JP5741597B2 - Manufacturing method of heat dissipation structure - Google Patents

Description

The present invention relates to a process for producing a heat release structure.

  Conventionally, an electronic component such as a processor element held on an electronic substrate generates heat when electric power is supplied. Since the heat generated in such a heat generating element may damage the heat generating element, the heat generating element is brought into contact with a heat radiating member having high thermal conductivity to release the heat generated in the heat generating element to the heat radiating member. This avoids thermal damage to the heating elements.

  However, when the heat radiating member is brought into direct contact with the heat generating element, mechanical stress is applied to the heat generating element from the heat radiating member at the time of assembly in order to strengthen the contact between the two. There is a possibility of receiving. For this reason, in order to relieve the mechanical stress, it is considered to provide a heat radiating gel between the heat generating element and the heat radiating member.

  As a method for manufacturing such a heat dissipation structure, for example, as disclosed in Patent Document 1, a method of providing a heat dissipation gel between a heat generating element and a heat dissipation member using a dedicated discharge control device is known. . According to this method, by controlling the discharge amount of the heat radiating gel discharged from the nozzle by the discharge control device, a desired amount of the heat radiating gel can be disposed between the heat generating element and the heat radiating member.

JP 2012-143678 A

  In the device of Patent Document 1, the amount of heat radiation gel is precisely adjusted by a discharge control device, for example, the amount of discharge from the nozzle is previously measured so as to match the amount of heat radiation gel provided between the heat generating element and the heat radiation member. It is necessary to manage it. Therefore, the work efficiency at the time of manufacture falls.

  Furthermore, in the apparatus of Patent Document 1, since the heat radiating gel is applied onto the heat generating element before the electronic substrate and the heat radiating member are assembled, the heat radiating gel adheres to the operator's hand during the assembly. Since the amount controlled to the desired amount is insufficient, the reliability of the heat dissipation structure after manufacture is lowered.

  This invention is made | formed in view of this problem, The objective is to maintain the reliability of the heat dissipation structure after manufacture, improving the working efficiency at the time of manufacture.

The present invention includes a heat generating element (200) that generates heat, a heat radiating member (100, 11) that releases heat received from the heat generating element, and a filling space (60) defined between the heat generating element and the heat radiating member. The heat dissipation structure (1) is provided with a heat dissipation gel (300) that fills the filling space (60) and transmits heat of the heat generating element to the heat dissipation member, and includes an introduction hole (150) formed in the heat dissipation member. And introducing a heat dissipation gel having a volume that fills the filling space and a filling step of filling the introduced heat dissipation gel into the filling space . In the filling step, the heat dissipation gel introduced into the introduction hole is extruded. The introduction space (70) for introducing the heat radiation gel is formed by filling the heat radiation gel into the filling space by extruding with the members (50, 500, 504) and inserting the extrusion member into a part of the introduction hole. Extruded member By inserting, characterized in that extruding the heat radiation gel introducing space to the filling space.

  According to the present invention, if a heat radiating gel having a volume that fills the filling space is introduced into the introduction hole, the heat radiating gel can be densely filled into the filling space. Therefore, it can be relieved from the necessity of precisely managing the amount of the heat radiating gel provided between the heat generating element and the heat radiating member. In addition, since the filling space between the heat generating element and the heat radiating member is filled with the heat radiating gel, the heat radiating gel is less exposed, the heat radiating gel adheres to the operator's hand, and the amount of the heat radiating gel is insufficient. Can be prevented.

  According to the above, it is possible to maintain the reliability of the heat dissipation structure after manufacture while improving the working efficiency when the heat dissipation gel is provided between the heat generating element and the heat dissipation member, particularly during manufacturing.

  In addition, the code | symbol in the parenthesis described in the claim and the means for solving a problem shows the correspondence with the specific means as described in embodiment mentioned later as one aspect of this invention. However, it does not limit the technical scope of the present invention.

The whole block diagram which shows the thermal radiation structure in 1st embodiment. The exploded sectional view of the heat dissipation structure in a first embodiment. The principal part sectional view of the heat dissipation structure in a first embodiment. Explanatory drawing which shows the introduction process in 1st embodiment. Explanatory drawing which shows the assembly | attachment process in 1st embodiment. Explanatory drawing which shows the filling process in 1st embodiment. The schematic block diagram which shows the completion of the filling process in 1st embodiment. Explanatory drawing which shows the introduction process in 2nd embodiment. Explanatory drawing which shows the assembly | attachment process in 2nd embodiment. Explanatory drawing which shows the filling process in 2nd embodiment. The schematic block diagram which shows the completion of the filling process in the modification 1. The schematic whole block diagram which shows the thermal radiation structure in the modification 2. FIG.

  Hereinafter, a plurality of embodiments of the present invention will be described with reference to the drawings. In addition, the overlapping description may be abbreviate | omitted by attaching | subjecting the same code | symbol to the corresponding component in each embodiment. When only a part of the configuration is changed in each embodiment, the configuration of the other embodiment described above can be applied to other portions of the configuration. In addition to the combination of the configurations explicitly described in the description of each embodiment, it is possible to partially combine the configurations of the plurality of embodiments even if they are not explicitly specified unless there is a problem with the combination. .

(First embodiment)
The first embodiment of the present invention shown in FIGS. 1 to 7 will be described in detail.

  As shown in FIG. 1, the heat dissipation structure 1 of the first embodiment includes a processor element 200, a main substrate 400, a heat dissipation gel 300, a top case 100, a frame portion 600, a bottom case 500, and a side frame 700. Etc.

  The processor element 200 as a “heat generating element” is an integrated circuit such as an IC or an LSI. The processor element 200 performs arithmetic processing and the like when electric power is supplied from the outside. At that time, the processor element 200 having a resistance converts a part of the energy obtained from the electric power into heat energy. The processor element 200 generates heat due to its thermal energy.

  The plate-like main substrate 400 as the “holding member” is made of resin or the like and has electrical wiring printed in a printed form on the surface. The processor element 200 and other electronic components are mounted and held on such wiring, and the main board 400 supplies electric power from the outside to each of these elements via electric wiring. The main board 400 has a supply terminal (not shown) for supplying power from the outside and an output terminal 410 for outputting the result calculated by the processor element 200 to the outside.

  The heat dissipating gel 300 is made of a silicone resin or the like having conductivity and heat conductivity and having a high viscoelastic coefficient. The upper case 100 is in indirect contact with the processor element 200 through the heat radiating gel 300. As a result, the heat radiating gel 300 is in contact with the processor element 200 and the upper case 100 between the processor element 200 and the upper case 100, thereby transferring heat generated in the processor element 20 to the upper case 100. In addition, the heat dissipating gel 300 has a high viscoelastic coefficient to disperse external load stress applied to the processor element 200 by the upper case 100 during the process of assembling the upper case 100 to the main board 400. The processor element 200 has a stress relaxation function that relieves stress directly applied to the processor element 200.

  The upper case 100 as the “heat radiating member” is made of a metal having good heat conductivity such as aluminum, and is formed by die casting or the like. As shown in FIGS. 2 and 3, the upper case 100 includes a main body portion 110 and heat radiating fins 120. A plurality of plate-like heat radiation fins 120 are formed in a recess 130 that is recessed toward the processor element 200 in the main body 110, and protrudes from the bottom surface 131 of the recess 130 in the normal direction. The heat radiating fin 120 effectively radiates heat by increasing the surface area of the upper case 100 and increasing the area in contact with air.

  A protrusion 140 is formed in the recess 130 so as to protrude to the side opposite to the processor element 200. An introduction hole 150 is formed on the bottom surface 131 of the recess 130 so as to penetrate the protrusion 140. The introduction hole 150 is formed in a cylindrical shape between a specific pair of radiating fins 120. Further, the introduction hole 150 is formed to extend in the normal direction to the flat surface 21 of the processor element 200.

  As shown in FIG. 1, the frame portion 600 is made of aluminum or the like and supports the main substrate 400. A bottom case 500 made of aluminum or the like is fixed to the frame 600 on the opposite side of the top case 100. The frame unit 600 forms a space between the bottom case 500 and holds an HDD (not shown), a power supply board (not shown), and the like that are electrically connected to the main board 400 therebetween. To do. The frame portion 600 is fitted to the upper case 100 and the bottom case 500 via a side frame 700 described later, thereby fixing the main substrate 400 in the heat dissipation structure 1 and improving the rigidity of the heat dissipation structure 1.

  As shown in FIG. 1, the side frame 700 is made of aluminum or the like and is formed in a plate shape. A pair of side frames 700 are provided in the heat dissipation structure 1 and are fitted to the top case 100 and the bottom case 500. Thereby, the thermal radiation structure 1 becomes a housing | casing shape.

  As shown in FIG. 2, a screw receiving portion 160 is formed at a corner of the upper case 100 on the processor element 200 side. The screw 2 is fastened to the screw receiving portion 160 via the frame portion 600 and the main substrate 400, whereby the frame portion 600 and the main substrate 400 are fixed to the upper case 100. In addition, the main substrate 400 is covered with a casing including the top case 100, the side frame 700, and the bottom case 500, so that the main substrate 400, the processor element 200, and the like are protected from external shocks.

  As shown in FIG. 3, when the upper case 100 and the main substrate 400 are assembled, the heat radiation gel 300 is filled between the surface 21 of the processor element 200 on the main substrate 400 and the lower end surface 102 of the upper case 100. A filling space 60 is defined. The introduction hole 150 communicates with the filling space 60, and the internal volume of the introduction hole 150 has the same internal volume as the filling space 60.

  Next, the manufacturing method of the heat dissipation structure 1 will be described in detail with reference to FIGS. 4 to 7, the heat dissipating fins 120 are not shown in order to simplify the structure.

  As shown in FIG. 4, in the introduction step, the heat radiating gel 300 is introduced into the introduction hole 150 of the upper case 100. Specifically, first, the partition member 3 is brought into contact with the lower end surface 102 side of the upper case 100. Here, the partition member 3 is a plate-like member that can come into contact with the upper case 100 so that there is no gap between the partition member 3 and the lower end surface 102. Therefore, while fixing the partition member 3 and the upper case 100 to each other, the heat radiating gel 300 is introduced into the introduction hole 150 from the upper end surface 101 side opposite to the lower end surface 102 in the upper case 100. When the heat radiating gel 300 is introduced into the introduction hole 150, it reaches the surface partitioned by the partition member 3. Further, by continuing to introduce the heat radiating gel 300, when the introduction hole 150 is filled with the heat radiating gel 300, the introduction of the heat radiating gel 300 is stopped, and the sweep member 4 is slid parallel to the upper end surface 101. The excess heat radiating gel 300 coming out of the introduction hole 150 is removed. Thereafter, the partition member 3 that has been in contact is removed from the upper surface case 100. At this time, since the heat radiating gel 300 is a material having a high viscoelastic coefficient, it does not leak from the introduction hole 150 even if the partition member 3 is removed. As described above, the heat radiating gel 300 is held in the introduction hole 150 and the introduction process is completed.

  Next, in the assembly process shown in FIG. 5, the upper case 100 into which the heat dissipation gel 300 has been introduced in the introduction process is assembled to the main board 400. By this assembly, the introduction hole 150 is positioned on the opposite side of the main board 400 with the processor element 200 interposed therebetween. Further, the filling space 60 is determined so as to be sandwiched between the lower end surface 102 of the upper case 100 and the surface 21 of the processor element 200 by the assembly. Thus, the assembly process is completed.

  Subsequently, in the filling step shown in FIG. 6, the heat dissipating gel 300 held in the introduction hole 150 is extruded to fill the filling space 60. Specifically, the extrusion member 50 that is disposed on the upper end surface 101 side of the upper case 100 and that extrudes the heat-dissipating gel 300 from the introduction hole 150 is moved from the upper case 100 side to the processor element 200 side by an orthogonal drive device (not shown). Fit and insert in the A direction toward By this insertion, the heat radiating gel 300 in the introduction hole 150 is extruded into the filling space 60. When the pushing member 50 is inserted to a position where the front end surface 51 of the pushing member 50 does not exceed the lower end surface 102 of the upper case 100, the insertion is stopped. Here, since the volume of the introduction hole 150 is ensured to be the same as the volume that fills the filling space 60, when the heat radiating gel 300 is pushed out to the lower end surface 102 by the pushing member 50, the heat radiating gel 300 is filled in the filling space 60. It will be packed tightly. The extrusion member 50 is then extracted from the introduction hole 150, and the filling process is completed. As described above, when the filling step is completed, the heat radiating gel 300 is provided between the upper case 100 and the processor element 200, and the heat radiating structure 1 as shown in FIG. 7 is completed.

  In the first embodiment described so far, the heat radiating gel 300 is introduced into the introduction hole 150 formed in the upper surface case 100 and the introduced heat radiating gel 300 is extruded, so that the heat radiating gel 300 is brought into contact with the processor element 200 and the upper surface. It can be provided between the case 100. Here, since the heat dissipation gel 300 having a volume that fills the filling space 60 can be introduced into the introduction hole 150, the heat dissipation gel 300 extruded into the filling space 60 can be densely filled into the filling space 60. Therefore, it can be relieved from the necessity of precisely managing the amount of the heat radiating gel 300 provided between the processor element 200 and the upper case 100. Further, since the heat-dissipating gel 300 is filled in the filling space 60 between the processor element 200 and the upper case 100, the heat-dissipating gel 300 is less exposed, and the heat-dissipating gel 300 adheres to the operator's hand and the amount of the heat-dissipating gel. Can be prevented. As described above, it is possible to maintain the reliability of the heat dissipation structure 1 at the time of manufacture while improving the working efficiency when the heat dissipation gel 300 is provided between the processor element 200 and the upper case 100 at the time of manufacture.

  In the first embodiment, in the filling step, the heat radiating gel 300 introduced into the introduction hole 150 is pushed out by the pushing member 50 to fill the heat radiating gel 300 into the filling space 60. According to this, since the thermal radiation gel 300 can be extruded using the extrusion member 50, a filling process can be performed reliably. Therefore, it is possible to contribute to the improvement of work efficiency when the heat dissipating gel 300 is provided between the processor element 200 and the upper case 100.

  Furthermore, the assembly process for assembling the upper case 100 and the main board 400 in the first embodiment is performed after the introduction process is completed. According to this, since the introduction process can be performed before the upper case 100 and the main substrate 400 are assembled, the heat radiating gel 300 can be introduced into the introduction hole 150 without being obstructed by the main substrate 400. Therefore, it is possible to contribute to the improvement of work efficiency when the heat dissipating gel 300 is provided between the processor element 200 and the upper case 100.

  Furthermore, in the first embodiment, the upper case 100 has a protrusion 140 protruding to the opposite side of the processor element 200, and the introduction hole 150 is formed so as to penetrate the protrusion 140. According to this, regardless of the thickness of the upper surface case 100, the same volume as the volume that fills the filling space 60 can be secured in the introduction hole 150 using the protrusion 140. Therefore, the volume of the introduction hole 150 can be secured without increasing the diameter of the introduction hole 150 and the contact area between the heat radiating gel 300 and the upper surface case 100 can be increased, so that heat transfer from the processor element 200 to the upper surface case 100 can be performed. It can be suitably performed. Therefore, it is possible to improve the work efficiency when the heat radiating gel 300 is provided between the processor element 200 and the upper case 100 without impairing the heat dissipation.

  In addition, in the first embodiment, the introduction hole 150 is formed in the normal direction with respect to the flat surface 21 defining the filling space 60 in the processor element 200. According to this, when extruding the heat radiating gel 300 by the extruding member 50, the extruding member 50 can apply the force of extruding along the surface 21 of the processor element 200 to the heat radiating gel 300 substantially evenly. Therefore, since the heat radiating gel 300 spreads uniformly on the surface of the processor element 200, the work efficiency when the heat radiating gel 300 is provided between the processor element 200 and the upper case 100 is improved. It becomes possible to maintain reliability.

  In addition, in the first embodiment, the extrusion member 50 is extracted from the introduction hole 150 after the filling process is completed. According to this, since the extrusion member 50 can be repeatedly used by not fixing the extrusion member 50 to the heat dissipation structure 1, the number of parts of the heat dissipation structure 1 can be reduced. Therefore, it is possible to improve the work efficiency when the heat radiating gel 300 is provided between the processor element 200 and the upper case 100 while realizing cost reduction.

(Second embodiment)
Next, the second embodiment of the present invention shown in FIGS. 8 to 10 will be described in detail.

  As shown in FIG. 8, a female screw portion 151 is formed on the inner peripheral surface of the introduction hole 150 of the second embodiment. In addition, the heat dissipation structure 1 of the second embodiment is provided with a screwed body 500 made of a metal having good heat conductivity so as to form a male screw part 501 that can be screwed with the female screw part 151.

  In the introducing step shown in FIG. 8, first, the screwed body 500 is inserted into a part of the introducing hole 150 by screwing the female screw portion 151 and the male screw portion 501 together. By this insertion, the space closer to the processor element 200 than the front end surface 503 in the internal space of the introduction hole 150 is used as the introduction space 70. Therefore, the screw body 500 is inserted into the introduction hole 150 until the introduction space 70 has the same volume as the filling space 60. Subsequently, in the introduction step, the heat radiating gel 300 is introduced into the introduction space 70. By this introduction, the heat radiating gel 300 reaches the tip end surface 503 of the screwed body 500. Further, by continuing to introduce the heat radiating gel 300, when the introduction space 70 is filled with the heat radiating gel 300, the introduction of the heat radiating gel 300 is stopped, and further, by sliding the sweep member 4 in parallel with the lower end surface 102, Excessive heat-dissipating gel 300 exiting from the introduction hole 150 is removed. Thus, the heat dissipation gel 300 is held in the introduction hole 150 in a state where the introduction space 70 is filled, and the introduction process is completed.

  Next, in the assembling step shown in FIG. 9, the upper case 100 into which the heat dissipation gel 300 has been introduced in the introducing step is assembled to the main substrate 400 with the lower end surface 102 facing the processor element 200 side. By this assembly, the introduction hole 150 is positioned on the opposite side of the main board 400 with the processor element 200 interposed therebetween. Further, the filling space 60 is determined so as to be sandwiched between the lower end surface 102 of the upper case 100 and the surface 21 of the processor element 200 by the assembly. Thus, the assembly process is completed.

  Subsequently, in the filling step shown in FIG. 10, the heat radiating gel 300 held in the introduction space 70 is extruded to fill the filling space 60. Specifically, the screw body 500 inserted into the introduction hole 150 in the introduction step is further screwed and inserted in the A direction from the upper case 100 side toward the processor element 200 side to fill the heat dissipation gel 300 in the introduction space 70. Extrude into space 60. That is, in the present embodiment, the screwed body 500 corresponds to the pushing member 50 of the first embodiment. In this extrusion, when the screw body 500 is screwed to a position where the front end surface 503 of the screw body 500 does not exceed the lower end surface 102 of the upper case 100, the insertion is stopped. Here, since the volume of the introduction space 70 is ensured to be the same as the volume that fills the filling space 60, when the heat radiating gel 300 is pushed out to the lower end surface 102 by the screwed body 500, the heat radiating gel 300 is filled with the filling space 60. It will be packed tightly. Thereafter, the screwed body 500 is fixed to the upper surface case 100 without being extracted from the introduction hole 150, and the filling process is completed. As described above, when the filling process is completed, the heat radiating gel 300 is provided between the upper case 100 and the processor element 200, and the heat radiating structure 1 is completed.

  As described so far, in the second embodiment, the screw body 500 is inserted into a part of the introduction hole 150 to form the introduction space 70 for introducing the heat radiating gel 300, and then the screw body 500 is further inserted. Thus, the heat radiating gel 300 in the introduction space 70 is extruded into the filling space 60. According to this, in the introduction process, the front end surface 503 of the screwed body 500 can exhibit the same function as the partition member 3 of the first embodiment, and the introduction space 70 can be accurately adjusted by the insertion depth of the screwed body 500. Instead, in the filling step, the screwed body 500 can exhibit the same function as the extruded member 50 of the first embodiment. As described above, since the same volume as the volume that fills the filling space 60 can be secured in the introduction space 70 and the filling of the heat radiating gel 300 in the filling space 60 can be reliably made dense, the reliability of the heat radiating structure 1 after manufacturing can be maintained. Is possible.

  In the second embodiment, the screwed body 500 is fixed to the introduction hole 150 after the filling step is completed. According to this, since the good heat transfer screw 500 can be used as it is as a part of the heat dissipation structure 1, the heat dissipation efficiency of the heat generated in the processor element 200 can be increased. Further, since the introduction hole 150 can be filled with the screwed body 500, the heat radiating gel 300 can be prevented from leaking from the filling space 60. Therefore, it is possible to improve the work efficiency when the heat radiating gel 300 is provided between the processor element 200 and the upper case 100 while improving the heat dissipation.

(Other embodiments)
As mentioned above, although several embodiment of this invention was described, this invention is not limited to these embodiment, In the range which does not deviate from the summary, it can apply to various embodiment.

  Specifically, in Modification 1 related to the second embodiment, the screwed body 500 fixed to the upper surface case 100 by screwing is changed to a press-fitting member 504 fixed by press-fitting as shown in FIG. Also good. According to this, similarly to the second embodiment, the press-fitting member 504 can be used in place of the partition member 3 of the first embodiment in the introduction step, and the press-fitting member 504 is used in the filling step in the pressing member 50 of the first embodiment. Can be used instead of

  Moreover, in the modification 2 regarding 1st embodiment and 2nd embodiment, as FIG. 12 shows, instead of the upper surface case 100 which provided the radiation fin 120, the fan case member 11 in which the cooling fan 5 is provided " You may employ | adopt as a heat radiating member. In this case, the introduction hole 150 is provided in the fan case member 11 at a position corresponding to the gap between the fans among the cooling fans 5 whose positions are fixed. And in the introduction process, the method for manufacturing the heat dissipation structure 1 of the present invention can be applied by introducing the heat dissipation gel 300 into the introduction hole 150.

  Furthermore, in Modification 3 relating to the first embodiment and the second embodiment, the introduction hole 150 formed in the upper case 100 is formed so as to be inclined with respect to the surface 21 of the processor element 200 in the normal direction. May be. Furthermore, in Modification 4 regarding the first embodiment and the second embodiment, a plurality of introduction holes 150 formed in the upper surface case 100 may be formed. Here, when a plurality of introduction holes 150 are formed, each introduction hole 150 is formed such that the total volume of the introduction holes 150 is the same as the volume that fills the filling space 60.

  In addition, in the modified example 5 regarding the first embodiment and the second embodiment, the heat radiating gel 300 may be introduced so that the excessive heat radiating gel 300 protruding from the introduction hole 150 is not removed in the introducing step. .

  In addition, in the modification 6 regarding 1st embodiment and 2nd embodiment, you may perform an introduction process after an assembly | attachment process. In this case, after the partition member 3 is brought into contact with the upper surface case 100 before the assembly process, both the partition member 3 and the upper surface case 100 are assembled to the main substrate 400 to complete the assembly process. And after that, after introducing the thermal radiation gel 300 into the introduction hole 150, the partition member 3 is removed and the introduction process is completed. In addition, in Modification Example 7 related to the second embodiment, in the filling step, the screwed body 500 may be extracted from the introduction hole 150 after the screwed body 500 extrudes the heat radiating gel 300. In addition, in Modification 8 regarding the first embodiment, after the extruding member 50 extrudes the heat radiating gel 300 in the filling step, the extruding member 50 may be fitted and fixed without being extracted.

  Furthermore, in the modified example 9 regarding the first embodiment, without using the pushing member 50, compressed air is blown onto the exposed surface of the heat radiating gel 300 filled with the introduction port 150 to fill the filling space 60 from the introduction port 150. The heat dissipating gel 300 may be discharged and filled.

  Furthermore, in the modification 10 regarding the first embodiment and the second embodiment, the “heating element” may be a power semiconductor element such as a power transistor.

  DESCRIPTION OF SYMBOLS 1 Heat dissipation structure, 100 Upper surface case, 101 Upper end surface, 102 Lower end surface, 110 Main body part, 120 Radiation fin, 130 Recessed part, 131 Bottom surface, 140 Projection part, 150 Introduction hole, 151 Female screw part, 160 Screw receiving part, 11 Fan Case member, 200 processor element, 300 heat radiating gel, 400 main board, 410 output terminal, 500 bottom case, 600 frame part, 700 side wall frame, 50 extruded member, 500 screwed body, 501 male screw part, 502 base end head part, 503 Tip surface, 504 Press-fit member, 60 Filling space, 70 Introduction space, 3 Partition member, 4 Sweep member

Claims (6)

A heat generating element (200) for generating heat, a heat radiating member (100, 11) for releasing heat received from the heat generating element, and a filling space (60) defined between the heat generating element and the heat radiating member; A heat radiating structure (1) comprising a heat radiating gel (300) filled in the filling space and transmitting heat of the heat generating element to the heat radiating member,
An introduction step of introducing into the introduction hole (150) formed in the heat dissipation member a volume of the heat dissipation gel that fills the filling space;
Filling the filling space with the introduced heat dissipation gel ,
In the filling step,
The extruding member (50, 500, 504) extrudes the heat dissipating gel introduced into the introduction hole to fill the heat dissipating gel into the filling space,
By inserting the extrusion member into a part of the introduction hole, an introduction space (70) for introducing the heat dissipation gel is formed,
A method of manufacturing a heat dissipation structure, wherein the heat dissipation gel in the introduction space is extruded into the filling space by further inserting the extrusion member . An assembly step of assembling the heat dissipation member and the holding member (400) for holding the heat generating element;
The method for manufacturing a heat dissipation structure according to claim 1, wherein the assembly step is performed after the introduction step is completed. The heat dissipating member has a protruding portion (140) protruding on the opposite side to the heat generating element,
The introduction hole method for manufacturing a heat dissipation structure according to claim 1 or 2, characterized in that it is formed through the protrusion. The heating element has a flat surface (21) that defines the filling space,
The introduction hole method for manufacturing a heat dissipation structure according to any one of claims 1 to 3, characterized in that it is formed in the direction normal to the surface. The method for manufacturing a heat dissipation structure according to any one of claims 1 to 4 , wherein after the filling step is completed, the extruded member is extracted from the introduction hole. After completion of the filling process, the extrusion member manufacturing method of the heat dissipation structure according to any one of claims 1 to 4, characterized in that it is fitted and fixed to the introduction hole.

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