WO2015014219A1 - 光伏焊带 - Google Patents

光伏焊带 Download PDF

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Publication number
WO2015014219A1
WO2015014219A1 PCT/CN2014/082452 CN2014082452W WO2015014219A1 WO 2015014219 A1 WO2015014219 A1 WO 2015014219A1 CN 2014082452 W CN2014082452 W CN 2014082452W WO 2015014219 A1 WO2015014219 A1 WO 2015014219A1
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WO
WIPO (PCT)
Prior art keywords
conductive base
groove
grooves
base tape
strip
Prior art date
Application number
PCT/CN2014/082452
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English (en)
French (fr)
Inventor
钱海鹏
于昊
Original Assignee
凡登(江苏)新型材料有限公司
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Publication of WO2015014219A1 publication Critical patent/WO2015014219A1/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876Particular processes or apparatus for batch treatment of the devices
    • H01L31/188Apparatus specially adapted for automatic interconnection of solar cells in a module
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Definitions

  • the utility model belongs to the technical field of photovoltaic tape processing, in particular to a photovoltaic band.
  • the sling is an important raw material in the process of splicing of PV modules.
  • the quality of ⁇ belt will directly affect the collection efficiency of PV modules, which has a great impact on the power of PV modules. How to increase the conversion rate of the cell sheet and reduce the fragmentation rate through the isomerization of the ribbon has always been one of the research topics in the industry.
  • Cida Patent No. CN101789452A discloses a tin-coated ribbon comprising a copper strip and a tin-coated layer on its surface, the surface of the tin-coated layer having a uniformly distributed pit-like body.
  • This kind of slingband causes the sunlight to diffusely reflect in the pit, increasing the energy of receiving sunlight.
  • the pit-like body only diffusely reflects, the proportion of sunlight reflected back to the cell sheet is small, and the conversion rate is limited; in addition, the pit is prepared during the tin-coating process, which produces an uneven layer of tantalum. And it will produce a phenomenon that the battery is not firmly connected, and there is a vain.
  • Cigar Patent No. CN 102569470 A discloses a V-groove prepared on the surface of an ankle tape perpendicular to the length of the ankle strap to reduce the crack and chip rate of the battery sheet.
  • the patented V-groove is perpendicular to the length direction and has no significant spacing between the V-grooves. Therefore, the strap is unstable when it is spliced to the battery, and the splicing is not strong.
  • the technical problem to be solved by the utility model is: In order to overcome the fact that the existing photovoltaic tape cannot reflect the solar light efficiently to the cell sheet, even if there are pits on the surface of the tape which are diffusely reflected, the reflection ratio is low, and the pit is concave.
  • the manufacture will affect the quality of the ankle strap, so that the opposite surface of the ankle strap has a protrusion; and at the same time, the number of the pit greatly affects the lack of the fastening strength of the ankle strap, and the utility model provides A photovoltaic entrainment belt, which increases the ratio of total reflection of sunlight reflected by the crucible belt in the glass-to-air interface layer of the photovoltaic cell module, and the totally reflected sunlight re-engages in photoelectric conversion, thereby replacing the battery assembly
  • the power is increased by 0.5% to 2.5%, and to some extent, the internal stress of the solar cell after the splicing is reduced, so that no debris due to thermal expansion and contraction of the sling is generated; and even if the surface is pressed
  • the groove can also ensure the effective splicing area, thus ensuring the firmness of the splicing.
  • a photovoltaic tape comprising a conductive base tape, the conductive base tape being a metal elemental or alloy material having two upper and lower wide surfaces; the conductive base tape One or two wide surfaces are pressed with a plurality of grooves, and a base strip plane is left between adjacent ones, and the total area of the base strip plane of the same wide surface occupies an area ratio of 25 of the surface area of the conductive base. %-75%;
  • the groove depth is 5% - 50% of the thickness of the conductive base tape
  • the groove depth is 5% to 45% of the thickness of the conductive base tape, and the sum of the maximum depths of the upper and lower wide surface grooves does not exceed 50 of the thickness of the conductive base tape.
  • the conductive base tape is plated or thermally coated with a coating layer, and the coating layer may be directly plated or thermally coated on the conductive base tape, or a protective film may be first formed on the conductive base tape, and then electroplated or Hot coating of the layer.
  • the surface of the conductive base tape may have only one wide surface plated or hot coated layer, so that the surface of the conductive base tape with the groove may have a layer of tantalum or no material.
  • the surface of the conductive base tape with the groove may have a layer of tantalum or no material.
  • the ratio of the total area of the baseband plane to the area of the surface of the conductive substrate is a key factor, so that even if the surface of the tape is pressed with a groove, the area of the effective splicing can be ensured, thereby ensuring the firmness of the splicing. At the same time, the depth of the groove is limited, within which the pressing of the groove does not affect the opposing faces of the pressed grooves on the base tape.
  • the groove on the conductive base tape is regular along the length of the conductive baseband on the surface of the conductive baseband Sexual repetition.
  • the proportion of total reflection on the conductive baseband is evenly distributed; on the other hand, the baseband plane is evenly distributed, thereby facilitating the splicing, and at the same time, facilitating the processing of the conductive baseband.
  • the base tape of the tape is generally copper or copper alloy
  • the battery chip is silicon wafer
  • the thermal expansion coefficient of copper or copper alloy is larger than that of silicon.
  • the baseband expands in both the length and width directions after being heated. After cooling, the baseband shrinks more than the battery. Since the sling and the battery are fixed, the sling will act on the battery. The force that is locally bent inward causes the cell sheet to locally deform.
  • the recess is a linear strip groove and/or a curved strip groove.
  • the grooves are distributed across the same wide face, including both cross-distribution and parallel.
  • the inclination angles of the two intersecting grooves may be uniform, for example, 60 degrees, that is, the two intersecting grooves are mirror images of the length of the conductive base strip; or they may be different.
  • the grooves are linear strip-shaped grooves
  • a quadrilateral base band plane is formed between the adjacent grooves. Since the linear strip groove is inexpensive to manufacture, and since the base tape is expanded in the length and width directions after being heated, the internal stress can be uniformly reduced in the length and width directions.
  • a rhombic baseband plane between the adjacent grooves Forming a rhombic baseband plane between the adjacent grooves, and a total area of the baseband plane of the same wide surface occupies 30%-60% of the area of the conductive bandwidth bandwidth surface; wherein the groove is divided into Two oblique directions, and the grooves of the two oblique directions are mirror images of each other with respect to the longitudinal direction of the conductive base tape, and the angle between the grooves of the two oblique directions and the width direction of the conductive base tape are at Between 25 ° - 65 °.
  • the grooves are distributed in parallel on the same wide face, and may be parallel or inclined with respect to the width direction of the conductive base tape or parallel to the longitudinal direction of the conductive base tape.
  • the groove further includes a dot-shaped groove, a planar groove, and a one side along the length of the conductive base tape Or pressing one or more of the grooves formed by the bevel on both sides.
  • the grooves are all point-like grooves or are all planar grooves are also included in the protection scope of the present invention.
  • grooves in which the grooves are all formed on one side or both sides of the conductive base strip are also included in the scope of protection of the present invention. Further, when one side or both sides of the entire length direction of the conductive base tape presses the inclined surface which is inclined outwardly of the conductive base tape, as a limit of the groove, the groove becomes a slope.
  • the ability of the groove to reflect sunlight back to the cell sheet is improved, at least a point on the bottom surface of the groove on the conductive base tape is concave
  • the angle of the inclined surface of the groove is 20. 9 ° -45 °.
  • Light enters the light-diffusing medium from the optically dense medium.
  • the angle of refraction reaches 90 °, the refracted light completely disappears, leaving only the reflected light. This phenomenon is called total reflection.
  • the critical angle of total reflection of sunlight in the glass-air interface layer of the photovoltaic cell module is 41.8 °, as long as the sunlight reflected from the groove of the ribbon is incident on the glass-air interface layer of the photovoltaic module Above or equal to the critical angle, sunlight will be totally reflected in the glass-to-air interface layer of the photovoltaic module, so that the totally reflected sunlight will re-engage in the photoelectric conversion, and the actual power of the photovoltaic module can be achieved through the surface special groove structure. 2%-2%.
  • the groove may be an arc groove or a V-shaped groove.
  • the inclination angle of the bottom surface is gradually changed, generally from the opening of the groove to the bottom, the inclination angle of the bottom surface of the groove is gradually reduced; and the bottom surface of the curved groove is only partially inclined to satisfy the warp band.
  • the reflected sunlight is required to be totally reflected in the glass and air interface layer of the photovoltaic cell module, while other parts do not meet the requirement, that is, the sunlight reflected by the groove can be incident on the glass and air interface layer of the photovoltaic module.
  • the angle of incidence is greater than or equal to the critical angle at which total reflection occurs. Of course, it also includes the bottom surface of the groove on the bottom surface.
  • the angle of inclination of each point with respect to the width of the ⁇ bandwidth is 20.9 ° -45 °.
  • the conductive base tape is made of pure copper or copper aluminum alloy, copper silver alloy, copper silver aluminum alloy or an alloy based on high purity original copper and added with a rare earth material.
  • the crucible layer is prepared by electroplating or thermal coating on the conductive base tape.
  • the crucible used is tin-lead alloy, tin-bismuth alloy, tin-copper alloy, tin-bismuth alloy, tin-silver alloy, pure tin, tin-silver-copper alloy.
  • One or more of the layers; the layer of the layer is one or more layers having a total thickness of 3-30 ⁇ m.
  • the thickness of the ultrathin protective film is 0. 1-10 ⁇ m.
  • the shape and distribution of the grooves of the same wide surface of the conductive base tape of the present invention are not limited to one type, and grooves of different shapes and different distributions may be disposed on the two wide surfaces of the conductive base tape.
  • the utility model has the beneficial effects that the photovoltaic crucible belt of the utility model has a groove on the surface of the crucible, and the area of the area of the base layer of the conductive layer is limited by the ratio of the total area of the base strip plane to the surface area of the conductive layer, thereby ensuring the effective splicing area.
  • FIG. 1 is a schematic view showing the structure of a first embodiment of the present invention.
  • Figure 2 is a schematic cross-sectional view of the V-shaped groove of Figure 1.
  • FIG. 3 is a schematic cross-sectional view showing the groove in the embodiment 1 of the present invention as an arc groove.
  • 4 is a schematic structural view of Embodiment 2 of the present invention.
  • Fig. 5 is a schematic structural view of Embodiment 3 of the present invention.
  • Fig. 6 is a schematic structural view of Embodiment 4 of the present invention.
  • Fig. 7 is a schematic structural view of Embodiment 5 of the present invention.
  • Fig. 8 is a schematic structural view of Embodiment 6 of the present invention.
  • Figure 9 is a schematic view showing the structure of Embodiment 7 of the present invention.
  • Figure 10 is a schematic view showing the structure of Embodiment 8 of the present invention.
  • Figure 11 is a schematic view showing the structure of Embodiment 9 of the present invention.
  • Figure 12 is a schematic cross-sectional view of Figure 11.
  • Figure 13 is a partial enlarged view of A in Figure 12.
  • Figure 14 is a schematic view showing the structure of Embodiment 10 of the present invention.
  • Figure 15 is a schematic view showing the structure of an embodiment 11 of the present invention.
  • Figure 16 is a schematic view showing the structure of Embodiment 12 of the present invention.
  • Figure 17 is a cross-sectional view of Figure 16.
  • Figure 18 is a schematic view showing the structure of Embodiment 13 of the present invention.
  • Figure 19 is a schematic cross-sectional view of Figure 18.
  • Figure 20 is a schematic view showing the structure of Embodiment 14 of the present invention.
  • Figure 21 is a schematic view showing the structure of Embodiment 15 of the present invention.
  • Figure 22 is a cross-sectional view taken along line A-A of Figure 21 .
  • TU1 oxygen-free copper is selected as the conductive substrate, and the thickness is 0.22 mm, and a linear strip-shaped V-shaped groove 3 with uniform cross-distribution is pressed on one wide surface or two wide surfaces, and between adjacent grooves 3 a rhombic base strip plane 4 is left, and the total area of the base strip plane 4 of the same wide surface occupies 35% of the area of the wide surface of the conductive base strip 1; wherein the linear strip-shaped V-groove 3 and the conductive base strip 1
  • the linear strip-shaped V-shaped groove 3 is inclined in both the width direction and the length direction, and has only two inclination angles; in the embodiment, the two linear strip-shaped V-shaped grooves are opposite to the length direction of the conductive base tape 1
  • the two mirror angles are the inclination angles of the two directions which are substantially 60 degrees from the width direction of the conductive base tape 1, respectively.
  • the depth of the recess 3 is approximately 30% of the thickness of the conductive base strip 1;
  • the depth of the groove 3 is 20%-30% of the thickness of the conductive base tape 1, and the sum of the maximum depths of the upper and lower wide surface grooves 3 does not exceed the thickness of the conductive base tape 1. 50%;
  • a tin-copper alloy tantalum material is selected, and the 10 ⁇ m layer 2 is electroplated or thermally coated on the conductive base tape 1 with the groove 3 to obtain a photovoltaic band.
  • the slanting angle of the groove 3 on the bottom surface of the groove 3 is 20. ° .
  • the power of a set of battery components using this photovoltaic tape is 4W higher than that of a component prepared using a conventional tape, which is increased by 1.7%.
  • the splicing force of the sling is the tension force required to pull the sling along the 45 degrees of the battery until the sling is peeled off from the battery.
  • the splicing force is greater than 3N, and the splicing force of the sling is greater than 4N in this embodiment. fulfil requirements.
  • FIG. 4 is a schematic structural view of Embodiment 2 of the present invention. Different from Embodiment 1, a linear strip-shaped V-shaped groove 3 uniformly distributed in parallel is pressed on one wide surface or two wide surfaces of the conductive substrate, and strips are left between adjacent grooves 3.
  • Baseband plane 4 the total area of the baseband plane 4 of the same wide surface occupies 45% of the area of the wide surface of the conductive base strip 1 , and the depth of the recess 3 is 20% of the thickness of the conductive base strip 1 , and the enamel layer 2 is prepared by electroplating .
  • the power of a set of battery components using this photovoltaic tape is 3W higher than that of a component prepared using a conventional tape, which is increased by 1.25%.
  • the splicing force measuring method of the embodiment 1 the splicing force of the splicing belt of the embodiment is greater than 4N, which satisfies the requirements.
  • Embodiment 3 FIG.
  • Embodiment 3 is a schematic structural view of Embodiment 3 of the present invention. Different from the first embodiment, only the linear strip-shaped V-shaped grooves 3 are inclined to two inclination angles, and a part of the linear strip-shaped V-shaped grooves 3 are parallel to the width direction of the conductive base tape 1, and the other portion and the conductive base tape 1
  • the length direction is inclined to form a base strip plane 4, and the total area of the base plane 4 of the same wide surface occupies 25% of the area of the wide surface of the conductive base strip 1 , and the depth of the recess 3 is 38% of the thickness of the conductive base strip 1
  • the crucible layer 2 was prepared by electroplating.
  • FIG. 6 is a schematic structural view of Embodiment 4 of the present invention.
  • the linear strip-shaped V-shaped grooves 3 are inclined to two angles, and a part of the linear strip-shaped V-shaped grooves 3 are parallel to the longitudinal direction of the conductive base tape 1, and the other portion and the conductive base tape 1
  • the width direction is inclined to form a base strip plane 4, and the total area of the base plane 4 of the same wide surface occupies 75% of the area of the wide surface of the conductive base strip 1 , and the depth of the recess 3 is 5% of the thickness of the conductive base strip 1
  • the crucible layer 2 was prepared by electroplating.
  • the splicing force of the sling of the present embodiment is more than 6N, which is very good.
  • FIG. 7 is a schematic structural view of Embodiment 5 of the present invention. Different from Embodiment 1, only the strip-shaped V-shaped groove 3 is inclined to two inclination angles, and the linear strip-shaped V-shaped groove 3 is parallel to the width direction of the conductive base tape 1; the other part of the groove 3 and the conductive base tape 1
  • the length direction is inclined, and the groove 3 inclined with respect to the longitudinal direction of the conductive base tape 1 is a curved strip-shaped V-shaped groove 3, forming a base strip plane 4, and the total area of the base plane 4 of the same wide surface occupies the width of the conductive base strip 1
  • the area ratio of the surface was 45%, and the depth of the groove 3 was 30% of the thickness of the conductive base tape 1, and the tantalum layer 2 was prepared by electroplating.
  • the power of a set of battery components was 2. 4 W, which was increased by 1%.
  • the splicing force of the splicing belt of the embodiment is greater than 4N, which satisfies the requirements.
  • FIG. 8 is a schematic view showing the structure of Embodiment 6 of the present invention.
  • the linear strip-shaped V-shaped grooves 3 are all changed to the curved strip-shaped V-shaped grooves 3 to form the base strip plane 4, and the total area of the base plane 4 of the same wide surface occupies the conductive area
  • the area ratio of the wide surface of the base tape 1 is 45%, and the depth of the groove depth groove 3 is 30% of the thickness of the conductive base tape 1, and the tantalum layer 2 is prepared by electroplating.
  • the power of a set of battery components using this photovoltaic tape was 2. 3W higher than that of a component prepared using a common tape, which was increased by 1%.
  • the splicing force of the sling of the present embodiment is greater than 4N, which satisfies the requirements.
  • Embodiment 7 of the present invention is shown. Different from the first embodiment, the linear strip-shaped V-shaped grooves 3 are all changed into the planar V-shaped grooves 3, and the respective V-shaped grooves 3 do not cross each other to form the base strip plane 4, and the same width.
  • the ratio of the total area of the base strip plane 4 to the area of the wide surface of the conductive base strip 1 is 55%, and the depth of the recess 3 is 25% of the thickness of the conductive base strip 1, and the tantalum layer 2 is prepared by electroplating.
  • the power of a set of battery components is 1. 8W, which is increased by 0.78%.
  • FIG. 10 is a schematic structural view of Embodiment 8 of the present invention.
  • the linear strip-shaped V-shaped groove 3 is changed to a combination of the linear strip-shaped V-shaped groove 3 and the dot-shaped V-shaped groove 3, and each of the grooves 3 does not cross each other to form
  • the baseband plane 4, and the total area of the base plane 4 of the same wide surface occupies 45% of the area of the wide surface of the conductive base strip 1 , and the depth of the recess 3 is 25% of the thickness of the conductive base strip 1 , and the enamel layer is prepared by electroplating 2. 6% ⁇ 6%. 6%. 6% ⁇ 6%.
  • FIG. 11-13 is a schematic structural view of Embodiment 9 of the present invention. Different from the first embodiment, the linear strip-shaped V-shaped grooves 3 are all changed to the point-shaped arc-shaped grooves 3, and the dot-like grooves 3 are evenly distributed on the wide surface of the conductive base tape 1, and the conductive base tape 1 has a wide surface.
  • the baseband plane 4 is a large communicating plane, and the total area of the baseband plane 4 of the same wide surface accounts for 55% of the area of the wide surface of the conductive base strip 1. Moreover, as shown in FIG.
  • the baseband plane 4 is a metal passivation surface, and the surface of the conductive base tape 1 is plated with an ultra-thin protective film 5; the conductive base tape 1 has only one wide surface with a groove 3, the groove 3
  • the conductive layer bandwidth surface has no tantalum layer, and the other three sides are plated with a tantalum layer.
  • the ratio of the total area of the base plane 4 of the same wide surface to the area of the wide surface of the conductive base strip 1 is 40%, and the depth of the recess 3 is 50% of the thickness of the conductive base strip 1, and the tantalum layer 2 is prepared by electroplating.
  • the slanting angle of the wide surface of the conductive base strip 1 is 20. 9 °. -45 °.
  • FIG. 14 is a schematic structural view of Embodiment 10 of the present invention.
  • the groove 3 is pressed only on one wide surface of the conductive substrate, and the distribution of the groove 3 is the same as that of Embodiment 1, and the groove 3 is a linear strip-shaped V-shaped groove, and Further, there is a linear strip-shaped V-shaped groove 3 parallel to the width direction of the conductive base strip, and the total area of the base strip plane 4 on the wide surface with the groove accounts for 30% of the area of the wide surface of the conductive base strip 1 %, the depth of the groove 3 is 30% of the thickness of the conductive base tape 1, and the tantalum layer 2 is prepared by electroplating. 6% ⁇ The power is increased by 3.6.
  • Embodiment 10 The difference from Embodiment 10 is that the same groove 3 as in Embodiment 10 is pressed on one wide surface of the conductive substrate, and the other wide face also has the groove 3, as shown in Fig. 15, which is the embodiment 11 A schematic view of another wide face.
  • the other wide groove 3 is a linear strip-shaped V-shaped groove parallel to the width direction of the conductive base tape, and the linear strip-shaped V-shaped groove on the upper and lower wide surfaces parallel to the width direction of the conductive base tape is not The mutually overlapping, that is, the linear strip-shaped V-shaped grooves on the upper and lower wide surfaces parallel to the width direction of the conductive base strip are alternately pressed.
  • the total area of the base strip plane 4 on the upper wide surface accounts for 30% of the area of the surface of the conductive base strip 1 on the upper surface
  • the total area of the base strip plane 4 on the lower wide surface accounts for 75% of the area of the surface of the conductive base strip 1 on the lower wide surface.
  • the depth of the groove 3 of the upper surface is 30% of the thickness of the conductive base tape 1
  • the depth of the groove 3 of the lower surface is 20% of the thickness of the conductive base tape 1.
  • Embodiment 12 A schematic structural view of Embodiment 12 of the present invention is shown in Figs. 16-17.
  • the difference from Embodiment 1 is that the groove of this embodiment is a slope inclined toward the outside of the conductive base tape along both sides in the longitudinal direction of the conductive base tape 1, and at this time, the groove 3 becomes a slope.
  • the middle portion of the conductive base strip 1 forms a base strip plane 4 along the length direction of the conductive base strip 1, and the total area of the base strip plane 4 of the same wide surface occupies 50% of the area of the wide surface of the conductive base strip 1 , and the depth of the groove slope 3 is a conductive base strip.
  • the enamel layer 2 is prepared by electroplating or thermal coating at 20% of the thickness.
  • the angle of the angle of the wide surface of the conductive base strip 1 is 20. 9 ° -45 °. ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
  • the inclined surface which is inclined toward the inside of the conductive base tape is pressed on one side in the longitudinal direction of the conductive base tape 1, and the groove 3 is formed.
  • the other side of the conductive base tape 1 forms a baseband plane 4 along the length direction of the conductive base strip 1, and the total area of the base plane 4 of the same wide surface occupies 65% of the area of the wide surface of the conductive base strip 1 which is concave.
  • the depth of the groove slope 3 is 25% of the thickness of the conductive base tape 1, and the tantalum layer 2 is prepared by electroplating or thermal coating.
  • the angle of the angle of the wide surface of the conductive base strip 1 is 20. 9 ° -45 °.
  • the power of a set of battery components was 1. 4 W, which was increased by 0.6%.
  • the splicing force of the sling of the present embodiment is greater than 4N, which satisfies the requirements.
  • Embodiment 20 is a schematic structural view of Embodiment 14 of the present invention.
  • the groove of this embodiment is a linear strip-shaped V-shaped groove 3 pressed along both sides in the longitudinal direction of the conductive base tape 1, and the middle portion of the conductive base tape 1 forms a baseband plane 4 along the longitudinal direction of the conductive base tape 1.
  • the total area of the base plane 4 of the same wide surface accounts for 70% of the area of the wide surface of the conductive base strip 1 , and the depth of the groove slope 3 is 25% of the thickness of the conductive base strip 1 , and the material is prepared by electroplating or thermal coating.
  • Layer 2
  • the cut surface on the bottom surface of the groove 3 on the bottom surface of the groove 3 on the conductive base tape 1 is inclined at an angle of 20. 9 ° -45 ° with respect to the wide surface of the conductive base tape 1.
  • the power of a set of battery components using this photovoltaic tape is 1. 2 W higher than that of a component prepared using a conventional tape, which is increased by 0.5%.
  • the splicing force of the sling of the present embodiment is greater than 4N, which satisfies the requirements.
  • the groove of this embodiment is a linear strip-shaped V-shaped groove which is pressed along both sides in the longitudinal direction of the conductive base tape 1, wherein the central portion of the two sides of the conductive base tape 1 is pressed obliquely toward the conductive base tape.
  • the inclined surface forms a sloped groove, and the linear strip-shaped V-shaped groove and the inclined groove together constitute the groove 3 of the present embodiment.
  • the middle portion of the conductive base strip 1 forms a base strip plane 4 along the length direction of the conductive base strip 1, and the total area of the base strip plane 4 of the same wide surface occupies 75% of the area of the wide surface of the conductive base strip 1 , and the depth of the groove slope 3 is a conductive base strip.
  • the tantalum layer 2 is prepared by electroplating or thermal coating.
  • the angle of the angle of the wide surface of the conductive base strip 1 is 20. 9 ° -45 °. 4% ⁇
  • the power of a set of battery components is higher than the power of the assembly using a conventional slinger by 1W, an increase of 0.4%.
  • the splicing force measuring method of the embodiment 1 the splicing force of the splicing belt of the embodiment is greater than 4N, which satisfies the requirements.

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Abstract

提供了一种光伏焊带,包括导电基带(1),导电基带(1)为金属单质或合金材料,其具有上、下两个宽表面;导电基带(1)的一个或两个宽表面压制有若干凹槽(3),相邻的凹槽(3)之间留有基带平面(4),并且同一宽表面的基带平面(4)的总面积占其所在导电基带(1)宽表面的面积比例为25%-75%。这种光伏焊带,通过限定基带平面的总面积占其所在导电基带宽表面的面积比例,保证了有效焊接的面积,从而保证了焊接的牢固性;限制了凹槽的深度,在所述深度范围内,凹槽的压制不会对基带上压制凹槽的相对面产生影响;在满足焊接要求、降低内应力的同时,使焊带表面接受到的太阳光中的相当部分在光伏电池组件的玻璃空气界面全反射并重新加入光电转换,进一步提升组件实际功率。

Description

光伏焊带 技术领域
本实用新型属于光伏悍带加工技术领域, 特别涉及光伏悍带。
背景技术
随着世界经济的快速发展, 能源消耗越来越大, 世界各国都需求新能源的 应用和普及。 由于二氧化碳排放导致的温室气体效应致使全球气候变暖并引发 自然灾害, 世界各国对清洁的可再生能源的需求尤其强烈。 在美国 2007年次贷 危机导致的全球危机蔓延和扩大以来, 为剌激经济增长, 各国都通过了更积极 的鼓励使用可再生能源的措施。 美国奥巴马政府提出在未来 10年投资 1500亿 美元用于清洁能源; 欧盟设定目标在 2020年将可再生能源占使用能源的比例提 高到 20%;日本提出在 2030年使 70%以上的新建住宅安装太阳能电池板(约 70GW)。 为缓解光电产品国内需求不足, 2009年 3月 26日, 中国财政部宣布将推动实施 "太阳能屋顶计划"示范工程。 财政部、 住房和城乡建设部联合出台的 《关于 加快推进太阳能光电建筑应用的实施意见》 中明确提出, 实施 "太阳能屋顶计 划", 对光电建筑应用示范工程予以资金补助、 鼓励技术进歩与科技创新、 鼓励 地方政府出台相关财政扶持政策、 加强建设领域政策扶持等一系列原则措施。 现阶段在经济发达、 产业基础较好的大中城市积极推进太阳能屋顶、 光伏幕墙 等光电建筑一体化示范; 积极支持在农村与偏远地区发展离网式发电, 实施送 电下乡等有关规定,更是给太阳能技术的应用指明了方向。 以太阳能屋顶、 光伏 幕墙等光电建筑一体化为突破口, 可能在短期内让人们看到应用太阳能的诸多 好处, 也有利于今后大面积推广, 激发产业资本投资太阳能领域的积极性。 各 国的新能源政策或许将成为下一个影响我们此后 15年世界发展的重要政策之一。 2009年的哥本哈根气候会议再次唤醒、 强化了人们关注清洁能源的意识。 伴随 新能源的应用和普及, 光伏行业的迅猛增长势头得到进一歩的加强和重视。
悍带是光伏组件悍接过程中的重要原材料, 悍带质量的好坏将直接影响到 光伏组件电流的收集效率, 对光伏组件的功率影响很大。 如何通过悍带的异构 化, 来增加电池片的转化率, 降低碎片率, 一直是悍带行业研究的课题之一。
中国专利 CN101789452A给出了一种涂锡悍带, 其包括铜带及其表面的涂锡 层, 涂锡层表面具有均匀分布的坑状体。 这种悍带在一定程度上使太阳光在坑 状体中发生漫反射,提高了接受太阳光的能量。但是, 其坑状体仅发生漫反射, 反射回电池片的太阳光比例很小, 提高的转化率有限; 此外, 其凹坑是在涂锡 过程中制备, 会产生不均匀的悍料层, 并会产生与电池片悍接不牢的现象, 出 现虚悍。
中国专利 CN102569470A给出了一种在悍带表面制备垂直于悍带长度方向的 V型槽,以此来降低电池片的隐裂和碎片率。 但此专利悍带 V型槽是垂直于长度 方向且 V型槽间无明显的间距, 因此这种悍带在与电池片悍接时不稳定, 悍接 不牢。 实用新型内容
本实用新型要解决的技术问题是: 为了克服现有光伏悍带无法高效地将太 阳光反射到电池片,即使悍带表面有发生漫反射的凹坑,其往往反射比例较低, 并且凹坑的制造会影响悍带的质量,使悍带带有凹坑的相对面产生突起; 同时, 凹坑的数量在很大程度上影响了悍带的悍接牢固性的不足, 本实用新型提供了 一种光伏悍带, 增加经悍带反射的太阳光在光伏电池组件的玻璃与空气界面层 发生全反射的比例, 发生全反射的太阳光重新参与光电转换, 从而将电池组件 的功率提高 0. 5%-2. 5%, 并在一定程度上能降低太阳能电池片悍接后的内应力, 从而不会产生因为悍带的热胀冷缩导致的碎片; 而且即使表面压制有凹槽, 也 能保证有效悍接的面积, 从而保证了悍接的牢固性。 本实用新型解决其技术问题所采用的技术方案是: 一种光伏悍带, 包括导 电基带, 所述导电基带为金属单质或合金材料, 其具有上、 下两个宽表面; 所述导电基带的一个或两个宽表面压制有若干凹槽, 相邻的所述凹槽之间 留有基带平面, 并且同一宽表面的所述基带平面的总面积占其所在导电基带宽 表面的面积比例为 25%-75%;
当导电基带仅一个宽表面压制凹槽时, 所述的凹槽深度是导电基带厚度的 5%- 50%;
当导电基带两个宽表面均压制凹槽时, 所述的凹槽深度是导电基带厚度的 5%-45%, 且上、 下宽表面凹槽最大深度总和不超过所述导电基带厚度的 50%; 所述导电基带上电镀或热涂有悍料层, 悍料层可以是直接电镀或热涂在导 电基带上, 也可以是先在导电基带上先制作一层保护膜, 然后再电镀或热涂悍 料层。 并且, 为了节省悍料用量, 减少制造成本, 导电基带表面可以仅有一个 宽表面电镀或热涂悍料层, 因此, 带有凹槽的导电基带表面可以有悍料层, 也 可以没有悍料层。
基带平面的总面积占其所在导电基带宽表面的面积比例是一个关键, 使得 即使悍带表面压制有凹槽, 也能保证有效悍接的面积, 从而保证了悍接的牢固 性。 同时, 限制了凹槽的深度, 在所述深度范围内, 凹槽的压制不会对基带上 压制凹槽的相对面产生影响。
所述导电基带上的凹槽在所述导电基带宽表面沿导电基带长度方向呈规律 性重复。 一方面, 使得导电基带上发生全反射的比例均匀分布; 另一方面, 使 得基带平面均匀分布, 从而更有利于悍接, 同时, 还能便于导电基带的加工。
由于电池片与悍带的热膨胀系数不同, 一般悍带的基带为铜或铜合金, 电 池片为硅片, 铜或铜合金的热膨胀系数大于硅。 悍接时, 基带受热后在长度和 宽度方向均发生膨胀, 待冷却后, 基带收缩程度大于电池片, 由于此时悍带与 电池片已经固定, 悍带将会作用给电池片一个使电池片局部向内弯曲的力, 使 得电池片局部产生形变。 为了给悍带提供一个收缩的空间, 所述凹槽为直线型 条状凹槽和 /或曲线型条状凹槽。
由于基带受热后在长度和宽度方向均发生膨胀, 所述凹槽在同一宽面交叉 分布, 包括既有交叉分布, 又有相互平行的情况。 两个交叉槽的倾斜角度可以 是一致的, 例如都是 60度, 即两个交叉槽与导电基带长度方向互为镜像; 也可 以是不同的。
当所述凹槽为直线型条状凹槽时, 相邻的所述凹槽之间形成四边形的基带 平面。 由于直线型条状凹槽制造成本较低, 并且, 由于基带受热后在长度和宽 度方向均发生膨胀, 可以在长度和宽度方向均匀地降低内应力。
相邻的所述凹槽之间形成菱形的基带平面, 并且同一宽表面的基带平面的 总面积占其所在导电基带宽表面的面积比例为 30%-60%; 其中, 所述凹槽分为两 种倾斜方向, 且所述的两种倾斜方向的凹槽相对于导电基带的长度方向互为镜 像,所述的两种倾斜方向的凹槽均与导电基带的宽度方向之间的夹角在 25 ° - 65 ° 之间。
所述凹槽在同一宽面平行分布, 可以是凹槽与导电基带的宽度方向平行或 倾斜, 或者是与导电基带的长度方向平行。
所述凹槽中还包括点状凹槽、 面状凹槽, 以及沿导电基带长度方向的单侧 或双侧压制斜面所形成的凹槽中的一种或多种。 当然, 所述凹槽均为点状凹槽或者均为面状凹槽的技术方案也包括在本实 用新型的保护范围之内。
所述凹槽均为沿导电基带长度方向的单侧或双侧压制斜面所形成的凹槽也 包括在本实用新型的保护范围之内。 并且, 当导电基带整个长度方向的单侧或 双侧均压制向导电基带外倾斜的斜面时, 为所述凹槽的一种极限情况, 所述凹 槽变为斜面。
一方面, 考虑到降低悍带的内应力, 另一方面, 尽可能地提高所述凹槽将 太阳光反射回电池片的能力, 所述的导电基带上的凹槽底面上的至少一点在凹 槽底面上的切面, 相对于导电基带宽面的倾斜角度为 20. 9 ° -45 ° 。光从光密介 质射入光疏介质, 当入射角增大到临界角时, 使折射角达到 90 ° 时, 折射光完 全消失, 只剩下反射光, 这种现象叫做全反射。 由于太阳光在光伏电池组件的 玻璃与空气界面层发生全反射的临界角为 41. 8 ° , 只要使从悍带的凹槽反射的 太阳光入射到光伏组件的玻璃与空气界面层的入射角大于或等于该临界角, 太 阳光将会在光伏组件的玻璃与空气界面层发生全反射, 从而使发生全反射的太 阳光重新参与光电转换, 通过表面特殊凹槽结构可将光伏电池组件实际功率进 一歩提升 0. 2%-2%。所述的凹槽可以是弧形槽,也可以是 V形槽。如果是弧形槽, 其底面倾斜角度是逐渐变化的, 一般是从凹槽开口到底部, 凹槽底面的倾斜角 度逐渐变小; 并且包括弧形凹槽底面仅有部分倾斜角度满足经悍带反射的太阳 光在光伏电池组件的玻璃与空气界面层发生全反射的要求, 而其他部分不满足 该要求的情况, 即能够使凹槽反射的太阳光入射到光伏组件的玻璃与空气界面 层的入射角大于或等于发生全反射的临界角。 当然, 也包括凹槽底面在底面上 每一点的切面相对于悍带宽面的倾斜角度为 20. 9° -45 ° 的情况。 所述导电基带, 材质为纯铜或铜铝合金, 铜银合金, 铜银铝合金或以高纯 原铜为基础并添加有稀土材料的合金。
在导电基带上通过电镀或热涂的方式制备悍料层, 所使用的悍料为锡铅合 金, 锡铋合金, 锡铜合金, 锡铈合金, 锡银合金, 纯锡, 锡银铜合金中的一种 或多种; 悍料层为一层或多层, 其总厚度为 3-30 μ ιη。
此外在导电基带与悍料层之间可以电镀有一层或多层超薄保护膜, 所述超 薄保护膜的厚度为 0. 1-10 μ m。
本实用新型的导电基带同一宽表面的凹槽形状和分布并不局限于一种, 并 且, 导电基带两个宽表面上可以设置不同形状和不同分布的凹槽。
本实用新型的有益效果是, 本实用新型的光伏悍带, 悍带宽表面压制有凹 槽, 通过限定基带平面的总面积占其所在导电基带宽表面的面积比例, 保证了 有效悍接的面积, 从而保证了悍接的牢固性; 同时, 限制了凹槽的深度, 在所 述深度范围内, 凹槽的压制不会对基带上压制凹槽的相对面产生影响; 在满足 悍接要求、 降低内应力的同时, 使悍带宽表面接受到的太阳光中的相当部分在 光伏电池组件的玻璃空气界面全反射并重新加入光电转换, 进一歩提升组件实 际功率。 附图说明
图 1是本实用新型的实施例 1的结构示意图。
图 2是图 1中 V型槽的剖面示意图。
图 3是本实用新型的实施例 1中的凹槽为弧形槽的剖面示意图。 图 4是本实用新型的实施例 2的结构示意图。
图 5是本实用新型的实施例 3的结构示意图。
图 6是本实用新型的实施例 4的结构示意图。
图 7是本实用新型的实施例 5的结构示意图。
图 8是本实用新型的实施例 6的结构示意图。
图 9是本实用新型的实施例 7的结构示意图。
图 10是本实用新型的实施例 8的结构示意图。
图 11是本实用新型的实施例 9的结构示意图。
图 12是图 11的剖面示意图。
图 13是图 12中 A处的局部放大图。
图 14是本实用新型的实施例 10的结构示意图。
图 15是本实用新型的实施例 11的结构示意图。
图 16是本实用新型的实施例 12的结构示意图。
图 17是图 16的剖面示意图。
图 18是本实用新型的实施例 13的结构示意图。
图 19是图 18的剖面示意图。
图 20是本实用新型的实施例 14的结构示意图。
图 21是本实用新型的实施例 15的结构示意图。
图 22是图 21的 A-A剖面示意图。
图中 1、 导电基带, 2、 悍料层, 3、 凹槽, 4、 基带平面, 5、 超薄保护膜。 具体实施方式
现在结合附图对本实用新型作进一歩详细的说明。 这些附图均为简化的 意图, 仅以示意方式说明本实用新型的基本结构, 因此其仅显示与本实用新型 有关的构成。 实施例 1
选用 TU1无氧铜作为导电基材, 厚度为 0. 22mm, 在其一个宽表面或两个宽 表面压制有均匀交叉分布的直线型条状 V型凹槽 3,相邻的凹槽 3之间留有菱形 的基带平面 4,并且同一宽表面的基带平面 4的总面积占其所在导电基带 1宽表 面的面积比例为 35%; 其中, 直线型条状 V型凹槽 3与导电基带 1的宽度方向和 长度方向均倾斜, 且仅有两种倾斜角度的直线型条状 V型凹槽 3 ; 本实施例中, 这两种直线型条状 V型凹槽相对于导电基带 1的长度方向互为镜像, 两种倾斜 角度分别为与导电基带 1的宽度方向大致呈 60 ° 的两个方向的倾角。
当导电基带 1仅一个宽表面压制凹槽 3时, 凹槽 3深度大致是导电基带 1 厚度的 30%;
当导电基带 1两个宽表面均压制凹槽 3时, 凹槽 3深度是导电基带 1厚度 的 20%-30%,且上、下宽表面凹槽 3最大深度总和不超过导电基带 1厚度的 50%;
选用锡铜合金悍料, 在此带有凹槽 3的导电基带 1上电镀或热涂 lOum悍料 层 2, 得到光伏悍带。 导电基带 1上的凹槽 3从开口到底部的口径逐渐缩小, 凹槽 3底面上的点 在凹槽 3底面上的切面, 相对于导电基带 1宽面的倾斜角度为 20. 9 ° -45 ° 。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 4W, 提高了 1. 7%。 悍带的悍接力是通过拉力计, 沿着电池片 45度方向拉悍带直至悍带从电池 片剥离所需的拉力, 一般悍接力要求大于 3N, 本实施例的悍带悍接力大于 4N, 满足要求。
图 1、 图 2给出了此光伏悍带的结构图。 并且, 凹槽 3也可以是如图 3所示 的圆弧形。 图 3中, 导电基带 1上的凹槽 3从开口到底部的口径逐渐缩小, 凹 槽 3底面上的至少一点在凹槽 3底面上的切面, 相对于导电基带 1宽面的倾斜 角度为 20. 9 ° -45。 。 实施例 2 如图 4所示,本实用新型的实施例 2的结构示意图。与实施例 1不同的是, 在导电基材的一个宽表面或两个宽表面压制有均匀平行分布的直线型条状 V型 凹槽 3, 相邻的凹槽 3之间留有条状的基带平面 4, 同一宽表面的基带平面 4的 总面积占其所在导电基带 1宽表面的面积比例为 45%,凹槽 3深度是导电基带 1 厚度的 20%, 通过电镀方式制备悍料层 2。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 3W, 提高了 1. 25%。 采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 3 如图 5所示,本实用新型的实施例 3的结构示意图。与实施例 1不同的是, 仅有向两种倾斜角度的直线型条状 V型凹槽 3,一部分直线型条状 V型凹槽 3与 导电基带 1的宽度方向平行, 另一部分与导电基带 1长度方向倾斜, 形成基带 平面 4,且同一宽面的基带平面 4的总面积占其所在导电基带 1宽表面的面积比 例为 25%,凹槽 3深度是导电基带 1厚度的 38%, 通过电镀方式制备悍料层 2。采 用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比使用普 通悍带制备的组件功率高出 4. 5W, 提高了 1. 9%。 采用实施例 1的悍接力测量方法, 悍接力为 3. 5N, 略差。 实施例 4 如图 6所示,本实用新型的实施例 4的结构示意图。与实施例 1不同的是, 仅有向两种倾斜角度的直线型条状 V型凹槽 3,一部分直线型条状 V型凹槽 3与 导电基带 1的长度方向平行, 另一部分与导电基带 1宽度方向倾斜, 形成基带 平面 4,且同一宽面的基带平面 4的总面积占其所在导电基带 1宽表面的面积比 例为 75%,凹槽 3深度是导电基带 1厚度的 5%, 通过电镀方式制备悍料层 2。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 1. 2W, 提高了 0. 5%。 采用实施例 1的悍接力测量方法,本实施例的悍带悍接力大于 6N,非常好。 实施例 5
如图 7所示,本实用新型的实施例 5的结构示意图。与实施例 1不同的是, 仅有向两种倾斜角度的条状 V型凹槽 3,直线型条状 V型凹槽 3与导电基带 1的 宽度方向平行; 另一部分凹槽 3与导电基带 1长度方向倾斜, 与导电基带 1长 度方向倾斜的凹槽 3为曲线型条状 V型凹槽 3, 形成基带平面 4, 且同一宽面的 基带平面 4的总面积占其所在导电基带 1宽表面的面积比例为 45%,凹槽 3深度 是导电基带 1厚度的 30%, 通过电镀方式制备悍料层 2。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 2. 4W, 提高了 1%。 采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 6
如图 8所示,本实用新型的实施例 6的结构示意图。与实施例 1不同的是, 直线型条状 V型凹槽 3均改为曲线型条状 V型凹槽 3, 形成基带平面 4, 且同一 宽面的基带平面 4的总面积占其所在导电基带 1宽表面的面积比例为 45%,槽深 凹槽 3深度是导电基带 1厚度的 30%, 通过电镀方式制备悍料层 2。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 2. 3W, 提高了 1%。
采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 7
如图 9所示,本实用新型的实施例 7的结构示意图。与实施例 1不同的是, 直线型条状 V型凹槽 3均改为面状 V型凹槽 3,且各面状 V型凹槽 3均不相互交 叉, 形成基带平面 4, 且同一宽面的基带平面 4的总面积占其所在导电基带 1宽 表面的面积比例为 55%,凹槽 3深度是导电基带 1厚度的 25%, 通过电镀方式制 备悍料层 2。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件 的功率比使用普通悍带制备的组件功率高出 1. 8W, 提高了 0. 75%
采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 8 如图 10所示,本实用新型的实施例 8的结构示意图。与实施例 1不同的是, 直线型条状 V型凹槽 3改为直线型条状 V型凹槽 3与点状 V型凹槽 3的结合, 且各凹槽 3均不相互交叉, 形成基带平面 4, 且同一宽面的基带平面 4的总面积 占其所在导电基带 1宽表面的面积比例为 45%,凹槽 3深度是导电基带 1厚度的 25%, 通过电镀方式制备悍料层 2。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 1. 4W, 提高了 0. 6%。
采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 9 如图 11-13所示, 本实用新型的实施例 9的结构示意图。 与实施例 1不同 的是, 直线型条状 V型凹槽 3均改为点状弧形凹槽 3, 各点状凹槽 3均匀分布在 导电基带 1宽表面上, 导电基带 1宽表面的基带平面 4为一个连通的大平面, 同一宽表面的基带平面 4的总面积占其所在导电基带 1宽表面的面积比例为 55%。 并且, 如图 12所示, 基带平面 4为金属钝化面, 导电基带 1表面电镀有超薄保 护膜 5; 导电基带 1仅一个宽表面带有凹槽 3, 所述带有凹槽 3的导电基带宽表 面没有悍料层, 其余三面均电镀有悍料层。 且同一宽面的基带平面 4 的总面积 占其所在导电基带 1宽表面的面积比例为 40%,凹槽 3深度是导电基带 1厚度的 50%, 通过电镀方式制备悍料层 2。 导电基带 1上的弧形凹槽 3从开口到底部的口径逐渐缩小, 凹槽 3底面上 的点在凹槽 3底面上的切面,相对于导电基带 1宽面的倾斜角度为 20. 9° -45 ° 。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 2W, 提高了 0. 83%。 采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 10 如图 14所示, 本实用新型的实施例 10的结构示意图。 与实施例 1不同的 是,仅在导电基材的一个宽表面压制有凹槽 3,且凹槽 3的分布与实施例 1相同, 凹槽 3为直线型条状 V型凹槽, 并且在此基础上还具有平行于导电基带宽度方 向的直线型条状 V型凹槽 3,带有凹槽的宽表面上的基带平面 4的总面积占其所 在导电基带 1宽表面的面积比例为 30%, 凹槽 3深度是导电基带 1厚度的 30%, 通过电镀方式制备悍料层 2。 采用 60片 156*156多晶硅片, 使用此光伏悍带制 备一组电池组件的功率比使用普通悍带制备的组件功率高出 3. 8W,提高了 1. 6%。 采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力为 3. 7N, 略差。 实施例 11
与实施例 10 不同的是, 除了在导电基材的一个宽表面压制有与实施例 10 相同的凹槽 3, 另一个宽面也具有凹槽 3, 如图 15所示, 是实施例 11的另一宽 面的结构示意图。另一宽面的凹槽 3为平行于导电基带宽度方向的直线型条状 V 型凹槽, 并且上、 下宽表面上的平行于导电基带宽度方向的直线型条状 V型凹 槽并不互相重合, 即上、下宽表面上的平行于导电基带宽度方向的直线型条状 V 型凹槽互相交错压制。 且上宽面上基带平面 4的总面积占其所在导电基带 1的 表面的面积比例为 30%,下宽表面上基带平面 4的总面积占其所在导电基带 1的 表面的面积比例为 75%, 且上表面的凹槽 3深度是导电基带 1厚度的 30%, 下表 面的凹槽 3深度是导电基带 1厚度的 20%。 采用 60片 156*156多晶硅片, 使用 此光伏悍带制备一组电池组件的功率比使用普通悍带制备的组件功率高出 3. 4W, 提高了 1. 4%。 采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力 3. 6N, 略差。 实施例 12 如图 16-17所示, 本实用新型的实施例 12的结构示意图。 与实施例 1不同 的是, 本实施例的凹槽是沿导电基带 1 长度方向两侧压制的向导电基带外倾斜 的斜面, 此时, 凹槽 3即变为斜面。 导电基带 1中部形成沿导电基带 1长度方 向的基带平面 4,且同一宽面的基带平面 4的总面积占其所在导电基带 1宽表面 的面积比例为 50%,凹槽斜面 3深度是导电基带 1厚度的 20%, 通过电镀或热涂 方式制备悍料层 2。 导电基带 1上的凹槽 3底面上的点在凹槽 3底面上的切面, 相对于导电基 带 1宽面的倾斜角度为 20. 9 ° -45 ° 。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 1. 8W, 提高了 0. 75%。 采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 13 如图 18-19所示, 本实用新型的实施例 13的结构示意图。 与实施例 1不同 的是,本实施例中,沿导电基带 1长度方向单侧压制向导电基带内倾斜的斜面, 形成凹槽 3。 导电基带 1另一侧形成沿导电基带 1长度方向的基带平面 4, 且同 一宽面的基带平面 4的总面积占其所在导电基带 1宽表面的面积比例为 65%,凹 槽斜面 3深度是导电基带 1厚度的 25%, 通过电镀或热涂方式制备悍料层 2。 导电基带 1上的凹槽 3底面上的点在凹槽 3底面上的切面, 相对于导电基 带 1宽面的倾斜角度为 20. 9 ° -45 ° 。
采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 1. 4W, 提高了 0. 6%。
采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 14
如图 20所示, 本实用新型的实施例 14的结构示意图。 与实施例 1不同的 是,本实施例的凹槽是沿导电基带 1长度方向两侧压制的直线型条状 V型凹槽 3, 导电基带 1中部形成沿导电基带 1长度方向的基带平面 4,且同一宽面的基带平 面 4的总面积占其所在导电基带 1宽表面的面积比例为 70%,凹槽斜面 3深度是 导电基带 1厚度的 25%, 通过电镀或热涂方式制备悍料层 2。
导电基带 1上的凹槽 3底面上的点在凹槽 3底面上的切面, 相对于导电基 带 1宽面的倾斜角度为 20. 9 ° -45 ° 。
采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 1. 2W, 提高了 0. 5%。
采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。 实施例 15
如图 21-22所示, 本实用新型的实施例 15的结构示意图。 与实施例 14不 同的是, 本实施例的凹槽是沿导电基带 1长度方向两侧压制的直线型条状 V型 凹槽, 其中, 沿导电基带 1 长度方向两侧的中部压制的向导电基带外倾斜的斜 面,形成斜面凹槽,直线型条状 V型凹槽与斜面凹槽共同构成本实施例的凹槽 3。 导电基带 1中部形成沿导电基带 1长度方向的基带平面 4,且同一宽面的基带平 面 4的总面积占其所在导电基带 1宽表面的面积比例为 75%,凹槽斜面 3深度是 导电基带 1厚度的 25%, 通过电镀或热涂方式制备悍料层 2。 导电基带 1上的凹槽 3底面上的点在凹槽 3底面上的切面, 相对于导电基 带 1宽面的倾斜角度为 20. 9 ° -45 ° 。 采用 60片 156*156多晶硅片, 使用此光伏悍带制备一组电池组件的功率比 使用普通悍带制备的组件功率高出 1W, 提高了 0. 4%。 采用实施例 1的悍接力测量方法, 本实施例的悍带悍接力大于 4N, 满足要 求。

Claims

权 利 要 求 书
1、 一种光伏焊带, 包括导电基带 (1), 所述导电基带 (1) 为金属单质或 合金材料, 其具有上、 下两个宽表面, 其特征在于:
所述导电基带 (1) 的一个或两个宽表面压制有若干凹槽 (3), 相邻的所述 凹槽 (3) 之间留有基带平面 (4), 并且同一宽表面的所述基带平面 (4) 的总 面积占其所在导电基带 (1) 宽表面的面积比例为 25%-75%;
当导电基带 (1) 仅一个宽表面压制凹槽 (3) 时, 所述的凹槽 (3) 深度是 导电基带 (1) 厚度的 5%-50%;
当导电基带 (1) 两个宽表面均压制凹槽 (3) 时, 所述的凹槽 (3) 深度是 导电基带 (1) 厚度的 5%-45%, 且上、 下宽表面凹槽 (3) 最大深度总和不超过 所述导电基带 (1) 厚度的 50%。
2、 如权利要求 1所述的光伏焊带, 其特征在于: 所述导电基带 (1) 上的 凹槽 (3) 在所述导电基带 (1) 宽表面沿导电基带长度方向呈规律性重复。
3、 如权利要求 2所述的光伏焊带, 其特征在于: 所述凹槽 (3) 为直线型 条状凹槽和 /或曲线型条状凹槽。
4、 如权利要求 3所述的光伏焊带, 其特征在于: 所述凹槽 (3) 在同一宽 面交叉分布。
5、 如权利要求 4所述的光伏焊带, 其特征在于: 当所述凹槽 (3) 为直线 型条状凹槽时, 相邻的所述凹槽 (3) 之间形成四边形的基带平面 (4)。
6、 如权利要求 3所述的光伏焊带, 其特征在于: 所述凹槽 (3) 在同一宽 面平行分布。
7、 如权利要求 3所述的光伏焊带, 其特征在于: 所述凹槽 (3) 中还包括 点状凹槽、 面状凹槽, 以及沿导电基带 (1) 长度方向的单侧或双侧压制斜面所 形成的斜面凹槽中的一种或多种。
8、 如权利要求 2所述的光伏悍带, 其特征在于: 所述凹槽 (3) 为点状凹 槽。
9、 如权利要求 2所述的光伏悍带, 其特征在于: 所述凹槽 (3) 为面状凹 槽。
10、 如权利要求 2所述的光伏悍带, 其特征在于: 所述凹槽 (3) 为沿导电 基带 (1) 长度方向的单侧或双侧压制斜面所形成的斜面凹槽。
11、 如权利要求 1-10中任一项所述的光伏悍带, 其特征在于: 所述的导电 基带 (1) 上的凹槽 (3) 底面上的至少一点在凹槽 (3) 底面上的切面, 相对于 导电基带 (1) 宽面的倾斜角度为 20.9° -45° 。
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