WO2015029527A1 - 駆動機構及び製造装置 - Google Patents
駆動機構及び製造装置 Download PDFInfo
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- WO2015029527A1 WO2015029527A1 PCT/JP2014/064402 JP2014064402W WO2015029527A1 WO 2015029527 A1 WO2015029527 A1 WO 2015029527A1 JP 2014064402 W JP2014064402 W JP 2014064402W WO 2015029527 A1 WO2015029527 A1 WO 2015029527A1
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- rod
- moving mechanism
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- moving
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H21/00—Gearings comprising primarily only links or levers, with or without slides
- F16H21/46—Gearings comprising primarily only links or levers, with or without slides with movements in three dimensions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/003—Programme-controlled manipulators having parallel kinematics
- B25J9/0033—Programme-controlled manipulators having parallel kinematics with kinematics chains having a prismatic joint at the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78353—Ultrasonic horns
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Definitions
- the present invention relates to a drive mechanism and a manufacturing apparatus including the drive mechanism.
- the manufacturing apparatus means a manufacturing apparatus that directly manufactures an object and various apparatuses that are used in the process of manufacturing the object, and includes, for example, a wire bonding apparatus. .
- FIG. 10 is a perspective view showing a conventional wire bonding apparatus.
- the XYZ axes have a three-layer structure.
- a fixed base 3 is disposed on the first layer 2, and an X-axis cross roller guide 4 is provided on the fixed base 3.
- An X linear motor 17 is disposed in the X axis motor unit 15.
- the lower moving plate 6 is moved in the X-axis direction on the X-axis cross roller guide 4 by the X linear motor 17.
- the Y-axis cross roller guide 12 is disposed in the second layer, and the upper moving body 10 is moved in the Y-axis direction on the Y-axis cross roller guide 12 by the Y linear motor 42.
- a Z rotation fulcrum mounted on the upper moving body 10, and an ultrasonic horn and a capillary are arranged on the Z rotation fulcrum, and the Z rotation fulcrum is driven by a Z motor in a swinging manner.
- the capillary and the ultrasonic horn can be moved in the Z-axis direction by the driving force of the Z motor.
- the apparatus also has a bonding mechanism (not shown) that performs bonding by supplying a wire to the capillary.
- the above bonding mechanism supplies a wire to the capillary, forms a ball at the tip of the wire drawn out from the capillary, moves the ball to the first bonding point by the capillary, and ultrasonically vibrates the ball with an ultrasonic horn.
- the wire is bonded to the 1st bonding point, and then the capillary is moved to the 2nd bonding point.
- ultrasonic vibration is applied to the wire by an ultrasonic horn from the capillary.
- the lower moving plate 6 when the lower moving plate 6 is moved in the X axis direction by the X linear motor 17 in the first layer 2, the upper moving body 10 mounted thereon and the ultrasonic horn and capillary of the Z rotation fulcrum are also in the X axis. Move in the direction. Further, when the upper moving body 10 is moved in the Y-axis direction by the second-layer Y linear motor 42, the ultrasonic horn and capillary on the Z rotation fulcrum mounted thereon are also moved in the Y-axis direction. However, even if the upper moving body 10 is moved in the Y-axis direction, the lower moving plate 6 does not move.
- the Z rotation fulcrum capillary and ultrasonic horn are swung by the third layer Z motor.
- the lower moving plate 6 and the upper moving body 10 do not move except for the Z-axis oscillating Y component.
- precise XYZ movement is realized.
- the third layer Z motor Since the third layer Z motor is dedicated to the Z rotation fulcrum, it cannot contribute to the driving of the first layer X linear motor 17 in the X-axis direction at all and becomes a pure load. Similarly, since the second-layer Y linear motor 42 is dedicated to the movement of the upper moving body 10 in the Y-axis direction, driving the first-layer X linear motor 17 in the X-axis direction becomes a load.
- the Y-axis cross roller guide 12 is disposed on the X-axis cross roller guide 4 and the Z motor is mounted in a box-shaped housing, which requires a certain size, so these are also loads. Therefore, the X linear motor 17 has a relatively large load compared to the Z motor and is disadvantageous for high acceleration / deceleration.
- An object of one embodiment of the present invention is to provide a driving mechanism or a manufacturing apparatus that is advantageous for high acceleration / deceleration by reducing a load.
- One end of the second rod is rotatably connected by a third rotation fulcrum provided on the first rod, and the other end of the second rod is rotatably connected by the center moving mechanism and a fourth rotation fulcrum.
- a third rod, a fourth rod, and a second moving mechanism that moves on the plane are provided, and one end of the third rod has the moving portion and a fifth rotation.
- the other end of the third rod is rotatably connected by the second moving mechanism and a sixth rotation fulcrum, and one end of the fourth rod is connected to the third rod.
- the other end of the fourth rod is rotatably connected by the center movement mechanism and the eighth rotation fulcrum, and the second movement mechanism is connected to the center by the seventh rotation fulcrum provided.
- the second moving mechanism is a second planar motor or a second XY table.
- the center moving mechanism is moved on the first straight line on the plane or along the first straight line.
- a drive mechanism characterized by.
- the third moving mechanism is configured to guide both ends of the first linear guide so as to move on the second straight line or along the second straight line.
- a drive mechanism comprising: a linear guide; and a linear motor that moves the first linear guide on or along the second straight line.
- the first moving mechanism is guided so as to move on a third straight line on the plane connecting the center moving mechanism and the first moving mechanism.
- a drive mechanism having a second linear guide, wherein the second linear guide is guided by the first linear guide so as to move along the first straight line.
- the first moving mechanism is a first planar motor or a first XY table
- the center moving mechanism is A drive mechanism characterized by being a center plane motor or a center XY table.
- a manufacturing apparatus comprising the drive mechanism according to any one of [1] to [8].
- the manufacturing apparatus comprising: a capillary disposed in the moving unit; and a bonding mechanism that supplies a wire to the capillary and performs wire bonding.
- FIG. 6 is a schematic diagram illustrating a drive mechanism according to one embodiment of the present invention. It is a top view of the drive mechanism shown in FIG. It is a schematic diagram which shows the modification of the drive mechanism shown in FIG.
- FIG. 4 is a plan view of the drive mechanism shown in FIG. 3.
- 1 is a perspective view schematically showing a bonding apparatus according to an aspect of the present invention. 1 is a perspective view schematically showing a bonding apparatus according to an aspect of the present invention. It is a top view of the bonding apparatus shown in FIG. It is a top view which shows typically the bonding apparatus which concerns on 1 aspect of this invention. It is a schematic diagram which shows the drive mechanism which concerns on the modification of 1st Embodiment. It is a perspective view which shows the conventional wire bonding apparatus.
- FIG. 1 is a schematic diagram illustrating a drive mechanism according to an aspect of the present invention.
- FIG. 2 is a plan view of the drive mechanism shown in FIG.
- the drive mechanism can move the moving unit 101 in the XYZ axis space by combining four planar motors and three Scott Russell link mechanisms.
- a known planar motor may be used for the four planar motors.
- the driving mechanism shown in FIGS. 1 and 2 includes a first planar motor (hereinafter also referred to as “8 o'clock motor”) 106, a second planar motor (hereinafter also referred to as “4 o'clock motor”) 107, and the first. 3 plane motors (hereinafter also referred to as “12 o'clock motors”) 108 and a center plane motor 105, and these plane motors move on the same plane (on the XY plane 200).
- the driving mechanism includes a first rod 103a, a second rod 104a, a third rod 103b, a fourth rod 104b, a fifth rod 103c, a sixth rod 104c, a moving unit 101, and a fixed unit 102.
- a center plane motor 105 is mounted on the fixed portion 102.
- One end of the first rod 103a is rotatably connected by the moving part 101 and the first rotation fulcrum 125a, and the other end of the first rod 103a is rotatable by the 8 o'clock motor 106 and the second rotation fulcrum 126a. It is connected to the.
- One end of the second rod 104a is rotatably connected to the center of the first rod 103a and a third rotation fulcrum 128a, and the other end of the second rod 104a is connected to the fixed portion 102 and the fourth rotation fulcrum 127a. Is connected to be rotatable.
- the first Scott Russell link mechanism is constituted by the moving part 101, the fixed part 102, the first and second rods 103a, 104a, the eight o'clock motor 106, and the first to fourth rotation fulcrums 125a, 126a, 128a, 127a. It is composed.
- One end of the third rod 103b is rotatably connected by the moving part 101 and the fifth rotation fulcrum 125b, and the other end of the third rod 103b is rotatable by the 4 o'clock motor 107 and the sixth rotation fulcrum 126b. It is connected to the.
- One end of the fourth rod 104b is rotatably connected to the center of the third rod 103b and a seventh rotation fulcrum 128b, and the other end of the fourth rod 104b is connected to the fixed portion 102 and the eighth rotation fulcrum 127b. Is connected to be rotatable.
- the second Scott Russell link mechanism is constituted by the moving part 101, the fixed part 102, the third and fourth rods 103b, 104b, the four o'clock motor 107, and the fifth to eighth rotation fulcrums 125b, 126b, 128b, 127b. It is composed.
- One end of the fifth rod 103c is rotatably connected by the moving part 101 and the ninth rotation fulcrum 125c, and the other end of the fifth rod 103c is rotatable by the 12:00 motor 108 and the tenth rotation fulcrum 126c. It is connected to the.
- One end of the sixth rod 104c is rotatably connected to the center of the fifth rod 103c and an eleventh rotation fulcrum 128c, and the other end of the sixth rod 104c is fixed to the fixed portion 102 and the twelfth rotation fulcrum 127c. Is connected to be rotatable.
- the third Scott Russell link mechanism is constituted by the moving portion 101, the fixed portion 102, the fifth and sixth rods 103c, 104c, the 12 o'clock motor 108, and the ninth to twelfth rotational fulcrums 125c, 126c, 128c, 127c. It is composed.
- the movement of the moving unit 101 in the XY direction will be described. If all of the center plane motor 105, the 8 o'clock motor 106, the 4 o'clock motor 107, and the 12 o'clock motor 108 move in the same XY direction without changing the relative positions, the moving unit 101 moves XY and does not move in the Z direction. At this time, the distance between the center plane motor 105 and the first to third plane motors 106 to 108 does not change. That is, all planes are maintained while the first plane motor 106 is at the 8 o'clock position, the second plane motor 107 is at the 4 o'clock position, and the third plane motor 108 is at the 12 o'clock position with the center plane motor 105 as the center.
- the motor is configured to move XY in the same manner.
- the movement of the moving unit 101 in the Z-axis direction will be described.
- the first Scott Russell link mechanism moves the moving part 101 away from the center plane motor 105 when the 8 o'clock motor 106 is moved closer to the center plane motor 105, and moves the 8 o'clock motor 106 away from the center plane motor 105.
- the moving unit 101 moves so as to approach the center plane motor 105. Thereby, the moving unit 101 can be moved in the Z-axis direction.
- the moving unit 101 can be moved only in the Z-axis direction without moving in the XY direction.
- the moving unit 101 can be moved freely in the XYZ space.
- the second and third Scott Russell link mechanisms are driven in synchronization with the first Scott Russell link mechanism. That is, by moving the center plane motor 105, the 8 o'clock motor 106, the 4 o'clock motor 107, and the 12 o'clock motor 108 in the XY-axis direction, the moving unit 101 can be freely moved in the XYZ space. .
- the length of the first rod 103a (the distance between the first rotation fulcrum 125a and the second rotation fulcrum 126a) is L, and the other end of the first rod 103a is The straight line 90 connecting the second rotation fulcrum 126a and the fourth rotation fulcrum 127a at the other end of the second rod 104a and the longitudinal direction of the first rod 103a (the first rotation fulcrum 125a and the second rotation fulcrum 126a
- the angle ⁇ is changed from ⁇ to ⁇ by setting the center plane motor 105 to a fixed position and moving the 8 o'clock motor 106 closer to or away from the center plane motor 105.
- the input of the movement amount Yz of the 8:00 motor 106 is converted as follows and output as the movement amount Z1 of the moving unit 101 in the Z-axis direction.
- Yz L (cos ⁇ -cos ⁇ )
- Conversion ⁇ Z1 L (sin ⁇ -sin ⁇ )
- the movement amount Z1 of the moving unit 101 is larger than the movement amount Yz of the 8 o'clock motor 106, which is desirable for the bonding apparatus.
- the movement amount Z1 is 4.51 times the movement amount Yz.
- the drive mechanism has a control unit (not shown), and the above-described drive of each of the 8 o'clock motor 106, the 4 o'clock motor 107, the 12 o'clock motor 108 and the center plane motor 105 is controlled by this control unit.
- the drive mechanism is implemented using three Scott Russell link mechanisms.
- the drive mechanism can be implemented if at least one Scott Russell link mechanism is provided. It is.
- the first rods 103a1 and 103a2 may be parallel links, and the other configurations are the same as in this embodiment.
- a parallel link is not required.
- a drive mechanism for freely moving the moving unit 101 in the XYZ space can be manufactured by combining a planar motor and a Scott Russell link mechanism. Therefore, it is possible to realize a drive mechanism that is advantageous for high acceleration / deceleration by reducing the load.
- the Z motor that was a load is not required for the X linear motor 17 shown in FIG. 10, the load balance is optimized, and high acceleration / deceleration is possible. Further, since the drive mechanism according to the present embodiment does not require the X-axis cross roller guide 4 and the Y-axis cross roller guide 12 shown in FIG. 10, the load mass of XY can be reduced and high acceleration / deceleration can be achieved.
- the first plane motor 106 is at the 8 o'clock position
- the second plane motor 107 is at the 4 o'clock position
- the third plane motor 108 is at the 12 o'clock position with the center plane motor 105 as the center.
- the reaction force applied to the center plane motor cancels out, The sum of the reaction force vectors is reduced, and the occurrence of vibration due to the reaction force can be suppressed.
- the center plane motor 105 when the moving unit 101 is moved in the Z direction, when the 8 o'clock motor 106 approaches the center plane motor 105 due to the thrust of the 8 o'clock motor 106, the center plane motor 105 The reaction force is applied in the same direction as the thrust of the 8 o'clock motor 106. In order to keep the center plane motor 105 from moving due to the reaction force, a slightly smaller thrust opposite to the thrust of the 8 o'clock motor 106 is generated in the center plane motor 105 as a reaction force against the reaction force applied to the center plane motor 105. You can do it.
- the 8 o'clock motor 106 receives a reaction force in the same direction as the thrust (resistance force) of the center plane motor 105.
- the direction of these two reaction forces is parallel to the XY plane 200 and opposite to each other, the vibration generated thereby is the same as the product of the mass of the movable part (8 o'clock motor) and acceleration, and there is no particular merit.
- the first plane motor is centered on the center plane motor and the second plane is moved to the 6 o'clock position.
- the flat motor should be placed at the 12 o'clock position.
- the first plane motor is at the 3 o'clock position
- the second plane motor is at the 6 o'clock position
- the center plane motor is the center. It is preferable to arrange the 3 plane motor at the 9 o'clock position and the fourth plane motor at the 12 o'clock position.
- a drive mechanism using five or more Scott-Russell link mechanisms should be arranged in a balanced manner.
- the thrust in the Z-axis direction of the moving unit 101 can be divided into three by the first to third planar motors, the load per one planar motor is reduced, and high acceleration / deceleration can be achieved. If four planar motors are used, it can be divided into four, and the load per one planar motor can be further reduced.
- the resonance frequency is likely to increase.
- a drive mechanism that moves the moving unit 101 in the XYZ-axis space by combining four planar motors and three Scott Russell link mechanisms is used.
- the present invention is limited to four planar motors.
- a moving mechanism other than a planar motor can be used as long as it is a moving mechanism that moves on a plane.
- a driving mechanism according to the following modification can also be used.
- FIG. 3 is a schematic view showing a modification of the drive mechanism shown in FIG. 4 is a plan view of the drive mechanism shown in FIG. 3 and 4, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.
- the drive mechanism of this modification can move the moving unit 101 in the XYZ axis space by combining four XY tables and three Scott Russell link mechanisms.
- a known small XY table may be used for the four XY tables.
- a first XY table (hereinafter also referred to as “8 o'clock table”) 1106 shown in FIGS. 3 and 4 is used instead of the first planar motor 106 shown in FIGS. 1 and FIG. 2 is used instead of the second planar motor 107 shown in FIG. 1 and FIG. 2 and a second XY table (hereinafter also referred to as “4-hour table”) 1107 shown in FIG. 3 and FIG.
- a third XY table (hereinafter also referred to as “12 o'clock table”) 1108 shown in FIGS. 3 and 4 is used instead of the third flat motor 108, and the center flat motor 105 shown in FIGS. 1 and 2 is used instead.
- the center XY table 1105 shown in FIGS. 3 and 4 is used.
- the 8 o'clock table 1106 has an 8 o'clock X table 1106a and an 8 o'clock Y table 1106b, the 8 o'clock X table 1106a is attached to the 8 o'clock Y plate 1116b, and the 8 o'clock Y plate 1116b is the 8 o'clock Y table.
- the second rotation fulcrum 126a is attached to the 8 o'clock X plate 1116a, and the 8 o'clock X plate 1116a is configured to be movable in the X direction of the 8 o'clock X table 1106a. .
- the 8 o'clock X plate 1116a can move on the same XY plane as the XY plane 200 shown in FIG.
- the 4 o'clock table 1107 includes a 4 o'clock X table 1107a and a 4 o'clock Y table 1107b.
- the 4 o'clock X table 1107a is attached to the 4 o'clock Y plate 1117b, and the 4 o'clock Y plate 1117b is the Y axis of the 4 o'clock Y table 1107b.
- the sixth rotation fulcrum 126b is attached to the 4 o'clock X plate 1117a, and the 4 o'clock X plate 1117a is configured to be movable in the X direction of the 4 o'clock X table 1107a.
- the 4 o'clock X plate 1117a can move on the same XY plane as the XY plane 200 shown in FIG.
- the 12 o'clock table 1108 includes a 12 o'clock X table 1108a and a 12 o'clock Y table 1108b.
- the 12 o'clock X table 1108a is attached to the 12 o'clock Y plate 1118b, and the 12 o'clock Y plate 1118b is the Y axis of the 12 o'clock Y table 1108b.
- the tenth rotation fulcrum 126c is attached to the 12 o'clock X plate 1118a, and the 12 o'clock X plate 1118a is configured to be movable in the X direction of the 12 o'clock X table 1108a.
- the 12 o'clock X plate 1118a can move on the same XY plane as the XY plane 200 shown in FIG.
- the center XY table 1105 includes a center X table 1105a and a center Y table 1105b.
- the center X table 1105a is attached to the center Y plate 1115b, and the center Y plate 1115b is configured to be movable in the Y-axis direction of the center Y table 1105b.
- the fixed portion 102 to which the fourth rotation fulcrum 127a, the eighth rotation fulcrum 127b, and the twelfth rotation fulcrum 127c are attached is attached to the center X plate 1115a, and the center X plate 1115a is in the X direction of the center X table 1105a. It is configured to be movable. Thus, the center X plate 1115a can move on the same XY plane as the XY plane 200 shown in FIG.
- the 8 o'clock X plate 1116a, the 4 o'clock X plate 1117a, the 12 o'clock X plate 1118a, and the center X plate 1115a move on the same XY plane as the XY plane 200 shown in FIG. Yes.
- FIG. 5 is a perspective view schematically showing a bonding apparatus according to an aspect of the present invention.
- the same parts as those in FIG. 1 are denoted by the same reference numerals, and description of the same parts is omitted.
- the bonding apparatus shown in FIG. 5 has the drive mechanism shown in FIG. 1 mounted with a bonding mechanism necessary for a bonder such as a capillary, an ultrasonic horn, a clamp, a lens, and a spark rod.
- a bonder such as a capillary, an ultrasonic horn, a clamp, a lens, and a spark rod.
- an ultrasonic horn and a capillary 150 are mounted on the moving unit 101, a spark rod, a lens 151, and a gold wire supply system (not shown) are mounted on the fixed unit 102, and other parts necessary for the bonder (see FIG. (Not shown) is also mounted on the drive mechanism.
- a wire is supplied to the capillary 150, a ball is formed at the tip of the wire drawn out from the capillary, and the ball is moved by the capillary to the first bonding point by a driving mechanism. At that time, ultrasonic vibration is applied to the ball by an ultrasonic horn. While applying pressure from the capillary to the ball, the wire is bonded to the 1st bonding point, and then the capillary is moved to the 2nd bonding point by a drive mechanism, and at that time, the ultrasonic horn is applied to the wire while applying ultrasonic vibration to the capillary. To apply a pressure to the 2nd bonding point.
- the “bonding mechanism” includes a mechanism for bonding a pad of a semiconductor chip and a lead frame with a wire, and a mechanism for forming a bump on a pad of a semiconductor chip, a wiring board, or the like. .
- the driving mechanism shown in FIG. 1 is equipped with a bonding mechanism such as a capillary, the load is reduced and high compared with the driving mechanism of the conventional wire bonding apparatus shown in FIG. A driving mechanism advantageous for acceleration / deceleration can be realized.
- a Z linear encoder (not shown) for detecting the position in the Z-axis direction may be disposed between the moving unit 101 and the fixed unit 102 (for example, in the fixed unit 102).
- FIG. 6 is a perspective view schematically showing a bonding apparatus according to one aspect of the present invention.
- FIG. 7 is a plan view of the bonding apparatus shown in FIG. 6 and 7, the same parts as those in FIG. 5 are denoted by the same reference numerals, and the description of the same parts is omitted.
- the bonding apparatus shown in FIGS. 6 and 7 includes the first linear guide 155 and a third moving mechanism for moving the first linear guide 155, etc., mounted on the bonding apparatus shown in FIG.
- the bonding apparatus includes a first linear guide 155 that guides the center plane motor 105 to move on or along the first straight line on the plane on which the center plane motor 105 moves. And a third moving mechanism for moving the first linear guide 155 on the second straight line on the plane intersecting the first straight line or along the second straight line.
- the first straight line is located in parallel with the first linear guide 155, and the second straight line is orthogonal to the first straight line.
- the third moving mechanism is a mechanism for moving the X constraining block 114, and guides both ends of the X constraining block 114 so as to move on the second straight line or along the second straight line.
- the fixed base 109a and the fixed base 109b having the dedicated L fixed linear guide 110 and the Y dedicated R fixed linear guide 112 are provided, and the X constraining block 114 is moved on or along the second straight line.
- the Y-dedicated R linear motor 116 and the Y-dedicated L linear motor 117 are provided.
- the X constraining block 114 can be moved only in the Y-axis direction by the Y-dedicated L fixed linear guide 110 and the Y-dedicated R fixed linear guide 112 fixed to the fixed bases 109a and 109b.
- the center plane motor 105 can be moved in the X-axis direction by a first linear guide 155 fixed to the X constraining block 114.
- the Y-dedicated R linear motor 116 and the Y-dedicated L linear motor 117 are driven to move the X constraining block 114 in the Y-axis direction in order to cope with the weight of the X constraining block 114, the moving unit 101, the fixed unit, the bonding mechanism, and the like.
- the source the increase in load due to the increase in mass due to the X restraint block 114 can be compensated by the driving force of the Y-dedicated R linear motor 116 and the Y-dedicated L linear motor 117, so that a driving mechanism advantageous for high acceleration / deceleration can be realized. .
- a Y-dedicated L encoder 111 is installed at one end of the X constraint block 114, and a Y-dedicated R encoder 113 is installed at the other end of the X constraint block 114.
- the Y-dedicated L linear motor 117 is controlled by a Y-dedicated L encoder 111
- the Y-dedicated R linear motor 116 is controlled by a Y-dedicated R encoder 113.
- the X-dedicated encoder 115 is installed in the first linear guide 155 of the X constraint block 114.
- the movement of the center plane motor 105 in the X-axis direction is controlled by the X dedicated encoder 115.
- the control unit Based on the angles detected by the first to third angle encoders 118, 119, and 120, the control unit corrects the positional shifts of the 8 o'clock motor 106, the 4 o'clock motor 107, and the 12 o'clock motor 108, respectively. Control by.
- a first strain gauge 121a which is a stress detection sensor
- a second strain gauge 121b which is a stress detection sensor
- Third strain gauges 121c which are stress detection sensors, are installed on both side surfaces of the fifth rod 103c. If the appropriate positional relationship between the 8 o'clock motor 106, the 4 o'clock motor 107, and the 12 o'clock motor 108 is lost, non-uniform stress is applied to both side surfaces of the first to sixth rods, so the first to third strain gauges 121a. , 121b, 121c detect distortion and feed back to the control unit.
- control is performed by the control unit so as to correct the positional deviations of the 8 o'clock motor 106, the 4 o'clock motor 107, and the 12 o'clock motor 108. At that time, it is preferable to control so that the difference between the strains on both sides becomes zero.
- the first to third strain gauges 121a, 121b, and 121c are installed on both side surfaces of the first rod 103a, the third rod 103b, and the fifth rod 103c.
- the third strain gauges 121a, 121b, and 121c may be installed on both side surfaces of the second rod 104a, the fourth rod 104b, and the sixth rod 104c, and the strain of these rods may be detected.
- FIG. 8 is a plan view schematically showing a bonding apparatus according to an aspect of the present invention.
- the same parts as those in FIGS. 6 and 7 are denoted by the same reference numerals, and the description of the same parts is omitted.
- the bonding apparatus shown in FIG. 8 is obtained by mounting second to fourth linear guides 122, 123, and 124 on the bonding apparatus shown in FIGS.
- a second linear guide 122 that guides the 8 o'clock motor 106 to move on a third straight line connecting the center plane motor 105 and the 8 o'clock motor 106 is installed in the X restraint block 114, and the center A third linear guide 123 for guiding the 4 o'clock motor 107 to move on the fourth straight line connecting the plane motor 105 and the 4 o'clock motor 107 is installed, and the center plane motor 105 and the 12 o'clock motor 108 are connected to each other.
- a fourth linear guide 124 is installed for guiding the 10:00 motor 107 to move on the straight line 5.
- Each of the third straight line, the fourth straight line, and the fifth straight line is located on a plane on which the center plane motor 105 moves.
- Each of the second to fourth linear guides 122, 123, and 124 is guided by the first linear guide 155 so as to move on the first straight line or along the first straight line. That is, each of the second to fourth linear guides 122, 123, and 124 is connected to the center plane motor 105 (or the fixed portion 102) and moves in the X direction and the Y direction together with the center plane motor 105. It is configured as follows. With the first to fifth linear guides 155, 122, 123, 124, the center plane motor 105 is centered on the first plane motor 106 at the 8 o'clock position, the second plane motor 107 is at the 4 o'clock position, The flat motor 108 can reliably maintain the 12 o'clock position.
- a manufacturing apparatus includes the drive mechanism described in any of the first to fourth embodiments mounted on a manufacturing apparatus other than the bonding apparatus.
- the first to fifth embodiments described above may be implemented in combination with each other.
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Abstract
Description
このワイヤボンディング装置はXYZ軸が3層構造になっている。1層目2には固定ベース3が配置されており、固定ベース3にはX軸クロスローラーガイド4が設けられている。X軸モーター部15にはXリニアモーター17が配置されている。Xリニアモーター17によってX軸クロスローラーガイド4上で下部移動板6をX軸方向に移動させるようになっている。2層目にはY軸クロスローラーガイド12が配置されており、Yリニアモーター42によってY軸クロスローラーガイド12上で上部移動体10をY軸方向に移動させるようになっている。
[1]第1のロッド、第2のロッド、平面上を移動する第1の移動機構、前記平面上を移動するセンター移動機構及び移動部を有する駆動機構であり、前記第1のロッドの一端は前記移動部と第1の回転支点により回転可能に接続され、前記第1のロッドの他端は前記第1の移動機構と第2の回転支点により回転可能に接続され、前記第2のロッドの一端は前記第1のロッドに設けられた第3の回転支点により回転可能に接続され、前記第2のロッドの他端は前記センター移動機構と第4の回転支点により回転可能に接続され、前記第1の移動機構を前記センター移動機構に近づけると前記移動部が前記センター移動機構から遠ざかるように移動し、前記第1の移動機構を前記センター移動機構から遠ざけると前記移動部が前記センター移動機構に近づくように移動することを特徴とする駆動機構。
図1は、本発明の一態様に係る駆動機構を示す模式図である。図2は、図1に示す駆動機構の平面図である。
図1及び図2に示す駆動機構は、第1の平面モーター(以下、「8時モーター」ともいう。)106、第2の平面モーター(以下、「4時モーター」ともいう。)107、第3の平面モーター(以下、「12時モーター」ともいう。)108及びセンター平面モーター105を有し、これらの平面モーターは同一平面上(XY平面200上)を移動するようになっている。
センター平面モーター105と8時モーター106と4時モーター107と12時モーター108の相対位置を変えずに全てが同じようにXY移動すると移動部101はXY移動し、Z方向へは移動しない。この際、センター平面モーター105と第1~第3の平面モーター106~108それぞれとの距離は変わらない。つまり、センター平面モーター105を中心として第1の平面モーター106が8時の位置、第2の平面モーター107が4時の位置、第3の平面モーター108が12時の位置を保ちながら全ての平面モーターが同じようにXY移動するように構成されている。
第1のスコット・ラッセルのリンク機構は、8時モーター106をセンター平面モーター105に近づけると移動部101がセンター平面モーター105から遠ざかるように移動し、8時モーター106をセンター平面モーター105から遠ざけると移動部101がセンター平面モーター105に近づくように移動するようになっている。これにより、移動部101をZ軸方向に移動させることができる。このような駆動をセンター平面モーター105の位置を固定した状態で行うと、移動部101をXY方向へ移動させずにZ軸方向にだけ移動させることができ、このような駆動をセンター平面モーター105及び8時モーター106の距離を変えつつXY方向に移動させながら行うと、移動部101をXYZの空間を自在に移動させることができる。
第1のスコット・ラッセルのリンク機構において、第1のロッド103aの長さ(第1の回転支点125aと第2の回転支点126aとの距離)をLとし、第1のロッド103aの他端の第2の回転支点126aと第2のロッド104aの他端の第4の回転支点127aとを結ぶ直線90と第1のロッド103aの長手方向(第1の回転支点125aと第2の回転支点126aとを結ぶ直線)とで作る角度をθとしたときに、センター平面モーター105を固定位置とし、8時モーター106をセンター平面モーター105に近づけるか、または遠ざけることにより角度θをαからβに変えた場合、8時モーター106の移動量Yzの入力が下記のように変換されて移動部101のZ軸方向の移動量Z1として出力される。
Yz=L(cosβ-cosα)⇒変換⇒Z1=L(sinβ-sinα)
図3は、図1に示す駆動機構の変形例を示す模式図である。図4は、図3に示す駆動機構の平面図である。図3及び図4において図1及び図2と同一部分には同一符号を付す。
4時テーブル1107は、4時Xテーブル1107a及び4時Yテーブル1107bを有し、4時Xテーブル1107aは4時Yプレート1117bに取り付けられ、4時Yプレート1117bは4時Yテーブル1107bのY軸方向に移動可能に構成され、第6の回転支点126bは4時Xプレート1117aに取り付けられ、4時Xプレート1117aは4時Xテーブル1107aのX方向に移動可能に構成されている。これにより、4時Xプレート1117aは図1に示すXY平面200と同一のXY平面上を移動できるようになっている。
12時テーブル1108は、12時Xテーブル1108a及び12時Yテーブル1108bを有し、12時Xテーブル1108aは12時Yプレート1118bに取り付けられ、12時Yプレート1118bは12時Yテーブル1108bのY軸方向に移動可能に構成され、第10の回転支点126cは12時Xプレート1118aに取り付けられ、12時Xプレート1118aは12時Xテーブル1108aのX方向に移動可能に構成されている。これにより、12時Xプレート1118aは図1に示すXY平面200と同一のXY平面上を移動できるようになっている。
センターXYテーブル1105は、センターXテーブル1105a及びセンターYテーブル1105bを有し、センターXテーブル1105aはセンターYプレート1115bに取り付けられ、センターYプレート1115bはセンターYテーブル1105bのY軸方向に移動可能に構成され、第4の回転支点127aと第8の回転支点127bと第12の回転支点127cが取り付けられた固定部102はセンターXプレート1115aに取り付けられ、センターXプレート1115aはセンターXテーブル1105aのX方向に移動可能に構成されている。これにより、センターXプレート1115aは図1に示すXY平面200と同一のXY平面上を移動できるようになっている。
上記のように8時Xプレート1116a、4時Xプレート1117a、12時Xプレート1118a及びセンターXプレート1115aのそれぞれは、図1に示すXY平面200と同一のXY平面上を移動するようになっている。
図5は、本発明の一態様に係るボンディング装置を模式的に示す斜視図であり、図1と同一部分には同一符号を付し、同一部分の説明は省略する。
キャピラリ150にワイヤを供給し、キャピラリから繰り出されたワイヤの先端にボールを形成し、キャピラリによってボールを駆動機構で1stボンディング点に移動させ、その際、超音波ホーンによってボールに超音波振動を加えつつキャピラリからボールに圧力を加えることで、1stボンディング点にワイヤを接合し、その後、キャピラリを2ndボンディング点に駆動機構で移動させ、その際、超音波ホーンによってワイヤに超音波振動を加えつつキャピラリから圧力を加えることで、2ndボンディング点にワイヤを接合する。
図6は、本発明の一態様に係るボンディング装置を模式的に示す斜視図である。図7は、図6に示すボンディング装置の平面図である。図6及び図7において、図5と同一部分には同一符号を付し、同一部分の説明は省略する。
そこで、8時モーター106の下に第1の角度エンコーダー118を設置し、4時モーター107の下に第2の角度エンコーダー119を設置し、12時モーター108の下に第3の角度エンコーダー120を設置する。これにより、第1のロッド103a、第2のロッド104a、第3のロッド103bそれぞれの角度を検出し、制御部にフィードバックする。そして、第1~第3の角度エンコーダー118,119,120それぞれで検出した前記角度に基づいて、8時モーター106、4時モーター107及び12時モーター108それぞれの位置ずれを修正するように制御部によって制御する。
図8は、本発明の一態様に係るボンディング装置を模式的に示す平面図であり、図6及び図7と同一部分には同一符号を付し、同一部分の説明は省略する。
本発明の一態様に係る製造装置は、第1~第4の実施形態のいずれかに記載した駆動機構をボンディング装置以外の製造装置に搭載したものである。
101…移動部
102…固定部
103a…第1のロッド
103b…第3のロッド
103c…第5のロッド
104a…第2のロッド
104b…第4のロッド
104c…第6のロッド
105…センター平面モーター
106…第1の平面モーター(8時モーター)
107…第2の平面モーター(4時モーター)
108…第3の平面モーター(12時モーター)
109a,109b…固定ベース
110…Y専用L固定リニアガイド
111…Y専用Lエンコーダー
112…Y専用R固定リニアガイド
113…Y専用Rエンコーダー
114…X拘束ブロック
115…X専用エンコーダー
116…Y専用Rリニアモーター
117…Y専用Lリニアモーター
118…第1の角度エンコーダー
119…第2の角度エンコーダー
120…第3の角度エンコーダー
121a…第1のストレインゲージ
121b…第2のストレインゲージ
121c…第3のストレインゲージ
122…第2のリニアガイド
123…第3のリニアガイド
124…第4のリニアガイド
125a…第1の回転支点
125b…第5の回転支点
125c…第9の回転支点
126a…第2の回転支点
126b…第6の回転支点
126c…第10の回転支点
127a…第4の回転支点
127b…第8の回転支点
127c…第12の回転支点
128a…第3の回転支点
128b…第7の回転支点
128c…第11の回転支点
150…超音波ホーン及びキャピラリ
151…スパークロッド及びレンズ
155…第1のリニアガイド
200…XY平面
1105…センターXYテーブル
1105a…センターXテーブル
1105b…センターYテーブル
1106…第1のXYテーブル(8時テーブル)
1106a…8時Xテーブル
1106b…8時Yテーブル
1107…第2のXYテーブル(4時テーブル)
1107a…4時Xテーブル
1107b…4時Yテーブル
1108…第3のXYテーブル(12時テーブル)
1108a…12時Xテーブル
1108b…12時Yテーブル
1115a…センターXプレート
1115b…センターYプレート
1116a…8時Xプレート
1116b…8時Yプレート
1117a…4時Xプレート
1117b…4時Yプレート
1118a…12時Xプレート
1118b…12時Yプレート
Claims (10)
- 第1のロッド、第2のロッド、平面上を移動する第1の移動機構、前記平面上を移動するセンター移動機構及び移動部を有する駆動機構であり、
前記第1のロッドの一端は前記移動部と第1の回転支点により回転可能に接続され、
前記第1のロッドの他端は前記第1の移動機構と第2の回転支点により回転可能に接続され、
前記第2のロッドの一端は前記第1のロッドに設けられた第3の回転支点により回転可能に接続され、
前記第2のロッドの他端は前記センター移動機構と第4の回転支点により回転可能に接続され、
前記第1の移動機構を前記センター移動機構に近づけると前記移動部が前記センター移動機構から遠ざかるように移動し、
前記第1の移動機構を前記センター移動機構から遠ざけると前記移動部が前記センター移動機構に近づくように移動することを特徴とする駆動機構。 - 請求項1において、
第3のロッド、第4のロッド及び前記平面上を移動する第2の移動機構を有し、
前記第3のロッドの一端は前記移動部と第5の回転支点により回転可能に接続され、
前記第3のロッドの他端は前記第2の移動機構と第6の回転支点により回転可能に接続され、
前記第4のロッドの一端は前記第3のロッドに設けられた第7の回転支点により回転可能に接続され、
前記第4のロッドの他端は前記センター移動機構と第8の回転支点により回転可能に接続され、
前記第2の移動機構を前記センター移動機構に近づけると前記移動部が前記センター移動機構から遠ざかるように移動し、
前記第2の移動機構を前記センター移動機構から遠ざけると前記移動部が前記センター移動機構に近づくように移動することを特徴とする駆動機構。 - 請求項1において、
前記センター移動機構を、前記平面上の第1の直線上で移動するようにガイドする第1のリニアガイドと、
前記第1のリニアガイドを、前記第1の直線と交差する前記平面上の第2の直線に沿って移動させる第3の移動機構と、
を具備することを特徴とする駆動機構。 - 請求項3において、
前記第3の移動機構は、
前記第1のリニアガイドの両端を、前記第2の直線上で移動するようにガイドする固定リニアガイドと、
前記第1のリニアガイドを前記第2の直線上で移動させるリニアモーターと、
を有することを特徴とする駆動機構。 - 請求項3または4において、
前記第1の移動機構を、前記センター移動機構と前記第1の移動機構を結ぶ前記平面上の第3の直線上で移動するようにガイドする第2のリニアガイドを有し、
前記第2のリニアガイドは、前記第1のリニアガイドによって前記第1の直線に沿って移動するようにガイドされることを特徴とする駆動機構。 - 請求項1、3乃至4のいずれか一項において、
前記第1のロッドまたは前記第2のロッドの角度を検出する角度エンコーダーと、
前記角度エンコーダーで検出した前記角度に基づいて前記第1の移動機構の位置ずれを修正するように前記第1の平面モーターを制御する制御部と、
を有することを特徴とする駆動機構。 - 請求項1、3乃至6のいずれか一項において、
前記第1のロッドまたは前記第2のロッドの歪を検出する応力検出センサーと、
前記応力検出センサーで検出した前記歪に基づいて前記第1の移動機構の位置ずれを修正するように前記第1の移動機構を制御する制御部と、
を有することを特徴とする駆動機構。 - 請求項1、3乃至7のいずれか一項において、
前記第1の移動機構は、第1の平面モーターまたは第1のXYテーブルであり、
前記センター移動機構は、センター平面モーターまたはセンターXYテーブルであることを特徴とする駆動機構。 - 請求項1、3乃至8のいずれか一項に記載の駆動機構を有することを特徴とする製造装置。
- 請求項9において、
前記移動部に配置されたキャピラリと、
前記キャピラリにワイヤを供給し、ワイヤボンディングを行うボンディング機構と、
を具備することを特徴とする製造装置。
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- 2014-05-30 CN CN201480042434.6A patent/CN105531077B/zh not_active Expired - Fee Related
- 2014-05-30 WO PCT/JP2014/064402 patent/WO2015029527A1/ja active Application Filing
- 2014-05-30 US US14/903,800 patent/US9772012B2/en not_active Expired - Fee Related
- 2014-07-17 TW TW103124530A patent/TWI543282B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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TW201530670A (zh) | 2015-08-01 |
JP2015047667A (ja) | 2015-03-16 |
CN105531077A (zh) | 2016-04-27 |
US9772012B2 (en) | 2017-09-26 |
US20160169355A1 (en) | 2016-06-16 |
CN105531077B (zh) | 2017-08-25 |
TWI543282B (zh) | 2016-07-21 |
KR20150143643A (ko) | 2015-12-23 |
JP5723426B2 (ja) | 2015-05-27 |
KR101795534B1 (ko) | 2017-11-08 |
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