WO2014188800A1 - 金属セパレータの成形装置および成形方法 - Google Patents
金属セパレータの成形装置および成形方法 Download PDFInfo
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- WO2014188800A1 WO2014188800A1 PCT/JP2014/059898 JP2014059898W WO2014188800A1 WO 2014188800 A1 WO2014188800 A1 WO 2014188800A1 JP 2014059898 W JP2014059898 W JP 2014059898W WO 2014188800 A1 WO2014188800 A1 WO 2014188800A1
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- flow path
- mold
- thin plate
- heating
- substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/02—Stamping using rigid devices or tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D13/00—Corrugating sheet metal, rods or profiles; Bending sheet metal, rods or profiles into wave form
- B21D13/02—Corrugating sheet metal, rods or profiles; Bending sheet metal, rods or profiles into wave form by pressing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/16—Heating or cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0204—Non-porous and characterised by the material
- H01M8/0206—Metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0247—Collectors; Separators, e.g. bipolar separators; Interconnectors characterised by the form
- H01M8/0254—Collectors; Separators, e.g. bipolar separators; Interconnectors characterised by the form corrugated or undulated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0258—Collectors; Separators, e.g. bipolar separators; Interconnectors characterised by the configuration of channels, e.g. by the flow field of the reactant or coolant
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Definitions
- the present invention relates to a metal separator molding apparatus and molding method.
- a metal separator for a fuel cell is formed by press molding using a press machine and a mold (see, for example, Patent Document 1). By superposing two metal separators, each flow path through which fuel gas, oxidizing gas, and cooling water (refrigerant) flow is formed.
- a metal separator for a fuel cell has a relatively thin plate thickness and is formed by press-molding a long base material, so that distortion such as wrinkles is likely to occur.
- a metal separator that remains strained cannot obtain sufficient positional accuracy and is difficult to be positioned when it is stacked on a membrane electrode assembly.
- strain remains in the thickness direction of the base material of the metal separator, the cell module is deformed after stacking the metal separator and the membrane electrode assembly to assemble the cell module. For this reason, in the formation of the metal separator, how to remove the strain is an important issue.
- the present invention has been made in order to solve the problems associated with the above-described prior art, and provides a molding apparatus and a molding method for a metal separator that can eliminate distortion generated during press molding and can be molded without remaining distortion. For the purpose.
- the metal separator molding apparatus that achieves the above-mentioned object is to press-mold a thin plate-like base material with a first die and a second die that are relatively close to and away from each other, and a heating part And a processing unit and a control unit.
- the heating unit heats the thin plate-like substrate.
- the processing unit forms a flow path for circulating the medium by pressing the thin plate-like substrate heated by the heating unit with the first mold and the second mold.
- the control unit controls the operation of the heating unit and the processing unit.
- the metal separator molding method according to the present invention that achieves the above object is a method in which a thin plate-like substrate is press-molded by a first mold and a second mold that are relatively close to and away from each other, and a heating step. And processing steps.
- the heating step the thin plate-like substrate is heated.
- a flow path through which the medium flows is formed by pressing the heated thin plate-like substrate with the first mold and the second mold.
- the metal separator 91 forming apparatus 100 according to the present embodiment will be described with reference to FIGS.
- FIG. 1 is a schematic diagram showing a molding apparatus 100 for the metal separator 91.
- FIG. 2 is a schematic view showing a thin plate-like substrate 90 that has been subjected to various forming processes using the forming apparatus 100.
- FIG. 3 is a perspective view showing a metal separator 91 formed by the forming apparatus 100.
- FIG. 4 is an end view showing the configuration of the preliminary processing unit 20 of the molding apparatus 100.
- FIG. 5 is an end view illustrating the configuration of the flow path processing unit 30, the second heating unit 40, and the heat insulating unit 50 of the molding apparatus 100.
- the forming apparatus 100 forms openings, irregularities, and the like in a region that becomes the metal separator 91 shown in FIG. 3 in the long thin plate-like substrate 90.
- the openings correspond to, for example, locate holes 90a and manifold holes 90d to 90i described later.
- the unevenness corresponds to the unevenness of the preform 90b described later and the flow path 90c.
- the molding apparatus 100 includes an upper mold 110, a lower mold 120, a carry-in feeder 130, a carry-out conveyor 140, a carry-out feeder 150, and a control unit 180.
- the upper mold 110 and the lower mold 120 have a plurality of types of press molds for forming openings and irregularities on the thin plate-like substrate 90.
- the plurality of types of press dies are arranged along the conveyance direction of the thin plate-like substrate 90.
- the positioning holes 90 a for positioning, the uneven preform 90 b, the flow path 90 c for circulating the medium, and the medium are supplied to the thin plate substrate 90 by a plurality of types of press dies.
- the manifold holes 90d to 90i to be discharged are formed. Thereafter, the outer edge portion of the metal separator 91 is punched to open a punching hole 90j. As shown in FIG.
- the manifold holes 90d to 90i are an anode gas supply port 90d, a cooling fluid supply port 90e, a cathode gas supply port 90f, a cathode gas discharge port 90g, a cooling fluid discharge port 90h, and an anode gas discharge port 90i.
- the anode gas is a fuel gas (hydrogen)
- the cathode gas is an oxidizing gas (air).
- the carry-in feeder 130 carries the thin plate-like substrate 90 before processing between the upper mold 110 and the lower mold 120.
- the carry-in feeder 130 is provided on the upstream side of the upper mold 110 and the lower mold 120.
- the carry-out conveyor 140 carries out the metal separator 91 punched out from the thin plate-like substrate 90.
- the carry-out feeder 150 carries out the thin plate-like base material 90 to be discarded after punching out the metal separator 91 from between the upper mold 110 and the lower mold 120.
- the carry-out feeder 150 is provided on the downstream side of the upper mold 110 and the lower mold 120.
- the control unit 180 controls the carry-in speed and timing of the thin plate-like substrate 90 by the carry-in feeder 130 and the carry-out speed and timing of the thin plate-like substrate 90 by the carry-out feeder 150, respectively.
- the control unit 180 controls the movable upper mold 110 so as to be separated from the lower mold 120 after urging the movable upper mold 110 against the fixed lower mold 120.
- the forming apparatus 100 heats and processes the thin plate-like substrate 90 to form a flow path 90 c on the thin plate-like substrate 90.
- the molding apparatus 100 includes a flow path machining upper mold 31 (corresponding to a first mold) and a flow path machining lower mold 32 (corresponding to a second mold), which are relatively detachably movable.
- the thin plate-like substrate 90 is press-molded.
- the molding apparatus 100 includes a first heating unit 10 (corresponding to a heating unit) and a flow path processing unit 30 (corresponding to a processing unit). The first heating unit 10 heats the thin plate-like substrate 90.
- the flow path processing unit 30 forms a flow path 90c through which the medium is circulated by pressing the heated thin plate-like substrate 90 with the upper mold 31 for flow path processing and the lower mold 32 for flow path processing.
- the control unit 180 controls the operation of the first heating unit 10 and the flow path processing unit 30.
- the first heating unit 10 is provided to sufficiently heat the thin plate-like substrate 90 before the flow passage processing unit 30 press-forms the thin plate-like substrate 90 to form the flow passage 90c.
- the first heating unit 10 includes a first heating member 11 for heating the thin plate-like substrate 90.
- the 1st heating member 11 is comprised from what can heat the thin-plate-shaped base material 90 instantaneously and uniformly like a high frequency coil, a far-infrared heater, a steam heater, a hot air fan etc., for example.
- the first heating member 11 is provided between the upper mold 110 and the thin plate substrate 90 and between the lower mold 120 and the thin plate substrate in order to heat the upper and lower surfaces of the thin plate substrate 90. 90 between the two.
- the first heating unit 10 starts heating while the conveyance of the thin plate-like substrate 90 by the molding apparatus 100 is started under the control of the control unit 180.
- the 1st heating part 10 heats the field (the 1st field a1) which forms channel 90c among thin plate-like base materials 90 conveyed by forming device 100.
- the forming apparatus 100 is configured to press the thin plate-like substrate 90 that has been softened by heating by press-forming the thin plate-like substrate 90 by the flow path processing unit 30 to form the flow path 90c. It further has a pre-processed portion 20 for forming the preform 90b by preforming the region a1. Pre-forming by the pre-processing unit 20 is performed after the heat treatment by the first heating unit 10.
- the pre-processed part 20 performs the pre-formation which gives a preliminary shape to the thin plate-like substrate 90 to form the preform 90 b before forming the flow channel 90 c on the thin plate-like substrate 90, and then forms the flow path. It is provided to mold 90c.
- the preliminary processing unit 20 includes a preliminary processing upper mold 21 that interlocks with the operation of the upper mold 110, and a preliminary processing lower mold 22 that is fixed in the same manner as the lower mold 120. Yes.
- the preliminary processing unit 20 presses the thin plate-like base material 90 softened by the heating of the first heating unit 10 by the preliminary processing upper mold 21 and the preliminary processing lower mold 22 to form a preliminary molded body 90b.
- the preliminary shape of the thin plate-like substrate 90 is, for example, a concavo-convex shape in which the flow path processing unit 30 can easily process the flow path 90c.
- the pre-formed body 90b is pressed by the flow path processing unit 30 to form the flow path 90c.
- the thin plate-like substrate 90 is bent stepwise, so that the flow path 90c from which distortions such as wrinkles are removed can be formed.
- the flow path processing section 30 is provided to press the softened preform 90b formed by the preliminary processing section 20 to mold the flow path 90c.
- the flow path machining unit 30 has a flow path machining upper mold 31 that interlocks with the operation of the upper mold 110 and a flow path machining lower mold 32 that is fixed in the same manner as the lower mold 120. is doing.
- the preform 90b softened by the flow path machining upper mold 31 and the flow path machining lower mold 32 is pressed to start forming the flow path 90c, the formed flow path 90c has wrinkles or the like. Almost no distortion occurs.
- the preformed body 90b in a state where the flow path processing portion 30 is softened is pressed, distortion such as wrinkles forms a flow path 90c formed by pressing the flow path processing portion 30.
- the first region a1 is pushed in the outer peripheral direction and hardly remains in the center of the first region a1.
- the thin plate-like substrate 90 is heated by the first heating unit 10, and the thin plate-like substrate 90 heated in the flow path processing unit 30 is converted into the flow path processing upper mold 31 and the flow path processing.
- the lower mold 32 is pressed. In this way, since the thin plate-like substrate 90 is heated and softened, it is pressed by the flow path machining upper mold 31 and the flow path machining lower mold 32, so that distortions such as wrinkles generated during press molding are removed in the surface direction.
- the metal separator 91 can be formed without any distortion remaining.
- the molding apparatus 100 can form the metal separator 91 without remaining distortion such as wrinkles generated during press molding by having the above-described configuration, but further includes the following configuration in order to more reliably remove the distortion. Yes. Below, the further structure which the shaping
- the region of the thin plate-like substrate 90 in which the flow path 90c is formed (first A second heating unit 40 (corresponding to another heating unit) for heating a part of the outer periphery of the region a1) is further included.
- the second heating unit 40 presses the thin plate-like substrate 90 softened by the flow path processing unit 30 to form the flow channel 90c, the flow channel 90c is formed in the thin plate-shaped substrate 90. It is provided to remove distortion such as wrinkles pushed in the outer peripheral direction of the first region a1.
- the second heating unit 40 includes a plurality of second heating units 31 for heating the upper channel 31 for flow path processing on the upper surface 31b side opposite to the pressing surface 31a for pressing the thin plate-like substrate 90 of the upper mold 31 for flow path processing. Two heating members 41 are provided.
- the second heating unit 40 includes a plurality of second heating units 40 for heating the flow path processing lower mold 32 on the lower surface 32b side opposite to the pressing surface 32a that presses the thin plate-like substrate 90 of the flow path processing lower mold 32.
- the second heating member 41 is provided.
- the plurality of second heating members 41 are provided on a part of the outer periphery of each of the upper surface 31 b of the flow path machining upper mold 31 and the lower surface 32 b of the flow path machining lower mold 32.
- the second heating member 41 is directly attached to the flow path machining upper mold 31 and the flow path machining lower mold 32.
- the second heating member 41 is composed of a member capable of heating a part of the outer periphery of the thin plate-like substrate 90 instantaneously and uniformly, such as a high-frequency coil, a far-infrared heater, a steam heater, a hot air blower, or the like. Yes.
- the second heating member 41 is controlled by the control unit. Heating is started by controlling 180.
- the second heating member 41 heats a part of the outer periphery (second region a2) of the first region a1 of the thin plate-like substrate 90 that is pressed by the flow path processing unit 30 to form the flow channel 90c.
- the distortion such as wrinkles pushed out in the outer peripheral direction of the first region a1 of the thin plate-like substrate 90 by the pressing causes the second region a2 by the second heating unit 40 heating the second region a2 of the thin plate-like substrate 90.
- the second region a2 that is a part of the outer periphery of the first region a1 of the thin plate substrate 90 is formed in the second region a2 while the flow path processing unit 30 presses the thin plate substrate 90 to form the flow channel 90c.
- distortion such as a wrinkle which arises in the flow path 90c, can be removed more reliably.
- the second heating member 41 completes the formation of the flow path 90c and the flow path processing upper mold 31 is separated from the flow path processing lower mold 32. To stop.
- the second heating unit 40 heats the four corners of the region having a rectangular shape.
- the 2nd heating part 40 is provided in order to remove distortion, such as a wrinkle pushed especially in the four corner directions, among the perimeters of the 1st field a1 which forms channel 90c of thin plate-like substrate 90. ing.
- the second heating member 41 is provided at each of the four corners of the upper surface 31 b of the flow path machining upper mold 31 and the lower surface 32 b of the flow path machining lower mold 32.
- Distortions such as wrinkles that are pushed out in the four corner directions of the flow path 90c by the pressure of the flow path processing section 30 are generated by heating the four corners (second area a2) of the flow path 90c with the second heating section 40. Since a2 is particularly softened, it is further pushed out toward the end of the second region a2. In this way, while the flow path processing unit 30 presses the thin plate-like base material 90 to form the flow path 90c, the second region a2 that is the four corners of the first region a1 of the thin plate-like base material 90 is the second heating unit. By heating at 40, distortion such as wrinkles generated in the flow path 90c can be more reliably removed.
- the forming apparatus 100 insulates the second region (corresponding to a partial region on the outer periphery) a2 and the other regions in the first region a1 where the flow path 90c of the thin plate-like substrate 90 is formed. It further has a heat insulating part 50 provided in the separated flow path processing part 30.
- the heat insulating part 50 is provided for the second heating part 40 to heat only a part of the outer periphery of the first region a1 where the flow path 90c is formed. As shown in FIG. 5, the heat insulating portion 50 is provided in each of the upper flow path processing die 31 and the lower flow path processing die 32. When the upper die 31 for channel processing and the lower die 32 for channel processing form the channel 90c in the thin plate-like substrate 90, the heat insulating part 50 includes the first region a1 of the thin plate-like substrate 90, The second region a2 is separated from the other regions to prevent heat from being conducted between the two regions.
- the heat insulating part 50 has heat insulating members 51 at a part or four corners of the outer periphery of the upper die 31 for flow path processing or the lower die 32 for flow path processing.
- the heat insulating member 51 is formed of a member having heat insulation and high hardness, for example, formed of ceramics (including glass). As shown in FIG. 5 and the like, the heat insulating member 51 has a shape surrounding the second heating member 41. For example, when the second heating member 41 is a coil-shaped heating member, the heat insulating member 51 has a cylindrical shape. ing. As shown in FIG. 4, the heat insulating member 51 is attached to a groove 31 c processed into the flow path processing upper mold 31 and a groove 32 c processed into the flow path processing lower mold 32.
- the first heating unit 10 heats the first region a ⁇ b> 1 in the range where the flow path 90 c is formed in the thin plate-like substrate 90 (first heating). Thereafter, in the preliminary processing section 20 and the flow path processing section 30, the softened thin plate-like substrate 90 is press-molded to form the flow path 90c.
- the second heating unit 40 causes the second region a2 that is a part of the outer periphery or the four corners of the first region a1. Is heated (second heating).
- each second heating member 41 of the second heating part 40 can heat only the second region a ⁇ b> 2 of the thin plate-like base material 90. Therefore, by providing the heat insulating portion 50, heat conduction between the second region a2 and the other regions in the first region a1 of the thin plate-like substrate 90 can be blocked. Thereby, the two-step heating which attached the time difference with respect to the thin-plate shaped base material 90 by the 1st heating part 10 and the 2nd heating part 40 can be performed.
- the control unit 180 heats a part of the outer periphery of the channel 90c by the second heating unit 40 when the channel 90c is formed by the channel processing upper die 31 and the channel processing lower die 32.
- the control unit 180 controls the heating operation of the first heating unit 10 and the second heating unit 40.
- the control unit 180 includes a ROM, a CPU, and a RAM.
- ROM Read Only Memory
- the flow path machining upper mold 31 and the flow path machining lower mold 32 have different mold temperatures when the flow path 90c is formed.
- the control unit 180 includes a second heating member 41 attached to the flow path machining upper mold 31 side in order to control the temperatures of both the flow path machining upper mold 31 and the flow path machining lower mold 32.
- the heating temperature with the second heating member 41 attached to the flow path machining lower mold 32 side is controlled.
- the control unit 180 controls the temperatures of both molds so that the temperature of the mold of the flow path machining lower mold 32 is lower than the temperature of the mold of the flow path machining upper mold 31.
- the thin plate-like substrate 90 in which the flow path 90c is formed is Adsorb to the lower mold 32 side.
- the thin plate-like substrate 90 in which the flow path 90c is formed is adsorbed to the lower mold 32 for flow path processing, distortion such as wrinkles is generated in the next processed portion where the manifold holes 90d to 90i are formed as shown in FIG. Can be easily transported.
- FIG. 6 is a flowchart showing a method for forming the metal separator 91.
- the metal separator 91 is formed by a flow path processing upper die 31 (corresponding to the first die, see FIG. 5) provided with a thin plate-like substrate 90 (see FIG. 2) so as to be relatively close to and away from it.
- This is a method of forming a metal separator 91 that is press-formed by a flow path machining lower die 32 (corresponding to a second die, see FIG. 5).
- the molding method has a heating step and a processing step. In the heating step, the thin plate-like substrate 90 is heated. In the processing step, the heated thin plate-like base material 90 is pressed by the flow path processing upper mold 31 and the flow path processing lower mold 32 to form a flow path 90c (see FIG. 2) through which the medium flows.
- the molding apparatus 100 described above is a molding apparatus that embodies a molding method of the metal separator 91.
- FIG. 7 is a flowchart showing the operation of the molding apparatus 100.
- FIG. 8 is an end view showing a state in which the thin plate-like substrate 90 in which the preforming body 90b has been formed is carried out from the pre-processing section 20 of the forming apparatus 100.
- FIG. 9 is an end view showing a state in which the thin plate-like base material 90 is carried into the flow path processing unit 30 of the forming apparatus 100.
- FIG. 10 is an end view showing a state in which the flow path 90c is formed in the thin plate-like substrate 90 by the flow path processing section 30, the second heating section 40, and the heat insulating section 50 of the molding apparatus 100.
- FIG. 11 is an end view showing a state in which the thin plate-like substrate 90 in which the formation of the flow path 90c is completed from the flow path processing unit 30 of the forming apparatus 100 is carried out.
- the first heating member 11 of the first heating unit 10 starts heating under the control of the control unit 180, as shown in FIGS.
- the 1st heating part 10 heats the field (the 1st field a1) which forms channel 90c among thin plate-like base materials 90 conveyed by forming device 100 (Step S1). Due to the heating by the first heating unit 10, the first region a1 of the thin plate-like substrate 90 is sufficiently softened.
- the forming apparatus 100 conveys the thin plate-like substrate 90 by a predetermined pitch, the portion softened by the heating by the first heating unit 10 reaches the preliminary processing unit 20.
- the preliminary processing unit 20 presses the thin plate-like substrate 90 with the preliminary processing upper mold 21 and the preliminary processing lower mold 22 to form a preformed body 90b (step S2).
- the forming apparatus 100 conveys the thin plate-like substrate 90 by a predetermined pitch, the part of the preform 90b formed by the preforming by the pre-processing unit 20 reaches the flow path processing unit 30.
- the flow path processing unit 30 carries a thin plate-like base material between both molds in a state where the upper mold 31 for flow path processing is separated from the lower mold 32 for flow path processing ( Step S3).
- the flow path processing unit 30 places the thin plate-shaped substrate 90 on the flow path processing lower mold 32 so that the uneven shape of the preform 90b that is loaded corresponds to the uneven shape of the lower mold 32 for flow path processing. .
- the flow path processing unit 30 directs the flow path processing upper mold 31 toward the thin plate-like substrate 90 forming the flow path processing lower mold 32 and the preform 90b. And descend.
- the flow path machining upper die 31 pushes the preform 90b formed on the thin plate-like substrate 90 downward in the figure.
- the pressing surface 31a of the upper channel processing die 31 and the lower pressing surface 32a of the lower channel processing die 32 become the thin plate-like substrate 90 as shown in FIG.
- the pressing of the preformed body 90b being formed is started. Since the preform 90b formed on the thin plate-like base material 90 is softened, when the preform 90b is pressed to form the channel 90c, distortion such as wrinkles forms the channel 90c.
- the first region a1 is gradually pushed out, particularly at the four corners in the outer peripheral direction.
- the second heating unit 40 supplies electric power to each second heating member 41 under the control of the control unit 180.
- Each second heating member 41 starts heating by supplying electric power, and starts heating of the four corners of the upper die 31 for flow path processing and the lower die 32 for flow path processing.
- the control unit 180 controls the temperatures of both molds so that the temperature of the lower mold 32 for flow path processing is lower than the temperature of the upper mold 31 for flow path processing.
- the flow path machining upper mold 31 is moved away from the flow path machining lower mold 32 under the control of the control unit 180.
- the flow path machining upper mold 31 is separated from the flow path machining lower mold 32, thereby completing the molding of the flow path 90c from which distortions such as wrinkles are removed (step S5).
- the second heating member 41 is controlled by the control unit 180, the supply of electric power is cut off at the same time as the upper channel processing die 31 is separated from the lower channel processing die 32, and heating is stopped.
- the forming apparatus 100 conveys the thin plate-like base material 90 by a predetermined pitch, the thin plate-like base material 90 in which the formation of the flow path 90c is completed is conveyed to a press die that is removed.
- the metal separator 91 is punched from the thin plate-like substrate 90.
- the carry-out conveyor 140 carries out the punched-out metal separator 91, and the carry-out feeder 150 carries out the thin plate-like substrate 90 to be discarded after the metal separator 91 is punched out.
- the metal separator forming apparatus 100 has the following effects.
- the metal separator 91 forming apparatus 100 includes a first heating unit 10 (heating unit), a flow path processing unit 30 (processing unit), and a control unit 180.
- the first heating unit 10 heats the thin plate-like substrate 90.
- the flow path processing unit 30 forms a flow path 90c through which the medium is circulated by pressing the heated thin plate-like substrate 90 with the upper mold 31 for flow path processing and the lower mold 32 for flow path processing.
- the control unit 180 controls the operation of the first heating unit 10 and the flow path processing unit 30.
- the thin plate-like substrate 90 is heated by the first heating unit 10, and the thin plate-like substrate 90 heated in the flow path processing unit 30 is converted into the upper mold 31 for flow path processing and the lower mold 32 for flow path processing. Press.
- the thin plate-like substrate 90 is pressed by the upper die 31 for flow path processing and the lower die 32 for flow passage processing in a softened state, so that wrinkles and other distortions that occur during press molding are removed in the surface direction.
- the metal separator can be formed without any distortion remaining. As a result of no distortion remaining in the metal separator, sufficient positional accuracy can be obtained, and positioning when layered on the membrane electrode assembly is easy. Furthermore, since no strain remains in the thickness direction of the base material of the metal separator, it is possible to prevent the cell module from being deformed after stacking the metal separator and the membrane electrode assembly to assemble the cell module.
- a second heating unit 40 (second area 40) that is provided in the flow path processing unit 30 and heats a part of the outer periphery (second area a2) of the area (first area a1) where the flow path 90c is formed in the thin plate-like substrate 90.
- the flow path 90c is formed by the flow path machining upper mold 31 (first mold) and the flow path machining lower mold 32 (second mold). Furthermore, it is preferable to heat a part of the outer periphery of the flow path 90 c by the second heating unit 40.
- the second heating unit 40 heats a part of the outer periphery (second region a2) of the first region a1 of the thin plate-like substrate 90, so that distortion such as wrinkles is caused at the end of the second region a2. Can be pushed further in the direction.
- distortion such as wrinkles generated during press molding can be more reliably removed in the surface direction.
- the second heating unit 40 (other heating unit) preferably heats the four corners (second region) of the first region a1 (region) having a rectangular shape.
- the four corners (second region a2) of the outer periphery of the first region a1 of the thin plate-like substrate 90 are heated by the second heating unit 40, so that distortion such as wrinkles is caused at the end of the second region a2. Can be pushed further in the direction.
- distortion such as wrinkles generated during press molding can be more reliably removed in the surface direction.
- first region a1 a channel processing part that insulates and separates a part of the outer periphery (second region a2) from the other region. It is preferable to further have a heat insulating part 50 provided at 30 (processed part).
- the heat conduction between the second region a2 (a part or the four corners of the outer periphery of the flow path 90c) of the thin plate-like substrate 90 and the other regions is blocked by providing the heat insulating portion 50. be able to.
- the two-step heating with the time difference by the 1st heating part 10 which heats the 1st field a1 and the 2nd heating part 40 which heats the 2nd field a2 can be performed.
- the channel processing upper mold 31 (first mold) and the channel processing lower mold 32 (second mold) preferably have different mold temperatures when the channel 90c is formed.
- the temperature of both molds is controlled by the control of the control unit 180 so that the temperature of the mold of the flow path machining lower mold 32 is lower than the temperature of the mold of the flow path machining upper mold 31. be able to.
- the thin plate-like substrate 90 in which the flow path 90c is formed flows due to contraction deformation. Adsorbed to the lower die 32 side for road processing. In this way, the thin plate-like substrate 90 in which the flow path 90c is formed is adsorbed to the flow path processing lower mold 32 side, so that the next processing portion for forming the manifold holes 90d to 90i as shown in FIG. It can be easily transported without causing distortion such as wrinkles.
- the flow path machining upper mold 31 first mold
- the flow path machining lower mold 32 second mold in which the thin plate-like base material 90 is relatively moved toward and away from each other.
- the heating step the thin plate-like substrate 90 is heated.
- the processing step the heated thin plate-like substrate 90 is pressed by the flow path processing upper mold 31 and the flow path processing lower mold 32 to form a flow path 90c through which the medium flows.
- the heated thin plate-like substrate 90 is pressed by the flow path machining upper mold 31 (first mold) and the flow path machining lower mold 32 (second mold).
- the thin plate-like substrate 90 is pressed by the upper die 31 for flow path processing and the lower die 32 for flow passage processing in a softened state, so that wrinkles and other distortions that occur during press molding are removed in the surface direction.
- the metal separator can be formed without any distortion remaining. As a result of no distortion remaining in the metal separator, sufficient positional accuracy can be obtained, and positioning when layered on the membrane electrode assembly is easy. Furthermore, since no strain remains in the thickness direction of the base material of the metal separator, it is possible to prevent the cell module from being deformed after stacking the metal separator and the membrane electrode assembly to assemble the cell module.
- the processing step it is preferable to heat a part (second region a2) of the outer periphery of the region (first region a1) where the flow path 90c is formed in the thin plate-like substrate 90.
- a part of the outer periphery (second region a2) of the first region a1 of the thin plate-like substrate 90 is heated, so that distortion such as wrinkles is caused in the direction toward the end of the second region a2. It can be extruded further.
- distortions such as wrinkles that occur during press molding can be more reliably removed in the surface direction.
- the processing step it is preferable to heat the four corners (second regions) of the first region a1 (region) having a rectangular shape.
- the four corners (second region a2) of the outer periphery of the first region a1 of the thin plate-like substrate 90 are heated, so that distortion such as wrinkles is caused in the end direction of the second region a2. It can be extruded further.
- distortion such as wrinkles generated during press molding can be more reliably removed in the surface direction.
- the channel processing upper mold 31 and the channel processing lower mold 32 preferably have different mold temperatures when the channel 90c is formed.
- the temperature of the lower mold 32 for flow path processing can be made lower than the temperature of the upper mold 31 for flow path processing.
- the thin plate-like substrate 90 on which the flow path 90c is formed is Adsorb to the lower mold 32 side.
- the thin plate-like substrate 90 in which the flow path 90c is formed is adsorbed to the flow path processing lower mold 32 side, so that the next processing portion for forming the manifold holes 90d to 90i as shown in FIG. It can be easily transported without causing distortion such as wrinkles.
- the upper mold 110 (including the preliminary machining upper mold 21 and the flow path machining upper mold 31) is the moving mold, and the lower mold 120 (preliminary machining lower mold 22 and the flow path machining lower mold 32).
- the present invention is not limited to such a configuration.
- the upper mold 110 and the lower mold 120 can be movable, and both molds can be moved toward and away from each other.
- the temperature of the lower mold 32 for the flow path processing is lower than the temperature of the upper mold 31 for the flow path processing. Compared with the temperature of the upper mold 31 for processing, the temperature of the lower mold 32 for flow path processing can be increased. In this case, the thin plate-like substrate 90 in which the flow path 90c is formed can be adsorbed to the flow path processing upper mold 31 side.
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- Engineering & Computer Science (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
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- Sustainable Energy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Fuel Cell (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Extrusion Of Metal (AREA)
Abstract
Description
11 第1加熱部材、
20 予備加工部、
21 予備加工用上型、
22 予備加工用下型、
30 流路加工部(加工部)、
31 流路加工用上型(第1型)、
31a 押圧面、
31b 上面、
31c 溝、
32 流路加工用下型(第2型)、
32a 押圧面、
32b 上面、
32c 溝、
40 第2加熱部(他の加熱部)、
41 第2加熱部材、
50 断熱部、
51 断熱部材、
90 薄板状基材、
90a ロケート孔、
90b 予備成形体、
90c 流路、
90d アノードガス供給口、
90e 冷却流体供給口、
90f カソードガス供給口、
90g カソードガス排出口、
90h 冷却流体排出口、
90i アノードガス排出口、
90j 打ち抜き孔、
91 金属セパレータ、
100 成形装置、
110 上型、
120 下型、
130 搬入フィーダー、
140 搬出コンベア、
150 搬出フィーダー、
180 制御部、
a1 第1領域(薄板状基材のうち流路を形成する領域)、
a2 第2領域(薄板状基材のうち流路が形成された領域の外周の一部)。
Claims (9)
- 薄板状基材を相対的に接近離反移動自在に設けられた第1型と第2型とによってプレス成形する金属セパレータの成形装置であって、
前記薄板状基材を加熱する加熱部と、
前記加熱部によって加熱された前記薄板状基材を前記第1型および前記第2型によって押圧して媒体を流通させる流路を形成する加工部と、
前記加熱部と前記加工部との作動を制御する制御部と、を有する金属セパレータの成形装置。 - 前記加工部に設けられ、前記薄板状基材のうち前記流路が形成された領域の外周の一部を加熱する他の加熱部をさらに有し、
前記制御部は、前記第1型および前記第2型によって前記流路を形成しているときに、前記他の加熱部によって前記流路の外周の一部を加熱する、請求項1に記載の金属セパレータの成形装置。 - 前記他の加熱部は、矩形形状を有する前記領域の四隅を加熱する、請求項2に記載の金属セパレータの成形装置。
- 前記薄板状基材の前記流路が形成された領域のうち、前記外周の一部の領域と、その他の領域とを断熱して隔てる前記加工部に設けられた断熱部を、さらに有する請求項2または請求項3に記載の金属セパレータの成形装置。
- 前記第1型と前記第2型とは、前記流路形成時において、それぞれの型の温度が異なる、請求項1~4のいずれか1項に記載の金属セパレータの成形装置。
- 薄板状基材を相対的に接近離反移動自在に設けられた第1型と第2型とによってプレス成形する金属セパレータの成形方法であって、
前記薄板状基材を加熱する加熱工程と、
加熱された前記薄板状基材を前記第1型および前記第2型によって押圧して媒体を流通させる流路を形成する加工工程と、を有する金属セパレータの成形方法。 - 前記加工工程では、前記薄板状基材のうち前記流路が形成された領域の外周の一部を加熱する、請求項6に記載の金属セパレータの成形方法。
- 前記加工工程では、矩形形状を有する前記領域の四隅を加熱する、請求項7に記載の金属セパレータの成形方法。
- 前記第1型と前記第2型とは、前記プレス成形時において、それぞれの型の温度が異なる、請求項6~8のいずれか1項に記載の金属セパレータの成形方法。
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EP14801415.2A EP3001489B1 (en) | 2013-05-22 | 2014-04-03 | Device and method for molding metal separator |
CN201480026567.4A CN105210220B (zh) | 2013-05-22 | 2014-04-03 | 金属隔板的成形装置和成形方法 |
US14/787,492 US9884357B2 (en) | 2013-05-22 | 2014-04-03 | Metal separator molding device and method for molding metal separator |
CA2913111A CA2913111C (en) | 2013-05-22 | 2014-04-03 | Device and method for molding metal separator |
JP2015518147A JP6213561B2 (ja) | 2013-05-22 | 2014-04-03 | 金属セパレータの成形装置および成形方法 |
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