WO2014204161A3 - Insert pour inspection - Google Patents

Insert pour inspection Download PDF

Info

Publication number
WO2014204161A3
WO2014204161A3 PCT/KR2014/005278 KR2014005278W WO2014204161A3 WO 2014204161 A3 WO2014204161 A3 WO 2014204161A3 KR 2014005278 W KR2014005278 W KR 2014005278W WO 2014204161 A3 WO2014204161 A3 WO 2014204161A3
Authority
WO
WIPO (PCT)
Prior art keywords
insert
inspection
hole
support member
conductive
Prior art date
Application number
PCT/KR2014/005278
Other languages
English (en)
Korean (ko)
Other versions
WO2014204161A2 (fr
Inventor
오종우
최우석
Original Assignee
주식회사 아이에스시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아이에스시 filed Critical 주식회사 아이에스시
Publication of WO2014204161A2 publication Critical patent/WO2014204161A2/fr
Publication of WO2014204161A3 publication Critical patent/WO2014204161A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G01R31/2603—Apparatus or methods therefor for curve tracing of semiconductor characteristics, e.g. on oscilloscope
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention se rapporte à un insert pour inspection et, plus particulièrement, à un insert pour inspection comprenant : un corps d'insert possédant un trou traversant formé dans la partie centrale de celui-ci, un dispositif à inspecter pouvant être inséré dans le trou traversant ; et un élément de support agencé par-dessus le trou traversant du corps d'insert, l'élément de support comprenant : une feuille conductrice comprenant des parties conductrices et des parties isolantes supportant des parties conductrices respectives ; et une feuille de guidage agencée sur le côté surface supérieure de la feuille conductrice, la feuille de guidage possédant un trou traversant formé dans chaque position correspondant à la borne.
PCT/KR2014/005278 2013-06-18 2014-06-17 Insert pour inspection WO2014204161A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130069975A KR101490498B1 (ko) 2013-06-18 2013-06-18 검사용 인서트
KR10-2013-0069975 2013-06-18

Publications (2)

Publication Number Publication Date
WO2014204161A2 WO2014204161A2 (fr) 2014-12-24
WO2014204161A3 true WO2014204161A3 (fr) 2015-04-23

Family

ID=52105443

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/005278 WO2014204161A2 (fr) 2013-06-18 2014-06-17 Insert pour inspection

Country Status (3)

Country Link
KR (1) KR101490498B1 (fr)
TW (1) TWI533002B (fr)
WO (1) WO2014204161A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101626513B1 (ko) * 2015-01-21 2016-06-01 신종천 반도체 칩 테스트 소켓
KR20160118796A (ko) * 2015-04-03 2016-10-12 리노공업주식회사 테스트 소켓
KR101928466B1 (ko) * 2016-10-14 2018-12-12 주식회사 아이에스시 검사용 소켓
KR102192764B1 (ko) * 2019-11-19 2020-12-18 (주)티에스이 테스트 소켓 장치
KR102192919B1 (ko) * 2019-11-19 2020-12-18 (주)티에스이 테스트 소켓 장치 및 그 제조방법
KR102089653B1 (ko) * 2019-12-30 2020-03-16 신종천 테스트 소켓 조립체
KR102144806B1 (ko) * 2020-04-24 2020-08-14 티씨에스 주식회사 전자부품 검사장치용 소켓
KR102319388B1 (ko) * 2020-07-16 2021-11-01 주식회사 아이에스시 검사용 커넥팅 장치
KR102342480B1 (ko) * 2020-08-21 2021-12-23 (주)티에스이 테스트 소켓 및 이를 포함하는 테스트 장치
KR102703562B1 (ko) * 2022-04-05 2024-09-05 주식회사 오킨스전자 반도체 소자 테스트용 인서트

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090011498A (ko) * 2007-07-26 2009-02-02 정영석 테스트용 소켓
KR100926777B1 (ko) * 2008-06-13 2009-11-16 주식회사 아이에스시테크놀러지 돌출도전부가 도전패드에 마련된 테스트 소켓
KR20090132215A (ko) * 2008-06-20 2009-12-30 이재학 테스트 소켓, 전기적 연결장치 및 그 테스트 소켓의제조방법
KR101204941B1 (ko) * 2012-04-27 2012-11-27 주식회사 아이에스시 전극지지부를 가지는 테스트용 소켓 및 그 테스트용 소켓의 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090011498A (ko) * 2007-07-26 2009-02-02 정영석 테스트용 소켓
KR100926777B1 (ko) * 2008-06-13 2009-11-16 주식회사 아이에스시테크놀러지 돌출도전부가 도전패드에 마련된 테스트 소켓
KR20090132215A (ko) * 2008-06-20 2009-12-30 이재학 테스트 소켓, 전기적 연결장치 및 그 테스트 소켓의제조방법
KR101204941B1 (ko) * 2012-04-27 2012-11-27 주식회사 아이에스시 전극지지부를 가지는 테스트용 소켓 및 그 테스트용 소켓의 제조방법

Also Published As

Publication number Publication date
TW201512677A (zh) 2015-04-01
KR20140147207A (ko) 2014-12-30
TWI533002B (zh) 2016-05-11
WO2014204161A2 (fr) 2014-12-24
KR101490498B1 (ko) 2015-02-05

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