WO2012139306A1 - 高出光率led灯泡 - Google Patents

高出光率led灯泡 Download PDF

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Publication number
WO2012139306A1
WO2012139306A1 PCT/CN2011/072926 CN2011072926W WO2012139306A1 WO 2012139306 A1 WO2012139306 A1 WO 2012139306A1 CN 2011072926 W CN2011072926 W CN 2011072926W WO 2012139306 A1 WO2012139306 A1 WO 2012139306A1
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WO
WIPO (PCT)
Prior art keywords
led
transparent
light
resistor
capacitor
Prior art date
Application number
PCT/CN2011/072926
Other languages
English (en)
French (fr)
Inventor
翁小翠
Original Assignee
Weng Xiaocui
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weng Xiaocui filed Critical Weng Xiaocui
Publication of WO2012139306A1 publication Critical patent/WO2012139306A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/30—Driver circuits
    • H05B45/37—Converter circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED light bulb.
  • an LED chip is usually mounted on the bottom surface of the substrate.
  • the LED substrate is usually made of a material having good thermal conductivity.
  • the substrate is provided with a power connection interface, and the power connection interface is electrically connected to the power connection line.
  • a printed circuit is disposed, and a plurality of LED chips are arranged on the substrate, the LED chip includes a current limiting resistor and a voltage regulator, and the current limiting resistor and the voltage regulator are connected to the printed circuit.
  • the illumination range is below the substrate, that is, the 2 ⁇ light is emitted, part of the light is irradiated onto the bottom surface of the substrate, the light output rate of the LED light source is lowered, and the heat dissipation performance is provided because the entire substrate is planarly disposed. Poor.
  • the present invention provides a high light output LED bulb that improves light extraction rate and enhances heat dissipation performance.
  • a high-luminance LED bulb includes a lamp cap, a lamp housing, an LED driver and a bulb cover, wherein the lamp cap is connected to an upper end of the lamp housing, the LED driver is mounted in the lamp housing, and a lower end of the lamp housing is connected to the bulb cover.
  • the LED light bulb further includes a transparent lamp post with high thermal conductivity, the transparent lamp post is located in the bulb cover, and the upper portion of the transparent lamp post is connected to the lower end of the lamp housing, and the transparent lamp post is mounted on the transparent lamp post.
  • the high light-emitting LED light bar comprising a plurality of LED chips connected in series, the outer side of the transparent light column
  • the cavity between the bulb cover is filled with a transparent or translucent highly thermally conductive filler.
  • the transparent or translucent high thermal conductivity filler in the present invention may be selected from a transparent high thermal conductivity material or a translucent high thermal conductive material such as an aluminum nitride transparent or translucent ceramic, as long as the high light output LED strip can be used. The emitted light can be transmitted.
  • transparent or translucent high thermal conductivity materials of other materials can also be used.
  • the high thermal conductivity filler in the present invention may fill the cavity between the outer side of the transparent lamp post and the bulb cover, or may be partially filled; for partial filling, it is required to fill up from the bottom of the bulb cover first. At least a filler is in contact with the bottom surface of the transparent lamp post. Preferably, the filler is simultaneously in contact with the peripheral sides of the transparent lamp post.
  • the structure can pass the heat generated by the high light-emitting LED strip in time.
  • the filler is diverging.
  • the filler and the bulb cover may be integrated, that is, the bulb cover and the filler are made of the same transparent or translucent highly thermally conductive material, and the integrated structure is convenient for processing; of course, it may be a mutually independent structure.
  • the upper end of the transparent lamp post is snap-connected with the lamp housing. Of course, other connection methods can also be used.
  • a side surface of the transparent lamp post is provided with a vertical groove, and a light bar of the light-emitting LED is installed in the vertical groove.
  • the transparent lamp post may be a solid structure, a hollow structure, or a hollow shape; of course, other structural forms may also be employed.
  • the transparent lamp post is stepped, the lower cross section of the transparent lamp post is smaller than the upper cross section, and an annular groove is opened at the step, and the high-luminance LED strip is installed in the annular groove.
  • a plurality of high-luminance LED light bars may be arranged on the plurality of steps.
  • the bottom surface of the transparent lamp post is provided with an annular groove, and the light-emitting LED strip is installed in the annular groove.
  • the bulb cover For the bulb cover to be white or other colors, if there is only a vertically arranged high-luminance LED strip, shadows are easily generated at the bottom of the bulb cover, and a high-luminance LED strip is added to the bottom of the lamp post, which can not only increase
  • the luminous power can also effectively eliminate the shadow on the bottom of the bulb cover; of course, if a transparent bulb cover is used, no shadow will be formed on the bulb cover even if the high-luminance LED strip is not provided.
  • the light source in the high light output LED strip is directed to the exterior of the vertical groove.
  • the LED chip in a high-luminance LED strip, the LED chip includes a transparent substrate and a light source, and the transparent substrate and the light source are both coated in the transparent silica gel, wherein the light emitted by the light source is diverged to the periphery, and the generated heat is relatively There is more heat in the direction of the light source. Therefore, installing the light source toward the outside of the groove facilitates transferring more heat to the transparent or translucent high thermal conductivity filler, so that good heat dissipation can be achieved. Of course, other heat sources can also be used.
  • the manner of installation for example, the manner in which the light source is directed towards the bottom of the vertical groove.
  • the light source in the high light output LED strip is directed toward the exterior of the annular groove.
  • the principle of heat dissipation is the same as that of a high light-emitting LED strip; of course, other mounting methods can be used, such as mounting with a light source towards the bottom of the vertical groove.
  • the high light output LED strip is sized to match the vertical or annular groove.
  • the high light-emitting LED strip is nested just inside the recess, which facilitates the processing of transparent or translucent highly thermally conductive fillers.
  • a reflector is mounted on the top surface of the transparent lamp post, and the reflector can converge the upwardly divergent light downwards, thereby further improving luminous efficiency.
  • a heat dissipating block having high thermal conductivity is mounted on a top surface of the transparent lamp post, and an outer wall of the heat dissipating block is connected to an inner wall of the lamp housing.
  • the heat sink block By setting the heat sink block, it can be good Auxiliary heat dissipation.
  • the heat dissipation block is integrated with the transparent lamp post.
  • the heat sink block and the transparent lamp post may also be separate structures, as long as the two are fixedly connected together.
  • the driving circuit of the LED driver includes a first capacitor, a first resistor, a rectifying circuit, a filter capacitor and a second resistor, and the mains access terminal is connected to the first capacitor, and the first resistor is connected in parallel with the first capacitor.
  • the other end of the first capacitor is connected to an input side of the rectifier circuit, both ends of the output side of the rectifier circuit are connected to a filter capacitor, and the second resistor is connected in parallel with the filter capacitor, and the filter capacitor is Both ends are connected to two drive circuit output interfaces.
  • the driving circuit of the LED driver includes a first capacitor, a first resistor, a rectifying circuit, a filter capacitor, a second resistor and a power factor boosting circuit, and the mains access terminal is connected to the first capacitor, the first resistor and The first capacitor is connected in parallel, and the other end of the first capacitor is connected to the input side of the rectifier circuit, and the positive terminal of the output side of the rectifier circuit is simultaneously connected to the second resistor end and the filter capacitor positive pole, and the rectifier circuit is The negative end of the output side is coupled to the other end of the second resistor, and the power factor boosting circuit includes a second diode, a third diode, a fourth diode, and an auxiliary filter capacitor, and the negative of the filter capacitor Simultaneously connected to the opposite end of the second diode and the forward end of the third diode, the forward end of the second diode is connected to the negative end of the output side of the rectifier circuit, the rectification The positive end of the output side of the circuit
  • One end of the filter capacitor is connected to a current limiting resistor, and the current limiting resistor and a driving current
  • the circuit output interface is connected to the bridge rectifier circuit of the rectifier circuit.
  • the transparent lamp post has a bottom cross section that is smaller than the top cross section.
  • the cross section of the transparent lamp post is circular, square, diamond or elliptical. Of course, other shapes can also be used.
  • a high-luminance LED strip can be arranged on the side of the transparent lamp post, or two or more high-luminance LED strips can be arranged, and two or more high-emitting light strips can be arranged.
  • the LED strips are equally spaced.
  • the beneficial effects of the invention are mainly as follows: 1. Improve light utilization rate and improve heat dissipation performance; 2. By avoiding the use of a transformer, simplifying circuit composition, no high frequency oscillation, no electromagnetic radiation, reducing energy consumption, and improving power supply Conversion efficiency; 3. Using current limiting resistor, effectively reduce the operating current of the LED lamp when the power supply voltage fluctuates abnormally, and protect the LED; 4. Add a power factor boosting circuit composed of three diodes and a third capacitor , can effectively adapt to high power factor occasions.
  • Figure 1 is a schematic diagram of a first high-luminance LED bulb.
  • Figure 2 is a schematic illustration of a second high-luminance LED bulb.
  • Figure 3 is a schematic illustration of a third high-luminance LED bulb.
  • Figure 4 is a schematic cross-sectional view of Figure 3.
  • Figure 5 is a schematic illustration of a fourth high-luminance LED bulb.
  • Figure 6 is a schematic illustration of a fifth high-luminance LED bulb.
  • Figure 7 is a schematic diagram of a drive circuit.
  • Figure 8 is a schematic illustration of another drive circuit.
  • a high-luminance LED bulb includes a lamp cap 1, a lamp housing 2, an LED driver 6, and a bulb cover 5.
  • the lamp cap 1 is connected to the upper end of the lamp housing 2, and the lamp housing 2 is mounted therein.
  • the LED driver 6 is connected to the bulb cover 5 at a lower end thereof, and the LED bulb further comprises a transparent lamp post 3 having high thermal conductivity, the transparent lamp post 3 is located in the bulb cover 5, the transparent lamp
  • the upper portion of the column 3 is connected to the lower end of the lamp housing 2, and the high light-emitting LED strip 4 is mounted on the transparent lamp post 3, and the high-luminance LED strip 4 includes a plurality of LED chips serially connected in series.
  • the cavity between the outer side of the transparent lamp post 3 and the bulb cover 5 is filled with a transparent or translucent highly thermally conductive filler.
  • the transparent or translucent high thermal conductivity filler in this embodiment may be selected from a transparent high thermal conductivity material or a translucent high thermal conductivity material, such as an aluminum nitride transparent or translucent ceramic, as long as the high light rate LED strip can be described.
  • the light emitted by 4 can be transmitted.
  • transparent or translucent high thermal conductivity materials of other materials can also be used.
  • the high thermal conductivity filler in the present invention may fill the cavity between the outer side of the transparent lamp post and the bulb cover, or may be partially filled; for partial filling, it is required to fill up from the bottom of the bulb cover first. At least a filler is in contact with the bottom surface of the transparent lamp post. Preferably, the filler is simultaneously in contact with the peripheral sides of the transparent lamp post.
  • the structure can pass the heat generated by the high light-emitting LED strip in time.
  • the filler is diverging.
  • the filler and the bulb cover may be integrated, that is, the bulb cover and the filler are made of the same transparent or translucent highly thermally conductive material, and the integrated structure is convenient for processing; of course, it may be a mutually independent structure.
  • the upper end of the transparent lamp post is snap-connected with the lamp housing.
  • the side of the transparent lamp post 3 is provided with a vertical groove, and the vertical light groove is mounted with a light-emitting LED strip 4; or: the transparent lamp post 3 is stepped, and the transparent lamp post 3
  • the lower cross section is smaller than the upper cross section, and an annular groove is formed at the step, and the high-luminance LED light bar 4 is installed in the annular groove, and the high light-emitting LED light bar 4 includes a plurality of LED chips serially connected in series.
  • other assembly methods are also possible.
  • the transparent lamp post 3 may be a solid structure, a hollow structure, or a hollow shape; of course, other structural forms may also be employed.
  • the bottom surface of the transparent lamp post 3 is provided with an annular groove, and the high-emission LED strip 4 is mounted in the annular groove.
  • the bulb cover 5 to be white or other colors, if there is only a vertically arranged high-luminance LED strip, shadows are easily generated at the bottom of the bulb cover, and a high-luminance LED strip is added to the bottom of the lamp post, which can not only increase The large luminous power can also effectively eliminate the shadow on the bottom of the bulb cover; of course, if a transparent bulb cover is used, no shadow will be formed on the bulb cover even if the high-luminance LED strip is not provided.
  • the light source in the high light extraction LED strip 4 faces the exterior of the vertical groove.
  • the LED chip in a high-luminance LED strip, the LED chip includes a transparent substrate and a light source, and the transparent substrate and the light source are both coated in the transparent silica gel, wherein the light emitted by the light source is diverged to the periphery, and the generated heat is relatively There is more heat in the direction of the light source. Therefore, installing the light source toward the outside of the groove facilitates transferring more heat to the transparent or translucent high thermal conductivity filler, so that good heat dissipation can be achieved. Of course, other heat sources can also be used.
  • the manner of installation for example, the manner in which the light source is directed towards the bottom of the vertical groove.
  • the light source in the high light extraction LED strip 4 faces the exterior of the annular groove.
  • the heat dissipation principle is the same as that of the high light-emitting LED strip; of course, other mounting methods can also be used, such as the installation of the light source toward the bottom of the vertical groove.
  • the high light-emitting LED strip 4 is sized to match the vertical or annular groove. That is, the high light-emitting LED strip is nested in the groove, and the structure facilitates the processing of the transparent or translucent high-thermal filler.
  • a reflector 7 is mounted on the top surface of the transparent lamp post 3, and the reflector 7 can converge the upwardly diverging light downwards, thereby further improving luminous efficiency.
  • a heat dissipating block 8 having a high thermal conductivity is mounted on the top surface of the transparent lamp post 3, and an outer wall of the heat dissipating block 8 is connected to an inner wall of the lamp housing 2.
  • the heat sink block 8 it can provide a good auxiliary heat dissipation effect.
  • the heat dissipation block is integrated with the transparent lamp post.
  • the heat sink block and the transparent lamp post can also be separate structures, as long as the two are fixedly connected together.
  • the lamp housing 2 is made of a material having high thermal conductivity, and the wall surface of the lower portion of the lamp housing 2 is thicker than the upper wall surface, and the structure is advantageous for heat dissipation.
  • the lamp housing 2 can also be made of a wall thickness or the like.
  • the lamp housing 2 has a circular, square, diamond, elliptical or regular polygon in cross section. Of course, other shapes can also be used.
  • the transparent lamp post 3 has a bottom cross section that is smaller than the top cross section.
  • the transparent lamp post 3 has a circular, square, diamond or elliptical cross section. Of course, other shapes can also be used.
  • a high-luminance LED strip can be arranged on the side of the transparent lamp post 3, or two or more high-luminance LED strips can be arranged, and two or more high-emission LED strips are equally spaced. Arrangement.
  • the bulb cover 5 of the present embodiment has a circular shape, a square shape, a diamond shape or an elliptical shape. Of course, other shapes can also be used. Referring to Figure 3, the bulb cover is elongated, referring to Figure 4, the bulb cover is long Square, the lamp cover is provided with a lamp housing and a lamp cap at both ends.
  • the driving circuit of the LED driver 6 includes a first capacitor C1, a first resistor R1, a rectifier circuit D1, a filter capacitor C2, and a second resistor R2.
  • the mains access terminal is connected to the first capacitor C1.
  • the first resistor R1 is connected in parallel with the first capacitor C1, the other end of the first capacitor C1 is connected to the input side of the rectifier circuit D1, and both ends of the output side of the rectifier circuit D1 are connected to the filter capacitor C2.
  • the second resistor R2 is connected in parallel with the filter capacitor C2, and both ends of the filter capacitor C2 are connected to two drive circuit output interfaces.
  • the rectifier circuit D1 is a bridge rectifier circuit. Of course, other commonly used rectifier circuits can also be used.
  • the IC chip and the transformer are not used, and the RC is used to step down, and after the step-down, the DC power is obtained by rectifying and filtering.
  • the DC power supply provides a small current and high voltage LED lamp drive.
  • the existing circuit does not have a high-frequency oscillation source, so that there is no high-frequency radiation, and the voltage and current parameters required for the operation of the LED light source are adjusted by the capacitance capacity value (first capacitance C1) in the circuit; preferably, the output of the power supply passes through the series resistance
  • the LED light source is driven after current limiting.
  • the LED driver 6 includes a first capacitor C1, a first resistor R1, a rectifier circuit D1, a filter capacitor C2, and a second resistor R2.
  • the mains access terminal is connected to the first capacitor C1.
  • the resistor R1 is connected in parallel with the first capacitor C1, the other end of the first capacitor C1 is connected to the input side of the rectifier circuit D1, and the positive terminal of the output side of the rectifier circuit D1 is simultaneously connected to the second resistor R2.
  • the second capacitor C2 is connected to the positive pole, and the negative terminal of the output side of the rectifier circuit D1 is connected to the other end of the second resistor R2.
  • the rate factor boosting circuit includes a second diode D2, a third diode D3, a fourth diode D4, and an auxiliary filter capacitor C3.
  • the negative terminal of the filter capacitor C2 is simultaneously opposite to the opposite end of the second diode D2.
  • the forward end of the second diode D2 is connected to the negative terminal of the output side of the rectifier circuit, and the output side of the rectifier circuit D1 is positive
  • the terminal is connected to the opposite end of the fourth diode D4, and the opposite end of the third diode D4 is connected to the positive terminal of the fourth diode D4 and the positive electrode of the auxiliary filter capacitor C3.
  • the negative electrode of the filter capacitor C3 is connected to the negative terminal of the output side of the rectifier circuit, and the two ends of the second resistor R2 are connected to the output interfaces of the two drive circuits.
  • the rectifier circuit D1 is a bridge rectifier circuit. Of course, other commonly used rectifier circuits can also be used.
  • the set diode includes a forward end and a reverse end, and flows through the diode from the forward end to the reverse end.
  • the IC chip and the transformer are not used, and the RC is used to step down, and after the step-down, the DC power is obtained by rectifying and filtering.
  • the DC power supply provides a small current and high voltage LED lamp drive.
  • the existing circuit does not have a high-frequency oscillation source, so that there is no high-frequency radiation, and the voltage and current parameters required for the operation of the LED light source are adjusted by the capacitance capacity value (first capacitance C1) in the circuit; preferably, the output of the power source directly drives the LED light source.
  • the power factor boosting circuit can improve the power factor of the entire LED lamp driving circuit, and effectively meet the power factor of the light source for high power factor occasions.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

说 明 书
高出光率 LED灯泡 技术领域
本发明涉及一种 LED灯泡。
背景技术
现有的 LED灯泡，通常在基板底面上安装 LED芯片， LED基板 通常采用导热性能良好的材料，所述基板设有电源连接接口，所述电 源连接接口与电源连接线电连接，所述基板上设有印刷电路，所述基 板上排列布置多个 LED芯片，所述 LED芯片包括限流电阻和稳压器， 所述限流电阻和稳压器均与所述印刷电路连接。
由于 LED芯片发出的光线向下发散， 其照射范围为基板以下部 分， 即实现 2π出光， 部分光线照射到基板的底面， 降低了 LED光源 的出光率， 另外， 由于整个基板呈平面设置， 散热性能较差。
发明内容
为了克服已有 LED灯的出光率较低、散热性能较差的不足， 本发 明提供了一种提升出光率、 增强散热性能的高出光率 LED灯泡。
本发明解决其技术问题所采用的技术方案是：
一种高出光率 LED灯泡， 包括灯头、 灯壳、 LED驱动器和灯泡 罩， 所述灯头与灯壳上端连接， 所述灯壳内安装所述 LED驱动器， 所 述灯壳下端与灯泡罩连接，所述 LED灯泡还包括高导热性能的透明灯 柱， 所述透明灯柱位于所述灯泡罩内， 所述透明灯柱的上方与所述灯 壳下端连接，所述透明灯柱上安装所述高出光率 LED灯条，所述高出 光率 LED灯条包括依次串联的多个 LED芯片， 所述透明灯柱的外侧 与所述灯泡罩之间的空腔内填充透明或半透明高导热性填充物。
本发明中的透明或半透明高导热性填充物， 可以选择透明的高导 热性能物质或半透明高导热物质， 例如氮化铝透明或半透明陶瓷， 只 要能够将所述高出光率 LED灯条发出的灯光透射出来即可， 当然， 也 可以采用其他材料的透明或半透明高导热性物质。
本发明中的高导热性填充物可以充满所述透明灯柱的外侧与所述 灯泡罩之间的空腔， 也可以是局部填充； 对于局部填充的情况， 要求 先从灯泡罩的底部向上填充，至少填充物与所述透明灯柱的底面接触， 优选的方案是填充物同时与所述透明灯柱的四周侧面同时接触， 该结 构能够将所述高出光率 LED灯条产生的热量及时通过填充物发散。
本发明中， 填充物和灯泡罩可以呈一体， 即灯泡罩和填充物采用 相同的透明或半透明高导热材料， 一体化的结构便于加工； 当然， 也 可以是相互独立的结构形式。
透明灯柱的上端与所述灯壳之间卡扣式连接， 当然， 也可以采用 其他连接方式。
进一步， 所述透明灯柱的侧面开有竖向凹槽， 所述竖向凹槽内安 装高出光率 LED灯条。
所述透明灯柱可以为实心结构， 也可以为空心结构， 或者呈镂空 状； 当然， 也可以采用其他结构形式。
或者是： 所述透明灯柱呈阶梯形， 所述透明灯柱的下部截面比上 部截面小， 在台阶处开有环形凹槽， 所述环形凹槽内安装高出光率 LED灯条， 当所述台阶有多个时， 可以在多个台阶上分别布置多根高 出光率 LED灯条。 当然， 也可以采用其他的装配方式。 所述透明灯柱的底面开有环形凹槽， 所述环形凹槽内安装高出光 率 LED灯条。对于灯泡罩属于白色或其他颜色，如果只有竖向布置的 高出光率 LED灯条， 则在灯泡罩的底部容易产生阴影，在灯柱的底面 加设高出光率 LED灯条， 不仅能够增大发光功率， 也能够有效消除灯 泡罩底部的阴影； 当然， 如果采用透明的灯泡罩， 则即便不设置高出 光率 LED灯条， 也不会在灯泡罩上产生阴影。
所述高出光率 LED灯条中的光源朝向所述竖向凹槽的外部。相对 而言， 高出光率 LED灯条中， LED芯片包含透明基板和光源， 透明 基板和光源均包覆在透明硅胶中， 其中光源发出的光线向四周发散， 对于产生的热量， 相对而言， 光源所在方向的热量较多， 因此， 将光 源朝凹槽外部安装， 有利于将较多的热量传递到透明或半透明高导热 性填充物， 便于实现良好的散热； 当然， 也可以采用其他的安装方式， 例如采用光源朝向所述竖向凹槽的底部的安装方式。
所述高出光率 LED灯条中的光源朝向所述环形凹槽的外部。其散 热原理与高出光率 LED灯条相同；当然，也可以采用其他的安装方式， 例如采用光源朝向所述竖向凹槽的底部的安装方式。
所述高出光率 LED灯条的大小与所述竖向凹槽或环形凹槽匹配。 即将所述高出光率 LED灯条刚好嵌套在凹槽内，该结构便于透明或半 透明高导热填充物的加工。
所述透明灯柱的顶面安装反光板， 该反光板能够将向上发散的灯 光向下汇聚， 能够进一步提升发光效率。
所述透明灯柱的顶面上安装安装高导热性能的散热块， 所述散热 块的外壁与所述灯壳的内壁连接。 通过设置散热块， 能够起到良好的 辅助散热作用。 进一步， 所述散热块与所述透明灯柱呈一体。 当然， 散热块和透明灯柱也可以是相互单独的结构， 只要将两者固定连接在 一起即可。
所述 LED驱动器的驱动电路包括第一电容、第一电阻、整流电路、 滤波电容和第二电阻， 市电接入端与所述第一电容连接， 所述第一电 阻和第一电容并联， 所述第一电容的另一端与所述整流电路的输入侧 连接， 所述整流电路的输出侧的两端与滤波电容连接， 所述第二电阻 与所述滤波电容并联， 所述滤波电容的两端与两个驱动电路输出接口 连接。
所述 LED驱动器的驱动电路包括第一电容、第一电阻、整流电路、 滤波电容、 第二电阻和功率因数提升电路， 市电接入端与所述第一电 容连接， 所述第一电阻和第一电容并联， 所述第一电容的另一端与所 述整流电路的输入侧连接， 所述整流电路的输出侧的正极端同时与第 二电阻一端和滤波电容正极连接， 所述整流电路的输出侧的负极端与 所述第二电阻另一端联接， 所述功率因数提升电路包括第二二极管、 第三二极管、 第四二极管和辅助滤波电容， 所述滤波电容的负极同时 与第二二极管的反向端和第三二极管的正向端连接， 所述第二二极管 的正向端与所述整流电路的输出侧的负极端连接， 所述整流电路的输 出侧的正极端与第四二极管的反向端连接， 所述第三二极管的反向端 同时与第四二极管的正向端、 辅助滤波电容的正极连接， 所述辅助滤 波电容的负极与所述整流电路的输出侧的负极端连接， 所述第二电阻 两端与两个驱动电路输出接口连接。
所述滤波电容的一端连接限流电阻， 所述限流电阻与一个驱动电 路输出接口连接， 所述整流电路的桥式整流电路。
所述透明灯柱的底部横截面比顶部横截面小。 当然， 也可以采用 等截面的结构形式。
所述透明灯柱的横截面呈圆形、 方形、 菱形或椭圆形。 当然， 也 可以采用其他形状。
在所述透明灯柱的侧面可以布置一根高出光率 LED灯条，也可以 布置两根或两根以上高出光率 LED灯条， 两根或两根以上高出光率
LED灯条等间隔布置。
本发明的有益效果主要表现在： 1、提高光利用率、提升散热性能; 2、 由于避免采用变压器，简化了电路组成，无高频振荡、无电磁辐射， 降低了能耗， 同时提高了电源转换效率； 3、 采用限流电阻， 在电源电 压发生异常波动时， 有效降低 LED灯的工作电流， 起到保护 LED的 作用； 4、加入由三个二极管和第三电容组成的功率因数提升电路， 能 够有效适应高功率因数场合。
附图说明
图 1是第一种高出光率 LED灯泡的示意图。
图 2是第二种高出光率 LED灯泡的示意图。
图 3是第三种高出光率 LED灯泡的示意图。
图 4是图 3的截面示意图。
图 5是第四种高出光率 LED灯泡的示意图。
图 6是第五种高出光率 LED灯泡的示意图。
图 7是一种驱动电路的示意图。
图 8是另一种驱动电路的示意图。
具体实施方式 下面结合附图对本发明作进一步描述。
参照图 1〜图 8， 一种高出光率 LED灯泡， 包括灯头 1、 灯壳 2、 LED驱动器 6和灯泡罩 5， 所述灯头 1与灯壳 2上端连接， 所述灯壳 2内安装所述 LED驱动器 6， 所述灯壳 2下端与灯泡罩 5连接， 所述 LED灯泡还包括高导热性能的透明灯柱 3， 所述透明灯柱 3位于所述 灯泡罩 5内， 所述透明灯柱 3的上方与所述灯壳 2下端连接， 所述透 明灯柱 3上安装所述高出光率 LED灯条 4，所述高出光率 LED灯条 4 包括依次串联的多个 LED芯片，所述透明灯柱 3的外侧与所述灯泡罩 5之间的空腔内填充透明或半透明高导热性填充物。
本实施例中的透明或半透明高导热性填充物， 可以选择透明的高 导热性能物质或半透明高导热物质， 例如氮化铝透明或半透明陶瓷， 只要能够将述高出光率 LED灯条 4发出的灯光透射出来即可， 当然， 也可以采用其他材料的透明或半透明高导热性物质。
本发明中的高导热性填充物可以充满所述透明灯柱的外侧与所述 灯泡罩之间的空腔， 也可以是局部填充； 对于局部填充的情况， 要求 先从灯泡罩的底部向上填充，至少填充物与所述透明灯柱的底面接触， 优选的方案是填充物同时与所述透明灯柱的四周侧面同时接触， 该结 构能够将所述高出光率 LED灯条产生的热量及时通过填充物发散。
本发明中， 填充物和灯泡罩可以呈一体， 即灯泡罩和填充物采用 相同的透明或半透明高导热材料， 一体化的结构便于加工； 当然， 也 可以是相互独立的结构形式。
透明灯柱的上端与所述灯壳之间卡扣式连接， 当然， 也可以采用 其他连接方式。 所述透明灯柱 3的侧面开有竖向凹槽， 所述竖向凹槽内安装高出 光率 LED灯条 4; 或者是： 所述透明灯柱 3呈阶梯形， 所述透明灯柱 3 的下部截面比上部截面小， 在台阶处开有环形凹槽， 所述环形凹槽 内安装高出光率 LED灯条 4， 所述高出光率 LED灯条 4包括依次串 联的多个 LED芯片。 当然， 也可以采用其他的装配方式。
所述透明灯柱 3可以为实心结构， 也可以为空心结构， 或者呈镂 空状； 当然， 也可以采用其他结构形式。
所述透明灯柱 3的底面开有环形凹槽， 所述环形凹槽内安装高出 光率 LED灯条 4。 对于灯泡罩 5属于白色或其他颜色， 如果只有竖向 布置的高出光率 LED灯条， 则在灯泡罩的底部容易产生阴影，在灯柱 的底面加设高出光率 LED灯条，不仅能够增大发光功率， 也能够有效 消除灯泡罩底部的阴影； 当然， 如果采用透明的灯泡罩， 则即便不设 置高出光率 LED灯条， 也不会在灯泡罩上产生阴影。
所述高出光率 LED灯条 4中的光源朝向所述竖向凹槽的外部。相 对而言， 高出光率 LED灯条中， LED芯片包含透明基板和光源， 透 明基板和光源均包覆在透明硅胶中，其中光源发出的光线向四周发散， 对于产生的热量， 相对而言， 光源所在方向的热量较多， 因此， 将光 源朝凹槽外部安装， 有利于将较多的热量传递到透明或半透明高导热 性填充物， 便于实现良好的散热； 当然， 也可以采用其他的安装方式， 例如采用光源朝向所述竖向凹槽的底部的安装方式。
所述高出光率 LED灯条 4中的光源朝向所述环形凹槽的外部。其 散热原理与高出光率 LED灯条相同； 当然， 也可以采用其他的安装方 式， 例如采用光源朝向所述竖向凹槽的底部的安装方式。 所述高出光率 LED灯条 4的大小与所述竖向凹槽或环形凹槽匹 配。即将所述高出光率 LED灯条刚好嵌套在凹槽内， 该结构便于透明 或半透明高导热填充物的加工。
所述透明灯柱 3的顶面安装反光板 7， 该反光板 7能够将向上发 散的灯光向下汇聚， 能够进一步提升发光效率。
所述透明灯柱 3的顶面上安装安装高导热性能的散热块 8， 所述 散热块 8的外壁与所述灯壳 2的内壁连接。 通过设置散热块 8， 能够 起到良好的辅助散热作用。 进一步， 所述散热块与所述透明灯柱呈一 体。 当然， 散热块和透明灯柱也可以是相互单独的结构， 只要将两者 固定连接在一起即可。
所述灯壳 2采用高导热性能材料， 所述灯壳 2的下部的壁面比上 部的壁面厚， 该结构有利于散热。 当然， 灯壳 2也可以采用壁面等厚， 或者其他方式。
所述灯壳 2的横截面呈圆形、 方形、 菱形、 椭圆形或正多边形。 当然， 也可以采用其他形状。
所述透明灯柱 3的底部横截面比顶部横截面小。 当然， 也可以采 用等截面的结构形式。
所述透明灯柱 3的横截面呈圆形、 方形、 菱形或椭圆形。 当然， 也可以采用其他形状。 在所述透明灯柱 3的侧面可以布置一根高出光 率 LED灯条， 也可以布置两根或两根以上高出光率 LED灯条， 两个 或两根以上高出光率 LED灯条等间隔布置。
本实施例的灯泡罩 5呈圆形、 方形、 菱形或椭圆形。 当然， 也可 以采用其他形状。参照图 3， 灯泡罩呈长条形， 参照图 4， 灯泡罩为长 方形， 灯泡罩的两端均设有灯壳和灯头的结构。
参照图 7， LED驱动器 6的驱动电路， 包括第一电容 Cl、 第一电 阻 Rl、 整流电路 Dl、 滤波电容 C2和第二电阻 R2， 市电接入端与所 述第一电容 C1连接， 所述第一电阻 R1和第一电容 C1并联， 所述第 一电容 C1的另一端与所述整流电路 D1的输入侧连接，所述整流电路 D1的输出侧的两端与滤波电容 C2连接， 所述第二电阻 R2与所述滤 波电容 C2并联，所述滤波电容 C2的两端与两个驱动电路输出接口连 接。
所述滤波电容 C2的一端连接限流电阻 R3 , 所述限流电阻 R3与 一个驱动电路输出接口连接。 所述整流电路 D1 为桥式整流电路。 当 然， 也可以选用其他常用的整流电路来实现。
本实施例中， 相对于现有技术， 没有采用 IC芯片和变压器， 采用 阻容方式来降压， 降压后再由整流滤波得到直流电源， 该直流电源提 供小电流高压 LED灯驱动，现对于现有电路没有高频振荡源， 从而无 高频辐射， LED光源工作所需的电压和电流参数通过电路中的电容容 量数值（第一电容 C1 )来调整； 优选的， 电源的输出经过串联电阻限 流后驱动 LED光源。
参照图 8， LED驱动器 6的包括第一电容 Cl、 第一电阻 Rl、 整 流电路 Dl、 滤波电容 C2和第二电阻 R2， 市电接入端与所述第一电 容 C1连接，所述第一电阻 R1和第一电容 C1并联，所述第一电容 C1 的另一端与所述整流电路 D1的输入侧连接，所述整流电路 D1的输出 侧的正极端同时与第二电阻 R2—端和第二电容 C2正极连接，所述整 流电路 D1的输出侧的负极端与所述第二电阻 R2另一端连接，所述功 率因数提升电路包括第二二极管 D2、第三二极管 D3、第四二极管 D4 和辅助滤波电容 C3 , 所述滤波电容 C2的负极同时与第二二极管 D2 的反向端和第三二极管 D3的正向端连接，所述第二二极管 D2的正向 端与所述所述整流电路的输出侧的负极端连接， 所述整流电路 D1 的 输出侧的正极端与第四二极管 D4的反向端连接， 所述第三二极管 D3 的反向端同时与第四二极管 D4的正向端、辅助滤波电容 C3的正极连 接， 所述辅助滤波电容 C3 的负极与所述整流电路的输出侧的负极端 连接， 所述第二电阻 R2两端与两个驱动电路输出接口连接。
所述整流电路 D1 为桥式整流电路。 当然， 也可以选用其他常用 的整流电路来实现。
本实施例中， 设定二极管包括正向端和反向端， 当电流通过二极 管时， 从正向端向反向端流过。
本实施例中， 相对于现有技术， 没有采用 IC芯片和变压器， 采用 阻容方式来降压， 降压后再由整流滤波得到直流电源， 该直流电源提 供小电流高压 LED灯驱动，现对于现有电路没有高频振荡源， 从而无 高频辐射， LED光源工作所需的电压和电流参数通过电路中的电容容 量数值 （第一电容 C1 ) 来调整； 优选的， 电源的输出直接驱动 LED 光源。
采用功率因数提升电路，能够提高整个 LED灯驱动电路的功率因 数， 有效满足光源功率因数为高功率因数场合。
本说明书的实施例所述的内容仅仅是对发明构思的实现形式的列 举， 本发明的保护范围不应当被视为仅限于实施例所陈述的具体形式， 本发明的保护范围也及于本领域技术人员根据本发明构思所能够想到 的等同技术手段-

Claims

权 利 要 求 书
1、一种高出光率 LED灯泡， 包括灯头、灯壳、 LED驱动器和灯泡罩， 所述灯头与灯壳上端连接，所述灯壳内安装所述 LED驱动器，所述灯 壳下端与灯泡罩连接，其特征在于：所述 LED灯泡还包括高导热性能 的透明灯柱， 所述透明灯柱位于所述灯泡罩内， 所述透明灯柱的上方 与所述灯壳下端连接， 所述透明灯柱上安装所述高出光率 LED灯条， 所述高出光率 LED灯条包括依次串联的多个 LED芯片， 所述透明灯 柱的外侧与所述灯泡罩之间的空腔内填充透明或半透明高导热性填充
2、 如权利要求 1所述的高出光率 LED灯泡， 其特征在于： 所述透明 灯柱的侧面开有竖向凹槽，所述竖向凹槽内安装所述高出光率 LED灯
3、 如权利要求 1所述的高出光率 LED灯泡， 其特征在于： 所述透明 灯柱呈阶梯形， 所述透明灯柱的下部截面比上部截面小， 在台阶处开 有环形凹槽， 所述环形凹槽内安装高出光率 LED灯条。
4、 如权利要求 1~3之一所述的高出光率 LED灯泡， 其特征在于： 所 述透明或半透明高导热性填充物和灯泡罩呈一体。
5、 如权利要求 2所述的高出光率 LED灯泡， 其特征在于： 所述透明 灯柱的底面开有环形凹槽， 所述环形凹槽内安装高出光率 LED灯条， 所述高出光率 LED灯条的光源朝向所述竖向凹槽和环形凹槽的外部。
6、 如权利要求 4所述的高出光率 LED灯泡， 其特征在于： 所述高出 光率 LED灯条的大小与所述竖向凹槽或环形凹槽匹配。
7、 如权利要求 1~3之一所述的高出光率 LED灯泡， 其特征在于： 所 述透明灯柱的顶面安装反光板。
8、 如权利要求 1~3之一所述的高出光率 LED灯泡， 其特征在于： 所 述透明灯柱的顶面上安装高导热性能的散热块， 所述散热块的外壁与 所述灯壳的内壁连接。
9、 如权利要求 1~3之一所述的高出光率 LED灯泡， 其特征在于： 所 述 LED驱动器的驱动电路包括第一电容、第一电阻、 整流电路、滤波 电容和第二电阻， 市电接入端与所述第一电容连接， 所述第一电阻和 第一电容并联，所述第一电容的另一端与所述整流电路的输入侧连接， 所述整流电路的输出侧的两端与滤波电容连接， 所述第二电阻与所述 滤波电容并联， 所述滤波电容的两端与两个驱动电路输出接口连接。
10、如权利要求 1~3之一所述的高出光率 LED灯泡， 其特征在于： 所 述 LED驱动器的驱动电路包括第一电容、第一电阻、 整流电路、滤波 电容、 第二电阻和功率因数提升电路， 市电接入端与所述第一电容连 接， 所述第一电阻和第一电容并联， 所述第一电容的另一端与所述整 流电路的输入侧连接， 所述整流电路的输出侧的正极端同时与第二电 阻一端和滤波电容正极连接， 所述整流电路的输出侧的负极端与所述 第二电阻另一端联接， 所述功率因数提升电路包括第二二极管、 第三 二极管、 第四二极管和辅助滤波电容， 所述滤波电容的负极同时与第 二二极管的反向端和第三二极管的正向端连接， 所述第二二极管的正 向端与所述整流电路的输出侧的负极端连接， 所述整流电路的输出侧 的正极端与第四二极管的反向端连接， 所述第三二极管的反向端同时 与第四二极管的正向端、 辅助滤波电容的正极连接， 所述辅助滤波电 容的负极与所述整流电路的输出侧的负极端连接， 所述第二电阻两端 与两个驱动电路输出接口连接； 所述滤波电容的一端连接限流电阻， 所述限流电阻与一个驱动电路输出接口连接， 所述整流电路的桥式整 流电路。
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