WO2016152688A1 - Structure de réglage de dissipation de chaleur, bloc-batterie et dispositif d'écoulement de fluide - Google Patents

Structure de réglage de dissipation de chaleur, bloc-batterie et dispositif d'écoulement de fluide Download PDF

Info

Publication number
WO2016152688A1
WO2016152688A1 PCT/JP2016/058377 JP2016058377W WO2016152688A1 WO 2016152688 A1 WO2016152688 A1 WO 2016152688A1 JP 2016058377 W JP2016058377 W JP 2016058377W WO 2016152688 A1 WO2016152688 A1 WO 2016152688A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat dissipation
adjustment structure
thermal
thermal switch
Prior art date
Application number
PCT/JP2016/058377
Other languages
English (en)
Japanese (ja)
Inventor
崇弘 冨田
研吉 永井
博治 小林
Original Assignee
日本碍子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本碍子株式会社 filed Critical 日本碍子株式会社
Priority to JP2017508275A priority Critical patent/JPWO2016152688A1/ja
Publication of WO2016152688A1 publication Critical patent/WO2016152688A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/613—Cooling or keeping cold
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/61—Types of temperature control
    • H01M10/615—Heating or keeping warm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/63—Control systems
    • H01M10/635—Control systems based on ambient temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/651—Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/658—Means for temperature control structurally associated with the cells by thermal insulation or shielding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
    • F01M—LUBRICATING OF MACHINES OR ENGINES IN GENERAL; LUBRICATING INTERNAL COMBUSTION ENGINES; CRANKCASE VENTILATING
    • F01M5/00—Heating, cooling, or controlling temperature of lubricant; Lubrication means facilitating engine starting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a heat dissipation adjustment structure capable of adjusting heat dissipation. Moreover, it is related with a battery pack provided with the heat dissipation adjustment structure, and a fluid distribution apparatus.
  • Patent Document 1 an element that switches the thermal conductivity accompanied by an electronic phase transition by applying energy (magnetic field, electric field, light, heat, etc.) to a transition body sandwiched between electrodes.
  • a switch that switches between a connected state in which the substrate having the carbon nanotube layer contacts and a non-connected state in which the substrate has a carbon nanotube layer are disclosed.
  • Patent Document 1 an electrode, wiring, and the like are necessary to switch the switch by applying energy.
  • Patent Document 2 an actuator or the like is required to change the connection state of the switch.
  • the switches described in Patent Document 1 and Patent Document 2 require components in addition to the one whose thermal conductivity changes itself. Therefore, the switch is increased in size and the mounting location is restricted from the viewpoint of heat resistance. Furthermore, it is difficult to manufacture a complicated shape.
  • An object of the present invention is to provide a heat dissipation adjustment structure that can adjust heat dissipation from a heat generation source. Moreover, a battery pack provided with the heat dissipation adjustment structure and a fluid circulation device are provided.
  • the inventors of the present invention have a first material whose thermal resistance at room temperature is larger than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W and whose thermal resistance at 100 ° C. is 2/3 or less of the thermal resistance at room temperature.
  • the heat switch formed by is provided around the heat generation source that generates heat, and the heat conduction of the heat switch varies depending on the temperature, thereby providing a heat dissipation adjustment structure that adjusts the heat dissipation from the heat generation source, It has been found that the above problems can be solved.
  • the following heat dissipation adjustment structure, a battery pack including the same, and a fluid circulation device are provided.
  • the first material of the thermal switch is made of oxide, nitride, carbide, carbon allotrope, variable emissivity element, Mott insulator, metal-semiconductor phase transition material, and metal-insulator phase transition material.
  • the heat dissipation adjustment structure according to any one of [1] to [3], which is formed by any one selected from the group.
  • the first material of the thermal switch is made of SiC, AlN, Si 3 N 4 , VO 2 , Al 2 O 3 , ZrO 2 , diamond, graphene, graphite, carbon nanotube, carbon nanowire, and cordierite.
  • a battery pack comprising the heat radiation adjusting structure according to any one of [1] to [10].
  • a fluid circulation device through which a fluid circulates including the heat dissipation adjustment structure according to any one of [1] to [10].
  • the thermal resistance at room temperature is larger than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W, and the thermal resistance at 100 ° C. is 2/3 or less of the thermal resistance at room temperature.
  • a heat switch formed of one material is provided around a heat generation source that generates heat.
  • the thermal switch is made of a first material whose thermal resistance at room temperature is larger than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W and whose thermal resistance at 100 ° C. is 2/3 or less of the thermal resistance at room temperature.
  • the thermal switch used in the present invention is a self-supporting thermal switch because the thermal conductivity changes due to a change in ambient temperature. For this reason, there is no need for parts such as a drive unit, the size can be reduced, and the degree of freedom in shape is high.
  • FIG. 6 is a schematic diagram showing an evaluation device of Example 2. It is a figure which shows the result of Example 2, and is a graph which shows oil temperature.
  • the heat dissipation adjustment structure 11 of the present invention includes a thermal switch 12 around a heat generation source that generates heat.
  • the thermal switch 12 is made of a first material whose thermal resistance at room temperature is larger than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W and whose thermal resistance at 100 ° C. is 2/3 or less of the thermal resistance at room temperature. Is formed. It is possible to adjust the heat radiation from the heat generation source by changing the thermal resistance of the thermal switch 12 depending on the temperature, that is, changing the heat conduction depending on the temperature.
  • room temperature means 25 degreeC.
  • FIG. 1 is a schematic cross-sectional view showing Embodiment 1 of the heat dissipation adjustment structure 11 of the present invention.
  • the first embodiment is a battery pack 21 including a heat dissipation adjustment structure 11 including a thermal switch 12.
  • the battery pack 21 is a heat generation source.
  • the battery pack 21 includes a plurality of batteries, which are electrically connected and accommodated in the case 22.
  • a thermal switch 12 is provided around the battery pack 21, that is, on the surface of the case 22. 1 shows the heat dissipation adjustment structure 11 at a low temperature.
  • the diagram on the right side of FIG. 1 shows the heat dissipation adjustment structure 11 at a higher temperature than the diagram on the left side.
  • the battery pack 21 has a high electric resistance because it is at a low temperature at the start. Therefore, it is preferable that the heat inside the battery pack 21 is not radiated as much as possible. On the other hand, after the warm-up is completed, the internal temperature of the battery pack 21 becomes high, and there is a concern of ignition due to decomposition of the electrolyte. Therefore, it is preferable to dissipate the heat inside the battery pack 21.
  • the battery pack 21 including the heat dissipation adjustment structure 11 including the thermal switch 12 is thermally insulated because the thermal switch 12 has a high thermal resistance at the start. For this reason, the heat generated by the battery reaction is not missed, and the temperature rises early and can be kept at an appropriate temperature.
  • the battery pack 21 having the heat dissipation adjustment structure 11 including the thermal switch 12 increases the internal temperature of the battery pack 21 after the battery pack 21 is warmed up.
  • the thermal resistance of the thermal switch 12 becomes low and radiates heat. For this reason, the heat inside the battery pack 21 can be positively released to the outside and kept at an appropriate temperature.
  • the internal heat of the battery pack 21 is kept at an appropriate temperature, decomposition and combustion of the electrolytic solution can be suppressed.
  • Examples of the battery pack 21 including the heat dissipation adjustment structure 11 including the thermal switch 12 include a battery pack 21 including a lithium ion battery.
  • Lithium ion batteries tend to grow dendrites when charged at low temperatures, and dendrites may destroy the separator. In order to suppress the breakdown due to the dendrite growth, the charge / discharge current cannot be increased at low temperatures. On the other hand, the lithium ion battery deteriorates at a high temperature.
  • the heat dissipation adjustment structure 11 of the present invention when the heat dissipation adjustment structure 11 of the present invention is applied to a lithium ion battery, the heat dissipation adjustment structure 11 is insulated at low temperatures and dissipates heat at high temperatures, so that deterioration is suppressed while increasing the charge / discharge current of the lithium ion battery. be able to.
  • the second embodiment is a fluid circulation device that includes a heat dissipation adjustment structure 11 including a thermal switch 12 and through which a fluid flows.
  • the fluid circulation device through which the fluid circulates include devices through which the fluid flows, such as a pump that circulates the fluid, a flow path, and a heat exchanger through which the fluid circulates.
  • the fluid include oils such as engine oil and gear oil, water, ethylene glycol, a mixed solution of ethylene glycol and water, and air.
  • the fluid is a heat receiving body that receives heat from the heat generation source via the heat switch 12.
  • the flow rate of the heat receiving body is preferably 0.1 m / s or more and 10 m / s or less.
  • the flow rate of the heat receiving body is less than 0.1 m / s, the heat transfer coefficient of the heat receiving body may be reduced and the heat dissipation performance may be insufficient.
  • the flow velocity is higher than 10 m / s, the energy required to obtain the flow velocity may be too large, or the device may be too large, which is not preferable.
  • FIG. 2 shows an engine oil pipe 32 provided with a heat dissipation adjustment structure 11 including a thermal switch 12.
  • the engine oil pipe 32 is a heat generation source.
  • the diagram on the left side of FIG. 2 shows an engine oil pipe 32 provided with a heat dissipation adjustment structure 11 including a thermal switch 12 at a low temperature.
  • the right side of FIG. 2 shows an engine oil pipe 32 provided with a heat dissipation adjustment structure 11 including a thermal switch 12 at a higher temperature than the left side.
  • the engine 31 includes an oil pan 33 below the engine body.
  • the engine 31 is provided with an oil pump 35 for lubricating engine oil to each part of the engine 31 such as the pipe 32.
  • the oil pump 35 sucks engine oil by an oil strainer 34 provided in the engine oil.
  • the engine oil passes through the pipe 32, passes through the oil cooler 36, the oil filter 37, and the oil gallery 38, lubricates each part of the engine 31, and then returns to the oil pan 33.
  • the heat dissipation adjustment structure 11 of the present invention can be installed at any location where engine oil circulates.
  • the oil cooler 36, the oil pan 33, the pipe 32 from the oil gallery 38 to the oil pan 33, the pipe 32 from the oil cooler 36 to the oil filter 37, and the oil It is preferably installed in the pipe 32 to the gallery 38.
  • Engine oil has a high viscosity at low temperatures, which contributes to a deterioration in fuel consumption immediately after engine startup. For this reason, it is preferable not to dissipate the heat of engine oil as much as possible at low temperatures.
  • the high temperature state for example, 120 ° C.
  • the engine oil deteriorates and the life is shortened. For this reason, it is preferable to dissipate the heat of the engine oil at high temperatures.
  • the engine oil pipe 32 provided with the heat dissipation adjustment structure 11 of the present invention has a high thermal resistance of the thermal switch 12 provided around the engine oil pipe 32 when the engine is started. Insulate. For this reason, the temperature of engine oil can be raised early and the warm-up time from low temperature can be shortened. Furthermore, it is possible to make it difficult to cool engine oil at an appropriate temperature. Therefore, the viscosity of the engine oil is reduced, and the friction between the engine oil and the pipe 32 is reduced. As a result, fuel consumption can be improved.
  • the engine oil pipe 32 provided with the heat dissipation adjustment structure 11 of the present invention has a low thermal resistance of the thermal switch 12 provided around the engine oil pipe 32 at high temperatures, Dissipate heat. For this reason, the temperature in the piping 32 can be kept at an appropriate temperature. As a result, deterioration of the engine oil can be prevented. Furthermore, seizure due to high-temperature engine oil can be prevented.
  • FIG. 3 is a schematic cross-sectional view showing another example of Embodiment 2 of the heat dissipation adjustment structure 11 of the present invention.
  • a transmission 51 is an example of a fluid circulation device in which a fluid having the heat dissipation adjustment structure 11 circulates.
  • the transmission 51 is a heat generation source.
  • the heat radiation adjusting structure 11 is provided with the thermal switch 12 around the transmission 51, that is, on the outer surface.
  • the diagram on the left side of FIG. 3 shows a transmission 51 provided with a heat dissipation adjustment structure 11 at a low temperature.
  • the diagram on the right side of FIG. 3 shows the transmission 51 provided with the heat dissipation adjustment structure 11 at a higher temperature than the diagram on the left side.
  • the transmission 51 provided with the heat dissipation adjustment structure 11 of the present invention has a high thermal resistance of the thermal switch 12 and is insulated at low temperatures. For this reason, the temperature of the transmission fluid can be raised at an early stage. Therefore, viscosity becomes low and friction can be reduced.
  • the transmission 51 provided with the heat dissipation adjustment structure 11 of the present invention radiates heat at a high temperature because the thermal resistance of the thermal switch 12 is low. For this reason, the temperature of the transmission fluid can be maintained at an appropriate temperature. As a result, deterioration of the transmission fluid can be prevented. Further, seizure due to high-temperature transmission fluid can be prevented.
  • the thermal switch 12 for forming the heat dissipation adjustment structure 11 shown in the first and second embodiments has a thermal resistance at room temperature larger than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W and 100 It is formed of a first material having a thermal resistance at 2 ° C. of 2/3 or less of the thermal resistance at room temperature.
  • the heat resistance in 100 degreeC is 1/2 or less of the heat resistance in room temperature, More preferably, it is 1/3 or less.
  • the thermal resistance of the first material at room temperature is larger than that of a metal such as aluminum or stainless steel that constitutes a conventional product that does not include the thermal switch 12. Therefore, the value of the thermal resistance at room temperature is preferably larger than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W.
  • the thermal switch 12 In order for the thermal switch 12 to perform its function, the temperature of the thermal switch 12 itself needs to be low and high following the surrounding environment.
  • the thickness of the thermal switch 12 When the thickness of the thermal switch 12 is thin, the volume is reduced and the heat capacity is also reduced. Then, the thermal switch 12 itself is easy to heat and cool. As the temperature of the heat generation source changes, the temperature of the thermal switch 12 itself easily changes, and the thermal conductivity also changes. Therefore, the thickness of the thermal switch 12 provided around the heat generation source is preferably 20 mm or less.
  • the thickness is 10 mm or less, and further preferably the thickness is 5 mm or less. Since the volume of the heat switch material does not become too large when the thickness of the heat switch 12 is 20 mm or less, the response of the heat switch 12 to the temperature change of the heat generation source is improved.
  • the volume specific heat of the thermal switch 12 is preferably smaller than 1000 kJ / m 3 K.
  • the volume specific heat is 1000 kJ / m 3 K or more, the heat capacity increases, the temperature change of the thermal switch 12 itself becomes slow, and the functions at low temperature and high temperature (low temperature heat insulation, high temperature heat dissipation) are not sufficiently exhibited. There is. On the other hand, there is no problem in that the volume specific heat is small. The smaller the volume specific heat, the faster the temperature change rate of the thermal switch, and the function of the thermal switch is sufficiently exhibited.
  • the first material of the thermal switch 12 has a thermal resistance greater than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W at room temperature and a thermal resistance at 100 ° C. of 2/3 or less of the thermal resistance at room temperature. It is. Further, it exhibits such physical properties, and is made of an oxide, nitride, carbide, carbon allotrope, variable emissivity element, Mott insulator, metal-semiconductor phase transition material, and metal-insulator phase transition material. It is preferably any one selected from the group.
  • the first material of the thermal switch 12 is composed of SiC, AlN, Si 3 N 4 , VO 2 , Al 2 O 3 , ZrO 2 , diamond, graphene, graphite, carbon nanotube, carbon nanowire, and cordierite. It is preferable to include one or more types selected from the group. Moreover, it is more preferable that either SiC, AlN, or Si 3 N 4 is included. When a material having high thermal conductivity such as SiC, AlN, or Si 3 N 4 is included, the difference in thermal conductivity between the heat radiation state and the heat insulation state becomes larger.
  • the ceramic material 1 is composed of nanoparticles 2 and has a pore surface area, a pore volume, and an average pore diameter of 3. It is preferable that 5 ⁇ (pore surface area ⁇ average pore diameter / pore volume) is satisfied, and the thermal conductivity monotonously increases from room temperature to 100 ° C. Monotonic increase means that if the temperature rises between room temperature and 100 ° C., it means that the thermal conductivity increases, and there is no region where the thermal conductivity decreases even though the temperature rises. is there.
  • the thermal conductivity is preferably 2 W / (m ⁇ K) or less at room temperature, and more preferably 1 W / (m ⁇ K) or less.
  • thermal resistance sample thickness / thermal conductivity.
  • the ceramic material 1 that can be used as the thermal switch 12 of the present invention is composed of nanoparticles 2 and has a pore surface area, a pore volume, and an average pore diameter of 3.5 ⁇ (pore surface area ⁇ average pore diameter / pore. It is preferable to satisfy (volume). If this condition is satisfied, the shape of the pore is neither a shape close to a closed pore nor a sphere. For this reason, there are many interfaces between pores and nanoparticles. Therefore, since the thermal conductivity at low temperatures tends to be further lowered, the rate of change of the thermal conductivity with respect to temperature is improved.
  • the average pore diameter, pore surface area, and pore volume can be measured using a mercury intrusion method.
  • the particle diameter of the nanoparticles 2 constituting the ceramic material 1 satisfying 3.5 ⁇ (pore surface area ⁇ average pore diameter / pore volume) is preferably 10 to 500 nm, more preferably 10 to 300 nm. More preferably, the thickness is 10 to 200 nm. If the thickness is smaller than 10 nm, aggregation is likely to occur, and a uniform sintered body may not be obtained. In particular, if it is smaller than 1 nm, the nanoparticles 2 are very likely to condense, so that it is difficult to disperse and it is difficult to obtain a uniform sintered body. On the other hand, if it is larger than 500 nm, long free path phonons are difficult to be scattered.
  • the nanoparticles 2 are bonded to form a three-dimensional network skeleton structure. As shown in FIG. 4, it is preferable that the nanoparticles 2 have a structure in which the beads are connected together. The formation of a three-dimensional network skeleton structure increases the interface between particles and pores.
  • Such thickness L A of the skeleton composed of the ceramic material 1 by nanoparticles 2 is preferably 1 to 10 minutes nanoparticles. Note that the thickness L A of the skeleton, the average of values measured 10 points. By the thickness L A of the skeleton is 1 to 10 min nanoparticles, to suppress the thermal conduction in a low temperature (adiabatic conditions), it can be produced almost no inhibition (heat radiation state) ceramic thermal conductivity at high temperatures.
  • the skeleton thickness L A is related to the neck thickness L B of the bonding portion of the nanoparticles 2.
  • a neck is a contact portion between the nanoparticles 2.
  • the neck thickness L B, the length of the contact portion for example, a thickness of the portion shown in FIG.
  • the neck thickness L B of the bonding part of the nanoparticles 2 forming the ceramic material 1 is preferably 5 to 300 nm. More preferably, it is 5 to 100 nm, and further preferably 5 to 50 nm.
  • neck thickness L B is 5nm or more, it is possible to maintain the strength. Further, when the thickness is 300 nm or less, phonons having a long free path are easily scattered.
  • the porosity of the ceramic material 1 satisfying 3.5 ⁇ (pore surface area ⁇ average pore diameter / pore volume) is preferably 5 to 70%. More preferably, it is 15 to 65%, and further preferably 35 to 65%. When the porosity is 5% or more, the interface between the pores 3 and the particles increases, so that phonons are easily scattered. Further, when the porosity is 70% or less, the strength can be maintained.
  • the average pore diameter is preferably 10 to 1000 nm. More preferably, it is 10 to 500 nm, and still more preferably 20 to 300 nm. When the average pore diameter is 10 nm or more, the thermal conductivity does not become too small. When the average pore diameter is 1000 nm or less, the strength can be increased.
  • FIG. 5 shows a ceramic material in which 3.5 ⁇ (pore surface area ⁇ average pore diameter / pore volume) is satisfied, the dissimilar material 4 is present on the surface of the nanoparticle 2, and the nanoparticles 2 are bonded to each other. 1 is shown.
  • the ceramic material 1 in FIG. 5 is a composite material in which the different material 4 covers the surface of the nanoparticle 2 (the interface between the nanoparticle 2 and the nanoparticle 2 and the interface between the pore 3 and the nanoparticle 2).
  • a heterogeneous phase exists at the interface between the nanoparticle 2 and the nanoparticle 2.
  • phonons are more easily scattered than at the interface where the heterogeneous phase does not exist. For this reason, the thermal conductivity at low temperatures is lowered, and the rate of change of the thermal conductivity with respect to temperature is improved.
  • the dissimilar material 4 covers the surface of the nanoparticles 2 by 10% or more. If it is covered by 10% or more, it becomes easy to scatter phonons.
  • the dissimilar material 4 preferably contains at least one selected from the group consisting of O, B, C, N, Al, Si and Y. These dissimilar materials 4 are preferable because the ratio of heat conduction carried by phonons is high.
  • the nanoparticles 2 as a raw material are crushed using an organic solvent and dried. It can be produced by press molding in an Ar atmosphere or in vacuum under a firing temperature of 1000 to 2000 ° C., a firing pressure of 0 to 80 MPa, and a firing time of 1 to 360 minutes.
  • the thermal switch 12 in the heat dissipation adjustment structure 11 of the present invention is preferably a composite structure including a main layer 13 made of a first material and a resin layer 14 made of a resin that is a second material.
  • FIG. 6 shows an embodiment of a composite structure including the main layer 13 and the resin layer 14.
  • the thermal switch 12 having a composite structure is preferably provided with a resin layer 14 between the surface portion 15 of the heat generation source and the main layer 13.
  • the adhesion between the main layer 13 and the surface portion 15 is improved. Thereby, the thermal resistance between the main layer 13 and the surface part 15 can be made small, and peeling of the main layer 13 and the surface part 15 can be suppressed.
  • the thickness of the resin layer 14 is preferably 1 mm or less. More preferably, it is 0.5 mm or less, More preferably, it is 0.3 mm or less. When the thickness of the resin layer 14 is 1 mm or less, the heat capacity of the resin layer 14 does not become too large. Thereby, when the thermal resistance of the thermal switch 12 is low, the heat dissipation performance is not impaired, and when the thermal resistance is high, the heat insulation performance is not impaired.
  • the second material is ethylene propylene diene monomer copolymer (EPDM), ethylene propylene copolymer, polyimide, polyamideimide, silicone, fluoroelastomer, epoxy resin, phenol resin, melamine resin, urea resin, unsaturated polyester resin.
  • EPDM ethylene propylene diene monomer copolymer
  • ethylene propylene copolymer polyimide, polyamideimide, silicone, fluoroelastomer, epoxy resin, phenol resin, melamine resin, urea resin, unsaturated polyester resin.
  • unevenness is formed on the surface opposite to the heat generation source of the thermal switch 12.
  • the unevenness may be formed on the surface of the thermal switch 12 itself, or may be formed by providing a metal with unevenness on the surface of the thermal switch 12.
  • irregularities may be formed on the outer surface 13s of the main layer 13, or the outer surface 13s of the main layer 13 may be provided with a metal having irregularities on the surface.
  • thermal diffusivity was measured by a laser flash method.
  • specific heat was measured by differential scanning calorimetry.
  • Density was measured by Archimedes method.
  • Thermal resistance thickness of thermal switch 12 / thermal conductivity. The volume specific heat calculated from the density measured by the Archimedes method and the specific heat value measured by differential scanning calorimetry was 980 kJ / (m 3 ⁇ K).
  • the thermal switch 12 was attached to a lithium ion battery (rated capacity 1800 mAh) using an adhesive, and the discharge characteristics and the battery surface temperature during rapid charging at 7.2 A were measured. Unevenness was not formed on the surface of the thermal switch 12 opposite to the heat generation source. Moreover, the lithium ion battery which is not equipped with the thermal switch 12 was measured similarly.
  • FIG. 7 shows the measurement results of the discharge characteristics at an atmospheric temperature of ⁇ 10 ° C. and a flow rate of 3 m / s. Moreover, the measurement result of the temperature change of the battery surface temperature when the rapid discharge at 7.2 A from the initial temperature of the battery surface of 30 ° C. is shown in FIG. 7 and 8, Example 1 has a thermal switch, and Comparative Example 7 has no thermal switch. Further, Comparative Example 1 was represented as a, Comparative Example 2 as b, and Comparative Example 3 as c.
  • Example 1 From the above, the samples of Example 1 and Comparative Example 1 had a thermal resistance greater than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W at room temperature (25 ° C.) and good heat insulation. (Thermal resistance at 100 ° C.) / (Thermal resistance at room temperature) was 2/3 or less in Example 1 and Comparative Example 2, and when the temperature rose, the thermal resistance decreased and the heat dissipation was excellent. Accordingly, Example 1 in which the thermal resistance at room temperature is larger than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W and (thermal resistance at 100 ° C.) / (Thermal resistance at room temperature) is 2/3 or less. Is excellent in heat insulation and heat dissipation, and the lithium ion battery equipped with this has improved performance.
  • thermal switch 12 (Thermal switch) (Example 2) A silicon carbide polycrystal was used as the thermal switch 12. The thickness of the thermal switch 12 was 0.1 mm. When the thermal conductivity of this polycrystal was measured, it was 2 W / (m ⁇ K) at room temperature (25 ° C.) and 7 W / (m ⁇ K) at 100 ° C., and the thermal resistance was 5 ⁇ 10 ⁇ 5 at room temperature. It was (m 2 ⁇ K) / W , at 100 °C 1.4 ⁇ 10 -5 (m 2 ⁇ K) / W. The volume specific heat calculated from the density measured by the Archimedes method and the specific heat value measured by differential scanning calorimetry was 970 kJ / (m 3 ⁇ K).
  • Comparative Examples 4 to 6 Similarly, samples of Comparative Examples 4 to 6 were produced. The values of the manufactured thermal switch are shown in Table 1. The samples of Comparative Examples 4 to 6 are the same as the samples of Comparative Examples 1 to 3.
  • the evaluation apparatus shown in FIG. 9 was produced.
  • oil circulates through a cylindrical heater 61, a tube 62, a cooler 68, a pump 63, and a flow meter 65.
  • the cylindrical heater 61 is energized by a DC power source to generate heat, and the oil is warmed, and the temperature of the oil after passing through the cylindrical heater 61 is measured by the thermocouple 67.
  • the thermal switch 12 was attached to the outer periphery of the cylindrical heater 61 using an adhesive. Unevenness was not formed on the surface of the thermal switch 12 opposite to the heat generation source.
  • the time (temperature increase rate) until the temperature of the oil reached 100 ° C. when the heater was heated at 200 W and the oil was flowed at a flow rate of 5 m / s was measured.
  • the temperature increase rate after the oil temperature exceeded 100 ° C. was also measured.
  • the measurement was also performed on an evaluation apparatus that did not include the thermal switch 12.
  • the measurement results are shown in FIG. In FIG. 10, Example 2 has a thermal switch, and Comparative Example 8 has no thermal switch. Further, Comparative Example 4 was represented as d, Comparative Example 5 as e, and Comparative Example 6 as f.
  • Example 2 had a thermal resistance at room temperature (25 ° C.) greater than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W and good heat insulation.
  • (Thermal resistance at 100 ° C.) / (Thermal resistance at room temperature) was 2/3 or less in Example 2 and Comparative Example 5, and when the temperature rose, the thermal resistance decreased and the heat dissipation was excellent. Therefore, Example 2 in which the thermal resistance at room temperature is larger than 1.0 ⁇ 10 ⁇ 5 (m 2 ⁇ K) / W and (thermal resistance at 100 ° C.) / (Thermal resistance at room temperature) is 2/3 or less. Is excellent in heat insulation and heat dissipation, and the heater equipped with this has improved performance.
  • the heat dissipation adjustment structure of the present invention can be used as a structure for adjusting the temperature inside the apparatus for an apparatus having heat inside.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Algebra (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Mathematical Optimization (AREA)
  • Pure & Applied Mathematics (AREA)
  • Battery Mounting, Suspending (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Secondary Cells (AREA)
  • Lubrication Of Internal Combustion Engines (AREA)

Abstract

L'invention concerne une structure de réglage de dissipation de chaleur qui permet de régler la dissipation de la chaleur d'une source de chaleur. Un commutateur thermique (12) est formé à partir d'un premier matériau dont la résistance thermique à la température ambiante est supérieure à 1,0 × 10-5 (m2∙K)/W et la résistance thermique à 100 °C est inférieure ou égale à 2/3 de la résistance thermique à la température ambiante. La structure de réglage de dissipation de chaleur (11) est formée par agencement du commutateur thermique (12) autour d'une source de chaleur qui produit de la chaleur. La dissipation de la chaleur provenant de la source de chaleur est ajustée du fait que la conductivité thermique du commutateur (12) varie selon la température.
PCT/JP2016/058377 2015-03-23 2016-03-16 Structure de réglage de dissipation de chaleur, bloc-batterie et dispositif d'écoulement de fluide WO2016152688A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017508275A JPWO2016152688A1 (ja) 2015-03-23 2016-03-16 放熱調整構造、バッテリーパック、及び流体流通装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015060157 2015-03-23
JP2015-060157 2015-03-23

Publications (1)

Publication Number Publication Date
WO2016152688A1 true WO2016152688A1 (fr) 2016-09-29

Family

ID=56977362

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/058377 WO2016152688A1 (fr) 2015-03-23 2016-03-16 Structure de réglage de dissipation de chaleur, bloc-batterie et dispositif d'écoulement de fluide

Country Status (2)

Country Link
JP (1) JPWO2016152688A1 (fr)
WO (1) WO2016152688A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107994202A (zh) * 2017-10-31 2018-05-04 合肥国轩高科动力能源有限公司 一种改善圆柱电池极片导热散热性能的方法
JP2019102419A (ja) * 2017-11-30 2019-06-24 三菱ケミカル株式会社 仕切り部材、組電池及び組電池の熱伝達制御方法
CN112002957A (zh) * 2020-08-26 2020-11-27 重庆峘能电动车科技有限公司 电池模组结构、电池箱及新能源汽车
KR102186294B1 (ko) * 2019-05-31 2020-12-04 삼화콘덴서공업 주식회사 원통형 이차전지
US11958783B2 (en) 2017-09-22 2024-04-16 Sumitomo Chemical Company, Limited Composition, film, and method for producing film

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327223A (ja) * 2003-04-24 2004-11-18 Matsushita Electric Ind Co Ltd 電池収納装置、電源装置、および電動車両
WO2012153752A1 (fr) * 2011-05-10 2012-11-15 新神戸電機株式会社 Batterie secondaire enroulée
JP2014043835A (ja) * 2012-08-28 2014-03-13 Aisin Keikinzoku Co Ltd オイルパンの保温及び冷却構造
WO2014148585A1 (fr) * 2013-03-22 2014-09-25 日本碍子株式会社 Commutateur thermique, structure de réglage de température, et bloc de batteries
WO2014156991A1 (fr) * 2013-03-29 2014-10-02 日本碍子株式会社 Commutateur thermique, structure de régulation de température, et bloc-batterie

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327223A (ja) * 2003-04-24 2004-11-18 Matsushita Electric Ind Co Ltd 電池収納装置、電源装置、および電動車両
WO2012153752A1 (fr) * 2011-05-10 2012-11-15 新神戸電機株式会社 Batterie secondaire enroulée
JP2014043835A (ja) * 2012-08-28 2014-03-13 Aisin Keikinzoku Co Ltd オイルパンの保温及び冷却構造
WO2014148585A1 (fr) * 2013-03-22 2014-09-25 日本碍子株式会社 Commutateur thermique, structure de réglage de température, et bloc de batteries
WO2014156991A1 (fr) * 2013-03-29 2014-10-02 日本碍子株式会社 Commutateur thermique, structure de régulation de température, et bloc-batterie

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11958783B2 (en) 2017-09-22 2024-04-16 Sumitomo Chemical Company, Limited Composition, film, and method for producing film
CN107994202A (zh) * 2017-10-31 2018-05-04 合肥国轩高科动力能源有限公司 一种改善圆柱电池极片导热散热性能的方法
CN107994202B (zh) * 2017-10-31 2020-07-17 合肥国轩高科动力能源有限公司 一种改善圆柱电池极片导热散热性能的方法
JP2019102419A (ja) * 2017-11-30 2019-06-24 三菱ケミカル株式会社 仕切り部材、組電池及び組電池の熱伝達制御方法
JP7059828B2 (ja) 2017-11-30 2022-04-26 三菱ケミカル株式会社 仕切り部材、組電池及び組電池の熱伝達制御方法
KR102186294B1 (ko) * 2019-05-31 2020-12-04 삼화콘덴서공업 주식회사 원통형 이차전지
CN112002957A (zh) * 2020-08-26 2020-11-27 重庆峘能电动车科技有限公司 电池模组结构、电池箱及新能源汽车

Also Published As

Publication number Publication date
JPWO2016152688A1 (ja) 2018-01-18

Similar Documents

Publication Publication Date Title
WO2016152688A1 (fr) Structure de réglage de dissipation de chaleur, bloc-batterie et dispositif d'écoulement de fluide
Kargar et al. Thermal percolation threshold and thermal properties of composites with high loading of graphene and boron nitride fillers
JP5754031B2 (ja) 高熱伝導率体を使用する電気エネルギー蓄積装置または電気化学エネルギー発生装置の温度を変更するシステム
JP6034876B2 (ja) フィラー高充填高熱伝導性材料、およびその製造方法、並びに組成物、塗料液、および成形品
JP4711956B2 (ja) 冷却される機能素子によって形成された少なくとも１つの熱源、少なくとも１つの吸熱源、および熱源と吸熱源の間に置かれて熱伝導材料から作られた少なくとも１つの中間層を備えるデバイス、および特にそのようなデバイスで使用される熱伝導材料
JP6060078B2 (ja) ヒーター
US8715875B2 (en) System and method of operating an electrical energy storage device or an electrochemical energy generation device using thermal conductivity materials based on mobile device states and vehicle states
US9656920B2 (en) Ceramic material and thermal switch
CN108430919B (zh) 碳纳米管接合片以及碳纳米管接合片的制造方法
Choi et al. Application of hexagonal boron nitride to a heat-transfer medium of an InGaN/GaN quantum-well green LED
US20150076685A1 (en) Flow path member, and heat exchanger and semiconductor device using the same
KR101713791B1 (ko) 플렉서블 회로
KR101684008B1 (ko) 간접냉각식 배터리 모듈용 계면 플레이트 및 그 제조방법
JP2011230472A (ja) 絶縁性の高い熱伝導シート及びこれを用いた放熱装置
Zhang et al. Performance enhancements in poly (vinylidene fluoride)-based piezoelectric films prepared by the extrusion-casting process
CN112703359B (zh) 用于增强热传输的单层和多层网筛结构
CN107004921A (zh) 在电动交通领域中的热管理
CN109104867A (zh) 散热器、用于散热器的填料及其方法
WO2019132041A1 (fr) Dispositif de génération de chaleur et son utilisation
CN112352324A (zh) 热电元件
WO2016152687A1 (fr) Matériau céramique et procédé de production correspondant
TW202114253A (zh) 熱電設備
Shchegolkov et al. Effect of addition of carbon nanotubes on electrical conductance and heat dissipation of elastomers at flow of direct current
US20240230252A1 (en) Heat conduction film and heat-dissipating structure using same
EP4349888A1 (fr) Film thermoconducteur et structure de dissipation de chaleur l?utilisant

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16768591

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2017508275

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16768591

Country of ref document: EP

Kind code of ref document: A1