WO2015018138A1 - 导电银胶及其制备方法 - Google Patents

导电银胶及其制备方法 Download PDF

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Publication number
WO2015018138A1
WO2015018138A1 PCT/CN2013/086588 CN2013086588W WO2015018138A1 WO 2015018138 A1 WO2015018138 A1 WO 2015018138A1 CN 2013086588 W CN2013086588 W CN 2013086588W WO 2015018138 A1 WO2015018138 A1 WO 2015018138A1
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Prior art keywords
conductive silver
epoxy resin
silver paste
conductive
curing
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French (fr)
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石博
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Priority to US14/379,457 priority Critical patent/US9567496B2/en
Publication of WO2015018138A1 publication Critical patent/WO2015018138A1/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic

Definitions

  • Embodiments of the invention relate to a conductive silver paste and a method of making the same. Background technique
  • the IPS (In-Plane Switching) and the Fringe Field Switching (FFS) liquid crystal display products need to be grounded on the back surface conductive layer (ITO) of the color filter substrate and the array substrate.
  • Silver glue is applied to the resistance area.
  • Conventional epoxy conductive silver paste is usually prepared by using a sheet-like or dendritic silver powder in combination with a certain proportion of epoxy resin, curing agent, dispersant, and the like.
  • the conductive silver paste has a high curing temperature and a long curing time, and is usually heated at about 70 ° C for 2 hours, which affects the productivity of the surface mount chip (COG, Chip On Glass) of the glass substrate.
  • the existing conductive silver paste is cured on the surface when heated, and the surface solidified silver gel forms a layer of "coating" 1-1, which makes the organic emulsifier in the uncured silver gel 1-2 difficult. It evaporates and the external heat is hard to communicate to the internal 4 gel, which makes the curing time increase, as shown in Figure 1.
  • the sheet-like or dendritic silver powder has poor fluidity, it is necessary to add more organic solvent and or dispersant to ensure a proper viscosity.
  • the volatilization of the organic solvent and the dispersing agent causes the silver gel to shrink in volume (especially in the thickness direction).
  • the current silver colloid has a longitudinal shrinkage ratio of 35-46%, which is easy to be between the color filter substrate 2 and the array substrate 3.
  • the conductive silver paste 1 at the junction is too thin, even broken, to lose conductive properties, as shown in Figures 2A and 2B. Summary of the invention
  • Embodiments of the present invention provide a conductive silver paste having a short curing time and a low shrinkage.
  • Embodiments of the present invention also provide a method of preparing the conductive silver paste.
  • the conductive silver paste provided by the embodiment of the invention comprises silver powder, wherein the silver powder is spherical silver powder.
  • the spherical silver powder has a particle diameter of 1 to 10 ⁇ m.
  • the conductive silver paste may include 50 to 60% of spherical silver powder by weight.
  • the conductive silver paste may further include 3 to 10% of a promoter and 0.5 to 3% of a catalyst by weight; the accelerator is a moisture-curable polyurethane, and the catalyst is a polyethylene glycol ether.
  • the conductive silver paste may further comprise 10 to 15% epoxy resin, 15 to 25% dispersant, and 1 to 5% curing agent by weight.
  • the epoxy resin may be one or more selected from the group consisting of bisphenol A type epoxy resins, aliphatic epoxy resins, and phenolic epoxy resins.
  • the dispersing agent may be selected from one or more of ethanol, isopropanol, acetone, cyclohexanone, ethylene glycol diethyl ester, and ethylene glycol butyl ether acetate.
  • the curing agent may be selected from one or more of dicyandiamide, imidazole, and adipic acid dihydrazide.
  • the preparation method of the conductive silver paste provided by the embodiment of the invention is: mixing spherical silver powder, epoxy resin, agent, curing agent, accelerator and catalyst, and stirring until uniformly dispersed.
  • Figure 1 is a schematic view of a conductive silver paste when it is cured by heating
  • FIGS. 2A and 2B are respectively schematic diagrams of shrinkage of conductive silver paste between substrates before and after curing;
  • FIG. 3A is an SEM picture of flake silver powder;
  • FIG. 3B is an SEM picture of spherical silver powder;
  • FIG. 4 is a cured view of the conductive silver paste of the present invention; State diagram
  • Fig. 5 is a plan view (under the microscope) of the conductive silver paste of Example 1 after it is cured on the substrate. Reference mark:
  • Embodiments of the present invention provide a conductive silver paste comprising silver powder, which is a spherical silver powder.
  • the spherical silver powder and the common flake silver powder have a large difference in microstructure (see Figures 3 ⁇ and 3 ⁇ ).
  • the microscopic stacking of spherical silver powder is three-dimensional communication type.
  • the spherical silver powder 4 is relatively neatly stacked by the colloidal portion 5, and the adjacent spherical silver powders 4 are joined to each other, whereby electrical conduction can be achieved.
  • the colloidal portion 5 is a material (epoxy resin, accelerator, etc.) other than silver powder in the silver paste after curing.
  • the structure facilitates the volatilization of the organic substance in the curing of the silver paste, thereby accelerating the curing rate of the silver paste and improving the curing efficiency.
  • the spherical silver powder also has excellent fluidity, reduces the amount of dispersant used in the silver paste, and effectively reduces the volume shrinkage when the silver paste is cured.
  • the use of such a conductive silver paste can improve the quality of, for example, IPS type and FFS type liquid crystal display products, such as the problems shown in Figs. 2A and 2B when connecting the array substrate and the color filter substrate.
  • the spherical silver powder has a particle diameter of 1 to 10 ⁇ m.
  • the conductive silver paste comprises 50 to 60% of spherical silver powder by weight percentage.
  • the conductive silver paste further comprises 3 to 10% of a promoter and 0.5 to 3% of a catalyst by weight;
  • the accelerator is a moisture-curable polyurethane
  • the catalyst is a polyethylene glycol ether.
  • the accelerator can react with the moisture in the air to exotherm, so that it can be heated from the "inside" of the silver paste, and combined with the heating of the "outside” (oven), the heating efficiency can be maximized, thereby enabling the heating efficiency to be maximized.
  • the conductive silver paste provided by the embodiment of the present invention may further comprise 10 to 15% epoxy resin, 15 to 25% of the agent, and 1 to 5% of the curing agent.
  • the epoxy resin may be any suitable epoxy resin, such as any epoxy resin used in conventional conductive silver paste.
  • the epoxy resin includes, but is not limited to, one or more of a bisphenol quinone type epoxy resin, an aliphatic epoxy resin, and a novolac epoxy resin.
  • the dispersing agent may be any suitable dispersing agent such as any of the dispersing agents used in conventional conductive silver paste.
  • the dispersing agent includes, but is not limited to, one or more of ethanol, isopropyl alcohol, acetone, cyclohexanone, ethylene glycol diethyl ester, and ethylene glycol butyl ether acetate.
  • the curing agent may be any suitable curing agent, for example, Any of the curing agents used in the conductive silver paste.
  • the curing agent includes, but is not limited to, one or more of dicyandiamide, imidazole, and adipic acid dihydrazide.
  • the preparation method of the conductive silver paste provided by the embodiment of the invention is: mixing the spherical silver powder, the epoxy resin, the agent, the curing agent, the accelerator and the catalyst until uniformly dispersed.
  • the order of addition of the components of the conductive silver paste is not particularly limited.
  • the above preparation may be carried out by mixing and dispersing using a high-speed dispersing machine; or by a person skilled in the art.
  • the spherical silver powder has a particle size ranging from 1-10 ⁇ m
  • the bisphenol oxime epoxy resin is epoxy resin 618 (E-51)
  • the moisture-curing polyurethane model is KS991
  • the polyethylene glycol ether model It is a polyether F-68; the fat epoxy resin model is JEw-0110.
  • Formulation (parts by weight): 52 parts of spherical silver powder, 15 parts of bisphenol A epoxy resin, 18 parts of cyclohexanone, 4 parts of dicyandiamide, 1 part of imidazole, 9 parts of moisture-curing polyurethane and 1 part of polyethylene glycol ether.
  • Preparation process The above components are mixed, stirred, and defoamed until the components are uniformly dispersed to obtain a finished conductive silver paste.
  • the conductive silver paste has a curing temperature of about 70 ° C, a curing time of about 15 min, a longitudinal shrinkage of about 15% after curing, a transverse shrinkage of less than 5%, and a resistivity of less than 1.2 ⁇ 1 ( ⁇ 4 ⁇ « ⁇ .
  • the appearance of the back is shown in Figure 5.
  • Component formulation (parts by weight): 50 parts of spherical silver powder, 10 parts of bisphenol oxime epoxy resin, 4 parts of fat epoxy resin, 21 parts of isopropyl alcohol, 4 parts of adipic acid dihydrazide, 9 parts of moisture-curing polyurethane and 2 parts of polyethylene glycol ether.
  • the conductive silver paste has a curing temperature of about 70 ° C, a curing time of about 16 min, a longitudinal shrinkage of about 17% after curing, a transverse shrinkage of less than 5%, and a resistivity of less than 1.2 ⁇ 10 ⁇ 4 ⁇ ( ⁇ .
  • Example 3 Formulation (parts by weight): 56 parts of spherical silver powder, 10 parts of bisphenol A epoxy resin, 2 parts of aliphatic epoxy resin, 16 parts of acetone, 2 parts of adipic acid dihydrazide, 2 parts of dicyandiamide, 1 part Imidazole, 9.5 parts of moisture-curing polyurethane and 1.5 parts of polyethylene glycol ether.
  • the conductive silver paste has a curing temperature of about 70 ° C, a curing time of about 14 min, a longitudinal shrinkage of about 14% after curing, a transverse shrinkage of less than 5%, and a resistivity of less than 1.2 ⁇ 10 ⁇ 4 ⁇ ⁇ ( ⁇ .
  • Component formulation (parts by weight): 60 parts of spherical silver powder, 10 parts of bisphenol oxime epoxy resin, 15 parts of cyclohexanone, 2 parts of dicyandiamide, 1 part of imidazole, 10 parts of moisture-curing polyurethane and 2 parts of polyethylene glycol ether.
  • the conductive silver paste has a curing temperature of about 70 ° C, a curing time of about 13 min, a longitudinal shrinkage of about 12% after curing, a transverse shrinkage of less than 5%, and a resistivity of less than 1.2 ⁇ 10 ⁇ 4 ⁇ ( ⁇ .
  • a conductive silver paste was prepared in the same manner as in Example 1 except that flake silver powder was used instead of spherical silver powder (to increase the fluidity of the silver powder and the dispersant amount was doubled).
  • the conductive silver paste has a curing temperature of about 70 ° C, a curing time of about 120 min, a longitudinal shrinkage of about 41% after curing, a transverse shrinkage of about 5%, and a resistivity of less than 1.2 ⁇ 10 ⁇ 4 ⁇ ( ⁇ .
  • Conductive silver paste was prepared in the same manner as described in Example 1, except that no promoter and catalyst were added.
  • the conductive silver paste has a curing temperature of about 70 ° C, a curing time of about 60 min, a longitudinal shrinkage of about 15% after curing, a transverse shrinkage of about 5%, and a resistivity of less than 1.2 ⁇ 10 ⁇ 4 ⁇ ( ⁇ .
  • the embodiment of the invention provides a conductive silver paste using spherical silver powder as a main raw material, and the microscopic stacking is three-dimensional communication type, and has good fluidity, high heating efficiency, low shrinkage after curing, and prepared IPS type and FFS type liquid crystal.
  • the product quality is high.
  • the conductive silver paste of the embodiment of the present invention can also add a promoter and a catalyst, which can change the heating mode, thereby making the heating and curing efficiency of the silver glue higher and more uniform, significantly shortening the curing time and increasing the productivity.
  • the method for preparing the conductive silver glue provided by the embodiment of the invention is simple, and is suitable for industrial application.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

一种导电银胶包括银粉，该银粉为球形银粉。还公开了一种导电银胶的制备方法。该导电银胶的加热固化效率更高、更均匀，明显缩短了固化时间、提高了产能。

Description

导电银胶及其制备方法 技术领域
本发明的实施例涉及一种导电银胶及其制备方法。 背景技术
为了传到导静电， 面内开关型 （IPS, In-Plane Switching )和边缘电场开 关型 （FFS, Fringe Field Switching )液晶显示产品需要在彩膜基板的背面导 电层（ITO )和阵列基板的接地电阻区域上点银胶。 传统的环氧导电银胶通 常采用片状或枝状银粉， 配合一定比例的环氧树脂、 固化剂、分散剂等制得。 这种导电银胶固化温度高， 固化时间长， 通常为 70°C左右加热 2小时， 影响 玻璃基板表面封装芯片 （COG, Chip On Glass )产能。 为了加快周转速度， 不得不在产线设置更多的烘箱， 这不但增加了设备投入而且又受到产线空间 的限制， 同时长时间高温加热还容易造成托盘变形， 造成资材损耗。
这种现有的导电银胶在加热时表面先固化， 表面已固化银胶形成了一层 "外衣 "1-1包裹，这使得内部未固化的银胶 1-2中的有机^:剂难以挥发出来， 同时外部热量较难传达到内部 4艮胶， 使得固化时间增长， 如图 1所示。 另一 方面， 由于片状或枝状的银粉流动性较差， 所以为保证合适的黏度， 需要添 加较多的有机溶剂和或分散剂。 银胶固化后， 有机溶剂和分散剂的挥发导致 银胶体积缩小 （厚度方向尤为严重） ， 目前的银胶纵向收缩比率为 35-46%, 容易在彩膜基板 2和阵列基板 3之间的连接处的导电银胶 1过薄， 甚至断开 而失去导电特性， 如图 2A和 2B所示。 发明内容
本发明的实施例提供了一种固化时间短、 收缩率低的导电银胶。
本发明的实施例还提供一种所述导电银胶的制备方法。
本发明的实施例提供的导电银胶， 包括银粉， 其中， 所述银粉为球形银 粉。
例如， 所述球形银粉的粒径为 1 ~ 10μηι。 例如， 所述导电银胶中按重量百分比可以包括 50 ~ 60%的球形银粉。 例如， 所述导电银胶中按重量百分比还可以包括 3 ~ 10%的促进剂和 0.5 ~ 3%催化剂； 所述促进剂为湿固化型聚氨酯， 所述催化剂为聚乙二醇醚。
例如，所述导电银胶按重量百分比还可以包括 10 ~ 15%的环氧树脂、 15 ~ 25%的分散剂、 1 ~ 5%的固化剂。
例如， 所述环氧树脂可以选自双酚 A型环氧树脂、 脂肪族环氧树脂、 酚 醛环氧树脂中的一种或多种。
例如， 所述分散剂选可以自乙醇、 异丙醇、 丙酮、 环己酮、 乙二醇二乙 酯、 乙二醇丁醚醋酸酯中的一种或多种。
例如， 所述固化剂可以选自双氰胺、 咪唑、 己二酸二酰肼中的一种或多 种。
本发明实施例提供的导电银胶的制备方法为： 将球形银粉、 环氧树脂、 剂、 固化剂、 促进剂以及催化剂混合， 搅拌直至均匀分散。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1 是导电银胶加热固化时的示意图；
图 2A和 2B 分别是固化前后导电银胶在基板间的收缩示意图； 图 3A是片状银粉的 SEM图片； 图 3B是球形银粉的 SEM图片； 图 4是本发明所述导电银胶固化后的状态示意图；
图 5 是实施例 1所述导电银胶涂于基板固化后的俯视图 （显微镜下 ) 。 附图标记：
1、 导电银胶， 1-1、 表面已固化银胶， 1-2、 内部未固化银胶； 2、 彩膜 基板； 3、 阵列基板； 4、 球形银粉； 5、 固化后银胶中除了银粉的部分（环氧 树脂、 促进剂等） 。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
本发明实施方式提供了一种导电银胶，其包括银粉，该银粉为球形银粉。 球形银粉和常见片状银粉在微观结构上具有^艮大差异（参见图 3Α 和 3Β )。 球形银粉的微观堆垛呈三维联通型。 例如， 见图 4的示意图所示， 球 形银粉 4通过胶体部分 5较为整齐地堆垛， 相邻的球形银粉 4相接， 由此可 以实现导电。 胶体部分 5为固化后银胶中除了银粉的材料（环氧树脂、 促进 剂等） 。 这种结构便于银胶固化时其中的有机物质更好地挥发， 从而加快了 银胶的固化速率、 提高了固化效率。 同时， 球形银粉还具有优良的流动性， 减少了银胶中分散剂等的使用量， 并有效降低了银胶固化时的体积收缩率。 使用这种导电银胶可提高例如 IPS型和 FFS型液晶显示产品的质量， 例如在 连接阵列基板和彩膜基板时避免如图 2A和 2B所示的问题。
优选地， 例如， 球形银粉的粒径为 1 ~ 10μηι。 优选地， 例如， 导电银胶 中按重量百分比包括 50 ~ 60%的球形银粉。
优选地，例如，导电银胶中按重量百分比还包括 3 ~ 10%的促进剂和 0.5 ~ 3%催化剂；例如，所述促进剂为湿固化型聚氨酯，所述催化剂为聚乙二醇醚。 在催化剂的催化作用下， 促进剂能与空气中的水分反应放热， 从而可从银胶 "内部 "进行加热， 结合"外界"（烘箱） 的加热， 可以最大程度地提高加热效 率， 从而能明显缩短加热时间、 降低加热温度。
本发明实施方式提供的导电银胶按重量百分比还可以包括 10 ~ 15%的环 氧树脂、 15 ~ 25%的^:剂、 1 ~ 5%的固化剂。
本发明实施方式的导电银胶中， 环氧树脂可以为任何适用的环氧树脂， 例如传统导电银胶使用的任一种环氧树脂。 优选地， 该环氧树脂包括但不限 于双酚 Α型环氧树脂、 脂肪族环氧树脂、 酚醛环氧树脂中的一种或多种。
本发明实施方式的导电银胶中， 分散剂可为任何适用的分散剂， 例如传 统导电银胶使用的任一种分散剂。 优选地， 该分散剂包括但不限于乙醇、 异 丙醇、 丙酮、 环己酮、 乙二醇二乙酯、 乙二醇丁醚醋酸酯中的一种或多种。
本发明实施方式的导电银胶中， 固化剂可为任何适用的固化剂， 例如传 统的导电银胶使用的任一种固化剂。优选地，该固化剂包括但不限于双氰胺、 咪唑、 己二酸二酰肼中的一种或多种。
本发明实施方式提供的导电银胶制备方法为： 将球形银粉、 环氧树脂、 剂、 固化剂、 促进剂以及催化剂混合搅拌直至均匀分散。
上述制备方法中， 导电银胶各成分的加料顺序没有特别限定。 上述制备 可选用高速分散机进行混合分散； 或由本领域普通技术人员进行筒单改变即 付。
以下实施例用于说明， 而非用来限制本发明的范围。 若未特别指明， 实 施例中所用的试剂均为常规市售试剂， 实施例中所用的技术手段为本领域技 术人员所熟知的常规手段。
仅为示例性地， 实施例中球形银粉的粒径范围为 1-10μηι, 双酚 Α环氧 树脂为环氧树脂 618 ( E-51 ) ； 湿固化聚氨酯型号为 KS991 ; 聚乙二醇醚型 号为聚醚 F-68; 脂肪环氧树脂型号为 JEw-0110。
实施例 1
组分配方（重量份） ： 52份球形银粉、 15份双酚 A环氧树脂、 18份环 己酮、 4份双氰胺、 1份咪唑、 9份湿固化聚氨酯以及 1份聚乙二醇醚。
制备过程： 将上述各个组分混合后进行搅拌， 脱泡， 直至各组分分散均 匀得到成品导电银胶。
上述导电银胶的固化温度约为 70°C , 固化时间约为 15min, 固化后纵向 收缩率约为 15%, 横向收缩率小于 5%, 电阻率小于 1.2χ1(Τ4 Ω·«η。 固化后 的外观见图 5。
实施例 2
组分配方（重量份）： 50份球形银粉、 10份双酚 Α环氧树脂、 4份脂肪 环氧树脂、 21份异丙醇、 4份己二酸二酰肼、 9份湿固化聚氨酯以及 2份聚 乙二醇醚。
制备过程同实施例 1。
上述导电银胶的固化温度约为 70°C , 固化时间约为 16min, 固化后纵向 收缩率约为 17%, 横向收缩率小于 5%, 电阻率小于 1.2χ 10·4 Ω·(πη。
实施例 3 组分配方（重量份）： 56份球形银粉、 10份双酚 A环氧树脂、 2份脂肪 环氧树脂、 16份丙酮、 2份己二酸二酰肼、 2份双氰胺、 1份咪唑、 9.5份湿 固化聚氨酯以及 1.5份聚乙二醇醚。
制备过程同实施例 1。
上述导电银胶的固化温度约为 70°C , 固化时间约为 14min, 固化后纵向 收缩率约为 14%, 横向收缩率小于 5%, 电阻率小于 1.2χ10·4 Ω·(πη。
实施例 4
组分配方（重量份） ： 60份球形银粉、 10份双酚 Α环氧树脂、 15份环 己酮、 2份双氰胺、 1份咪唑、 10份湿固化聚氨酯以及 2份聚乙二醇醚。
制备过程同实施例 1。
上述导电银胶的固化温度约为 70°C , 固化时间约为 13min, 固化后纵向 收缩率约为 12%, 横向收缩率小于 5%, 电阻率小于 1.2χ10·4 Ω·(πη。
对比例 1
除使用片状银粉代替球形银粉（为保证银粉流动性， 分散剂用量增加 1倍）之外， 按实施例 1所述相同的过程制备导电银胶。
上述导电银胶的固化温度约为 70°C , 固化时间约为 120min, 固化后纵 向收缩率约为 41%, 横向收缩率约为 5%, 电阻率小于 1.2χ10·4 Ω·(πη。
对比例 2
除不添加促进剂和催化剂外，按实施例 1所述相同的过程制备导电银胶。 上述导电银胶的固化温度约为 70°C , 固化时间约为 60min, 固化后纵向 收缩率约为 15%, 横向收缩率约为 5%, 电阻率小于 1.2χ10·4 Ω·(πη。
本发明实施例提供了采用了球形银粉作为主要原料的导电银胶， 其微观 堆垛呈三维联通型，且流动性好，加热效率高， 固化后收缩率低， 制备的 IPS 型和 FFS型液晶显示产品质量高。本发明实施例的导电银胶还可以添加促进 剂和催化剂， 这能够改变加热方式， 从而使银胶的加热固化效率更高、 更均 匀， 明显缩短了固化时间、 提高了产能。 本发明实施例提供的导电银胶制备 方法工艺筒单， 适宜工业化应用。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1、 一种导电银胶， 包括银粉， 其中， 所述银粉为球形银粉。
2、 根据权利要求 1所述的导电银胶， 其中， 所述球形银粉的粒径为 1 ~ 10μηι。
3、根据权利要求 1或 2所述的导电银胶， 其中， 所述导电银胶中按重量 百分比包括 50 ~ 60%的球形银粉。
4、 根据权利要求 1-3任一所述的导电银胶， 其中， 所述导电银胶中按重 量百分比还包括 3 ~ 10%的促进剂和 0.5 ~ 3%的催化剂；所述促进剂为湿固化 型聚氨酯， 所述催化剂为聚乙二醇醚。
5、根据权利要求 4所述的导电银胶， 其中， 所述导电银胶按重量百分比 还包括 10 ~ 15%的环氧树脂、 15 ~ 25%的分散剂、 1 ~ 5%的固化剂。
6、 根据权利要求 5所述的导电银胶， 其中， 所述环氧树脂选自双酚 A 型环氧树脂、 脂肪族环氧树脂、 酚醛环氧树脂中的一种或多种。
7、 根据权利要求 5或 6所述的导电银胶， 其中， 所述^:剂选自乙醇、 异丙醇、 丙酮、 环己酮、 乙二醇二乙酯、 乙二醇丁醚醋酸酯中的一种或多种。
8、 根据权利要求 5-7任一所述的导电银胶， 其中， 所述固化剂选自双氰 胺、 咪唑、 己二酸二酰肼中的一种或多种。
9、 权利要求 5-8任一项所述导电银胶的制备方法， 其中， 将球形银粉、 环氧树脂、 剂、 固化剂、 促进剂以及催化剂混合， 搅拌直至均匀分散。
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