WO2014110854A1 - 阵列基板修复装置及方法 - Google Patents
阵列基板修复装置及方法 Download PDFInfo
- Publication number
- WO2014110854A1 WO2014110854A1 PCT/CN2013/071699 CN2013071699W WO2014110854A1 WO 2014110854 A1 WO2014110854 A1 WO 2014110854A1 CN 2013071699 W CN2013071699 W CN 2013071699W WO 2014110854 A1 WO2014110854 A1 WO 2014110854A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- array substrate
- pattern
- excess photoresist
- filter lens
- repairing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Definitions
- the present invention relates to liquid crystal manufacturing technology, and more particularly to an array substrate repairing apparatus and method.
- the exposed pattern is left on the etching layer.
- the exposure is insufficient, there may be cases where excess photoresist is present in the exposed pattern, and the excess photoresist needs to be repaired.
- the engineer needs to manually locate the excess photoresist after removing the excess photoresist, and then remove or repair the excess photoresist. Due to the precise pattern structure formed on the array substrate, the operation using manual positioning is complicated and cumbersome, and often the positioning error may occur and the repair fails.
- an array substrate repairing apparatus includes:
- a detecting device configured to detect whether there is excess photoresist on the array substrate
- the filter lens is disposed above the array substrate, the laser source is disposed above the filter lens, and the detecting device is disposed above the array substrate.
- the detecting device includes an image collector for acquiring a pattern on the array substrate, and an image comparator for comparing the pattern on the array substrate with a preset target pattern to determine whether there is excess photoresist .
- the array substrate repairing apparatus of the present invention further includes a display device connected to the detecting device for displaying a pattern on the array substrate.
- the filter lens includes a light shielding area and a light transmission area, and the pattern of the light shielding area matches the correct pattern on the array substrate.
- the array substrate repairing device of the present invention comprises:
- the detecting device detects whether there is excess photoresist in the array substrate. When there is excess photoresist, the laser light emitted from the laser source passes through the filtering lens and is irradiated on the excess photoresist to repair the excess photoresist.
- the detecting device includes an image collector and an image comparator connected to each other; the image collector first acquires a pattern on the array substrate, and the image comparator compares the acquired pattern with a preset target pattern.
- the array substrate repairing apparatus includes a display device connected to the detecting device, and the display device displays the pattern acquired by the detecting device.
- the filter lens includes a light shielding area and a light transmission area, and the pattern of the light shielding area matches the correct pattern on the array substrate.
- an array substrate repairing method comprising the steps of:
- the filter lens is disposed on the array substrate, and the laser source is disposed on the filter lens, so that the laser light emitted by the laser source is irradiated on the excess photoresist after passing through the filter lens;
- Exposure repair of excess photoresist using a laser exiting the laser source Exposure repair of excess photoresist using a laser exiting the laser source.
- the step of detecting whether there is excess photoresist on the array substrate comprises:
- the pattern on the array substrate is compared with a target pattern set in advance.
- the array substrate repairing method of the present invention further includes displaying a pattern on the array substrate.
- the method for repairing an array substrate of the present invention further comprises forming a light-shielding region and a light-transmitting region on the filter lens, and the pattern of the light-shielding region matches the correct pattern on the array substrate.
- the array substrate repairing apparatus and method of the present invention can improve the repair efficiency of the repair process by performing rapid and accurate repair of the array substrate by performing manual positioning without performing manual positioning when performing repair of excess photoresist on the array substrate. Fix the quality.
- FIG. 1 is a schematic view of a preferred embodiment of an array substrate repairing apparatus of the present invention
- Figure 2.a is a schematic diagram of an array substrate in a normal state
- FIG. 2b is a schematic diagram of an array substrate with excess photoresist repaired by using the array substrate repairing apparatus shown in FIG. 1;
- FIG. 2b is a schematic diagram of an array substrate with excess photoresist repaired by using the array substrate repairing apparatus shown in FIG. 1;
- Figure 2.c is a schematic view of the filter lens in the array substrate repairing device shown in Figure 1;
- FIG. 3 is a flow chart of a preferred embodiment of a method for repairing an array substrate according to the present invention.
- FIG. 4 is a schematic view of an array substrate for performing dark spot repair using the method shown in FIG. 3;
- Fig. 5 is a schematic view of a filter lens when dark spot repair is performed using the method shown in Fig. 3.
- Figure 1 shows the invention
- Array substrate repair apparatus is a schematic view of a preferred embodiment.
- the array substrate 300 is a substrate which has been exposed and has a pattern on its surface.
- the array substrate repairing device is required to inspect and repair the pattern left on the surface.
- a filter lens 200 is disposed above the array substrate 300.
- the filter lens 200 is provided with a light shielding region 201 and a light transmitting region 202 corresponding to an ideal etching pattern originally formed on the array substrate 300.
- a laser source 100 is disposed above the filter lens 200, and the light emitted by the laser source 100 can pass through the light-transmitting region 202 on the filter lens 200 while being completely blocked by the light-shielding region 201. Since the light-shielding region 201 blocks the light of the laser light source 100, only the excess light resistance of the array substrate 300 is irradiated with the laser light, and the normal region is not exposed.
- This embodiment is further provided with a detecting device 400 for detecting whether there is excess photoresist on the array substrate 300.
- An image collector and an image comparator are disposed in the detecting device 400.
- the image collector collects the pattern on the array substrate 300 and submits it to the image comparator for comparison with a target image stored in advance, wherein the target graphic may be the original An ideal etch pattern formed on the array substrate 300 is set. According to the comparison result, the portion of the array substrate 300 that is inconsistent with the target pattern can determine whether there is excess photoresist on the array substrate.
- the detecting device 400 is disposed above the array substrate 300 and has a certain inclination angle with respect to the array substrate 300.
- the position of the detecting device 400 can also be adjusted according to actual needs, as long as the exposure of the laser source 100 is not affected.
- the detecting device 400 can be disposed directly above the array substrate 300, after the detection is completed. The detecting device 400 is removed.
- the array substrate repairing apparatus of the present invention further includes a display device 500 connected to the detecting device 400, and the display device 500 displays the image acquired by the detecting device 400 to the operator so that the operator can view the effect of the repair.
- Fig. 2.a the array substrate 300 in a normal state, the array substrate 300 is etched, and a desired lithographic pattern 301 is left thereon.
- the etching effect is not good and the excess photoresist is generated, the effect is as shown in FIG. 2.b.
- the array substrate 300 in addition to the lithographic pattern 301, there is an excess photoresist 302, and the unnecessary photoresist 302. It needs to be removed without affecting the lithographic pattern 301.
- a light-shielding region 201 and a light-transmitting region 202 are disposed on the filter lens 200, as shown in Fig. 2.c, wherein the pattern of the light-shielding region 201 matches the lithographic pattern 301, so that the laser source 100 is illuminated.
- the lithographic pattern 301 of the array substrate 300 is not affected by the laser source 100.
- the excess photoresist 302 is removed by exposure to the laser, resulting in an array substrate as shown in Figure 2.a.
- the process of using the array substrate repairing device is as shown in the flow of FIG. 3.
- the detecting device 400 detects whether there is excess photoresist on the array substrate 300 to be repaired.
- the method for detecting and determining is: collecting the pattern of the array substrate 300 by the image collector in the detecting device 400, and then collecting by the image comparator.
- the resulting pattern is compared to a preset target pattern (ie, the desired pattern that is expected to be obtained) to determine if there is excess photoresist.
- the detection repair process ends; otherwise, the repair process is performed: the filter lens 200 is disposed, so that the light shielding area on the filter lens 200 can completely block the normal lithographic pattern 301, so that the normal light
- the engraved pattern 301 is not irradiated with laser light, and the outgoing light of the laser source 100 passes through the light transmitting region and is irradiated at other positions of the array substrate 300, so that the excess photoresist 302 is repaired.
- the detecting device 400 After repair, the detecting device 400 re-detects whether there is still excess photoresist, and if it still exists, repeats the repair process until the excess photoresist is repaired.
- the array substrate repairing apparatus and method of the present invention can also be used for welding when the dark spots of the array substrate are repaired.
- Figure 4 shows an array substrate that needs to be repaired by dark spots. When repairing, it needs to be soldered at a fixed point. Welding is performed at the first point 601, the second point 602, and the third point 603. Process requirements do not affect wiring in substantially other locations. Since the position of the weld is fixed in the pattern, we can use a filter lens (such as the filter lens 200 described above) for auxiliary welding, as shown in Figure 5.
- the filter lens of Fig. 5 is disposed at a first point 601, a second point 602, and a third point 603 for laser light transmission, and is shielded from laser light at other positions (i.e., the black portion in Fig. 5).
- the substrate is shielded by the filter lens except for the above three points, the quality of the solder is improved.
- the repair of the array substrate and the soldering of the fixed point can use the same device, except that the filter lens used is different, thereby improving the versatility of the liquid crystal manufacturing apparatus and reducing the cost of the liquid crystal manufacturing process.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Prostheses (AREA)
- Laser Beam Processing (AREA)
Abstract
一种阵列基板修复装置及方法,其中该装置包括:激光源(100),用于修补阵列基板(300)上的多余光阻(302);检测装置(400),用于检测阵列基板(300)上是否存在多余光阻(302);过滤镜片(200),用于使激光源(100)射出的光照射在阵列基板(300)的多余光阻(302)上;过滤镜片(200)设置在阵列基板(300)上方,激光源(100)设置在过滤镜片(200)上方,检测装置(400)设置在阵列基板(300)的上方。实施该阵列基板修复装置及方法能够快速、准确地对阵列基板(300)进行修复。
Description
本发明涉及液晶制造技术,更具体地说,涉及一种阵列基板修复装置及方法。
在液晶的阵列基板制造过程中,利用光罩对基底上的刻蚀层进行光照后,会在刻蚀层上留下曝光后的图形。在这类操作中,若是曝光不够充分,则有可能出现曝光后的图形中存在多余光阻的情况,此时需要对多余的光阻进行修补。在现有的技术中,工程人员需要在找到该多余的光阻后,进行手动定位,然后对多余的光阻进行移除或修补的动作。由于阵列基板上形成的图形结构精密,采用人工定位的操作复杂繁琐,时常可能出现定位失误而导致修补失败。
本发明的目的在于,针对现有的阵列基板修复技术中,容易出现定义失误而导致修补失败的缺陷,提供一种阵列基板修复装置及方法以克服该缺陷。本发明的一个方面,提供一种阵列基板修复装置,包括:
激光源,用于修复阵列基板上的多余光阻;
检测装置,用于检测阵列基板上是否存在多余光阻;
过滤镜片,用于使激光源出射的光照射在阵列基板的多余光阻上以修复该多余光阻;
其中,过滤镜片设置在阵列基板上方,激光源设置在过滤镜片上方,检测装置设置在阵列基板的上方。
本发明的阵列基板修复装置,检测装置包括图像采集器,用于获取阵列基板上的图案;以及图像对比器,用于对比阵列基板上的图案和预先设置的目标图案,确定是否存在多余光阻。
本发明的阵列基板修复装置,还包括显示装置,显示装置与检测装置连接,用于显示阵列基板上的图案。
本发明的阵列基板修复装置,过滤镜片上包括遮光区与透光区,遮光区的图案与阵列基板上的正确图案相匹配。
本发明的阵列基板修复装置,包括:
激光源,检测装置和过滤镜片;
检测装置检测阵列基板是否存在多余光阻,存在多余光阻时,以激光源出射的激光在经过过滤镜片后,照射在多余光阻上,对多余光阻进行修复。
本发明的阵列基板修复装置,检测装置包括相互连接的图像采集器和图像对比器;图像采集器首先获取阵列基板上的图案,图像对比器将获取的图案与预先设置的目标图案进行比较。
本发明的阵列基板修复装置,阵列基板修复装置包括与检测装置连接的显示装置,显示装置对检测装置获取的图案进行显示。
本发明的阵列基板修复装置,过滤镜片上包括遮光区与透光区,遮光区的图案与阵列基板上的正确图案相匹配。
本发明的另一个方面,提供一种阵列基板修复方法,包括以下步骤:
检测阵列基板上是否存在多余光阻;
若存在多余光阻,将过滤镜片设置在阵列基板上,激光源设置在过滤镜片上,使得激光源出射的激光在经过过滤镜片后,照射在多余光阻上;
使用激光源出射的激光对多余光阻进行曝光修复。
本发明的阵列基板修复方法,检测阵列基板上是否存在多余光阻的步骤包括:
获取阵列基板上的图案;
将阵列基板上的图案与预先设置的目标图案比较。
本发明的阵列基板修复方法,还包括显示阵列基板上的图案。
本发明的阵列基板修复方法,还包括在过滤镜片上形成遮光区与透光区,遮光区的图案与阵列基板上的正确图案相匹配。
实施本发明的阵列基板修复装置及方法,在进行阵列基板上多余光阻的修复时,无需进行人工定位,通过过滤镜片快速、准确地对阵列基板进行修复,从而提高了修复过程的工作效率以及修复质量。
以下结合附图对本发明进行说明,其中:
图1为本发明 阵列基板修复装置优选实施例的示意图;
图2.a为正常状态下的阵列基板示意图;
图2.b为使用图1所示的阵列基板修复装置进行修复的带有多余光阻的阵列基板示意图;
图2.c为图1所示的阵列基板修复装置中过滤镜片的示意图;
图3为本发明阵列基板修复方法 优选实施例 的流程图;
图4为使用图3所示的方法进行暗点修复的阵列基板示意图;
图5为使用图3所示的方法进行暗点修复时的过滤镜片示意图。
以下结合附图与具体实施方式对本发明进行说明。
如图1所示为本发明
阵列基板修复装置一则优选实施例的示意图,在本实施例中阵列基板300为已经经过曝光,在其表面留有图案的基板。阵列基板修复装置要对其表面留下的图案进行检查修复。
在阵列基板300上方设置有过滤镜片200,过滤镜片200上设置有遮光区201和透光区202,遮光区201与原定在该阵列基板300上形成的理想刻蚀图形相对应。在过滤镜片200的上方设置有激光源100,激光源100发出的光能够透过过滤镜片200上的透光区202,同时会被遮光区201完全阻挡。由于有遮光区201将激光源100的光挡住,仅在阵列基板300的多余光阻上会受到激光的照射,正常区域不会受到曝光。
本实施例还设置有检测装置400,检测装置400用于检测阵列基板300上是否存在多余光阻。检测装置400内设置有图像采集器和图像比较器,图像采集器对阵列基板300上的图案进行采集,并交由图像比较器进行与预先存储的目标图形的比较,其中该目标图形可以为原定在该阵列基板300上形成的理想刻蚀图形。根据比较结果中该阵列基板300上的图案与该目标图形不一致的部分,可以确定阵列基板上是否有多余的光阻。为了不影响激光源100的曝光,检测装置400设置在阵列基板300的上方,且相对于阵列基板300具有一定的倾斜角度。需要说明的是,检测装置400的位置还可以依据实际需要进行调整,只要不影响激光源100的曝光即可,例如,可以将检测装置400设置在阵列基板300的正上方,在检测完成之后再移开检测装置400。
优选的,本发明的阵列基板修复装置还包括一个与检测装置400相连接的显示装置500,显示装置500将检测装置400获取的图像显示给操作者,使得操作者可以观看到修复的效果。
为了说明本发明的效果,现结合图2.a~图2.c进行说明。如图2.a为正常状态时的阵列基板300,阵列基板300经过刻蚀,其上面留有所需要的光刻图案301。当刻蚀的效果不佳,产生多余的光阻的时候,其效果如图2.b所示,在阵列基板300上,除了光刻图案301,还有多余光阻302,而多余光阻302需要去除,同时不影响光刻图案301。为了达到这一目的,在过滤镜片200上设置遮光区201和透光区202,如图2.c所示,其中遮光区201的图样与光刻图案301相匹配,使得激光源100在照射在该过滤镜片200之后,阵列基板300的光刻图案301不会受到激光源100的影响。多余光阻302受到激光的曝光后消除,使得产生如图2.a的阵列基板。
具体的,采用该阵列基板修复装置的过程如图3的流程所示。首先由检测装置400检测待修复的阵列基板300上是否存在多余光阻,其检测判断的方法是:通过检测装置400内的图像采集器对阵列基板300进行图样采集,再由图像比较器将采集到的图样与预设的目标图样(即预期获得的理想图样)进行比较,以确定是否存在多余光阻。
若无多余光阻,则本次的检测修复过程结束;否则进行修复过程:设置过滤镜片200,使得过滤镜片200上的遮光区能够恰好将正常的光刻图案301完全遮挡住,使得正常的光刻图案301不会被激光照射,而激光源100的出射光从透光区穿过,照射在阵列基板300的其他位置上,使得多余光阻302被修复。
在修复后,检测装置400重新检测是否还存在多余光阻,若依然存在,则重复修复过程,直到多余光阻被修复。
采用本发明的阵列基板修复装置及方法,还可以用于阵列基板的暗点修复时进行焊接(welding)。
如图4为一块需要进行暗点修复的阵列基板,在修复的时候需要在固定点位进行焊接,在第一点位601、第二点位602、第三点位603处进行焊接,焊接的过程要求不影响基本上其他位置的布线。由于焊接的位置在图形中是固定的,我们可以采用一块过滤镜片(例如上述的过滤镜片200)进行辅助焊接,如图5所示。图5中的过滤镜片,在第一点位601、第二点位602、第三点位603设置为可供激光透过,在其他位置对激光遮蔽(即图5中的黑色部分)。由于在基板上除了上述的三个点位外,都被过滤镜片遮蔽,使得焊接的质量得到提高。另外,前述阵列基板的修复和进行固定点位的焊接能够使用相同的装置,区别仅在于使用的过滤镜片不同,因此提高液晶制造设备的通用性,降低液晶制造过程的成本。
以上仅为本发明具体实施方式,不能以此来限定本发明的范围,本技术领域内的一般技术人员根据本创作所作的均等变化,以及本领域内技术人员熟知的改变,都应仍属本发明涵盖的范围。
Claims (12)
- 一种阵列基板修复装置,其中,包括:激光源,用于修复阵列基板上的多余光阻;检测装置,用于检测阵列基板上是否存在多余光阻;过滤镜片,用于使激光源出射的光照射在阵列基板的多余光阻上以修复该多余光阻;所述过滤镜片设置在所述阵列基板上方,所述激光源设置在所述过滤镜片上方,所述检测装置设置在所述阵列基板的上方。
- 根据权利要求1所述的阵列基板修复装置,其中,所述检测装置包括图像采集器,用于获取阵列基板上的图案;以及图像对比器,用于对比阵列基板上的图案和预先设置的目标图案,以确定是否存在多余光阻。
- 根据权利要求2所述的阵列基板修复装置,其中,阵列基板修复装置包括显示装置,所述显示装置与所述检测装置连接,用于显示所述阵列基板上的图案。
- 根据权利要求1所述的阵列基板修复装置,其中,所述过滤镜片上包括遮光区与透光区,所述遮光区的图案与阵列基板上的正确图案相匹配。
- 一种阵列基板修复装置,其中,包括:激光源,检测装置和过滤镜片;检测装置检测阵列基板是否存在多余光阻,存在多余光阻时,以激光源出射的激光在经过过滤镜片后,照射在多余光阻上,对多余光阻进行修复。
- 根据权利要求5所述的阵列基板修复装置,其中,检测装置包括相互连接的图像采集器和图像对比器;图像采集器首先获取阵列基板上的图案,图像对比器将所述获取的图案与预先设置的目标图案进行比较。
- 根据权利要求7所述的阵列基板修复装置,其中,阵列基板修复装置包括与检测装置连接的显示装置,显示装置对检测装置获取的图案进行显示。
- 根据权利要求5所述的阵列基板修复装置,其中,所述过滤镜片上包括遮光区与透光区,所述遮光区的图案与阵列基板上的正确图案相匹配。
- 一种阵列基板修复方法,其中,包括以下步骤:检测阵列基板上是否存在多余光阻;若存在多余光阻,将过滤镜片设置在阵列基板上,激光源设置在过滤镜片上,使得激光源出射的激光在经过过滤镜片后,照射在多余光阻上;使用激光源出射的激光对多余光阻进行修复。
- 根据权利要求9所述的阵列基板修复方法,其中,检测阵列基板上是否存在多余光阻的步骤包括:获取阵列基板上的图案;将阵列基板上的图案与预先设置的目标图案比较。
- 根据权利要求9所述的阵列基板修复方法,其中,该方法还包括显示阵列基板上的图案。
- 根据权利要求9所述的阵列基板修复方法,其中,该方法还包括在所述过滤镜片上形成遮光区与透光区,遮光区的图案与阵列基板上的正确图案相匹配。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/824,392 US20140199910A1 (en) | 2013-01-15 | 2013-02-20 | Apparatus and method for repairing array substrate |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310013800.2A CN103048815B (zh) | 2013-01-15 | 2013-01-15 | 阵列基板修复装置及方法 |
| CN201310013800.2 | 2013-01-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2014110854A1 true WO2014110854A1 (zh) | 2014-07-24 |
Family
ID=48061513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2013/071699 Ceased WO2014110854A1 (zh) | 2013-01-15 | 2013-02-20 | 阵列基板修复装置及方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103048815B (zh) |
| WO (1) | WO2014110854A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104880841B (zh) * | 2015-05-18 | 2018-05-25 | 合肥京东方光电科技有限公司 | 基板修复装置及修复方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4623607A (en) * | 1982-04-06 | 1986-11-18 | Fuji Xerox Co., Ltd. | Process of forming a photoresist pattern and apparatus for correcting the pattern |
| KR20090074554A (ko) * | 2008-01-02 | 2009-07-07 | 주식회사 하이닉스반도체 | 포토마스크의 결함 수정 방법 |
| CN101566788A (zh) * | 2008-04-21 | 2009-10-28 | 东捷科技股份有限公司 | 光刻胶图案的修补方法 |
| CN102809839A (zh) * | 2012-08-31 | 2012-12-05 | 深圳市华星光电技术有限公司 | 阵列基板的图形修补装置及方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4752668A (en) * | 1986-04-28 | 1988-06-21 | Rosenfield Michael G | System for laser removal of excess material from a semiconductor wafer |
-
2013
- 2013-01-15 CN CN201310013800.2A patent/CN103048815B/zh not_active Expired - Fee Related
- 2013-02-20 WO PCT/CN2013/071699 patent/WO2014110854A1/zh not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4623607A (en) * | 1982-04-06 | 1986-11-18 | Fuji Xerox Co., Ltd. | Process of forming a photoresist pattern and apparatus for correcting the pattern |
| KR20090074554A (ko) * | 2008-01-02 | 2009-07-07 | 주식회사 하이닉스반도체 | 포토마스크의 결함 수정 방법 |
| CN101566788A (zh) * | 2008-04-21 | 2009-10-28 | 东捷科技股份有限公司 | 光刻胶图案的修补方法 |
| CN102809839A (zh) * | 2012-08-31 | 2012-12-05 | 深圳市华星光电技术有限公司 | 阵列基板的图形修补装置及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103048815B (zh) | 2015-09-09 |
| CN103048815A (zh) | 2013-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101735403B1 (ko) | 검사 방법, 템플릿 기판 및 포커스 오프셋 방법 | |
| KR100413035B1 (ko) | 마스크와작업편의위치맞춤방법및장치 | |
| CN203409425U (zh) | 修复装置 | |
| JP3789163B2 (ja) | 連続パターンの欠陥修正方法および欠陥修正装置 | |
| KR101821239B1 (ko) | 접착제 제거장치 및 방법 | |
| CN105627919B (zh) | 图像测量设备和测量设备 | |
| TWM526177U (zh) | 視覺化系統及具有其之製程腔室 | |
| WO2014032312A1 (zh) | 阵列基板的图形修补装置及方法 | |
| KR101731338B1 (ko) | 위치 측정 방법, 위치 이탈 맵의 작성 방법 및 검사 시스템 | |
| JP2004317427A (ja) | パターン検査方法及びその装置、マスクの製造方法 | |
| KR20130098838A (ko) | 레이저 가공 장치, 레이저 가공 방법 및 레이저 가공 프로그램을 기록한 컴퓨터가 판독 가능한 기록 매체 | |
| WO2014110854A1 (zh) | 阵列基板修复装置及方法 | |
| JP2004309826A (ja) | グレートーンマスクの欠陥修正方法 | |
| TW201535064A (zh) | 描繪方法及描繪裝置 | |
| JP3672884B2 (ja) | パターン検査方法、パターン検査装置およびマスクの製造方法 | |
| US20030095699A1 (en) | Method for applying a defect finder mark to a backend photomask making process | |
| JP6184746B2 (ja) | 欠陥検出装置、欠陥修正装置および欠陥検出方法 | |
| JPH11264718A (ja) | ウエハの位置把握方法並びに露光方法及び露光装置 | |
| WO2025037806A1 (ko) | 오버레이 계측 장치의 보정 방법 및 오버레이 계측 장치의 보정 시스템 | |
| JP5282476B2 (ja) | フォトマスクの製造方法 | |
| CN113345328B (zh) | 显示面板Mura修补方法 | |
| KR101531816B1 (ko) | 웨이퍼 마킹장치의 마킹위치 보정방법 | |
| KR100945924B1 (ko) | 노광 렌즈의 디스토션 수차 보정 방법 | |
| US20140199910A1 (en) | Apparatus and method for repairing array substrate | |
| JP4997748B2 (ja) | フォーカスモニターマークを有するフォトマスクの転写シミュレーション方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 13824392 Country of ref document: US |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13871343 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 13871343 Country of ref document: EP Kind code of ref document: A1 |