WO2014068639A1 - 部品供給装置 - Google Patents
部品供給装置 Download PDFInfo
- Publication number
- WO2014068639A1 WO2014068639A1 PCT/JP2012/077901 JP2012077901W WO2014068639A1 WO 2014068639 A1 WO2014068639 A1 WO 2014068639A1 JP 2012077901 W JP2012077901 W JP 2012077901W WO 2014068639 A1 WO2014068639 A1 WO 2014068639A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer sheet
- guide
- wafer
- support point
- component
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/02—Devices for feeding articles or materials to conveyors
- B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
- B65G47/06—Devices for feeding articles or materials to conveyors for feeding articles from a single group of articles arranged in orderly pattern, e.g. workpieces in magazines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7565—Means for transporting the components to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Definitions
- the technology disclosed in this specification relates to a component supply apparatus that supplies components to a mounting machine that mounts components on a substrate.
- Some component supply apparatuses supply a wafer sheet in which a plurality of components are arranged in a specific pattern on a sheet.
- a wafer sheet is placed on a table, and the table on which the wafer sheet is placed is conveyed to a component supply position (a position near the mounting machine).
- a component supply position a position near the mounting machine.
- components are supplied from the wafer sheet on the table to the mounting machine.
- a conventional example of such a component supply apparatus is disclosed in Japanese Patent Laid-Open No. 2000-114204.
- a component supply apparatus components are supplied to a mounting machine from a wafer sheet placed on a table.
- the wafer sheet can be adjusted to a predetermined angle by providing the table with an angle adjusting mechanism for adjusting the angle of the table.
- the mechanism is likely to be complicated, and the table is likely to increase in size.
- the component supply apparatus disclosed in this specification is configured to pass a table on which a wafer sheet is placed, around a specific rotation axis that passes through a placement surface on which the wafer sheet is placed and is orthogonal to the placement surface. It has a mechanism to rotate.
- support points are set on a circumference around the rotation axis. And it is characterized by making a support point carry out circular arc movement with respect to the said rotating shaft by guiding to a guide.
- the front view which shows the structure of a movement table typically.
- a mounting table (for example, a feeder device table) on which other component supply devices (for example, a feeder) (not shown) are mounted is installed.
- the mounting machine 20 includes board transfer units 22a and 22b that transfer boards.
- An upstream component mounting system is disposed on the left side surface 24 a of the mounting machine 20.
- a downstream component mounting system is disposed on the right side surface 24 b of the mounting machine 20.
- a board on which components are mounted by the upstream component mounting system is supplied to the board transfer units 22a and 22b.
- the substrates supplied to the substrate transfer units 22 a and 22 b are sent to the center of the mounting machine 20.
- the mounting head 30 of the mounting machine 20 sucks the component W1 on the wafer sheet W2 transported to the component supply position by the wafer sheet transport unit 60 and mounts the sucked component W1 on the substrate on the substrate transport units 22a and 22b. .
- the substrate on which the component W1 is mounted is sent to the component mounting system on the downstream side by the substrate transfer units 22a and 22b.
- the upstream component mounting system may be disposed on the right side surface 24 b of the mounting machine 20
- the downstream component mounting system may be disposed on the left side surface 24 a of the mounting machine 20. In this case, the substrate is transported from the right side 24b side to the left side 24a side of the mounting machine 20.
- the wafer sheet supply unit 160 includes a housing 162, a magazine 170, and an elevating mechanism 168.
- the lifting mechanism 168 has a ball screw 166 and a motor 164 that rotates the ball screw 166.
- a nut (not shown) that engages with the ball screw 166 is fixed to the magazine 170. For this reason, when the ball screw 166 is rotated by the motor 164, the magazine 170 moves up and down in the housing 162.
- an arbitrary wafer sheet accommodating portion 172 of the magazine 170 can be made to coincide with the height of the carry-out port 174 of the housing 162.
- the wafer sheet W2 can be carried out from the wafer sheet storage unit 172 to the wafer transfer unit 60 through the carry-out port 174.
- the transfer of wafer sheet W2 from wafer sheet storage unit 172 to wafer transfer unit 60 is performed by a robot (not shown).
- the guide roller 182 is in contact with a surface 148b extending in the y direction of the first frame member 148. Therefore, a z-direction force acts between the guide roller 182 and the first frame member 148. As described above, the guide roller 182 is rotatable around a rotation axis that is parallel to the y-axis. For this reason, the wafer sheet supply unit 160 is supported in the z direction by the guide roller 182 while allowing the wafer sheet conveyance unit 60 to slide in the x direction (direction orthogonal to the paper surface).
- the guide roller 184 contacts the surface 148 a extending in the z direction of the first frame member 148 and also contacts the protruding piece 150 a of the second frame member 150.
- the second engagement groove 138a is configured similarly to the first engagement groove 138b. That is, the second slide block group 186 and the guide rollers 188 and 190 are accommodated in the second engagement groove 138a, and the guide rollers 188 and 190 are in contact with the inner surface of the second engagement groove 138a. Wafer sheet supply unit 160 is supported by guide rollers 188 and 190 in the y direction and the z direction with respect to wafer sheet conveyance unit 60.
- the wafer sheet supply unit 160 can slide in the x direction (that is, a direction orthogonal to the direction (y direction) for supplying the wafer sheet W2) with respect to the wafer sheet conveyance unit 60.
- the range in which the wafer sheet replenishment unit 160 can slide is a range from the position indicated by the solid line in FIG. . For this reason, even if the wafer sheet supply unit 160 is slid, the wafer sheet supply unit 160 does not interfere with the upstream component mounting system and does not interfere with the downstream component mounting system. As is clear from FIG.
- the slider 78 is supported so as to be slidable in the y direction with respect to the base 64.
- a guide 72 is provided on the upper surface of the base 64.
- a guide portion 74 of a slider 78 is engaged with the guide 72. Therefore, the slider 78 is supported so as to be movable in the y direction with respect to the base 64.
- the slider 78 is moved by a ball screw mechanism (not shown) and a motor that rotationally drives the ball screw mechanism.
- the three points where the slider 84 and the support points 86a and 86b are provided are set so as to be on the circumference of the same circle centered on the point C shown in FIG. That is, the wafer table 88 is supported at three points on the same circumference with the point C ( ⁇ axis) as the center. Further, the curvature of the R guide 82 is set so that the slider 84 moves on the circumference of the same circle with the point C ( ⁇ axis) as the center. For this reason, when the slider 84 is guided by the R guide 82 and makes an arc motion around the ⁇ axis, the support points 86a and 86b are also guided by the cross guides 80a and 80b and make an arc motion around the ⁇ axis. As a result, the wafer table 88 rotates around the ⁇ axis.
- the nut member 85 moves in the x direction along the ball screw 94.
- the slider 84 moves in the x direction while being guided by the R guide 82.
- the wafer table 88 rotates about the ⁇ axis.
- the wafer table 88 has a mounting surface on which the wafer sheet W2 is mounted. As shown in FIG. 8, an opening 88 a is formed at the center of the mounting surface of the wafer table 88. By forming the opening 88a in the center of the mounting surface, a mechanism for pushing up the wafer sheet W2 can be disposed on the lower surface side of the wafer sheet W2. By pushing up wafer sheet W2 from the lower surface, component W1 can be easily adsorbed from wafer sheet W2. Note that the wafer sheet W ⁇ b> 2 placed on the wafer table 88 can be photographed with the camera 104 fixed to the moving mechanism 102.
- the suction head 100 includes a mechanism (118, 120, etc.) for switching the suction nozzles 114a, 114b between a suction position and a delivery position. That is, a rack 118 is attached to the first housing 110 so as to be movable in the vertical direction. A pinion gear 120 is engaged with the rack 118. The pinion gear 120 is fixed to the rotating shaft 116. Accordingly, when the rack 118 moves in the vertical direction, the pinion gear 120 and the rotating shaft 116 rotate, and the suction nozzles 114a and 114b also move between the suction position and the delivery position.
- a mechanism 118, 120, etc.
- the vertical movement of the rack 118 is performed by the rotation member 126 rotating around the support shaft 128. That is, a cam follower 122 is attached to the upper end of the rack 118. A guide groove 124 is formed in the cam follower 122. A pin 130 is engaged with the guide groove 124 of the cam follower 122, and the pin 130 is fixed to one end of a rotating member (cam member) 126. For this reason, when the rotating member 126 is rotated around the support shaft 128 by an actuator (not shown) (for example, an air cylinder), the pin 130 is also rotated according to the rotation of the rotating member 126. As a result, the cam follower 122 engaged with the pin 130 also moves in the vertical direction, and the rack 118 moves in the vertical direction.
- an actuator for example, an air cylinder
- the suction head 100 and the camera 104 can be moved in the xy direction with respect to the moving table 62 by a moving mechanism 102 attached to the moving table 62.
- a moving mechanism 102 attached to the moving table 62.
- the suction head 100 and the camera 104 are attached to the moving table 62 via the moving mechanism 102. For this reason, when the moving table 62 is moved in the vertical direction by the table lifting mechanism 110, the suction head 100 and the camera 104 are also moved in the vertical direction accordingly.
- the arrangement of the suction nozzles 32 of the mounting head 30 corresponds to the arrangement of the suction nozzles 114 a and 114 b of the suction head 100. That is, the mounting head 30 can simultaneously receive a plurality of components W1 held by the suction nozzles 114a and 114b of the suction head 100.
- the mounting head 30 can be moved in the xy direction by an x-direction moving mechanism and a y-direction moving mechanism (not shown).
- the component camera 28 reads the component W1 adsorbed by the mounting head 30 and the like.
- the wafer sheet W2 is conveyed from the wafer sheet supply unit 160 (S10).
- the control device 200 drives the lifting mechanism 168 to position one of the wafer sheet storage portions 172 at the carry-out port 174.
- the control device 200 drives the moving table 62 to position the wafer table 88 at the wafer sheet placement position (position near the wafer sheet replenishing unit 160).
- the wafer sheet placement position is a position where the wafer sheet W2 is unloaded from the unloading port 174 of the wafer sheet supply unit 160, and is set in the vicinity of the unloading port 174 of the wafer sheet supply unit 160.
- the control device 200 drives the robot to place the wafer sheet W2 accommodated in the wafer accommodating portion 172 on the placement surface of the wafer table 88.
- the control device 200 drives the moving table 62 to position the wafer table 88 at the component supply position (position near the mounting machine 20) (S12).
- the component supply position is set in the vicinity of the mounting machine 20 and is a position where the component W1 is supplied from the wafer sheet W2 to the mounting head 30.
- the camera 104 photographs the wafer sheet W2 on the wafer table 88, and calculates the deviation amount (deviation in the ⁇ direction (angular deviation)) of the wafer sheet W2.
- the deviation in the ⁇ direction of the wafer sheet W2 can be calculated by the following procedure, for example. That is, the center points C1 to C3 of the plurality of parts W1 are calculated from the image photographed by the camera 104 as shown in FIG. Then, a deviation (angle deviation) in the ⁇ direction of the wafer sheet W2 is calculated from the straight line L2 connecting the center point C1 and the center point C2 and the inclination of the straight line L1 connecting the center point C1 and the center point C3.
- the control device 200 drives the movement table 62 to correct the positional deviation around the ⁇ axis (S18). As a result, the wafer sheet W1 is positioned in a predetermined posture (angle).
- control device 200 determines whether or not the component W1 on the wafer sheet W2 is directly sucked by the mounting head 30 (S20). That is, the control device 200 determines whether to supply the part W1 of the wafer sheet W2 face-up or face-down.
- steps S22 and S24 are skipped and the process proceeds to step S26.
- the control device 200 drives the suction head 100 to cause the component W1 on the wafer sheet W2 to the suction head 100.
- Adsorbed S22
- the suction head 100 has a plurality of suction nozzles 114a and 114b, a plurality of components W1 are sucked to the suction head 100.
- the control device 200 rotates the second housing 112 to move the suction nozzles 114a and 114b of the suction head 100 from the suction position to the delivery position. Further, the control device 200 drives the table lifting mechanism 110 to lower the moving table 62. That is, as is apparent from FIGS.
- the suction nozzles 114a and 114b of the suction head 100 and the arrangement of the suction nozzle 32 of the mounting head 30 correspond to each other, a plurality of components W1 can be simultaneously transferred from the suction head 100 to the mounting head 30.
- the suction nozzle provided in the suction head 100 and the suction nozzle provided in the mounting head 30 may partially correspond to each other so that a plurality of components W1 can be delivered at the same time.
- the suction nozzles of the suction head 100 are arranged in 2 rows ⁇ 2 columns (ie, two in the x direction and two in the y direction), and the suction nozzles of the mounting head 30 are arranged in 1 row ⁇ 2 columns.
- the two parts W1 may be simultaneously delivered from the suction head 100 to the mounting head.
- the suction nozzles of the suction head 100 are arranged in 1 row ⁇ 2 columns
- the suction nozzles of the mounting head 30 are arranged in 2 rows ⁇ 2 columns
- two components W1 are simultaneously delivered from the suction head 100 to the mounting head. It may be a thing.
- the suction nozzles of the suction head 100 are arranged in 4 rows ⁇ 2 columns
- the suction nozzles of the mounting head 30 are arranged in 2 rows ⁇ 4 columns
- four components W1 are simultaneously delivered from the suction head 100 to the mounting head. It may be done.
- the control device 200 drives the mounting head 30 to mount the component W1 attracted to the mounting head 30 on the substrates on the substrate transport units 22a and 22b. As a result, the component W1 is mounted on the substrate.
- the wafer replenishing unit 160 is slidable with respect to the wafer transfer unit 60, so that the mounting machine 20 can be easily accessed. .
- the wafer replenishing unit 160 by restricting the slidable range of the wafer replenishing unit 160, it is possible to prevent the wafer replenishing unit 160 from interfering with the adjacent component mounting system. As a result, it is possible to suppress an increase in size of the component mounting system 10 while expanding an access area of the operator to the mounting machine 20.
- the wafer table 88 is supported at three points.
- the number of points for supporting the wafer table 88 is not limited to three, and may be three or more. It may be less than the point.
- the position of the point supporting the wafer table 88, the position where the R guide is provided, and the like can be changed as appropriate.
Abstract
Description
次に、部品装着システム10の各部について詳細に説明する。まず、ウエハシート補給部160について説明する。図2に示すように、ウエハシート補給部160は、ハウジング162と、マガジン170と、昇降機構168を備えている。
次に、ウエハシート搬送部60について説明する。図2に示すように、ウエハシート搬送部60は、移動テーブル62と、移動テーブル62を昇降するテーブル昇降機構110と、移動テーブル62に対してxy方向に移動可能とされた吸着ヘッド100と、移動テーブル62に載置されたウエハシートW2を撮影するカメラ104を有している。
次に、実装機20について説明する。なお、実装機20には、従来公知のものを使用することができるため、ここでは、実装機20の構成については簡単に説明する。図2に示すように、実装機20は、基板搬送部22a,22bと、装着ヘッド30と、部品カメラ28を有している。基板搬送部22a,22bは、コンベアベルトを回転させることで、コンベアベルト上に載置された基板を搬送する。装着ヘッド30は、部品W1を吸着するための複数の吸着ノズル32と、ウエハシートW2のフィデューシャルマークを読み取るためのマークカメラ34を備えている。装着ヘッド30の吸着ノズル32の配置は、吸着ヘッド100の吸着ノズル114a,114bの配置に対応している。すなわち、装着ヘッド30は、吸着ヘッド100の吸着ノズル114a,114bに保持された複数の部品W1を同時に受取ることができる。なお、装着ヘッド30は、図示しないx方向移動機構とy方向移動機構によって、xy方向に移動可能となっている。部品カメラ28は、装着ヘッド30に吸着された部品W1の読み取り等を行う。
Claims (3)
- 基板に部品を実装する実装機に隣接して配置され、前記実装機に前記部品を供給する部品供給装置であり、
シート上に複数の部品が特定のパターンで配置されたウエハシートが補給されるウエハシート補給部と、
前記ウエハシート補給部に補給されたウエハシートを前記実装機に向かって搬送するウエハシート搬送部と、を有しており、
前記ウエハシート搬送部は、
前記ウエハシート補給部の近傍の位置から前記実装機の近傍の位置までの間を移動する移動スライダと、
前記移動スライダに支持され、前記ウエハシートが載置される載置面を有するテーブルと、
前記載置面に対して直交する特定の回転軸の周りにテーブルを回転させる回転機構と、を有しており、
前記テーブルは、前記回転軸を中心とする円周上に設定された第1の支持点、第2の支持点及び第3の支持点で前記移動スライダに支持されており、
前記回転機構は、
前記第1の支持点を前記回転軸に対して円弧運動させるための第1ガイドと、
前記第1の支持点を前記第1ガイドに沿って移動させるアクチュエータと、
前記第1の支持点が前記第1ガイドに沿って移動するときに、前記第2の支持点を前記回転軸に対して円弧運動させる第1従動ガイドと、
前記第1の支持点が前記第1ガイドに沿って移動するときに、前記第3の支持点を前記回転軸に対して円弧運動させる第2従動ガイドと、
を有する部品供給装置。 - 前記第1ガイドは、
前記移動スライダに設けられたRガイドと、
前記テーブルの前記第1の支持点に取付けられ、前記Rガイドに沿って移動するRスライダと、を有しており、
前記第1ガイドが、前記テーブルの実装機側の端辺に配置されている、請求項1に記載の部品供給装置。 - 前記第1従動ガイド及び前記第2従動ガイドはクロスガイドである、請求項1又は2に記載の部品供給装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201280076742.1A CN104770076B (zh) | 2012-10-29 | 2012-10-29 | 元件供给装置 |
PCT/JP2012/077901 WO2014068639A1 (ja) | 2012-10-29 | 2012-10-29 | 部品供給装置 |
US14/438,525 US9781870B2 (en) | 2012-10-29 | 2012-10-29 | Component supply device |
JP2014544070A JP5885856B2 (ja) | 2012-10-29 | 2012-10-29 | 部品供給装置 |
EP12887805.5A EP2914078B1 (en) | 2012-10-29 | 2012-10-29 | Component supply apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2012/077901 WO2014068639A1 (ja) | 2012-10-29 | 2012-10-29 | 部品供給装置 |
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WO2014068639A1 true WO2014068639A1 (ja) | 2014-05-08 |
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PCT/JP2012/077901 WO2014068639A1 (ja) | 2012-10-29 | 2012-10-29 | 部品供給装置 |
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US (1) | US9781870B2 (ja) |
EP (1) | EP2914078B1 (ja) |
JP (1) | JP5885856B2 (ja) |
CN (1) | CN104770076B (ja) |
WO (1) | WO2014068639A1 (ja) |
Cited By (1)
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CN113543511A (zh) * | 2021-08-11 | 2021-10-22 | 常州冯卡斯登智能科技有限公司 | 一种具有自动疏通功能的贴片机进料装置 |
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US9902415B2 (en) * | 2016-02-15 | 2018-02-27 | Lam Research Corporation | Universal service cart for semiconductor system maintenance |
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CN113543511B (zh) * | 2021-08-11 | 2023-08-18 | 常州冯卡斯登智能科技有限公司 | 一种具有自动疏通功能的贴片机进料装置 |
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US20150282397A1 (en) | 2015-10-01 |
EP2914078A1 (en) | 2015-09-02 |
CN104770076A (zh) | 2015-07-08 |
JP5885856B2 (ja) | 2016-03-16 |
US9781870B2 (en) | 2017-10-03 |
EP2914078B1 (en) | 2020-05-06 |
EP2914078A4 (en) | 2015-11-04 |
JPWO2014068639A1 (ja) | 2016-09-08 |
CN104770076B (zh) | 2018-04-10 |
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