WO2014135644A1 - Verfahren und vorrichtung zur vermessung und optimierung einer optoelektronischen komponente - Google Patents
Verfahren und vorrichtung zur vermessung und optimierung einer optoelektronischen komponente Download PDFInfo
- Publication number
- WO2014135644A1 WO2014135644A1 PCT/EP2014/054364 EP2014054364W WO2014135644A1 WO 2014135644 A1 WO2014135644 A1 WO 2014135644A1 EP 2014054364 W EP2014054364 W EP 2014054364W WO 2014135644 A1 WO2014135644 A1 WO 2014135644A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optoelectronic component
- connection
- region
- resonant circuit
- electromagnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/105—Controlling the light source in response to determined parameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
Definitions
- Terminals are short-circuited, that is, in between their connections a negligible resistance. This is especially the case when
- a galvanization step can no longer be used.
- connection carrier and / or freestanding contacts can lead to mechanical problems, such as jamming and some manufacturing steps, such as a
- connection carrier DC voltage can be operated, especially if there is a negligible resistance between the terminals of the optoelectronic component. Furthermore, a method and a device for optimizing such are arranged on a connection carrier
- optoelectronic component can be specified.
- arranged optoelectronic component comprises the
- Oscillatory circuit which by the at least one
- the optoelectronic component and the connection carrier is formed, so that the at least one optoelectronic component is excited to emit electromagnetic radiation, and measuring at least one electro-optical property of the at least one optoelectronic component.
- the invention is not based on exciting a single electromagnetic resonant circuit with a single one
- electro-optical property can be measured.
- a plurality of electromagnetic resonant circuits each having a single optoelectronic component or a plurality of electromagnetic resonant circuits each having a plurality of optoelectronic components can be excited.
- Electromagnetic resonant circuits can be independent
- An optoelectronic component may in this case be in particular an optoelectronic component or an element which is present as an optoelectronic component after execution of further production steps.
- the optoelectronic component comprises at least one component which is used for the emission of
- Electromagnetic radiation can be excited.
- optoelectronic component can be measured if there is a negligible ohmic resistance, for example, an ohmic resistance in the micro-ohmic range between the terminals of the optoelectronic component, so that the optoelectronic component is short-circuited.
- a negligible ohmic resistance for example, an ohmic resistance in the micro-ohmic range between the terminals of the optoelectronic component, so that the optoelectronic component is short-circuited.
- an electro-optical property of the optoelectronic component can also be measured if the optoelectronic component is short-circuited during at least part of the manufacturing process
- connection carrier for example, because it is arranged on a connection carrier and has not yet been isolated.
- the optoelectronic component is a light-emitting diode (LED), a laser diode, a semiconductor diode or a semiconductor chip, or it comprises a light-emitting diode (LED), a laser diode, a semiconductor diode or a semiconductor chip.
- a laser diode is a semiconductor diode which emits laser radiation. The emission of electromagnetic radiation is preferably due to electro-optical luminescence.
- An electromagnetic resonant circuit is a circuit which comprises inductive and / or capacitive elements. The overall impedance of such a circuit is generally complex. In particular, an electromagnetic resonant circuit may comprise both inductive and capacitive elements. In this case, the absolute value of the total impedance when excited at a certain frequency becomes minimum.
- Electromagnetic resonant circuit may preferably be excited at this particular frequency.
- the optoelectronic component comprises a
- connection carrier is a leadframe, in particular a metal frame.
- a multiplicity of optoelectronic components can be arranged on the connection carrier.
- the connection carrier can be at least one
- Connecting conductor area include, wherein in each
- Connecting conductor area is an area in which connection conductors are formed.
- connecting conductors can be formed in the connection conductor region, which during a manufacturing process of the
- connection carrier may further comprise bridging regions through which the
- Connection conductor areas are conductively connected to one another.
- a coherent connection carrier can be formed in a simplified manner.
- the at least one connection conductor region comprises at least a first connection region and a second connection region.
- a first terminal of the optoelectronic component may be conductively connected to the first terminal region, and a second terminal of the optoelectronic component may be conductively connected to the second terminal region.
- the conductive connection of the first terminal to the first terminal region may be by direct electrical contact, and the conductive connection of the second terminal to the second terminal region may be via a bonding wire.
- Connection area can be conductively connected to each other by the connection carrier.
- Terminal area and the second terminal region may at least partially enclose a non-conductive gap. This will be the environment of the
- the gap is free of solid matter. This ensures that a means for exciting the electromagnetic resonant circuit, for example an inductive element or a ferrite core, can be introduced into the intermediate space, whereby a more effective excitation of the electromagnetic resonant circuit can be achieved.
- a means for exciting the electromagnetic resonant circuit for example an inductive element or a ferrite core
- Optoelectronic component to the brightness, the color locus or the spectrum of the electromagnetic radiation emitted by the optoelectronic component Due to the measured electro-optical property can more
- Properties of the optoelectronic component can be determined. For example, at least one lifetime of at least one type of charge carriers in the
- the exciting of the electromagnetic resonant circuit comprises applying an electrical voltage to two electrical contacts in the electromagnetic resonant circuit, in particular at two contact points on the connection carrier.
- the exciting of the electromagnetic includes
- Oscillation circuit Inducing an electrical AC voltage in the electromagnetic resonant circuit by generating a time-varying electromagnetic alternating field.
- the inductive excitation has the advantage that the excitation can be made contactless.
- Electromagnetic alternating field can be generated by an inductive element, in particular a coil with one or more windings.
- the inductive element can be arranged above or below, ie on both sides of the connection carrier.
- the distance from the connection carrier of the inductive element may vary, but is preferably kept constant.
- the inductive element be guided at a constant distance from the connection carrier on areas of different optoelectronic components.
- the inductive element has similar dimensions and / or a similar shape as the electromagnetic resonant circuit. Due to the local stimulation of the
- Electromagnetic resonant circuit is achieved that an electro-optical property of a single
- optoelectronic component can be measured without adjacent optoelectronic components, which are arranged for example on the same connection carrier, are also excited to emit electromagnetic radiation.
- Electromagnetic radiation are excited.
- the inductive element encloses the inductive element at least partially ferromagnetic element which extends from the inductive element in the direction of the electromagnetic resonant circuit. This ensures that the magnetic
- the ferromagnetic element can
- the inductive element and / or the ferromagnetic element penetrates at least partially during the excitation
- the high frequency voltage is applied via a matching circuit which serves for impedance matching.
- the frequency of the high frequency voltage is preferably 1 MHz to 10 GHz, more preferably 10 MHz to 1 GHz, and particularly preferably 25 MHz to 500 MHz.
- the frequency is the
- the method comprises adjusting the frequency of the high frequency voltage. Adjusting the frequency of the high frequency voltage may be regulated based on a measurement of the intensity of the emitted from the optoelectronic component
- the imaginary part is the effective impedance of the conductive connection between the first terminal area and the second
- the optoelectronic component can be measured without disconnecting the conductive connection between its terminals, which would cause a short circuit when a DC voltage is applied.
- connection carrier comprises a plurality of connecting conductor regions with a plurality of optoelectronic components and the
- Connecting conductor areas are each conductively connected by bridging areas.
- the invention further relates to a method for optimizing an optoelectronic component.
- the method comprises executing a
- the method can sort optoelectronic components due to the measured
- electro-optical property include.
- the manufacturing step may in particular be the application of a conversion material to an LED, in particular white light-generating LEDs.
- the LED may, for example, a housing, a blue semiconductor chip, a conversion material and optionally further
- Potting materials include.
- optoelectronic component preferably the color locus of the emitted from the optoelectronic component
- the optoelectronic component can be provided, for example, with a housing or an optical element. If a plurality of optoelectronic components are arranged on the connection carrier, then the composite of connection carrier and optoelectronic can subsequently Components are separated.
- the common connection carrier is divided into a plurality of connection carrier, so that the finished optoelectronic components each have a connection carrier.
- the invention further relates to a device for measuring an optoelectronic component.
- the device comprises a
- Connection carrier on which at least one optoelectronic component can be arranged, a high-frequency generator, a matching circuit, means for exciting a
- the device comprises a device according to the invention for measuring a
- the means for modifying the optoelectronic component by comparison may include means for adjusting the electro-optic property to the setpoint.
- the means for modifying the optoelectronic component due to the comparison comprise means for adjusting a manufacturing step due to the comparison.
- the control unit is adapted to the means for modifying the optoelectronic component based on the measured electro-optical component
- Figure 1 is a plan view of a first embodiment of a connection carrier on which the inventive
- Figure 6 shows a third embodiment of
- Figure 7 is a detail view of the first embodiment of a connection carrier in conjunction with the first
- FIG. 8 shows an electromagnetic spectrum of an optoelectronic component measured according to the invention.
- Time is directed into the plane of the drawing.
- the magnetic fields used herein are variable in time, and at a certain time in the Drawing plane directed magnetic field may be directed out of the plane of the drawing at another time. Only the relevant magnetic field lines are shown.
- FIG. 1 shows a plan view of a total of 100
- connection carrier to which the method according to the invention is applicable.
- connection carrier 100 comprises three connecting conductor regions 12, which are in regular
- Connecting conductor regions 12 comprises a middle region 14 and first to fourth connecting conductors 16, 18, 20, 22, which each have the same width, wherein in each case the first connecting conductor 16 and the second connecting conductor 18 are arranged on a first side of the central region 14 and the third Connection conductor 20 and the fourth
- Terminal conductor 22 are arranged on a second, the first side opposite side of the central region 14. Between the first and second connection conductors 16, 18 on the first side of the central region 14 there is in each case a first intermediate space 24, and between the third and fourth connection conductors 20, 22 on the second side of the middle region 14 there is a second one in each case
- Gap 28 separated from the central region 14; the First to third connection conductors 16, 18, 20 each directly adjoin the central region 14.
- the connecting conductor regions 12 are separated from each other by four intermediate spaces 30.
- the width of the third spaces 28 is less than the width of the first and second spaces 24, 26, and the width of the first and second spaces 24, 26 is less than the width of the fourth spaces 30.
- the terminal support 100 further includes a first bridging area 32 and a second bridging region 34 disposed on opposite sides of the lead portions 12.
- the first and second leads 16, 18 on the first side of the central region 14 are respectively connected to the first bridging region 32
- the third and fourth leads 20, 22 on the second side of the middle region 14 are connected to the second Bridging 34 connected.
- the first and second bridging regions 32, 34 thus form a conductive one
- an optoelectronic component 10 is arranged on the middle region 14 of each connection conductor region 12, one of the connections being in direct electrical contact with the central region 14.
- the middle region 14 thus acts as a first connection region for the connection of the optoelectronic component.
- a second connection of the optoelectronic component is in each case connected to the fourth connection conductor via a bonding wire via the third intermediate space.
- Terminal conductor 22 thus acts as a second
- Gap 26 is formed around, which is in the
- time-varying magnetic field 40 may in the
- electromagnetic resonant circuit 38 an electrical
- FIG. 1 shows purely by way of example a second one
- connection carrier 100 which includes two adjacent optoelectronic components 10. This should make it clear that, depending on the geometry of the connection carrier 100 and the optoelectronic arranged thereon
- the electromagnetic resonant circuit 39 may be formed by a plurality of connection conductors and parts of the bridging regions. Similar to the electromagnetic resonant circuit 38 is in the
- Resonant circuit 39 used. By one in the second Gap 26 available temporally variable
- Electromagnetic radiation are excited.
- FIG. 2 shows a plan view of a total of 100
- connection carrier to which the method according to the invention is applicable.
- connection carrier 100 which also consists for example of metal, turn
- optoelectronic components 10 are arranged. Also the
- Connection carrier 100 comprises three connecting conductor regions 12, which are arranged at regular intervals from one another and each have the same structure and orientation.
- Each of the lead portions 12 includes a first one
- Terminal conductor 42 and a second terminal conductor 44 which each have the same width. Between the first and second connecting conductors 42, 44 there is a respective first intermediate space 46.
- connection carrier 100 further comprises a first bridging region 32 and a second bridging region 32
- Each lead-wire area 12 is the first one
- Terminal conductor 42 is connected to the second bridging area 34, and the second terminal conductor 44 is connected to the first bridging area 32.
- the Bridging areas 32, 34 thus form a conductive
- connection carrier 100 further comprises third
- Bridging regions 50 each of which interconnects the first connection conductors 42 of two adjacent connection conductor regions 12 via one of the second intermediate spaces 48, as well as interconnecting the first and second connection conductors 42 and 44 of one of the two adjacent connection conductor regions 12.
- the third bridging areas 50 thus form a conductive connection between the
- Connecting conductor region 12 is arranged in each case an optoelectronic component 10, whose one terminal is in direct electrical contact with the first connecting conductor 42.
- the first connection conductor 42 thus acts as a first one
- a second terminal of the optoelectronic component 10 is connected in each case by a bonding wire 36 across the first gap 46 away with the second connection conductor 44.
- the second connection conductor 44 thus acts as a second connection region for the connection of the
- each form the optoelectronic component 10 a part of the first
- electromagnetic resonant circuit 38 an electrical
- FIG. 3 shows a block diagram of an excitation circuit, generally designated by 200, with an electromagnetic oscillating circuit 38 to be excited.
- the electromagnetic oscillating circuit 38 shown schematically here can be, for example, the circuit shown in FIG.
- High frequency generator 60 voltage is applied via a matching circuit 62 to a circuit element 64.
- the matching circuit 62 is for impedance matching between the high-frequency generator 60 and the
- the circuit element 64 includes a coupling device 66 with two terminals 68.
- the coupling device 66 may be as described in more detail below to act an inductive coupling device or a coupling device via electrical contacts.
- the electromagnetic resonant circuit 38 comprises an optoelectronic illustrated schematically here
- FIG. 4 shows a first exemplary embodiment of the coupling-in device 66 shown in FIG.
- a coil 72 is arranged, which acts as an inductive element.
- the coil 72 may be one or more turns
- Magnetic field (not shown here) therefore induces an electrical in the electromagnetic resonant circuit 38
- Resonant circuit 38 is excited to vibrate.
- the coil 72 may be inserted into the electromagnetic resonant circuit 38 for better inductive coupling.
- connection carrier Embodiment of a connection carrier are introduced.
- the electromagnetic resonant circuit 38 can be excited without contact.
- Figure 5 shows a second embodiment of
- ferromagnetic element acts.
- the ferrite core 74 is the time-varying generated by the coil 72
- Resonant circuit 38 is arranged.
- the ferrite core 74 for better inductive coupling in the
- the electromagnetic resonant circuit 38 can also be excited without contact.
- Figure 6 shows a third embodiment of
- Excitation circuit 200 In this embodiment, the electromagnetic shown here schematically
- Resonant circuit 38 excited directly via two electrical contacts 76.
- High-frequency voltage is coupled via the electrical contacts 76 directly into the electromagnetic resonant circuit 38.
- FIG. 7 shows a detail view of the first one
- FIG. 7 exemplarily shows a combination of the first
- connection carrier with the first embodiment of the coupling device of the excitation circuit shown in Figure 3 shown.
- the invention is not limited to this combination;
- Excitation circuit are combined.
- the two electrical contacts 76 of the coupling-in device 66 shown in FIG. 6, which are preferably designed as needle tips, are placed on the connection carrier 100 at the positions indicated by the reference numeral 77 in FIG. 7 in order to excite the electromagnetic resonant circuit 38.
- FIG. 8 shows a spectrum measured according to the invention and emitted by an optoelectronic component
- the spectrum of the Electromagnetic radiation emitted by the optoelectronic component substantially corresponds to the spectrum that would be measurable with a DC voltage when a singulated optoelectronic component is excited. Due to the heating of the optoelectronic component by the excitation with a high-frequency voltage, the spectrum is slightly shifted; However, an electro-optical property such as the color locus of the optoelectronic component can be reliably determined from the measured spectrum.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Devices (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Led Device Packages (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015560693A JP6283696B2 (ja) | 2013-03-08 | 2014-03-06 | オプトエレクトロニクス部品を測定および最適化する方法および装置 |
| US14/769,788 US10132855B2 (en) | 2013-03-08 | 2014-03-06 | Method and device for measuring and optimizing an optoelectronic component |
| KR1020157026186A KR102136912B1 (ko) | 2013-03-08 | 2014-03-06 | 광전자 소자를 측정하고 최적화하기 위한 방법 및 장치 |
| CN201480012703.4A CN105026941B (zh) | 2013-03-08 | 2014-03-06 | 用于测量和优化光电子组件的方法和设备 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013102322.3A DE102013102322B4 (de) | 2013-03-08 | 2013-03-08 | Verfahren und Vorrichtung zur Vermessung und Optimierung einer optoelektronischen Komponente |
| DE102013102322.3 | 2013-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2014135644A1 true WO2014135644A1 (de) | 2014-09-12 |
Family
ID=50241396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2014/054364 Ceased WO2014135644A1 (de) | 2013-03-08 | 2014-03-06 | Verfahren und vorrichtung zur vermessung und optimierung einer optoelektronischen komponente |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10132855B2 (de) |
| JP (1) | JP6283696B2 (de) |
| KR (1) | KR102136912B1 (de) |
| CN (1) | CN105026941B (de) |
| DE (1) | DE102013102322B4 (de) |
| WO (1) | WO2014135644A1 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108028295A (zh) * | 2015-09-17 | 2018-05-11 | 欧司朗光电半导体有限公司 | 用于制造光电子器件的方法 |
| US10288671B2 (en) | 2015-02-05 | 2019-05-14 | Osram Opto Semiconductors Gmbh | Method and device for inspecting an optoelectronic component arranged on a connection board |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10727131B2 (en) * | 2017-06-16 | 2020-07-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Source and drain epitaxy re-shaping |
| DE102017117411B4 (de) | 2017-08-01 | 2021-11-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leiterrahmenverbund und Herstellungsverfahren für optoelektronische Halbleiterbauteile |
| EP3845915B1 (de) * | 2018-09-20 | 2022-11-02 | Huawei Technologies Co., Ltd. | Photoelektronenkomponente und herstellungsverfahren dafür |
| DE102019107143B4 (de) * | 2019-03-20 | 2022-09-15 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum sortieren von optoelektronischen halbleiterbauelementen und vorrichtung zum sortieren von optoelektronischen halbleiterbauelementen |
| WO2022133659A1 (zh) * | 2020-12-21 | 2022-06-30 | 华为技术有限公司 | 光发射组件 |
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2013
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2014
- 2014-03-06 WO PCT/EP2014/054364 patent/WO2014135644A1/de not_active Ceased
- 2014-03-06 JP JP2015560693A patent/JP6283696B2/ja active Active
- 2014-03-06 CN CN201480012703.4A patent/CN105026941B/zh active Active
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- 2014-03-06 US US14/769,788 patent/US10132855B2/en active Active
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10288671B2 (en) | 2015-02-05 | 2019-05-14 | Osram Opto Semiconductors Gmbh | Method and device for inspecting an optoelectronic component arranged on a connection board |
| CN108028295A (zh) * | 2015-09-17 | 2018-05-11 | 欧司朗光电半导体有限公司 | 用于制造光电子器件的方法 |
| JP2018533203A (ja) * | 2015-09-17 | 2018-11-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクスデバイスの製造方法 |
| CN108028295B (zh) * | 2015-09-17 | 2020-01-21 | 欧司朗光电半导体有限公司 | 用于制造光电子器件的方法 |
| US10879136B2 (en) | 2015-09-17 | 2020-12-29 | Osram Oled Gmbh | Method for producing an optoelectronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105026941B (zh) | 2019-01-18 |
| DE102013102322A1 (de) | 2014-09-11 |
| KR102136912B1 (ko) | 2020-07-22 |
| US20160003890A1 (en) | 2016-01-07 |
| CN105026941A (zh) | 2015-11-04 |
| DE102013102322B4 (de) | 2018-05-30 |
| JP2016510874A (ja) | 2016-04-11 |
| JP6283696B2 (ja) | 2018-02-21 |
| KR20150127124A (ko) | 2015-11-16 |
| US10132855B2 (en) | 2018-11-20 |
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