Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
  • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
  • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70058—Mask illumination systems
  • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
  • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
  • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
  • G03F7/70558—Dose control, i.e. achievement of a desired dose

Definitions

• the invention relates to a system for producing structures in a substrate.
• Wafers are printed.
• high-frequency means a higher spatial frequency than corresponds to the possible resolution of an intensity variation device present in the illumination system.At a certain number of locations, the structures are printed with the desired widths, but deviations of the printed feature widths from those occur between these locations desired structure widths.
• the object is achieved with a system comprising:
• a projection exposure machine comprising: a projection optics for mapping an object field into a picture field;
• a mask holder for holding a lithographic mask which can be arranged in the object field, the mask holder being displaceable along a scanning direction;
• a substrate holder for holding a substrate in the image field, the substrate holder being displaceable along the scan direction;
• an illumination system for generating and guiding illumination light to the object field, the illumination light having a scan integrated intensity distribution and a scan integrated directional distribution as a function of orthogonally arranged to the scan direction is sawn reit mono with the Be ⁇ lighting system at the object field;
• the lithography mask comprises mask structures with which edictionsbe- clearing system in the imaging means of the Project on the substrate he substrate structures are ⁇ gnebar; characterized in that the size of the mask structures are determined at defined mask design locations from the intensity distribution and from the directional distribution of the illumination light generated by the illumination system at the object field;
• the size of the mask pattern between the mask designations is given by a sum of an interpolation of the values of the sizes of the mask patterns at the mask designation locations plus a term given by the progression of the scan integrated intensity distribution except for a proportionality factor.
• the object is achieved with a system comprising:
• a projection exposure machine comprising: a projection optics for mapping an object field into a picture field;
• a mask holder for holding a can be arranged in the object field lithography mask, wherein the Mas ⁇ kenhalter along a scanning direction can be displaced;
• a substrate holder for holding a substrate in the image field, the substrate holder being displaceable along the scan direction;
• the illumination light on the Ob ⁇ jektfeld can be provided with a scan-integrated intensity distribution and a scan integrated directional distribution as a function of orthogonally arranged to the scan direction; wherein the lithography mask has mask structures onto ⁇ , which are in the imaging process by means of the exposure apparatus j substrate structures produced on the substrate;
• the size of the mask structural ⁇ structures on the lithography mask at defined locations, mask layout from the intensity distribution and the direction of distribution of the illumination light generated by the lighting system are determined on the object field; wherein the size of the mask structures onto the Lithography ⁇ phiemaske is an interpolation of the sizes of the mask patterns on the mask layout locations between the mask layout locations.
• the object is achieved with a system comprising:
• a projection exposure machine comprising:
• a projection optics for mapping an object field into a picture field - a mask holder for holding a can be arranged in the object field lithography mask, wherein the Mas ⁇ kenhalter along a scanning direction can be displaced;
• a substrate holder for holding a substrate in the image field, the substrate holder being displaceable along the scan direction;
• a lighting system for generating and guiding illumination light toward the object field; wherein the illumination system converts an intensity varying means into a variation of the scan integrated ones
• the object field illumination light having a SCANIN ⁇ tegrated intensity distribution and with a SCA nintegr elected directional distribution can be provided; in which
• the lithography mask has mask structures with which substrate structures can be produced on the substrate during imaging by means of the projection exposure apparatus;
• lithography mask is subdividable into disjoint regions in which the mask structure size variation is proportional to the scan-integrated intensity variation.
• Preferred embodiments of the system are the subject of dependent claims.
• An embodiment of the system provides that the size of the mask structure is formed in at least one location as a function of an NILS factor and as a function of an MEEF factor, the size of the mask pattern on the lithography mask between the mask designations being given as the sum of one Interpolation of the size of the mass ken Modellen at the mask design locations plus one given by the following mathematical relationship
• the illumination system has an intensity variation device for varying the scan-integrated intensity distribution of the illumination light at the object field, wherein the intensity variation device is adjustable such that a uniformity of the scan-integrated intensity distribution of the
• Illumination light can be improved on the object field.
• the intensity variation device a proven device for correcting an uneven intensity distribution of the illumination light is used, wherein the uneven intensity distribution can be corrected or evened out in the best possible way.
• Another preferred embodiment of the system is a proven device for correcting an uneven intensity distribution of the illumination light, wherein the uneven intensity distribution can be corrected or evened out in the best possible way.
• the scan-integrated intensity of the illumination light is the same size at at least three of ⁇ spaced locations of the object field. In this way, an interpolation effort for the calculation of structures on the lithography mask is kept as low as possible.
• a further embodiment of the system is characterized in that the mask structure on the Lithography ⁇ phiemaske in response to a NILS factor and in
• the lithography mask is divided into disjoint areas in which a dependence of the size of the mask structure from the place x is given by the following mathematical relationship:
• a method for producing a mask for a lithographic projection exposure system comprising the following steps:
• a method of manufacturing a mask for a lithographic proj edictionsbelichtungs ⁇ system comprising the steps of: a) adjusting an intensity variation means such that the most uniform possible illumination intensity is provided tung;
• a method for producing a mask for a lithographic projection exposure system comprises the following steps: a) Setting of an intensity variation device
• the method provides that in step b) the determination of the illumination direction distribution is carried out at all locations at which an independent intensity adaptation is possible.
• OF INVENTION ⁇ dung proper interpolations between a large number of locations, advantageously be carried out and therefore already compensated small CD error as far as possible in this manner.
• the method in step b) determines the illumination direction distribution at a number of mask design locations (PM) ranges between three and five. With this specific choice of locations, a reduction of mask design locations is performed, thereby significantly reducing computational effort.
• the method in step e) between the mask design locations performs the interpolation of the feature sizes, which is one of: linear, square, parabolic.
• the interpolation of the feature sizes which is one of: linear, square, parabolic.
• several well-known interpolation methods can be performed by, thereby INTERPO ⁇ lationser Stahlisse can be considered highly variable.
• the method provides that in step b) the determination of the illumination direction distribution is carried out at one or all locations at which an independent intensity adaptation is possible.
• the potential for improving the mask by varying the potential for improvement.
• the mask design location (P) is arranged in the middle of the mask +/- of the 2/3 reticle radius or one of the locations at the edge of the mask. In this way can advantageously be taken into ⁇ into account the range in which the mask is the need for correcting the mask is the largest.
• Fig. 1 is a schematic plan view of a
• Fig. 2 is a plan view of a detail of a
• FIG. 5a and 5b CD errors in a mask design at each location PU, where an independent intensity adjustment is possible, or only in the field center (PO), from ⁇ evaluated at all locations PU, where an independent intensity adjustment is possible
• Figures 6a and 6b CD error on a mask layout at each location PU to which an inde- pendent intensity adjustment is possible, or only to a field center (PO), from ⁇ counted in all places.
• PO field center
• FIG. 7 shows an illumination intensity profile over the mask after a correction by means of an intensity variation device
• FIGS. 9a to the present invention reduced CD error wide at a linear interpolation of feature sizes in a mask layout in the midspan and +/- 2/3 field ⁇ ;
• 11a to 11c reduced CD errors in a quadratic interpolation of feature sizes in a mask design in the middle of the field and +/- 4/5 field width;
• 14a to 14c according to the invention reduced CD errors with a correction according to equation (4) and subsequent linear interpolation with a mask design in the field center and +/- 2/3 field width;
• 15a to 15c according to the invention reduced CD errors in a correction according to equation (4) and subsequent linear interpolation at a mask design in the middle of the field and at the edge of the field;
• 16a to 16c reduced CD errors with a correction according to equation (4) and subsequent quadratic interpolation with a mask design in the middle of the field and +/- 4/5-field width;
• FIGS. 17a to 17c show reduced CD errors according to the invention when corrected according to the equation
• FIG. 18 is a detailed illustration of a
• FIG. 1 shows a conventional projection exposure apparatus 100 or a projection exposure system in a principal view.
• the projection exposure apparatus 100 comprises projection optics 10 for imaging an object field in an object plane onto an image field in an image plane.
• the projection exposure apparatus 100 comprises projection optics 10 for imaging an object field in an object plane onto an image field in an image plane.
• a movable mask holder 20 in which (referred to as "mask” or “reticle") 30, a lithography mask is held in a mask layer, wherein the mask holder 20 preferably by means of a mask displacement drive (not shown) of a direction of displacement is longitudinally displaceable.
• the mask layer coincides with an object plane the projection optics 10 together.
• the direction of displacement is also referred to below as the "scan direction" and is selected parallel to the y-axis
• a wafer or substrate holder 40 for holding a wafer or substrate 50 in the image field of the projection optics 10 is shown, wherein the substrate holder 40 along a displacement direction is displaceable, preferably by means of a Waferverlagerungsantriebs (not shown).
• the displacement or displacement of mask 30 and wafer 50 preferably takes place synchronously with one another.
• the displacement directions are arranged parallel to one another, and the displacement speed of the Wa ⁇ fers 50 is equal to the product of the Verlagerungsge ⁇ speed of the mask 30 and the magnification of the projection optics 10.
• This can be done the image of a mask 30 on a part of the wafer 50, so that each object point of the mask 30 is imaged on the same respective image ⁇ point of the wafer 50 during the duration of a displacement process.
• This process is referred to as "scanning" and the projection exposure equipment accordingly as a "scanner".
• An illumination system 60 having a radiation source 61 for example in the form of a laser which emits a laser beam of 193 nm wavelength, ensures is that BL LEVEL ⁇ tung light L generated and guided towards the object field.
• illumination light L meets with ei ⁇ ner, where appropriate, depending on the location, intensity distribution and directional distribution.
• the 50 light intensity impinging on a point on the wafer is proportio nal ⁇ to the intensity of illumination at the corresponding point of the object field. If diffractive structures are introduced into the object field, in particular because a mask 30 is located there, the intensity in the image field depends additionally from the directional distribution of the illumination light in the object field.
• the dose at a point on the wafer 50 is the time integral of the intensity of the light In ⁇ at this point.
• the dose at a point on the wafer 50 is the time integral of the intensity of the light In ⁇ at this point.
• the observed point of Wa is located fers 50 within the image field and the entspre ⁇ sponding point on the mask 30 within the excluded illuminated area of the object field.
• the process is therefore also referred to as "scan integration."
• the dose at a point on the wafer 50 after completion of the scan is not dependent on the total local dependence on intensity distribution and directional guidance, but only on the corresponding integral over the scan, ie, over
• the y-direction is therefore referred to as scan-integrated intensity distribution and scan-integrated directional distribution, which no longer depend on a coordinate parallel to the direction of displacement, but only on a coordinate orthogonal thereto.
• This direction orthogonal to the direction of displacement will be referred to as the x-axis
• the points lying on a common plane with an identical x-coordinate form a straight line that is parallel to the y-axis, but in the following - as the term "straight line" is unusual in this context - are referred to as a location.
• a "point” is therefore identified by two co ⁇ ordinatenkomponenten, a "spot” on the other hand only by a coordinate component.
• an intensity variation device 70 is provided. This allows adaptation of the scan-integrated intensity distribution in the object field.
• a largely location-independent scan-integrated Intensi ⁇ tiquessvertechnik can be set at the object field by means of the intensity variation means 70th
• ⁇ sondere can by means of the intensity variation means 70 are at least partially compensated for an effect of manufacturing defects, temporal drift, aging effects, etc..
• the directional distribution of the illumination light can be optionally changed at the object field.
• the change in the directional distribution can lead to a change in the scan-integrated intensity distribution, in particular even in the absence of manufacturing errors, temporal drifts, aging effects, etc. When such a change occurs, it can then be at least partially compensated by the intensity variation device 70.
• the intensity variation device 70 comprises a plurality of, for example, twenty-five fingers 71.
• Each finger 71 is displaceable independently of one another along the y-axis.
• the fingers 71 are mounted near the object plane in which the object field is arranged, or they are arranged close to a plane conjugate thereto. If the fingers 71 are displaced appropriately, it can be achieved that a certain area of the object field is no longer illuminated by illumination light L. Accordingly, the value of the scan-integrated intensity distribution is reduced at these locations.
• Each of the fingers 71 has a defined width corresponding to the value of the distance that the individual fingers 71 of the intensity varying device 70 from each other. Width and distance refer to the x Coordinate, so are measured orthogonal to the direction of displacement of the fingers 71.
• Each finger 71 has at the front edge, that is, where the finger 71 is pushed into the illumination light L, a curvature corresponding to a projection of the curvature of the object field of the projection lens 10.
• the uniformity correction devices corresponding to the intensity variation device 70 are known, for example, from the documents EP 0952491A2, US 2011 / 0096317A1, US
• the fingers 71 may have a bevelled edge region.
• the fingers 71 may be arranged overlapping.
• the fingers 71 can be arranged on one side of the object field.
• the fingers 71 may be grouped into two groups, each located on one side of the object field.
• the fingers 71 of two different groups of fingers 71 can be arranged offset from each other.
• the lithographic mask 30 has structures, by means of which, in the imaging with the projection exposure apparatus 100, structures are produced in the photosensitive layer on the substrate 50. Such generation of structures in the substrate 50 is referred to as "printing" of structures.
• the structures in the photo sensi ⁇ tive layer can be transferred in a subsequent, and not further described here, step into the substrate 50.
• An extension of the structures on the mask 30 is referred to as b M. If the structures are substantially in the form of lines, the thickness of the
• Lines represent the extent b M. If the structures are essentially in the form of ellipses, then one of the two axes can represent the extension b M. For structures of a different shape, an extent b M can be defined in an analogous or different manner.
• the structures formed on the wafer 50 and on the forward befindli ⁇ chen photosensitive layer have an extension to b s.
• b s is given by multiplying b M by the magnification of the projection optics 10.
• This approximated value and the actual extent The size of this deviation depends on the scan-integrated intensity distribution and the scan-integrated direction distribution in the object field.
• the extent b M of structures on the mask 30, their imaging on the wafer 50 will depend on structures having mutually identical dimensions lead, from the coordinate x of the position of a structure on the mask 30, ie, from the location on the mask 30.
• sizes b M of such structures on the mask differ from each other by less than lnm, in particular by less than 0.5nm.
• the struc ⁇ ren on the mask 30 is the same shape as on the wafer 50, in particular the same orientation.
• OPC Optical Proximity Correction
• the lithography mask 30 is characterized in that the size of the structures b M at defined locations PM the intensity distribution and from the directional distribution of the illumination light generated by the illumination system 60 on the object field can be determined, wherein the size of the structures b M between the locations PM is an interpolation of the sizes of the structures b M at the locations PM.
• FIG. 2 shows a basic plan view of fingers 71 of the intensity variation device 70.
• Each of the fingers 71 has a width of approximately 4 mm in the x direction.
• the area of the object field which is illuminated by illuminating light L can be shortened by closing the fingers 71.
• the scanning slot is accordingly lengthened by moving the fingers 71.
• Correction of the exposure is carried out by means of the fingers 71 formed in the form of stripes Correction of the scan-integrated intensity distribution is possible, which is, however, limited due to the system, so that by means of the intensity variation device 70, a completely exact correction of the scan-integrated intensity distribution can not be performed.
• FIG. 18 shows a detailed representation of the structure of an illumination system 60 for the EUV wavelength range.
• a plasma 611 emits illumination light L in a wavelength range, for example, between 5 nm and 30nm. After being focused by a collector 612, the illumination light L passes through an intermediate focus plane 613, which can be used to separate the EUV illumination light L from unwanted radiation or particle components.
• Information on such plasmas and collectors are known, for example, from US Pat. No. 6,859,515 B2 and EP 1 225 481 A2.
• the illumination light L After passing through the intermediate focus plane 613, the illumination light L first strikes a field facet mirror 62 consisting of field facets not shown in detail. The light which strikes a field facet is guided over a pupil facet, not shown, of a pupil facet mirror 63.
• the illumination light L is led to the object field via a transmission optics 64 exemplarily composed of three mirrors 641, 642, 643 in FIG. 18. Suchansssys ⁇ system, for example, from DE 10 2011 076 145 B4 be ⁇ known.
• the mirror 643 can be oriented ⁇ into grazing incidence.
• the mirror 643 can be oriented ⁇ leads without power. Some or all of the mirrors of Kochtra ⁇ supply optics 64 may also be omitted.
• an intensity variation device 70 In the vicinity of the object field, but from the perspective of the incident on the object field illumination light L in front of him, there is an intensity variation device 70 with fingers 71st
• the pupil facet mirror 63 is arranged near a pupil plane ⁇ , that is, the choice of the pupil facet, is passed over the illumination light L, the direction-of impingement specifies to the object field.
• the Feldfa ⁇ cetten the field facet mirror 62 are displaced so that illumination light incident on a field facet on ⁇ can be performed depending on the shift state over another Pu ⁇ pillenfacette. As a result, a directional distribution of illumination light on the object field can be changed.
• the field facet mirror is located in or near a conjugated plane to the Whether ⁇ jektfeld. Each field facet is therefore mapped, at least approximately, into the plane of the object field.
• Intensity inhomogeneities of the incident on a field facet illumination light L lead to a Intensticiansinhomogentician the guided over a certain pupil lighting ⁇ bright when it hits the object field.
• the illumination of the field facet mirror 62 and thus also of each individual field facet depend on the properties of the source plasma 611 and of the collector 612. In general, no homogeneous illumination of the field facet mirror 62 and thus also the individual field facet can be achieved. Since the pupil facet mirror is located in or near a pupil plane 63, the inhomogeneity leads to a dependence of the Häsver ⁇ distribution from the point on the object box, and thus lung also a function of the scan-integrated willingnesssvertei- from the site.
• FIG. 3 shows, in principle, a profile of a scan-integrated intensity I of the illumination light, which has a parabolic shape. The course shown is before a correction by the fingers 71 of the intensity variation device 70.
• an upwardly curved parabola results in a upwardly convex parabola for a shift state of the field facets of the Feldfacet ⁇ tenaptapts 62 a downwardly curved parabola, and for a different shift state of the field facets.
• FIG. 4 a again shows the course of FIG. 3 together with the fingers 71 of the intensity variation device 70.
• An exact correction of the intensity distribution is carried out at the punctiform points of the intensity profile I (x), but not in the regions between them.
• a serrated scan-integrated intensity profile I (x) after a correction by the fingers 71 is obtained.
• projection exposure systems which differ in the intensity distribution that generates the light source 61 on the field facet mirror 62.
• These projection exposure systems can differ, for example, in the source plasma 611 or in the collector 612.
• the structures considered in the following embodiment are 18nm wide lines with a pitch between 36nm and 126nm.
• 100 different structures are considered, namely 50 different ⁇ period lengths in horizontal and vertical orientation.
• a mask 30 is betrach ⁇ tet by which 100 different structures can be generated on the wafer 50 to, and each of these structures to be produced in a large number of different locations on the wafer 50th Accord- Accordingly, the nomenclature "location dependence of a feature size" is well defined below.
• a locally substantially constant intensity profile of the illumination of the reticle is adjusted by means of the intensity varying means so that a uniformity Corridor ⁇ yaws. This can also be done by simulation.
• a position of the fingers 71 of the intensity variation device 70 is sought in such a way that substantially the same scan-integrated intensity is obtained at all locations in the object field. Since the fingers 71 can only be moved in one direction and therefore only one degree of freedom is present, only the scan-integrated intensity at a location PU can be freely selected per finger 71. It is assumed that this location PU is always in the middle of the finger. This also corresponds to the illustration in Fig. 4a. Of all places P, therefore, a desired intensity can be ensured only at certain locations PU whose number is determined by the number of fingers 71.
• the corresponding widths are used at each location P, which is covered by the respective finger.
• a mask design is performed only in the middle of the object field (location PO), these feature widths then being used for each location on the mask 30.
• Figures 5a and 5b qualitatively show feature size variations of the structures formed on the wafer 50, ie, a deviation between the desired extent of the structures and their actual extent.
• the coordinate R runs parallel to the x-axis, ie orthogonal to the scan direction.
• the Strukturgrö ⁇ Texabweichung is also referred to as "CD error”.
• Representation provided in Figures 5a and 5b only the structure ⁇ size deviations in the places PU, ie, in Figures 5a and 5b, the curve of the structure size error Zvi ⁇ rule It can be seen in Fig. 5a that in the case where a mask design is carried out at each location PU, the desired structure widths are present at each location PU for all the structures considered on the wafer is equal to zero in all places PU.
• the mask design is based on a calculation of aerial images and is therefore numerically demanding. Therefore, mask manufacturers use rule-based mask adjustments to reduce computational effort. In these a designed by means of one or a few aerial image calculation ⁇ mask 30 is taken and adjusted simpler numerical rules. Due to the simplicity of these rules, this type of Maskenan ⁇ adjustment advantageously requires little computation time.
• FIGS. 6a and 6b additionally show qualitatively CD errors for locations P which lie between the locations PU.
• the curves show the CD error for the different structures as a function of the location. There are 100 curves drawn, each individual line corresponding to a structure. The value of the CD error at the locations PU is marked by dots, which means that each point at the corresponding location PU lies on the corresponding curve.
• CD error is even more pronounced only in the middle of the field (see FIG. 6b), since in this case special location dependencies of the illumination direction distribution are added.
• ⁇ ne lithography tools 100 which differ in the characteristics of the light source 61 are shown in Figs.. These three different situations are referred to as A, B and C.
• the different light sources lead to different intensity profiles and illumination direction distributions, with which the object field is illuminated.
• the gestri ⁇ Chelten lines indicate the minimum and the maximum of the structure size error over the ensemble of 100 ⁇ which various structures.
• the values at the locations PU are indicated by horizontal error bars.
• FIGS. 8a to 8c show CD errors when a mask design is performed only in a single location PO, namely in the middle of the field.
• courses of CD errors are shown, if at each the location PU, ie on each finger 71 of the intensity variation device 70, a mask design is performed. It is a detailed depicting ⁇ lung analogous to Figures 6b and 6a.
• the locations where a mask design is performed are hereinafter referred to as PM.
• PU always denotes the locations where a scan-integrated intensity correction is performed.
• PM P0 and PM ⁇ PU.
• PM PU.
• FIGS. 12a to 12c Clearly recognizable are the CD errors significantly reduced in FIGS. 12a to 12c compared with FIGS. 8a to 8c.
• one main reason for the large values of the CD errors at locations P between the locations PU is the variation of the illumination intensity across the width of each finger 71 of the intensity varying means 70 and to some extent also the variation the illumination direction distribution between the locations PM and out of place PM.
• An intensity variation ⁇ can be converted into a prediction for the CD variation ACD of a structure by means of the so-called normalized-intensity-logarithm-squared (NILS) according to the following mathematical relationship: € D_ __ 2 ⁇ M
• the NILS can be calculated the aerial image intensity of the striking be ⁇ structure according to the following mathematical relationship directly from the profile I (x):
• NILS and the later introduced size MEEF are standard sizes in lithography process development. They are described, for example, in the textbook “Fundamental Principles of Optical Lithography” by Chris Mack, John Wiley & Sons, ISBN 978-0-470-72730-0.
• the NILS value for each structure can be calculated thus wall without additional expenses in the mask design, with the ⁇ ses often already happens automatically.
• an intensity profile as shown for example in FIG. 7, can be converted into a prediction for the CD error caused thereby.
• This prediction can then be used to adapt the feature sizes on the mask 30 so that the CD error is compensated as completely as possible.
• the MEEF (Mask Error Enhancement Factor) indicates how much the width of a structure printed on the wafer changes as the width b of a pattern on the mask 30 changes.
• the MEEF Mask Error Enhancement Factor
• the MEEF includes the magnification factor ⁇ in the size of the MEEF. Also, the MEEF can be calculated during the mask design advantageously without additional effort.
• Equation (4) describes a rule-based adjustment Maskenan ⁇ which is feasibility bar to a correction of feature size on the mask 30 advantageously without major effort. This procedure also advantageously requires no change in the known processes of the mask manufacturer.
• FIGS. 17a to 17c show characteristics of the CD error in a mask design at each location PU with a subsequent correction at each location P according to equation (4).
• the correction method proposed according to the invention can not be better than the value of the CD errors which results at the locations PU of the fingers 71 of the intensity variation device 70. This minimum CD error results from the location-dependent change in the direction of illumination distribution.
• the minimum CD error is significantly greater. Even if the reduction of the high-frequency contribution to the CD error is similarly good, ie that the abso ⁇ lute difference of the CD error of Figures 8a to 8c and 13a to 13c is approximately the same size as the difference of the CD error of Figures 12a to 12c and 17a to 17c, the relative reduction of the total CD error is only a factor of 2. This can be explained by the fact that the CD errors in Figure 12 are already very low, the required mask design disadvantageous but a very requires large computational effort and is therefore rarely used in the Pra ⁇ tice.
• CD errors resulting from field dependency of the illumination direction distribution and not correctable by equation (4) may be undesirably large.
• a third option is proposed, which provides that the mask design is performed at a small number of locations PM, for example at three locations. If three locations PM are used, these can be, for example, in the middle of the field and +/- 2/3 of the reticle radius or +/- 4/5 of the reticule radius.
• Structure size determined on the mask 30 at locations PM may be used for interpolation in one location.
• the feature sizes on the mask 30 at all locations PM, or even just feature sizes at some of the locations PM may be used.
• the feature size may be parabolically interpolated, or between two adjacent points of the three points PM may be linearly interpolated.
• the use of only two design PMs is also conceivable, just as the use of more than three design PMs is possible.
• Figures 9a to 9c and 14a to 14c show Inventive ⁇ accordance reduced CD error with (FIGS. 14a to 14c) Bezie ⁇ hung example without (Fig. 9a to 9c) applying the correction supervisednähme according to equation (4).
• corresponding ⁇ speaking be seen in particular that at the three selected from ⁇ mask layout locations PM at midspan, as well as +/- 2/3 field width (at 0 and approximately +/- 35 mm), the CD error is equal to zero ,
• FIGS. 15a to 15c a mask design with linear interpolation and corrective action according to equation (4) is shown for the three light sources A, B and C.
• a system for making structures in a wafer by means of a Proj In summary edictionsbelich- treatment plant and proposed a lithography mask can be removed with the high-frequency contributions to a CD-errors in the We ⁇ sentlichen completely by rule-based mask adjustments are made.
• Derar- term rule-based mask adjustments are Standardprozes ⁇ se in mask manufacturers, the present invention beaten before ⁇ rules of the correction according to equation (4) or the interpolation can be carried out advantageously without large additional expenditure.
• the residual effect for the CD error is a long-range, ie low-frequency, curve with a typical period of approximately one-half the width of the filter.
• This residual effect could be removed completely if a mask interpretation would be performed at sufficiently vie ⁇ len field points. This is per ⁇ but often computationally impractical. Therefore was shown as a modification that with a mask ⁇ design in only three locations with subsequent mask design correction a significant improvement of the CD error can be achieved.

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• 2013
  • 2013-05-16 DE DE102013209093.5A patent/DE102013209093A1/de not_active Ceased
• 2014
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• 2015
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