WO2014091632A1 - Matériau d'électrode destiné à un fusible thermique et son procédé de fabrication - Google Patents

Matériau d'électrode destiné à un fusible thermique et son procédé de fabrication Download PDF

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WO2014091632A1
WO2014091632A1 PCT/JP2012/082579 JP2012082579W WO2014091632A1 WO 2014091632 A1 WO2014091632 A1 WO 2014091632A1 JP 2012082579 W JP2012082579 W JP 2012082579W WO 2014091632 A1 WO2014091632 A1 WO 2014091632A1
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layer
alloy
electrode material
thermal fuse
internal oxidation
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PCT/JP2012/082579
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English (en)
Japanese (ja)
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英生 汲田
慎也 眞々田
真弘 山口
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株式会社徳力本店
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Priority to JP2014551828A priority Critical patent/JP6099673B2/ja
Priority to PCT/JP2012/082579 priority patent/WO2014091632A1/fr
Publication of WO2014091632A1 publication Critical patent/WO2014091632A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/06—Fusible members characterised by the fusible material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material

Definitions

  • the present invention relates to an electrode material for a thermal fuse to be mounted to prevent an abnormally high temperature of an electronic device or an electric appliance for home appliances, and a method for manufacturing the same.
  • a thermal fuse that is installed to prevent electronic and electrical equipment from becoming extremely hot is that the temperature-sensitive pellet melts at the operating temperature, unloads the force of the strong compression spring, and the strong compression spring extends. As a result, the electrode material and the lead wire that are in pressure contact with each other by the strong compression spring are separated from each other to interrupt the current.
  • Patent Document 1 As an electrode material used for this thermal fuse, an Ag-oxide alloy is becoming mainstream (for example, Patent Document 1 and Patent Document 2).
  • the electrode material is a thin plate of 0.1 mm or less due to the thermal fuse mechanism, and the contact surface with the lead wire is kept energized for a long time, so it is welded to the lead wire or metal case. Phenomenon easily occurs, and welding resistance is required as a material property. In recent years, there has been a demand for a reduction in the material price of Ag-oxide alloys.
  • the demand for welding resistance and material cost reduction can be met by increasing the oxide content in the Ag-oxide alloy and decreasing the Ag content.
  • the Ag-oxide alloy has a marked decrease in rolling processability with the increase in oxide, making it difficult to process into a thin plate in the rolling process after internal oxidation.
  • the rolling processability is poor, and it was necessary to reduce the oxide content in order to improve the rolling processability.
  • This invention makes it a subject to solve such a problem.
  • the present invention has a multilayer structure having Ag—Cu alloy plates on both front and back surfaces in the longitudinal direction of a substrate made of Cu or Cu alloy, whereby a substrate layer and an Ag—Cu alloy layer are formed, and an internal oxidation is formed on this.
  • a thermal fuse electrode material having a multilayer structure in which an internal oxide layer was formed on the surface layer of the Ag—Cu alloy layer.
  • a bonding layer capable of improving the bonding strength may be provided as necessary at the interface between the substrate layer and the Ag—Cu alloy layer.
  • the thermal fuse electrode material having a multilayer structure as described above allows the material cost to be further reduced as compared with the conventional manufacturing method because the inexpensive substrate layer that occupies most of the material does not contain Ag. Further, since the substrate layer is rich in workability, it has succeeded in improving workability when rolling the material after internal oxidation while maintaining the oxide content in the internal oxide layer.
  • composition of each layer pure Cu containing inevitable impurities is preferable in the substrate layer, but for the purpose of improving heat resistance, conductivity or mechanical properties, Ti, Cr, Be, Si, Fe, Co, Zr Cu alloy containing at least one of Zn, Sn, Ni, P, and Pb may be used.
  • the Ag—Cu alloy plate contains 1 to 50% by mass of Cu and the balance contains Ag and inevitable impurities, or contains 1 to 50% by mass of Cu, and further includes Sn, In, Ti, Fe, Ni and Co.
  • An alloy containing 0.01 to 5% by mass of at least one selected from the group consisting of Ag and inevitable impurities is preferred.
  • the reason why the addition amount of Cu in the Ag—Cu alloy is 1 to 50% by mass is that, after the internal oxidation treatment, if the Cu content is less than 1% by mass, the oxide is insufficient and the thermal fuse is used. This is because welding resistance sufficient for use as an electrode material cannot be obtained.
  • the Cu content exceeds 50% by mass the workability of the internal oxide layer is remarkably lowered due to an increase in the oxide content, Cracks are likely to occur in the internal oxide layer.
  • oxygen is allowed to penetrate into the metal layer by internal oxidation treatment, oxygen is mainly bonded to Cu to form an oxide film near the surface, and oxide particles are dispersed in the metal layer. It becomes difficult to let you.
  • the bonding layer include pure Ag containing inevitable impurities, or an alloy containing 0.01 to 28% by weight of Cu and the balance containing Ag and inevitable impurities.
  • Any metal material may be used as long as it has appropriate bondability, such as noble metals such as Au, Mg, Cr, Sn, In, Ti, Fe, Ni or Co.
  • This bonding layer improves the bondability between the substrate layer and the Ag—Cu alloy layer, and prevents peeling due to differences in elongation during processing, vibration or impact.
  • a part of the constituent components may be diffused or alloyed to other adjacent layers by heat treatment.
  • this bonding layer is subjected to an internal oxidation process on the surface layer of the bonding layer during the internal oxidation process, and oxygen enters the substrate layer and Cu is oxidized until immediately before the adjacent substrate layer is subjected to the internal oxidation process. It also has a function of preventing peeling of the internal oxide layer that may be caused by this.
  • the reason why the added amount of Cu contained in the alloy of the bonding layer is 0.01 to 28% by mass is that when the Cu content exceeds 28% by mass, the bonding property to the adjacent plate material is preferable. This is because there is not.
  • the bonding layer in which the Cu content exceeds 28% by mass is more oxygenated during the internal oxidation treatment than the bonding layer in which the Cu content is 28% by mass or less. It has a high function of preventing peeling of the internal oxide layer that may be caused by Cu entering and oxidizing Cu.
  • a pipe clad method is preferable.
  • a wire material serving as a substrate layer is covered with an outer tube constituting an Ag—Cu alloy layer or a joining layer, and these are joined by hot wire drawing to form a wire shape composed of a plurality of the above various layers. This is a method of forming a multilayer structure material.
  • the linear multilayered structural material is processed into a plate shape by rolling. Thereafter, an internal oxidation layer is formed on the surface layer of the Ag—Cu alloy layer on both the front and back surfaces of the plate-shaped multilayer structure material by performing an internal oxidation treatment.
  • the linear multi-layer structure material may be processed into a plate shape by rolling after forming an internal oxidation layer on the surface layer of the Ag—Cu alloy layer by performing internal oxidation treatment while maintaining the linear shape.
  • the outer tube that constitutes the Ag—Cu alloy layer in which the inner oxide layer is formed by performing internal oxidation treatment in advance on the wire to be the substrate layer, and the outer tube that constitutes the bonding layer as necessary, are covered. May be joined by hot wire drawing to form a linear multilayered structure material composed of a plurality of the various layers, and then processed into a plate shape by rolling.
  • the plating method is a method of performing electrolysis or electroless plating on a substrate layer using a plating solution containing a metal salt constituting an Ag—Cu alloy layer or a bonding layer.
  • a thin film is formed on a substrate layer using a target material constituting an Ag—Cu alloy layer or a bonding layer and, if necessary, an oxygen atmosphere.
  • the manufacturing method of the multilayer structure material include plasma spraying, gas spraying, high-speed flame spraying, laminating by spraying such as a cold spray method, intermittent discharge in the air or liquid, pulse, etc.
  • a stacking by a discharge and a stacking by a vapor deposition method such as PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition).
  • the manufacturing method of the thermal fuse electrode material according to the present invention may be a method combining the above manufacturing methods.
  • the substrate layer may be a material central portion, both surfaces may be a cladding method, and the bonding layer may be a plating method.
  • the internal oxidation treatment is a process in which, in the Ag—Cu alloy layer, Cu previously contained in the Ag matrix is precipitated as an oxide in the Ag matrix by being combined with oxygen stored in the Ag matrix from the material surface layer. Take. At this time, Cu, which is a solute element, diffuses from the material inside the Ag—Cu alloy layer toward the surface layer.
  • the definition of the surface layer in the present invention refers to a range not more than the total thickness of the Ag—Cu alloy layer and the bonding layer from the material surface.
  • the phenomenon that the solute element diffuses from the inside of the material toward the surface layer is caused by the internal oxide layer formed by the oxide precipitated from the material surface of the Ag—Cu alloy layer toward the inside, and the precipitation over time.
  • This is a phenomenon in which a difference in Cu concentration occurs between the unoxidized layer and the non-oxidized layer, and Cu diffuses from the unoxidized layer toward the surface layer in order to fill the concentration gradient. For this reason, oxygen is always supplied in excess of the amount of oxygen necessary for the oxidation of other elements in the Ag matrix.
  • the diffusion process by adding at least one selected from the group consisting of Sn, In, Ti, Fe, Ni, and Co into the Ag—Cu alloy layer, the diffusion phenomenon due to the concentration gradient is suppressed, As a result, by suppressing the aggregation due to the movement of the deposited oxide, the oxide structure is made finer and a uniform dispersion can be obtained. Furthermore, it becomes a complex oxide with Cu, for example, (Cu—Sn) Ox, and has the effect of improving the welding resistance.
  • At least one of Sn, In, Ti, Fe, Ni, or Co is made 0.01 to 5% by mass. This is because the movement of the solute element during the treatment cannot be sufficiently suppressed, and a uniform dispersion of the oxide cannot be obtained. If the amount exceeds 5% by mass, a coarse oxide is formed at the grain boundary and the contact resistance is increased. It is for inviting.
  • the present invention is characterized in that, in this internal oxidation treatment, only the surface layers on both the front and back surfaces of the material have an internal oxide structure, and the internal oxidation conditions for this are set at 500 ° C. in an internal oxidation furnace at a desired plate thickness. It is adjusted under the conditions of ⁇ 750 ° C., 0.25 hours or more, and oxygen partial pressure of 0.1 to 2 MPa. As a result, an internal oxide layer can be formed on the front and back surfaces of the material, and a substrate layer can be formed at the center of the material.
  • the average particle size of the oxide particles dispersed in the internal oxide layer is 0.5 to 5 ⁇ m, preferably 1 to 4 ⁇ m, more preferably 2 to 3 ⁇ m.
  • the average particle size of the oxide particles is less than 0.5 ⁇ m, the oxide particles are fine at the contact portion between the lead wire and the movable electrode, so that the oxide particles are easily welded.
  • the average particle size of the oxide particles is 5 ⁇ m. If it is larger, the contact resistance becomes higher, so that welding becomes easier.
  • the oxygen partial pressure during the internal oxidation treatment is important for adjusting the average particle size of the oxide particles to 0.5 to 5 ⁇ m.
  • the oxygen partial pressure during the internal oxidation treatment under internal oxidation conditions is preferably 0.1 to 2 MPa. That is, when the oxygen partial pressure is less than 0.1 MPa, it is difficult to form the internal oxide layer uniformly, the average particle size of the oxide particles is greater than 5 ⁇ m, and when the oxygen partial pressure is greater than 2 MPa, The average particle size becomes less than 0.5 ⁇ m, and it becomes easy to weld as described above.
  • the temperature during the internal oxidation treatment is preferably 500 ° C. to 750 ° C. as described above.
  • the temperature is lower than 500 ° C., the oxidation reaction does not proceed sufficiently.
  • the temperature is higher than 750 ° C., it becomes difficult to control the thickness of the internal oxide layer and the size of the oxide particles.
  • the time of internal oxidation treatment includes the target internal oxide layer thickness, unoxidized layer thickness, Ag—Cu alloy composition, bonding layer and Ag—Cu alloy layer thickness, and the aforementioned internal oxidation temperature. It is necessary to adjust appropriately according to the oxygen partial pressure.
  • the thickness of the target internal oxide layer it is preferably 0.25 hours or longer. That is, when the internal oxidation time is less than 0.25 hours, it is difficult to form the internal oxide layer uniformly. If the internal oxidation time is less than 0.25 hours, it is difficult to form the internal oxide layer uniformly and sufficiently, and there is a risk of causing a welding phenomenon with the lead wire or the metal case when used as an electrode material for a thermal fuse. is there. There is no particular upper limit to the internal oxidation time, and the thickness of the internal oxide layer increases in proportion to the increase in internal oxidation time.
  • the substrate layer is internally oxidized, it may cause peeling of each layer, so that the ratio of the thickness of the Ag—Cu alloy layer or the bonding layer to the substrate layer should be increased so that the substrate layer is not subjected to internal oxidation treatment.
  • a layer for preventing oxidation may be provided at the interface with the substrate layer.
  • the temperature, pressure, and time of internal oxidation are correlated with each other. For example, in order to shorten the internal oxidation time in a short time, the temperature and pressure are increased and adjusted. It is necessary to select a proper condition.
  • the electrode material for the thermal fuse has various component compositions and various final plate thicknesses depending on the usage of the thermal fuse, but a thin plate material of 0.1 mm or less is used due to the mechanism of the thermal fuse.
  • a thin plate material of 0.1 mm or less is used due to the mechanism of the thermal fuse.
  • shearing or heat treatment may be performed as necessary. Or you may wire-draw the material after internal oxidation to a thin plate material with a deformed die.
  • the electrode material of the present invention even if the content of Ag is decreased by increasing the Cu content in the Ag-Cu alloy layer to 50 mass% and increasing the oxide content after the internal oxidation treatment, In the processing after the internal oxidation, it is possible to perform a rolling process with a cross-section reduction rate of 80% or more.
  • the internal oxide layer having a sufficient thickness on both the front and back surfaces of the electrode material and a substrate layer mainly composed of Cu at the center of the material are provided.
  • Workability can be greatly improved without reducing the oxide content of the oxide layer.
  • an electrode material for thermal fuse that adjusts heat resistance, conductivity, mechanical properties, etc. to desired characteristics while maintaining welding resistance It becomes possible to provide.
  • thermal fuse electrode material that can greatly reduce the amount of Ag and the like while maintaining various characteristics such as welding resistance and low contact resistance required for the thermal fuse electrode material. Is possible.
  • Explanatory drawing which shows the front direction cross section of the two-layer clad wire in Manufacturing Method 1 and Manufacturing Method 5
  • Explanatory drawing which shows the longitudinal direction cross section of the 3 layer clad board in the manufacturing method 1 and the manufacturing method 5
  • Explanatory drawing which shows the longitudinal cross section of the multilayer clad board after the internal oxidation process in the manufacturing method 1 and the manufacturing method 5
  • Explanatory drawing which shows the front direction cross section of the 3 layer clad line in the manufacturing method 2 and the manufacturing method 6
  • Explanatory drawing which shows the longitudinal cross section of the 5-layer clad board in the manufacturing method 2 and the manufacturing method 6
  • Explanatory drawing which shows the longitudinal direction cross section of the multilayer clad board in the manufacturing method 2 and the manufacturing method 6
  • Explanatory drawing which shows the front direction cross section of the two-layer clad wire after the internal oxidation process in Manufacturing Method 3 and Manufacturing Method 7
  • Explanatory drawing which shows the front direction cross section of the three-layer clad line after the internal oxidation process
  • Examples of the present invention are shown in Tables 1 to 4, and a method for manufacturing these thermal fuse electrode materials will be described.
  • an Example and a comparative example are electrode material kind No ..
  • Table 2 is shown in a format corresponding to Table 1
  • Table 4 is shown in a format corresponding to Table 3.
  • the composition of components contained in the Ag—Cu alloy pipes and joint pipes of the production methods 1 to 8 of the present invention is shown in Table 1, and the Ag—Cu alloy pipe and joint pipes of the production methods 3 to 4 of the present invention are shown in Table 1.
  • the component composition contained is listed in Table 3.
  • Tables 1 and 3 also show the composition of the components contained in the Ag—Cu alloy pipe of the comparative example.
  • internal oxidation temperature, internal oxidation time, oxygen partial pressure, average particle size of oxide, workability of rolling after internal oxidation treatment and after clad processing, electrode material for thermal fuse Table 2 or Table 4 shows the final plate thickness and the final processing rate.
  • the component composition contained in the Ag—Cu alloy pipe and the joining pipe is quantitatively analyzed using a wavelength dispersive electron microscope and an ICP emission analyzer.
  • the remaining Ag and inevitable impurities are described as remaining.
  • the inevitable impurities described in the examples of the present invention indicate impurities having a content of less than 0.01% by mass.
  • Bondability is determined by subjecting each clad plate obtained by manufacturing methods 1 to 8 to 180 ° bending according to the press bending method defined in JIS Z 2248, and then performing an adhesion bending test to crack the curved portion. Bondability was evaluated by the presence or absence of peeling. The case where cracks and peeling were observed in the curved portion was evaluated as x, and the case where cracks and separation were not observed in the curved portion and excellent in bondability was evaluated as ⁇ . Even if the bondability evaluation is x, if the following processability evaluation is A to C and the evaluation of other evaluation items is ⁇ , it can be suitably used as a movable electrode for a thermal fuse.
  • Bending workability is determined by fixing a test piece of various electrode materials processed to the final plate thickness by each manufacturing method and then performing a 90 ° repeated bending test until the test piece is cracked. The number of bends was measured, and the bondability was evaluated based on the number of bends. The number of bending was 10 times or more was evaluated as A, the number of 4 times or more and less than 10 times was evaluated as B, and the case of 2 times or more and less than 4 times was evaluated as C. In addition, when processing into a movable electrode having a predetermined shape, bending is performed once by pressing, but if the evaluation is A to C, the movable electrode can be processed with sufficient reliability. In any of the production methods of the present invention, the obtained movable electrode material did not cause interfacial delamination between layers, and was broken at the substrate layer to obtain a movable electrode material having extremely good bonding properties. .
  • the workability was evaluated as “ ⁇ ” when the final processing rate in the final plate thickness before the hardness adjustment by heat treatment was cold-rolled to 80% or more in terms of the cross-sectional reduction rate, and “ ⁇ ” when it was not possible.
  • Reasons for evaluation x include cracks and breaks during rolling, cracks in the internal oxide layer, and the like.
  • good workability was obtained as compared with the comparative example.
  • oxygen-free Cu was used for the substrate layer
  • manufacturing methods 5 to 8 a Cu alloy was used for the substrate layer, but no difference in workability was observed.
  • the average particle size of the oxide particles was measured at 1000 times the cross section of the movable electrode material for the thermal fuse with a metal microscope. Average particle size is 0mm. In the range of 5 mm to 5 mm, the average particle size is 0 mm. Those outside the range of 5 to 5 ⁇ m were evaluated as x. In addition, in any internal oxidation conditions of the present invention, a good average oxide particle size was obtained.
  • Comparative Example As a comparative example, an internal oxidation treatment was performed on an Ag—Cu alloy plate having a thickness of 0.5 mm in an internal oxidation furnace under conditions of 500 ° C. to 750 ° C. for 48 hours and an oxygen partial pressure of 0.1 to 2 MPa.
  • An Ag-oxide alloy plate 7 (FIG. 9) in which an inner oxide layer 4 containing oxide on both surface layers and an oxide thin layer 8 in the middle layer portion was formed, and after final annealing, the final thickness (0 .1 mm or less), the electrode material type No. that has been cold-rolled so that the final processing rate in the cross-section reduction rate is 80% or more. Details of 41 to 47 are also shown in Tables 1 to 4. The reason why the internal oxidation time of the comparative example is unified to 48 hours is that the oxide thin layer 8 can be reliably formed in the thickness of the Ag—Cu alloy plate of the comparative example.
  • the definition of the diluted oxide layer 8 in the comparative example is located at the center of the longitudinal cross section of the Ag—Cu alloy plate subjected to the internal oxidation treatment, the oxide content is lower than 1 mass%, and the cross-sectional ratio Means a layer in the range of 10% or less.
  • a clad wire (outer diameter ⁇ 29) was obtained (FIG. 1).
  • the temperature of the material was adjusted to 400 ° C. when the Ag—Cu alloy pipe and the core material passed through the die.
  • the reason for fixing the temperature at 400 ° C. is to make the test conditions uniform, and a range of 200 to 750 ° C. is preferable.
  • the above-mentioned two-layer clad wire was subjected to cold wire drawing, cold rolling, shearing and heat treatment to obtain a three-layer clad plate having a thickness of 0.5 mm (FIG. 2).
  • the above three-layer clad plate was internally oxidized in an internal oxidation furnace under conditions of 500 ° C. to 750 ° C., 0.25 to 36 hours, and oxygen partial pressure of 0.1 to 2 MPa. At this time, conditions are selected within the above ranges depending on the composition and thickness of each layer, the internal oxide layer 4 containing the oxide 3 is formed on the front and back surfaces of the three-layer clad plate, and the unoxidized layer is formed in the middle layer portion. 5.
  • a multi-layer structure (FIG. 3) having a substrate layer 2 at the center of the material is provided.
  • the above-mentioned three-layer clad plate after internal oxidation is completely annealed and then cold-rolled with the multilayer structure shown in FIG.
  • the electrode material for thermal fuses was produced.
  • Manufacturing method 2 Examples according to this production method are shown in Tables 1 and 2. Alloys having desired compositions to be the bonding layers 6 corresponding to the electrode material types No. 1 to 40 were prepared by a melting method. The alloy having a desired composition to be the joining layer 6 was subjected to rolling, and then joined pipes (outer diameter ⁇ 36, inner diameter ⁇ 33) to be the joining layer 6 by pipe welding and tube drawing. Further, Ag—Cu alloy pipes (outer diameter ⁇ 36, inner diameter ⁇ 33) and the substrate layer 2 having the same composition and the same dimensions as the electrode material types No. 1 to 40 are manufactured by the same manufacturing method as in manufacturing method example 1. A core material (outer diameter ⁇ 32) was obtained.
  • the three-layer clad wire is subjected to cold drawing, cold rolling, shearing, and heat treatment, the plate thickness is 0.5 mm, and the bonding layer 6 and Ag- A multilayered five-layer clad plate (FIG. 6) having a Cu alloy layer 1 was formed.
  • the internal oxidation treatment was performed on the five-layer clad plate under the same conditions as in Production Method Example 1. At this time, conditions are selected within the above ranges depending on the composition and layer thickness in each layer, the internal oxide layer 4 containing oxide 3 is formed on the front and back surfaces of the five-layer clad plate, and the unoxidized layer is formed in the middle layer portion. 5.
  • a multilayer structure (FIG. 7) having a substrate layer 2 at the center of the material and a bonding layer 6 at the bonding interface between the unoxidized layer 5 and the substrate layer 2 is provided.
  • the above-mentioned internally oxidized 5-layer clad plate is completely annealed and then cold-rolled with the multilayer structure shown in FIG.
  • the electrode material for thermal fuses was produced.
  • Manufacturing method 4 Examples according to this production method are shown in Tables 1 and 2.
  • a three-layer clad wire manufactured under the same conditions as in manufacturing method 2 was subjected to internal oxidation under the same conditions as in manufacturing method example 1.
  • conditions are selected within the above ranges depending on the composition and layer thickness of each layer, the internal oxide layer 4 containing the oxide 3 is formed on the surface layer of the three-layer clad wire, the unoxidized layer 5 and the material in the middle layer portion
  • a multilayer structure (FIG. 9) having the substrate layer 2 in the center and the bonding layer 6 at the bonding interface between the unoxidized layer 5 and the substrate layer 2 is provided.
  • Manufacturing method 5 Examples according to this production method are shown in Tables 3 and 4.
  • a Cu alloy containing 0.2% by mass of Sn was prepared by a melting method.
  • the Cu alloy was subjected to extrusion processing and wire drawing processing to obtain a core material (outer diameter ⁇ 32 mm) to be the substrate layer 2.
  • Manufacturing method 7 Examples according to this production method are shown in Tables 3 and 4.
  • a Cu alloy containing 0.2% by mass of Sn was prepared by a melting method.
  • the Cu alloy was subjected to extrusion processing and wire drawing processing to obtain a core material (outer diameter ⁇ 32 mm) to be the substrate layer 2.
  • Manufacturing method 8 Examples according to this production method are shown in Tables 3 and 4.
  • a Cu alloy containing 0.2% by mass of Sn was prepared by a melting method.
  • the Cu alloy was subjected to extrusion processing and wire drawing processing to obtain a core material (outer diameter ⁇ 32 mm) to be the substrate layer 2.
  • thermal fuse electrode materials of the examples and comparative examples are adjusted to a desired hardness by heat treatment as necessary, and then processed into a movable electrode having a predetermined shape by pressing or the like, so that the temperature sensitive material is at the operating temperature.
  • a typical commercially available temperature-sensitive pellet type thermal fuse that melts and unloads the compression spring, and when the compression spring is extended, the movable electrode pressed by the compression spring and the lead wire are separated to interrupt the current. Can be suitably used.
  • the temperature fuse electrode materials of the examples and comparative examples are adjusted to a desired hardness by heat treatment as necessary, and then processed into a movable electrode having a predetermined shape by pressing, and the movable electrode is subjected to a temperature sensitive pellet type temperature.
  • Tables 2 and 4 show the results of conducting an energization test and a current interruption test with a fuse mounted, DC30V, 20A, and a heating rate of 1 ° C per minute.
  • the temperature fuse was energized for 10 minutes, and the temperature difference on the surface of the temperature fuse metal case before and after the test was less than 10 ° C., and the temperature difference of 10 ° C. or more was evaluated as x.
  • the temperature fuse In the current interruption test, the temperature fuse is energized for 10 minutes, and then the temperature of the test environment is raised to a temperature 10 ° C higher than the operating temperature at a heating rate of 1 ° C per minute while energization continues. I tried to cut off the current. After the test, a case where the movable electrode and the lead wire were not welded, that is, a case where the current could be interrupted, was evaluated as ⁇ .

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Fuses (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)

Abstract

La présente invention concerne un matériau d'électrode destiné à un fusible thermique qui utilise un matériau de placage formé par la liaison de deux matériaux métalliques ou plus possédant des propriétés différentes, et un procédé de fabrication pour le matériau d'électrode. Par l'utilisation d'un fil comprenant Cu ou un alliage de Cu en tant que matériau de base, par l'ajustement d'un tuyau comprenant un alliage Ag-Cu et, selon le besoin, d'un tuyau comprenant une couche de liaison au matériau de base, par la réalisation d'un placage et d'un travail des plastiques dans le but d'obtenir un fil de placage multicouche ou un matériau de placage multicouche, et par la réalisation d'un traitement d'oxydation interne et d'un travail des plastiques sur le résultat dans le but de configurer une plaque mince, le matériau d'électrode destiné à un fusible thermique est conçu de façon à comprendre une structure multicouche possédant une couche oxydée en interne sur la surface à la fois des surfaces avant et arrière de la plaque mince et une couche d'alliage Ag-Cu ou un alliage d'une couche d'alliage Ag-Cu et d'une couche de liaison qui sont formées à la fois sur les surfaces avant et arrière d'une couche de substrat.
PCT/JP2012/082579 2012-12-14 2012-12-14 Matériau d'électrode destiné à un fusible thermique et son procédé de fabrication WO2014091632A1 (fr)

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JP2014551828A JP6099673B2 (ja) 2012-12-14 2012-12-14 温度ヒューズ用電極材料の製造方法
PCT/JP2012/082579 WO2014091632A1 (fr) 2012-12-14 2012-12-14 Matériau d'électrode destiné à un fusible thermique et son procédé de fabrication

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104625471A (zh) * 2014-12-18 2015-05-20 郴州市金贵银业股份有限公司 一种真空电子钎焊用无镉银钎料及其制备方法
CN110592420A (zh) * 2019-10-23 2019-12-20 常州恒丰特导股份有限公司 高分段玻璃保险管用镀锡银铜合金熔断丝及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169320U (fr) * 1980-05-17 1981-12-15
JPS62241211A (ja) * 1986-04-11 1987-10-21 中外電気工業株式会社 点溶接可能なテ−プ状電気接点材料
JPH025844U (fr) * 1988-06-24 1990-01-16
JPH0336223A (ja) * 1989-06-30 1991-02-15 Tanaka Kikinzoku Kogyo Kk 銀酸化カドミウム系電気接点材料及びその製造方法
JPH0547252A (ja) * 1991-08-15 1993-02-26 Furukawa Electric Co Ltd:The 電気接点材料とその製造方法
WO2003009323A1 (fr) * 2001-07-18 2003-01-30 Nec Schott Components Corporation Fusible thermique

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169320U (fr) * 1980-05-17 1981-12-15
JPS62241211A (ja) * 1986-04-11 1987-10-21 中外電気工業株式会社 点溶接可能なテ−プ状電気接点材料
JPH025844U (fr) * 1988-06-24 1990-01-16
JPH0336223A (ja) * 1989-06-30 1991-02-15 Tanaka Kikinzoku Kogyo Kk 銀酸化カドミウム系電気接点材料及びその製造方法
JPH0547252A (ja) * 1991-08-15 1993-02-26 Furukawa Electric Co Ltd:The 電気接点材料とその製造方法
WO2003009323A1 (fr) * 2001-07-18 2003-01-30 Nec Schott Components Corporation Fusible thermique

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104625471A (zh) * 2014-12-18 2015-05-20 郴州市金贵银业股份有限公司 一种真空电子钎焊用无镉银钎料及其制备方法
CN110592420A (zh) * 2019-10-23 2019-12-20 常州恒丰特导股份有限公司 高分段玻璃保险管用镀锡银铜合金熔断丝及其制备方法
CN110592420B (zh) * 2019-10-23 2021-08-13 常州恒丰特导股份有限公司 高分断玻璃保险管用镀锡银铜合金熔断丝及其制备方法

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