WO2014148585A1 - Commutateur thermique, structure de réglage de température, et bloc de batteries - Google Patents

Commutateur thermique, structure de réglage de température, et bloc de batteries Download PDF

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Publication number
WO2014148585A1
WO2014148585A1 PCT/JP2014/057627 JP2014057627W WO2014148585A1 WO 2014148585 A1 WO2014148585 A1 WO 2014148585A1 JP 2014057627 W JP2014057627 W JP 2014057627W WO 2014148585 A1 WO2014148585 A1 WO 2014148585A1
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WO
WIPO (PCT)
Prior art keywords
temperature
heat
thermal switch
protective layer
layer
Prior art date
Application number
PCT/JP2014/057627
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English (en)
Japanese (ja)
Inventor
拓 西垣
崇弘 冨田
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日本碍子株式会社
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Publication date
Application filed by 日本碍子株式会社 filed Critical 日本碍子株式会社
Priority to JP2015506841A priority Critical patent/JPWO2014148585A1/ja
Publication of WO2014148585A1 publication Critical patent/WO2014148585A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/615—Heating or keeping warm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/63—Control systems
    • H01M10/637—Control systems characterised by the use of reversible temperature-sensitive devices, e.g. NTC, PTC or bimetal devices; characterised by control of the internal current flowing through the cells, e.g. by switching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/64—Heating or cooling; Temperature control characterised by the shape of the cells
    • H01M10/647—Prismatic or flat cells, e.g. pouch cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • ⁇ It relates to a thermal switch whose heat transfer performance changes depending on the temperature, a temperature adjustment structure provided with the switch, and a battery pack.
  • Heat may or may not be needed.
  • a battery battery pack mounted on an EV has high resistance when the temperature of the battery is low, heat insulation is required when the temperature is low, and there is concern about ignition due to decomposition of the electrolyte when the temperature is too high. Therefore, heat dissipation is required when the temperature is high. Therefore, it is thought that if there is a technology for controlling the flow of heat, it will lead to effective use of heat.
  • Patent Document 1 an element that switches thermal conductivity by applying energy (magnetic field, electric field, light, etc.) to a transition body sandwiched between electrodes, a substrate 1 and a carbon nanotube layer
  • the switch which switches the connection state which the base material 2 which it has contacts, and the non-connection state which does not contact is disclosed.
  • Patent Document 1 an electrode, wiring, and the like are necessary to switch by applying energy. Moreover, in patent document 2, components other than what itself changes in thermal conductivity are required, and an actuator is provided to change the contact state. Therefore, the switch becomes large and the mounting location is limited from the viewpoint of heat resistance. Moreover, it is difficult to manufacture a complicated shape.
  • An object of the present invention is to provide a heat switch having a simple structure capable of changing the heat transfer performance depending on the temperature, a temperature adjustment structure including the heat switch, and a battery pack.
  • the present inventors have found that the above problem can be solved by providing a thermal switch having a radiation layer whose emissivity changes when the temperature changes. That is, according to the present invention, the following thermal switch, a temperature adjustment structure including the same, and a battery pack are provided.
  • the radiation layer is formed of any one of an emissivity variable element, a Mott insulator, a metal-semiconductor phase transition material, and a metal-insulator phase transition material.
  • the thermal switch according to any one of [1] to [7] is provided around a heat generation source that generates heat, and heat is dissipated between a first temperature and a second temperature that is higher or lower than the first temperature.
  • the temperature adjustment structure which adjusts the temperature by the said heat from the said heat generation source by changing.
  • the thermal switch of the present invention operates as a thermal switch having low heat transfer performance at low temperatures and a heat insulation effect, and high heat transfer performance at high temperatures and a heat dissipation effect. Or, conversely, it operates as a heat switch having a high heat transfer performance at a low temperature and a heat dissipation effect, and having a low heat transfer performance and a heat insulation effect at a high temperature.
  • the heat transfer performance changes due to changes in ambient temperature, it becomes a self-supporting thermal switch where the heat transfer performance is switched on (high heat transfer performance) or OFF (low heat transfer performance).
  • the mountability is high and the degree of freedom in shape is high.
  • a battery pack having a temperature control structure equipped with this thermal switch, for example, a battery pack, can effectively use internal heat and improve its function.
  • FIG. 1 shows an embodiment of a cross section of the thermal switch 1.
  • the left diagram of FIG. 1 schematically shows the emissivity when the temperature is low, and the right diagram schematically shows the emissivity when the temperature is high.
  • the thermal switch 1 is bonded to the first protective layer 2 for receiving heat, the radiation layer 4 whose emissivity changes when the temperature changes, and the radiation switch 4 and the gap 5.
  • the second protective layer 3 is disposed opposite to the radiation layer 4 and receives heat from the radiation layer 4. Since the emissivity of the radiating layer 4 changes as the temperature changes, the heat switch 1 that increases the emissivity when the temperature rises. When the temperature is low, the heat from the first protective layer 2 is reduced.
  • the thermal switch 1 Since the thermal switch 1 does not require parts such as a drive unit, it can be miniaturized. Therefore, it is highly mountable and has a high degree of freedom in shape.
  • Fig. 2 shows the temperature dependence of the emissivity of the radiation layer 4.
  • the emissivity of the radiation layer 4 changes with temperature, the heat transfer performance of the entire thermal switch 1 changes suddenly and reversibly, and the operation of the thermal switch 1 is switched according to temperature. Functions as a switch. It is preferable that the emissivity of the radiation layer 4 changes stepwise depending on the temperature.
  • the emissivity of the radiation layer 4 is preferably changed by 0.2 or more when the temperature rises (or falls) from the first temperature to the second temperature.
  • the difference between the emissivity at the first temperature immediately before the emissivity increases (or decreases) and the emissivity at the second temperature immediately after the increase (or decreases) is 0.2 or more, more preferably 0.3 or more, Preferably, it varies by 0.4 or more.
  • 1st temperature and 2nd temperature are not specifically limited, In what has a temperature adjustment structure provided with the thermal switch 1, it has a temperature adjustment structure by changing a heat dissipation state and adjusting temperature. Preferably, the emissivity changes abruptly between the first temperature and the second temperature so that the function of the object can be improved.
  • the temperature difference between the first temperature and the second temperature is preferably small, and the temperature difference is preferably 0.1 to 100 ° C., and preferably 0.1 to 50 ° C. Is more preferable.
  • the heat transfer performance of the entire thermal switch 1 is low because the emissivity is low below the first temperature, and it can be said to be in an OFF state.
  • the second temperature or higher since the emissivity is high, the heat transfer performance of the entire thermal switch 1 is high, and it can be said to be in an ON state.
  • the radiation layer 4 having a first temperature of ⁇ 10 to 20 ° C. and a second temperature of 30 to 60 ° C.
  • the radiation layer 4 is made of a variable emissivity element, a Mott insulator, a metal-semiconductor phase transition material, a metal-insulator phase transition material, or the like. Those composed mainly of oxides of transition metals and having a perovskite structure are particularly desirable.
  • ReNiO 3 Re is a rare earth element
  • M1 (1- (x + y)) M2 x M3 y MnO 3 M1 is La, Pr, Sc, In, Nd or Sm, and M2 is alkaline earth
  • M3 is an alkaline earth metal that is not the same as M2, 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1), La 1-xy Sr x Ca y MnO 3 (0 ⁇ x ⁇ 1, 0 ⁇ y) ⁇ 1), Ca 2 Ru 1-x M x O 4 (M is Mn or Fe, 0 ⁇ x ⁇ 1), VO 2 and the like.
  • Transition metal oxides are materials whose emissivity changes at a specific temperature range. Although it is necessary to select the temperature in the temperature region and its temperature range depending on the application, the temperature range is preferably 100 ° C. or less. For example, when used for a battery pack member, the temperature range is preferably 0 ° C. to 50 ° C. Further, it is necessary to select an appropriate change width of the emissivity depending on the application, but the change width of the emissivity is preferably 0.2 or more. For example, when used for a battery pack, it is preferable that the emissivity changes from 0.3 to 0.7, and the change in emissivity is 0.4.
  • the thickness of the radiation layer 4 is not particularly limited, but is preferably in the range of 10 nm to 10 mm from the viewpoint of ease of manufacture, durability, and cost.
  • the first protective layer 2 or the second protective layer 3 has a function of protecting the radiation layer 4 from physical damage and chemical damage.
  • Physical damage refers to thermal shock when used where an unsteady thermal history is applied, damage due to sliding when used in an operating part, and the like.
  • Chemical damage refers to corrosion or deterioration when used in the presence of an oxidizing atmosphere or corrosive gas.
  • the first protective layer 2 and the radiation layer 4 are joined, and the radiation layer 4 and the second protection layer 3 are provided with a gap 5.
  • the second protective layer 3 has a role of receiving thermal energy radiated from the radiating layer 4 and releasing it from the opposite surface.
  • the first protective layer 2 or the second protective layer 3 can be formed of metal or ceramics (oxide, nitride, carbide, etc.).
  • the first protective layer 2 or the second protective layer 3 is preferably a material having high thermal conductivity. The higher the thermal conductivity, the greater the apparent change in thermal conductivity when the switch is OFF and ON.
  • the radiation layer 4, the second protective layer 3, and the gap 5 are preferably 1 nm or more and 1 mm or less. More preferably, they are 1 nm or more and 100 micrometers or less, More preferably, they are 1 nm or more and 50 micrometers or less. By setting this range, the function as a switch can be exhibited more effectively.
  • the gap 5 is preferably a vacuum, but may be filled with a gas such as air.
  • the method of providing the gap 5 is not particularly limited.
  • the layer can be fixed with a heat insulating material 8.
  • a transparent (particularly in the far-infrared to near-infrared region) porous insulating material can be present and fixed in the gap 5.
  • the temperature adjustment structure refers to a structure having a function of adjusting temperature while effectively using heat from a heat generation source.
  • the heat generation source that generates heat refers to the one that generates heat, and is not particularly limited.
  • the temperature adjustment structure of the present invention includes a temperature adjustment structure that adjusts the temperature due to the heat of the heat generation source by changing the heat radiation state between the first temperature and the second temperature that is higher or lower than the first temperature. Performance can be improved.
  • examples of the heat generation source include a battery pack, a motor, a CPU, a control circuit, an engine, a brake, and a gear box.
  • the structure provided with the thermal switch 1 around these is a temperature adjustment structure. In the case where sunlight is used as the heat generation source, an indoor temperature adjustment structure can be obtained by providing the building material, window, and sash with the thermal switch 1.
  • FIG. 4 shows an embodiment of the battery pack 30 provided with the thermal switch 1.
  • the battery pack 30 is a heat generation source.
  • the battery pack 30 includes a plurality of batteries, and these are electrically connected and accommodated in the case 31.
  • the thermal switch 1 is provided on the outer peripheral portion of the battery pack 30, that is, the case 31.
  • the battery pack 30 has a high battery resistance because it is at a low temperature when starting. Therefore, it is preferable not to dissipate the heat inside the battery pack 30 as much as possible.
  • the temperature inside the battery pack 30 is too high, there is a concern of ignition due to decomposition of the electrolyte. Therefore, it is preferable to actively dissipate the heat inside the battery pack 30.
  • FIG. 4 by providing the thermal switch 1 on the outer periphery of the battery pack 30, it is difficult to dissipate heat at the time of starting, and heat can be used effectively.
  • emissivity becomes high after completion of warm-up, the heat inside the battery pack 30 can be actively dissipated.
  • first protective layer 2 and the second protective layer 3 are made of metal, they can be made by casting, press molding, or the like. Next, the material for forming the radiation layer 4 is molded by tape molding, press molding, or the like and then fired to produce the radiation layer 4. Then, an adhesive layer having a low thermal resistance such as thermal grease is applied, the first protective layer 2 and the radiation layer 4 are pressure-bonded, and the second protective layer 3 is further provided as the thermal switch 1.
  • the protective layer can be produced by forming the material to be the protective layer by press molding, extrusion molding, or the like, followed by firing. Next, for example, a thick film is formed on the first protective layer 2 by coating, injection, or the like, and baked to produce the radiation layer 4. This is provided with a second protective layer 3 to form a thermal switch 1.
  • the manufacturing method of the thermal switch 1 is not limited to these methods.
  • Perovskite-type manganese oxide (La 0.7 Sr 0.2 Ca 0.1 MnO 3 ) was used as the radiation layer 4.
  • the emissivity was 0.4 at 0 ° C. and 0.6 at 50 ° C.
  • AD aerosol deposition
  • aluminum first protective layer 2
  • the radiation layer 4 having a thickness of 1 ⁇ m was formed by the method.
  • a thermal switch 1 was prepared in which aluminum (second protective layer 3) was placed with a gap 5 of 100 ⁇ m so as to face the radiation layer 4.
  • thermo switch 1 The way of heat transfer as a whole member (thermal switch 1) was evaluated using a heat flow meter. When one side of aluminum (first protective layer 2) is heated to 0 ° C and 50 ° C, the heat flow through the heat flow sensor attached to the other side aluminum (second protective layer 3) is measured. did.
  • the thermal switch of the present invention can be used as a switch whose heat transferability varies depending on the temperature. For example, by providing a thermal switch in a battery pack or the like, the internal heat can be used effectively.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Secondary Cells (AREA)
  • Battery Mounting, Suspending (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)

Abstract

L'invention concerne un commutateur thermique de structure simple pouvant modifier sa performance de transfert thermique selon la température, une structure de réglage de température équipée du commutateur thermique, et un bloc de batteries. Le commutateur thermique (1) comprend : une première couche protectrice (2) qui reçoit de la chaleur ; une couche de rayonnement (4) qui est jointe sur la première couche protectrice (2) et dont l'émissivité est modifiée lorsque la température change ; et une seconde couche protectrice (3) faisant face à la couche de rayonnement (4) avec un espace (5) formé avec la couche de rayonnement (4) et reçoit de la chaleur en provenance de la couche de rayonnement (4). L'émissivité de la couche de rayonnement (4) est modifiée lorsque la température change, de sorte que dans un commutateur thermique (1) dont l'émissivité augmente avec une augmentation de la température, la chaleur n'est pas susceptible d'être transférée de la première couche protectrice (2) à la seconde couche protectrice (3) lorsque la température est basse, mais susceptible d'être transférée de la première couche protectrice (2) à la seconde couche protectrice (3) lorsque la température est élevée.
PCT/JP2014/057627 2013-03-22 2014-03-19 Commutateur thermique, structure de réglage de température, et bloc de batteries WO2014148585A1 (fr)

Priority Applications (1)

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JP2015506841A JPWO2014148585A1 (ja) 2013-03-22 2014-03-19 熱スイッチ、温度調整構造、およびバッテリーパック

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JP2013061020 2013-03-22
JP2013-061020 2013-03-22

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016152688A1 (fr) * 2015-03-23 2016-09-29 日本碍子株式会社 Structure de réglage de dissipation de chaleur, bloc-batterie et dispositif d'écoulement de fluide
JP2016216688A (ja) * 2015-05-26 2016-12-22 国立大学法人名古屋大学 熱伝導率可変デバイス
JP2018193533A (ja) * 2017-05-19 2018-12-06 トヨタ自動車株式会社 熱放射構造体
US20220244001A1 (en) * 2021-02-03 2022-08-04 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and Methods for Tunable Radiative Cooling
US11828498B2 (en) 2021-07-16 2023-11-28 Toyota Motor Engineering & Manufacturing North America, Inc. Multi mode heat transfer systems

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102288123B1 (ko) 2018-10-05 2021-08-11 주식회사 엘지에너지솔루션 전극조립체, 그를 포함하는 이차전지 및 전지팩

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037313A1 (fr) * 2005-09-28 2007-04-05 Nec Corporation Vitre et film de fenêtre
JP2008258199A (ja) * 2007-03-30 2008-10-23 Sumitomo Bakelite Co Ltd 伝熱シートおよび放熱構造体
US20090253369A1 (en) * 2006-09-08 2009-10-08 Mpb Communications Inc. Variable emittance thermochromic material and satellite system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007037313A1 (fr) * 2005-09-28 2007-04-05 Nec Corporation Vitre et film de fenêtre
US20090253369A1 (en) * 2006-09-08 2009-10-08 Mpb Communications Inc. Variable emittance thermochromic material and satellite system
JP2008258199A (ja) * 2007-03-30 2008-10-23 Sumitomo Bakelite Co Ltd 伝熱シートおよび放熱構造体

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016152688A1 (fr) * 2015-03-23 2016-09-29 日本碍子株式会社 Structure de réglage de dissipation de chaleur, bloc-batterie et dispositif d'écoulement de fluide
JP2016216688A (ja) * 2015-05-26 2016-12-22 国立大学法人名古屋大学 熱伝導率可変デバイス
JP2018193533A (ja) * 2017-05-19 2018-12-06 トヨタ自動車株式会社 熱放射構造体
US20220244001A1 (en) * 2021-02-03 2022-08-04 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and Methods for Tunable Radiative Cooling
US11852423B2 (en) * 2021-02-03 2023-12-26 Toyota Motor Engineering & Manufacturing North America, Inc. Systems and methods for tunable radiative cooling
US11828498B2 (en) 2021-07-16 2023-11-28 Toyota Motor Engineering & Manufacturing North America, Inc. Multi mode heat transfer systems

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