SG11201503409PA - Electrical contact member and inspection connection device - Google Patents

Electrical contact member and inspection connection device

Info

Publication number
SG11201503409PA
SG11201503409PA SG11201503409PA SG11201503409PA SG11201503409PA SG 11201503409P A SG11201503409P A SG 11201503409PA SG 11201503409P A SG11201503409P A SG 11201503409PA SG 11201503409P A SG11201503409P A SG 11201503409PA SG 11201503409P A SG11201503409P A SG 11201503409PA
Authority
SG
Singapore
Prior art keywords
electrical contact
contact member
connection device
inspection connection
inspection
Prior art date
Application number
SG11201503409PA
Inventor
Takayuki Hirano
Nobuyuki Kawakami
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of SG11201503409PA publication Critical patent/SG11201503409PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/06—Contacts characterised by the shape or structure of the contact-making surface, e.g. grooved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/027—Composite material containing carbon particles or fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2300/00—Orthogonal indexing scheme relating to electric switches, relays, selectors or emergency protective devices covered by H01H
    • H01H2300/036—Application nanoparticles, e.g. nanotubes, integrated in switch components, e.g. contacts, the switch itself being clearly of a different scale, e.g. greater than nanoscale

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Composite Materials (AREA)
  • Geometry (AREA)
SG11201503409PA 2012-12-14 2013-12-12 Electrical contact member and inspection connection device SG11201503409PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012274117 2012-12-14
PCT/JP2013/083400 WO2014092171A1 (en) 2012-12-14 2013-12-12 Electrical contact member and inspection connection device

Publications (1)

Publication Number Publication Date
SG11201503409PA true SG11201503409PA (en) 2015-06-29

Family

ID=50934453

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201503409PA SG11201503409PA (en) 2012-12-14 2013-12-12 Electrical contact member and inspection connection device

Country Status (8)

Country Link
US (1) US20150301081A1 (en)
JP (1) JP2014134536A (en)
KR (1) KR20150084950A (en)
CN (1) CN104871010A (en)
PH (1) PH12015501023A1 (en)
SG (1) SG11201503409PA (en)
TW (1) TWI513982B (en)
WO (1) WO2014092171A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6485465B2 (en) * 2017-01-18 2019-03-20 アンデン株式会社 Contact device and electromagnetic relay
IT201700019437A1 (en) * 2017-02-21 2018-08-21 St Microelectronics Srl TEST CARD FOR A MAGNETICALLY ACTUABLE DEVICE, AND TEST SYSTEM INCLUDING THE TEST CARD
KR102517135B1 (en) 2020-12-16 2023-03-31 전지훈 Electric contact member supply device
CN115128315A (en) * 2021-03-25 2022-09-30 旺矽科技股份有限公司 Circuit embedded probe device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4045084B2 (en) * 2001-08-17 2008-02-13 株式会社神戸製鋼所 Electrical connection inspection device
JP2003214444A (en) * 2002-01-22 2003-07-30 Nsk Ltd Rolling sliding member and rolling device
JP5568268B2 (en) * 2009-09-15 2014-08-06 株式会社神戸製鋼所 Contact probe pin for semiconductor inspection equipment
JP5049358B2 (en) * 2010-01-25 2012-10-17 株式会社神戸製鋼所 Method for producing a tungsten-containing diamond-like carbon film on a base material of a contact probe pin for a semiconductor inspection apparatus
JP5036892B2 (en) * 2010-05-10 2012-09-26 株式会社神戸製鋼所 Contact probe
JP2012112681A (en) * 2010-11-19 2012-06-14 Kobe Steel Ltd Contact probe pin and inspection method
JP5798315B2 (en) * 2010-11-19 2015-10-21 株式会社神戸製鋼所 Contact probe pin
WO2012173243A1 (en) * 2011-06-15 2012-12-20 株式会社神戸製鋼所 Electrical contact member

Also Published As

Publication number Publication date
JP2014134536A (en) 2014-07-24
KR20150084950A (en) 2015-07-22
TW201443442A (en) 2014-11-16
TWI513982B (en) 2015-12-21
PH12015501023A1 (en) 2015-07-27
WO2014092171A1 (en) 2014-06-19
CN104871010A (en) 2015-08-26
US20150301081A1 (en) 2015-10-22

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