WO2015004768A1 - Procédé de sérigraphie et dispositif de sérigraphie - Google Patents

Procédé de sérigraphie et dispositif de sérigraphie Download PDF

Info

Publication number
WO2015004768A1
WO2015004768A1 PCT/JP2013/068962 JP2013068962W WO2015004768A1 WO 2015004768 A1 WO2015004768 A1 WO 2015004768A1 JP 2013068962 W JP2013068962 W JP 2013068962W WO 2015004768 A1 WO2015004768 A1 WO 2015004768A1
Authority
WO
WIPO (PCT)
Prior art keywords
screen
mask
circuit board
screen printing
support member
Prior art date
Application number
PCT/JP2013/068962
Other languages
English (en)
Japanese (ja)
Inventor
剛 水越
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to PCT/JP2013/068962 priority Critical patent/WO2015004768A1/fr
Priority to EP13889212.0A priority patent/EP3020551B1/fr
Priority to US14/903,339 priority patent/US9656454B2/en
Priority to CN201380078081.0A priority patent/CN105358323B/zh
Priority to JP2015526091A priority patent/JP6071156B2/ja
Publication of WO2015004768A1 publication Critical patent/WO2015004768A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/44—Squeegees or doctors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/12—Machines with auxiliary equipment, e.g. for drying printed articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes

Definitions

  • the present invention relates to a screen printing method and a screen printing apparatus that screen-prints a predetermined pattern on a circuit board after removing static electricity charged on the screen mask.
  • the screen printing apparatus when screen printing is performed by overlaying the screen mask on the upper surface of the circuit board, the upper surface of the screen mask is rubbed with a squeegee due to the squeegeeing operation, so that static electricity is easily charged on the screen mask.
  • static electricity is charged on the screen mask
  • the delicate circuit inside the electronic components on the lower surface side of the circuit board is caused by the electrostatic discharge from the screen mask. It can be destroyed.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2004-17512
  • a mask holder for holding a screen mask and the mask holder Connect the screen mask to the upper surface of the screen mask with a ground wire, let the static electricity charged on the screen mask escape to the ground side through the ground wire and the mask holder, or touch the upper surface of the screen mask with the static elimination brush connected to the ground side. There is one that let static electricity escape from the screen mask.
  • Patent Document 2 Japanese Patent Laid-Open No. 8-252988
  • conductive layers are formed on both the upper and lower surfaces of the screen mask, In some cases, static electricity is removed from the screen mask through a clamp member that clamps the circuit board.
  • Patent Document 1 in the static elimination method in which the ground wire is connected to the upper surface side of the screen mask, it is necessary to replace the ground wire with the screen mask every time the screen mask is replaced. is there. Further, in the static elimination method in which the static elimination brush is brought into contact with the upper surface of the screen mask, the static elimination brush does not interfere with the squeegee every time the screen mask is changed, depending on the size of the screen mask and the movement range of the squeegee. It is necessary to change the position, and the work is troublesome.
  • the circuit board is also attached to the lower surface of the screen mask during screen printing. Since the conductive layer and the clamp member are in contact with each other, there is a possibility that a part of static electricity released from the screen mask to the conductive layer and the clamp member may be charged to the circuit board. The effect of preventing damage to electronic components due to electrostatic discharge from the screen mask is small.
  • the present invention raises the circuit board carried under the screen mask and keeps the circuit board in contact with the lower surface of the screen mask, thereby bringing the squeegee into contact with the upper surface of the screen mask.
  • a screen printing method and a screen printing apparatus for screen-printing a predetermined pattern on the upper surface of the circuit board by moving the circuit board the position is located on the side of the circuit board before contacting the circuit board with the lower surface of the screen mask.
  • the conductive mask supporting member to be lifted is brought into contact with the lower surface of the screen mask to remove static electricity charged on the screen mask through the mask supporting member, and then the circuit board is lifted to The screen is printed by contacting the lower surface of the screen mask.
  • the present invention performs the rising operation of the mask support member at a timing earlier than the rising operation of the circuit board, so that the static electricity charged in the screen mask is made conductive before the circuit board is brought into contact with the lower surface of the screen mask. Since it can be removed through the support member, electrostatic discharge from the screen mask to the circuit board can be surely prevented, and damage to electronic components due to electrostatic discharge from the screen mask can be reliably prevented. Moreover, the operation of making the rising timing of the mask support member earlier than the rising timing of the circuit board can be automatically controlled by the screen printing device, and the operator can change the ground wire or remove the static elimination brush every time the screen mask is replaced. It is not necessary to change the position of the screen mask, and the screen mask replacement work can be simplified accordingly. In addition, since the charge removal operation of the present invention can be dealt with only by changing the control program of the screen printing apparatus, the static electricity removal function can be realized at low cost.
  • the present invention performs screen printing after performing the static elimination operation only when screen printing is performed on the upper surface of a circuit board having electronic components mounted on the lower surface, and the screen is formed on the upper surface of the circuit board having no electronic components mounted on the lower surface.
  • the neutralization operation is not performed, and the mask support member and the circuit board are both raised at the same height and brought into contact with the lower surface of the screen mask at the same time. You may make it do. This is because damage to the electronic component due to electrostatic discharge from the screen mask is likely to occur when screen printing is performed on the upper surface of the circuit board having the electronic component mounted on the lower surface.
  • the static elimination operation may be performed before screen printing each time.
  • the static elimination operation is performed. You may make it screen-print by performing a static elimination operation every time screen printing which is not performed is performed a predetermined number of times (that is, every time the screen mask is charged with a charge that may be discharged). In this way, the number of times of performing the static elimination operation with respect to the number of screen printings can be greatly reduced, and the productivity can be improved.
  • an adsorption hole for adsorbing the screen mask with negative pressure during screen printing is formed on the upper surface of the mask support member, and negative pressure is applied to the adsorption hole when performing static elimination operation.
  • the upper surface of the mask support member may be brought into close contact with the lower surface of the screen mask by force. In this way, the conduction resistance between the screen mask and the mask support member can be reduced, and static electricity can be easily released from the screen mask to the mask support member.
  • FIG. 1 is a diagram for explaining the operation of carrying a circuit board under a screen mask of a screen printing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a diagram for explaining the operation of clamping the circuit board carried under the screen mask with a clamp member.
  • FIG. 3 is a diagram for explaining the operation of removing the charge by raising the mask support member and bringing it into contact with the lower surface of the screen mask.
  • FIG. 4 is a view for explaining the screen printing operation by raising the circuit board and bringing it into contact with the lower surface of the screen mask.
  • FIG. 5 is a diagram for explaining a plate separating operation for lowering the circuit board while keeping the mask support member in contact with the lower surface of the screen mask after screen printing.
  • FIG. 6 is a view for explaining the operation of lowering the lifting table and lowering the mask support member.
  • FIG. 7 is a block diagram showing the configuration of the control system of the screen printing apparatus.
  • the screen printing apparatus 10 is provided with two upper and lower lift tables 11 and 12 that can be moved up and down, and the upper lift table 11 is supported on the lower lift table 12 by a lift mechanism 13 so as to be lifted and lowered.
  • the lower elevating table 12 is supported by an elevating mechanism 26 (see FIG. 7) so as to be movable up and down.
  • Side clampers 15 that clamp the both side edges of the circuit board 14 are provided on both sides of the upper lift table 11. The distance between the side clampers 15 on both sides is adjusted by a feed screw mechanism 37 (see FIG. 7) according to the width of the circuit board 14 to be clamped. Inside the side clamper 15, a conveyor 16 for loading and unloading the circuit board 14 is provided, and both side edges of the circuit board 14 are clamped by the side clamper 15 on the conveyor 16.
  • a conductive mask support member 17 is provided on the lower lift table 12 adjacent to each side clamper 15, and the interval between the mask support members 17 on both sides is sent in accordance with the width of the conveyor 16 (interval of the side clamper 15). It is adjusted by a screw mechanism 38 (see FIG. 7).
  • a backup plate 18 is provided so as to be lifted and lowered by a lifting mechanism 19, and a plurality of backup pins 20 for receiving and supporting the circuit board 14 from below are provided on the backup plate 18. .
  • a screen mask 21 is horizontally disposed above the mask support member 17 and the side clamper 15, and a squeegee 22 is disposed above the screen mask 21.
  • the screen mask 21 is formed of a metal plate or the like, and is attached to the mask attachment frame 23 via a tension film 24 made of an insulating elastic material.
  • the mask support member 17 is formed on a horizontal flat surface so that its upper surface is in close contact with the lower surface of the screen mask 21 and static electricity moves from the screen mask 21 to the mask support member 17.
  • the mask support member 17 and the lower lift table 12 are each formed of a conductive member such as metal, and are in electrical contact with each other.
  • a grounded ground wire 25 is connected to the lower lift table 12. .
  • a suction hole 27 for sucking the screen mask 21 with negative pressure during screen printing is formed on the upper surface of the mask support member 17, and negative pressure is applied to the suction hole 27 when performing a charge eliminating operation described later.
  • the lower surface of the screen mask 21 is brought into close contact with the upper surface of the mask support member 17 by the negative pressure adsorption force.
  • the screen printing apparatus 10 configured as described above includes a control device 31 (see FIG. 7) as control means.
  • the control device 31 controls the operation of the screen printing apparatus 10 including the raising / lowering operation of the circuit board 14, the raising / lowering operation of the mask support member 17, and the movement operation of the squeegee 22.
  • the screen printing device 10 When the screen printing device 10 is used to screen-print the circuit board 14 on the lower surface of the screen mask 21, the upper surface of the screen mask 21 is rubbed with the squeegee 22 by the squeegeeing operation.
  • the mask 21 is easily charged with static electricity.
  • static electricity is charged on the screen mask 21
  • the control device 31 when screen printing is performed on the upper surface of the circuit board 14 on which the electronic component 28 is mounted on the lower surface, the control device 31 does not contact the circuit board 14 with the lower surface of the screen mask 21.
  • a conductive mask support member 17 located on the side of the substrate 14 is raised and brought into contact with the lower surface of the screen mask 21 to perform static elimination operation for removing static electricity charged in the screen mask 21 through the mask support member 17. Thereafter, the circuit board 14 is raised and brought into contact with the lower surface of the screen mask 21 to perform screen printing.
  • the control device 31 has a circuit board 14 in which an electronic component 28 is mounted on the lower surface in a state where the height of the upper surface of the mask support member 17 is higher than the height of the upper surface of the side clamper 15. Is placed on the conveyor 16 and carried into a predetermined printing position below the screen mask 21.
  • the control device 31 raises the backup plate 18 by the lifting mechanism 19, pushes up the circuit board 14 at the upper end of the backup pin 20 on the backup plate 18, and the circuit board 14.
  • the rising operation of the circuit board 14 is stopped in a state where the height of the upper surface of the circuit board 15 is aligned with the height of the upper surface of the side clamper 15.
  • the control device 31 reduces the distance between the side clampers 15 and clamps both side edges of the circuit board 14.
  • the control device 31 moves to the static elimination operation, and the control device 31 raises the lower lift table 12 and brings the mask support member 17 into contact with the lower surface of the screen mask 21.
  • the ascending operation of 12 is stopped.
  • the control device 31 applies a negative pressure to the suction hole 27 on the upper surface of the mask support member 17 to bring the lower surface of the screen mask 21 into close contact with the upper surface of the mask support member 17 by the negative pressure suction force.
  • the screen mask 21 is grounded through the mask support member 17, the lower lift table 12, and the ground wire 25, and static electricity charged in the screen mask 21 is applied to the mask support member 17 ⁇ the lower lift table 12 ⁇ the ground wire 25. It is escaped to the earth side by the route of.
  • the control device 31 raises the upper lifting table 11 so that the upper surface of the circuit board 14 and the upper surface of the side clamper 15 are in contact with the lower surface of the screen mask 21.
  • the raising operation of the lifting table 11 is stopped.
  • the screen mask 21 is neutralized, even if the upper surface of the circuit board 14 is brought into contact with the lower surface of the screen mask 21, static electricity is not discharged from the screen mask 21 to the circuit board 14.
  • the control device 31 screen-prints a predetermined pattern on the upper surface of the circuit board 14 by moving the squeegee 22 in contact with the upper surface of the screen mask 21.
  • control device 31 applies a negative pressure to the suction hole 27 on the upper surface of the mask support member 17 so as to make the lower surface of the screen mask 21 the upper surface of the mask support member 17 by the negative pressure adsorption force, as in the above-described static elimination operation. Hold it in close contact.
  • the control device 31 releases the negative pressure, shifts to the plate separating operation, lowers the lifting table 11 on the upper stage, and connects the circuit board 14 and the side clamper 15 to the screen mask. 21 to be spaced downward.
  • the control device 31 lowers the lower lifting table 12 to separate the mask support member 17 downward from the screen mask 21, and the circuit board 14 and the side clamper 15 are moved back to the original. Lower to height position.
  • the control device 31 lowers the backup plate 18 by the elevating mechanism 19 and places the circuit board 14 on the conveyor 16, and widens the interval between the side clampers 15 to release the clamp of the circuit board 14.
  • the carrying operation is started and the circuit board 14 is carried out.
  • the control device 31 performs the above-described static elimination operation of the screen mask 21 and then performs screen printing by bringing the circuit board 14 into contact with the lower surface of the screen mask 21.
  • the lifting operation of the mask support member 17 is performed at a timing earlier than the lifting operation of the circuit board 14, so that the screen before the circuit board 14 contacts the lower surface of the screen mask 21. Since the static electricity charged on the mask 21 can be removed through the conductive mask support member 17, the discharge of static electricity from the screen mask 21 to the circuit board 14 can be reliably prevented, and the electrons due to the electrostatic discharge from the screen mask 21 can be prevented. Damage to the component 28 can be reliably prevented.
  • the operation of making the rising timing of the mask support member 17 earlier than the rising timing of the circuit board 14 can be automatically controlled by the screen printing apparatus 10, and each time the screen mask 21 is replaced, the operator can connect the ground wire 25.
  • the circuit board 14 is brought into contact with the lower surface of the screen mask 21 after performing the above-described static elimination operation of the screen mask 21.
  • the electronic component 28 is damaged due to electrostatic discharge from the screen mask 21 when screen printing is performed on the upper surface of the circuit board 14 having the electronic component 28 mounted on the lower surface.
  • the screen printing is performed after performing the static elimination operation as in the above embodiment, and the electronic component is formed on the lower surface.
  • the static elimination operation may be performed before screen printing each time, but since the amount of static electricity charged on the screen mask 21 by one screen printing is considered to be relatively small, the static elimination operation is performed. It is also possible to carry out screen printing by performing a static elimination operation every time screen printing without performing a predetermined number of times (that is, every time the screen mask 21 is charged with an amount of charge that may be discharged). In this way, the number of times of performing the static elimination operation with respect to the number of screen printings can be greatly reduced, and the productivity can be improved.
  • the ground wire 25 is connected to the mask support member 17, and the static electricity charged on the screen mask 21 is connected to the ground side through the path of the mask support member 17 ⁇ the ground wire 25.
  • the operating mechanism of the side clamper 15, the operating mechanism of the backup plate 18, the operating mechanism of the mask support member 17, etc. may be changed as appropriate. Needless to say, this can be done.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Methods (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Selon la présente invention, lorsqu'on soulève une carte de circuit imprimé (14) supportée sous un masque d'écran (21), que l'on maintient la carte de circuit imprimé (14) dans un état où elle vient en contact avec la surface inférieure du masque d'écran (21), que l'on met en contact une raclette (22) avec la surface supérieure du masque d'écran (21) et qu'on déplace la raclette (22), ce qui permet de sérigraphier un motif prédéterminé sur la surface supérieure de la carte de circuit imprimé (14) avant que la carte de circuit imprimé (14) ne vienne en contact avec la surface inférieure du masque d'écran (21), un élément de support de masque conducteur (17) positionné sur le côté de la carte de circuit imprimé (14) est soulevé, venant en contact avec la surface inférieure du masque d'écran (21), ce qui permet d'effectuer une opération antistatique pour éliminer l'électricité statique qui charge le masque d'écran (21) à travers l'élément de support de masque (17). Ensuite, la carte de circuit imprimé (14) est soulevée, venant en contact avec la surface inférieure du masque d'écran (21), et la sérigraphie est réalisée.
PCT/JP2013/068962 2013-07-11 2013-07-11 Procédé de sérigraphie et dispositif de sérigraphie WO2015004768A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2013/068962 WO2015004768A1 (fr) 2013-07-11 2013-07-11 Procédé de sérigraphie et dispositif de sérigraphie
EP13889212.0A EP3020551B1 (fr) 2013-07-11 2013-07-11 Procédé de sérigraphie et dispositif de sérigraphie
US14/903,339 US9656454B2 (en) 2013-07-11 2013-07-11 Screen printing method and screen printing device
CN201380078081.0A CN105358323B (zh) 2013-07-11 2013-07-11 丝网印刷方法及丝网印刷装置
JP2015526091A JP6071156B2 (ja) 2013-07-11 2013-07-11 スクリーン印刷方法及びスクリーン印刷装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/068962 WO2015004768A1 (fr) 2013-07-11 2013-07-11 Procédé de sérigraphie et dispositif de sérigraphie

Publications (1)

Publication Number Publication Date
WO2015004768A1 true WO2015004768A1 (fr) 2015-01-15

Family

ID=52279490

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/068962 WO2015004768A1 (fr) 2013-07-11 2013-07-11 Procédé de sérigraphie et dispositif de sérigraphie

Country Status (5)

Country Link
US (1) US9656454B2 (fr)
EP (1) EP3020551B1 (fr)
JP (1) JP6071156B2 (fr)
CN (1) CN105358323B (fr)
WO (1) WO2015004768A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018109891A1 (fr) * 2016-12-15 2018-06-21 株式会社Ｆｕｊｉ Dispositif de transfert de substrat
CN112425308A (zh) * 2020-11-02 2021-03-02 邯郸市农业科学院 玉米种子培养装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3054696B1 (fr) * 2016-07-29 2019-05-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Capteur de motif thermique a elements chauffants mutualises
CN106379037B (zh) * 2016-08-25 2018-09-07 京东方科技集团股份有限公司 丝网印刷装置以及丝网印刷方法
KR101740493B1 (ko) * 2016-11-14 2017-05-26 유원근 납빠짐성이 개선된 스크린프린터와 이것의 제어방법
CN110053350B (zh) * 2018-01-19 2020-12-04 深圳市阳光晶玻科技有限公司 丝网印刷机及其防静电机构
CN110626054B (zh) * 2019-08-22 2021-04-16 安徽一路明光电科技有限公司 一种led灯灯罩的快速丝印装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0592544A (ja) * 1991-10-02 1993-04-16 Furukawa Electric Co Ltd:The クリーム半田印刷機及びクリーム半田の印刷方法
JPH08252988A (ja) 1995-01-17 1996-10-01 Ricoh Micro Electron Kk ペースト印刷用プラスチックマスクおよびこれを用いたペースト印刷方法
JPH1120126A (ja) * 1997-07-08 1999-01-26 Matsushita Electric Ind Co Ltd スクリーン印刷方法及びその装置
JP2004017512A (ja) 2002-06-18 2004-01-22 Matsushita Electric Ind Co Ltd スクリーン印刷装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW289901B (fr) 1994-12-28 1996-11-01 Ricoh Microelectronics Kk
SG71804A1 (en) * 1995-08-30 2000-04-18 Matsushita Electric Ind Co Ltd Screen printing method and screen printing apparatus
JP2005088343A (ja) * 2003-09-17 2005-04-07 Matsushita Electric Ind Co Ltd スクリーン印刷装置
JP4926567B2 (ja) * 2006-06-29 2012-05-09 ヤマハ発動機株式会社 印刷装置および印刷方法
US8057964B2 (en) * 2008-10-31 2011-11-15 Altera Corporation Photolithographic reticles with electrostatic discharge protection structures
CN201776978U (zh) * 2009-12-31 2011-03-30 四川虹欧显示器件有限公司 用于印刷机的浆料添加装置及具有该装置的印刷系统
JP5059134B2 (ja) * 2010-01-08 2012-10-24 パナソニック株式会社 スクリーン印刷機
JP2012245622A (ja) * 2011-05-25 2012-12-13 Panasonic Corp スクリーン印刷装置およびスクリーン印刷方法
JP2015100943A (ja) * 2013-11-22 2015-06-04 パナソニックＩｐマネジメント株式会社 スクリーン印刷機、部品実装ライン及びスクリーン印刷方法
JP6089228B2 (ja) * 2014-01-29 2017-03-08 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及び電子部品実装システム並びにスクリーン印刷方法
JP6340588B2 (ja) * 2014-05-12 2018-06-13 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0592544A (ja) * 1991-10-02 1993-04-16 Furukawa Electric Co Ltd:The クリーム半田印刷機及びクリーム半田の印刷方法
JPH08252988A (ja) 1995-01-17 1996-10-01 Ricoh Micro Electron Kk ペースト印刷用プラスチックマスクおよびこれを用いたペースト印刷方法
JPH1120126A (ja) * 1997-07-08 1999-01-26 Matsushita Electric Ind Co Ltd スクリーン印刷方法及びその装置
JP2004017512A (ja) 2002-06-18 2004-01-22 Matsushita Electric Ind Co Ltd スクリーン印刷装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018109891A1 (fr) * 2016-12-15 2018-06-21 株式会社Ｆｕｊｉ Dispositif de transfert de substrat
CN112425308A (zh) * 2020-11-02 2021-03-02 邯郸市农业科学院 玉米种子培养装置

Also Published As

Publication number Publication date
JP6071156B2 (ja) 2017-02-01
CN105358323B (zh) 2018-02-23
CN105358323A (zh) 2016-02-24
JPWO2015004768A1 (ja) 2017-02-23
EP3020551A4 (fr) 2016-07-06
US20160200091A1 (en) 2016-07-14
US9656454B2 (en) 2017-05-23
EP3020551B1 (fr) 2018-11-07
EP3020551A1 (fr) 2016-05-18

Similar Documents

Publication Publication Date Title
JP6071156B2 (ja) スクリーン印刷方法及びスクリーン印刷装置
JP6142290B2 (ja) スクリーン印刷機、部品実装ライン及びスクリーン印刷方法
JP5023904B2 (ja) スクリーン印刷装置
KR101160174B1 (ko) 스크린 인쇄 장치 및 스크린 인쇄 방법
JP2015100943A (ja) スクリーン印刷機、部品実装ライン及びスクリーン印刷方法
JP2013251524A (ja) 順次密着できる構造を有するシート型ｆｐｃｂ自動真空吸脱着装置
JP2015039865A (ja) スクリーン印刷機
KR20140041394A (ko) 스크린 인쇄 장치 및 스크린 인쇄 방법
JP4718225B2 (ja) 印刷装置
JP2006272583A (ja) スクリーン印刷装置およびスクリーン印刷方法ならびに基板
CN110997328B (zh) 丝网印刷机
JP2006289677A (ja) 印刷装置および印刷方法
JP4168973B2 (ja) スクリーン印刷装置およびスクリーン印刷方法
JPWO2018109891A1 (ja) 基板搬送装置
JP5316609B2 (ja) 部品実装ラインおよび部品実装方法
JP5630242B2 (ja) スクリーン印刷装置
JP5350529B2 (ja) 部品実装ラインおよび部品実装方法
JP4241497B2 (ja) スクリーン印刷装置およびスクリーン印刷方法
CN114208411B (zh) 作业机及元件搬运方法
JP5257282B2 (ja) スクリーン印刷機及びスクリーン印刷方法
JP2010056382A (ja) フラックス塗布装置
JP5574032B2 (ja) 部品実装ラインおよび部品実装方法ならびにスクリーン印刷装置
JP6101934B2 (ja) スクリーン印刷機及び部品実装ライン
JP5131368B2 (ja) スクリーン印刷装置およびスクリーン印刷方法

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201380078081.0

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13889212

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2015526091

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 14903339

Country of ref document: US

Ref document number: 2013889212

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE