption.
  • the cooling device of Example 1 using three kinds of ceramic materials has a larger cooling effect after 200 seconds than the cooling device of Comparative Example 1, and also exhibits a sufficient cooling effect after 600 seconds. It was confirmed.
  • the cooling device of the present invention can be used, for example, as a cooling device for a small communication terminal in which a thermal countermeasure problem has become prominent.

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Abstract

La présente invention concerne un dispositif de refroidissement qui présente une efficacité élevée et une réactivité élevée, peut présenter une compacité accrue et une épaisseur plus faible, et ne requiert pas d'énergie électrique. Le dispositif de refroidissement, qui comprend un matériau céramique présentant une chaleur latente, est caractérisé par une température, indiquant la chaleur latente du matériau céramique à une première distance par rapport à une surface venant en contact avec un sujet de refroidissement, qui est différente d'une température indiquant la chaleur latente du matériau céramique à une seconde distance par rapport à la surface venant en contact avec le sujet de refroidissement.
PCT/JP2014/069476 2013-09-05 2014-07-23 Dispositif de refroidissement WO2015033690A1 (fr)

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JP2013-184086 2013-09-05
JP2013184086 2013-09-05

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5854363B2 (ja) * 2013-12-11 2016-02-09 富士高分子工業株式会社 蓄熱性組成物
WO2016063479A1 (fr) * 2014-10-22 2016-04-28 株式会社デンソー Matériau de stockage de chaleur stratifié
JP2016069554A (ja) * 2014-09-30 2016-05-09 株式会社デンソー 蓄熱ユニット及び蓄熱システム

Citations (3)

* Cited by examiner, † Cited by third party
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