WO2015011751A1 - Machine de montage de composants - Google Patents

Machine de montage de composants Download PDF

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Publication number
WO2015011751A1
WO2015011751A1 PCT/JP2013/069752 JP2013069752W WO2015011751A1 WO 2015011751 A1 WO2015011751 A1 WO 2015011751A1 JP 2013069752 W JP2013069752 W JP 2013069752W WO 2015011751 A1 WO2015011751 A1 WO 2015011751A1
Authority
WO
WIPO (PCT)
Prior art keywords
head
positive pressure
mounting
mounting head
command value
Prior art date
Application number
PCT/JP2013/069752
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English (en)
Japanese (ja)
Inventor
識 西山
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2015528021A priority Critical patent/JP6144765B2/ja
Priority to PCT/JP2013/069752 priority patent/WO2015011751A1/fr
Publication of WO2015011751A1 publication Critical patent/WO2015011751A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools

Definitions

  • the mounting head to be held by the head holding portion of the component mounting machine is a mounting head that holds a suction nozzle having a nozzle diameter corresponding to the type (size, shape, weight, etc.) of the component to be sucked
  • the positive pressure source supplies it to the suction nozzle. Since the positive pressure is constant, depending on the part, the positive pressure may be insufficient, and the part cannot be released from the suction nozzle, and the part may be brought back to the suction nozzle due to static electricity or the like. The positive pressure is too large, and the positive pressure blown out from the suction nozzle may cause the mounting position of the surrounding parts on the circuit board to shift, causing a decrease in mounting reliability. To have.
  • An electromagnetic valve that opens and closes, and includes a control unit that controls a positive pressure adjustment operation of the electropneumatic proportional valve and an opening and closing operation of the electromagnetic valve, and the control unit is configured to hold the head holding unit before holding it.
  • each mounting head has to adjust the output positive pressure of the electropneumatic proportional valve.
  • the electropneumatic proportional valve for adjusting the positive pressure supplied to the mounting head is provided in the head holding unit, the positive pressure supplied to the mounting head for each mounting head held by the head holding unit is It becomes possible to adjust to a positive pressure suitable for releasing the parts adsorbed by the adsorption nozzle of the mounting head.
  • the function of adjusting the positive pressure for each mounting head held by the head holding unit can be mounted on the component mounting machine at a low cost, and the type (size) of the component that sucks the positive pressure supplied to the mounting head for each mounting head.
  • the head ID recording unit may use an electronic tag (also referred to as an RF tag, IC tag, radio wave tag, or wireless tag) that stores head ID data.
  • an electronic tag also referred to as an RF tag, IC tag, radio wave tag, or wireless tag
  • a code label recorded with a code such as a code may be used.
  • the head ID recording unit is a code label or the like, it is obtained by imaging a head ID recording unit with a camera using a camera that images a reference mark of a circuit board on which a component is mounted as the head ID reading unit.
  • the head ID may be read by processing the image.
  • the camera that captures the reference mark on the circuit board can also be used as the head ID reading means, and it is not necessary to provide a dedicated head ID reading means, resulting in cost reduction.
  • the mounting head is provided with a positive pressure command value recording unit that records or stores a positive pressure command value suitable for releasing a component sucked by the suction nozzle of the mounting head, and the head mounting unit And a positive pressure command value reading means for reading the positive pressure command value from the positive pressure command value recording portion of the mounting head.
  • the control means is provided in the mounting head on the head mounting portion.
  • the positive pressure command value read by the positive pressure command value reading means from the positive pressure command value recording unit may be output to the electropneumatic proportional valve to adjust the output positive pressure of the electropneumatic proportional valve.
  • the positive pressure command value recording unit may use a code label or the like in which the data of the positive pressure command value is recorded with a code such as a barcode or a two-dimensional code, or stores the data of the positive pressure command value.
  • a code label or the like in which the data of the positive pressure command value is recorded with a code such as a barcode or a two-dimensional code, or stores the data of the positive pressure command value.
  • An electronic tag may be used.
  • the head holding unit includes the A pressure sensor for detecting a positive pressure supplied from the electropneumatic proportional valve to the mounting head when the solenoid valve is opened; and the control means detects the positive pressure detected by the pressure sensor when the positive pressure is supplied to the mounting head. May be compared with the positive pressure command value, and the positive pressure command value may be corrected according to the comparison result.
  • the suction is determined based on the comparison result between the positive pressure detection value of the pressure sensor and the positive pressure command value. Since it can be seen how much the positive pressure supplied to the nozzle deviates from the positive pressure command value, the positive pressure command value is corrected according to the amount of deviation so that the positive pressure supplied to the suction nozzle of the mounting head It is possible to adjust the positive pressure suitable for release, and it is possible to correct the adjustment deviation of the positive pressure due to the secular change of the positive pressure supply system as needed.
  • the process of correcting the positive pressure command value by comparing the positive pressure detection value of the pressure sensor with the positive pressure command value does not need to be performed every time the mounting head is replaced. It may be performed once every time the number of head replacements reaches a predetermined number, or at the start of operation of the component mounting machine.
  • the present invention may be configured such that the suction nozzle held in the mounting head can be replaced from among a plurality of types of suction nozzles.
  • the suction nozzle held by the mounting head changes, the type (size, shape, weight, etc.) of the part to be picked up changes, and the positive pressure suitable for releasing the part sucked by the suction nozzle may change. There is.
  • a plurality of positive pressure command values corresponding to a plurality of types of suction nozzles that can be held by the mounting head are set for each mounting head that is held by the head holding unit, and the control means includes the head
  • a positive pressure command value corresponding to the suction nozzle held by the mounting head is output to the electropneumatic proportional valve to adjust the output positive pressure of the electropneumatic proportional valve.
  • FIG. 8 is a flowchart showing the flow of processing of the positive pressure adjustment program.
  • FIG. 9 is a flowchart showing the flow of processing of the positive pressure command value correction program.
  • FIG. 10 is a diagram illustrating a data table of positive pressure command values corresponding to the mounting head according to the first embodiment.
  • FIG. 11 is a diagram illustrating a data table of positive pressure command values corresponding to the mounting head and the suction nozzle according to the second embodiment.
  • FIGS. 1-10 A first embodiment of the present invention will be described with reference to FIGS. First, the structure of the component adsorption
  • a plurality of nozzle holders 12 are held by a rotary mounting head 11 (rotating head) of the component suction device 10 so as to be lowered at predetermined intervals in the circumferential direction.
  • suction nozzles 13 for sucking parts are engaged and held so that they can be exchanged downward (detachable).
  • the mounting head 11 is replaceably (removably) held by an R shaft 22 (see FIG. 2) extending below a head holding unit 21 that is moved by a head moving device 20 (see FIG. 6) of the component mounter.
  • the head holding unit 21 is assembled with an R-axis drive mechanism 23 (head rotation drive mechanism) that rotates the R-axis 22.
  • the R-axis drive mechanism 23 rotates an R-axis gear 24 (tooth surface not shown) fixed to the upper end of the R-axis 22 by an R-axis motor 25 to rotate the mounting head 11 around the R-axis 22.
  • the plurality of nozzle holders 12 are configured to rotate integrally with the plurality of suction nozzles 13 in the circumferential direction of the mounting head 11.
  • a Q-axis gear 27 (toothed surface not shown) serving as a drive source for the Q-axis drive mechanism 26 (nozzle rotation drive mechanism) is rotatably inserted into the R-axis 22, and the Q-axis gear 27 is rotated by a Q-axis motor 28. Thus, it rotates around the R axis 22.
  • a plurality of (for example, four) engaging members 31 for detachably engaging and holding the mounting head 11 are provided at the lower end portion of the R shaft 22 so as to be movable in the vertical direction.
  • an air cylinder (not shown) for driving the engagement member 31 in the vertical direction is provided.
  • Each engagement member 31 is formed in an L shape or a J shape, and is arranged at equal intervals in the circumferential direction of the R shaft 22, and the direction of the claw portion of each engagement member 31 is the positive direction of the R shaft 22. They are aligned so as to be in the same direction as the rotation direction (or reverse rotation direction).
  • the mounting head 11 is provided with a nozzle rotation gear mechanism 32 (see FIGS. 3 and 4) that transmits the rotational force of the Q-axis gear 27 to each nozzle holder 12.
  • the nozzle rotation gear mechanism 32 bites a cylindrical gear 33 (tooth surface not shown) that is rotatably held concentrically on the upper side of the mounting head 11 and a small gear 34 attached to each nozzle holder 12.
  • the Q-axis gear 27 of the head holding unit 21 and the cylindrical gear 33 of the nozzle rotation gear mechanism 32 are coupled so as to be able to transmit rotation by engaging the concave and convex portions of the ring-shaped clutch members 61 and 62 (see FIGS. 2 and 3).
  • each nozzle holder 12 rotates around the axis of each nozzle holder 12, and each nozzle holder 12 rotates.
  • the direction (angle) of each component sucked by each suction nozzle 13 held by the holder 12 is corrected.
  • the inner diameter of the cylindrical gear 33 is slightly larger than the outer diameter of the R shaft 22 so that the R shaft 22 of the head holding unit 21 can be inserted into the cylindrical gear 33.
  • Engagement holes 35 are formed at equal intervals in the circumferential direction.
  • a head mounting portion (not shown) for mounting the replacement mounting head 11 is provided at a predetermined position within the movement range of the head holding unit 21 of the component mounting machine.
  • This head mounting portion is configured to mount a plurality of types of mounting heads 11.
  • the mounting head 11 placed on the head placement portion is attached to the head holding unit 21, the R shaft 22 of the head holding unit 21 is inserted into the cylindrical gear 33, and each engagement member 31 of the R shaft 22 is inserted.
  • Each of the mounting heads 11 is inserted into each of the engagement holes 35 and the R shaft 22 is rotated by the rotation of the R shaft gear 24 so that the engagement members 31 are engaged with the end edges of the engagement holes 35.
  • the engaging member 31 is pulled up and held.
  • the head holding unit 21 can hold various types of rotary mounting heads 11 [see FIGS. 5A and 5B] and also has a single nozzle mounting head 38 [see FIG. 5C]. It can be retained.
  • the nozzle mounting portion for mounting the replacement suction nozzle 13 [see FIGS. 5 (d) to (i)]. (Not shown) is provided so that the suction nozzle 13 held by the nozzle holder 12 of the mounting head 11 can be automatically replaced.
  • a Z-axis drive mechanism (not shown) using a Z-axis motor 37 (see FIG. 6) as a drive source moves integrally with the head holding unit 21.
  • the engagement piece 39 fixed to the upper end of the nozzle holder 12 is pushed down by a push-down member (not shown) of the Z-axis drive mechanism at a predetermined stop position of the orbit of the nozzle holder 12.
  • the nozzle holder 12 is lowered.
  • each nozzle holder 12 is urged upward by a spring 40, and the nozzle holder 12 released from the depressing member of the Z-axis drive mechanism is moved to the upper limit position (FIG. 3) by the urging force of the spring 40.
  • FIG. 3 the state shown in FIG.
  • the component mounter is equipped with a camera 41 (see FIG. 6) that images the fiducial marks on the circuit board, and the camera 41 is moved integrally with the component suction device 10 by the head moving device 20.
  • the camera 41 is also used as a camera for imaging the reference mark 42 (see FIGS. 3 and 4) of the mounting head 11 on the head mounting portion in addition to the reference mark on the circuit board.
  • the reference mark 42 of the mounting head 11 is formed at a predetermined position on the upper end portion of the cylindrical gear 33.
  • the reference mark 42 is imaged by the camera 41, and the image is captured by the control device 43 (see FIG. 6) of the component mounting machine. By processing, the position of the reference mark 42 is detected, and the rotational phase of the cylindrical gear 33 is detected.
  • the identification information (hereinafter referred to as “head ID”) of the mounting head 11 is indicated on the upper surface of the engagement piece 39 at the upper end of the predetermined nozzle holder 12 of the mounting head 11. ) Is recorded by a code such as a bar code or a two-dimensional code.
  • the camera 41 of the component mounter is used as a head ID reading unit that reads the head ID from the head ID recording unit 45, and an image obtained by imaging the head ID recording unit 45 with the camera 41 is controlled by the control device.
  • the head ID is read by processing at 43.
  • an optical sensor (not shown) for detecting a mounting head for checking the type of the mounting head 11 held by the head holding unit 21 is provided.
  • the control device 43 can detect the mounting head 11 when the mounting head 11 without the head ID recording unit 45 is held by the head holding unit 21 or when the power of the component mounting machine is turned on. The type of the mounting head 11 held in the head holding unit 21 can be confirmed based on the output signal.
  • the head holding unit 21 of the component mounting machine is supplied from a negative pressure supply system 52 that supplies negative pressure supplied from the negative pressure source 51 to the mounting head 11 and a positive pressure source 53.
  • a positive pressure supply system 54 that supplies positive pressure to the mounting head 11 is provided.
  • the negative pressure supply system 52 is provided with an electromagnetic valve 56 that opens and closes the negative pressure supply path 55. When the component is adsorbed to the adsorption nozzle 13 of the mounting head 11, the electromagnetic valve 56 is opened to adsorb the mounting head 11. Negative pressure is supplied to the nozzle 13.
  • the positive pressure supply system 54 is adjusted by an electropneumatic proportional valve 57 (also referred to as an electropneumatic regulator or a proportional control valve) that adjusts the positive pressure supplied to the suction nozzle 13 of the mounting head 11 and the electropneumatic proportional valve 57.
  • An electromagnetic valve 59 that opens and closes a positive pressure supply path 58 that supplies positive pressure to the mounting head 11 is provided.
  • the electromagnetic valve 59 is opened, and the positive pressure adjusted by the electropneumatic proportional valve 57 is supplied to the suction nozzle 13 of the mounting head 11.
  • the positive pressure supply path 58 on the downstream side of the electromagnetic valve 59 is provided with a pressure sensor 60 that detects the positive pressure supplied to the mounting head 11 when the electromagnetic valve 59 is opened (when the parts are released).
  • the control device 43 of the component mounter is configured mainly by a computer, and controls the head moving device 20, the R-axis motor 25, the Q-axis motor 28, and the Z-axis motor 37 of the head holding unit 21 according to the production program, While controlling the operation
  • control device 43 of the component mounting machine controls the opening / closing operation of the electromagnetic valve 56 of the negative pressure supply system 52, the positive pressure adjusting operation of the electropneumatic proportional valve 57 of the positive pressure supply system 54, and the opening / closing of the electromagnetic valve 59. It also functions as a control means for controlling the operation. Further, the control device 43 reads the output signal of the pressure sensor 60 when the electromagnetic valve 59 is opened (when the part is released), and detects the positive pressure supplied to the mounting head 11.
  • the mounting head 11 to be held by the head holding unit 21 of the component mounting machine is a mounting head 11 that holds the suction nozzle 13 having a nozzle diameter corresponding to the type (size, shape, weight, etc.) of the component to be sucked.
  • the mounting heads 11 have different numbers of suction nozzles 13, when the mounting head 11 is held by the head holding unit 21, when the component sucked by the suction nozzle 13 of the mounting head 11 is released. If the positive pressure (vacuum breaking pressure) supplied from the positive pressure source 53 to the suction nozzle 13 of the mounting head 11 is constant, the positive pressure may be insufficient depending on the part, and the part cannot be released from the suction nozzle 13. Some parts are brought home while being attached to the suction nozzle 13 due to static electricity or the like. Thus there is a possibility that shift the mounting position around the components on the circuit board.
  • the control device 43 of the component mounting machine is suitable for releasing the component in which the output positive pressure of the electropneumatic proportional valve 57 is attracted to the suction nozzle 13 of the mounting head 11 for each mounting head 11 held by the head holding unit 21.
  • the pressure is adjusted to positive pressure.
  • positive pressure command values P1, P2,.
  • the control device 43 causes the head holding unit 21 to hold the mounting head 11 on the head mounting portion.
  • the positive pressure command value corresponding to the head ID read by the camera 41 from the head ID recording unit 45 provided in the mounting head 11 on the head placement unit is read from the positive pressure command value table stored in the storage device 46.
  • the positive pressure command value is output to the electropneumatic proportional valve 57 to adjust the output positive pressure of the electropneumatic proportional valve 57.
  • the positive pressure detected by the pressure sensor 60 when the positive pressure is supplied to the mounting head 11 is compared with a positive pressure command value (target positive pressure), and the positive pressure command value is corrected according to the comparison result.
  • the positive pressure detected value of the pressure sensor 13 is compared with the positive pressure command value.
  • the positive pressure supplied to the mounting head 11 is corrected by correcting the positive pressure command value according to the deviation amount.
  • the pressure can be adjusted to a positive pressure suitable for releasing the parts, and the adjustment deviation of the positive pressure due to the secular change of the positive pressure supply system 54 can be corrected at any time.
  • the process of correcting the positive pressure command value by comparing the positive pressure detection value of the pressure sensor 60 with the positive pressure command value does not need to be performed every time the mounting head 11 is replaced, or every time a predetermined period elapses, or The mounting head 11 may be replaced once every time the replacement number reaches a predetermined number or at the start of operation of the component mounting machine.
  • the positive pressure adjustment process of the first embodiment described above and the correction process of the positive pressure command value based on the detected positive pressure value of the pressure sensor 60 are performed by the control device 43 by the positive pressure adjustment program of FIG. 8 and the positive pressure of FIG. It is executed according to the command value correction program.
  • the processing contents of these programs will be described.
  • step 101 it is determined whether it is the replacement timing of the mounting head 11 (that is, the timing at which the head holding unit 21 holds the mounting head 11 on the head mounting portion). If it is not the replacement timing, the system waits until the replacement timing is reached. Thereafter, when the replacement timing is reached, the process proceeds to step 102 where the camera 41 of the component mounter images the head ID recording unit 45 provided on the mounting head 11 on the head mounting unit and processes the image. Thus, the head ID of the mounting head 11 is read.
  • the replacement timing of the mounting head 11 that is, the timing at which the head holding unit 21 holds the mounting head 11 on the head mounting portion. If it is not the replacement timing, the system waits until the replacement timing is reached. Thereafter, when the replacement timing is reached, the process proceeds to step 102 where the camera 41 of the component mounter images the head ID recording unit 45 provided on the mounting head 11 on the head mounting unit and processes the image. Thus, the head ID of the mounting head 11 is read.
  • step 103 the positive pressure command value corresponding to the head ID read in step 102 is read with reference to the positive pressure command value table of FIG. Then, the positive pressure command value is output to the electropneumatic proportional valve 57 to adjust the output positive pressure of the electropneumatic proportional valve 57.
  • the positive pressure supplied to the mounting head 11 is changed to a positive pressure suitable for releasing the components adsorbed by the suction nozzle 13 of the mounting head 11. adjust.
  • step 203 the positive pressure detection value of the pressure sensor 60 is read, and in the next step 204, the positive pressure detection value and the positive pressure command value of the pressure sensor 60 are obtained.
  • the amount of misalignment of the positive pressure is calculated by the following equation.
  • Positive pressure adjustment deviation positive pressure detection value ⁇ positive pressure command value
  • the positive pressure command value is a value converted into pressure, and a value obtained by combining the positive pressure detection value and the unit is used.
  • step 205 if it is determined in step 205 that the absolute value of the positive pressure adjustment deviation amount is equal to or less than the predetermined value, the positive pressure adjustment deviation amount is small, and there is no need to correct the deviation of the positive pressure command value. Determination is made, the process returns to step 201, and the above-described processing is repeated.
  • a positive pressure command value reading means (camera or reader) for reading the positive pressure command value from the positive pressure command value recording portion of the mounting head 11 on the mounting portion is provided in the head holding unit 21, and the control device 43
  • the positive pressure command value read by the positive pressure command value reading means from the positive pressure command value recording portion provided in the mounting head 11 on the portion is output to the electropneumatic proportional valve 57 to output the electropneumatic proportional valve 5. Output positive pressure may be adjusted.
  • the suction nozzle 13 held by the mounting head 11 is configured to be replaceable from a plurality of types of suction nozzles 13.
  • the suction nozzle 13 held by the mounting head 11 is changed, the type (size, shape, weight, etc.) of the part to be sucked is changed, and the positive pressure suitable for releasing the part sucked by the suction nozzle 13 is changed. there's a possibility that.
  • each mounting head 11 (H1, H2,..., HN) held by the head holding unit 21 is held by the mounting head 11.
  • a positive pressure command value table in which a plurality of positive pressure command values (Pa1, Pb1,..., PxN) corresponding to a plurality of types of suction nozzles 13 (a, b,.
  • the control device 43 stores a positive pressure command value corresponding to the suction nozzle 13 held by the mounting head 11 for each mounting head 11 held by the head holding unit 21.
  • the supply to the mounting head 11 is performed.
  • the positive pressure to be adjusted can be adjusted to a positive pressure suitable for releasing the component sucked by the suction nozzle 13 of the mounting head 11.
  • SYMBOLS 10 Component adsorption apparatus, 11 ... Mounting head, 12 ... Nozzle holder, 13 ... Adsorption nozzle, 20 ... Head moving mechanism, 21 ... Head holding unit, 22 ... R axis, 23 ... R axis drive mechanism (head rotation drive mechanism) , 24 ... R-axis gear, 25 ... R-axis motor, 26 ... Q-axis drive mechanism (nozzle rotation drive mechanism), 27 ... Q-axis gear, 28 ... Q-axis motor, 31 ... engaging member, 32 ... nozzle rotation gear mechanism , 33 ... cylindrical gear, 34 ... small gear, 35 ... engagement hole, 37 ... Z-axis motor, 41 ... camera (head ID reading means), 42 ...
  • control device control means
  • feeder feeder
  • head ID recording unit 46
  • storage device storage means 51
  • negative pressure source 52
  • negative pressure supply system 53
  • positive pressure source 54
  • positive pressure supply system 55
  • negative pressure supply path 56
  • Solenoid valve 57
  • Electro-pneumatic proportional valve 58
  • Pressure supply path 59
  • electromagnetic valve 60
  • pressure sensor 60

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

L'invention concerne une tête de montage (11) qui est retenue de manière à pouvoir être remplacée dans une unité de rétention de tête (21) d'une machine de montage de composants. L'unité de rétention de tête (21) comporte un système d'application de pression négative (52) qui applique une pression négative provenant d'une source de pression négative (51) à la tête de montage (11), et un système d'application de pression positive (54) qui applique une pression positive provenant d'une source de pression positive (53) à la tête de montage (11). Le système d'application de pression positive (54) comporte une vanne proportionnelle électropneumatique (57) qui règle la pression positive appliquée à la tête de montage (11), et une électrovanne (59) qui ouvre et ferme un chemin d'application de pression positive (58) qui applique la pression positive, laquelle a été réglée par la vanne proportionnelle électropneumatique (57), à la tête de montage (11). Chaque fois que la tête de montage (11) est retenue par l'unité de rétention de tête (21), un dispositif de commande (43) de la machine de montage de composants acquiert une valeur d'instruction de pression positive permettant de libérer un composant saisi par une buse d'aspiration (13) de la tête de montage (11) et transmet la valeur d'instruction de pression positive à la vanne proportionnelle électropneumatique (57) afin de régler la pression positive de sortie de la vanne proportionnelle électropneumatique (57).
PCT/JP2013/069752 2013-07-22 2013-07-22 Machine de montage de composants WO2015011751A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015528021A JP6144765B2 (ja) 2013-07-22 2013-07-22 部品実装機
PCT/JP2013/069752 WO2015011751A1 (fr) 2013-07-22 2013-07-22 Machine de montage de composants

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Application Number Priority Date Filing Date Title
PCT/JP2013/069752 WO2015011751A1 (fr) 2013-07-22 2013-07-22 Machine de montage de composants

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WO2015011751A1 true WO2015011751A1 (fr) 2015-01-29

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018135346A1 (fr) * 2017-01-17 2018-07-26 シンフォニアテクノロジー株式会社 Dispositif de commande de pompe à air
WO2019082404A1 (fr) * 2017-10-26 2019-05-02 シンフォニアテクノロジー株式会社 Dispositif de régulation d'air d'appareil monteur
WO2023084085A1 (fr) * 2021-11-15 2023-05-19 Kulicke & Soffa Netherlands B.V. Systèmes de placement de composants, têtes de placement de pipette multiple et leurs procédés d'utilisation

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WO2018135346A1 (fr) * 2017-01-17 2018-07-26 シンフォニアテクノロジー株式会社 Dispositif de commande de pompe à air
JP2018117007A (ja) * 2017-01-17 2018-07-26 シンフォニアテクノロジー株式会社 マウンタ用エア制御装置
CN110192446A (zh) * 2017-01-17 2019-08-30 昕芙旎雅有限公司 安装机用空气控制装置
CN110192446B (zh) * 2017-01-17 2020-11-27 昕芙旎雅有限公司 安装机用空气控制装置
US11202399B2 (en) 2017-01-17 2021-12-14 Sinfonia Technology Co., Ltd. Mounter air controller
WO2019082404A1 (fr) * 2017-10-26 2019-05-02 シンフォニアテクノロジー株式会社 Dispositif de régulation d'air d'appareil monteur
JP2019079970A (ja) * 2017-10-26 2019-05-23 シンフォニアテクノロジー株式会社 マウンタ用エア制御装置
JP7001425B2 (ja) 2017-10-26 2022-01-19 シンフォニアテクノロジー株式会社 マウンタ用エア制御装置
US11589490B2 (en) 2017-10-26 2023-02-21 Sinfonia Technology Co., Ltd. Air control device for mounter
WO2023084085A1 (fr) * 2021-11-15 2023-05-19 Kulicke & Soffa Netherlands B.V. Systèmes de placement de composants, têtes de placement de pipette multiple et leurs procédés d'utilisation

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