WO2014112014A1 - Method for manufacturing heat dissipation structure - Google Patents

Abstract

The present invention provides a method for manufacturing a heat dissipation structure provided with a heat generation element (200), a heat dissipation member (100), a loading space (60), and a heat dissipation gel (300). The heat generation element (200) generates heat, and the heat dissipation member (100) dissipates to the outside heat received from the heat generation element (200). The loading space (60) is formed between the heat generation element (200) and the heat dissipation member (100), and the heat dissipation gel (300) is loaded into the loading space (60) so as to transfer the heat of the heat generation element (200) to the heat dissipation member (100). In this manufacturing method, a predetermined volume of the heat dissipation gel (300) set to fill the loading space (60) is introduced into an introduction hole (150) in the heat dissipation member (100). Next, the heat dissipation gel (300) in the introduction hole (150) is loaded into the loading space (60).

Description

Manufacturing method of heat dissipation structure Cross-reference of related applications

This disclosure is based on Japanese Patent Application No. 2013-004767 filed on January 15, 2013, and the contents thereof are disclosed in this specification.

The present disclosure relates to a method for manufacturing a heat dissipation structure.

Conventionally, an electronic component such as a processor element held on an electronic board generates heat when electric power is supplied. The heat generated in such a heating element may damage the heating element. For this reason, the heat generating element is brought into contact with a heat radiating member having a high thermal conductivity to release heat generated in the heat generating element to the heat radiating member, thereby avoiding thermal damage to the heat generating element.

However, when the heat radiating member is brought into direct contact with the heat generating element, mechanical stress may be applied from the heat radiating member to the heat generating element at the time of assembly in order to strengthen the contact between the two. In this case, the heating element may be mechanically damaged by this stress. For this reason, in order to relieve the mechanical stress, it is considered to provide a heat radiating gel between the heat generating element and the heat radiating member.

As a method for manufacturing such a heat dissipation structure, for example, as disclosed in Patent Document 1, a method of providing a heat dissipation gel between a heat generating element and a heat dissipation member using a dedicated discharge control device is known. . According to this method, by controlling the discharge amount of the heat radiating gel discharged from the nozzle by the discharge control device, a desired amount of the heat radiating gel can be disposed between the heat generating element and the heat radiating member.

In the device of Patent Document 1, the amount of heat radiation gel is precisely adjusted by a discharge control device, for example, the amount of discharge from the nozzle is previously measured so as to match the amount of heat radiation gel provided between the heat generating element and the heat radiation member. It is necessary to manage it. Therefore, the work efficiency at the time of manufacture falls.

Furthermore, in the apparatus of Patent Document 1, since the heat radiating gel is applied onto the heat generating element before the electronic substrate and the heat radiating member are assembled, the heat radiating gel adheres to the operator's hand during the assembly. Since the amount controlled to the desired amount is insufficient, the reliability of the heat dissipation structure after manufacture is lowered.

JP 2012-143678 A

The present disclosure has been made in view of the above-described problems, and an object thereof is to maintain the reliability of the heat dissipation structure after manufacturing while improving work efficiency at the time of manufacturing.

In order to achieve the above object, in the present disclosure, a heat generating element that generates heat during operation, a heat radiating member that releases the heat received from the heat generating element to the outside, and formed between the heat generating element and the heat radiating member are formed. There is provided a manufacturing method of a heat dissipation structure comprising: the filled space; and a heat dissipation gel that fills the filling space and transfers the heat of the heat generating element to the heat dissipation member. In this manufacturing method, the heat radiating gel having a predetermined volume set to fill the filling space is introduced into the introduction hole of the heat radiating member. Next, the filling space is filled with the predetermined amount of the heat-dissipating gel in the introduction hole.

FIG. 1 is an exploded perspective view showing a heat dissipation structure in the first embodiment of the present disclosure. FIG. 2 is an exploded cross-sectional view of the heat dissipation structure in the first embodiment. FIG. 3 is a partial cross-sectional view showing a main part of the heat dissipation structure in the first embodiment. FIG. 4 is an explanatory diagram showing an introduction process in the first embodiment. FIG. 5 is an explanatory view showing an assembly process in the first embodiment. FIG. 6 is an explanatory diagram showing a filling step in the first embodiment. FIG. 7 is a partial cross-sectional view showing the state after the filling step in the first embodiment is completed. FIG. 8 is an explanatory diagram illustrating an introduction process in the second embodiment of the present disclosure. FIG. 9 is an explanatory diagram showing an assembly process in the second embodiment. FIG. 10 is an explanatory view showing a filling step in the second embodiment. FIG. 11 is a partial cross-sectional view showing the state after the filling process in Modification 1 is completed. FIG. 12 is a cross-sectional view showing a heat dissipation structure in the second modification.

Hereinafter, a plurality of embodiments of the present disclosure will be described with reference to the drawings. In addition, the overlapping description may be abbreviate | omitted by attaching | subjecting the same code | symbol to the corresponding component in each embodiment. When only a part of the configuration is changed in each embodiment, the configuration of the other embodiment described above can be applied to other portions of the configuration. In addition to the combination of the configurations explicitly described in the description of each embodiment, it is possible to partially combine the configurations of the plurality of embodiments even if they are not explicitly specified unless there is a problem with the combination. .

(First embodiment)
The first embodiment of the present disclosure shown in FIGS. 1 to 7 will be described in detail.

As shown in FIG. 1, the heat dissipation structure 1 of the electronic device of the first embodiment includes a processor element 200, a main substrate 400, a heat dissipation gel 300, a top case 100, a frame portion 600, a bottom case 800, Side frame 700.

The processor element 200 as a “heating element” is an integrated circuit (electronic circuit device) such as an IC or an LSI. The processor element 200 performs arithmetic processing and the like when electric power is supplied from the outside. At that time, the processor element 200 having a resistance converts a part of the energy obtained from the electric power into heat energy. The processor element 200 generates heat due to its thermal energy.

The plate-like main substrate 400 as the “holding member” is made of resin or the like and has electric wiring printed on the surface thereof on the surface. The processor element 200 and other electronic components are mounted and held on such wiring, and the main board 400 supplies electric power from the outside to each of these elements via electric wiring. The main board 400 has a supply terminal (not shown) for supplying power from the outside and an output terminal 410 for outputting the result calculated by the processor element 200 to the outside.

The heat dissipating gel 300 is made of a silicone resin or the like that has conductivity and heat conductivity and has a high viscoelastic coefficient. The upper case 100 is in indirect contact with the processor element 200 through the heat radiating gel 300. As a result, the heat radiating gel 300 is in contact with the processor element 200 and the upper case 100 between the processor element 200 and the upper case 100, thereby transferring heat generated in the processor element 20 to the upper case 100. In addition, the heat dissipating gel 300 has a high viscoelastic coefficient to disperse external load stress applied to the processor element 200 by the upper case 100 during the process of assembling the upper case 100 to the main board 400. The processor element 200 has a stress relaxation function that relieves stress directly applied to the processor element 200.

The top case 100 as a “heat radiating member” is made of a metal having good heat conductivity such as aluminum, and is formed by die casting or the like. As shown in FIGS. 2 and 3, the upper case 100 includes a main body portion 110 and heat radiating fins 120. A plurality of plate-like heat radiation fins 120 are formed in a recess 130 that is recessed toward the processor element 200 in the main body 110, and protrudes from the bottom surface 131 of the recess 130 in the normal direction. The heat radiating fin 120 effectively radiates heat by increasing the surface area of the upper case 100 and increasing the area in contact with air.

A protrusion 140 is formed in the recess 130 so as to protrude to the opposite side of the processor element 200. An introduction hole 150 is formed on the bottom surface 131 of the recess 130 so as to penetrate the protrusion 140. The introduction hole 150 is formed in a cylindrical shape between a specific pair of radiating fins 120. Further, the introduction hole 150 extends in the normal direction with respect to the flat surface (plane) 21 of the processor element 200.

As shown in FIG. 1, the frame portion 600 is made of aluminum or the like and supports the main substrate 400. A bottom case 800 made of aluminum or the like is fixed to the frame 600 on the opposite side of the top case 100. The frame portion 600 forms a space between the bottom case 800 and holds an HDD (not shown), a power supply substrate (not shown), and the like that are electrically connected to the main substrate 400 between the frames. To do. The frame portion 600 is fixed to the heat dissipation structure 1 by fitting the upper surface case 100 and the bottom surface case 800 via a side frame 700 described later, thereby improving the rigidity of the heat dissipation structure 1.

As shown in FIG. 1, the side frame 700 is made of aluminum or the like and is formed in a plate shape. A pair of side frames 700 are provided in the heat dissipation structure 1 and are fitted to the top case 100 and the bottom case 800. Thereby, the thermal radiation structure 1 becomes a housing | casing shape.

As shown in FIG. 2, a screw receiving portion 160 is formed at a corner of the upper case 100 on the processor element 200 side. The screw 2 is fastened to the screw receiving portion 160 via the frame portion 600 and the main substrate 400, whereby the frame portion 600 and the main substrate 400 are fixed to the upper case 100. Further, since the main board 400 is covered with a casing including the top case 100, the side frame 700, and the bottom case 800, the main board 400, the processor element 200, and the like are protected from external impacts.

As shown in FIG. 3, when the upper case 100 and the main substrate 400 are assembled, the heat radiation gel 300 is filled between the surface 21 of the processor element 200 on the main substrate 400 and the lower end surface 102 of the upper case 100. A filling space 60 is defined. The introduction hole 150 communicates with the filling space 60, and the internal volume of the introduction hole 150 has the same internal volume as the filling space 60.

Next, the manufacturing method of the heat dissipation structure 1 will be described in detail with reference to FIGS. 4 to 7, the heat dissipating fins 120 are not shown in order to simplify the structure.

As shown in FIG. 4, in the introduction step, a heat dissipating gel 300 having a predetermined volume set to fill the filling space 60 is introduced into the introduction hole 150 of the upper case 100. Specifically, first, the partition member 3 is brought into contact with the lower end surface 102 side of the upper case 100. Here, the partition member 3 is a plate-like member that can come into contact with the upper case 100 so that there is no gap between the partition member 3 and the lower end surface 102. Therefore, while fixing the partition member 3 and the upper case 100 to each other, the heat radiating gel 300 is introduced into the introduction hole 150 from the upper end surface 101 side opposite to the lower end surface 102 in the upper case 100. When the heat radiating gel 300 is introduced into the introduction hole 150, it reaches the surface partitioned by the partition member 3. Further, by continuing to introduce the heat radiating gel 300, when the introduction hole 150 is filled with the heat radiating gel 300, the introduction of the heat radiating gel 300 is stopped, and the sweep member 4 is slid parallel to the upper end surface 101. The excess heat radiating gel 300 coming out of the introduction hole 150 is removed. Thereafter, the partition member 3 that has been in contact is removed from the upper surface case 100. At this time, since the heat radiating gel 300 is a material having a high viscoelastic coefficient, it does not leak from the introduction hole 150 even if the partition member 3 is removed. As described above, the heat radiating gel 300 is held in the introduction hole 150 and the introduction process is completed.

Next, in the assembling process shown in FIG. 5, the upper case 100 into which the heat radiating gel 300 has been introduced in the introducing process is assembled to the main board 400. By this assembly, the introduction hole 150 is positioned on the opposite side of the main board 400 with the processor element 200 interposed therebetween. Further, the filling space 60 is determined so as to be sandwiched between the lower end surface 102 of the upper case 100 and the surface 21 of the processor element 200 by the assembly. That is, the filling space 60 is defined on one side (the lower side in FIG. 5) in the vertical direction of FIG. 5 by the surface 21 of the processor element 200, and the other side (the upper side in FIG. 5) is the lower end surface of the upper case 100. 102. Thus, the assembly process is completed.

Subsequently, in the filling step shown in FIG. 6, the heat dissipating gel 300 held in the introduction hole 150 is extruded to fill the filling space 60. Specifically, the extrusion member 50 that is disposed on the upper end surface 101 side of the upper case 100 and that extrudes the heat-dissipating gel 300 from the introduction hole 150 is moved from the upper case 100 side to the processor element 200 side by an orthogonal drive device (not shown). Fit and insert in the A direction toward By this insertion, the heat radiating gel 300 in the introduction hole 150 is extruded into the filling space 60. When the pushing member 50 is inserted to a position where the front end surface 51 of the pushing member 50 does not exceed the lower end surface 102 of the upper case 100, the insertion is stopped. Here, since the volume of the introduction hole 150 is ensured to be the same as the volume that fills the filling space 60, when the heat radiating gel 300 is pushed out to the lower end surface 102 by the pushing member 50, the heat radiating gel 300 is filled in the filling space 60. It will be packed tightly. The extrusion member 50 is then extracted from the introduction hole 150, and the filling process is completed. As described above, when the filling step is completed, the heat radiating gel 300 is provided between the upper case 100 and the processor element 200, and the heat radiating structure 1 as shown in FIG. 7 is completed.

In the first embodiment described so far, the heat radiating gel 300 is introduced into the introduction hole 150 formed in the upper surface case 100 and the introduced heat radiating gel 300 is extruded, so that the heat radiating gel 300 is brought into contact with the processor element 200 and the upper surface. It can be provided between the case 100. Here, since the heat dissipation gel 300 having a volume that fills the filling space 60 can be introduced into the introduction hole 150, the heat dissipation gel 300 extruded into the filling space 60 can be densely filled into the filling space 60. Therefore, it can be relieved from the necessity of precisely managing the amount of the heat radiating gel 300 provided between the processor element 200 and the upper case 100. Further, since the heat-dissipating gel 300 is filled in the filling space 60 between the processor element 200 and the upper case 100, the heat-dissipating gel 300 is less exposed, and the heat-dissipating gel 300 adheres to the operator's hand and Can be prevented. As described above, it is possible to maintain the reliability of the heat dissipation structure 1 at the time of manufacture while improving the working efficiency when the heat dissipation gel 300 is provided between the processor element 200 and the upper case 100 at the time of manufacture.

Further, in the filling process in the first embodiment, the heat radiating gel 300 introduced into the introduction hole 150 is extruded by the extruding member 50 to fill the heat radiating gel 300 into the filling space 60. According to this, since the thermal radiation gel 300 can be extruded using the extrusion member 50, a filling process can be performed reliably. Therefore, it is possible to contribute to the improvement of work efficiency when the heat dissipating gel 300 is provided between the processor element 200 and the upper case 100.

Furthermore, in the first embodiment, the assembly process for assembling the upper case 100 and the main board 400 is performed after the introduction process is completed. According to this, since the introduction process can be performed before the upper case 100 and the main substrate 400 are assembled, the heat radiating gel 300 can be introduced into the introduction hole 150 without being obstructed by the main substrate 400. Therefore, it is possible to contribute to the improvement of work efficiency when the heat dissipating gel 300 is provided between the processor element 200 and the upper case 100.

Furthermore, in the first embodiment, the upper case 100 has a protruding portion 140 protruding to the opposite side of the processor element 200, and the introduction hole 150 is formed through the protruding portion 140. According to this, regardless of the thickness of the upper surface case 100, the same volume as the volume that fills the filling space 60 can be secured in the introduction hole 150 using the protrusion 140. Therefore, the volume of the introduction hole 150 can be secured without increasing the diameter of the introduction hole 150 and the contact area between the heat radiating gel 300 and the upper surface case 100 can be increased, so that heat transfer from the processor element 200 to the upper surface case 100 can be performed. It can be suitably performed. Therefore, it is possible to improve the work efficiency when the heat radiating gel 300 is provided between the processor element 200 and the upper case 100 without impairing the heat dissipation.

In addition, in the first embodiment, the introduction hole 150 formed in the protrusion 140 extends in the normal direction with respect to the flat surface (plane) 21 that defines the filling space 60 in the processor element 200. Yes. According to this, when extruding the heat radiating gel 300 by the extruding member 50, the extruding member 50 can apply the force of extruding along the surface 21 of the processor element 200 to the heat radiating gel 300 substantially evenly. Therefore, since the heat radiating gel 300 spreads uniformly on the surface of the processor element 200, the work efficiency when the heat radiating gel 300 is provided between the processor element 200 and the upper case 100 is improved, and the reliability of the heat radiating structure 1 is improved. It becomes possible to keep sex.

In addition, in the first embodiment, in the filling step, the extruding member 50 is extracted from the introducing hole 150 after the heat radiating gel 300 in the introducing hole 150 is extruded into the filling space 60 by the extruding member 50. According to this, since the extrusion member 50 can be repeatedly used by not fixing the extrusion member 50 to the heat dissipation structure 1, the number of parts of the heat dissipation structure 1 can be reduced. Therefore, it is possible to improve the work efficiency when the heat radiating gel 300 is provided between the processor element 200 and the upper case 100 while realizing cost reduction.

(Second embodiment)
Next, the second embodiment of the present disclosure shown in FIGS. 8 to 10 will be described in detail.

As shown in FIG. 8, a female screw portion 151 is formed on the inner peripheral surface of the introduction hole 150 of the second embodiment. Further, the heat dissipation structure 1 of the second embodiment is provided with a screwed body 500 made of a highly heat-conductive metal or the like. A male screw portion 501 that can be screwed with the female screw portion 151 is formed on the outer peripheral surface of the screwed body 500. The screwed body 500 corresponds to the extruded member of the present disclosure.

In the introducing step shown in FIG. 8, first, the screwed body 500 is inserted into a part of the introducing hole 150 by screwing the female screw portion 151 and the male screw portion 501 together. By this insertion, a space on the processor element 200 side of the inner surface of the introduction hole 150 with respect to the tip surface 503 of the screwed body 500 is used as the introduction space 70. Therefore, the screw body 500 is inserted into the introduction hole 150 until the introduction space 70 has the same volume as the filling space 60. Subsequently, in the introduction step, the heat radiating gel 300 is introduced into the introduction space 70. By this introduction, the heat radiating gel 300 reaches the tip end surface 503 of the screwed body 500. Further, by continuing to introduce the heat radiating gel 300, when the introduction space 70 is filled with the heat radiating gel 300, the introduction of the heat radiating gel 300 is stopped, and further, by sliding the sweep member 4 in parallel with the lower end surface 102, Excessive heat-dissipating gel 300 exiting from the introduction hole 150 is removed. Thus, the heat dissipation gel 300 is held in the introduction hole 150 in a state where the introduction space 70 is filled, and the introduction process is completed.

Next, in the assembly process shown in FIG. 9, the upper case 100 into which the heat-dissipating gel 300 has been introduced in the introduction process is assembled to the main board 400 with the lower end surface 102 facing the processor element 200 side. By this assembly, the introduction hole 150 is positioned on the opposite side of the main board 400 with the processor element 200 interposed therebetween. Further, the filling space 60 is determined so as to be sandwiched between the lower end surface 102 of the upper case 100 and the surface 21 of the processor element 200 by the assembly. Thus, the assembly process is completed.

Subsequently, in the filling step shown in FIG. 10, the heat radiating gel 300 held in the introduction space 70 is extruded to fill the filling space 60. Specifically, the screw body 500 inserted into the introduction hole 150 in the introduction step is further screwed and inserted in the A direction from the upper case 100 side toward the processor element 200 side to fill the heat dissipation gel 300 in the introduction space 70. Extrude into space 60. That is, in the present embodiment, the screwed body 500 corresponds to the pushing member 50 of the first embodiment. In this extrusion, when the screw body 500 is screwed to a position where the front end surface 503 of the screw body 500 does not exceed the lower end surface 102 of the upper case 100, the insertion is stopped. The screw body 500 has a proximal end head 502 as a stopper. When the screw body 500 is inserted into the insertion hole 150 by screwing, as shown in FIG. 10, the proximal end head 502 abuts against the protruding portion 140 and stops, whereby the screw body 500 is inserted into the insertion hole 150. Is stopped. As a result, the threaded body 500 is inserted into the introduction hole 150 to a position where the front end surface 503 of the threaded body 500 does not exceed the lower end surface 102 of the upper case 100. Here, since the volume of the introduction space 70 is ensured to be the same as the volume that fills the filling space 60, when the heat radiating gel 300 is pushed out to the lower end surface 102 by the screwed body 500, the heat radiating gel 300 is filled with the filling space 60. It will be packed tightly. Thereafter, the screwed body 500 is fixed to the upper surface case 100 without being extracted from the introduction hole 150, and the filling process is completed. As described above, when the filling process is completed, the heat radiating gel 300 is provided between the upper case 100 and the processor element 200, and the heat radiating structure 1 is completed.

As described so far, in the second embodiment, the screw body 500 is inserted into a part of the introduction hole 150 to form the introduction space 70 for introducing the heat radiating gel 300, and then the screw body 500 is further inserted. Thus, the heat radiating gel 300 in the introduction space 70 is extruded into the filling space 60. According to this, in the introduction process, the front end surface 503 of the screwed body 500 can exhibit the same function as the partition member 3 of the first embodiment, and the introduction space 70 can be accurately adjusted by the insertion depth of the screwed body 500. Instead, in the filling step, the screwed body 500 can exhibit the same function as the extruded member 50 of the first embodiment. As described above, since the same volume as the volume that fills the filling space 60 can be secured in the introduction space 70 and the filling of the heat radiating gel 300 in the filling space 60 can be reliably made dense, the reliability of the heat radiating structure 1 after manufacturing can be maintained. Is possible.

In the second embodiment, after the heat dissipation gel 300 in the introduction hole 150 is extruded into the filling space 60 by the screwing body 500 in the filling step, the screwing body 500 is fixed to the introduction hole 150 and left. According to this, since the good heat transfer screw 500 can be used as it is as a part of the heat dissipation structure 1, the heat dissipation efficiency of the heat generated in the processor element 200 can be increased. Further, since the introduction hole 150 can be filled with the screwed body 500, the heat radiating gel 300 can be prevented from leaking from the filling space 60. Therefore, it is possible to improve the work efficiency when the heat radiating gel 300 is provided between the processor element 200 and the upper case 100 while improving the heat dissipation.

(Other embodiments)
Although a plurality of embodiments of the present disclosure have been described above, the present disclosure is not limited to these embodiments, and can be applied to various embodiments without departing from the scope of the present disclosure.

Specifically, in Modification 1 related to the second embodiment, the screwed body 500 fixed to the upper surface case 100 by screwing is changed to a press-fitting member 504 fixed by press-fitting as shown in FIG. Also good. The press-fitting member 504 has a proximal end head portion 506 as a stopper. When the press-fitting member 504 is press-fitted into the insertion hole 150, the proximal end head portion 506 is brought into contact with the protruding portion 140 and stopped, whereby the press-fitting of the press-fitting member 504 into the insertion hole 150 is stopped. As a result, the press-fitting member 504 is inserted into the introduction hole 150 until the tip end surface 507 of the press-fitting member 504 does not exceed the lower end surface 102 of the upper case 100. According to this, similarly to the second embodiment, the press-fitting member 504 can be used in place of the partition member 3 of the first embodiment in the introduction step, and the press-fitting member 504 is used in the filling step in the pressing member 50 of the first embodiment. Can be used instead of The press-fitting member 504 corresponds to the extrusion member of the present disclosure.

Moreover, in the modification 2 regarding 1st embodiment and 2nd embodiment, as FIG. 12 shows, instead of the upper surface case 100 which provided the radiation fin 120, the fan case member 11 with which the some cooling fan 5 is provided. May be adopted as the “heat radiating member”. In this case, a plurality of (two in the example of FIG. 12) introduction holes 150 are provided in the fan case member 11 at positions corresponding to the gaps between the fans 5 among the plurality of cooling fans 5 whose positions are fixed. And in the introduction process, the manufacturing method of the heat dissipation structure 1 of the present disclosure can be applied by introducing the heat dissipation gel 300 into the introduction hole 150.

Furthermore, in Modification 3 relating to the first embodiment and the second embodiment, the introduction hole 150 formed in the upper case 100 is formed so as to be inclined with respect to the surface 21 of the processor element 200 in the normal direction. May be. Furthermore, in Modification 4 regarding the first embodiment and the second embodiment, a plurality of introduction holes 150 formed in the upper surface case 100 may be formed. Here, when a plurality of introduction holes 150 are formed, each introduction hole 150 is formed such that the total volume of the introduction holes 150 is the same as the volume that fills the filling space 60.

In addition, in the modified example 5 regarding the first embodiment and the second embodiment, the heat radiating gel 300 may be introduced so that the excessive heat radiating gel 300 protruding from the introduction hole 150 is not removed in the introducing step. .

In addition, in the modified example 6 related to the first embodiment and the second embodiment, the introducing step may be performed after the assembling step. In this case, after the partition member 3 is brought into contact with the upper surface case 100 before the assembly process, both the partition member 3 and the upper surface case 100 are assembled to the main substrate 400 to complete the assembly process. And after that, after introducing the thermal radiation gel 300 into the introduction hole 150, the partition member 3 is removed and the introduction process is completed. In addition, in Modification Example 7 related to the second embodiment, in the filling step, the screwed body 500 may be extracted from the introduction hole 150 after the screwed body 500 extrudes the heat radiating gel 300. In addition, in Modification 8 regarding the first embodiment, after the extruding member 50 extrudes the heat radiating gel 300 in the filling step, the extruding member 50 may be fitted and fixed without being extracted.

Furthermore, in the ninth modified example related to the first embodiment, without using the pushing member 50, compressed air is blown onto the exposed surface of the heat radiating gel 300 filled with the introduction hole 150 to fill the filling space 60 from the introduction hole 150. The heat dissipating gel 300 may be discharged and filled.

Furthermore, in the modification 10 related to the first embodiment and the second embodiment, the “heat generating element” may be a power semiconductor element such as a power transistor.

Claims (8)

1. A heat generating element (200) that generates heat during operation, a heat radiating member (100, 11) that releases the heat received from the heat generating element (200), the heat generating element (200), and the heat radiating member (100, 11) ) And a heat radiation gel (300) that fills the filling space (60) and transmits the heat of the heat generating element (200) to the heat radiating member (100, 11). A method of manufacturing a heat dissipation structure comprising:
   Introducing the heat-dissipating gel (300) of a predetermined volume set to fill the filling space (60) into the introduction hole (150) of the heat-dissipating member (100, 11);
   The manufacturing method including filling the filling space (60) with the heat-dissipating gel (300) of the predetermined volume in the introduction hole (150).
2. Filling the filling space (60) with the predetermined volume of the heat-dissipating gel (300) is achieved by inserting the push-out member (50, 500, 504) into the introduction hole (150). , 500, 504) extruding the predetermined volume of the radiating gel (300) in the introduction hole (150) into the filling space (60), and the filling space (60) with the predetermined volume of the radiating gel (300). The manufacturing method of Claim 1 including filling.
3. Introducing the predetermined volume of the heat radiating gel (300) into the introduction hole (150) of the heat radiating member (100, 11) inserts the pushing member (500, 504) into a part of the introduction hole (150). Thus, the introduction space (70) is formed in the introduction hole (150), and the heat-dissipating gel (300) having the predetermined volume is introduced into the introduction space (70) in the introduction hole (150). Including
   Filling the filling space (60) with the predetermined volume of the heat dissipating gel (300) means that after the heat dissipating gel (300) with the predetermined volume is introduced into the introduction space (70), the pushing member (500, 504) is further inserted into the introduction hole (150), and the pushing member (500, 504) pushes the predetermined amount of the heat-dissipating gel (300) in the introduction space (70) into the filling space (60). The manufacturing method according to claim 1, comprising filling the filling space (60) with the heat-dissipating gel (300) of the predetermined volume.
4. After introducing the heat dissipation gel (300) of the predetermined volume into the introduction hole (150) of the heat dissipation member (100, 11), the heat dissipation member (100, 11) and the heat generating element (200) are held. The manufacturing method according to any one of claims 1 to 3, comprising assembling the holding member (400).
5. Introducing the heat-dissipating gel (300) of the predetermined volume into the introduction hole (150) of the heat-dissipating member (100, 11) means that the heat-dissipating member (100, 11. The manufacturing method according to claim 1, comprising introducing the predetermined amount of the heat-dissipating gel (300) into the introduction hole (150) extending through the protrusion (140) of 11). .
6. Filling the filling space (60) with the predetermined volume of the heat-dissipating gel (300) means that the filling space (60) is defined on one side by the plane (21) of the heating element (200). 6. The method according to claim 1, further comprising filling the heat-dissipating gel (300) with the predetermined volume through the introduction hole (150) extending in a normal direction with respect to the plane (21) of the heating element (200). The production method according to item.
7. Filling the filling space (60) with the predetermined volume of the heat-dissipating gel (300) means that the predetermined volume of the heat-dissipating gel (300) in the introduction hole (150) is filled with the filling space by the pushing member (50). The manufacturing method according to claim 2 or 3, comprising extracting the extruded member (50) from the introduction hole (150) after being extruded into (60).
8. Filling the filling space (60) with the predetermined volume of the heat-dissipating gel (300) may cause the predetermined volume of the heat-dissipating gel (300) in the introduction hole (150) to be filled with the pushing member (500, 504). The method according to claim 2 or 3, further comprising fixing the extruded member (500, 504) and leaving the extruded member (500) in the introduction hole (150) after being extruded into the filling space (60).

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