JPH06318486A - Ic part mounting pin socket and collective socket - Google Patents

Abstract

PURPOSE:To provide a highly efficient heut radiating effect, and reduce the cost for a measure to counter the heart of an IC part, by providing a pin socket with an anchor pin part, a radiating column part having a radiation accelerating means to the outer circumference and a lead pin insent hole on the upper end of a core. CONSTITUTION:A through hole 5 corresponding to the lead pin 2 of an IC part formed on a printed circuit board 4. The anchor pin part 8b of a pin type socket 8 is inserted through it, and the protruded lower end part is soldered to board 4. When each pin 2 of the IC part is fitted to a lead pin insert hole 8d on the upper end, the radiating column part 8c of the socket 8 forms a spacer to form a radiating space between the board 4 and the package base 1 of the IC part. The heat of the IC part is emitted to the radiating space by the column part 8c through the pin 2. The outer circumferential surface of the column part 8c is subjected to knurling as a radiation accelerating means, whereby radiating effect can be enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin type socket used to mount a PGA (pin grid array) type IC component in which a large-scale IC such as a microprocessor is enclosed in a package on a printed wiring board. The present invention also relates to a collective socket, and particularly to measures against heat generation of IC parts.

[0002]

2. Description of the Related Art In mounting design of a miniaturized electronic circuit device such as a notebook personal computer, it is extremely important to take measures against heat generation of electronic parts.
It is necessary to devise a circuit to reduce heat generation as much as possible, devise a heat dissipation mechanism that efficiently dissipates generated heat, and devise a mounting method for components that reduce adverse effects of heat.

In a device such as a personal computer, a large-scale microprocessor used as a CPU is a large heat source. Recent microprocessors are PGA
Enclosed in a mold package. As shown in Figure 1,
In the PGA type IC component, a large number of lead pins 2 are regularly arranged and projected on the lower surface of a ceramic package substrate 1. These lead pins 2 are connected to a conductive pattern (not shown) printed and wired on the package substrate 1. An IC chip (not shown) is bonded to the central part of the package substrate 1, and the electrode pad part of the IC chip and the tip part of the conductive pattern are wire-bonded. The mounting portion of the IC chip is sealed with the lid 3 mounted on the package substrate 1.

FIG. 2 shows a conventional typical form of mounting this type of PGA type IC component on a printed wiring board. A large number of through holes 5 are formed in the printed wiring board 4 in accordance with the arrangement of the lead pins of the IC component, and the pin-type sockets 6 are mounted through the through holes 5.
The pin-type socket 6 is a metal rod-shaped part that fits into the through hole 5 almost exactly. The thin tip end of the pin-type socket 6 projects toward the lower surface side of the wiring board 4, and is positioned so that the flange 6a at the upper end of the pin-type socket 6 contacts the upper surface of the wiring board 4. A lead pin insertion hole (not shown) is formed at the center of the pin-type socket 6, and the hole opens at the center of the upper end flange 6a. A large number of pin type sockets 6 are attached to the through holes 5 of the printed wiring board 4 in a predetermined arrangement, and their downward protruding ends are attached to the wiring board 4.
To solder. Then, the lead pins 2 of the IC component are fitted into the lead pin insertion holes at the upper ends of the large number of pin type sockets 6 attached to the printed wiring board 4.

Usually, a radiator 7 is attached to the PGA type IC component mounted on the wiring board 4 as described above. The radiator 7 is made of aluminum, and a large number of radiation fins are integrally formed on the upper portion thereof. This radiator 7
The C component is bonded to the upper surface of the package substrate 1 to efficiently dissipate heat from the IC component.

An aggregate type socket in which a large number of pin type sockets are integrated with a socket substrate in a predetermined arrangement pattern may be used. Also in that case, the radiator 7 is added in the same manner as described above.

[0007]

As described above, in the conventional heat countermeasure in which the radiator 7 is added to the upper surface of the IC component, the component cost of the radiator itself and the mounting cost thereof have been problems. Recently, the demand for cost reduction of electronic circuit devices is very strong, and the cost of countermeasures against heat generation as described above is also targeted for reduction.

The present invention has been made in view of the above-mentioned conventional problems, and an object thereof is to efficiently provide a pin type socket and a collective type socket used when mounting an IC component such as a PGA type on a wiring board. The purpose of this is to provide a heat dissipation effect, and to significantly reduce the cost for countermeasures against heat generation of IC parts.

[0009]

A pin-type socket according to the present invention is a metal rod-shaped component used for mounting an IC component having a large number of lead pins protruding from the lower surface of a package on a printed wiring board. , The anchor pin part that penetrates the through hole of the printed wiring board and the tip part projects to the lower surface side, the heat dissipation pillar part that is thicker than the outer diameter of the anchor pin part and is continuous with the upper part, and this heat dissipation part It has a heat dissipation promoting means added to the outer periphery of the pillar portion, and a lead pin insertion hole which is formed along the center line of the heat dissipation pillar portion and opens at the upper end surface and into which the lead pin of the IC component is fitted. It is a thing.

The collective socket according to the present invention is
A socket substrate having a large number of holes formed in the same pattern as an array pattern of a large number of lead pins projectingly provided on the lower surface of a package of an IC component, and a pin according to the present invention that is penetratingly mounted in each of the holes of the socket substrate. Type sockets, the heat dissipation pillars of these pin type sockets are fitted into the holes of the socket substrate and are integrated as a whole, and the heat dissipation promoting means and the socket substrate of each pin type socket are It is one that is thermally closely coupled.

[0011]

In the pin type socket of the present invention, the anchor pin portion fitted into the through hole of the printed wiring board is integrally formed with the heat dissipation column portion thicker than the anchor pin portion, and the lead pin is fitted into the insertion hole to form an IC. When the component is mounted in the socket, the heat-dissipating pillar portion serves as a spacer, and there is a large gap between the printed wiring board and the package lower surface of the IC component. This space serves as a heat dissipation space. That is, the heat from the chips in the IC package is efficiently conducted to the lead pins through the conductive pattern of the package substrate and the substrate itself,
It is transmitted from the lead pin to the pin type socket. The heat is radiated to the heat radiation space through the heat radiation promoting means on the outer periphery of a certain heat radiation column.

In the collective socket according to the second aspect of the invention, the socket substrate functions as a radiator to enhance the heat radiation effect.

[0013]

FIG. 3 shows the structure of a pin-type socket according to the present invention.
, And its implementation is shown in FIG. The pin-type socket 8 is a metal member having a substantially round bar shape, and the outer diameter of the pin-shaped socket 8 is reduced stepwise from top to bottom. As shown in FIG. 4, a portion of the printed wiring board 4 which is fitted almost exactly into the through hole 5 at the time of mounting is the anchor pin portion 8b, and the lower end portion 8a of the anchor pin portion 8a is further thinned, and the lower end portion 8a is the through hole. It penetrates 5 and projects to the lower surface side of wiring board 4.

On the upper portion of the anchor pin portion 8b, a radiation pillar portion 8c which is considerably thicker than the anchor pin portion 8b is integrally continuous. Heat dissipation column 8
The length of c is almost the same as the total length of the anchor pin portion 8b and the lower end portion 8a, but as will be apparent from the following description, the heat dissipation column portion 8c is longer if other conditions are allowed. Better.

In order to mechanically and electrically couple the lead pin 2 protruding from the lower surface of the package substrate 1 of the PGA type IC component and the pin type socket 8, a lead pin insertion hole is formed along the center line of the heat radiation column portion 8c. 8d is formed, and the insertion hole 8d is opened in the upper end surface of the heat dissipation column portion 8c.

Further, the outer peripheral surface of the heat radiation column portion 8c is knurled as a heat radiation promoting means. Heat dissipation column 8
The outer diameter of c is considerably larger than that of the anchor pin portion 8b, and the surface area contributing to heat dissipation is very large. In addition, knurling is applied to this part to further enhance the heat dissipation effect.

A large number of through holes 5 are formed on the printed wiring board 4 in a pattern corresponding to the arrangement of the lead pins 2 of the IC component.
Are formed. The anchor pin portion 8b of the pin-type socket 8 is passed through the through hole 5, and the lower end portion protruding to the lower surface side is soldered to the wiring board 4. Then, each lead pin 2 of the IC component is inserted into the lead pin insertion hole 8d at the upper end of the large number of pin type sockets 8 attached to the printed wiring board 4.
Fit in.

Then, as shown in FIG. 4, the heat dissipation column portion 8c of each pin type socket 8 serves as a spacer, and a large gap is provided between the upper surface of the printed wiring board 4 and the lower surface of the package substrate 1 of the IC component. This space becomes a heat dissipation space. I
Most of the heat transmitted from the lead pin 2 of the C component to the pin-type socket 8 is radiated from the outer peripheral surface of the heat dissipation column portion 8c to the heat dissipation space. That is, a large number of pin-type sockets 8 function as radiators arranged on the lower surface side of the package substrate 1,
There is no need to add a dedicated radiator to the upper surface of the package substrate 1 as in the conventional case.

FIG. 5 shows another embodiment of the heat radiation promoting means added to the outer periphery of the heat radiation column portion 8c. In the embodiment of FIG. 5, a fin having a screw thread shape is formed on the outer circumference of the heat dissipation column portion 8c. This increases the surface area of this part. In the same manner, a large number of fins may be formed along the axial direction on the outer circumference of the heat dissipation column portion 8c.

The above embodiment is a type in which each pin type socket 8 is individually attached to the printed wiring board 4. As described below, the pin-type sockets 8 described above can be assembled in advance in a predetermined array pattern. One such type is a collective socket, an example of which is shown in FIGS.

The collective socket shown in FIG. 6 is obtained by combining a predetermined number of pin sockets 8 shown in FIG. 3 in a predetermined pattern and integrating them with a silicon rubber socket substrate 9. Specifically, a large number of pin-type sockets 8 are resin-molded by insert molding or the like (mold resin is a silicon rubber socket substrate 9).

That is, the form of the completed collective socket is
A large number of holes 9a are formed in the socket board 9 in the same pattern as the arrangement pattern of the large number of lead pins 2 of the IC component, and the pin-type sockets 8 are mounted through the holes 9a of the socket board 9 respectively. The heat dissipation column portion 8c of the die socket 8 is fitted into the hole 9a of the socket substrate 9 and integrated as a whole, and the heat dissipation promoting means of each pin type socket and the socket substrate are thermally and tightly coupled. Has been done.

In the case of such a collective type socket, the work of inserting the pin type socket 8 into each through hole of the printed wiring board can be integrally performed. In the present invention, the heat dissipation column portion 8c of each pin type socket 8 constituting the collective type socket mounted on the printed wiring board is located in the heat dissipation space, and functions as a heat dissipation plate in this heat dissipation space. The substrate 9 is arranged.

The collective type socket shown in FIG. 7 is provided with a socket substrate 10 made of aluminum and having a honeycomb structure, and the pin type sockets 8 are respectively provided in a large number of holes 10a formed therein.
Silicon resin with high thermal conductivity and insulation
The heat dissipation column portion 8c of the pin-type socket 8 is fixed to the socket substrate 10 via the connector 1. The socket substrate 10 of this embodiment functions as a very efficient heat dissipation plate. In addition, the fins in the axial direction described above are formed on the outer circumference of the heat dissipation column portion 8c in this embodiment.

[0025]

As described above in detail, in the pin-type socket of the present invention, the heat dissipation which is thicker than the anchor pin portion fitted into the through hole of the printed wiring board and which has the heat dissipation promoting means on the outer periphery is added. Since the pillar part is integrated,
When an IC component such as a PGA type is mounted using this, a large heat radiation column portion serves as a spacer to form a large heat radiation space between the lower surface of the IC package and the printed wiring board. It will be arranged. I
Heat is efficiently transmitted from the C component through the lead pins of the pin-type socket, and most of the heat is quickly radiated from the outer surface of the heat dissipation column portion to the space. Therefore, an expensive radiator made of aluminum as in the prior art is unnecessary, and the process of attaching a dedicated radiator can be omitted.

Further, in the collective type socket in which a large number of the pin type sockets are combined and integrated in advance, the socket substrate for integration effectively functions as a heat dissipation plate, and the heat dissipation effect can be further enhanced.

[Brief description of drawings]

FIG. 1 is a schematic view of a PGA type IC component.

FIG. 2 is a schematic diagram showing a mounting form of an IC component using a conventional pin-type socket and a radiator.

FIG. 3 is a perspective view of a pin-type socket according to an embodiment of the present invention.

FIG. 4 is a schematic diagram showing a mounting form of an IC component using the pin-type socket of the above embodiment.

FIG. 5 is a perspective view of a pin-type socket according to another embodiment of the present invention.

FIG. 6 is a schematic configuration diagram of a collective type socket according to an embodiment of the present invention.

FIG. 7 is a schematic configuration diagram of a collective socket according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Package board 2 Lead pin 4 Printed wiring board 5 Through hole 6 Conventional pin type socket 7 Radiator 8 Pin type socket 8a of the present invention 8a Lower end part 8b Anchor pin part 8c Heat dissipation pillar part 8d Lead pin insertion hole 9, 10 Socket board

Claims (5)

[Claims] 1. A metal rod-shaped component used when mounting an IC component having a large number of lead pins protruding from the lower surface of a package on a printed wiring board, the tip penetrating through a through hole of the printed wiring board. An anchor pin portion projecting to the lower surface side, a heat radiation pillar portion that is thicker than the outer diameter of the anchor pin portion and is integrally continuous with the upper portion thereof, and heat radiation promoting means added to the outer circumference of the heat radiation pillar portion. Formed along the center line of the heat dissipation column and opening at the upper end surface,
A pin-type socket for mounting an IC component, comprising a lead pin insertion hole into which the lead pin of the component is fitted. 2. The pin-type socket for mounting an IC component according to claim 1, wherein the heat dissipation promoting means is a fin formed on an outer periphery of the heat dissipation pillar portion. 3. The pin-type socket for mounting an IC component according to claim 1, wherein the heat radiation promoting means is a knurled surface formed on the outer periphery of the heat radiation column portion. 4. A socket substrate having a large number of holes formed in the same pattern as the arrangement pattern of a large number of lead pins projectingly provided on the lower surface of the package of the IC component, and the socket substrate is inserted through each of the holes. The pin-type socket according to claim 1, wherein the heat-dissipating pillar portions of these pin-type sockets are fitted into holes of the socket substrate to be integrated as a whole, and the heat-dissipation promoting means of each pin-type socket is A collective socket for mounting IC parts, characterized in that it is thermally and tightly coupled to the socket substrate. 5. The socket substrate is a radiator made of aluminum having a honeycomb structure, and an insulating member is interposed between the heat dissipation column portion of each pin-type socket and the hole of the socket substrate. The collective socket for mounting IC components according to claim 4.