WO2014171702A1 - 지문센서 모듈, 이를 구비한 휴대용 전자기기 및 그 제조방법 - Google Patents

지문센서 모듈, 이를 구비한 휴대용 전자기기 및 그 제조방법 Download PDF

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Publication number
WO2014171702A1
WO2014171702A1 PCT/KR2014/003243 KR2014003243W WO2014171702A1 WO 2014171702 A1 WO2014171702 A1 WO 2014171702A1 KR 2014003243 W KR2014003243 W KR 2014003243W WO 2014171702 A1 WO2014171702 A1 WO 2014171702A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint sensor
layer
bracket
sensor module
fingerprint
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Application number
PCT/KR2014/003243
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
박상일
이두환
손동남
박영문
홍승무
최재준
김재흥
심창섭
Original Assignee
주식회사 아이피시티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 아이피시티 filed Critical 주식회사 아이피시티
Priority to CN201490000817.2U priority Critical patent/CN205427870U/zh
Publication of WO2014171702A1 publication Critical patent/WO2014171702A1/ko

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H04B1/3833—Hand-held transceivers

Definitions

  • the present invention relates to a fingerprint sensor module, a portable electronic device having the same, and a manufacturing method thereof, and more particularly, to a fingerprint sensor module having a superior sensing sensitivity, a portable electronic device having the same, and a manufacturing method thereof.
  • Portable electronic devices often incorporate a touch screen integrated with a display, which is a display device, as one of input devices for receiving a specific command from a user.
  • the portable electronic device may have various function keys or soft keys as input devices other than the touch screen.
  • function keys or softkeys can act as home keys, for example, to exit a running app and return to the home screen, or to return the user interface one layer back, or frequently. Can act as a menu key to call a menu to write.
  • these function keys or softkeys may be implemented as physical buttons.
  • the function key or soft key may be implemented in a manner of sensing a capacitance of a conductor, a method of sensing an electromagnetic wave of an electromagnetic pen, or a complex method in which both methods are implemented.
  • the fingerprint sensor may be implemented integrally with a physical function key.
  • the fingerprint sensor is a sensor that detects a human finger fingerprint.
  • the fingerprint sensor protects data stored in a portable electronic device and prevents a security accident by performing a user registration or authentication procedure through the fingerprint sensor.
  • the fingerprint sensor is manufactured in the form of a module including a peripheral component or structure, in order to match the color of the fingerprint sensor with the color of the electronic device is mounted. For other reasons, it is necessary to implement color on the fingerprint sensor base material including the fingerprint sensor.
  • the operability changes depending on the thickness of the coating film on the fingerprint sensor base material.
  • the thicker the coating on the fingerprint sensor base material the worse the sensing response characteristics of the fingerprint sensor, there is a limit in the thickness of the coating film to implement the color.
  • a fingerprint sensor module designed in a chip-on-film (BOC) or ball grid array (BGA) method has been developed in order to manufacture the fingerprint sensor module at a low cost in order to mount it on a portable device.
  • the fingerprint detection IC is separated from the sensing area.
  • the fingerprint sensor module includes a fingerprint sensor and a bracket or a substrate on which the fingerprint sensor is fixed. Therefore, the fingerprint sensor and the bracket coupling process is required to increase the efficiency and productivity of the process, as well as the process of the bracket is required to increase the sensing sensitivity.
  • the thickness from the sensing area of the fingerprint sensor to the final cover in contact with the user's finger does not affect the function of the electronic device (for example, the fingerprint sensing sensitivity), while the appearance and reliability of the electronic device are problematic.
  • a fingerprint sensor module for example, the fingerprint sensing sensitivity
  • a portable electronic device including the same, and a manufacturing method thereof.
  • the technical problem to be achieved by the present invention is to provide a fingerprint sensor module, a portable electronic device having the same and a method of manufacturing the same having excellent sensing sensitivity while preventing appearance defects or damage.
  • an embodiment of the present invention is a fingerprint sensor module including a fingerprint sensor and a bracket for seating the fingerprint sensor, the fingerprint sensor, the fingerprint of the finger located on the upper side of the substrate and And a sensing unit formed on the substrate to receive a difference in the electrical signal of the bone, and a sensor circuit unit configured to sense and process a fingerprint image
  • the bracket includes a cover layer formed to cover an upper surface of the sensing unit, and the cover. It has a touch surface formed on the upper surface of the layer, the multi-coating layer is provided on the touch surface to face the upper surface of the sensing unit accommodated in the bracket, the sum of the thickness of the cover layer and the multi-coating layer is 40 ⁇ 60 ⁇ m It provides a fingerprint sensor module.
  • the multi-coating layer may include a primer layer, a color paint layer and a protective film layer.
  • the cover layer or the protective film layer may include a ferroelectric.
  • the thickness of the primer layer is 2 ⁇ 3 ⁇ m
  • the thickness of the color coating layer is 3 ⁇ 5 ⁇ m
  • the thickness of the protective film layer may be 20 ⁇ 22 ⁇ m.
  • the thickness of the cover layer may be 15 ⁇ 30 ⁇ m.
  • the fingerprint sensor may be fixed by a molding material filled in the bracket or an additional bracket coupled to the bracket.
  • an embodiment of the present invention provides a portable electronic device having the above-described fingerprint sensor module.
  • an embodiment of the present invention a) a sensing unit formed on the substrate to receive the difference between the electrical signal of the peak and the valley of the fingerprint of the finger located on the substrate and the fingerprint image Mounting a fingerprint sensor having a sensor circuit unit to sense and process the bracket, and allowing the sensing unit to be received in the bracket; And b) providing a multi-coating layer on the touch surface formed on the upper surface of the cover layer formed on the bracket to cover the upper surface of the sensing unit so as to face the upper surface of the sensing unit.
  • the sum of the thicknesses of the coating layer provides a manufacturing method of the fingerprint sensor module is formed to 40 ⁇ 60 ⁇ m.
  • the multi-coating layer in the step (b) of preparing the multi-coating layer, may be formed in the order of a primer layer, a color paint layer and a protective film layer.
  • the cover layer or the protective film layer may include a ferroelectric.
  • the primer layer is formed with a thickness of 2 ⁇ 3 ⁇ m
  • the color paint layer is formed with a thickness of 3 ⁇ 5 ⁇ m
  • the protective layer is formed with a thickness of 20 ⁇ 22 ⁇ m Can be.
  • the cover layer may have a thickness of 15 ⁇ 30 ⁇ m.
  • the method may further include polishing the touch surface before the preparing of the multi-coating layer (step b).
  • the method may further include fixing the fingerprint sensor.
  • a fingerprint sensor module it is possible to provide a fingerprint sensor module, a portable electronic device including the same, and a method of manufacturing the same, in which a fingerprint sensor is firmly modularized and sensing sensitivity is improved.
  • a fingerprint sensor module capable of stably supporting a fingerprint sensor designed in a COF or BGA method, a portable electronic device including the same, and a method of manufacturing the same.
  • the upper surface portion of the fingerprint sensor module while efficiently manufacturing the upper surface portion of the fingerprint sensor module provides a fingerprint sensor module having no problem in the appearance, function, and reliability of the electronic device, a portable electronic device comprising the same and a method of manufacturing can do.
  • the cover layer and the multi-coating layer by managing the sum of the thickness of the cover layer and the multi-coating layer to 40 ⁇ 60 ⁇ m, it can be effective effective sensing when fingerprint detection.
  • FIG. 1 is a perspective view showing a fingerprint sensor module according to an embodiment of the present invention.
  • FIG. 2 is an exemplary cross-sectional view taken along the line A-A of FIG.
  • FIG 3 is an exemplary view showing a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.
  • Figure 4 is a cross-sectional view showing a manufacturing process of the fingerprint sensor module according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing a process of preparing a ceramic paint by the sol-gel method in the fingerprint sensor module according to an embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a fingerprint sensor module according to an embodiment of the present invention.
  • FIG. 7 is an exemplary view showing a fingerprint sensor according to an embodiment of the present invention.
  • FIG. 8 is a schematic view showing the structure of a fingerprint sensor according to an embodiment of the present invention.
  • FIG 9 is an exemplary view schematically showing the operation of the fingerprint sensor provided in the fingerprint sensor module according to an embodiment of the present invention.
  • FIG. 10 is an exemplary view schematically showing a fingerprint sensor provided in the fingerprint sensor module according to another embodiment of the present invention.
  • FIG. 11 is an exemplary view schematically showing a fingerprint sensor provided in the fingerprint sensor module according to another embodiment of the present invention.
  • FIG. 12 is a perspective view showing a fingerprint sensor module according to another embodiment of the present invention.
  • FIG. 13 is a cross-sectional view showing a fingerprint sensor module according to another embodiment of the present invention.
  • FIG. 14 is a cross-sectional view showing a manufacturing process of a fingerprint sensor module according to another embodiment of the present invention.
  • FIG. 1 is a perspective view showing a fingerprint sensor module according to an embodiment of the present invention
  • Figure 2 is a cross-sectional view of the A-A line of FIG.
  • the fingerprint sensor module 10 includes a fingerprint sensor 200, a bracket 310, and a multi-coating layer 500.
  • the fingerprint sensor module 10 may be provided in an electronic device, especially a portable electronic device.
  • the portable electronic device includes a mobile phone, a smart phone, a PDA, a tablet PC, a notebook computer, a portable sound player (MP3 player), and all portable electronic devices of a similar type.
  • MP3 player portable sound player
  • the fingerprint sensor 200 may have a sensing unit 210 formed on the substrate 201 using a conductor, and a sensor circuit unit 220 electrically connected to the sensing unit 210.
  • the fingerprint sensor 200 may sense a fingerprint image by receiving a signal transmitted through a user's finger.
  • Bracket 310 is a member for receiving and seating the fingerprint sensor 200, while determining the overall shape of the fingerprint sensor module 10 while protecting the fingerprint sensor 200.
  • the bracket 310 may be a mold product formed by a mold.
  • the bracket 310 has a cover layer 315 covering an upper portion of the fingerprint sensor 200, more specifically, the sensing unit 210, and a touch surface 314 is formed on an upper surface of the cover layer 315. That is, the cover layer 315 may be provided between the touch surface 314 from the upper surface of the sensing unit 210.
  • the touch surface 314 is a part where a user's touch is made, and receives a signal transmitted through a user (exactly a user's finger).
  • the multi-coating layer 500 may be positioned on the touch surface 314 of the bracket 310 to face the upper surface of the sensing unit 210 of the fingerprint sensor 200.
  • the sum of the thickness D1 of the cover layer 315 and the thickness D2 of the multi-coating layer 500 may be 40 to 60 ⁇ m, through which effective effective sensing may be possible when detecting a fingerprint.
  • FIG 3 is an exemplary view showing a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention
  • Figure 4 is a cross-sectional view showing a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention.
  • the bracket 310 has a groove 312 on the inside thereof, and a touch surface 314 protruding corresponding to the shape of the groove 312 on the opposite side of the surface on which the groove 312 is formed. ) Is formed.
  • the bracket 310 has a cover layer 315 between the bottom surface 313 of the groove 312 and the touch surface 314, and the thickness D1 of the cover layer 315 may be 15 to 30 ⁇ m.
  • the thickness D1 of the cover layer 315 refers to a thickness measured vertically from the groove 312 to the touch surface 314. That is, the cover layer 315 may be a thickness between the upper surface of the sensing unit 210 and the touch surface 314. If the thickness of the cover layer 315 is too thin, the fingerprint sensor 200 may not be stably accommodated. On the contrary, if the cover layer 315 is too thick, the sensing capability of the fingerprint sensor 200 may be weakened.
  • the cover layer 315 may include a ferroelectric 400 to increase the dielectric constant.
  • the fingerprint sensor reduces the loss of the signal that receives the image in the active state, thereby allowing the thickness of the cover layer 315 and the multi-coating layer 500 to be more freely implemented.
  • the ferroelectric 400 will be described in more detail.
  • the ferroelectric 400 is a kind of dielectric that is an electrically insulator, and refers to materials in which positive and negative electric polarization occurs by itself without applying a voltage from the outside. Representative materials include Al 2 O 3, BaTio 3 (BTO), SrTio 3 (STO), (Ba, Sr) Tio 3 (BST).
  • the ferroelectric 400 may be mixed in the bracket 310 in the form of powder or liquid, etc., and may be included in the entire bracket 310.
  • the bracket 310 may be embodied in an EMC mold including the ferroelectric 400.
  • the EMC mold including the ferroelectric 400 has a fingerprint on board (COB) type fingerprint sensor and a ball grid array (BGA) type fingerprint sensor, in addition to a chip on film (COF) type fingerprint sensor composed of a flexible substrate as in the present embodiment. And it can be applied to WLP (Wafer Level Package) type fingerprint sensor.
  • COB fingerprint on board
  • BGA ball grid array
  • COF chip on film
  • WLP Wafer Level Package
  • the ferroelectric 400 is preferably included in the cover layer 315, but may be entirely included in the bracket 310 for convenience of the process.
  • the bracket 310 may be made of any one of nylon or polyamide material including epoxy molding compound (EMC), fluorine resin, and 20 to 40% glass.
  • EMC epoxy molding compound
  • the glass may increase the strength of the bracket to protect the fingerprint sensor from external impact.
  • the fluorine resin may be polyvinylidene fluoride (PVDF) having a high dielectric constant. If the dielectric constant is high, the detection signal is amplified to facilitate fingerprint recognition, and can be free from thickness during post processing.
  • the sensing unit 210 and the sensor circuit unit 220 of the fingerprint sensor 200 are accommodated.
  • a predetermined amount of epoxy resin 330 may be injected into the groove 312 as an adhesive.
  • the flexible circuit 201 is supported on the step 316 formed at the edge of the groove 312 so as to support the sensor circuit part of the fingerprint sensor 200.
  • 220 may be seated facing the top surface.
  • the fingerprint sensor 200 may be compressed and seated by the same jig (JIG) 340 as the outer shape of the fingerprint sensor 200.
  • JIG jig
  • the flatness of the flexible material substrate 201 of the fingerprint sensor 200 may be secured by the fingerprint sensor 200 being compressed and fixed to the bracket 310 provided in advance.
  • the jig 340 may be removed from the groove 312.
  • the groove 312 of the bracket 310 may be filled with the molding material 350.
  • the sensing unit 210 and the sensor circuit unit 220 are accommodated in the groove 312, and an empty space exists in addition to the accommodated portion. If the empty space is left as it is, the fingerprint sensor 200 may not be fixed and may move in the empty space, thereby filling the molding material 350 in the empty space.
  • a liquid polymer may be used. For example, any one of an epoxy molding compound, an epoxy resin, and a putty may be used.
  • Epoxy molding compound (EMC) may be a liquid epoxy molding compound (EMC).
  • Epoxy molding compound (EMC) is harder than the PC series formed by the normal injection (hard) can prevent the tolerance in advance, it is possible to further improve the flatness.
  • the molding member 350 may increase the reliability of the fingerprint sensor 200 by bringing the sensing unit 210 into close contact with the bottom surface of the groove 312.
  • the molding material may be a mechanism having a predetermined shape.
  • the instrument can also increase the sensing reliability by fixing the fingerprint sensor 200 like the liquid polymer.
  • the appliance may be designed to fit the size of the groove 312 may be pressed or fastened using a separate fastening means. An example in which the molding material is used as a mechanism having a predetermined shape will be described later.
  • FIG. 3D shows the bracket 310 of FIG. 3C upside down. As described above, the touch surface 314 corresponding to the shape of the groove 312 protrudes from the opposite side of the groove 312.
  • the multi-coating layer 500 may be provided on the touch surface 314 of the bracket 310.
  • the multi-coating layer 500 may perform various functions such as implementing colors in the fingerprint sensor module 10 or reinforcing the upper surface side strength of the fingerprint sensor module 10.
  • the multicoat layer 500 may include a primer layer 502, a color paint layer 503, and a protective film layer 504, and the multicoat layer 500 may include a primer layer 502 and a color paint layer 503.
  • the protective layer 504 may be formed in the order of the protection layer 504.
  • the primer layer 502 may be provided on the touch surface 314 to connect the color paint layer 503, and the color paint layer 503 may perform a color implementation function.
  • the primer layer 502 may have a thickness of 2 to 3 ⁇ m, and the color paint layer 503 may have a thickness of 3 to 5 ⁇ m.
  • the protective layer 504 may be a ceramic coating layer including a UV protective layer or ceramic.
  • the above-described ferroelectric 400 may be further included in the passivation layer 504.
  • the ferroelectric 400 may be configured to be included in both the cover layer 315 and the passivation layer 504, or may be configured to be included in the cover layer 315 or the passivation layer 504.
  • the protective layer 504 may have a thickness of 20 to 22 ⁇ m.
  • the thickness D2 of the multi-coat layer 500 may be formed to 25 ⁇ 30 ⁇ m.
  • the sum of the thickness D1 of the cover layer 315 and the thickness D2 of the multi-coating layer 500 may be 40 to 60 ⁇ m.
  • FIG. 5 is a schematic diagram illustrating a process of preparing a ceramic paint by a sol-gel method in a fingerprint sensor module according to an embodiment of the present invention, which will be described below with reference to FIG. 5.
  • Ceramic paints may be prepared, for example, by using a sol-gel method in which two or more solutions are stirred to prepare a ceramic.
  • liquid A and liquid B are prepared. Then, the liquid A is shaken up, down, left, and right for a predetermined time (for example, 30 minutes) (FIG. 5B). Next, after mixing B liquid with A liquid, it stirs for predetermined time (for example, 5 hours) (FIG. 5 (c)).
  • a predetermined time for example, 30 minutes
  • predetermined time for example, 5 hours
  • the passivation layer 504 may be formed by spraying the previously prepared ceramic paint on the color paint layer 503.
  • the ceramic paint can be made, for example, by the sol-gel method as described above, and the ceramic coating layer is formed on the color paint layer using this ceramic paint.
  • Ceramics have a high dielectric constant, which reduces the loss of a signal that the fingerprint sensor accepts images in the active state. That is, since the ceramic coating layer acts as a dielectric layer, the electric signal lines directed to the fingerprint sensor 200 through the user's finger (not shown) may be more densely formed. That is, in the fingerprint sensor module 10 according to an embodiment of the present invention, the loss of the sensing signal is reduced.
  • ceramics have high stain resistance such as anti-fingerprint and water repellency. Therefore, it is possible to obtain a clearer fingerprint image by reducing the blurring of the image due to surface contamination.
  • inorganic pigments excellent in heat resistance, hiding power, weather resistance in the ceramic paint it is possible to implement a variety of colors.
  • the dielectric constant of the ceramic coating layer may be predetermined according to the driving frequency of the fingerprint sensor 200, for example, the dielectric constant may be 5 or more.
  • the driving signal sent toward the user's finger Is received by the sensing unit 210 via the user.
  • the protective layer 504 When using a ceramic coating layer having a dielectric constant suitable for the driving frequency of the sensing unit 210 (ie, the protective layer 504), the signal is concentrated on the ceramic coating layer and is received in the image sensing region. Therefore, the loss of the signal is reduced and the operability of the fingerprint sensor 200 is improved.
  • the protective film layer 504 of the multi-coating layer 500 by forming the protective film layer 504 of the multi-coating layer 500 with a ceramic coating layer, the loss of signal of the fingerprint sensor as well as the effect of low film thickness, wear resistance and heat resistance, improve the operation of the fingerprint sensor. By reducing the operation can be improved.
  • a polishing process for increasing thickness and flatness of the cover layer 315 of the bracket 310 may be further performed.
  • the polishing process is made up to a thickness that can be sensed by the fingerprint sensor 200, for this purpose, the thickness of the cover layer 315 of the bracket 310 may be 15 to 30 ⁇ m.
  • the cover layer 315 has a thickness of 100 ⁇ m
  • the cover layer 315 is polished so that the cover layer 315 has a thickness of 15 to 30 ⁇ m.
  • FIG. 6 is a cross-sectional view illustrating a fingerprint sensor module according to an embodiment of the present invention.
  • a metal plate 360 may be further provided on the molding member 350.
  • the metal plate 360 may be provided on the molding member 350 to seal and seal the portion where the molding member 350 is exposed, and to support the fingerprint sensor module 10 to reinforce the strength of the fingerprint sensor module 10.
  • the metal plate 360 may be made of stainless steel.
  • Figure 7 is an exemplary view showing a fingerprint sensor according to an embodiment of the present invention
  • Figure 8 is a schematic diagram showing the structure of the fingerprint sensor according to an embodiment of the present invention
  • Figure 9 is a view of the present invention Exemplary diagrams illustrating operations of a fingerprint sensor provided in a fingerprint sensor module according to an exemplary embodiment.
  • the fingerprint sensor 200 may include a substrate 201, a sensing unit 210, a sensor circuit unit 220, and an external interface connection unit 221 of a flexible material.
  • the sensing unit 210 may include a driving electrode and a receiving electrode made of a conductor, and may be installed in the substrate 201.
  • the sensing unit 210 may receive a difference between an electrical signal of a valley and a ridge of a fingerprint of a finger located on the substrate 201.
  • the substrate 201 is formed of a flexible printed circuit board (FPCB) made of a flexible material, and also serves as a substrate of the sensor circuit unit 220 while protecting the driving electrode and the receiving electrode.
  • FPCB flexible printed circuit board
  • the sensor circuit unit 220 is an integrated circuit (IC) in which an electronic circuit for sensing a fingerprint image and processing a fingerprint image is integrated, and is electrically connected to a driving electrode and a receiving electrode of the sensing unit 210. Since the substrate 201 is made of a flexible printed circuit board (FPCB), the sensor circuit unit 220 may be mounted on the bottom surface of the substrate 201.
  • IC integrated circuit
  • FPCB flexible printed circuit board
  • the external interface connector 221 is formed by extending the flexible printed circuit board FPCB of the substrate 201 described above. A wire is formed inside the external interface connector 221, and a connector 223 is formed at one end thereof so as to be connected to the external interface.
  • the external interface connector 221 may be connected to, for example, a portable device such as a smartphone.
  • the fingerprint sensor according to an embodiment of the present invention may have an “I” shaped structure in which the sensing unit 210 and the external interface connection unit 221 are coupled in the same direction as shown in FIG. 7.
  • the fingerprint sensor according to an embodiment of the present invention may have a “T” shaped structure in which the sensing unit and the external interface connection unit are perpendicular to each other. That is, as shown in FIG. 8, the fingerprint sensor 200 may include a sensing unit 210 provided on the upper surface of the substrate 201 and a sensor circuit unit 220 provided on the lower surface of the substrate 201.
  • FIG. 8A illustrates a top surface of the substrate 201 and FIG. 8B illustrates a bottom surface of the substrate 201, and
  • FIG. 8C illustrates a sensing unit 210 and a sensor circuit unit.
  • 220 is a diagram schematically showing the electrical connection relationship.
  • the substrate 201 may be a flexible substrate, and may be made of, for example, a polymide film, but is not limited thereto.
  • the sensing unit 210 may include a plurality of driving electrodes 211 and image receiving electrodes 212 formed on the substrate 201.
  • the driving electrode 211 and the image receiving electrode 212 may be composed of conductor lines.
  • the driving electrode 211 receives a driving signal from the sensor circuit unit 220 and transmits a signal to the image receiving electrode 212.
  • the image receiving electrode 212 receives a signal transmitted from the driving electrode 211 through a user (preferably a user's finger).
  • One end portion of the image receiving electrode 212 positioned on the upper surface of the substrate 201 is formed to extend in the horizontal direction.
  • the plurality of driving electrodes 211 are formed to be spaced apart from each other so as to be perpendicular to the direction in which the image receiving electrode 212 extends (see FIG. 8A).
  • the image receiving electrode 212 is electrically connected to the sensor circuit 220 on the bottom surface of the substrate 201.
  • One end of the plurality of driving electrodes 211 is spaced apart from the image receiving electrode 212 by a predetermined distance.
  • the other ends of the plurality of driving electrodes 211 are electrically connected to the sensor circuit 220 on the bottom surface of the substrate 201.
  • the driving electrode 211 and the image receiving electrode 212 are spaced apart from each other, and the driving signal transmitted from the driving electrode 211 is received by the image receiving electrode 212 via the user U. do. At this time, it is possible to recognize the fingerprint by measuring a change in the electric field according to the presence or absence of the fingerprint bone or the fingerprint acid located on the user's finger as a signal.
  • the sensor circuit unit 220 may have an external interface connection unit 221 electrically connected to the outside.
  • the fingerprint sensor 200 may be implemented by a chip-on-film (COF) or ball grid array (BGA) method.
  • COF chip-on-film
  • BGA ball grid array
  • the sensing unit 210 that is, the driving electrode 211 and the image receiving electrode 212 is formed on the upper surface of the substrate 201, and the sensor circuit unit 220 connected to the sensing unit 210 on the lower surface of the substrate 201.
  • the IC size of the sensor circuit unit 220 can be made small. Through this, the spatial constraints in which the sensing unit 210 is installed can be eliminated, and the overall appearance can be made compact.
  • FIG. 10 is an exemplary view schematically showing a fingerprint sensor provided in a fingerprint sensor module according to another embodiment of the present invention.
  • the sensor circuit unit 1220 of the fingerprint sensor 1200 is a sensing unit. It may be installed at a considerable distance from 1210. That is, the above-described sensor circuit unit 220 (see FIGS. 7 and 8) is located inside the bracket 310 (see FIG. 1), while the sensor circuit unit 1220 illustrated in FIG. 10 may be installed outside the bracket. Can be. Through this, impact and heat that may be generated in the coupling process between the bracket and the fingerprint sensor 1200 and in the process of fixing the fingerprint sensor 1200 may be prevented from being applied directly to the sensor circuit unit 1220.
  • the sensor circuit unit 1220 can be installed on any portion of the substrate 1201, it may be flexibly installed and applied according to the structural characteristics of the portable electronic device to be assembled.
  • the fingerprint sensor may be formed not only in a separate type in which the sensor circuit part and the sensing part are separately installed, but also in an integral type in which the sensor circuit part and the sensing part are integrally formed.
  • FIG. 11 is a schematic view showing a fingerprint sensor provided in a fingerprint sensor module according to another embodiment of the present invention.
  • the fingerprint sensor 2200 may include a ball grid array (BGA). ) Type.
  • BGA ball grid array
  • the terminals 2250 may be arranged in a two-dimensional array on the substrate 2201, and the bumps 2221 formed on the bottom surface of the sensor circuit unit 2220 may be connected to the terminals 2250.
  • the terminal 2250 and the bumps 2221 may be connected by soldering.
  • the substrate 2201 may be, for example, a printed circuit board (PCB) to be electrically connected to the sensor circuit unit 2220 to transmit electrical signal information.
  • a lead frame may be attached to the lower portion of the substrate 2201 by resin injection or surface mounting technology (SMT).
  • the fingerprint sensor has been described mainly as a separate type, but when the sensor circuit unit and the sensing unit are integrated, the case of the AREA type having a plurality of image receivers is also included in the scope of the present invention.
  • FIG. 12 is a perspective view showing a fingerprint sensor module according to another embodiment of the present invention
  • Figure 13 is a cross-sectional view showing a fingerprint sensor module according to another embodiment of the present invention
  • Figure 14 is another embodiment of the present invention
  • the fingerprint sensor may be fixed by the additional bracket, and the other configuration is the same as the embodiment, so description thereof is omitted.
  • the bracket 3310 accommodates the sensor circuit unit 220 of the fingerprint sensor 200 in the first groove 3311 formed therein, and at the edge of the first groove 3311.
  • the sensing unit 210 of the fingerprint sensor 200 faces the upper surface by supporting the flexible substrate 201 on the formed step 3319.
  • the fingerprint sensor 200 and the bracket 3310 may be bonded to each other by an epoxy resin or an adhesive tape, and the external interface connection part 221 is exposed to the outside of the bracket 3310 and disposed to extend.
  • the bracket 3310 may be configured with a flange 3312 including a through portion 3318 to support the bracket 3310 and to penetrate the external interface connection portion 221.
  • the flange 3312 may be configured integrally or detachably with the bracket 3310.
  • a coupling hole (not shown) to which an external decorative member (not shown) may be coupled may be formed in the flange 3312.
  • the penetrating portion 3318 may be configured at a portion of the flange 3312 that contacts the bottom edge of the bracket 3310.
  • the outer shape of the flange 3312 may be configured to be wider than the edge of the bracket 3310, through which, the flange 3312 may serve as a position fixing to facilitate the subsequent process.
  • an additional bracket 3320 may be configured to cover the bracket 3310 in a state in which the fingerprint sensor 200 is provided at the bracket 3310 and the external interface connection part 221 is configured at the through part 3318.
  • the additional bracket 3320 may be designed to fix the external interface connection 221 and to facilitate attaching the fingerprint sensor module to the mobile device.
  • the additional bracket 3320 may be integrally formed with the bracket 3310 in the process.
  • a cover layer 3315 may be formed on the additional bracket 3320 to cover the sensing unit 210 of the fingerprint sensor 200.
  • a separate polishing process may be further included in the touch surface 3314 of the additional bracket 3320.
  • the polishing process may be made up to a thickness (15 ⁇ 30 ⁇ m) that the fingerprint sensor 200 can sense.
  • the multi-coating layer 500 may be formed on the touch surface 3314.
  • the multi-coating layer 500 may be formed to a thickness of 25 ⁇ 30 ⁇ m.
  • Brackets 3310, flanges 3312, and additional brackets 3320 may be made of any one of nylon or polyamide materials, including epoxy molding compound, fluorine resin, and 20-40% glass. Can be done.
  • cover layer 3315 of the additional bracket 3320 may include a ferroelectric 400, the ferroelectric 400 may be further included in the additional bracket 3320 as a whole.
  • additional brackets 3320 may be combined with the brackets 3310 in a physical manner, or by molding such as insert molding.
  • a plurality of fingerprint sensor modules 3010 in which the bracket 3310, the fingerprint sensor 200, and the additional bracket 3320 are combined may be processed on a substrate and separated into individual modules through a sawing process.

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PCT/KR2014/003243 2013-04-15 2014-04-15 지문센서 모듈, 이를 구비한 휴대용 전자기기 및 그 제조방법 WO2014171702A1 (ko)

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KR10-2013-0041312 2013-04-15
KR20130041312 2013-04-15
KR20130046374 2013-04-25
KR10-2013-0046374 2013-04-25
KR10-2013-0049684 2013-05-03
KR20130049684 2013-05-03
KR20130055781 2013-05-16
KR10-2013-0055781 2013-05-16
KR20130071913 2013-06-21
KR10-2013-0071913 2013-06-21
KR20130096079 2013-08-13
KR10-2013-0096079 2013-08-13
KR10-2013-0101823 2013-08-27
KR20130101823 2013-08-27
KR20130102512 2013-08-28
KR10-2013-0102512 2013-08-28
KR20130124557 2013-10-18
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PCT/KR2014/003244 WO2014171703A1 (ko) 2013-04-15 2014-04-15 지문센서 모듈, 이를 구비한 휴대용 전자기기 및 그 제조방법

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CN105740754B (zh) * 2014-12-12 2019-03-29 联想(北京)有限公司 一种指纹采集模组、制作方法及电子设备
KR101675465B1 (ko) * 2015-01-02 2016-11-15 주식회사 바이오메트릭스 필름 커버를 포함하는 생체인식센서 모듈 및 생체인식센서 모듈의 패키징 방법
KR101707818B1 (ko) 2015-04-23 2017-02-20 주식회사 씨아이씨티 전자부품 외장 형성방법 및 전자부품 외장 형성구조
KR101678465B1 (ko) * 2015-10-20 2016-11-23 (주)티이에스 터치 센서 모듈 제조 방법 및 이에 의해 제조된 터치 센서 모듈
CN105740852B (zh) * 2016-03-28 2022-04-05 江西欧迈斯微电子有限公司 指纹识别模组及电子装置
KR20170122972A (ko) * 2016-04-28 2017-11-07 엘지이노텍 주식회사 지문 센싱 장치 및 이를 포함하는 전자 기기
WO2018038569A1 (ko) * 2016-08-26 2018-03-01 주식회사 아모센스 지문인식센서용 커버 및 이를 포함하는 휴대용 전자기기
CN106503685A (zh) * 2016-10-31 2017-03-15 北京小米移动软件有限公司 保护膜层、显示基板和电子设备
KR101833993B1 (ko) * 2016-11-23 2018-03-06 (주) 개마텍 투명강화조립층의 제조방법 및 이를 이용한 지문센서 어셈블리의 제조방법
CN111512262A (zh) 2017-10-13 2020-08-07 华为技术有限公司 电子设备的结构和电子设备
WO2019103172A1 (ko) * 2017-11-21 2019-05-31 (주)개마텍 지문센서 어셈블리 및 이를 이용한 지문센서 모듈 및 이의 제조방법
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CN205375505U (zh) 2016-07-06
CN205540791U (zh) 2016-08-31
CN205375499U (zh) 2016-07-06
WO2014171703A1 (ko) 2014-10-23
CN205486174U (zh) 2016-08-17
CN205427870U (zh) 2016-08-03
CN205540793U (zh) 2016-08-31
CN205375506U (zh) 2016-07-06
CN205540792U (zh) 2016-08-31
KR20140123919A (ko) 2014-10-23
CN205540794U (zh) 2016-08-31
KR20140123920A (ko) 2014-10-23

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