WO2014094328A1 - 镀膜方法及装置 - Google Patents

镀膜方法及装置 Download PDF

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Publication number
WO2014094328A1
WO2014094328A1 PCT/CN2012/087479 CN2012087479W WO2014094328A1 WO 2014094328 A1 WO2014094328 A1 WO 2014094328A1 CN 2012087479 W CN2012087479 W CN 2012087479W WO 2014094328 A1 WO2014094328 A1 WO 2014094328A1
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Prior art keywords
coated
coating
plated
area
heated
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Ceased
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PCT/CN2012/087479
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English (en)
French (fr)
Inventor
郑文达
吴础任
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/813,656 priority Critical patent/US20140178600A1/en
Publication of WO2014094328A1 publication Critical patent/WO2014094328A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0209—Pretreatment of the material to be coated by heating
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Definitions

  • the present invention relates to the field of liquid crystal panel technology, and in particular, to a coating method and a coating device.
  • the liquid crystal panel includes an array substrate, a color filter substrate, and a liquid crystal layer disposed therebetween.
  • the array substrate is one of the important constituent elements of the liquid crystal panel.
  • a plurality of signal lines, such as data lines, scan lines, and the like, are disposed on the array substrate.
  • the signal line of the array substrate may have a wire breakage defect, that is, the signal line has an open circuit.
  • the coating gas flow transmitted by the coating device to the array substrate is a high temperature molten mixture, and the array substrate is at normal temperature, the temperature difference between the array substrate and the coating gas flow is large, resulting in a coating gas flow. Crystallization is formed after the mixture contacts the array substrate. When the crystallized material falls on the area to be coated, the crystallized material is blocked between the coating layer and the array substrate, and the coating layer cannot be closely adhered to the array substrate, so that the coating layer is not strong and is easily peeled off from the array substrate, resulting in coating. Failure, reducing the yield of the array substrate.
  • the main object of the present invention is to provide a coating method and apparatus for improving the success rate and stability of a coating.
  • the present invention provides a coating method comprising the steps of:
  • the film to be coated after the object to be plated is heated is coated.
  • the heating of the to-be-coated region of the article to be plated comprises:
  • the area to be coated of the plated part is heated by a laser heating device or a resistance heating device.
  • the heating of the to-be-coated region of the article to be plated comprises:
  • the laser is emitted and concentrated on the area to be coated of the member to be plated to heat the area to be coated.
  • the heating of the to-be-coated region of the article to be plated comprises:
  • the gas is heated and the heated gas is blown to the area to be coated of the member to be plated to heat the area to be coated.
  • the heating gas and blowing the heated gas to the area to be coated of the object to be plated to heat the area to be coated includes:
  • the gas is blown into the heat pipe by the blasting member, and the electric resistance heating element in the heat pipe heats the gas blown into the air duct, and the heated gas is guided to the film to be coated through the heat pipe to the film to be coated. District heating.
  • the coating film to be coated after the object to be plated is heated comprises:
  • the metal particles in the metal powder mixture are decomposed so that the metal particles adhere to the film to be coated to form a plating layer.
  • the invention also proposes a coating device comprising a heating unit for heating a region to be coated of a plate to be plated, and a coating unit for coating a film to be coated after the object to be plated is heated.
  • the heating unit is a laser heating unit or a resistance heating unit.
  • the heating unit is a laser heating unit, including a laser emitter and a concentrating member, and the laser light emitted by the laser emitter is concentrated by the concentrating member and irradiated to the to-be-coated region of the member to be plated.
  • the coating unit comprises a barrier glass
  • the laser heating unit and the coating unit are located on the same side of the member to be plated
  • the barrier glass adopts a concentrating glass to serve as a concentrating member of the laser heating unit.
  • the heating unit is a resistance heating unit, comprising a heat pipe, a heat generating resistor disposed in the heat pipe, and an air blowing member, wherein the air blowing member blows air inside the heat pipe, and the blown gas is heated by the heating resistor.
  • the film to be coated of the material to be plated is guided through a heat pipe.
  • the heat pipe is annular, and the coating unit is sleeved in a ring of the heat pipe.
  • the heating unit and the coating unit are disposed side by side on the same side of the material to be plated or oppositely disposed on both sides of the material to be plated.
  • the coating unit comprises a coating cavity, a barrier glass fixed on the coating cavity, and a laser
  • the coating cavity conveys a coating gas flow to the heated film to be coated
  • the barrier glass blocks the The coating gas stream floats
  • the laser emits laser light through the barrier glass to the coating gas flow of the film to be coated.
  • the coating method provided by the invention heats the area to be coated of the plated part in advance to increase the temperature of the area to be coated, reduce the temperature difference between the area to be coated and the gas flow of the coating, and avoid the mixture in the coating gas flow.
  • the film to be coated is crystallized, so that there is no barrier between the coating layer and the material to be plated, and the coating layer is directly adhered to the to-be-coated region of the member to be plated, thereby improving the success rate and stability of the coating.
  • Figure 1 is a flow chart showing a first embodiment of the coating method of the present invention
  • Figure 2 is a flow chart showing a second embodiment of the coating method of the present invention.
  • Figure 3 is a schematic structural view of a coating device of the present invention.
  • Figure 4 is a schematic structural view of a first embodiment of a coating apparatus according to the present invention.
  • Figure 5 is a schematic view showing the structure of a second embodiment of the coating apparatus of the present invention.
  • the coating method includes:
  • Step S101 the area to be coated of the plate to be plated is heated.
  • the area to be coated of the plated part is heated to increase the temperature of the area to be coated of the part to be plated, and the temperature difference between the area to be coated and the flow of the coating to be plated is reduced.
  • the heating device to be coated may be heated by a heating device such as a laser heating device or a resistance heating device, and the heating device may be integrated with the coating device or may be separately provided; the heating device and the coating device may be arranged side by side, and the device to be plated is located. The same side of the same is heated and the film to be plated is coated; the heating device and the coating device can also be disposed opposite each other and placed on both sides of the member to be plated.
  • a heating device such as a laser heating device or a resistance heating device
  • the laser light emitted by the laser emitter of the laser heating device is concentrated by the concentrating member and irradiated to the area to be coated of the object to be plated, and the concentrated laser heats the area to be coated to improve the area. temperature.
  • the air outlet of the heat pipe of the electric resistance heating device is aligned with the film to be coated of the object to be plated, and the air blowing member of the electric resistance heating device, such as a fan, blows the inside of the heat pipe, and the heat generating resistor inside the heat pipe is heated.
  • the blown gas is heated, and the heated hot gas is blown to the area to be coated so that the area is heated and the temperature is raised.
  • Step S102 coating a film to be coated after the object to be plated is heated.
  • the temperature of the area to be coated of the plated part is increased, and at this time, when the film to be coated is to be coated, the high temperature molten coating gas jet sprayed by the coating device and the part to be plated are sprayed.
  • the temperature difference of the area to be coated is small, and even the temperature difference between the area to be coated and the coating gas flow of the plated part is negligible, so the mixture in the coating gas flow does not crystallize in the area to be coated and affects the formation of the coating gas flow in the area to be coated.
  • the adhesion of the coating layer allows the coating layer to directly adhere to the area to be coated of the member to be plated, and is closely combined with the member to be plated, thereby improving the success rate and stability of the coating.
  • the coating method of the present invention can be applied to the field of liquid crystal panel technology.
  • a signal line on an array substrate of a liquid crystal panel has an open defect, it is necessary to apply a metal plating layer to the broken region to repair the signal line.
  • the coating method of the present invention is described in detail by taking a metal plating layer on the array substrate as an example:
  • Step S201 heating the area to be coated of the array substrate.
  • the object to be plated in this embodiment is an array substrate that needs to repair the signal line, and only heats the area to be coated of the array substrate, thereby reducing the influence of high temperature on other components on the array substrate, and on the other hand, reducing energy unnecessary. Loss and waste.
  • the area to be coated is the area where the signal line on the array substrate needs to be plated with the metal plating layer due to the disconnection.
  • the laser light emitted by the laser emitter of the laser heating device is concentrated by the concentrating member and irradiated to the region to be coated of the array substrate, and the concentrated laser heats the region to be coated to increase the temperature of the region. .
  • the air outlet of the heat pipe of the resistance heating device is aligned with the film to be coated of the array substrate, and the air blowing member of the resistance heating device, such as a fan, blows the inside of the heat pipe, and the heat generating resistor inside the heat pipe is The blown gas is heated, and the heated hot gas is guided to the area to be coated via the heat pipe so that the area is heated and the temperature is raised.
  • Step S202 conveying the coating gas stream containing the metal powder mixture to the heated film to be coated.
  • the coating device sprays the high-temperature molten coating gas jet onto the to-be-coated region of the array substrate. Since the region is preheated, the temperature difference between the coating film and the high-temperature molten coating gas flow is small, and even the temperature difference between the film-coated region of the array substrate and the coating gas flow. It can be ignored, so the metal powder mixture in the coating gas stream will not crystallize in the area to be coated.
  • Step S203 decomposing the metal particles in the metal powder mixture such that the metal particles adhere to the film to be coated to form a plating layer.
  • the coating device emits laser light to decompose the metal powder mixture. Since the metal particles decomposed from the metal powder mixture are in a high-temperature molten state, a metal plating layer is formed on the to-be-coated region of the array substrate immediately, thereby causing a wire breakage defect. Signal line repair. Since the film to be coated region of the array substrate has been heated at this time, the temperature difference between the metal substrate and the metal particles is small or the temperature difference is negligible, so that the metal ions attached to the region to be coated of the array substrate are not crystallized, thereby forming the array.
  • the metal plating layer of the substrate to be coated in the substrate has strong adhesion in the area to be coated without falling off.
  • the temperature of the area to be coated of the array substrate is increased, the temperature difference between the area to be coated of the array substrate and the coating gas flow is reduced, and the mixture in the coating gas flow is avoided.
  • the crystallization of the area to be coated of the array substrate is such that there is no barrier of crystallization between the coating layer and the array substrate, and the coating layer is directly adhered to the array substrate, so that the adhesion is strong and does not fall off, thereby improving the success rate and stability of the coating. .
  • the present invention further provides a coating apparatus 100.
  • the coating apparatus 100 includes a heating unit 120 and a coating unit 110, wherein the heating unit 120 is used to heat a region to be coated of a plate to be plated, and the coating unit 110 is used for The film to be coated after the object to be plated 200 is heated is coated.
  • the heating unit 120 may be a laser heating unit 121, a resistance heating unit 122, or the like.
  • the coating apparatus 100 includes a laser heating unit 121 and a coating unit 110, wherein the laser heating unit 121 includes a laser emitter 1211 and a concentrating member 1212, and a laser emitter The laser light emitted by the 1211 is concentrated by the concentrating member 1212 and then irradiated to the area to be coated of the member to be plated 200.
  • the coating unit 110 includes a coating chamber 111, a barrier glass 112, and a laser 113.
  • the coating chamber 111 is provided with a coating passage, and the barrier glass 112 is disposed above the coating passage.
  • the coating chamber 111 has a first outlet 1111, a second outlet 1112, a third outlet 1113, and a discharge port 1114.
  • the powder coating material for forming a plating film is blown out by the first outlet 1111, and the first outlet 1111 is disposed above the film to be coated.
  • the second outlet 1112 is disposed above the first outlet 1111 for blowing a gas that does not react with the coating material, such as an inert gas or the like, and the inert gas blown by the second outlet 1112 and the first outlet 1111 The blown coating material is mixed.
  • the third outlet 1113 is disposed at one side of the first outlet 1111, and the inert gas blown by the third outlet 1113 is used to block the diffusion of the mixture of the inert gas and the coating material blown by the second outlet 1112 into the non-coating zone, that is, by The gas blown out by the three outlets 1113 is used to define the coating material in the area to be coated.
  • the discharge port 1114 is located between the first outlet 1111 and the third outlet 1113 for discharging a mixture of the coating material and the inert gas.
  • the laser 113 emits laser light to the area to be coated of the material to be plated 200 through the barrier glass 112 to decompose the metal particles in the powder coating material mixture, so that the metal particles adhere to the material to be plated 200 to form a coating layer; the barrier glass 112
  • the mixed gas flow formed by blocking the powder coating material and the inert gas is floated.
  • the coating chamber 111 further has a second discharge port 1115.
  • the second discharge port 1115 and the discharge port 1114 are respectively disposed at two sides of the third outlet 1113 for discharging the gas blown out from the third outlet 1113.
  • the laser heating unit 121 and the coating unit 110 may be arranged side by side, and the plate to be plated 200 is heated and coated on the object to be plated 200 on the same side of the object to be plated 200, so that the laser emitter 1211 and the coating of the laser heating unit 121 can be applied.
  • the lasers 113 of the unit 110 are arranged side by side, and both of them transmit laser light to the object to be plated through the barrier glass 112.
  • the barrier glass 112 may use a concentrating glass to serve as the concentrating member 1212 of the laser heating unit 121.
  • the laser heating unit 121 and the coating unit 110 may also be disposed opposite to each other and disposed on both sides of the member to be plated 200, so that the laser heating unit 121 heats the plated member 200 on one side, and the coating unit 110 is on the other side of the member to be plated 200.
  • the heated film to be coated is coated.
  • the coating device 100 is used as a repairing signal line on the array substrate of the liquid crystal panel, and the metal plating layer is additionally plated in the region where the signal line is broken.
  • the coating process of the coating device 100 of the present embodiment will be described in detail:
  • the laser light emitted from the laser emitter 1211 of the laser heating unit 121 is concentrated by the concentrating member 1212 and irradiated to the region to be coated of the object to be plated 200 (ie, the signal line disconnection region of the array substrate), thereby heating the region in advance and improving.
  • the powder coating material is blown out from the first outlet 1111 of the coating unit 110 and mixed with an inert gas to form a coating gas flow.
  • the laser 113 emits a laser to the area to be coated, and decomposes the metal particles of the coating gas flow, so that the metal particles adhere to the material to be coated 200 to form a metal plating layer. Since there is no crystal barrier between the metal plating layer and the member to be plated 200, the metal plating layer is directly attached to the member to be plated 200, and is tightly bonded to the member to be plated 200.
  • the film to be coated portion of the plated member 200 is heated in advance by the laser heating unit 121 to increase the temperature of the region to be coated of the member to be plated 200, and to reduce the area to be coated of the member to be plated 200 and the coating gas flow.
  • the temperature difference is avoided, and the mixture in the coating gas stream is crystallized in the film to be coated region of the object to be plated 200, so that there is no crystal barrier between the metal plating layer and the film to be coated portion of the member to be plated 200, and the metal plating layer is directly adhered to the plate to be plated.
  • the film to be coated on the part 200 improves the success rate and stability of the coating.
  • the heating unit 120 is different.
  • the heating unit of the embodiment is a resistance heating unit 122, and the resistance heating unit 122 includes The air blowing member 1221, the heat conducting tube 1222, and the heat generating resistor 1223 disposed in the heat conducting tube 1222, the air blowing member 1221 may be disposed in the heat conducting tube 1222, or may be disposed outside the heat conducting tube 1222 but aligned with the inlet of the heat conducting tube 1222.
  • the power source (not shown) energizes the heating resistor 1223 to heat the heating resistor 1223.
  • the air blowing member 1221 blows the inside of the heat pipe 1222, and the blown gas is heated by the heating resistor 1223 and then guided to the object to be plated through the heat pipe 1222. 200 areas to be coated.
  • the resistance heating unit 122 can be disposed opposite to the coating unit 110 and disposed on both sides of the member to be plated 200.
  • the outlet of the heat pipe 1222 of the resistance heating unit 122 is aligned with the area to be coated, so that the resistance heating unit 122 is
  • the side to be coated of the plated member 200 is heated on one side, and the coating unit 110 coats the area to be coated after heating on the other side of the member to be plated 200.
  • the resistance heating unit 122 and the coating unit 110 may also be arranged side by side on the same side of the member to be plated 200.
  • the resistance heating unit 122 can be disposed around the coating unit 110, that is, the heat pipe 1222 is disposed as a circular pipe, and the coating unit 110 is sleeved in the ring of the heat pipe 1222, so that the resistance heating unit 122 and the coating unit 110 is aligned with the same position of the member to be plated 200, and the plated member 200 is heated on the same side and coated on the member to be plated 200.
  • the coating process of the coating device 100 of the present embodiment is as follows: the air outlet of the heat pipe 1222 of the resistance heating unit 122 is aligned with the film to be coated of the plate to be plated 200, and the air blowing member 1221 of the resistance heating unit 122 is a fan pair heat pipe 1222. The internal blowing is performed, and the heating resistor 1223 inside the heat pipe 1222 heats the blown gas, and the heated hot gas is blown to the film to be coated so that the region is heated and the temperature is raised. The powder coating material is blown out from the first outlet 1111 and mixed with an inert gas to form a coating gas flow.
  • the metal powder mixture in the coating gas flow is not treated.
  • the coating area is crystallized; at the same time, the laser 113 emits laser light to the area to be coated, and decomposes the metal particles of the coating gas flow, so that the metal particles adhere to the material to be coated 200 to form a metal plating layer. Since there is no crystal barrier between the metal plating layer and the member to be plated 200, the metal plating layer is directly attached to the member to be plated 200, which improves the success rate and stability of the coating.

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Abstract

提供了一种镀膜方法及装置，所述镀膜方法包括步骤：对待镀件的待镀膜区加热；在所述待镀件加热后的待镀膜区镀膜。从而，通过预先对待镀件的待镀膜区加热，以提高该待镀膜区的温度，减小该待镀膜区与镀膜气流之间的温差，避免镀膜气流中的混合物于待镀件的待镀膜区结晶，从而镀膜层与待镀件之间没有结晶物的阻隔，镀膜层直接紧密附着于待镀膜区上，提高了镀膜的成功率和稳定性。

Description

镀膜方法及装置
技术领域
本发明涉及液晶面板技术领域，尤其涉及一种镀膜方法和镀膜装置。
背景技术
液晶面板包括阵列基板、彩色滤光片基板及设置在二者之间的液晶层。阵列基板是液晶面板的重要组成元件之一。在阵列基板上设置有若干信号线，如数据线、扫描线等。由于各种原因，阵列基板的信号线会存在断线缺陷，即信号线存在断路。为提高阵列基板的良率，需要利用镀膜装置在断线缺陷的区域补镀金属镀膜层，以修复断开的信号线。
在补镀金属镀膜层时，由于镀膜装置向阵列基板上传送的镀膜气流是高温熔融的混合物，而阵列基板则是处于常温下，因此阵列基板与镀膜气流的温差很大，导致镀膜气流中的混合物接触阵列基板后会形成结晶物。当结晶物落在待镀膜区域时，会使得镀膜层与阵列基板之间被结晶物阻隔，镀膜层不能紧密附着于阵列基板上，从而使镀膜层不牢固，容易从阵列基板上剥离，导致镀膜失败，降低了阵列基板的良率。
发明内容
本发明的主要目的在于提供一种镀膜方法及装置，旨在提高镀膜的成功率和稳定性。
为达以上目的，本发明提出一种镀膜方法，包括步骤：
对待镀件的待镀膜区加热；
在所述待镀件加热后的待镀膜区镀膜。
优选地，所述对待镀件的待镀膜区加热包括：
利用激光加热装置或电阻加热装置对待镀件的待镀膜区加热。
优选地，所述对待镀件的待镀膜区加热包括：
发射激光并把该激光汇聚于待镀件的待镀膜区，以对该待镀膜区加热。
优选地，所述对待镀件的待镀膜区加热包括：
加热气体并把加热后的气体吹向待镀件的待镀膜区，以对该待镀膜区加热。
优选地，所述加热气体并把加热后的气体吹向待镀件的待镀膜区，以对该待镀膜区加热包括：
利用鼓风件向导热管内吹入气体，所述导热管内的电阻加热元件加热吹入该导风管内的气体，加热后的气体经所述导热管导向所述待镀膜区，以对该待镀膜区加热。
优选地，所述在待镀件加热后的待镀膜区镀膜包括：
将包含金属粉末混合物的镀膜气流传送到所述待镀件加热后的待镀膜区；
分解出所述金属粉末混合物中的金属粒子，以使该金属粒子附着于所述待镀膜区上形成镀膜层。
本发明同时提出一种镀膜装置，包括加热单元和镀膜单元，所述加热单元用于对待镀件的待镀膜区加热，所述镀膜单元用于在待镀件加热后的待镀膜区镀膜。
优选地，所述加热单元为激光加热单元或电阻加热单元。
优选地，所述加热单元为激光加热单元，包括激光发射器和聚光件，所述激光发射器发射的激光经聚光件汇聚后照射于所述待镀件的待镀膜区。
优选地，所述镀膜单元包括一阻隔玻璃，所述激光加热单元和镀膜单元位于所述待镀件的同一侧，且所述阻隔玻璃采用聚光玻璃以充当所述激光加热单元的聚光件。
优选地，所述加热单元为电阻加热单元，包括导热管、设于导热管内的发热电阻和鼓风件，所述鼓风件对所述导热管内部吹风，吹入的气体被发热电阻加热后经导热管导向所述待镀件的待镀膜区。
优选地，所述导热管呈圆环形，所述镀膜单元套设于该导热管的圆环内。
优选地，所述加热单元和镀膜单元并列设置位于所述待镀件的同一侧或相对设置分置于所述待镀件的两侧。
优选地，所述镀膜单元包括镀膜腔体、固定于该镀膜腔体上的阻隔玻璃及激光器，所述镀膜腔体向加热后的所述待镀膜区传送镀膜气流，所述阻隔玻璃阻挡所述镀膜气流上浮，所述激光器透过所述阻隔玻璃向所述待镀膜区的镀膜气流发射激光。
本发明所提供的一种镀膜方法，通过预先对待镀件的待镀膜区加热，以提高该待镀膜区的温度，减小该待镀膜区与镀膜气流之间的温差，避免镀膜气流中的混合物于待镀件的待镀膜区结晶，从而镀膜层与待镀件之间没有结晶物的阻隔，镀膜层直接紧密附着于待镀件的待镀膜区上，提高了镀膜的成功率和稳定性。
附图说明
图1是本发明的镀膜方法第一实施例的流程图；
图2是本发明的镀膜方法第二实施例的流程图；
图3 是本发明的镀膜装置的结构示意图；
图4 是本发明的镀膜装置第一实施例的结构示意图；
图5是本发明的镀膜装置第二实施例的结构示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参见图1，提出本发明的镀膜方法一实施例，所述镀膜方法包括：
步骤S101、对待镀件的待镀膜区加热。
在镀膜之前，先对待镀件的待镀膜区加热，以提高待镀件的待镀膜区的温度，减小待镀件的待镀膜区与镀膜气流的温差。
可以利用激光加热装置、电阻加热装置等加热装置对待镀件的待镀膜区加热，加热装置可以与镀膜装置设为一体，也可以分体设置；加热装置与镀膜装置可以并列设置，位于待镀件的同一侧对该待镀件加热以及在该待镀件上镀膜；加热装置与镀膜装置也可以相对设置，分置于待镀件的两侧。
当用激光加热装置加热时，激光加热装置的激光发射器发射的激光经聚光件汇聚后照射于待镀件的待镀膜区，汇聚后的激光就对该待镀膜区加热而提高该区域的温度。当用电阻加热装置加热时，将电阻加热装置的导热管的出风口对准待镀件的待镀膜区，电阻加热装置的鼓风件如风机则对导热管内部吹风，导热管内部的发热电阻对吹入的气体加热，加热后的热气体吹到待镀膜区使得该区域被加热，温度得以升高。
步骤S102、在待镀件加热后的待镀膜区镀膜。
对待镀件的待镀膜区加热后，待镀件的待镀膜区的温度得以升高，此时再在待镀件的待镀膜区镀膜时，镀膜装置喷射的高温熔融的镀膜气流与待镀件的待镀膜区的温差较小，甚至待镀件的的待镀膜区与镀膜气流之间的温差可以忽略，因此镀膜气流中的混合物不会在待镀膜区域结晶而影响镀膜气流在待镀膜区形成的镀膜层的附着力，使得镀膜层直接附着于待镀件的待镀膜区，与待镀件紧密结合，提高了镀膜的成功率和稳定性。
参见图2，提出本发明的镀膜方法第二实施例。本发明的镀膜方法可以应用于液晶面板技术领域，当液晶面板的阵列基板上的信号线存在断路缺陷时，需要对断线区域补镀金属镀膜层，以修复该信号线。本实施例即以在阵列基板上补镀金属镀膜层为例对本发明的镀膜方法做详细说明：
步骤S201、对阵列基板的待镀膜区加热。
本实施例的待镀件即为需要修复信号线的阵列基板，并只对阵列基板的待镀膜区加热，一方面减少高温对阵列基板上其他部件的影响，另一方面可以减小能量不必要的损耗和浪费。此时待镀膜区即为阵列基板上信号线因存在断线而需要补镀金属镀膜层的区域。
当用激光加热装置加热时，激光加热装置的激光发射器发射的激光经聚光件汇聚后照射于阵列基板的待镀膜区，汇聚后的激光就对该待镀膜区加热而提高该区域的温度。当用电阻加热装置加热时，将电阻加热装置的导热管的出风口对准阵列基板的待镀膜区，电阻加热装置的鼓风件如风机则对导热管内部吹风，导热管内部的发热电阻对吹入的气体加热，加热后的热气体经导热管导向待镀膜区使得该区域被加热，温度得以升高。
步骤S202、将包含金属粉末混合物的镀膜气流传送到加热后的待镀膜区。
镀膜装置将高温熔融的镀膜气流喷射到阵列基板的待镀膜区，由于该区域已预先加热，其与高温熔融的镀膜气流的温差较小，甚至阵列基板的待镀膜区与镀膜气流之间的温差可以忽略，因此镀膜气流中的金属粉末混合物就不会在该待镀膜区结晶。
步骤S203、分解出金属粉末混合物中的金属粒子，以使该金属粒子附着于待镀膜区上形成镀膜层。
镀膜装置发射激光对金属粉末混合物进行分解，由于从金属粉末混合物中分解出的金属粒子处于高温熔融状态，因此马上附着于阵列基板的待镀膜区上形成金属镀膜层，从而将存在断线缺陷的信号线修复。由于此时阵列基板的待镀膜区已经被加热，其与金属粒子之间的温差较小或者温差可以忽略，因此附着在阵列基板的待镀膜区的金属离子不会发生结晶，从而使形成在阵列基板的待镀膜区的金属镀膜层在待镀膜区的附着力强，而不会脱落。
据此，本实施例通过预先对阵列基板的待镀膜区加热，以提高阵列基板的待镀膜区的温度，减小阵列基板的待镀膜区与镀膜气流之间的温差，避免镀膜气流中的混合物于阵列基板的待镀膜区结晶，使得镀膜层与阵列基板之间没有结晶物的阻隔，镀膜层直接紧密附着于阵列基板上，因此附着力强不会脱落，提高了镀膜的成功率和稳定性。
如图3-图5，本发明还提出一种镀膜装置，所述镀膜装置100包括加热单元120和镀膜单元110，其中加热单元120用于对待镀件的待镀膜区加热，镀膜单元110用于在待镀件200加热后的待镀膜区镀膜。加热单元120可以是激光加热单元121、电阻加热单元122等。
结合参见图4，提出本发明的镀膜装置第一实施例，所述镀膜装置100包括激光加热单元121和镀膜单元110，其中激光加热单元121包括激光发射器1211和聚光件1212，激光发射器1211发射的激光经聚光件1212汇聚后照射于待镀件200的待镀膜区。镀膜单元110包括镀膜腔体111、阻隔玻璃112、和激光器113，其中该镀膜腔体111开设有镀膜通道，阻隔玻璃112设置在镀膜通道的上方。镀膜腔体111具有第一出口1111、第二出口1112、第三出口1113及排出口1114。用于形成镀膜的粉末状镀膜材料由该第一出口1111吹出，该第一出口1111设置在待镀膜区的上方。第二出口1112设置在第一出口1111的上方，该第二出口1112用于吹出不与镀膜材料发生反应的气体，如惰性气体等，并且该第二出口1112吹出的惰性气体与第一出口1111吹出的镀膜材料混合。第三出口1113设置在第一出口1111的一侧，由第三出口1113吹出的惰性气体用于阻挡由第二出口1112吹出的惰性气体与镀膜材料的混合物扩散到非待镀膜区，即由第三出口1113吹出的气体用于将镀膜材料限定在待镀膜区。排出口1114位于第一出口1111与第三出口1113之间，用于排出镀膜材料和惰性气体的混合物。激光器113透过阻隔玻璃112向待镀件200的待镀膜区发射激光，分解出粉末状镀膜材料混合物中的金属粒子，以使该金属粒子附着于待镀件200上形成镀膜层；阻隔玻璃112阻挡粉末状镀膜材料与惰性气体形成的混合气流上浮。优选的，该镀膜腔体111还具有第二排出口1115，该第二排出口1115与排出口1114分别设置在第三出口1113的两侧，用于将从第三出口1113吹出的气体排出。
激光加热单元121和镀膜单元110可以并列设置，于待镀件200的同一侧对该待镀件200加热和在待镀件200上镀膜，从而可以将激光加热单元121的激光发射器1211和镀膜单元110的激光器113并列设置，均透过阻隔玻璃112向待镀件发射激光，此时的阻隔玻璃112可以采用聚光玻璃以充当激光加热单元121的聚光件1212。
当然，激光加热单元121和镀膜单元110也可以相对设置，分置于待镀件200两侧，从而激光加热单元121在一侧对待镀件200加热，镀膜单元110在待镀件200另一侧对加热后的待镀膜区域镀膜。
现以镀膜装置100为修复液晶面板的阵列基板上的信号线而在信号线断线的区域补镀金属镀膜层为例，详细说明本实施例的镀膜装置100的镀膜过程：
激光加热单元121的激光发射器1211发射的激光经聚光件1212汇聚后照射于待镀件200的待镀膜区域（即阵列基板的信号线断线区域），得以预先对该区域加热而提高了该区域的温度。粉末状镀膜材料由镀膜单元110的第一出口1111吹出并与惰性气体混合形成镀膜气流，由于该待镀膜区域已被加热而与镀膜气流的温差减小，因此镀膜气流中的金属粉末混合物不会在该待镀膜区域结晶；同时激光器113向该待镀膜区发射激光，分解出镀膜气流的金属粒子，以使该金属粒子附着于待镀膜件200上形成金属镀膜层。由于金属镀膜层与待镀件200之间没有结晶物的阻隔，使得金属镀膜层得以直接附着于待镀件200，与待镀件200紧密结合。
据此，本实施例通过激光加热单元121预先对待镀件200的待镀膜区加热，以提高待镀件200的待镀膜区域的温度，减小待镀件200的待镀膜区与镀膜气流之间的温差，避免镀膜气流中的混合物于待镀件200的待镀膜区结晶，使得金属镀膜层与待镀件200的待镀膜区之间没有结晶物的阻隔，金属镀膜层直接紧密附着于待镀件200的待镀膜区上，提高了镀膜的成功率和稳定性。
结合参见图5，提出本发明的镀膜装置第二实施例，本实施例与上述实施例的区别在于加热单元120不同，本实施例的加热单元为电阻加热单元122，所述电阻加热单元122包括鼓风件1221、导热管1222以及设于导热管1222内的发热电阻1223，鼓风件1221可以设于导热管1222内，也可以设于导热管1222外但对准导热管1222入口。电源（图中未示出）对发热电阻1223通电使发热电阻1223发热，所述鼓风件1221对导热管1222内部吹风，吹入的气体被发热电阻1223加热后经导热管1222导向待镀件200的待镀膜区。
如图5所示，电阻加热单元122可以和镀膜单元110相对设置，分置于待镀件200两侧，电阻加热单元122的导热管1222的出口对准待镀膜区，从而电阻加热单元122在一侧对待镀件200的待镀膜区加热，镀膜单元110在待镀件200另一侧对加热后的待镀膜区域镀膜。
电阻加热单元122和镀膜单元110也可以并列设置，位于待镀件200的同一侧。可以将电阻加热单元122设置于镀膜单元110的周围，也即将导热管1222设置为圆环形管道，将镀膜单元110套设于该导热管1222的圆环内，使得电阻加热单元122和镀膜单元110对准待镀件200的同一位置，于同一侧对待镀件200加热和在待镀件200上镀膜。
本实施例的镀膜装置100的镀膜过程如下：将电阻加热单元122的导热管1222的出风口对准待镀件200的待镀膜区，电阻加热单元122的鼓风件1221如风机对导热管1222内部吹风，导热管1222内部的发热电阻1223对吹入的气体加热，加热后的热气体吹到待镀膜区使得该区域被加热，温度得以升高。粉末状镀膜材料由该第一出口1111吹出并与惰性气体混合形成镀膜气流，由于该待镀膜区域已被加热而与镀膜气流的温差减小，因此镀膜气流中的金属粉末混合物不会在该待镀膜区域结晶；同时激光器113向该待镀膜区发射激光，分解出镀膜气流的金属粒子，以使该金属粒子附着于待镀膜件200上形成金属镀膜层。由于金属镀膜层与待镀件200之间没有结晶物的阻隔，使得金属镀膜层得以直接附着于待镀件200上，提高了镀膜的成功率和稳定性。
应当理解的是，以上仅为本发明的优选实施例，不能因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (14)

  1. 一种镀膜方法，其特征在于，包括步骤：
    对待镀件的待镀膜区加热；
    在所述待镀件加热后的待镀膜区镀膜。
  2. 根据权利要求1所述的镀膜方法，其特征在于，所述对待镀件的待镀膜区加热包括：
    利用激光加热装置或电阻加热装置对待镀件的待镀膜区加热。
  3. 根据权利要求1所述的镀膜方法，其特征在于，所述对待镀件的待镀膜区加热包括：
    发射激光并把该激光汇聚于待镀件的待镀膜区，以对该待镀膜区加热。
  4. 根据权利要求1所述的镀膜方法，其特征在于，所述对待镀件的待镀膜区加热包括：
    加热气体并把加热后的气体吹向待镀件的待镀膜区，以对该待镀膜区加热。
  5. 根据权利要求4所述的镀膜方法，其特征在于，所述加热气体并把加热后的气体吹向待镀件的待镀膜区，以对该待镀膜区加热包括：
    利用鼓风件向导热管内吹入气体，所述导热管内的电阻加热元件加热吹入该导风管内的气体，加热后的气体经所述导热管导向所述待镀膜区，以对该待镀膜区加热。
  6. 根据权利要求1所述的镀膜方法，其特征在于，所述在待镀件加热后的待镀膜区镀膜包括：
    将包含金属粉末混合物的镀膜气流传送到所述待镀件加热后的待镀膜区；
    分解出所述金属粉末混合物中的金属粒子，以使该金属粒子附着于所述待镀膜区上形成镀膜层。
  7. 一种镀膜装置，其特征在于，包括加热单元和镀膜单元，所述加热单元用于对待镀件的待镀膜区加热，所述镀膜单元用于在待镀件加热后的待镀膜区镀膜。
  8. 根据权利要求7所述的镀膜装置，其特征在于，所述加热单元为激光加热单元或电阻加热单元。
  9. 根据权利要求7所述的镀膜装置，其特征在于，所述加热单元为激光加热单元，包括激光发射器和聚光件，所述激光发射器发射的激光经聚光件汇聚后照射于所述待镀件的待镀膜区。
  10. 根据权利要求9所述的镀膜装置，其特征在于，所述镀膜单元包括一阻隔玻璃，所述激光加热单元和镀膜单元位于所述待镀件的同一侧，且所述阻隔玻璃采用聚光玻璃以充当所述激光加热单元的聚光件。
  11. 根据权利要求7所述的镀膜装置，其特征在于，所述加热单元为电阻加热单元，包括导热管、设于导热管内的发热电阻和鼓风件，所述鼓风件对所述导热管内部吹风，吹入的气体被发热电阻加热后经导热管导向所述待镀件的待镀膜区。
  12. 根据权利要求11所述的镀膜装置，其特征在于，所述导热管呈圆环形，所述镀膜单元套设于该导热管的圆环内。
  13. 根据权利要求7所述的镀膜装置，其特征在于，所述加热单元和镀膜单元并列设置位于所述待镀件的同一侧或相对设置分置于所述待镀件的两侧。
  14. 根据权利要求7所述的镀膜装置，其特征在于，所述镀膜单元包括镀膜腔体、固定于该镀膜腔体上的阻隔玻璃及激光器，所述镀膜腔体向加热后的所述待镀膜区传送镀膜气流，所述阻隔玻璃阻挡所述镀膜气流上浮，所述激光器透过所述阻隔玻璃向所述待镀膜区的镀膜气流发射激光。
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