WO2019147012A1 - 센서를 장착하기 위한 개구를 포함하는 디스플레이 - Google Patents
센서를 장착하기 위한 개구를 포함하는 디스플레이 Download PDFInfo
- Publication number
- WO2019147012A1 WO2019147012A1 PCT/KR2019/000950 KR2019000950W WO2019147012A1 WO 2019147012 A1 WO2019147012 A1 WO 2019147012A1 KR 2019000950 W KR2019000950 W KR 2019000950W WO 2019147012 A1 WO2019147012 A1 WO 2019147012A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- thin film
- sensor
- organic light
- opening
- Prior art date
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Definitions
- the present invention relates to a display comprising an aperture for mounting a sensor.
- the display of the electronic device may include an active area in which the screen is displayed and an inactive area surrounding the active area.
- the sensor may be exposed on the front side of the electronic device.
- Various sensors and camera modules may be disposed on the sensor, such as an illuminance sensor, an iris sensor, and the like.
- the electronic device can sense the brightness outside the electronic device through the brightness sensor and adjust the screen brightness of the display based on the detection result.
- an electronic device can photograph a picture or a moving picture through a camera module.
- Such a sensor may be located inside the electronic device or inside the display.
- the sensor exposed through the bezel area of the front portion may be disposed in an inactive area of the display or inside the housing in which the display does not extend.
- the sensor exposed through the display area of the front part can be disposed in the active area of the display.
- the bezel area is removed from the front side of the electronic device, and the whole front side is used as the display area. An attempt is therefore made to mount the sensor in the active area of the display.
- a hole In order to mount the sensor in the active area of the display, a hole must be formed in the display panel. At this time, the light emitting element, the common electrode, or the circuit board may be exposed to the outside through the hole. Particularly, a pixel composed of an organic light emitting diode is vulnerable to oxygen or moisture.
- a display comprising: a display substrate layer; an organic light emitting layer formed over the display substrate layer and including a plurality of pixels; and an organic light emitting layer disposed between the display substrate layer and the organic light emitting layer A thin film transistor array layer including a plurality of thin film transistors electrically connected to the pixel, a thin film encapsulation layer formed over the organic light emitting layer, and a thin film transistor array including the display substrate layer, the organic light emitting layer, And a sealing member covering at least a portion of the inner wall of the opening that includes at least a portion of a portion of the sidewall formed by the display substrate layer among the inner side wall of the opening, ) Is provided.
- a display for mounting a sensor comprising: a polymer layer; an organic light emitting layer formed on the polymer layer, the organic light emitting layer including a plurality of pixels; A thin film transistor array layer including a plurality of thin film transistors electrically connected to the pixels; a thin film encapsulation layer formed on at least a part of the organic light emitting layer; and a light emitting layer, a thin film transistor array layer, And a sensor disposed inside the opening, and to prevent the organic light emitting layer and the thin film transistor array layer from being exposed to the outside through the inside wall of the opening, And a sealing member formed in the opening, Made of a second portion formed in the first portion and a remainder that are generated, the sealing member has a display that is formed on at least a portion of the second portion and the first portion is provided.
- a sensor can be mounted on an active area, and the active area can be expanded by reducing or eliminating the inactive area of the display. Whereby the active area can be enlarged to the entire front side of the electronic device.
- FIG. 1 shows a front view of an electronic device according to various embodiments.
- FIG. 1 is a sectional view taken along line A-A 'in Fig.
- FIG. 3 is a cross-sectional view of an electronic device according to various embodiments.
- 1 is a sectional view taken along the line B-B 'in Fig. 1;
- FIG. 4 is a cross-sectional view of an electronic device according to various embodiments. 1 is a sectional view taken along the line B-B 'in Fig. 1;
- FIG. 5 is a cross-sectional view of a display panel according to various embodiments.
- FIG. 6 is a cross-sectional view of a display panel according to various embodiments.
- FIG. 7 is a cross-sectional view of a display panel according to various embodiments.
- FIG. 8 is a cross-sectional view of a display panel according to various embodiments.
- FIG. 9 is a cross-sectional view of a display panel according to various embodiments.
- FIG. 10 is a cross-sectional view of a display panel according to various embodiments.
- FIG. 11 is a view showing a method of manufacturing a display panel according to various embodiments.
- FIG. 12 is a block diagram of an electronic device in a network environment, including a display including an aperture for mounting a sensor, in accordance with various embodiments.
- FIG. 13 is a block diagram of a display, including an aperture for mounting a sensor, in accordance with various embodiments.
- FIG. 1 is a diagram illustrating a front portion of an electronic device 20 including a display 10 according to various embodiments.
- an electronic device 20 including a display 10 in accordance with various embodiments is shown.
- the electronic device 20 may include a housing 22 and a display 10 disposed within the housing 22.
- the display area 21 of the electronic device means the area where the screen is displayed by the pixel and may correspond to the active area of the display 10 disposed inside the housing of the electronic device 20.
- a display area 21 may be formed at least a portion of the front side of the housing 22. [ The display area 21 may be formed on the entire front surface of the housing 22.
- an opening corresponding to the display area 21 may be formed.
- the display area 21 in which the opening is formed can be arranged such that the display 10 provided in the housing 22 is exposed.
- the transparent layer 150 of the display 10 may be formed in the opening of the front surface of the housing 22. [ Through the transparent layer of the display 10, a screen of the display 10 can be displayed as the front side of the electronic device 20. [ Also, the sensor 700 mounted on the display can be exposed to the front side.
- the display 10 and the sensor 700 may be disposed inside the housing 22. [
- the display 10 and the sensor 700 may be disposed between the transparent layer 150 and the second surface 22b of the housing 22.
- the sensor 700 may be mounted in an opening 800 formed in the active area of the display 10.
- the upper surface of the sensor 700 may be disposed to face the transparent layer 150.
- the sensor 700 may be an optical sensor capable of receiving external light that has passed through the transparent layer 150.
- the entire front surface of the housing 22 can be configured as the display area 21. Thereby providing the user of the electronic device 20 with a large screen.
- a structure for mounting the sensor 700 in the active area of the display 10 may be considered.
- the type, number or position of the sensor 700 shown in FIG. 1 is exemplary and is not limited to that shown.
- the sensor 700 may include at least one of a proximity sensor, an illuminance sensor, a gesture sensor, a motion sensor, a fingerprint recognition sensor, and a biosensor.
- the sensor may include an image sensor that captures an image or a moving image. Or a camera.
- the senor 700 may obtain image data.
- external light may be incident through the sensor, and the sensor 700 may acquire image data corresponding to the incident light.
- the image data may correspond to data in which the incident light is converted into an electrical signal by the sensor.
- FIG. 1 is a sectional view taken along line A-A 'in Fig.
- the electronic device 20 includes a display 10, a sensor 700, a printed circuit board (PCB) 27, a power management integrated circuit (PMIC) 25, And a processor 26.
- PCB printed circuit board
- PMIC power management integrated circuit
- the display 10 includes a display panel 100, a polymer layer 110, a display driver integrated circuit (DDI), and a module- flexible printed circuit board).
- a display driver integrated circuit DPI
- a module- flexible printed circuit board DPI
- the display panel may include a plurality of pixels.
- Each of the plurality of pixels may include a red subpixel, a green subpixel, and a blue subpixel. Or each of the plurality of pixels may comprise a red subpixel, a green subpixel, a blue subpixel, and a green subpixel. Or each of the plurality of pixels may comprise a red subpixel, a green subpixel, a blue subpixel, and a white subpixel.
- the polymer layer 110 may be disposed in the -z direction of the display panel 100.
- the polymer layer 110 may include wires for supplying power and / or signals to the display panel 100.
- the polymer layer 110 may be made of a flexible material and extend from one end of the display panel 100 to the flexible printed circuit board 24.
- the display driver IC 23 may be disposed in a part of the polymer layer 110.
- the display driving circuit 23 can control the pixels through the polymer layer 110.
- a film may be disposed between the display drive circuit 23 and the polymer layer 110.
- a film may be attached to one end of the polymer layer 110, and a display driving circuit 23 may be disposed on the film.
- the flexible printed circuit board 24 may be electrically connected to a portion of the polymer layer 110.
- the flexible printed circuit board 24 may be electrically connected to a conductive pattern (or wiring) formed on the polymer layer 110.
- the flexible printed circuit board 24 may be referred to as a module-flexible printed circuit board (M-FPCB).
- the printed circuit board 27 may be disposed in the -z direction of the display 10. [ The printed circuit board 27 can mount various components (e.g., processor 26, memory) included in the electronic device 20.
- the power management circuit 25 may supply pixel power to the pixels.
- the power management circuit 25 may apply a first voltage (e.g., ELVDD) to one end of the pixels and a second voltage (e.g., ELVSS) to the other end of the pixels.
- ELVDD first voltage
- ELVSS second voltage
- the pixels supplied with the pixel power can emit light.
- the processor 26 may turn on the sensor 700 in response to a user input for recognizing biometric information.
- the processor 26 may control the sensor 700 to either reflect on the subject outside the electronic device 20 or acquire image data corresponding to the light generated in the subject .
- the sensor 700 may be disposed in the aperture 800 through at least a portion of the display 10 to receive external light.
- the processor 26 can control the sensor 700 (or the light emitting element) to emit light in the infrared band when the user desires to unlock the screen.
- the light emitted from the sensor 700 may be reflected from the user's body (e.g., iris, finger) and then enter the electronic device 20 again.
- the processor 26 may perform user authentication based on the incoming light. If the authentication result indicates that the user matches, the processor 26 can release the screen lock.
- the embodiment shown in Fig. 2 is merely an example, and the lamination structure of the electronic device 20 and the components included in the electronic device 20 are not limited to those shown in Fig.
- the display 10 may be formed of a COF (chip on film) method in which various components are disposed on a thin film, or a COG (chip on glass) method in which a display driving circuit 23 is directly mounted on a glass substrate.
- the electronic device may include a memory (e.g., 930 of FIG. 12).
- the memory may include instructions that can control the display drive circuit 23 and / or the processor 26.
- FIG. 3 is a cross-sectional view of an electronic device according to various embodiments.
- 1 is a sectional view taken along the line B-B 'in Fig. 1;
- the electronic device 20 may include a housing 22 and a display 10 disposed within the housing.
- the display 10 includes a first adhesive layer 410, a display panel 100, a third adhesive layer 430, a touch screen panel 200, a polarizing layer 300, An adhesive layer 420 and a transparent layer 150.
- the display 10 may be exposed through the transparent layer 150.
- the transparent layer 150 may be formed of a transparent material to protect the touch screen panel 200 within the display 10 from external impacts.
- the transparent layer 150 can transmit light generated inside the electronic device 20 to the outside.
- the transparent layer 150 may transmit the external light of the electronic device 20 to the interior of the electronic device.
- the transparent layer 150 may be made of a material excellent in light transmittance, heat resistance, chemical resistance, and mechanical strength.
- the transparent layer 150 may be a transparent film or a glass substrate made of polyethylene terephthalate or the like and may be formed of a material such as polymethylmethacrylate, polyamide, polyimide, polypropylene a plastic substrate made of polypropylene, polyurethane, or the like.
- the display 10 may include a display such as, for example, a liquid crystal display (LCD), a lightemitting diode (LED) display, an organic light-emitting diode (OLED) A microelectromechanical systems (MEMS) display, or an electronic paper display.
- a display such as, for example, a liquid crystal display (LCD), a lightemitting diode (LED) display, an organic light-emitting diode (OLED) A microelectromechanical systems (MEMS) display, or an electronic paper display.
- LCD liquid crystal display
- LED lightemitting diode
- OLED organic light-emitting diode
- MEMS microelectromechanical systems
- a first adhesive layer 410 may be disposed between the second side 22b of the housing 22 and the transparent layer 150.
- the first adhesive layer 410 may be at least partially opaque double-sided tape.
- the first adhesive layer 410 may adhere the display panel 100 to a flexible printed circuit board (FPCB) (not shown), which may be disposed on the second surface 22b of the housing 22.
- FPCB flexible printed circuit board
- the first adhesive layer 410 may be an optical clear adhesive (OCA).
- OCA optical clear adhesive
- the first adhesive layer 410 may be a thin film adhesive film corresponding to the shape of the display panel 100.
- the display panel 100 may be disposed between a first adhesive layer 410 and a third adhesive layer 430 disposed below the touch screen panel 200.
- the touch screen panel 200 may be disposed between a third adhesive layer 430 and a second adhesive layer 420 disposed below the transparent layer 150.
- the touch screen panel 200 may be coupled with the transparent layer 150 by the third adhesive layer 430 to sense a touch position of the user generated in the transparent layer 150.
- the touch screen panel 200 may include a touch sensing sensor such as a capacitive overlay, a resistive overlay, or an infrared beam, or may include a pressure sensor or a fingerprint sensor A sensor, and / or a sensor.
- various sensors capable of sensing contact or pressure of an object may be included in the touch screen panel 200.
- the touch screen panel 200 may be formed in a separate add-on manner from the display 10 as shown in FIG. 3, but this is exemplary and may include various types of touch screen panels. have.
- the touch screen panel 200 may be integrated with the display in an on-cell manner coupled to the top of the display 10.
- the touch screen panel 200 may be formed in an in-cell manner included within the display 100.
- the second adhesive layer 420 may be formed on the touch screen panel 200 And the transparent layer 150 to adhere the touch screen panel 200 and the transparent layer 150 to each other.
- a polarizing layer 300 may be disposed between the second adhesive layer 420 and the touch screen panel 200.
- the second adhesive layer 420 may be a substantially transparent OCA (optical clear adhesive).
- the second adhesive layer 420 may comprise an optically transparent polymeric material.
- a polarizing layer 300 may be further included between the second adhesive layer 420 and the touch screen panel 200.
- the polarizing layer (POL) 300 may polarize the incident light incident on the touch screen panel 200 and the reflected light reflected from the touch screen panel 200.
- the polarizing layer 300 may be attached to the transparent layer 150 through the second adhesive layer 420 to prevent scattering of the transparent layer 150 when the transparent layer 150 is broken.
- An opening 800 may be formed through some or all of the layers.
- the opening 800 may be located within a range of 1 mm to 20 mm from the periphery of the front portion of the housing 22.
- a thin film encapsulation layer may be formed inside the display panel 100 of the display 10.
- the thin film encapsulation layer can prevent the display panel 100 from being in contact with the external environment so that the display panel 100 is not exposed to moisture when the opening 800 is formed in the display.
- a buffer layer made of the same material as the thin-film encapsulation layer may be further provided on the thin-film encapsulation layer for planarization of the thin-film encapsulation layer.
- the sensor 700 may be disposed at least partially within the opening 800. Or the sensor 700 may be disposed under the opening, depending on the shape of the sensor 700.
- the sensor 700 may include one or more image sensors (e.g., a front sensor or a backside sensor) that pass through at least a portion of the opening 800 and face the transparent layer 150.
- the sensor 700 may include, for example, a lens, an image signal processor (ISP), or a flash (e.g., an LED or xenon lamp, etc.) as a device capable of capturing still images and moving images.
- ISP image signal processor
- flash e.g., an LED or xenon lamp, etc.
- one or more sponges 730 are mounted between the transparent layer 150 and the sensor 700 disposed below the transparent layer 150 to allow dust to enter the lens of the sensor 700 And it is desirable to be able to mitigate the impact applied to the sensor 700 from the outside.
- the display panel 100 of the display 10 includes a plurality of apertures 800 extending around the periphery of the aperture 800 as viewed from the transparent layer 150 so as not to optically block the apertures 800.
- the conductive wiring 500 may be disposed.
- FIG. 4 is a cross-sectional view of another example of an electronic device according to various embodiments.
- 1 is a sectional view taken along the line B-B 'in Fig. 1;
- the electronic device includes a transparent layer 150, a second adhesive layer 420, a polarizing layer 300, a touch screen panel 200 A third adhesive layer 430, a display panel 100, a first adhesive layer 410, and a sensor 700.
- Fig. 4 differs from the configuration disclosed in Fig. 3 described above only in the position at which the sensor 700 is mounted in the opening 800, so that a detailed description of the same components will be omitted.
- the opening 800 may be further extended through at least a portion of the first adhesive layer 410, the display panel 100, the third adhesive layer 430, and the touch screen panel 200 .
- the sensor 700 may be mounted in the aperture 800 penetrating to the touch screen panel 200.
- the aperture 800 extends further through the touch screen panel 200, but may not penetrate the polarization layer 300.
- a thin film encapsulation layer may be included at both ends of the opening 800 of the display panel 100.
- at least one sponge 730 is mounted between the thin film encapsulating layer formed on both ends of the display panel 100 and the sensor 700 to prevent dust from entering the lens of the sensor 700, It is preferable that the impact applied to the sensor 700 can be mitigated.
- the thin film encapsulation layer (140 in Fig. 5) is formed at both ends of the opening 800 of the display panel 100 as will be described later.
- the thin film encapsulation layer (140 in Fig. 5) is formed at both ends of the opening 800 of the display panel 100,
- One or more sponges 730 may be mounted without the layer (140 of FIG. 5) being formed.
- the aperture 800 may extend further through the polarizing layer 300 have.
- the structure of the display panel 100 of the display 10 for mounting the sensor 700 in the active area 220 will be described below.
- the direction in which the thin film encapsulation layer 140 is located is referred to as an upper portion and the direction in which the polymer layer 110 is disposed is referred to as a lower portion.
- Figure 5 is a cross-sectional view of a display panel 100 according to various embodiments.
- Figure 6 is a cross-sectional view of a display panel 100 according to various embodiments.
- the display panel 100 may include a display substrate layer, a thin film transistor (TFT) array 120, an organic light emitting layer 130, and a thin film encapsulation (TFE) ) Layer 140, as shown in FIG.
- TFT thin film transistor
- TFE thin film encapsulation
- the display substrate layer may be a base layer constituting the base of the display panel.
- the display substrate layer may be formed of a flexible polymer material, but is not limited thereto.
- the display substrate layer in this document may be referred to as a polymer layer 110.
- the aperture 800 for mounting the sensor 700 may include a display panel 100 May be formed to pass through.
- the openings 800 may be formed to penetrate the thin film encapsulation layer 140 of the display panel 100, the organic light emitting layer 130, the thin film transistor array 120, and the polymer layer 110.
- a sensor 700 may be mounted in the opening 800.
- the polymer layer 110 may be formed of a flexible material.
- the thin film transistor array 120 may be disposed on the polymer layer 110 and the first adhesive layer 410 shown in FIGS. 3 and 4 may be adhered to the lower portion of the polymer layer 110.
- the polymer layer 110 may comprise a first polymer layer and a second polymer layer disposed below the first polymer layer.
- the first polymer layer may be made of a polyimide material that is a flexible material.
- An organic light emitting layer 130 may be formed on the upper surface of the thin film transistor array 120 to form a plurality of pixels 132. Such a pixel 132 may comprise a subpixel. Each subpixel may be composed of a light emitting element.
- the light emitting device may include an organic light emitting diode including an organic material.
- the organic light emitting layer 130 is a layer that emits light by itself when electricity is supplied through the electrodes, and may be a fluorescent material such as red, green, and blue phosphors, Organic compounds.
- the organic light emitting layer 130 may not at least partially overlap the opening 800 when viewed from above the front portion of the housing 22 shown in FIG.
- the organic light emitting layer 130 may be deposited on the thin film transistor array 120, including a cathode electrode, an anode electrode, and an organic light emitting device.
- the organic light emitting layer 130 may be disposed toward the transparent layer 150 shown in FIG.
- the pixel 132 formed in the organic light emitting layer 130 may be vulnerable to external oxygen or moisture.
- the display 10 may include the thin film encapsulation layer 140 for blocking exposure of the pixels 132 and the organic light emitting layer 130 to external oxygen or moisture.
- a buffer layer may be further provided on the thin film encapsulation layer 140 to planarize the thin encapsulation layer 140.
- the thin film transistor array 120 may be a buffer layer.
- the buffer layer may prevent impurities from penetrating the polymer layer 110 and may provide a flat surface on top of the polymer layer 110.
- the thin film transistor array 120 which is a buffer layer, may be formed of various materials capable of providing a flat surface.
- the buffer layer may be formed of an inorganic material such as glass, synthetic resin (PET), silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum naphride, titanium oxide, titanium nitride, An organic substance such as polyvinyl alcohol, polyvinyl alcohol, polyvinyl alcohol, The buffer layer can be deposited by various deposition methods such as PECVD (plasma enhanced chemical vapor deposition), APCVD (atomospheric pressure CVD), LPCVD (low pressure CVD)
- PECVD plasma enhanced chemical vapor deposition
- APCVD atomospheric pressure CVD
- LPCVD low pressure CVD
- the thin film encapsulation layer 140 includes a first encapsulation part 140a formed on the organic light emitting layer 130 to cover the organic emission layer 130, a first encapsulation part 140a formed on the first encapsulation part 140a And a second sealing portion 140b extending from the first sealing portion 140a to the inside of the opening 800.
- the sealing member 142 may be formed inside the opening 800.
- the sealing member 142 may have an upper side end connected to the thin film encapsulation layer 140.
- the thin encapsulation layer 140 may include a plurality of layers. For example, a first layer formed on the organic light emitting layer 130 and a second layer formed on the first layer.
- the first layer may be made of an inorganic material and / or the organic material, and the second layer may be made of an inorganic material.
- the thin film encapsulation layer 140 may include at least one of an organic layer, an inorganic layer, an organic metal layer, and / or a silicate layer to cover the organic light emitting layer 130.
- the thin film sealing layer 140 can prevent the organic light emitting layer 130 from being oxidized by moisture and oxygen.
- the thin film sealing layer 140 may be a structure in which one or more organic layers and one or more inorganic layers are alternately repeatedly laminated.
- the uppermost layer may be formed of an inorganic layer to more effectively prevent moisture permeation to the organic light emitting layer 130.
- the organic layer may comprise a compound of aluminum tris 8-hydroxyquinoline, phthalocyanines, naphthalocyanines, polycyclic aromatics, or materials.
- the inorganic layer may comprise a laser induced fluorescence (LIF), magnesium fluoride (MgF2), calcium fluoride (CaF2), or a combination of materials.
- LIF laser induced fluorescence
- MgF2 magnesium fluoride
- CaF2 calcium fluoride
- the thin film encapsulation layer 140 may further include a functional layer in addition to at least one of an organic layer, an inorganic layer, an organic metal layer, and / or a silicate layer.
- the functional layer may comprise hardcoat layers, photoresist layers, antiglare layers, antireflective layers, impact protective coatings, and anti-smear / finger prints.
- the opening 800 for mounting the sensor 700 is formed on the organic light emitting layer 130 and the thin film transistor array 120
- the pixel 132 of the organic light emitting layer 130 and the thin film transistor array 120, the light emitting element or the electrodes may be exposed to the outside through the light emitting layer 130 and the inner wall of the thin film transistor array 120.
- a method for preventing the organic light emitting material contained in the organic light emitting layer 130 from being exposed to external moisture or oxygen may be considered.
- the display panel 100 may include a second encapsulant 140b extending into the interior of the opening 800.
- the second encapsulant 140b may include a first encapsulant 140a and a second encapsulant 140b. It can be understood that it is formed of the same material and extends from the first sealing portion 140a.
- the second sealing portion 140b may extend from the top of the opening 800 to the bottom as shown in FIG.
- the second sealing portion 140b may be formed of a film member formed on the inner surface of the opening 800.
- the second encapsulant 140b extends from the first encapsulant 140a to the inner side of the opening 800 and is formed to cover the inner wall of the organic light emitting layer 130 and the inner wall of the thin film transistor array 120 .
- the second encapsulant 140b may further extend along the lower side of the opening 800 to cover at least a part of the second encapsulant 140b of the polymer layer 110. [ Or it may be formed so as to cover the entire inner wall of each layer.
- the polymer layer 110 disposed outside the opening 800 may be covered by the second encapsulant 140b in which the thin encapsulation layer 140 is extended.
- the opening 800 may be formed to penetrate at least a portion of the organic light emitting layer 130, the thin film transistor array 120, and the polymer layer 110.
- the sensor 700 may be inserted through the first portion in the direction of the second portion.
- the first portion may be sealed by the transparent layer 150.
- the opening 800 may have a circular cross-sectional area, but is not limited thereto and may have various cross-sectional shapes.
- the present invention is not limited thereto.
- the sensor 700 and the second encapsulation unit 140b may be spaced apart from each other by a predetermined distance so that a predetermined space may be formed between the sensor 700 and the second encapsulation unit 140b.
- the sealing member 142 may be formed separately from the thin-film encapsulating layer 140.
- the sealing member 142 may be in the form of a membrane formed in the sidewall of the opening 800.
- the filler filling the gap between the sidewall of the opening 800 and the sensor 700.
- the filler may comprise a curable material such as an epoxy or a resin.
- the inner wall of the opening 800 may include a first portion formed in the polymer layer 110 and a second portion formed in the remaining inner wall.
- the sealing member 142 may be formed to cover at least a part of the second portion and the first portion. Or between the second portion and the sensor 700, and between at least a portion of the first portion and the sensor 700.
- the sensor 700 may include an insert 710 that is inserted into the opening 800 and a support 720 that extends from the insert 710. 5 and 6, the insert 710 can be formed in a diameter, size, or cross-sectional area that can be inserted into the opening 800 through the first portion.
- the support portion 720 may have a larger cross-sectional area than the insertion portion 710.
- the support portion 720 may be formed so as not to be inserted by the opening 800.
- the support portion 720 may be disposed outside the opening 800, unlike the insertion portion 710.
- the support portion 720 may be formed larger than the diameter or the cross-sectional area of the opening 800 and may not be inserted into the opening 800.
- the support portion 720 may be formed on the inner substrate of the electronic device 20 to support the insertion portion 710. Or 5 and 6, the support 720 may include a support surface 722 that is configured to contact at least a portion of the lower surface of the polymer layer 110. The support surface 722 may be formed to seal the first portion of the opening 800, i. E., The first portion, which is formed on the lower surface of the polymer layer 110.
- the second sealing portion 140b may be formed inside the opening 800. [ A portion of the second sealing portion 140b may be formed on the supporting surface 722 when the second sealing portion 140b extends to the region formed in the polymer layer 110. [ Alternatively, the second sealing portion 140b inside the opening 800 can be supported by the supporting surface 722. [
- the display 10 includes a first encapsulant 140a covering an upper surface of the organic light emitting layer 130 and a second encapsulant 140b covering the upper end of the first encapsulant 140a, And a second sealing portion 140b extending to the second sealing portion 140b.
- the second sealing portion 140b covers the organic light emitting layer 130 and the thin film transistor array 120, which are exposed to the outside through the opening 800, Damage and defects can be prevented and the service life can be prolonged.
- a thin film encapsulating layer 140 covering the organic light emitting layer 130 and a separate encapsulating member 142 formed in the opening may be formed on the organic light emitting layer 130, By covering the layer 130 and the thin film transistor array layer 120, it is possible to prevent damage and defects of the organic light emitting layer 130 and the display 10, and prolong the life.
- FIG. 7 is a cross-sectional view of a display panel 100 according to various embodiments.
- 8 is a cross-sectional view of a display panel 100 according to various embodiments.
- the display panel 100 includes a polymer layer 110 formed from the bottom side, a thin film transistor array 120 formed on the top surface of the polymer layer 110, a thin film transistor array 120 formed on the top surface of the thin film transistor array 120, An organic light emitting layer 130 formed on the organic light emitting layer 130, and a thin film sealing layer 140 formed on the organic light emitting layer 130.
- the opening 800 for mounting the sensor 700 is formed to pass through the organic light emitting layer 130, the thin film transistor array 120 and the polymer layer 110, 700, a filler 144, or a blocking layer 148 may be disposed.
- the filler 144 may comprise an epoxy, a resin, or the like.
- the organic light emitting layer 130, the thin film transistor array 120, the opening 800, and the sensor 700 are the same as those described above and will not be described here.
- the thin film encapsulation layer 140 may be formed on the upper surface of the organic light emitting layer 130 and may include a sealing member 142 disposed inside the opening 800. At this time, the sealing member 142 may include a filler 144 or a blocking film 148.
- the thin film encapsulation layer 140 of the display 10 shown in FIGS. 7 and 8 may be formed so as to cover at least a part of the organic light emitting layer 130.
- the thin film encapsulation layer 140 may be referred to as a thin film encapsulation layer or a thin film encapsulation film.
- the thin film encapsulation layer 140 may not be formed in a region adjacent to the opening 800 of the organic light emitting layer 130.
- the organic light emitting layer 130 may include an encapsulation region sealed by the thin film encapsulation layer 140 and an encapsulation region not encapsulated by the thin encapsulation layer.
- the exposed area may refer to an area extending from the sealing area toward the center of the opening 800.
- the exposed region may include a first stepped surface 134 formed on the upper surface of the organic light emitting layer 130 and an inner wall of the organic light emitting layer 130 formed by the opening 800.
- the exposed region of the organic light emitting layer 130 may be exposed to external oxygen or moisture.
- the inner wall of the organic light emitting layer 130 may be exposed to external oxygen or moisture by the cross section of the opening 800 passing through the organic light emitting layer 130.
- the embodiment shown in Figs. 7 and 8 may include a sealing member 142 formed inside the hole.
- the sealing member 142 may include a filler 144 or a blocking film 148.
- a filler 144 may be formed within the opening 800.
- the filler 144 may be disposed between the inner surface of the opening 800 and the sensor 700 disposed within the opening 800.
- the filler 144 may be filled into the opening 800.
- the support surface 722 of the sensor 700 may be formed in a second portion of the opening 800 and the filler 144 received within the opening 800 may be supported by the support surface.
- the opening 800 may include a first stepped portion including a first stepped surface 134 formed by the organic light emitting layer 130 and the thin film sealing layer 140.
- the thin film encapsulation layer 140 and the organic light emitting layer 130 may be formed in a stepped manner since the thin encapsulation layer 140 is not formed in the exposed region formed in the organic light emitting layer 130.
- the first stepped surface 134 and the inner wall of the organic light emitting layer 130 can be exposed to external oxygen and moisture. Therefore, it may include a blocking film 148 formed to cover the exposed region.
- the blocking layer 148 may be formed of a film member containing a metal and / or an inorganic material.
- the blocking layer 148 may be formed to cover at least the first stepped surface 134 in which the thin film encapsulating layer 140 is not formed and the inner wall of the organic light emitting layer 130 in the upper surface of the organic light emitting layer 130 .
- a barrier layer 148 may extend further down the opening 800 to an opening 800 formed in the polymer layer 110.
- the display 10 may include a moisture barrier member 146 disposed on top of the sensor 700.
- the moisture barrier member 146 may prevent the moisture introduced through the transparent layer 150 from penetrating into the organic light emitting layer 130.
- the moisture barrier member 146 may be formed to be transparent and to cover the top of the sensor 700.
- the moisture blocking member 146 may extend further from the upper portion of the sensor 700 in the radial direction of the sensor 700, and cover the entire upper side of the opening 800.
- the organic light emitting layer 130 may further extend on the first stepped surface 134 formed on the organic light emitting layer 130 or on the blocking film 148 formed on the first stepped surface 134.
- the moisture blocking member 146 may be formed opaque, and an air layer may be formed inside the moisture blocking member 146, or a transparent member may be filled.
- FIG. 9 is a cross-sectional view of a display panel 100 according to various embodiments.
- 10 is a cross-sectional view of a display panel 100 according to various embodiments.
- the opening 800 may include at least one step.
- the first step portion may be formed by the organic light emitting layer 130 and the thin film encapsulation layer 140.
- the first stepped portion may include a first stepped surface 134 and the first stepped surface 134 may be formed toward the front portion of the housing 22.
- a second step may be formed in the polymer layer 110.
- the polymer layer 110 may include protrusions, some of which protrude toward the center of the opening 800. These protrusions may include a lower surface of the polymer layer 110.
- the second step may include a second stepped surface 112 formed on the protrusion and the second stepped surface 112 may be formed toward the front surface of the housing 22.
- the thin-film encapsulation layer 140 may be disposed on the organic light-emitting layer 130.
- a sealing member 142 may be formed inside the opening 800.
- the sealing member 142 may include a filler 144 or a blocking film 148.
- a blocking film 148 may be formed on the first step portion.
- the blocking layer 148 may be formed to cover the first stepped surface 134, the inner wall of the organic light emitting layer 130, and the inner wall of the thin film transistor array 120.
- the blocking layer 148 may extend further downward along the inner side of the opening 800 to cover at least a portion of the inner wall of the polymer layer 110.
- a filler 144 may be disposed within the opening 800. Filler 144 may fill the interior of opening 800.
- the support surface 722 formed in the support portion 720 of the sensor 700 is formed in the second portion of the opening 800 and can support the filler 144 inside the opening 800 from the lower side.
- Figure 11 illustrates a method of manufacturing the display 10 according to various embodiments.
- grooves 101 may be formed in the polymer layer 110.
- the groove 101 can be formed by using a laser such as laser etching or laser cutting.
- the grooves 101 may be formed in a part of the polymer layer 110 corresponding to the area where the sensor 700 is to be mounted.
- the thin film transistor array 120 can be stacked on the polymer layer 110.
- the thin film transistor array 120 may be formed with holes corresponding to the grooves 101 formed in the polymer layer 110.
- a plurality of pixels 132 may be arranged on the upper surface of the thin film transistor array 120.
- the plurality of pixels 132 may be composed of various kinds of light emitting devices including OLED elements.
- the organic light emitting layer 130 may be stacked on one side of the thin film transistor array 120.
- the organic light emitting layer 130 may have openings corresponding to the grooves 101 formed in the polymer layer 110 in the same manner as the thin film transistor array 120.
- the organic light emitting layer 130 may include a cathode element that is electrically connected to the pixel 132.
- the thin film encapsulation layer 140 may be formed on the top surface of the organic light emitting layer 130.
- the thin film encapsulation layer 140 may be formed to cover a part of the organic light emitting layer 130.
- the thin film encapsulation layer 140 may not be formed on the upper surface of the organic light emitting layer 130 in a region adjacent to the hole.
- a first stepped portion including a first stepped surface 134 formed to face the upper side may be formed in the organic light emitting layer 130.
- a sensor mounting hole 800 for mounting the sensor 700 on the polymer layer 110 may be formed.
- the sensor mounting hole 800 can be formed by laser cutting in the same manner as the groove 101 is formed in the polymer layer 110.
- a second stepped portion including the second stepped surface 112 may be formed.
- the second stepped surface 112 may be formed to face the front surface of the housing, which is the upper side, like the first stepped surface 134.
- the foreign substance 305 generated from the polymer layer 110 may be scattered.
- the first step can prevent such foreign matter 305 from being scattered to the active region.
- the foreign matter 305 can be left on the second step face 112 without being scattered to the active region.
- the senor 700 can be mounted on the sensor mounting hole 800. A portion of the sensor 700 may be inserted into the sensor mounting hole 800 and the remainder may be located outside the sensor mounting hole 800.
- the sensor 700 is inserted and the filler 144 is injected into the holes formed in the groove 101 formed in the sensor mounting hole 800 and the polymer layer 110 and the thin film transistor array 120 and the organic light emitting layer 130 Can be filled.
- the filler 144 may prevent the organic light emitting layer 130 and the thin film transistor array 120, which are exposed to the outside, from being exposed to oxygen and moisture.
- the moisture barrier member 146 may be disposed on the top surface of the sensor 700. [ The moisture blocking member 146 can block the path through which the moisture is permeated.
- the display 10 In the case of manufacturing the display 10 as described above, it is possible to prevent foreign matter 305 generated during cutting of the sensor mounting hole 800 from being scattered to the active region. Even when the sensor 700 is mounted on the display 10, the display 10 and the electronic device can be provided without defect in the active area.
- the filler 144 is disposed in the sensor mounting hole 800, and the moisture shielding member 146 is disposed on the sensor 700, whereby the highly reliable display 10 and the electronic device with a low defect ratio can be provided.
- FIG. 12 is a block diagram of an electronic device 1201 in a network environment 1200, in accordance with various embodiments. 12, in the network environment 1200, the electronic device 1201 communicates with the electronic device 1202 via a first network 1298 (e.g., a short-range wireless communication network) (E. G., A < / RTI > long-range wireless communication network) to communicate with electronic device 1204 or server 1208. According to one embodiment, the electronic device 1201 may communicate with the electronic device 1204 through the server 1208.
- a first network 1298 e.g., a short-range wireless communication network
- E. G., A < / RTI > long-range wireless communication network e.g., a short-range wireless communication network
- the electronic device 1201 may communicate with the electronic device 1204 through the server 1208.
- the electronic device 1201 includes a processor 1220, a memory 1230, an input device 1250, an acoustic output device 1255, a display device 1260, an audio module 1270, a sensor module 1276, an interface 1277, a haptic module 1279, a camera module 1280, a power management module 1288, a battery 1289, a communication module 1290, a subscriber identity module 1296, ).
- at least one of these components e.g., display 1260 or camera module 1280
- some of these components may be implemented as a single integrated circuit.
- a sensor module 1276 e.g., a fingerprint sensor, iris sensor, or illuminance sensor
- the display device 1260 e.g., a display
- Processor 1220 may be configured to execute at least one other component (e.g., hardware or software component) of an electronic device 1201 connected to processor 1220 by executing software (e.g., program 1240) And can perform various data processing or arithmetic operations.
- the processor 1220 may provide instructions or data received from other components (e.g., the sensor module 1276 or the communication module 1290) to the volatile memory 1232, And may process instructions or data stored in volatile memory 1232 and store the resulting data in nonvolatile memory 1234.
- processor 1220 includes a main processor 1221 (e.g., a central processing unit or application processor), and a secondary processor 1223 (e.g., a graphics processing unit, an image signal processor , A sensor hub processor, or a communications processor). Additionally or alternatively, the coprocessor 1223 may use less power than the main processor 1221, or it may be set to be specific to the specified function. The coprocessor 1223 may be implemented separately from, or as part of, the main processor 1221.
- main processor 1221 e.g., a central processing unit or application processor
- secondary processor 1223 e.g., a graphics processing unit, an image signal processor , A sensor hub processor, or a communications processor.
- the coprocessor 1223 may use less power than the main processor 1221, or it may be set to be specific to the specified function.
- the coprocessor 1223 may be implemented separately from, or as part of, the main processor 1221.
- the secondary processor 1223 e.g., an image signal processor or communications processor
- Memory 1230 may store various data used by at least one component (e.g., processor 1220 or sensor module 1276) of electronic device 1201.
- the data may include, for example, input data or output data for software (e.g., program 1240) and associated instructions.
- Memory 1230 may include volatile memory 1232 or non-volatile memory 1234.
- the program 1240 may be stored as software in the memory 1230 and may include, for example, an operating system 1242, middleware 1244 or application 1246. [
- the input device 1250 may receive commands or data to be used for components (e.g., processor 1220) of the electronic device 1201 from the outside (e.g., a user) of the electronic device 1201.
- the input device 1250 may include, for example, a microphone, a mouse, or a keyboard.
- the sound output device 1255 can output the sound signal to the outside of the electronic device 1201.
- the sound output device 1255 may include, for example, a speaker or a receiver.
- Speakers can be used for general purposes, such as multimedia playback or record playback, and receivers can be used to receive incoming calls.
- the receiver may be implemented separately from the speaker, or as part thereof.
- Display device 1260 can visually provide information to an external (e.g., user) electronic device 1201.
- Display device 1260 may include, for example, a display, a hologram device, or a projector and control circuitry for controlling the device.
- the display device 1260 can include a touch circuitry configured to sense a touch, or a sensor circuit (e.g., a pressure sensor) configured to measure the strength of a force generated by the touch have.
- the audio module 1270 may convert the sound to an electrical signal, or vice versa. According to one embodiment, the audio module 1270 may acquire sound through an input device 1250, or may be connected to an audio output device 1255, or to an external electronic device (e.g., Electronic device 1202) (e.g., a speaker or headphone)).
- an external electronic device e.g., Electronic device 1202 (e.g., a speaker or headphone)
- the sensor module 1276 senses the operating state (e.g., power or temperature) of the electronic device 1201 or an external environmental condition (e.g., a user state) and generates an electrical signal or data value corresponding to the sensed condition can do.
- the sensor module 1276 may be a gesture sensor, a gyroscope, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared sensor, A temperature sensor, a humidity sensor, or an illuminance sensor.
- the interface 1277 may support one or more designated protocols that may be used by the electronic device 1201 to connect directly or wirelessly with an external electronic device (e.g., the electronic device 1202).
- the interface 1277 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
- HDMI high definition multimedia interface
- USB universal serial bus
- SD card interface Secure Digital Card
- connection terminal 1278 may include a connector through which the electronic device 1201 may be physically connected to an external electronic device (e.g., electronic device 1202).
- the connection terminal 1278 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
- the haptic module 1279 can convert an electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that the user can perceive through a tactile or kinesthetic sense.
- the haptic module 1279 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
- the camera module 1280 can capture a still image and a moving image.
- the camera module 1280 may include one or more lenses, image sensors, image signal processors, or flashes.
- the power management module 1288 may manage the power supplied to the electronic device 1201.
- the power management module 388 may be implemented as at least a portion of, for example, a power management integrated circuit (PMIC).
- PMIC power management integrated circuit
- the battery 1289 may provide power to at least one component of the electronic device 1201.
- the battery 1289 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
- Communication module 1290 may be a direct (e.g., wired) communication channel between an electronic device 1201 and an external electronic device (e.g., electronic device 1202, electronic device 1204, or server 1208) Establishment, and communication through the established communication channel.
- Communication module 1290 may include one or more communication processors that operate independently from processor 1220 (e.g., an application processor) and that support direct (e.g., wired) or wireless communication.
- communication module 1290 includes a wireless communication module 1292 (e.g., a cellular communication module, a short range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1294 : A local area network (LAN) communication module, or a power line communication module).
- GNSS global navigation satellite system
- a corresponding one of these communication modules may be a first network 1298 (e.g., a short distance communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 1299 (e.g., (E.g., a telecommunications network, such as a computer network (e.g., a LAN or WAN)).
- first network 1298 e.g., a short distance communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)
- a second network 1299 e.g., (E.g., a telecommunications network, such as a computer network (e.g., a LAN or WAN)).
- These various types of communication modules may be integrated into one component (e.g., a single chip) or a plurality of components (e.g., a plurality of chips) that are separate from each other.
- the wireless communication module 1292 may communicate with the subscriber identity module 1296 in a communication network such as the first network 1298 or the second network 1299 using subscriber information (e.g., International Mobile Subscriber Identity (IMSI)
- subscriber information e.g., International Mobile Subscriber Identity (IMSI)
- IMSI International Mobile Subscriber Identity
- An antenna module 1297 can transmit signals or power to the outside (e.g., an external electronic device) or receive it from the outside.
- the antenna module 1297 may include one or more antennas from which at least one antenna suitable for a communication scheme used in a communication network, such as the first network 1298 or the second network 1299, For example, be selected by the communication module 1290.
- a signal or power may be transmitted or received between the communication module 1290 and the external electronic device via the selected at least one antenna.
- At least some of the components are connected to each other via a communication method (e.g., bus, general purpose input and output, SPI, or mobile industry processor interface (MIPI) For example, commands or data).
- a communication method e.g., bus, general purpose input and output, SPI, or mobile industry processor interface (MIPI)
- MIPI mobile industry processor interface
- the command or data may be transmitted or received between the electronic device 1201 and the external electronic device 1204 via the server 1208 connected to the second network 1299.
- Each of the electronic devices 1202 and 1204 may be the same or a different type of device as the electronic device 1201.
- all or a portion of the operations performed on the electronic device 1201 may be performed on one or more external devices of the external electronic devices 1202, 1204, or 1208.
- electronic device 1201 may perform a function or service on behalf of itself Or in addition, to one or more external electronic devices to perform the function or at least part of the service.
- the one or more external electronic devices that have received the request may execute at least a portion of the requested function or service, or an additional function or service associated with the request, and deliver the result of the execution to the electronic device 1201.
- the electronic device 1201 may process the result as is or in addition to provide at least a portion of the response to the request.
- cloud computing distributed computing, or client- Can be used.
- the display device 1260 may include a display 1310 and a display driver IC (DDI) 1330 for controlling the same.
- the DDI 1330 may include an interface module 1331, a memory 1333 (e.g., a buffer memory), an image processing module 1335, or a mapping module 1337.
- the DDI 1330 receives image data including image data or image control signals corresponding to commands for controlling the image data from other components of the electronic device 1201 via the interface module 1331 can do.
- the image information may be provided to a processor 1220 (e.g., a main processor 1221 (e.g., an application processor) or a secondary processor 1223
- the DDI 1330 may communicate with the touch circuit 1350 or the sensor module 1276 through the interface module 1331.
- the DDI 1330 may also be connected to the interface module 1331 via the interface module 1331.
- At least a portion of the received image information may be stored in the memory 1333, for example, on a frame-by-frame basis.
- the image processing module 1335 may, for example, (E.g., resolution, brightness, or scaling) based at least on the characteristics of the display 1310.
- the mapping module 1337 may perform pre-processing or post-processingThe generation of a voltage value or a current value may be performed by, for example, changing the attributes of the pixels of the display 1310 (e.g., the arrangement of pixels (E.g., RGB stripe or pentile structure), or the size of each of the subpixels). At least some of the pixels of display 1310 may be, for example, based at least in part on the voltage value or current value Visual information (e.g., text, images, or icons) corresponding to the image data can be displayed through the display 1310 by being driven.
- Visual information e.g., text, images, or icons
- the display device 1260 may further include a touch circuit 1350.
- the touch circuit 1350 may include a touch sensor 1351 and a touch sensor IC 1353 for controlling the touch sensor 1351.
- the touch sensor IC 1353 may control the touch sensor 1351, for example, to sense a touch input or a hovering input to a specific position of the display 1310.
- the touch sensor IC 1353 may sense a touch input or a hovering input by measuring a change in a signal (e.g., voltage, light amount, resistance, or charge amount) for a particular position of the display 1310.
- the touch sensor IC 1353 may provide the processor 1220 with information (e.g., position, area, pressure, or time) about the sensed touch input or hovering input.
- touch circuitry 1350 may be disposed in display driver IC 1330, or as part of display 1310, or external to display device 1260 (E. G., The coprocessor 1223). ≪ / RTI >
- the display device 1260 may further include at least one sensor (e.g., a fingerprint sensor, iris sensor, pressure sensor or illuminance sensor) of the sensor module 1276, or control circuitry therefor.
- the at least one sensor or control circuitry thereof may be embedded in a portion of display device 1260 (e.g., display 1310 or DDI 1330) or a portion of touch circuitry 1350.
- the sensor module 1276 embedded in the display device 1260 includes a biosensor (e.g., a fingerprint sensor)
- the biosensor displays biometric information associated with the touch input through a portion of the display 1310 (E.g., a fingerprint image).
- the pressure sensor may obtain pressure information associated with the touch input through some or all of the area of the display 1310 .
- the touch sensor 1351 or the sensor module 1276 may be disposed between pixels of the pixel layer of the display 1310, or above or below the pixel layer.
- the electronic device can be various types of devices.
- An electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
- a portable communication device e.g., a smart phone
- a computer device e.g., a laptop, a desktop, a tablet, or a portable multimedia device
- portable medical device e.g., a portable medical device
- camera e.g., a camera
- a wearable device e.g., a smart watch
- a home appliance e.g., a smart bracelet
- any (e.g., first) component may be referred to as being “coupled” or “connected” to another (eg, second) component, with or without the term “functionally”
- any (e.g., first) component may be referred to as being “coupled” or “connected” to another (eg, second) component, with or without the term “functionally”
- module may include units implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic blocks, components, or circuits.
- a module may be an integrally constructed component or a minimum unit of the component or part thereof that performs one or more functions.
- the module may be implemented in the form of an application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- Various embodiments of the present document may include one or more instructions stored in a storage medium (e.g., internal memory 1236 or external memory 1238) readable by a machine (e.g., electronic device 1201) (E. G., Program 1240). ≪ / RTI >
- a processor e.g., processor 1220 of a device (e.g., electronic device 1201) may invoke and execute at least one of the stored one or more instructions from a storage medium. This enables the device to be operated to perform at least one function in accordance with the at least one command being called.
- the one or more instructions may include code generated by the compiler or code that may be executed by the interpreter.
- a device-readable storage medium may be provided in the form of a non-transitory storage medium.
- 'non-transient' means that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), which means that data is permanently stored in the storage medium Do not distinguish between cases where they are temporarily stored.
- a method according to various embodiments disclosed herein may be provided in a computer program product.
- a computer program product can be traded between a seller and a buyer as a product.
- the computer program product may be distributed in the form of a machine readable storage medium (e.g., compact disc read only memory (CD-ROM)), or via an application store (e.g. PlayStore TM ) For example, smartphones), directly or online (e.g., downloaded or uploaded).
- an application store e.g. PlayStore TM
- smartphones e.g., smartphones
- online e.g., downloaded or uploaded.
- at least a portion of the computer program product may be temporarily stored, or temporarily created, on a storage medium readable by a machine, such as a manufacturer's server, a server of an application store, or a memory of a relay server.
- each component e.g., a module or program of the components described above may include one or more entities.
- one or more of the above-described components or operations may be omitted, or one or more other components or operations may be added.
- a plurality of components e.g., modules or programs
- the integrated component may perform one or more functions of each component of each of the plurality of components in a manner similar or similar to that performed by the corresponding one of the plurality of components prior to the integration .
- operations performed by a module, program, or other component may be performed sequentially, in parallel, repetitively, or heuristically, or one or more of the operations may be performed in a different order, Or one or more other operations may be added.
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Abstract
Description
Claims (15)
- 디스플레이에 있어서,디스플레이 기판 층;상기 디스플레이 기판 층 상에 형성되고, 복수개의 픽셀을 포함하는 유기 발광 층;상기 디스플레이 기판 층과 상기 유기 발광 층 사이에 배치되고, 상기 픽셀과 전기적으로 연결된 복수개의 박막 트랜지스터들을 포함하는 박막 트랜지스터 어레이 층;상기 유기 발광 층의 적어도 일부 위에 형성된 박막 봉지 층;상기 유기 발광 층, 상기 박막 트랜지스터 어레이 층 및 상기 디스플레이 기판 층을 관통하도록 형성되는 개구와, 상기 개구의 내부에 배치되는 센서를 포함하는 센서 장착부; 및상기 유기 발광 층 및 상기 박막 트랜지스터 어레이 층이 상기 개구의 내측벽을 통해 외부로 노출되는 것을 방지하기 위해, 상기 개구에 형성되는 밀봉 부재;를 포함하고,상기 개구는 디스플레이 기판 층에 형성되는 제 1 부분과 나머지에 형성되는 제 2 부분으로 이루어지고,상기 밀봉 부재는 상기 제 2 부분과 상기 제 1 부분의 적어도 일부에 형성되는 디스플레이.
- 청구항 1에 있어서,상기 밀봉 부재는 상기 개구의 내측벽과 상기 센서 사이에 채워지는 충전제를 포함하고, 상기 충전제는 에폭시 및/또는 레진을 포함하는 디스플레이.
- 청구항 1에 있어서,상기 유기 발광 층은 상기 박막 봉지 층이 형성되는 봉지 영역과, 상기 봉지 영역으로부터 상기 개구의 중심 방향으로 연장되는 노출 영역을 포함하고,상기 밀봉 부재는 상기 노출 영역을 덮도록 형성되는 차단막을 포함하는 디스플레이,
- 청구항 3에 있어서,상기 노출 영역은, 상기 유기 발광 층의 일면에 형성되는 제 1 단차면과, 상기 개구에 의해 형성되는 상기 유기 발광 층의 내측벽을 포함하고, 상기 차단막은 무기물 및/또는 금속 소재로 이루어지는 디스플레이.
- 청구항 1에 있어서,상기 박막 봉지 층은, 유기 발광 층 상에 형성되는 제 1 층과 상기 제 1 층 상에 형성되는 제 2 층을 포함하고,상기 제 1 층은 유기물 및/또는 무기물 재질로 이루어지고, 상기 제 2 층은 무기물 재질로 이루어지는 디스플레이.
- 청구항 1에 있어서,상기 디스플레이 기판 층은, 폴리이미드를 포함하는 폴리머 층으로 형성되는 디스플레이.
- 청구항 1에 있어서,상기 밀봉 부재는, 상기 박막 봉지 층과 연결되는 디스플레이.
- 청구항 1에 있어서,상기 밀봉 부재는, 상기 박막 봉지 층으로부터 연장 형성되는 디스플레이.
- 청구항 8에 있어서,상기 밀봉 부재와 상기 박막 봉지 층은 동일한 재질로 이루어지는 디스플레이.
- 청구항 9에 있어서,상기 밀봉 부재는,상기 유기 발광 층 및 상기 박막 트랜지스터 어레이 층에 의해 형성된 상기 개구의 내측벽의 나머지 일부를 더 덮는 디스플레이.
- 청구항 1에 있어서,상기 센서는 카메라를 포함하는 디스플레이.
- 청구항 1에 있어서,상기 센서가 습기에 노출되는 것을 차단하기 위하여, 상기 센서 위에 배치되는 습기 차단 부재(moisture barrier)를 포함하는 디스플레이.
- 청구항 12에 있어서,상기 습기 차단 부재는, 상기 센서의 외측 방향으로 연장되어 상기 박막 봉지 층과 연결되는 디스플레이.
- 디스플레이에 있어서,디스플레이 기판 층;상기 디스플레이 기판 층 위에(over) 형성되고, 복수개의 픽셀들을 포함하는 유기 발광 층;상기 디스플레이 기판 층과 상기 유기 발광 층 사이에 배치되고, 상기 픽셀과 전기적으로 연결된 복수개의 박막 트랜지스터들을 포함하는 박막 트렌지스터 어레이 층;상기 유기 발광 층 위에(over) 형성된 박막 봉지 층; 및상기 디스플레이 기판 층, 상기 유기 발광 층, 및 상기 박막 트랜지스터 어레이 층을 관통하는 개구가 형성되고, 상기 개구의 내측벽(inner side wall) 중 상기 디스플레이 기판 층에 의해 형성된 일부 측벽의 적어도 일부를 포함하는 상기 개구의 내측벽의 적어도 일부를 덮는 밀봉 부재(sealing member)를 포함하는 디스플레이.
- 청구항 14에 있어서,적어도 일부가 상기 개구 내부에 배치되거나, 또는 상기 개구 아래에 배치되는 센서를 하나 이상 더 포함하고,상기 밀봉 부재는 상기 개구와 상기 센서 사이에 형성되는 디스플레이.
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CN201980009290.7A CN111630831B (zh) | 2018-01-23 | 2019-01-23 | 包括用于安装传感器的开口的显示器 |
US16/961,831 US11482692B2 (en) | 2018-01-23 | 2019-01-23 | Display including opening for mounting sensor |
EP19743306.3A EP3720103A4 (en) | 2018-01-23 | 2019-01-23 | DISPLAY WITH OPENING FOR SENSOR MOUNTING |
AU2019210937A AU2019210937B2 (en) | 2018-01-23 | 2019-01-23 | Display including opening for mounting sensor |
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KR1020180008286A KR102443229B1 (ko) | 2018-01-23 | 2018-01-23 | 센서를 장착하기 위한 개구를 포함하는 디스플레이 |
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Also Published As
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US20210083227A1 (en) | 2021-03-18 |
AU2019210937A1 (en) | 2020-07-23 |
EP3720103A4 (en) | 2021-05-05 |
US11482692B2 (en) | 2022-10-25 |
EP3720103A1 (en) | 2020-10-07 |
AU2019210937B2 (en) | 2021-04-29 |
CN111630831B (zh) | 2023-08-15 |
KR102443229B1 (ko) | 2022-09-15 |
CN111630831A (zh) | 2020-09-04 |
KR20190089578A (ko) | 2019-07-31 |
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