WO2014097898A1 - 部品固定方法、回路基板、及び表示パネル - Google Patents

部品固定方法、回路基板、及び表示パネル Download PDF

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Publication number
WO2014097898A1
WO2014097898A1 PCT/JP2013/082767 JP2013082767W WO2014097898A1 WO 2014097898 A1 WO2014097898 A1 WO 2014097898A1 JP 2013082767 W JP2013082767 W JP 2013082767W WO 2014097898 A1 WO2014097898 A1 WO 2014097898A1
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Prior art keywords
acf
component
cured
light
substrate
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PCT/JP2013/082767
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English (en)
French (fr)
Inventor
裕喜 中濱
塩田　素二
松井　隆司
弘規 宮崎
中山　正樹
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シャープ株式会社
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Priority to US14/652,175 priority Critical patent/US20150334839A1/en
Publication of WO2014097898A1 publication Critical patent/WO2014097898A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/00—Properties of the layers or laminate
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    • B32B2307/202—Conductive
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    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
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    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
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    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the present invention relates to a component fixing method, a circuit board on which components are fixed using the component fixing method, and a display panel including the circuit board as a component.
  • Display panels such as liquid crystal display panels and organic EL display panels are modularized in combination with components such as driver ICs and flexible wiring boards (FPCs) that drive them.
  • FPCs flexible wiring boards
  • ACF anisotropic conductive film
  • a resin that cures by either ultraviolet light (UV light) or heat is used as an adhesive.
  • ACF is used. After aligning and pressurizing the connection electrode of the liquid crystal display element and the electrode of the TCP or flexible wiring board, UV light is irradiated to the adhesive layer of the ACF from the liquid crystal display element side for a predetermined time and a predetermined amount of light. As a result, the ACF adhesive in the region that is not shielded from light by the connection electrode of the liquid crystal display element becomes highly hard due to the photocuring reaction.
  • the TCP or flexible wiring board is pressurized and heated to perform the main pressure bonding.
  • the electrodes of the TCP or the flexible wiring board and the liquid crystal display element The connection electrode is reliably connected.
  • UV-cured ACF which cures only by UV light
  • the components can be connected and fixed at a relatively low temperature, so that heat hardly damages the components and the substrate.
  • time required to raise the temperature to the target temperature can be shortened, there is an advantage that the production efficiency can be improved.
  • UV-cured ACF also has the following disadvantages.
  • An ACF at a location shielded from light by a wiring portion (in this specification, the term “wiring portion” is used as a concept including both an electrode for electrically connecting components and a wiring for connecting electrodes) is described in Patent Document 1.
  • ACF can be heated and cured, but UV-cured ACF cannot be cured by heating.
  • the ACF at the light-shielding portion is slightly cured by the UV light that is reflected and transmitted inside the ACF, the curing is insufficient and must be positioned as uncured.
  • Uncured ACF cannot exhibit its original performance and causes various problems.
  • the problems include a decrease in adhesion between the component and the substrate, an increase in electrical resistance due to a small resin shrinkage, and a change in hygroscopicity. Since uncured ACF easily absorbs moisture, problems such as corrosion of metal wiring on the substrate surface and increase in electrical resistance due to moisture absorption and swelling of the substrate occur.
  • a predetermined reaction rate varies depending on the type of ACF, but is generally 80% or more.
  • the present invention has been made in view of the above points.
  • the UV-curing ACF is directly irradiated to the UV-curing ACF at a portion shielded from light by the wiring portion, and the uncured
  • the purpose is to prevent ACF from remaining.
  • the component fixing method according to the present invention is a component fixing method in which a wiring portion is formed on a substrate that can transmit UV light, and the component is electrically connected to the wiring portion by UV curing ACF and fixed to the substrate.
  • the method includes the following steps. That is, a step of causing the UV-cured ACF to flow by applying pressure to the component, and a step of directly irradiating the UV-cured ACF at a portion shielded by the wiring portion from the back surface of the substrate with UV light. It is.
  • the component fixing method having the above configuration preferably includes the following configuration. That is, it is a step of applying pressure to the component after increasing the fluidity of the UV-cured ACF by heating.
  • the component fixing method having the above configuration includes the following steps. That is, it is a step of performing UV light irradiation before the start of flow of the UV-cured ACF.
  • the component fixing method having the above configuration includes the following steps. That is, it is a step of performing UV light irradiation during the flow of the UV-cured ACF.
  • the present invention is characterized in that it is a circuit board in which components are fixed using the component fixing method.
  • the circuit board configured as described above is preferably configured as follows. That is, the wiring portion to which the component is connected is arranged in a form deviating from the center of the mounting location of the component.
  • the circuit board configured as described above is preferably configured as follows. That is, the wiring portion to which the component is connected has an opening formed at a location aligned with the center of the mounting location of the component.
  • the circuit board configured as described above is preferably configured as follows. That is, the wiring part to which the component is connected has a plurality of openings distributed in a region including the center of the mounting location of the component.
  • the present invention is also characterized in that the display panel includes the circuit board as a component.
  • the UV-cured ACF is caused to flow by applying pressure to the component, and the UV-cured ACF at the location shielded by the wiring portion is directly irradiated with UV light from the back surface of the substrate. Therefore, the ACF remaining uncured is wiped out, and the inconvenience caused by the uncured ACF can be solved.
  • the component fixing method according to the present invention is performed using the component fixing device 1.
  • the horizontal stage 2 is the main component of the component fixing device 1.
  • the stage 2 has a structure in which a stage central portion 2a made of a UV light transmitting material such as glass is supported by a metal stage peripheral portion 2b.
  • a substrate 10 capable of transmitting UV light is placed on the stage center 2a.
  • Illustrated as the substrate 10 is a TFT glass substrate of a liquid crystal display panel.
  • a wiring part 11 made of a metal having low electric resistance is formed on the surface of the substrate 10, and a UV cured ACF 12 is attached so as to cover the wiring part 11.
  • the wiring part 11 does not transmit light and becomes a light shielding part for UV light.
  • UV cured ACF12 is affixed to a separator (not shown) like a double-sided adhesive tape, and is supplied in a reel form.
  • the separator has a continuous band shape, but the UV-cured ACF 12 is cut at predetermined intervals. A predetermined length of the UV-cured ACF 12 from the notch to the notch is applied to the substrate 10 and heat and pressure are applied from above through the separator. Then, while the UV-cured ACF 12 is attached to the substrate 10, the separator is separated from the UV-cured ACF 12, and only the UV-cured ACF 12 is transferred cleanly to the substrate 10.
  • the component is placed on the upper surface of the UV-curing ACF 12.
  • the component may be FPC or TCP, but here, the IC 13 is illustrated.
  • the IC 13 is mounted on the wiring unit 11 by a COG (chip on glass) method.
  • the IC 13 is only lightly placed on the UV cured ACF 12 after being positioned in the horizontal plane.
  • Bumps 13a serving as terminal portions are formed on the lower surface of the IC13. It is the role of the UV cured ACF 12 to electrically connect the bumps 13a to the wiring part 11 and to physically fix the IC 13 to the substrate 10.
  • the IC 13 is heated with the heater tool 14.
  • the viscosity of the UV-cured ACF 12 decreases and liquefies. That is, the fluidity of the UV cured ACF 12 is increased.
  • the UV-cured ACF 12 is pressurized by the heater tool 14 to flow the UV-cured ACF 12.
  • the IC 13 is preferably heated so that the temperature of the UV-curing ACF 12 is 70 ° C. to 100 ° C.
  • the pressure applied to the UV-curing ACF 12 may be approximately the same as the pressure when thermocompression bonding is performed using the thermosetting ACF.
  • the heat of the heater tool 14 is not used to cure the UV-curing ACF 12 but is used only to fluidize it, and the amount of heat is less than the heat necessary to cure the UV-curing ACF 12. For this reason, the temperature of the mounting operation of the IC 13 can be reduced. Due to the low temperature of the mounting operation, warpage of the IC 13 and the substrate 10 is suppressed. If the substrate 10 is included in the display panel, the display quality is improved.
  • the fluidized UV-curing ACF 12 In the fluidized UV-curing ACF 12, what is present at a location shielded from light by the wiring portion 11 is pushed out from the location by the pressure applied by the bump 13a. If the pressurization of the IC 13 proceeds, the IC 13 itself presses the UV-cured ACF 12 and a large-scale flow is generated inside the UV-cured ACF 12. The UV-cured ACF 12 present at the location shielded from light by the wiring portion 11 is pushed out from the location even by the large-scale flow.
  • a UV light source (not shown) arranged below the stage 2 emits light to emit UV light, and the UV cured ACF 12 is applied to the back surface of the substrate 10. Irradiate with UV light from the side.
  • UV-cured ACF 12 In addition to the UV-cured ACF 12 that is not shielded from light by the wiring part 11, the UV-cured ACF 12 that would remain in the light-shielded part by the wiring part 11 if flow does not occur. As a result, the light is pushed out from the portion shielded by the wiring portion 11 and directly irradiated with UV light.
  • direct irradiation refers to irradiation without being interrupted by UV light emitted from a UV light source, rather than irradiation with UV light transmitted by reflection inside the UV cured ACF 12.
  • UV-curing ACF12 starts by direct irradiation of UV light. There is also a UV-cured ACF 12 that moves to a location that is shielded by the wiring portion 11 due to flow, but this is a UV-cured ACF 12 that has not been shielded by the wiring portion 11 and has been directly irradiated with UV light. From this, curing also begins.
  • UV-cured ACF at a portion shielded by the wiring portion has two meanings. The first is “UV-cured ACF that would have been pushed out from the location shielded by the wiring portion due to the flow, even though it would remain in the location shielded by the wiring portion if no flow occurred. Is. The second is “UV-cured ACF that was in a location that was not shielded by the wiring portion but moved to a location that was shielded by the wiring portion due to flow”. In any meaning of the UV-cured ACF 12, since the UV-cured ACF 12 is directly irradiated with UV light, the UV-cured ACF 12 that has remained uncured is excluded, and the UV light ACF 12 is uncured. The inconvenience caused by this can be solved.
  • FIG. 4 shows a stage where the heating and pressurization of the IC 13 and the irradiation of the UV light to the UV-curing ACF 12 are finished.
  • the thickness of the UV cured ACF 12 is designed to be larger than the height of the bump 13a. For this reason, when the IC 13 is pressurized until the bump 13a approaches the wiring portion 11, excessive UV-cured ACF 12 to be excluded is generated. Excess UV-cured ACF 12 is excluded outside IC 13, and bump 13 a and wiring portion 11 are electrically connected via UV-cured ACF 12.
  • FIG. 5 conceptually shows a state in which the conductive particles 15 inside the UV-cured ACF 12 are sandwiched between the wiring portion 11 and the bump 13a and are flattened to cause conduction between the wiring portion 11 and the bump 13a. It is shown in This state is maintained by the UV curing ACF 12 being cured by irradiation with UV light.
  • the timing setting of FIG. 6 is the first embodiment
  • the timing setting of FIG. 7 is the second embodiment
  • the timing setting of FIG. 8 is the first comparative example.
  • UV light is irradiated prior to heating the IC 13.
  • the UV-cured ACF 12 previously irradiated with UV light becomes more fluid by subsequent heating, and flows by pressurization.
  • the UV-cured ACF 12 By irradiating UV light before the UV-cured ACF 12 starts to flow, the UV-cured ACF 12 that has sufficiently absorbed the UV light can be moved. However, if the amount of UV light absorption is large, the curing of the UV-curing ACF 12 proceeds and the viscosity increases, and the subsequent heating does not cause fluidization. Although it depends on the resin material of the UV curable ACF12, the time lag from the start of UV light irradiation to the start of heating is preferably 1 second or less.
  • the IC 13 is heated and then irradiated with UV light.
  • the UV-cured ACF 12 that has started to flow under pressure after heating is irradiated with UV light while continuing to flow, and absorbs UV light. If the UV-cured ACF 12 is cured by irradiation with UV light, the flow of the UV-cured ACF 12 stops even if heating and pressurization are not completed.
  • the UV light irradiation time is preferably about 3 to 10 seconds, and the time lag from the start of heating to UV light irradiation is preferably 1 second or less.
  • the reason why the UV-curing ACF 12 is insufficiently cured is that the wiring portion 11 shields the light, so that the UV light does not reach the UV-curing ACF 12. If UV light is irradiated after the UV-cured ACF 12 stops flowing as shown in FIG. 8, the UV-cured ACF 12 in the portion shielded by the wiring portion 11 is not directly irradiated with the UV light any time. End up.
  • the UV-cured ACF 12 at the location shielded by the wiring portion 11 moves, and thus, which portion of the UV-cured ACF 12 is moved. Also passes through a location that is directly exposed to UV light. Therefore, even if the UV light irradiation is performed before the start of the flow of the UV-curing ACF 12 as in the first embodiment, the UV light irradiation is performed during the flow of the UV-curing ACF 12 as in the second embodiment. Even if it is the method of doing, it can directly irradiate UV light to UV hardening ACF12 of the location light-shielded by the wiring part 11.
  • the wiring part 11 passing through the central part of the IC 13 has a shape in which the wiring connects the electrodes located on the left and right, and the wiring part is located directly below the UV-cured ACF 12a left behind from the flow. ing.
  • the UV-cured ACF 12a left behind from the flow is shielded from light by the wiring portion 11, and ends in an uncured state.
  • the device shown in FIGS. In FIGS. 13 and 10 to 12 reference numeral 11a denotes a signal input electrode portion for inputting a signal by connecting an FPC (not shown), and 11b denotes an output electrode portion connected to a display area (not shown) of the liquid crystal display panel. Only the position of the IC 13 which is a component fixed by the UV-curing ACF 12 is indicated by a dotted line, and a part surrounded by the dotted line is a mounting part (COG mounting part) of the IC 13.
  • one opening portion 11 c is formed at a position aligned with the center of the mounting portion in the wide wiring portion 11 passing through the center of the mounting portion of the IC 13.
  • the opening 11 c is rectangular, and its own longitudinal direction coincides with the longitudinal direction of the wiring part 11.
  • the UV-cured ACF 12a left from the flow is directly irradiated with the UV light passing through the opening 11c and cured.
  • a plurality of openings 11c are dispersedly arranged in a wide wiring portion 11 that passes through the center of the IC 13 mounting location.
  • the plurality of openings 11c are distributed in a region including the center of the mounting location.
  • the UV-cured ACF remaining from the flow is directly irradiated with the UV light passing through any of the plurality of openings 11c arranged in a distributed manner, and cured.
  • rectangular openings 11c having their own longitudinal direction aligned with the longitudinal direction of the wiring portion 11 are arranged in a matrix of 3 rows and 3 columns, but this arrangement is merely an example and limits the invention. It is not a thing.
  • the distance between the openings 11c is preferably 0.5 mm or less, preferably 0.2 mm or less, in both the vertical and horizontal directions in FIG.
  • TFT glass substrate of a liquid crystal display panel has been described as an example of the substrate 10 that becomes a circuit board by mounting components, it is needless to say that the present invention is not limited thereto.
  • the present invention can also be applied to a glass substrate of an organic EL display panel.
  • the present invention can also be applied to general circuit boards that are not included in the display panel.
  • the present invention is widely applicable to display panels and general circuit boards.

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Abstract

　ＵＶ光が透過可能な基板（１０）に配線部（１１）を形成し、配線部に電気的に接続される部品（１３）をＵＶ硬化ＡＣＦ（１２）で基板に固定する。その際、部品に圧力を加えることによりＵＶ硬化ＡＣＦに流動を生じさせ、配線部によって遮光される箇所のＵＶ硬化ＡＣＦにも基板の裏面よりＵＶ光を直接照射する。加熱によりＵＶ硬化ＡＣＦの流動性を高めた上で部品に圧力を加え、ＵＶ硬化ＡＣＦを流動させる。

Description

部品固定方法、回路基板、及び表示パネル
　本発明は、部品固定方法、前記部品固定方法を用いて部品を固定した回路基板、及び前記回路基板を構成要素に含む表示パネルに関する。
　液晶表示パネルや有機ＥＬ表示パネルのような表示パネルは、それらを駆動するドライバＩＣやフレキシブル配線基板（ＦＰＣ）などの部品と組み合わせてモジュール化される。表示パネルのモジュール化にあたっては、表示パネルの基板表面に形成された電極部に部品を、異方性導電膜（anisotropic　conductive　film：以下、本明細書及び特許請求の範囲では「ＡＣＦ」の呼称を用いる）により電気的に接続しつつ物理的に固定するという手法が一般的に採用される。その一例を特許文献１に見ることができる。
　特許文献１に記載された液晶表示装置の製造方法では、液晶表示素子にＴＣＰ（tape　　carrier　package）またはフレキシブル配線基板を接続するに際し、紫外線（ＵＶ光）と熱のいずれでも硬化する樹脂を接着剤とするＡＣＦが用いられている。液晶表示素子の接続電極とＴＣＰまたはフレキシブル配線基板の電極を位置合わせし、加圧した後、液晶表示素子側よりＡＣＦの接着剤層にＵＶ光を所定時間・所定光量で照射する。これにより、液晶表示素子の接続電極で遮光されていない領域のＡＣＦの接着剤が光硬化反応で高硬度となる。次いでＴＣＰまたはフレキシブル配線基板を加圧・加熱して本圧着するのであるが、この時、硬化済みの接着剤により導電剤の流動が抑制されるので、ＴＣＰまたはフレキシブル配線基板の電極と液晶表示素子の接続電極とが確実に導通する。
特開２０００－１０５３８８号公報
　特許文献１記載の液晶表示装置の製造方法ではＡＣＦの硬化がＵＶ光と熱を両方とも用いて行われており、熱により部品や基板が反るという問題を抱えている。また最近の液晶表示パネルでは狭額縁化を目指して表示部以外の領域をできるだけ縮小する傾向があり、表示部とドライバＩＣの間の距離、またドライバＩＣとＦＰＣの間の距離が非常に縮まってきている。このように距離が縮まるとＡＣＦを硬化させるための熱が様々な悪影響を及ぼす。例えば表示が劣化したり、ドライバＩＣやＦＰＣの接続信頼性が低下したりするなどの事象が生じている。
　そこで、最近ではＵＶ光によってのみ硬化が進行するＵＶ硬化ＡＣＦが用いられることが多くなっている。ＵＶ硬化ＡＣＦを用いれば部品の接続固定を比較的低温で行うことができるので、熱が部品や基板にダメージを与えることが少ない。また、目標温度まで温度上昇させるのに要する時間を短縮することができることから製造効率を向上させることができるというメリットがある。
　反面、ＵＶ硬化ＡＣＦには次のようなデメリットもある。配線部（本明細書では部品を電気的に接続する電極と電極同士を接続する配線の両方を含む概念として「配線部」の語を用いる）によって遮光される箇所のＡＣＦは、特許文献１記載のＡＣＦであれば加熱して硬化させることができるが、ＵＶ硬化ＡＣＦは加熱による硬化という手法が使えない。ＡＣＦの内部を反射して伝わってくるＵＶ光により、遮光箇所のＡＣＦも少しは硬化するが、その硬化は不十分であり、未硬化と位置づけざるを得ない。
　未硬化のＡＣＦは本来の性能を発揮できず、様々な問題を引き起こす。その問題とは、部品と基板の密着力の低下、樹脂の硬化収縮が小さいことによる電気抵抗の上昇、吸湿性の変化などである。未硬化のＡＣＦは吸湿しやすいため、基板表面の金属配線が腐食する、基板が吸湿して膨潤することで電気抵抗が上昇する、などの不具合が発生する。信頼性の高い部品実装を実現するためには、ＡＣＦの全領域にわたり所定の反応率を超えさせ、硬化させることが必要である。所定の反応率とは、ＡＣＦの種類によって異なるが、８０％以上であることが一般的である。
　本発明は上記の点に鑑みなされたものであり、ＵＶ硬化ＡＣＦで部品を基板に固定するに際し、配線部によって遮光される箇所のＵＶ硬化ＡＣＦにもＵＶ光を直接照射して、未硬化のＡＣＦが残ることのないようにすることを目的とする。
　本発明に係る部品固定方法は、ＵＶ光が透過可能な基板に配線部を形成し、部品をＵＶ硬化ＡＣＦで前記配線部に電気的に接続すると共に当該基板に固定する部品固定方法であって、以下の工程を含むことを特徴としている。すなわち、前記部品に圧力を加えることにより前記ＵＶ硬化ＡＣＦに流動を生じさせる工程、及び、前記配線部によって遮光される箇所の前記ＵＶ硬化ＡＣＦにも前記基板の裏面よりＵＶ光を直接照射する工程である。
　上記構成の部品固定方法は次の構成を含むことが好ましい。すなわち、加熱により前記ＵＶ硬化ＡＣＦの流動性を高めた上で前記部品に圧力を加える工程である。
　上記構成の部品固定方法は次の工程を含むことが好ましい。すなわち、前記ＵＶ硬化ＡＣＦの流動開始前にＵＶ光の照射を遂行する工程である。
　上記構成の部品固定方法は次の工程を含むことが好ましい。すなわち、前記ＵＶ硬化ＡＣＦの流動中にＵＶ光の照射を遂行する工程である。
　また本発明は、上記部品固定方法を用いて部品を固定した回路基板であることを特徴としている。
　上記構成の回路基板は以下のように構成されることが好ましい。すなわち、前記部品が接続される配線部は、前記部品の実装箇所の中心から偏倚する形で配置されている。
　上記構成の回路基板は以下のように構成されることが好ましい。すなわち、前記部品が接続される配線部は、前記部品の実装箇所の中心に整列する箇所に開口部が形成されている。
　上記構成の回路基板は以下のように構成されることが好ましい。すなわち、前記部品が接続される配線部は、前記部品の実装箇所の中心を含む領域に複数の開口部が分散配置されている。
　また本発明は、上記回路基板を構成要素に含む表示パネルであることを特徴としている。
　本発明によると、部品に圧力を加えることによりＵＶ硬化ＡＣＦに流動を生じさせ、配線部によって遮光される箇所のＵＶ硬化ＡＣＦにも基板の裏面よりＵＶ光を直接照射するから、ＵＶ光が照射されないため未硬化のまま残るＡＣＦを一掃し、ＡＣＦが未硬化であることにより生じる不都合を解消することができる。
本発明に係る部品固定方法の第１の工程説明図である。 本発明に係る部品固定方法の第２の工程説明図である。 本発明に係る部品固定方法の第３の工程説明図である。 本発明に係る部品固定方法の第４の工程説明図である。 ＵＶ硬化ＡＣＦによる電気的接続の説明図である。 ＵＶ光照射のタイミングについて説明する第１のガントチャートである。 ＵＶ光照射のタイミングについて説明する第２のガントチャートである。 ＵＶ光照射のタイミングについて説明する第３のガントチャートである。 ＵＶ硬化ＡＣＦの流動態様の説明図である。 配線部の第１の構成例を示す平面図である。 配線部の第２の構成例を示す平面図である。 配線部の第３の構成例を示す平面図である。 配線部の好ましくない構成例を示す平面図である。
　以下、図１から図４までの図面に基づき本発明に係る部品固定方法の概要を説明する。
　本発明に係る部品固定方法は部品固定装置１を用いて遂行される。部品固定装置１の主体をなすのは水平なステージ２である。ステージ２はガラス等のＵＶ光透過材料からなるステージ中央部２ａを金属製のステージ周辺部２ｂで支える構造となっている。
　図１に示す通り、ステージ中央部２ａの上にはＵＶ光が透過可能な基板１０が載置される。基板１０として例示されているのは液晶表示パネルのＴＦＴガラス基板である。基板１０の表面には電気抵抗の低い金属からなる配線部１１が形成されており、配線部１１を覆うようにＵＶ硬化ＡＣＦ１２が貼り付けられる。配線部１１は光を通さず、ＵＶ光にとり遮光部となる。
　ＵＶ硬化ＡＣＦ１２は両面粘着テープのように図示しないセパレータに貼り付けられ、リール状に巻かれて供給される。セパレータは連続した帯状であるが、ＵＶ硬化ＡＣＦ１２には所定間隔で切り込みが入れられている。切り込みから切り込みまでのＵＶ硬化ＡＣＦ１２の所定長さの部分を基板１０に当てて、上からセパレータ越しに熱と圧力を加える。するとＵＶ硬化ＡＣＦ１２が基板１０に貼り付く一方で、セパレータはＵＶ硬化ＡＣＦ１２から分離し、ＵＶ硬化ＡＣＦ１２のみが基板１０に綺麗に転写される、という仕組みである。
　図２に示す通り、ＵＶ硬化ＡＣＦ１２の上面に部品が載置される。部品はＦＰＣやＴＣＰであってもよいが、ここではＩＣ１３が例示されている。ＩＣ１３はＣＯＧ（chip　on　glass）の手法で配線部１１に実装される。ＩＣ１３はこの段階では水平面内での位置を位置決めされた上でＵＶ硬化ＡＣＦ１２に軽く載せられるだけである。ＩＣ１３の下面には端子部となるバンプ１３ａが形成されている。バンプ１３ａを配線部１１に電気的に接続し、ＩＣ１３を物理的に基板１０に固定することがＵＶ硬化ＡＣＦ１２の役割である。
　図３に示す通り、ＩＣ１３をヒーターツール１４で加熱する。加熱によりＵＶ硬化ＡＣＦ１２の粘度が下がり、液状化する。すなわちＵＶ硬化ＡＣＦ１２の流動性が高まる。加熱によりＵＶ硬化ＡＣＦ１２の流動性を高めた上で、ヒーターツール１４によりＵＶ硬化ＡＣＦ１２を加圧し、ＵＶ硬化ＡＣＦ１２を流動させる。ＵＶ硬化ＡＣＦ１２の温度が７０℃～１００℃になるようにＩＣ１３を加熱するのがよい。ＵＶ硬化ＡＣＦ１２に加える圧力は、熱硬化ＡＣＦを用いて熱圧着するときの圧力と同程度でよい。
　ヒーターツール１４の熱は、ＵＶ硬化ＡＣＦ１２を硬化させるのでなく、流動化させるためだけに用いられるものであり、ＵＶ硬化ＡＣＦ１２を硬化させるのに必要な熱よりも熱量が少なくて済む。このため、ＩＣ１３の実装作業の低温化を図ることができる。実装作業の低温化により、ＩＣ１３や基板１０の反りが抑制される。基板１０が表示パネルに含まれるものであれば表示品位が向上する。
　流動化したＵＶ硬化ＡＣＦ１２の中で、配線部１１によって遮光される箇所に存在したものはバンプ１３ａによる圧迫でその箇所から押し出される。ＩＣ１３の加圧が進行すればＩＣ１３自体がＵＶ硬化ＡＣＦ１２を圧迫し出してＵＶ硬化ＡＣＦ１２の内部に大規模流動が生じる。その大規模流動によっても配線部１１によって遮光される箇所に存在したＵＶ硬化ＡＣＦ１２がその箇所から押し出される。
　ヒーターツール１４からの圧力でバンプ１３ａが配線部１１に接近しつつある中、ステージ２の下方に配置された図示しないＵＶ光源が発光してＵＶ光を発射し、ＵＶ硬化ＡＣＦ１２を基板１０の裏面側よりＵＶ光で照射する。
　そもそも配線部１１で遮光されていなかった箇所のＵＶ硬化ＡＣＦ１２はもちろんのこと、流動が生じなければ配線部１１によって遮光される箇所に留まったままであったであろうＵＶ硬化ＡＣＦ１２も、流動が生じることで配線部１１によって遮光される箇所から押し出され、ＵＶ光が直接照射される。ここで「直接照射」とは、ＵＶ硬化ＡＣＦ１２の内部を反射により伝わってきたＵＶ光による照射でなく、ＵＶ光源から発射されたＵＶ光が遮るものなく照射することを指す。
　ＵＶ光の直接照射によりＵＶ硬化ＡＣＦ１２の硬化が始まる。流動により配線部１１によって遮光される箇所に移動するＵＶ硬化ＡＣＦ１２も存在するが、それは配線部１１で遮光されていなかった箇所のＵＶ硬化ＡＣＦ１２であり、ＵＶ光の直接照射が済んだものであるから、これもまた硬化が始まる。
　上記の通り、「配線部によって遮光される箇所のＵＶ硬化ＡＣＦ」という言葉には二通りの意味がある。その１は「流動が生じなければ配線部によって遮光される箇所に留まったままであろうにもかかわらず、流動が生じたことにより配線部によって遮光される箇所から押し出されることになったＵＶ硬化ＡＣＦ」である。その２は「配線部によって遮光されていない箇所にあったが、流動が生じることにより配線部によって遮光される箇所に移動することとなったＵＶ硬化ＡＣＦ」である。いずれの意味のＵＶ硬化ＡＣＦ１２であっても、そのＵＶ硬化ＡＣＦ１２には直接ＵＶ光が照射されるから、未硬化のまま残るところだったＵＶ硬化ＡＣＦ１２が排除され、ＵＶ光ＡＣＦ１２が未硬化であることにより生じる不都合を解消することができる。
　図４はＩＣ１３の加熱及び加圧とＵＶ硬化ＡＣＦ１２に対するＵＶ光の照射を終了した段階を示している。ＩＣ１３と基板１０の間でＵＶ硬化ＡＣＦ１２の充填不足が生じないようにするため、ＵＶ硬化ＡＣＦ１２の厚みはバンプ１３ａの高さよりも大となるように設計されている。このため、バンプ１３ａが配線部１１に接近するところまでＩＣ１３を加圧すると、排除対象となる余剰のＵＶ硬化ＡＣＦ１２が発生する。余剰のＵＶ硬化ＡＣＦ１２はＩＣ１３の外側に排除され、バンプ１３ａと配線部１１はＵＶ硬化ＡＣＦ１２を介して電気的に接続される。
　図５はＵＶ硬化ＡＣＦ１２の内部の導電性粒子１５が配線部１１とバンプ１３ａの間に挟み付けられ、偏平化されて、配線部１１とバンプ１３ａの間に導通が生じている状態を観念的に示すものである。この状態はＵＶ光の照射によってＵＶ硬化ＡＣＦ１２が硬化することで維持される。
　ここで、ＩＣ１３の加熱とＵＶ光の照射のタイミングの設定が、ＩＣ１３の固定にどのような影響を及ぼすかを図６から図８のガントチャートを用いて説明する。図６のタイミング設定を第１実施形態、図７のタイミング設定を第２実施形態、図８のタイミング設定を第１比較例とする。
＜第１実施形態＞
　図６ではＩＣ１３の加熱に先行してＵＶ光が照射されている。先にＵＶ光を照射されたＵＶ硬化ＡＣＦ１２はその後の加熱で流動性が高まり、加圧により流動することになる。
　ＵＶ硬化ＡＣＦ１２が流動を開始する前にＵＶ光を照射することで、十分にＵＶ光を吸収したＵＶ硬化ＡＣＦ１２を移動させることができる。但しＵＶ光吸収量が多いとＵＶ硬化ＡＣＦ１２の硬化が進んで粘度が上がり、その後の加熱では流動化しなくなる。ＵＶ硬化ＡＣＦ１２の樹脂材料にもよるが、ＵＶ光の照射開始から加熱開始までのタイムラグは１秒以下とすることが好ましい。
＜第２実施形態＞
　図７ではＩＣ１３を加熱してからＵＶ光が照射されている。加熱後の加圧で流動を開始したＵＶ硬化ＡＣＦ１２は流動を続けつつＵＶ光を照射され、ＵＶ光を吸収する。ＵＶ光の照射によりＵＶ硬化ＡＣＦ１２が硬化すれば、加熱及び加圧が完了していなくてもＵＶ硬化ＡＣＦ１２の流動は停止する。
　ＵＶ硬化ＡＣＦ１２の樹脂材料にもよるが、ＵＶ光の照射時間は３秒～１０秒程度、加熱開始からＵＶ光照射までのタイムラグは１秒以下とすることが好ましい。
＜第１比較例＞
　図８ではＩＣ１３の加熱及び加圧が終わりかけてＵＶ硬化ＡＣＦ１２が流動を停止してからＵＶ光が照射されている。この場合はＵＶ硬化ＡＣＦ１２の流動が停止しているためＵＶ光を照射されたＵＶ硬化ＡＣＦ１２は移動しない。
　ＵＶ硬化ＡＣＦ１２が硬化不十分になるのは、配線部１１が遮光するためＵＶ光がＵＶ硬化ＡＣＦ１２に届かないことが原因である。図８のようにＵＶ硬化ＡＣＦ１２が流動を停止してからＵＶ光を照射したのでは、配線部１１によって遮光される箇所のＵＶ硬化ＡＣＦ１２にはいつまでたってもＵＶ光の直接照射が行われなくなってしまう。
　これに対し第１実施形態（図６）と第２実施形態（図７）のＵＶ光照射タイミングでは、配線部１１によって遮光される箇所のＵＶ硬化ＡＣＦ１２が移動するため、どの部分のＵＶ硬化ＡＣＦ１２もＵＶ光の直接照射を受ける箇所を通過する。従って、第１実施形態のようにＵＶ硬化ＡＣＦ１２の流動開始前にＵＶ光の照射を遂行するやり方であっても、第２実施形態のようにＵＶ硬化ＡＣＦ１２の流動中にＵＶ光の照射を遂行するやり方であっても、どちらでも配線部１１によって遮光される箇所のＵＶ硬化ＡＣＦ１２にＵＶ光の直接照射を行うことができる
　ＩＣ１３を加熱した上で加圧すると、ＩＣ１３と基板１０の間に、図９に矢印で示すようなＵＶ硬化ＡＣＦ１２の流動が生じ、余剰のＵＶ硬化ＡＣＦ１２は排除される。しかしながらＩＣ１３の中心部に関しては、余剰量の流出はあるが、他の領域からの流入が非常に少ないので、結果として流動から取り残されるＵＶ硬化ＡＣＦ１２ａ（図９に網掛けで表示）が発生する。流動から取り残されるＵＶ硬化ＡＣＦ１２ａの問題点を、第２比較例として図１３により説明する。上記問題を解決する構成を、第３～第５実施形態として図１０～図１２により説明する。
＜第２比較例＞
　図１３において、ＩＣ１３の中央部を通過する配線部１１は、左右に位置する電極を配線が接続する形のものであり、その配線の部分が、流動から取り残されるＵＶ硬化ＡＣＦ１２ａの真下に位置している。このようになっていると、流動から取り残されるＵＶ硬化ＡＣＦ１２ａが配線部１１によって遮光され、未硬化で終わることになってしまう。このような事態を避けるため、配線部１１には図１０から図１２に示す工夫が施される。なお図１３及び図１０から図１２において、１１ａは図示しないＦＰＣを接続して信号を入力させる信号入力電極部、１１ｂは液晶表示パネルの図示しない表示エリアに接続する出力電極部である。ＵＶ硬化ＡＣＦ１２により固定される部品であるＩＣ１３は点線で位置のみ示されており、この点線で囲われた箇所がＩＣ１３の実装箇所（ＣＯＧ実装箇所）ということになる。
＜第３実施形態＞
　図１０の構成では、ＩＣ１３の実装箇所の中心を通る配線部１１が存在しない。ＩＣ１３の実装箇所中心に最も近い箇所を通る配線部１１であっても、いくらかの距離だけ当該実装箇所の中心から偏倚する形とされる。これにより、流動から取り残されたＵＶ硬化ＡＣＦ１２ａは配線部１１で遮光されないこととなり、ＵＶ光の直接照射を受けて硬化する。
＜第４実施形態＞
　図１１の構成では、ＩＣ１３の実装箇所の中心を通る幅広の配線部１１の中の、当該実装箇所の中心に整列する箇所に、１個の開口部１１ｃが形成されている。開口部１１ｃは矩形で、自身の長手方向を配線部１１の長手方向に一致させている。開口部１１ｃを通るＵＶ光で、流動から取り残されたＵＶ硬化ＡＣＦ１２ａも直接照射され、硬化する。
＜第５実施形態＞
　図１２の構成では、ＩＣ１３の実装箇所の中心を通る幅広の配線部１１に複数の開口部１１ｃが分散配置されている。複数の開口部１１ｃは、当該実装箇所の中心を含む領域に分散配置される。分散配置された複数の開口部１１ｃのいずれかを通るＵＶ光で、流動から取り残されたＵＶ硬化ＡＣＦも直接照射され、硬化する。
　図１２では自身の長手方向を配線部１１の長手方向に一致させた矩形の開口部１１ｃが３行３列のマトリックス状に配置されているが、この配置は単なる例示であり、発明を限定するものではない。開口部１１ｃ同士の間隔は、図１２の上下方向においても左右方向においても、０．５ｍｍ以下、できれば０．２ｍｍ以下であることが好ましい。
　部品の実装により回路基板となる基板１０の例として液晶表示パネルのＴＦＴガラス基板を取り上げて説明したが、言うまでもなくそれに限定されるものではない。有機ＥＬ表示パネルのガラス基板にも本発明は応用可能である。表示パネルに含まれない、一般の回路基板にも本発明は応用可能である。
　以上、本発明の実施形態につき説明したが、本発明の範囲はこれに限定されるものではない。発明の主旨を逸脱しない限り、種々の変更を加えて実施することができる。
　本発明は表示パネルや一般の回路基板に広く適用可能である。
　　　１　　部品固定装置
　　　２　　ステージ
　　　１０　基板
　　　１１　配線部
　　　１１ｃ　開口部
　　　１２　ＵＶ硬化ＡＣＦ
　　　１２ａ　流動から取り残されたＵＶ硬化ＡＣＦ
　　　１３　ＩＣ
　　　１３ａ　バンプ
　　　１４　ヒーターツール

Claims (9)

  1. 　ＵＶ光が透過可能な基板に配線部を形成し、部品をＵＶ硬化ＡＣＦで前記配線部に電気的に接続すると共に当該基板に固定する部品固定方法であって、以下の工程を含むもの：
    　前記部品に圧力を加えることにより前記ＵＶ硬化ＡＣＦに流動を生じさせる工程、
    及び、
    　前記配線部によって遮光される箇所の前記ＵＶ硬化ＡＣＦにも前記基板の裏面よりＵＶ光を直接照射する工程。
  2. 　請求項１の部品固定方法であって、以下の工程を含むもの：
    　加熱により前記ＵＶ硬化ＡＣＦの流動性を高めた上で前記部品に圧力を加える工程。
  3. 　請求項１または２の部品固定方法であって、以下の工程を含むもの：
    　前記ＵＶ硬化ＡＣＦの流動開始前にＵＶ光の照射を遂行する工程。
  4. 　請求項１または２の部品固定方法であって、以下の工程を含むもの：
    　前記ＵＶ硬化ＡＣＦの流動中にＵＶ光の照射を遂行する工程。
  5. 　回路基板であって、以下のように構成されるもの：
    　請求項１から４のいずれかの部品固定方法を用いて部品を固定した。
  6. 　請求項５の回路基板であって、以下のように構成されるもの：
    　前記部品が接続される配線部は、前記部品の実装箇所の中心から偏倚する形で配置されている。
  7. 　請求項５の回路基板であって、以下のように構成されるもの：
    　前記部品が接続される配線部は、前記部品の実装箇所の中心に整列する箇所に開口部が形成されている。
  8. 　請求項５の回路基板であって、以下のように構成されるもの：
    　前記部品が接続される配線部は、前記部品の実装箇所の中心を含む領域に複数の開口部が分散配置されている。
  9. 　表示パネルであって、以下のように構成されるもの：
    　請求項５から８のいずれかの回路基板を構成要素に含む。
PCT/JP2013/082767 2012-12-20 2013-12-06 部品固定方法、回路基板、及び表示パネル WO2014097898A1 (ja)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003045236A (ja) * 2001-08-03 2003-02-14 Nec Kagoshima Ltd 異方性導電フイルムおよびこれを用いた集積回路デバイスの接続方法
JP2005317350A (ja) * 2004-04-28 2005-11-10 Matsushita Electric Ind Co Ltd 異方性導電部材およびこれを用いた接続方法
JP2006041064A (ja) * 2004-07-26 2006-02-09 Sony Corp 実装基板、および表示装置

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Publication number Priority date Publication date Assignee Title
JP3462135B2 (ja) * 1999-01-14 2003-11-05 シャープ株式会社 二次元画像検出器およびアクティブマトリクス基板並びに表示装置
WO2006112383A1 (ja) * 2005-04-14 2006-10-26 Matsushita Electric Industrial Co., Ltd. 電子回路装置およびその製造方法

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Publication number Priority date Publication date Assignee Title
JP2003045236A (ja) * 2001-08-03 2003-02-14 Nec Kagoshima Ltd 異方性導電フイルムおよびこれを用いた集積回路デバイスの接続方法
JP2005317350A (ja) * 2004-04-28 2005-11-10 Matsushita Electric Ind Co Ltd 異方性導電部材およびこれを用いた接続方法
JP2006041064A (ja) * 2004-07-26 2006-02-09 Sony Corp 実装基板、および表示装置

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