WO2014049780A1 - Dispositif de chauffage, dispositif de soudure, procédé de chauffage et procédé de soudure - Google Patents

Dispositif de chauffage, dispositif de soudure, procédé de chauffage et procédé de soudure Download PDF

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Publication number
WO2014049780A1
WO2014049780A1 PCT/JP2012/074906 JP2012074906W WO2014049780A1 WO 2014049780 A1 WO2014049780 A1 WO 2014049780A1 JP 2012074906 W JP2012074906 W JP 2012074906W WO 2014049780 A1 WO2014049780 A1 WO 2014049780A1
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WO
WIPO (PCT)
Prior art keywords
light
heating
solder
heated
heating device
Prior art date
Application number
PCT/JP2012/074906
Other languages
English (en)
Japanese (ja)
Inventor
雅代 高橋
Original Assignee
パイオニアデジタルデザインアンドマニュファクチャリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニアデジタルデザインアンドマニュファクチャリング株式会社 filed Critical パイオニアデジタルデザインアンドマニュファクチャリング株式会社
Priority to PCT/JP2012/074906 priority Critical patent/WO2014049780A1/fr
Publication of WO2014049780A1 publication Critical patent/WO2014049780A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B7/00—Heating by electric discharge
    • H05B7/18—Heating by arc discharge
    • H05B7/22—Indirect heating by arc discharge

Definitions

  • the present invention relates to a heating device, a soldering device, a heating method, and a soldering method.
  • Patent Document 1 discloses a light that emits infrared light as a light source for heating solder.
  • Patent Documents 2 and 3 disclose laser light sources as light sources for heating solder.
  • An object of the present invention is to provide a heating device, a soldering device, a heating method, and a soldering method that can be easily reduced in size and cost.
  • a heating device is a heating device that heats an object to be heated, and a high-pressure mercury lamp that emits light of a predetermined wavelength, and reflects and collects light in a first wavelength range among the light of the predetermined wavelength.
  • the first wavelength range is more than 405 nm and not more than 800 nm.
  • a soldering apparatus includes an installation portion in which an electronic component is installed and the above-described heating device, and heats the solder applied to the electronic component with light in the first wavelength range. .
  • the heating method of the present invention is a heating method for heating an object to be heated, which emits light having a predetermined wavelength from a high-pressure mercury lamp, and reflects light having a wavelength exceeding 405 nm and not more than 800 nm out of the light having the predetermined wavelength. And the object to be heated is heated with the condensed light.
  • the soldering method of the present invention emits light having a predetermined wavelength from a high-pressure mercury lamp, and reflects and collects light having a wavelength of more than 405 nm and not more than 800 nm out of the light having the predetermined wavelength, which is applied to an electronic component.
  • the formed solder is heated with the condensed light, and the solder is solidified.
  • the fragmentary sectional view which shows schematic structure of the soldering apparatus in embodiment of this invention.
  • the block diagram which shows schematic structure of the soldering apparatus in the said embodiment.
  • the fragmentary sectional view which shows schematic structure of the light source device in the said embodiment.
  • the flowchart which shows the soldering method in the said embodiment.
  • a soldering apparatus 1 heats a solder SL as an object to be heated applied to an electronic component EL, and joins terminals (not shown) of the electronic component EL to each other.
  • the soldering apparatus 1 includes a transport device 2, a solder application device 3, a heating device 4, and a control device 9.
  • the transport device 2 transports the electronic component EL to a position where it can be heated by the heating device 4.
  • the transport device 2 includes a substantially box-shaped main body 21.
  • the main body 21 includes a substantially rectangular upper surface 22.
  • the upper surface 22 is provided with a case 23 that houses a light guide unit 6, a temperature measurement unit 7, and a photographing unit 8, which will be described later, of the heating device 4.
  • the case 23 is formed in a substantially box shape whose bottom surface and left surface are open.
  • the left surface of the case 23 is provided with a lid 231 that opens and closes the left surface.
  • a gap (not shown) is provided between the lower end of the lid portion 231 and the upper surface 22.
  • the upper surface 22 is provided with a linear motor 24 extending from the inside of the case 23 toward the outside of the case 23.
  • the linear motor 24 is provided with a stage 25 as an installation portion that can reciprocate along the linear motor 24.
  • An electronic component EL is installed on the stage 25.
  • the electronic component EL placed on the stage 25 is transported into the case 23 through a gap by driving the linear motor 24 and heated by the heating device 4.
  • the solder application device 3 applies the solder SL to the electronic component EL on the stage 25 located outside the case 23.
  • the heating device 4 heats the solder SL of the electronic component EL transported by the transport device 2.
  • the heating device 4 includes a light source device 5, a light guide unit 6, a temperature measurement unit 7, and a photographing unit 8.
  • the light source device 5 includes a box-shaped case 51 as shown in FIG.
  • the case 51 is provided with a lid 511 for opening and closing the upper surface of the case 51.
  • a high-pressure mercury lamp 52, a condensing mirror 53, a shutter 54 constituting a light intensity adjusting unit, and a connector 55 are provided inside the case 51.
  • the high-pressure mercury lamp 52 is used for a general UV irradiator.
  • the high-pressure mercury lamp 52 emits light L1 having peak wavelengths of 296 nm, 302 nm, 312 nm, 365 nm, 405 nm, 435 nm, 546 nm, and 576 nm.
  • the condenser mirror 53 includes a spheroidal reflecting surface 531.
  • the reflecting surface 531 reflects the light in the first wavelength range and the light in the second wavelength range and collects the light on the incident surface 551 of the connector 55.
  • the first wavelength range is more than 405 nm and not more than 800 nm.
  • the second wavelength range is 200 nm or more and 405 nm or less.
  • the condensing mirror 53 reflects light having a wavelength of 200 nm or more and 800 nm or less.
  • the light L1 emitted from the high-pressure mercury lamp 52 is reflected by the reflecting surface 531, and the light L2 having characteristics as shown in FIG. 4 enters the incident surface 551 of the connector 55.
  • the light L2 includes light in the first wavelength range.
  • the solder SL can be heated by the light L2.
  • the shutter 54 is provided on the optical path of the light L2.
  • the shutter 54 is configured such that the opening degree can be adjusted.
  • the shutter 54 blocks the light L2 reflected by the condenser mirror 53 and adjusts the intensity of the light L2 incident on the incident surface 551.
  • the heating temperature of the solder SL can be changed by adjusting the intensity of the light L2.
  • the connector 55 is provided so that the incident surface 551 is located inside the case 51 and the connecting portion 552 facing the incident surface 551 is located outside the case 51.
  • the connector 55 includes a transmission part 553 that transmits the light L2.
  • the light guide 6 guides the light L2 to the outside of the case 51 without reducing the intensity of the light L2.
  • the light guide unit 6 includes two optical fibers 61 as light guide members and two fiber support units 62 constituting an irradiation position adjusting unit.
  • the optical fiber 61 is formed in a substantially rod shape that can be bent.
  • the optical fiber 61 is provided so that one end is located outside the case 23 and the other end is located inside the case 23.
  • a connector 63 is provided at one end of the two optical fibers 61.
  • the connector 63 includes a connecting portion 631 that is detachably connected to the connecting portion 552 of the connector 55.
  • the connector 63 includes a transmission part 632 that transmits the light L2.
  • a condensing lens 64 is provided at the other end of the optical fiber 61.
  • the condensing lens 64 condenses the light L2 emitted from the optical fiber 61 at a predetermined position.
  • the fiber support unit 62 supports the other end side of the optical fiber 61.
  • the fiber support portion 62 is configured to be movable on the upper surface 22. As the fiber support 62 moves, the other end of the optical fiber 61 moves in a direction substantially orthogonal to the axis of the optical fiber 61 as indicated by an arrow D1. As the fiber support 62 moves, the other end of the optical fiber 61 moves in a direction substantially parallel to the axis of the optical fiber 61 as indicated by an arrow D2.
  • the temperature measuring unit 7 measures the temperature of the solder SL and outputs a signal corresponding to the measurement result to the control device 9.
  • a radiation thermometer may be used as the temperature measuring unit 7.
  • the imaging unit 8 images the electronic component EL and outputs a signal corresponding to the imaging result to the control device 9.
  • the installation position of the temperature measurement unit 7 and the imaging unit 8 may be any position as long as the temperature of the solder SL can be measured or the electronic component EL can be imaged.
  • the control device 9 includes an input unit 91, a display unit 92, a storage unit 93, and a control unit 94.
  • the input unit 91 includes a keyboard, a mouse, a touch pen, and the like, and is configured to be able to set and input various information.
  • storage part 93 memorize
  • the control unit 94 is configured by processing a program and data stored in the storage unit 93 by a CPU (Central Processing Unit). The control unit 94 performs various processes based on various data stored in the storage unit 93.
  • the control unit 94 includes a solder application control unit 941, a fiber position control unit 942 constituting an irradiation position adjustment unit, a lamp control unit 943, a shutter control unit 944 constituting a light intensity adjustment unit, and a display control unit. 945.
  • the solder application control unit 941 controls the conveying device 2 and the solder applying device 3 to apply the solder SL to the electronic component EL or convey the electronic component EL into and out of the case 23.
  • the lamp control unit 943 controls the high pressure mercury lamp 52.
  • the fiber position control unit 942 controls the position of the fiber support unit 62 and adjusts the incident angle and irradiation distance of the light L2 with respect to the solder SL.
  • the shutter control unit 944 controls the opening degree of the shutter 54 based on the temperature measurement result in the temperature measurement unit 7 and adjusts the intensity of the light L ⁇ b> 2 incident on the incident surface 551.
  • the display control unit 945 causes the display unit 92 to display an image photographed by the photographing unit 8.
  • solder application control unit 941 of the control device 9 sets the soldering conditions based on the setting input of the input unit 91 by the operator. It is determined whether or not it is necessary (step S1). Examples of the soldering conditions include the application position and application area of the solder SL, the melting temperature of the solder SL, the irradiation angle and spot diameter of the light L2 with respect to the solder SL, and the number of electronic components EL to be soldered.
  • step S1 when it is determined that the soldering conditions need to be set, the solder application control unit 941 stores data based on the setting input of the input unit 91 in the storage unit 93 and sets the soldering conditions ( Step S2).
  • the solder application control unit 941 controls an electronic component conveying device (not shown) to As indicated by the dotted line, the electronic component EL is set on the stage 25 (step S3).
  • the solder application control unit 941 controls the solder application device 3 based on the soldering conditions to apply the solder SL to the electronic component EL (step S4). Then, as shown by the solid line in FIG. 1, the solder application control unit 941 controls the transport device 2 to carry the electronic component EL into the case 23 (step S5). Thereafter, the fiber position control unit 942 of the control device 9 determines whether or not adjustment of the irradiation state of the light L2 is necessary based on the soldering conditions (step S6).
  • step S6 when the fiber position control unit 942 determines that adjustment is necessary, the fiber position control unit 942 controls the fiber support unit 62 and moves the distal end side of the optical fiber 61 in the direction indicated by the arrow D1 or the arrow D2.
  • the irradiation state of the light L2 is adjusted (step S7).
  • the fiber position control unit 942 moves the optical fiber 61 so that the irradiation angle and spot diameter of the light L2 are in an appropriate state based on the application position and application area of the solder SL and the melting temperature of the solder SL.
  • step S8 the lamp controller 943 of the control device 9 turns on the high-pressure mercury lamp 52 when the fiber position controller 942 performs the process of step S7 or when it is determined that the adjustment of the irradiation state is unnecessary in step S6.
  • step S8 the process of step S8, as shown in FIG. 3, the light L1 emitted from the high-pressure mercury lamp 52 is reflected by the condensing mirror 53, and the light L2 is condensed by the incident surface 551.
  • the light L ⁇ b> 2 collected by the incident surface 551 is guided to the outside of the case 51 by the optical fiber 61 and is applied to the solder SL.
  • the light L2 includes a component in the first wavelength range (exceeding 405 nm and not more than 800 nm). For this reason, the solder SL is heated mainly by components in the first wavelength range.
  • the temperature measurement unit 7 measures the temperature of the solder SL irradiated with the light L2, and transmits the measurement result to the control device 9 (step S9).
  • This temperature measurement is preferably performed after a predetermined time has elapsed from the process of step S8, for example, and the temperature of the solder SL has risen to a temperature corresponding to the intensity of the light L2.
  • the shutter control unit 944 of the control device 9 determines whether or not the temperature adjustment of the solder SL is necessary based on the soldering conditions and the temperature measurement result in step S9 (step S10).
  • step S10 when the shutter control unit 944 determines that temperature adjustment is necessary, the shutter control unit 944 adjusts the opening of the shutter 54 (step S11). Specifically, when it is determined that the temperature needs to be raised, the shutter control unit 944 increases the opening of the shutter 54. When the opening degree of the shutter 54 increases, the intensity of the light L2 irradiated to the solder SL through the optical fiber 61 increases, and the heating temperature of the solder SL increases. On the other hand, when the shutter control unit 944 determines that the temperature needs to be lowered, the heating temperature of the solder SL is lowered by reducing the opening degree of the shutter 54 and reducing the intensity of the light L2 applied to the solder SL. . As described above, by appropriately adjusting the temperature of the solder SL, there is a problem that the solder SL cannot be melted without being melted, or that the solder SL is excessively melted and flows to an unintended position. Can be prevented.
  • the lamp controller 943 determines whether the soldering is completed when the shutter controller 944 performs the process of step S11 or when it is determined in step S10 that the temperature adjustment is unnecessary (step S12). ). For example, after a predetermined time has elapsed since the completion of the process of step S11, or when the process of step S11 is not performed, the lamp control unit 943, after the predetermined time has elapsed after the completion of the process of step S8, It is determined that soldering (for example, joining of terminals (not shown)) is completed. Thereafter, the lamp controller 943 turns off the high-pressure mercury lamp 52 (step S13). By the processing in step S13, the irradiation of the light L2 onto the solder SL is completed, and the temperature of the solder SL is lowered and solidified.
  • step S14 the solder application controller 941 controls the transport device 2 to carry out the electronic component EL out of the case 23 (step S14). Then, the solder application control unit 941 determines whether or not to set the next electronic component EL based on the soldering conditions (step S15). In step S15, when the solder application control unit 941 determines to set, the process of step S3 is performed. On the other hand, if the solder application control unit 941 determines not to set in step S15, the process ends.
  • the photographing unit 8 photographs the electronic component EL during the above-described soldering.
  • the display control unit 945 causes the display unit 92 to display an image captured by the imaging unit 8.
  • the operator can visually confirm the molten state of the solder SL.
  • the operator checks the melting state of the solder SL when the opening of the shutter 54 is maximized (when the intensity of the light L2 is maximized), and whether or not the solder SL is melted in a state corresponding to the opening. Based on the above, it can be determined whether or not the high-pressure mercury lamp 52 has deteriorated over time.
  • the operator can replace the high-pressure mercury lamp 52 with a new high-pressure mercury lamp 52 when the high-pressure mercury lamp 52 has deteriorated over time.
  • the heating device 4 reflects the light L2 including light in the first wavelength range (exceeding 405 nm and not more than 800 nm) out of the light emitted from the high-pressure mercury lamp 52 and collects the light with a connector 55. 53.
  • a general UV irradiator only light having a wavelength of 405 nm or less out of light emitted from a high-pressure mercury lamp is reflected by a condensing mirror and condensed to irradiate an object to be irradiated. That is, the UV irradiator does not reflect light in the first wavelength range.
  • the heating device 4 includes a light guide 6 that guides the light L ⁇ b> 2 to the outside of the case 51. For this reason, even if it is necessary to increase the distance between the heating position of the solder SL and the light source device 5 due to the installation position and installation space of the transport device 2 and the heating device 4, the configuration of the light guide unit 6. It is possible to appropriately heat the solder SL by changing. Furthermore, since the light guide unit 6 is configured to be detachable from the case 51, only the failed heating device 4 or only the light guide unit 6 can be replaced, and unnecessary repair is unnecessary.
  • the light guide 6 includes a bendable optical fiber 61. For this reason, by bending the optical fiber 61, the irradiation position of the light L2, the spot diameter, and the like can be adjusted, and the solder SL can be appropriately heated. For example, even when the application range of the solder SL is large or when there is a variation in the dimensions of the electronic component EL, the solder SL can be uniformly heated over the entire application range. Further, since the position of the fiber support section 62 can be adjusted by the control of the fiber position control section 942, the irradiation position of the light L2 can be finely adjusted. Furthermore, by emitting the light L2 from the substantially rod-shaped optical fiber 61, it can be locally heated.
  • the heating device 4 includes a shutter 54 that adjusts the intensity of the light L2 applied to the solder SL. For this reason, the heating temperature of the solder SL can be appropriately adjusted by adjusting the intensity of the light L2 in accordance with the melting temperature of the solder SL. In particular, the heating temperature of the solder SL can be adjusted with a simple configuration that only adjusts the light shielding amount of the light L2 by adjusting the opening of the shutter 54. Further, since the shutter control unit 944 adjusts the intensity of the light L2 based on the temperature of the solder SL measured by the temperature measuring unit 7, the heating temperature of the solder SL can be appropriately adjusted according to the actual heating state.
  • the heating device 4 includes an imaging unit 8 that images the electronic component EL. For this reason, by displaying the melting state of the solder SL photographed by the photographing unit 8 on the display unit 92, the operator can determine whether or not the high-pressure mercury lamp 52 has deteriorated with time during the soldering process.
  • a condensing mirror 53 that reflects light in the first wavelength range and the second wavelength range is applied as the condensing mirror of the heating device 4. That is, the condensing mirror 53 that reflects light of all wavelengths is applied.
  • the cost of the heating device 4 can be easily reduced by applying the collectable mirror 53 that is easily available and inexpensive as compared with the collective mirror that reflects only light in the first wavelength range.
  • the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.
  • the condensing mirror 53 that reflects only light in the first wavelength range may be used.
  • the solder SL may be positioned at the light L2 condensing position (position where the incident surface 551 is provided) in the light source device 5.
  • the optical fiber 61 may be configured not to be bent.
  • the fiber support unit 62 may be moved manually by an operator without using the configuration in which the fiber support unit 62 is movable by the control of the fiber position control unit 942. Further, the temperature measurement unit 7 or the imaging unit 8 may not be provided.
  • the number of the optical fibers 61 provided in the light guide unit 6 may be one or three or more.
  • the object to be heated by the heating device 4 is not limited to the solder SL, and may be a thermosetting adhesive.
  • the coating film of the coil may be heated and melted as an object to be heated.
  • the light L2 may be emitted from only one optical fiber 61 in correspondence with the position of the solder SL in the electronic component EL.
  • the intensity of the light L2 emitted from the two optical fibers 61 may be individually adjustable. And you may apply the heating apparatus 4 to the apparatus and reflow furnace which take a solder from an electronic component. Further, the condensing lens 64 may not be provided in the optical fiber 61.
  • the emission intensity of the high-pressure mercury lamp 52 may be adjusted without adjusting the opening of the shutter 54.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention vise à permettre à un dispositif d'irradiation d'ultraviolets classique d'être utilisé comme dispositif de chauffage (4) par le simple remplacement d'un miroir de collecte de lumière de celui-ci, et à obtenir facilement une réduction de taille et des coûts réduits par rapport à une constitution utilisant une source de lumière de rayons infrarouges ou de lumière de laser. A cet effet, l'invention porte sur un dispositif de chauffage (5), lequel dispositif comporte une lampe à mercure à haute pression (52) qui émet une lumière à des longueurs d'onde prescrites, et un miroir de collecte de lumière (53) qui réfléchit et collecte une lumière d'une première plage de longueur d'onde parmi la lumière aux longueurs d'onde prescrites, et la première plage de longueur d'onde étant supérieure à 405 nm et inférieure ou égale à 800 nm.
PCT/JP2012/074906 2012-09-27 2012-09-27 Dispositif de chauffage, dispositif de soudure, procédé de chauffage et procédé de soudure WO2014049780A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/074906 WO2014049780A1 (fr) 2012-09-27 2012-09-27 Dispositif de chauffage, dispositif de soudure, procédé de chauffage et procédé de soudure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/074906 WO2014049780A1 (fr) 2012-09-27 2012-09-27 Dispositif de chauffage, dispositif de soudure, procédé de chauffage et procédé de soudure

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WO2014049780A1 true WO2014049780A1 (fr) 2014-04-03

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110891333A (zh) * 2019-10-29 2020-03-17 何海文 一种光热结构及干发器
CN115401285A (zh) * 2022-07-28 2022-11-29 成都飞机工业（集团）有限责任公司 一种电缆焊锡环自动加热设备及使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03204171A (ja) * 1989-12-28 1991-09-05 Ushio Inc 光ビームはんだ付け装置
JPH0917577A (ja) * 1996-08-09 1997-01-17 Matsushita Electric Ind Co Ltd 光出力発生装置
JP2010010589A (ja) * 2008-06-30 2010-01-14 Japan Unix Co Ltd レーザー式はんだ付け方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03204171A (ja) * 1989-12-28 1991-09-05 Ushio Inc 光ビームはんだ付け装置
JPH0917577A (ja) * 1996-08-09 1997-01-17 Matsushita Electric Ind Co Ltd 光出力発生装置
JP2010010589A (ja) * 2008-06-30 2010-01-14 Japan Unix Co Ltd レーザー式はんだ付け方法及び装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110891333A (zh) * 2019-10-29 2020-03-17 何海文 一种光热结构及干发器
CN115401285A (zh) * 2022-07-28 2022-11-29 成都飞机工业（集团）有限责任公司 一种电缆焊锡环自动加热设备及使用方法
CN115401285B (zh) * 2022-07-28 2024-06-07 成都飞机工业（集团）有限责任公司 一种电缆焊锡环自动加热设备及使用方法

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