WO2015027884A1 - Led光源模块和包含该模块的led球泡灯 - Google Patents

Led光源模块和包含该模块的led球泡灯 Download PDF

Info

Publication number
WO2015027884A1
WO2015027884A1 PCT/CN2014/085105 CN2014085105W WO2015027884A1 WO 2015027884 A1 WO2015027884 A1 WO 2015027884A1 CN 2014085105 W CN2014085105 W CN 2014085105W WO 2015027884 A1 WO2015027884 A1 WO 2015027884A1
Authority
WO
WIPO (PCT)
Prior art keywords
cap
led
substrates
light source
source module
Prior art date
Application number
PCT/CN2014/085105
Other languages
English (en)
French (fr)
Inventor
赵依军
Original Assignee
Zhao Yijun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhao Yijun filed Critical Zhao Yijun
Publication of WO2015027884A1 publication Critical patent/WO2015027884A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • LED light source module and LED bulb comprising the same
  • the present invention relates to semiconductor lighting technology, and more particularly to an LED light source module that is easy to assemble and an LED bulb including the LED light source module. Background technique
  • LEDs As a new type of light source, light-emitting diodes (LEDs) are widely used in various aspects of lighting because of their energy saving, environmental protection, long life and small size.
  • LED is a solid-state semiconductor device capable of converting electrical energy into visible light. Its basic structure generally includes a leaded support, a semiconductor wafer disposed on the support, and an encapsulating material (such as fluorescent silicone or epoxy) that seals the periphery of the wafer. ).
  • the semiconductor wafer includes a PN structure. When a current passes, electrons are pushed toward the P region. In the P region, electrons and holes recombine, and then energy is emitted in the form of photons, and the wavelength of the light is determined by the material forming the PN structure. .
  • Synjet® a fluidizer
  • Synjet® which internally includes a diaphragm that, when vibrated, generates airflow inside the device and quickly jets through the nozzle to the heat sink. The jetted air moves the surrounding air together to the vicinity of the radiator, thereby carrying away the heat of the radiator with high heat exchange efficiency.
  • SynJet® ejector see, for example, U.S. Patent Application Serial No. 12/288,144, filed on Jan. 16, 2008. This patent application is hereby incorporated by reference in its entirety in its entirety in its entirety in its entirety in its entirety.
  • An object of the present invention is to provide an LED bulb which has the advantages of simple structure and strong heat dissipation capability.
  • a heat sink an upper portion thereof is coupled to the lamp cover and a lower portion is fixed in the lamp cap;
  • LED light source module comprising:
  • a cap member disposed on an upper surface of the heat sink
  • a drive power source is located inside or within the heat sink and is electrically coupled to the LED light source module.
  • the top of the cap member includes a through region
  • the side portion of the cap member includes a through hole, thereby forming a through hole passing through the top and a through hole at the side. Air flow channel.
  • the cap member is surrounded by a plurality of substrates, each of the substrates including at least a portion of the beak, a second portion having a first interface region with the first portion, and a portion
  • the first portion has a third portion of the second interface region, the second portion and the third portion are bent relative to the first portion, and the side portion of the cap member is composed of the first portion, the cap
  • the top of the member is spliced by the second portion, and is fixed together for the adjacent two of the substrates by fitting the front surface of the third portion of the one to the back of the first portion of the other .
  • the first, second and third portions of each of the substrates are integrally formed, and the first and second interface regions are formed with via holes for facilitating bending. fold.
  • the through region is surrounded by the edge of the second portion, and the through hole is opened on the first and third portions.
  • an annular recessed area is formed along an edge of the upper surface of the heat sink to accommodate an opening edge of the lamp army, and an upper surface of the heat sink is opened for fixing the a slot of the first portion of the plurality of substrates and a through hole through which the output line of the driving power source passes.
  • the heat sink is made of ceramic or thermal insulation.
  • the molecular composite is constructed and coated with an infrared radiation material at least on a surface of the heat sink that is exposed to the lampshade and the base.
  • the heat sink is composed of an infrared radiation material.
  • the substrate is an aluminum substrate.
  • the LED units are connected in series, in parallel or in a mixed manner via wirings formed on the surface of the cap member.
  • An object of the present invention is to provide an LED lighting module which has the advantages of simple structure and strong heat dissipation capability.
  • each of the substrates includes at least a first portion and a second portion having a first interface region, the second portion being bent relative to the first portion, the plurality of substrates being fixed together
  • the side portion of the cap member is composed of the first portion, and the top portion of the cap member is formed by splicing the second portion;
  • a plurality of LED units disposed on the substrate.
  • each of the substrates further includes a third portion having a second interface region with the first portion, the third portion being bent relative to the first portion, and The two adjacent substrates are fixed together by fitting the front surface of the third portion of one of them to the back surface of the first portion of the other.
  • the first, second and third portions of each of the substrates are integrally formed, and the first and second interface regions are formed with via holes for facilitating bending .
  • a through region surrounded by the second portion edge is formed in a center of the top portion, and the plurality of substrates are The through holes are formed in the first and third portions to form an air flow passage through the through portion of the top portion and the through hole at the side portion.
  • the LED units located on the same substrate and different substrates are connected in series.
  • Figure 1 is an exploded perspective view of an LED bulb according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of the LED bulb shown in FIG. 1.
  • 3A and 3B are schematic views of the LED light source module in the LED bulb shown in Fig. 1, which respectively show the top and bottom of the LED light source module.
  • FIGS. 3A and 3B are views showing a single substrate for the LED light source module shown in Figs. 3A and 3B, respectively, in a flat state and a bent state. detailed description
  • semiconductor wafer refers to a plurality of individual single circuits formed on a semiconductor material (eg, silicon, gallium arsenide, etc.), “semiconductor wafer” or “die”, unless otherwise specified. “refers to such a single circuit, and “packaged chip” refers to the physical structure of a semiconductor wafer after being packaged. In a typical such physical structure, the semiconductor wafer is mounted, for example, on a support and encapsulated with a sealing material.
  • semiconductor material eg, silicon, gallium arsenide, etc.
  • LED unit refers to a unit comprising an electroluminescent material, examples of which include, but are not limited to, P-N junction inorganic semiconductor LEDs and organic LEDs (OLED and polymer LEDs (PLED)).
  • the P-N junction inorganic semiconductor LEDs can have different structural forms including, for example, but not limited to, LED dies and LED cells.
  • LED die refers to a semiconductor wafer having a PN structure and having electroluminescence capability
  • LED monomer refers to a physical structure formed by encapsulating a die, in a typical such physics In the structure, the die is mounted, for example, on a bracket and encapsulated with a sealing material.
  • wiring refers to conductive patterns disposed on an insulating surface for electrical connection between components, including but not limited to traces and holes (eg pads, Component holes, fastening holes, metallized holes, etc.).
  • traces and holes eg pads, Component holes, fastening holes, metallized holes, etc.
  • thermo radiation refers to the phenomenon that an object radiates electromagnetic waves due to its temperature.
  • thermal conduction refers to the way heat is transferred from a higher temperature part to a lower temperature part in a solid.
  • thermal convection refers to the flow of heat through a medium, which is transmitted from one place in space. The phenomenon to another place.
  • ceramic material generally refers to non-metallic inorganic materials that require high temperature treatment or densification, including but not limited to silicates, oxides, carbides, nitrides, sulfides, borides, and the like.
  • thermally conductive insulating polymer composite material refers to a polymer material which has a high thermal conductivity by forming a thermally conductive network chain inside a metal or inorganic filler filled with a high thermal conductivity.
  • the thermally conductive insulating polymer composite material includes, for example, but not limited to, a polypropylene material to which alumina is added, a polycarbonate to which alumina, silicon carbide, and cerium oxide are added, and an acrylonitrile-butadiene-styrene terpolymer.
  • thermally insulating polymer composites can be found in Li Li et al., "Study of the polycarbonate and polycarbonate alloy thermally insulating polymer material” ( “Heat Treatment of Materials” August 2007, Vol. 28, No.4, pp51-54) and Li Bing et al., “Application of Alumina in Thermal Conductive Insulating Polymer Composites”("PlasticAdditives", 2008, No. 3, ppl4-16), The manner in which the full text is cited is included in this specification.
  • infrared radiation material refers to a material that is engineered to absorb heat and emit a large amount of infrared light, which has a high emissivity.
  • examples of the infrared radiation material include, but are not limited to, graphite and a room temperature infrared ceramic radiation material.
  • the room temperature infrared ceramic radiation material includes, for example but not limited to, at least one of the following materials: magnesium oxide, aluminum oxide, calcium oxide, titanium oxide, silicon oxide, chromium oxide, iron oxide, manganese oxide, zirconium oxide, cerium oxide.
  • cordierite, mullite boron carbide, silicon carbide, titanium carbide, molybdenum carbide, niobium carbide, zirconium carbide, niobium carbide, boron nitride, aluminum nitride, silicon nitride, zirconium nitride, titanium nitride, silicidation Titanium, molybdenum silicide, tungsten silicide, titanium boride, zirconium boride and chromium boride.
  • Electrodes and “coupling” are to be understood to include situations in which electrical energy or electrical signals are transmitted directly between two units, or in the case of indirect transmission of electrical or electrical signals via one or more third units.
  • Drive Power or “LED Drive Power” means an “electronic control device” between an alternating current (AC) or direct current (DC) power source connected to the outside of the luminaire and an LED as a light source to provide the LEDs with the required Current or voltage (eg constant current, constant current) Pressure or constant power, etc.).
  • AC alternating current
  • DC direct current
  • LED as a light source to provide the LEDs with the required Current or voltage (eg constant current, constant current) Pressure or constant power, etc.).
  • One or more components in the drive power source are implemented in the form of a wafer or packaged chip, and the components in the form of a wafer or packaged chip in the drive power source are hereinafter referred to as "drive controllers”.
  • the driving power source can be implemented in a modular structure, for example, comprising a printed circuit board and one or more components disposed on the printed circuit board and electrically connected together by wiring, examples of which include However, it is not limited to LED driver controller chips, rectifier chips, resistors, capacitors, diodes, transistors, and turns.
  • circuits for implementing other functions such as a dimming control circuit, a sensing circuit, a power factor correction circuit, an intelligent lighting control circuit, a communication circuit, and a protection circuit, may also be integrated in the driving power source.
  • circuits may be integrated in the same semiconductor wafer or packaged chip as the drive controller, or these circuits may be provided separately in the form of semiconductor wafers or packaged chips, or some or all of these circuits may be combined together and on a semiconductor wafer or Available in the form of a packaged chip.
  • object A is placed on object B
  • object B should be broadly understood to mean that object A is placed directly on the surface of object B, or that object A is placed on the surface of other objects that are in contact with object B.
  • Figure 1 is an exploded perspective view of an LED bulb according to an embodiment of the present invention.
  • 2 is a schematic cross-sectional view of the LED bulb shown in FIG. 1.
  • the LED bulb 1 mainly includes a lamp army 10, a lamp cap 20, a heat sink 30, an LED light source module 40, and a driving power source 50.
  • the lampshade 10 can be made of a transparent or translucent material (such as glass or plastic), and the inner or outer surface can be sanded in order to make the light softer and more evenly diverge toward the space.
  • a layer of infrared radiation material may be formed on the inner/outer surface of the globe 10, for example by electrostatic spraying or vacuum spraying, which enhances on the one hand.
  • the heat dissipation capability of the Light Army 10 is also suppressed Or eliminate the glare effect of the LED.
  • the base 20 provides an interface for the drive power source 50 to be electrically connected to an external power source (e.g., various DC power sources or AC power sources), which may take the form of, for example, a threaded screw interface or a rotary bayonet similar to a conventional incandescent lamp and a power saving lamp.
  • an external power source e.g., various DC power sources or AC power sources
  • the end portion 210 of the cap 20 is made of a conductive material such as metal, and at least a portion of the side wall 220 is made of a metal material, so that the metal material of the end portion 210 and the side wall 220 can be made.
  • the area serves as a first electrode connection region and a second electrode connection region.
  • An insulating portion 230 (e.g., made of an insulating material such as plastic) is located between the end portion 210 and the side wall 220 to separate the two electrode connection regions.
  • a common illumination line generally includes two wires of a live wire and a neutral wire.
  • the end portion 210 and the side wall 220 may serve as the first and second electrode connection regions through the lamp holder in consideration of the safety of use (not drawn The electrodes of the output are connected to the live and neutral wires, respectively.
  • the metal material for the side wall 220 may be a copper-based alloy containing at least one of the following elements: zinc, aluminum, lead, tin, manganese, nickel, iron, and silicon.
  • the use of the above copper-based alloy can improve the corrosion resistance, so that the service life of the lamp cap is matched with the working life of the LED light source, and the above copper-based alloy can also improve the processing performance.
  • the side walls 220 are entirely composed of a metal material. Further, as shown in Figs. 1 and 2, the outer surface of the side wall 220 is provided with a thread.
  • the heat sink 30 is a housing and forms an annular recessed area 311 at the edge of its upper surface 310.
  • the recessed area 311 is adapted to receive the open rim of the lamp cover 10, so that the lamp body 10 can be secured to the upper surface 310 of the heat sink 30, for example by means of an adhesive.
  • the opening of the lamp 10 can be set slightly larger than the outer periphery of the upper portion of the heat sink 30, so that the heat sink 30 can be fixed to the opening of the lamp cover 10, for example, by means of an adhesive.
  • a through hole 312 is formed in the center of the upper surface of the heat sink 30, and a plurality of slots 313 are formed around the through hole 312.
  • the LED light source module 40 includes a cap member 410 having a plurality of protrusions at its lower end, so that the LED light source module 40 can be disposed on the heat sink 30 by fixing the protrusions in the slots 313.
  • the LED light source module 40 can be bonded to the upper surface 310 of the heat sink 30 with a thermal paste.
  • the lower portion 320 of the heat sink 30 extends into the base 20 and the end abuts against the printed circuit board 510 of the drive power source 50, which can be secured to the base, for example, by means of an adhesive such as glue or epoxy. 20 inside.
  • the central portion 330 of the heat sink 30 is located between the lamp cover 10 and the lamp cap 20 and exposed to the outside of the LED bulb, and a plurality of ribs 331 are disposed on the surface thereof. Increase the heat dissipation area.
  • the heat sink 30 may be entirely composed of an insulating heat conductive material (for example, ceramic or thermally conductive insulating polymer composite material), but it is also feasible and beneficial to only partially form an insulating heat conductive material (for example, when a small amount of insulating heat conductive material is used, heat conduction can be satisfied. When it comes to the demand outside the LED bulb or when it is necessary to reduce the material cost).
  • the entire outer surface of the heat sink 30 may be covered with an infrared radiant material (e.g., a normal temperature infrared ceramic radiant material such as silicon carbide).
  • an infrared radiant material e.g., a normal temperature infrared ceramic radiant material such as silicon carbide.
  • the heat sink 30 may all be composed of an infrared radiation material, or alternatively, the heat sink 30 may be composed only of a portion of the infrared radiation material.
  • 3A and 3B are schematic views of the LED light source module in the LED bulb shown in Fig. 1, which respectively show the top and bottom of the LED light source module.
  • the LED light source module 40 includes a cap member 410 having a plurality of LED units 420 disposed thereon and a wiring 430 electrically coupling the LED units together. It should be noted that, for the sake of convenience of illustration, all the LED units in the drawings are not labeled here, but such a short labeling does not cause incomprehension or misunderstanding for those skilled in the art. Similarly, similar reference numerals have been adopted for the LED unit, the substrate, the wiring, the through holes, and the like shown in the drawings.
  • the cap member 410 is preferably made of a printed circuit board material such as an aluminum substrate, but an insulating heat conductive material (for example, a ceramic material or a thermally conductive insulating polymer composite material) or an infrared radiation material having both insulating and heat conducting properties may be used ( Made of, for example, silicon carbide.
  • an insulating heat conductive material for example, a ceramic material or a thermally conductive insulating polymer composite material
  • an infrared radiation material having both insulating and heat conducting properties may be used ( Made of, for example, silicon carbide.
  • the top of the cap member 410 includes a through region 411 and one or more through holes 412 are defined in a lower portion of the side surface of the cap member 410.
  • the LED bulb 1 When the LED bulb 1 is in operation, the heat generated by the LED unit 420 mounted on the top and side of the cap causes a thermal gradient to form between the top and the lower side.
  • the LED bulb 1 In actual use, the LED bulb 1 is generally inverted (ie, the base 20 is on and the cover 10 is below), which causes the position of the through region 411 to be lower than the position of the through hole 412, thus entering the cap from the through region 411.
  • the flowing medium for example, air or inert gas
  • the flowing medium inside the member is heated and then raised to the periphery of the through hole 412, and then flows out through the through hole 412 to the cap member and again flows into the cap member through the through region 411, thereby forming a circulating flow of the medium.
  • the heat generated by the LED unit 420 is transmitted to the lamp leather 10 by means of thermal convection, in addition to being transferred to the heat sink 30 via the cap member 410 by means of heat conduction, which greatly improves the LED bulb lamp. Overall heat dissipation.
  • the lower end of the cap member is provided with a plurality of projections 413 which are insertable into the slots 313 formed on the upper surface of the heat sink 30 to fix the cap member to the heat sink.
  • the LED unit 420 disposed on the surface of the cap member 410 is in the form of a die, and the LED die can be electrically connected to the wiring by a flip chip on board (FCOB) process.
  • FCOB flip chip on board
  • the LED units 420 can be connected together in series, in parallel, or in a hybrid by forming suitable wiring on the surface of the cap member.
  • the LED unit 420 can also be in the form of an LED unit, in which case the LED unit can be electrically connected to the wiring by soldering. If it is necessary to adjust the light-emitting wavelength of the LED unit 420, a phosphor layer or a phosphor-mixed epoxy or silica gel may be applied to the surface of the LED unit 420.
  • cap member shown in Figs. 3A and 3B may be an integrally formed member, in the present embodiment, it is assembled from a plurality of substrates.
  • 4A and 4B are schematic views showing a single substrate for the LED light source module shown in Figs. 3A and 3B, respectively, in a flat state and a bent state.
  • the substrate 410A includes an integrally formed first portion 410A-1, a second portion 410A-2, and a third portion 410A-3, the surfaces of which are formed with wiring 430.
  • the first portion 410A-1 is adjacent to the second portion 410A-2 and the third portion 410A-3 via the junction regions 410A-4 and 410A-5 (the area indicated by the chain line in the figure), respectively.
  • Via holes 414 are formed in the 410A-4 and 410A-5 to facilitate bending.
  • a plurality of through holes 412-1, 412-2, 412-3, and 412-4 are formed in the lower portion of the first and third portions 410A-1, 410A-3, which provide the above The channel through which the medium circulates.
  • the lower end of the substrate 410A is formed with a protrusion 413 so as to be fixed in the slot 313 on the upper surface 310.
  • the wiring 430 extends to the surface of the protrusion 413, so that the electrical connection of the driving power source 50 to the wiring 430 can be realized by inserting the output lead of the driving power source 50 into the slot 313 on the upper surface 310 of the heat sink.
  • the output lead of the driving power source 50 may also be connected to the wiring 430 through the through hole 312 on the upper surface 310 of the heat sink and the through holes 412-3 and 412-4 of the substrate 410A.
  • the wiring connected between the first and second portions 410A-1, 410A-2 and between the first and third portions 410A-1, 410A-3 is a metal foil which may be bonded, soldered or It is fixed to the substrate 410A by means of embedding or the like.
  • the LED unit 420 is disposed on the surface of the substrate 410A using, for example, a FCOB process and And electrically connected to the wiring 430. Subsequently, the second portion 410A-2 and the third portion 410A-3 are bent along the boundary regions 410A-4 and 410A-5, respectively, to form a state as shown in FIG. 4B. In the present embodiment, four substrates as shown in Fig. 4B are assembled into LED light source modules of the cap members as shown in Figs. 3A and 3B.
  • the top of the cap member 410 is formed by splicing the second portions of the substrates 410A, 410B, 410C and 410D, wherein the front edge of the second portion encloses the through region 411; on the other hand, the substrate 410A
  • the first and third portions of 410B, 410C, and 410D form the sides of the cap member 410.
  • the front surface of the third portion 410A-3 of the substrate 410A is bonded to the back surface of the first portion 410B-1 of the substrate 410B, thereby fixing the two substrates. Together.
  • a similar manner of attachment is also employed for adjacent pairs of substrates 410B and 410C, 410C and 410D, and 410D and 410A.
  • the wiring on the first portion 410A-1 of the substrate 410A extends to the third portion 410A-3, as described above
  • the front surface of the third portion 410A-3 of the substrate 410A is bonded to the back surface of the first portion 410B-1 of the substrate 410B by the wiring on the third portion of the substrate 410A and the first portion 410B-1 of the substrate 410B.
  • the wiring is connected to enable electrical connection between the LED units on the two substrates (for example, in series connection).
  • the adjacent pair of substrates 410B and 410C, 410C and 410D and the LED units on 410D and 410A can also be electrically connected together.
  • the electrical connection with the driving power source 50 can be realized in the following manner: one of the output leads of the driving power source 50 is inserted into the slot in which the protrusion of the first portion of the substrate 410A is located, The input line is connected to the wiring on the first partial protrusion, and on the other hand, the other output lead of the driving power source 50 is inserted into the slot in which the protrusion of the third portion of the substrate 410D is located, so that the input line and the third The wiring on some of the protrusions is connected.
  • the driving power source 50 can supply a suitable current or voltage to the LED light source module 40 in various driving modes such as constant voltage power supply, constant current power supply, and constant voltage constant current power supply.
  • the driving power source 50 can adopt various topological architecture circuits, such as, but not limited to, a non-isolated buck topology circuit structure, a flyback topology circuit structure, and a half bridge LLC topology circuit structure.
  • topological architecture circuits such as, but not limited to, a non-isolated buck topology circuit structure, a flyback topology circuit structure, and a half bridge LLC topology circuit structure.
  • a drive power source 50 is disposed in the lower half of the interior of the heat sink 30.
  • the driving power source 50 includes a printed circuit board 510, one or more components 520 disposed on the printed circuit board and electrically connected together by wiring thereon, and a pair disposed on the lower surface of the printed circuit board 510.
  • the input lead 530B is not shown in the cross-sectional view shown in FIG. 2 due to the relationship of the angle of the cut.
  • the printed circuit board 510 of the driving power source 50 can be fixed to the lower half of the inner cavity of the heat sink 30 by means of an adhesive such as cement, silicone or epoxy.
  • the input leads 530A and 530B are electrically connected to a first electrode region of the cap (e.g., an end of the cap made of a conductive material) and a second electrode region (e.g., a portion of the cap side made of a conductive material).
  • the input lead 530A extends down to the end 210 of the base 20, and the input lead 530B folds back up after a downward extension.
  • the input lead 530B can extend out of the heat sink 30 and be embedded in the gap between the ridges of the outer surface of the heat sink and abut against the inner side surface of the lamp cap 20 to achieve Electrical connection of the two electrode zones.
  • output leads 540A and 540B are inserted into the slots on the upper surface 310 of the heat sink to electrically connect the wiring on the surface of the cap member 410.
  • the driving power source is disposed inside the heat sink casing, such an arrangement is not essential, and it is also conceivable to provide the driving power source in the lamp cap.
  • the lower end of the heat sink 30 can be fixed to the inner side of the base 20, for example by means of an adhesive; on the other hand, for example by the side of the printed circuit board 510 or
  • the inside of the lamp cap is coated with an adhesive such as cement, silicone or epoxy resin and cured, and the driving power source 50 can be disposed in the lamp cap 20 and under the heat sink 30.
  • the printed circuit board may be fixed to the inside of the lamp cap by other means, for example, the substrate may be fixed to the bottom of the lamp cap by means of an adhesive or a screw.
  • the input lead 530A extends downwardly to electrically connect to the first electrode region of the base 20
  • the input lead 530B extends downwardly from the printed circuit board 510 and then folds back up against the inner wall of the base to achieve the second electrode area of the base.
  • the output leads 540A and 540B are inserted into slots on the upper surface 310 of the heat sink to electrically connect the wiring on the surface of the cap member 410. While some aspects of the present invention have been shown and discussed, it will be appreciated by those skilled in the art that the above may be practiced without departing from the principles and spirit of the invention. The scope of the invention is defined by the claims and equivalents.

Abstract

一种便于组装的LED光源模块（40）以及包含该光源模块（40）的LED球泡灯（1），该LED球泡灯（1）包括：灯罩（10）；灯头（20）；散热器（30），其上部与灯罩（10）结合在一起并且下部固定于所述灯头（20）内；LED光源模块（40）包括：设置在所述散热器（30）的上表面的帽装部件（410）；多个设置在所述帽装部件（410）表面的LED单元（420）；以及驱动电源（50），其位于散热器（30）内部或所述灯头（20）内部并且与所述LED光源模块（40）电气连接。

Description

LED光源模块和包含该模块的 LED球泡灯 技术领域
本发明涉及半导体照明技术，特别涉及一种便于组装的 LED光源 模块以及包含该 LED光源模块的 LED球泡灯。 背景技术
发光二极管 （LED )作为一种新型的光源， 具有节能、 环保、 寿 命长、 体积小等特点， 正在被广泛应用于照明领域的各个方面。 LED 是一种能够将电能转换为可见光的固态半导体器件， 其基本结构一般 包括带引线的支架、 设置在支架上的半导体晶片以及将该晶片四周密 封起来的封装材料（例如荧光硅胶或环氧树脂） 。 上述半导体晶片包 含有 P-N结构， 当电流通过时， 电子被推向 P区， 在 P区里电子与空 穴复合， 然后以光子的形式发出能量， 而光的波长则由形成 P-N结构 的材料决定。
LED在工作过程中， 仅有一部分电能被转换为光能， 其余部分都 转换成为热能， 从而导致 LED的温度升高， 这是其性能劣化和失效的 主要原因。 在大功率 LED照明装置中， 如何高效、 及时地将 LED产 生的热量散发到照明装置外部的问题显得尤为突出。
美国德克萨斯州的 Nuventix公司最近研发了一种称为 Synjet®的 射流器， 该装置内部包括一个隔膜， 当该隔膜振动时， 气流产生于装 置内部并且通过喷嘴向散热器快速喷射。 喷射的气流带动周围的空气 一起到达散热器附近，从而以很高的热交换效率将散热器的热量带走。 有关 SynJet®射流器的进一步描述例如可参见 John Stanley Booth等人 于 2008年 10月 16日提交的题为 "带多个 LED和合成喷射热管理系 统的灯具"的美国专利申请 No. 12/288144,该专利申请作为参考文献， 以全文引用的方式包含在本申请中。
但是需要指出的是， 上述主动散热方式需要提供额外的能量驱动 散热装置工作， 而且导致高昂的制造成本和复杂的灯具结构。 发明内容 本发明的一个目的是提供一种 LED球泡灯，其具有结构简单和散 热能力强等优点。
按照本发明一个实施例的 LED球泡灯包括：
灯罩；
灯头；
散热器， 其上部与所述灯罩接合在一起并且下部固定于所述灯头 内；
LED光源模块， 其包括：
设置在所述散热器的上表面的帽状部件；
多个设置在所述帽状部件表面的 LED单元； 以及
驱动电源， 其位于所述散热器内部或所述灯头内并且与所述 LED 光源模块电气连接。
优选地， 在上述 LED球泡灯中， 所述帽状部件的顶部包含贯通区 域， 并且所述帽状部件的侧部包含贯通孔， 从而形成流经顶部的贯通 区域和侧部的贯通孔的气流通道。
优选地， 在上述 LED球泡灯中， 所述帽状部件由多个基板围成， 每个所述基板至少包括笫一部分、 与所述第一部分具有第一交界区域 的第二部分和与所述第一部分具有第二交界区域的第三部分， 所述第 二部分和第三部分相对于所述第一部分发生弯折， 所述帽状部件的侧 部由所述第一部分构成， 所述帽状部件的顶部由所述第二部分拼接而 成， 并且对于相邻的两个所述基板， 通过使其中一个的第三部分的正 面与另一个的第一部分的背面相贴合而固定在一起。
更好地， 在上述 LED球泡灯中， 每个所述基板的第一、 第二和笫 三部分是一体成型的， 并且所述第一和第二交界区域上形成有过孔以 方便弯折。
更好地， 在上述 LED球泡灯中， 所述贯通区域由所述第二部分的 边沿围成， 并且所述贯通孔开设在所述第一和第三部分上。
优选地， 在上述 LED球泡灯中， 沿所述散热器上表面的边缘形成 环形下凹区域以容纳所述灯軍的开口边沿， 并且在所述散热器的上表 面开设用于固定所述多个基板的第一部分的插槽以及使所述驱动电源 的输出线穿过的通孔。
优选地， 在上述 LED球泡灯中， 所述散热器由陶瓷或导热绝缘高 分子复合材料构成， 并且至少在所述散热器暴露于所述灯罩和灯头的 表面涂覆红外辐射材料。
优选地，在上述 LED球泡灯中，所述散热器由红外辐射材料构成。 优选地， 在上述 LED球泡灯中， 所述基板为铝基板。
优选地， 在上述 LED球泡灯中， 所述 LED单元经形成于所述帽 状部件表面的布线以串联、 并联或混联的形式连接在一起。
本发明的一个目的是提供一种 LED发光模块，其具有结构简单和 散热能力强等优点。
按照本发明一个实施例的 LED光源模块， 包括：
多个基板， 其中， 每个所述基板至少包括具有第一交界区域的第 一部分和第二部分， 所述第二部分相对于所述第一部分发生弯折， 所 述多个基板被固定在一起以形成一个帽状部件， 所述帽状部件的侧部 由所述第一部分构成， 所述帽状部件的顶部由所述第二部分拼接而成； 以及
多个设置在所述基板上的 LED单元。
优选地， 在上述 LED光源模块中， 每个所述基板还包括与所述第 一部分具有第二交界区域的第三部分， 所述第三部分相对于所述第一 部分发生弯折， 并且对于相邻的两个所述基板， 通过使其中一个的第 三部分的正面与另一个的第一部分的背面相贴合而固定在一起。
更好地， 在上述 LED光源模块中， 每个所述基板的第一、 第二和 第三部分是一体成型的， 并且所述第一和第二交界区域上形成有过孔 以方便弯折。
更好地， 在上述 LED光源模块中， 所述第二部分在拼接成所述顶 部时， 在顶部的中央形成由所述第二部分边沿围成的贯通区域， 并且 所述多个基板的第一和第三部分上开设有贯通孔， 从而形成流经顶部 的贯通区域和侧部的贯通孔的气流通道。
优选地， 在上述 LED光源模块中， 位于同一基板和不同基板上的 所述 LED单元都串联连接在一起。 附图说明
本发明的上述和 /或其它方面和优点将通过以下结合附图的各个方 面的描述变得更加清晰和更容易理解， 附图中相同或相似的单元采用 相同的标号表示， 附图包括：
图 1为按照本发明一个实施例的 LED球泡灯的分解示意图。
图 2为图 1所示 LED球泡灯的剖面示意图。
图 3A和 3B为图 1所示 LED球泡灯中的 LED光源模块的示意图， 其分别示出了 LED光源模块的顶部和底部。
图 4A和 4B分别示出用于图 3A和 3B所示 LED光源模块的单个 基板在平坦状态和弯折状态下的示意图。 具体实施方式
下面参照其中图示了本发明示意性实施例的附图更为全面地说明 本发明。 但本发明可以按不同形式来实现， 而不应解读为仅限于本文 给出的各实施例。
在本说明书中， 除非特别说明， 术语 "半导体晶圆" 指的是在半 导体材料（例如硅、 砷化镓等）上形成的多个独立的单个电路， "半 导体晶片" 或 "晶片 （die ) " 指的是这种单个电路， 而 "封装芯片" 指的是半导体晶片经过封装后的物理结构，在典型的这种物理结构中， 半导体晶片例如被安装在支架上并且用密封材料封装。
术语 "LED单元" 指的是包含电致发光材料的单元， 这种单元的 例子包括但不限于 P-N结无机半导体 LED和有机 LED ( OLED和聚 合物 LED ( PLED ) ) 。
P-N结无机半导体 LED可以具有不同的结构形式， 例如包括但不 限于 LED管芯和 LED单体。 其中， "LED管芯" 指的是包含有 P-N 结构的、 具有电致发光能力的半导体晶片， 而 "LED单体" 指的是将 管芯封装后形成的物理结构， 在典型的这种物理结构中， 管芯例如被 安装在支架上并且用密封材料封装。
术语 "布线" 、 "布线图案" 和 "布线层" 指的是在绝缘表面上 布置的用于元器件间电气连接的导电图案， 包括但不限于走线（ trace ) 和孔（如焊盘、 元件孔、 紧固孔和金属化孔等） 。
术语 "热辐射" 指的是物体由于具有温度而辐射电磁波的现象。 术语 "热传导" 指的是热量在固体中从温度较高的部分传送到温 度较低的部分的传递方式。
术语 "热对流" 指的是热量借助介质的流动， 由空间的一处传递 至另一处的现象。
术语 "陶瓷材料" 泛指需高温处理或致密化的非金属无机材料， 包括但不限于硅酸盐、 氧化物、 碳化物、 氮化物、 硫化物、 硼化物等。
术语 "导热绝缘高分子复合材料"指的是这样的高分子材料， 通 过填充高导热性的金属或无机填料在其内部形成导热网链， 从而具备 高的导热系数。 导热绝缘高分子复合材料例如包括但不限于添加氧化 铝的聚丙烯材料、 添加氧化铝、 碳化硅和氧化铋的聚碳酸酯和丙烯腈- 丁二烯-苯乙烯三元共聚物等。 有关导热绝缘高分子复合材料的具体描 述可参见李丽等人的论文 "聚碳酸酯及聚碳酸酯合金导热绝缘高分子 材料的研究" (《材料热处理学报》 2007年 8月， Vol. 28, No.4, pp51-54 ) 和李冰等人的论文"氧化铝在导热绝缘高分子复合材料中的应用" (《塑 料助剂》 2008年第 3期， ppl4-16 ) ， 这些文献以全文引用的方式包含 在本说明书中。
术语 "红外辐射材料" 指的是在工程上能够吸收热量而发射大量 红外线的材料， 其具有较高的发射率。 红外辐射材料的例子例如包括 但不限于石墨和常温红外陶瓷辐射材料。 进一步地， 常温红外陶瓷辐 射材料例如包括但不限于下列材料中的至少一种： 氧化镁、 氧化铝、 氧化钙、 氧化钛、 氧化硅、 氧化铬、 氧化铁、 氧化锰、 氧化锆、 氧化 钡、 堇青石、 莫来石、 碳化硼、 碳化硅、 碳化钛、 碳化钼、 碳化鵠、 碳化锆、 碳化钽、 氮化硼、 氮化铝、 氮化硅、 氮化锆、 氮化钛、 硅化 钛、 硅化钼、 硅化钨、 硼化钛、 硼化锆和硼化铬。 有关红外陶瓷辐射 材料的详细描述可参见李红涛和刘建学等人的论文 "高效红外辐射陶 瓷的研究现状及应用" （ 《现代技术陶瓷》 2005年第 2期 （总第 104 期）， pp24-26 )和王黔平等人的论文 "高辐射红外陶瓷材料的研究进 展及应用" （ 《陶瓷学报》 2011年第 3期） ， 这些文献以全文引用的 方式包含在本说明书中。
"电气连接" 和 "耦合，， 应当理解为包括在两个单元之间直接传 送电能量或电信号的情形， 或者经过一个或多个第三单元间接传送电 能量或电信号的情形。
"驱动电源" 或 "LED驱动电源" 指的是连接在照明装置外部的 交流（AC )或直流（DC ) 电源与作为光源的 LED之间的 "电子控制 装置" ， 用于为 LED提供所需的电流或电压（例如恒定电流、 恒定电 压或恒定功率等） 。 驱动电源中的一个或多个部件以晶片或封装芯片 的形式实现， 以下将驱动电源中以晶片或封装芯片的形式实现的部件 称为 "驱动控制器" 。 在具体的实施方案中， 驱动电源可以模块化的 结构实现， 例如其包含印刷电路板和一个或多个布置在印刷电路板上 并通过布线电气连接在一起的元器件， 这些元器件的例子包括但不限 于 LED驱动控制器芯片、 整流芯片、 电阻器、 电容器、 二极管、 三极 管和线圏等。 可选地， 在驱动电源中还可以集成实现其它功能的电路， 例如调光控制电路、 传感电路、 功率因数校正电路、 智能照明控制电 路、 通信电路和保护电路等。 这些电路可以与驱动控制器集成在同一 半导体晶片或封装芯片内， 或者这些电路可以单独地以半导体晶片或 封装芯片的形式提供， 或者这些电路中的一些或全部可以组合在一起 并以半导体晶片或封装芯片的形式提供。
诸如 "包含" 和 "包括" 之类的用语表示除了具有在说明书和权 利要求书中有直接和明确表述的单元和步骤以外， 本发明的技术方案 也不排除具有未被直接或明确表述的其它单元和步骤的情形。
诸如 "第一" 、 "第二" 、 "第三" 和 "第四" 之类的用语并不 表示单元在时间、 空间、 大小等方面的顺序而仅仅是作区分各单元之 用。
诸如 "物体 A设置在物体 B上" 之类的用语应该广义地理解为将 物体 A直接放置在物体 B的表面，或者将物体 A放置在与物体 B有接 触的其它物体的表面。 以下借助附图描述本发明的实施例。
图 1为按照本发明一个实施例的 LED球泡灯的分解示意图。 图 2 为图 1所示 LED球泡灯的剖面示意图。
按照本实施例的 LED球泡灯 1主要包括灯軍 10、 灯头 20、 散热 器 30、 LED光源模块 40和驱动电源 50。
灯罩 10可采用透明或半透明材料（例如玻璃或塑料）制成， 为了 使光线更柔和、 更均勾地向空间发散， 其内表面或外表面可进行磨砂 处理。 可选地， 可以例如通过静电喷涂或真空喷镀工艺， 在灯罩 10的 内 /外表面形成红外辐射材料层（例如包括但不限于石墨或常温红外陶 瓷材料等）， 这种处理一方面增强了灯軍 10的散热能力， 另外也抑制 或消除了 LED的眩光效应。
灯头 20为驱动电源 50提供了与外部电源 （例如各种直流电源或 交流电源） 电气连接的接口， 其例如可采用与普通白炽灯和节能灯类 似的螺纹状旋接口或旋转卡口等形式。 参见图 1和 2, 灯头 20的端部 210由诸如金属之类的导电材料制成，侧壁 220的至少一部分由金属材 料制成， 因此可以将端部 210和侧壁 220的金属材料制成的区域作为 第一电极连接区和第二电极连接区。绝缘部分 230 (例如由塑料之类的 绝缘材料制成）位于端部 210与侧壁 220之间以将这两个电极连接区 隔开。 普通的照明线路一般包含火线和零线两根电线， 在本实施例中， 考虑到使用的安全性， 端部 210和侧壁 220作为第一和第二电极连接 区可以经灯座（未画出） 的电极被分别连接至火线和零线。
在本实施例中， 用于侧壁 220的金属材料可以采用包含下列至少 一种元素的铜基合金： 锌、 铝、 铅、 锡、 锰、 镍、 铁和硅。 采用上述 铜基合金可以提高耐腐蚀能力，从而使得灯头的使用寿命与 LED光源 的工作寿命匹配， 此外上述铜基合金也可改善加工性能。 为了扩大散 热面积， 比较好的是使侧壁 220全部由金属材料构成。 此外， 如图 1 和 2所示， 侧壁 220的外表面开设有螺紋。
参见图 1和 2, 散热器 30为壳体并且在其上表面 310的边缘形成 环形下凹区域 311。 该下凹区域 311适于容纳灯罩 10的开口边沿， 因 此能够例如借助粘合剂将灯軍 10固定于散热器 30的上表面 310。可选 地， 可以将灯軍 10的开口设置得略大于散热器 30上部的外周边， 从 而能够例如借助粘合剂将散热器 30固定于灯罩 10的开口处。
继续参见图 1和 2， 在散热器 30的上表面的中央开设通孔 312并 且在通孔 312周围还开设多条插槽 313。 如下面将要描述的， LED光 源模块 40包括帽状部件 410， 其下端包含多个突起， 因此通过使突起 固定于插槽 313内可以将 LED光源模块 40设置在散热器 30上。但是 值得指出的是， 省略插槽 313也是可行的， 例如可以用导热胶将 LED 光源模块 40粘合在散热器 30的上表面 310。
如图 2所示， 散热器 30的下部 320伸入灯头 20内并且端部抵靠 住驱动电源 50的印刷电路板 510, 其例如可借助粘合剂 （例如胶泥或 环氧树脂） 固定于灯头 20内。 散热器 30的中部 330位于灯罩 10与灯 头 20之间并暴露于 LED球泡灯的外部， 其表面设置多个凸条 331以 增加散热面积。
散热器 30可全部由绝缘导热材料（例如陶瓷或导热绝缘高分子复 合材料）构成， 但是仅仅一部分由绝缘导热材料构成也是可行的和有 益的（例如当采用少量绝缘导热材料就能够满足将热量传导到 LED球 泡灯外部的需求时或需要降低材料成本时）。 另外， 散热器 30的整个 外表面可以覆盖红外辐射材料（例如诸如碳化硅之类的常温红外陶瓷 辐射材料）。 可选地， 也可以仅在散热器 30的中部 330的外表面覆盖 红外辐射材料。 如果红外辐射材料同时具有较好的绝缘导热性能 （例 如碳化硅材料）， 则散热器 30可以全部由红外辐射材料构成， 或者可 选地， 散热器 30可以仅仅一部分由红外辐射材料构成。
图 3A和 3B为图 1所示 LED球泡灯中的 LED光源模块的示意图， 其分别示出了 LED光源模块的顶部和底部。
参见图 3A和 3B， LED光源模块 40包含帽状部件 410, 其表面设 置多个 LED单元 420和将这些 LED单元电气耦合在一起的布线 430。 需要指出的是， 为了图示方便起见， 这里并未对图中所有的 LED单元 进行标注， 但是对于本领域内的技术人员来说， 这样的简略标注并不 会导致不可理解或者引起误解。类似地，对于附图中示出的 LED单元、 基板、 布线和贯通孔等也采用了类似的标注方式。
帽状部件 410优选地采用铝基板之类的印刷电路板材料制成， 但 是也可以采用绝缘导热材料（例如陶瓷材料或导热绝缘高分子复合材 料等）或兼具绝缘导热能力的红外辐射材料（例如碳化硅）制成。
在本实施例中， 帽状部件 410的顶部包含贯通区域 411并且在帽 状部件 410侧面的下部开设有一个或多个贯通孔 412。 当 LED球泡灯 1工作时， 安装在帽状部件顶部和侧面上部的 LED单元 420所产生的 热量导致在顶部与侧面下部之间形成热梯度。 在实际使用时， LED球 泡灯 1一般是倒置的 （也即灯头 20在上而灯罩 10在下） ， 这使得贯 通区域 411的位置低于贯通孔 412的位置， 因此从贯通区域 411进入 帽状部件内部的流动介质 （例如空气或惰性气体）被加热后上升至贯 通孔 412周围， 随后经贯通孔 412流出帽状部件并且再次经贯通区域 411 流入帽状部件， 从而形成介质的循环流动。 由此， LED单元 420 产生的热量除了借助热传导方式经帽状部件 410传递至散热器 30 以 外，还借助热对流方式被传递至灯革 10，这大大提高了 LED球泡灯的 总体散热能力。
如图 3A和 3B所示， 帽状部件的下端设置有多个突起 413， 它们 可插入形成于散热器 30上表面的插槽 313以使帽状部件与散热器固定 在一起。
在本实施例中，设置在帽状部件 410表面上的 LED单元 420采用 管芯形式， 可以利用在板上倒装芯片 （FCOB )工艺将 LED管芯与布 线电气连接在一起。通过在帽状部件表面形成合适的布线，可以将 LED 单元 420以串联、并联或混联的形式连接在一起。此外， LED单元 420 也可以釆用 LED单体的形式， 此时可以通过焊接方式将 LED单元电 气连接到布线上。 如果需要调整 LED单元 420的发光波长， 可以在 LED单元 420的表面涂覆荧光层或者混合荧光粉的环氧树脂或硅胶。
虽然图 3A和 3B所示的帽状部件可以是一体成型的部件， 但是在 本实施例中，其由多个基板拼装而成。图 4A和 4B分别示出用于图 3A 和 3B所示 LED光源模块的单个基板在平坦状态和弯折状态下的示意 图。
如图 4A所示，基板 410A包括一体成型的第一部分 410A-1、第二 部分 410A-2和第三部分 410A-3, 它们的表面形成有布线 430。 参见图 4A, 第一部分 410A-1分别经交界区域 410A-4和 410A-5 (图中点划线 示出的区域）与第二部分 410A-2和第三部分 410A-3相邻， 交界区域 410A-4和 410A-5上形成有过孔 414以方便弯折。
继续参见图 4A， 在第一和第三部分 410A-1 , 410A-3的下部形成 有多个贯通孔 412-1、 412-2、 412-3和 412-4， 其提供了如上所述的介 质循环流动的通道。 基板 410A的下端形成有突起 413， 以便固定于上 表面 310上的插槽 313内。 在本实施例中， 布线 430延伸到突起 413 的表面， 因此通过将驱动电源 50的输出引线插入散热器上表面 310上 的插槽 313内可以实现驱动电源 50与布线 430的电气连接。 可选地， 驱动电源 50的输出引线也可以穿过散热器上表面 310上的通孔 312和 基板 410A的贯通孔 412-3和 412-4连接至布线 430。 优选地， 连接在 笫一与第二部分 410A-1 , 410A-2之间以及第一与第三部分 410A-1、 410A-3之间的布线为金属薄片， 其可以通过粘合、 焊接或埋设等方式 固定于基板 410A。
LED单元 420例如利用 FCOB工艺设置在基板 410A的表面上并 且与布线 430电气连接。随后，将第二部分 410A-2和第三部分 410A-3 分别沿交界区域 410A-4和 410A-5弯折以形成如图 4B所示的状态。在 本实施例中， 4个如图 4B所示的基板被装配成如图 3A和 3B所示的帽 状部件的 LED光源模块。
结合图 3A、 3B和 4B可见， 帽状部件 410的顶部由基板 410A、 410B、 410C和 410D的第二部分拼接而成， 其中第二部分的前沿围成 贯通区域 411; 另一方面， 基板 410A、 410B、 410C和 410D的第一和 笫三部分构成帽状部件 410的侧部。对于相邻的两个基板（以基板 410A 和 410B为例）， 基板 410A的第三部分 410A-3的正面与基板 410B的 第一部分 410B-1的背面贴合在一起， 从而将两个基板固定在一起。 对 于相邻的成对基板 410B与 410C、 410C与 410D以及 410D与 410A, 也采用类似的固定方式。
结合图 3A、3B、4A和 4B，对于相邻的两个基板（仍然以基板 410A 和 410B为例） ， 基板 410A的第一部分 410A-1上的布线延伸至第三 部分 410A-3, 如上所述， 基板 410A的第三部分 410A-3的正面与基板 410B的第一部分 410B-1的背面贴合在一起，通过使基板 410A的第三 部分上的布线与基板 410B的第一部分 410B-1上的布线相连， 可以实 现两个基板上 LED单元之间的电气连接（例如串联连接）。 借助上述 方式，也可以使相邻的成对基板 410B与 410C、410C与 410D以及 410D 与 410A上的 LED单元电气连接在一起。对于上述结构的 LED光源模 块 40, 例如可以采用下列方式实现其与驱动电源 50之间的电气连接： 将驱动电源 50的其中一根输出引线插入基板 410A的第一部分的突起 所在的插槽内， 使得该输入线与位于第一部分突起上的布线相连， 另 一方面， 将驱动电源 50的另外一根输出引线插入基板 410D的第三部 分的突起所在的插槽内，使得该输入线与第三部分突起上的布线相连。
驱动电源 50可以多种驱动方式（例如恒压供电、 恒流供电和恒压 恒流供电等方式） 向 LED光源模块 40提供合适的电流或电压。 根据 外部供电的方式， 驱动电源 50可采用各种拓朴架构的电路， 例如包括 但不限于非隔离降压型拓朴电路结构、 反激式拓朴电路结构和半桥 LLC拓朴电路结构等。 有关驱动电源电路的详细描述可参见人民邮电 出版社 2011年 5月第 1版的 《LED照明驱动电源与灯具设计》一书， 该出版物以全文引用方式包含在本说明书中。 再次参见图 1和 2,驱动电源 50被设置在散热器 30内腔的下半部 分。 在本实施例中， 驱动电源 50包含印刷电路板 510、 一个或多个布 置在印刷电路板上并通过其上的布线电气连接在一起的元器件 520、一 对设置在印刷电路板 510下表面的输入引线 530A和 530B以及一对设 置在印刷电路板 510上表面的输出引线 540A和 540B。 由于剖取角度 的关系， 输入引线 530B未在图 2所示的剖面图中示出。
可以借助胶泥、硅胶或环氧树脂之类的粘合剂将驱动电源 50的印 刷电路板 510固定于散热器 30内腔的下半部分。输入引线 530A和 530B 分别与灯头的第一电极区 （例如灯头的由导电材料构成的端部）和第 二电极区 （例如灯头侧面由导电材料构成的部分） 电气连接。 输入引 线 530A向下延伸至灯头 20的端部 210，而输入引线 530B在向下延伸 一段后向上折返。 因此当将灯头 20和散热器 30装配在一起时， 输入 引线 530B可伸出散热器 30后嵌入散热器外表面的凸条之间的间隙内 并且抵靠住灯头 20的内侧表面以实现与第二电极区的电气连接。此外， 输出引线 540A和 540B插入散热器上表面 310上的插槽以与帽状部件 410表面的布线电气连接。
需要指出的是， 虽然在上述实施例中， 驱动电源被设置在散热器 壳体内部， 但是这种布置并非是必需的， 也可以考虑将驱动电源设置 在灯头内。 在对上述借助图 1和 2所示实施例的修改方式中， 例如可 以借助粘合剂将散热器 30的下端固定于灯头 20内侧面； 另一方面， 例如通过在印刷电路板 510的侧面或灯头内部涂覆胶泥、 硅胶或环氧 树脂之类的粘合剂并且使其固化， 可将驱动电源 50设置在灯头 20内 并且位于散热器 30的下方。 需要指出的是， 除了上述布置以外， 印刷 电路板也可以采用其它方式固定于灯头的内部， 例如可以借助粘合剂 或螺钉将基板固定在灯头的底部。类似地，输入引线 530A向下延伸与 灯头 20的第一电极区电气连接， 输入引线 530B自印刷电路板 510向 下延伸一段后向上折返并抵靠住灯头内壁以与灯头的第二电极区实现 电气连接， 输出引线 540A和 540B则插入散热器上表面 310上的插槽 以与帽状部件 410表面的布线电气连接。 虽然已经展现和讨论了本发明的一些方面， 但是本领域内的技术 人员应该意识到： 可以在不背离本发明原理和精神的条件下对上述方 面进行改变， 因此本发明的范围将由权利要求以及等同的内容所限定。

Claims

权 利 要 求
1、 一种 LED球泡灯， 其特征在于， 包括：
灯罩；
灯头；
散热器， 其上部与所述灯罩接合在一起并且下部固定于所述灯头 内；
LED光源模块， 其包括：
设置在所述散热器的上表面的帽状部件；
多个设置在所述帽状部件表面的 LED单元； 以及
驱动电源， 其位于所述散热器内部或所述灯头内并且与所述 LED 光源模块电气连接。
2、 如权利要求 1所述的 LED球泡灯， 其中， 所述帽状部件的顶 部包含贯通区域， 并且所述帽状部件的侧部包含贯通孔， 从而形成流 经顶部的贯通区域和侧部的贯通孔的气流通道。
3、 如权利要求 1所述的 LED球泡灯， 其中， 所述帽状部件由多 个基板围成， 每个所述基板至少包括第一部分、 与所述第一部分具有 第一交界区域的第二部分和与所述第一部分具有第二交界区域的第三 部分， 所述第二部分和第三部分相对于所述第一部分发生弯折， 所述 帽状部件的侧部由所述笫一部分构成， 所述帽状部件的顶部由所述第 二部分拼接而成， 并且对于相邻的两个所述基板， 通过使其中一个的 第三部分的正面与另一个的第一部分的背面相贴合而固定在一起。
4、 如权利要求 3所述的 LED球泡灯， 其中， 每个所述基板的第 一、 第二和第三部分是一体成型的， 并且所述第一和第二交界区域上 形成有过孔以方便弯折。
5、 如权利要求 3所述的 LED球泡灯， 其中， 所述贯通区域由所 述第二部分的边沿围成， 并且所述贯通孔开设在所述第一和第三部分 上。
6、 如权利要求 1所述的 LED球泡灯， 其中， 沿所述散热器上表 面的边缘形成环形下凹区域以容纳所述灯罩的开口边沿， 并且在所述 散热器的上表面开设用于固定所述多个基板的第一部分的插槽以及使 所述驱动电源的输出线穿过的通孔。
7、 如权利要求 1所述的 LED球泡灯， 其中， 所述 LED单元经形 成于所述帽状部件表面的布线以串联、并联或混联的形式连接在一起。
8、 一种 LED光源模块， 其特征在于， 包括：
多个基板， 其中， 每个所述基板至少包括具有第一交界区域的第 一部分和第二部分， 所述第二部分相对于所述第一部分发生弯折， 所 述多个基板被固定在一起以形成一个帽状部件， 所述帽状部件的侧部 由所述第一部分构成， 所述帽状部件的顶部由所述第二部分拼接而成； 以及
多个设置在所述基板上的 LED单元。
9、 如权利要求 8所述的 LED光源模块， 其中， 每个所述基板还 包括与所述第一部分具有第二交界区域的第三部分， 所述第三部分相 对于所述第一部分发生弯折， 并且对于相邻的两个所述基板， 通过使 其中一个的第三部分的正面与另一个的第一部分的背面相贴合而固定 在一起。
10、 如权利要求 8或 9所述的 LED光源模块， 其中， 所述第二部 分在拼接成所述顶部时， 在顶部的中央形成由所述第二部分边沿围成 的贯通区域， 并且所述多个基板的笫一和第三部分上开设有贯通孔， 从而形成流经顶部的贯通区域和侧部的贯通孔的气流通道。
PCT/CN2014/085105 2013-08-26 2014-08-25 Led光源模块和包含该模块的led球泡灯 WO2015027884A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310375909.0 2013-08-26
CN201310375909.0A CN104421682B (zh) 2013-08-26 2013-08-26 Led光源模块和包含该模块的led球泡灯

Publications (1)

Publication Number Publication Date
WO2015027884A1 true WO2015027884A1 (zh) 2015-03-05

Family

ID=52585580

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/085105 WO2015027884A1 (zh) 2013-08-26 2014-08-25 Led光源模块和包含该模块的led球泡灯

Country Status (2)

Country Link
CN (1) CN104421682B (zh)
WO (1) WO2015027884A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194005A1 (en) * 2015-06-04 2016-12-08 Corvi Led Pvt Ltd Led light bulb assembly and method for manufacturing same
CH711339A1 (de) * 2015-07-17 2017-01-31 Corvi Led Pvt Ltd LED-Lampenanordnung und Verfahren zur Herstellung derselben.
USD800373S1 (en) 2016-02-05 2017-10-17 Corvi Led Pvt Ltd. Lamp
EP3479009A4 (en) * 2016-06-30 2020-03-04 Zhejiang Shenghui Lighting Co., Ltd HEAT SINK AND LED BULB WITH HEAT SINK

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205909016U (zh) * 2016-06-27 2017-01-25 欧普照明股份有限公司 一种led蜡烛灯
CN105972461A (zh) * 2016-06-30 2016-09-28 浙江生辉照明有限公司 一种led光源模组及led灯
CN207831027U (zh) * 2017-12-29 2018-09-07 深圳市超频三科技股份有限公司 灯具及其光源基板
CN109538993A (zh) * 2018-10-24 2019-03-29 浙江鼎鑫工艺品有限公司 一种照明灯

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101545621A (zh) * 2008-03-28 2009-09-30 台达电子工业股份有限公司 照明装置及其散热结构
CN101761812A (zh) * 2010-02-10 2010-06-30 周成凤 灯管式led灯
US20100295436A1 (en) * 2009-05-19 2010-11-25 Alex Horng Lamp
CN102135254A (zh) * 2011-04-27 2011-07-27 诠兴开发科技股份有限公司 具有较大照明角度的发光二极管灯具构造
CN102203501A (zh) * 2008-11-06 2011-09-28 罗姆股份有限公司 Led灯

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203115564U (zh) * 2013-01-04 2013-08-07 广东雪莱特光电科技股份有限公司 Led陶瓷泡灯

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101545621A (zh) * 2008-03-28 2009-09-30 台达电子工业股份有限公司 照明装置及其散热结构
CN102203501A (zh) * 2008-11-06 2011-09-28 罗姆股份有限公司 Led灯
US20100295436A1 (en) * 2009-05-19 2010-11-25 Alex Horng Lamp
CN101761812A (zh) * 2010-02-10 2010-06-30 周成凤 灯管式led灯
CN102135254A (zh) * 2011-04-27 2011-07-27 诠兴开发科技股份有限公司 具有较大照明角度的发光二极管灯具构造

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194005A1 (en) * 2015-06-04 2016-12-08 Corvi Led Pvt Ltd Led light bulb assembly and method for manufacturing same
CN108291708A (zh) * 2015-06-04 2018-07-17 可菲发光二极管私人有限公司 Led灯泡的装配件及其制造方法
CN108291708B (zh) * 2015-06-04 2020-09-08 可菲发光二极管私人有限公司 Led灯泡的装配件及其制造方法
CH711339A1 (de) * 2015-07-17 2017-01-31 Corvi Led Pvt Ltd LED-Lampenanordnung und Verfahren zur Herstellung derselben.
USD800373S1 (en) 2016-02-05 2017-10-17 Corvi Led Pvt Ltd. Lamp
EP3479009A4 (en) * 2016-06-30 2020-03-04 Zhejiang Shenghui Lighting Co., Ltd HEAT SINK AND LED BULB WITH HEAT SINK

Also Published As

Publication number Publication date
CN104421682B (zh) 2018-04-03
CN104421682A (zh) 2015-03-18

Similar Documents

Publication Publication Date Title
WO2015027884A1 (zh) Led光源模块和包含该模块的led球泡灯
KR100998480B1 (ko) 열전달/발산 모듈을 구비한 반도체 발광 장치
WO2014187335A1 (zh) Led灯芯和包含其的led球泡灯
WO2013139295A1 (zh) 具有强散热能力的发光二极管球泡灯及其制造方法
JP2010045030A (ja) 発光ダイオード照明装置
WO2013067945A1 (zh) 发光二极管灯芯和采用发光二极管作为光源的照明装置
JP2009218192A (ja) 発光モジュール及び照明装置
JP2015503208A (ja) 発光システム
WO2014166367A1 (zh) 集成led驱动电源的灯头
WO2008138177A1 (en) An led lighting fixture with high-efficiency radiation effect
WO2012139306A1 (zh) 高出光率led灯泡
CN103672459B (zh) 具有紧凑结构的提供定向光束的发光二极管照明装置
WO2013117168A1 (zh) 发光二极管球泡灯及其制造方法
TWI373592B (en) Light source module
CN103470968A (zh) 大发光角度的发光二极管灯芯及包含该灯芯的照明装置
CN206943847U (zh) 一种可快速组装的led灯
WO2013097755A1 (zh) 高度集成化的发光二级管灯芯和包含其的照明装置
CN103375704B (zh) 大功率发光二极管灯及其制造方法
CN103322438A (zh) 大功率发光二极管投光灯及其制造方法
WO2016184372A2 (zh) Led光源组件、led光电一体化模组和led射灯
CN104033749A (zh) 散热能力强的发光二极管球泡灯
CN203413588U (zh) Led光源板组件、led灯芯和led照明装置
JP6085692B2 (ja) 放熱ｌｅｄドライバーを使用したｌｅｄ電球
CN206055219U (zh) 一种ac‑cob交流电芯片集成led灯
CN105720184B (zh) 积木式散热、电路集成化led倒装芯片光源陶瓷基座

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14839480

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14839480

Country of ref document: EP

Kind code of ref document: A1