WO2014045595A1 - Film conducteur transparent, son procédé de fabrication et écran tactile - Google Patents

Film conducteur transparent, son procédé de fabrication et écran tactile Download PDF

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Publication number
WO2014045595A1
WO2014045595A1 PCT/JP2013/005588 JP2013005588W WO2014045595A1 WO 2014045595 A1 WO2014045595 A1 WO 2014045595A1 JP 2013005588 W JP2013005588 W JP 2013005588W WO 2014045595 A1 WO2014045595 A1 WO 2014045595A1
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WIPO (PCT)
Prior art keywords
transparent conductive
conductive film
layer
transparent
film
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Application number
PCT/JP2013/005588
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English (en)
Japanese (ja)
Inventor
淳光 櫻井
伊藤　大
Original Assignee
凸版印刷株式会社
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Application filed by 凸版印刷株式会社 filed Critical 凸版印刷株式会社
Priority to CN201380048490.6A priority Critical patent/CN104641332A/zh
Priority to JP2014536607A priority patent/JPWO2014045595A1/ja
Publication of WO2014045595A1 publication Critical patent/WO2014045595A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality

Definitions

  • the present invention relates to a transparent conductive film suitable for a capacitive touch panel, a method for manufacturing a transparent conductive film suitable for manufacturing the transparent conductive film, and a touch panel using the transparent conductive film.
  • the touch panel is an input device that can operate a device by touching a display portion on a display screen.
  • forms such as a resistance film type and a capacitance type are known.
  • the resistance film method is a method including two opposing resistance films.
  • the resistance film is pressed in a state where a voltage is applied to one resistance film, the pressed resistance film side comes into contact with the opposing resistance film, so that a voltage drop corresponding to the pressed position is detected. Thereby, the operated place can be detected.
  • the electrostatic capacitance method is a method of detecting the position of the fingertip or the like by capturing the change in electrostatic capacitance between the electrostatic conductive portion such as the fingertip and the conductive film.
  • the position of the fingertip can be detected from the change in capacitance when the fingertip approaches the transparent conductive portion.
  • multiple points can be detected by overlapping transparent conductive films having different wiring shapes, and a more intuitive operation can be realized.
  • an invisible measure for making the shapes of the transparent conductive portion and the non-conductive portion inconspicuous is required due to a design request or the like. Moreover, protection of the electrically conductive film and wiring of a touch panel is calculated
  • Patent Document 1 For example, in a capacitive touch panel, a transparent conductive film for a touch panel with improved visibility has been proposed (see Patent Document 1).
  • the present invention has been made to solve the above-described problems, and provides a transparent conductive film having excellent optical characteristics while appropriately protecting the transparent conductive part, the non-conductive part, and the wiring part. Objective.
  • the transparent conductive film according to the present invention includes a transparent substrate, an optical adjustment layer provided on both sides of the transparent substrate, a transparent conductive layer provided on each of the optical adjustment layers, and a wiring connected to the transparent conductive layer. And a protective layer provided on at least one surface side of the transparent conductive film and covering the transparent conductive layer and the wiring.
  • the thickness of the protective layer is 1 ⁇ m or more and 50 ⁇ m or less.
  • the substrate layer, the optical adjustment layer, the transparent conductive layer, and the protective layer form the first multilayer structure, and the transmitted hue b * of the light transmitted through the first multilayer structure is 1.5 or less. .
  • the touch panel according to the present invention includes the transparent conductive film.
  • a transparent conductive part and a non-conductive part are formed on both surfaces of a transparent substrate, a wiring part connected to the transparent conductive part is formed, and at least one of the transparent conductive films A protective layer covering the transparent conductive portion is formed on the surface side of the substrate.
  • the transparent conductive film of the present invention can be formed by forming a protective layer on at least one surface, so that it can be protected from disconnection due to scratches when used for a touch panel, and the transmission hue b * is also suppressed. Can do. Therefore, a capacitive touch panel in which the conductive film surface is protected can be provided.
  • FIG. 1 is a schematic cross-sectional view showing an example of the transparent conductive film according to the first embodiment.
  • FIG. 2 is a schematic cross-sectional view showing an example of a transparent conductive film according to a modification of the first embodiment.
  • FIG. 3 is a schematic plan view of the transparent conductive film according to the first embodiment.
  • FIG. 4 is a schematic cross-sectional view showing an example of the transparent conductive film according to the second embodiment.
  • FIG. 5 is a schematic plan view of the transparent conductive film according to the second embodiment.
  • FIG. 1 is a schematic cross-sectional view showing an example of the transparent conductive film according to the first embodiment.
  • the transparent conductive film 20 includes a transparent substrate 21, optical adjustment layers 22 and 23 provided on both sides of the transparent substrate 21, transparent conductive layers 8 and 9 provided on the optical adjustment layers 22 and 23, respectively, Wirings 10 and 11 connected to the conductive layers 8 and 9, respectively, and a protective layer 14 covering the transparent conductive layer 8 and the wirings 10 on one side of the transparent conductive film 20 are provided.
  • the transparent substrate 21 is composed of a base material 1 and hard coat layers 2 and 3 provided on both surfaces of the base material 1.
  • the base material 1 is formed of a material having visible light permeability.
  • the base material include (1) inorganic glass, (2) polyolefin (polyethylene, polypropylene, etc.), polyester (polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.), polyamide (nylon 6, nylon 66, etc.), polyimide Transparent resins such as polyarylate, polycarbonate, polyacrylate, polyethersulfone, and polysulfone may be used.
  • the substrate 1 may be a plastic film obtained by non-stretching / stretching the transparent resin exemplified above.
  • the substrate 1 may be a composite film in which a plurality of materials are laminated.
  • the thickness of the substrate 1 is preferably in the range of about 10 ⁇ m to 200 ⁇ m.
  • the thickness of the substrate 1 is not limited to this range.
  • surface treatment may be performed on one side or both sides of the substrate 1.
  • the layer laminated on the surface of the substrate 1 can be firmly bonded.
  • methods such as easy adhesion treatment, plasma treatment, corona treatment, and ozone treatment can be used.
  • the hard coat layers 2 and 3 are provided on the surface of the substrate 1 to improve the mechanical strength, abrasion resistance, and the like of the substrate 1.
  • a material used for the hard coat layers 2 and 3 a material having visible light permeability can be used.
  • acrylic resins such as acrylic esters, acrylamides, methacrylic esters, methacrylamides, (2) organic silicon resins, (3) transparent resins such as thermosetting polysiloxane resins are hard It may be used as a material for the coating layers 2 and 3.
  • the formation method of the hard coat layers 2 and 3 can be performed by a thin film formation method corresponding to the formation material of the hard coat layers 2 and 3.
  • the hard coat layers 2 and 3 are prepared by dissolving a resin as described above as a main component and a material that absorbs ultraviolet rays in a solvent to prepare a coating liquid, and the coating liquid is a die coater, a curtain flow coater, You may form by apply
  • the transparent substrate 21 may be constituted by the base material 1 provided with the hard coat layer only on one side, or the transparent substrate 21 may be constituted by the base material 1 not provided with the hard coat layer.
  • the thickness of the hard coat layers 2 and 3 is preferably in the range of about 1 ⁇ m to 10 ⁇ m. However, the thickness of the hard coat layers 2 and 3 is not limited to the above range.
  • the transparent conductive layers 8 and 9 can be formed of a material having visible light transparency and electrical conductivity.
  • the material of the transparent conductive layers 8 and 9 include indium tin oxide (ITO), zinc oxide, carbon nanotubes, graphene, nano silver, and conductive polymer resin (quaternary ammonium salt having an ion conduction mechanism).
  • ITO indium tin oxide
  • zinc oxide zinc oxide
  • carbon nanotubes carbon nanotubes
  • graphene nano silver
  • conductive polymer resin quaternary ammonium salt having an ion conduction mechanism
  • a resin containing a conductive monomer, a conductive fine particle having an electron conduction mechanism, a ⁇ -conjugated conductive polymer, or the like may be used.
  • the optical film thickness of the transparent conductive layers 8 and 9 is preferably in the range of 30 nm to 80 nm. In the case where the optical film thickness of the transparent electrode layer 8 is thinner than 30 nm, the film thickness is small and the conductive performance cannot be sufficiently obtained. Moreover, when the optical film thickness of the transparent conductive layers 8 and 9 is thicker than 80 nm, the transmittance
  • the transparent conductive layers 8 and 9 are formed by forming a thin film using a transparent conductive material and then patterning the formed thin film into a predetermined shape. By patterning, the transparent conductive layers 8 and 9 are formed with a transparent conductive portion 12 and a non-conductive portion 13 having no conductivity provided between the adjacent transparent conductive portions 12.
  • the transparent conductive portion 12 is a portion where the transparent conductive material remains after patterning
  • the non-conductive portion 13 is a portion where the transparent conductive material is removed by patterning.
  • the transparent conductive layers 8 and 9 serve as transparent electrodes of the touch panel.
  • the transparent conductive layer 8 is provided with a striped transparent conductive portion 12 extending in a predetermined direction
  • the transparent conductive layer 9 is provided with a striped transparent conductive portion 12 extending in a direction orthogonal to the predetermined direction. It is done.
  • the optical adjustment layers 22 and 23 are exercised by laminating the high refractive index layers 4 and 5 and the low refractive index layers 6 and 7 in order from the transparent substrate 21 side.
  • the reflected light can be reduced by reversing the phases of the reflected light at the interfaces of the different layers and canceling them. For this reason, the reflected light emitted from the transparent substrate 21 side can be reduced, and the visual recognition of the transparent conductive pattern electrode (transparent conductive portion 12 of the transparent conductive layer 8) close to the observation surface side can be made difficult.
  • the high refractive index layers 4 and 5 are metal oxide compound layers
  • the low refractive index layers 6 and 7 are silicon oxide layers.
  • the high refractive index and the low refractive index are obtained by distinguishing the refractive index of one layer from the refractive index of the other layer by relative sizes. is there. That is, the refractive index of the high refractive index layer is relatively higher than the refractive index of the low refractive index layer. Further, since the band of reflected light to be reduced can be controlled by the refractive index and optical film thickness of each layer, the physical film thickness of each layer may be determined by optical design as appropriate according to the band to be inhibited. Furthermore, the optical adjustment layers 22 and 23 may be composed of three or more layers.
  • the refractive index of the transparent substrate 1 and the hard coat layers 2 and 3 is in the range of 1.5 to 1.7
  • the transparent conductive layers 8 and 9 are thin films of indium tin oxide (optical film thickness: 30 nm or more).
  • a high refractive index layer reffractive index: 1.7 to 2.6, optical film thickness: 5 nm to 25 nm
  • a low refractive index layer reffractive index: 1.3 to 1.5.
  • stacking optical film thickness 50 nm or more and 100 nm or less.
  • Examples of the combination of the materials of the high refractive index layer and the low refractive index layer that satisfy the above range include, for example, a high refractive index layer: niobium oxide (Nb 2 O 5), a low refractive index layer: silicon oxide (SiO X “x is an oxygen atom Number ”) and the like.
  • Materials that can be used for the high refractive index layers 4 and 5 include, besides Nb 2 O 5 , ZnO, TiO 2 , CeO 2 , Sb 2 O 5 , SnO 2 , Y 2 O 3 , La 2 O 3 , and ZrO 2.
  • Al 2 O 3 can be exemplified.
  • the formation method of the high refractive index layers 4 and 5 and the low refractive index layers 6 and 7 can be performed by a thin film forming method corresponding to the forming material of the high refractive index layer and the low refractive index layer.
  • a thin film forming method corresponding to the forming material of the high refractive index layer and the low refractive index layer.
  • coating methods such as screen printing and ink jet printing, (2) physical vacuum vapor deposition (PVD) such as EB vapor deposition with irradiation of accelerated electron beam, chemical vapor deposition (CVD), etc. Or the like may be used.
  • PVD physical vacuum vapor deposition
  • CVD chemical vapor deposition
  • it is preferable to use the vapor phase film forming method because the film thickness can be strictly controlled and can be adjusted to a desired optical film thickness.
  • the wirings 10 and 11 are connected to the transparent conductive layers 8 and 9 at the periphery of the transparent conductive film 20.
  • the wirings 10 and 11 are disposed on the transparent conductive film 20 so as not to overlap the image display area of the image display device combined with the transparent conductive film 20.
  • the materials for the wirings 10 and 11 may be appropriately selected from materials having electrical conductivity and excellent workability.
  • a metal such as copper, silver, or gold may be used as the material for the wirings 10 and 11.
  • the thickness of the wirings 10 and 11 is preferably in the range of about 0.1 ⁇ m to 2 ⁇ m. However, the thickness of the wirings 10 and 11 is not limited to this range.
  • the protective layer 14 is provided on one side of the transparent electrode film 20 so as to cover the transparent conductive portion 12, the nonconductive portion 13, and the wiring 10.
  • the protective layer 14 is for protecting the transparent conductive portion 12, the nonconductive portion 13, and the wiring 10.
  • the protective layer 14 is provided only on one side of the transparent conductive film 20, but the protective layer 14 may be provided on both sides of the transparent electrode film 20.
  • the difference in optical characteristics between the transparent conductive portion 12 and the nonconductive portion 13 can be reduced, so that the transparent conductive portion 12 and the nonconductive portion 13 can be made difficult to visually recognize.
  • the protective layer 14 is formed using a material having insulating properties and excellent thin film forming properties.
  • the material of the protective layer 14 include (1) acrylic resins such as acrylic esters, acrylamides, methacrylic esters, and methacrylamides, (2) organosilicon resins, and (3) thermosetting poly.
  • a siloxane resin, (4) silicon oxide, or the like may be used.
  • the thickness of the protective layer 14 is preferably about 1 ⁇ m to 50 ⁇ m.
  • the transmitted hue b * of the protective layer 14 is preferably in the range of about ⁇ 1.0 or more and 0.5 or less.
  • the transparent electrode film without the protective layer 14 is yellowish as a whole due to the material constituting the transparent conductive layer 8, and thus the transmission hue b * is increased. Therefore, by providing a slightly bluish protective layer 14 in which the transmission pigment b * is in the range of about ⁇ 1.0 or more and 0.5 or less, the transmission hue b * (the wirings 10 and 11 of the wirings 10 and 11) of the entire transparent conductive film 20 is provided.
  • the transmission hue b *) of the non-existing portion can be suppressed to 1.5 or less, and yellowness can be suppressed.
  • the transmitted hue b * is b * when the color of transmitted light is expressed in the L * a * b * color system (D65 light source, 2 ° field of view).
  • the thickness of the protective layer 14 is not limited to this range.
  • the transmitted hue b * of the protective layer 14 is more preferably ⁇ 0.5 or more and 0 or less.
  • the protective layer 14 can be formed by a thin film forming method corresponding to the material for forming the protective layer 14.
  • the protective layer 14 is prepared by, for example, dissolving a resin as described above as a main component and a material that absorbs ultraviolet rays in a solvent to prepare a coating liquid, and then applying the coating liquid to a die coater, a curtain flow coater, a roll coater, It is formed by applying a reverse roll coater, gravure coater, knife coater, bar coater, spin coater, micro gravure coater, etc. to the surface on which the protective layer 14 is formed, and then curing the coating film by irradiation with ultraviolet rays or the like. May be.
  • a laminate method may be employed, and a film or the like separately formed as the protective layer 14 may be attached to the conductive surface.
  • FIG. 2 is a schematic cross-sectional view showing a modification of the transparent conductive film according to the first embodiment.
  • the transparent conductive film 20 according to the modification is different from the example shown in FIG. 1 in that the base material 24 of the transparent substrate 21 is a laminate.
  • the base material 24 according to the modified example is a laminated body in which the film base material 15, the optical adhesive layer 17, and the film base material 16 are laminated in this order.
  • As the film bases 15 and 16, a film formed of the same material as the base 1 described above can be used.
  • An acrylic resin, a silicone resin, or a rubber resin can be used for the optical adhesive layer 17.
  • the optical adhesive layer 17 may be an adhesive having UV absorption performance or a film or liquid adhesive.
  • the thickness of the optical adhesive layer 17 is preferably in the range of about 1 ⁇ m to 150 ⁇ m.
  • the transparent substrate 21 is configured by laminating the hard coat layers 2 and 3 on both surfaces of the base material 24.
  • the optical adjustment layers 22 and 23 (high refractive index layers 4 and 5 and low refractive index layers 6 and 7) and transparent conductive layers 8 and 9 (transparent conductive portion 12 and non-conductive portion) laminated on the transparent substrate 21. 13)
  • the wirings 10 and 11 and the protective layer 14 are the same as those described with reference to FIG.
  • FIG. 3 shows a schematic plan view of the transparent conductive film shown in FIGS.
  • the protective layer 14 is formed so as to cover the transparent conductive portion 12, the nonconductive portion 13, and the wiring portions 10 and 11.
  • the transparent conductive film 20 shown in FIGS. 1 and 2 the first laminated structure including the transparent substrate 21, the optical adjustment layers 22 and 23, the transparent conductive layers 8 and 9, and the protective layer 14.
  • the transmitted hue b * of the light transmitted through is 1.5 or less.
  • the transmitted hue b * is b * when the color of transmitted light is expressed in the L * a * b * color system (D65 light source, 2 ° field of view).
  • the transmission hue b * of the first laminated structure portion (the portion without the wirings 10 and 11) of the transparent conductive film is larger than 1.5, the entire transparent conductive film becomes yellowish. If a transparent conductive film having a transmission hue b * of greater than 1.5 is used for the touch panel, the screen becomes yellowish and the image quality deteriorates.
  • the transmitted hue b * of the light transmitted through the first laminated structure is preferably ⁇ 3.0 or more. Further, the transmission hue b * of the first laminated structure is more preferably 0 or more and 1.0 or less. In this case, the transparent electrode film 20 can be further suppressed from being colored.
  • the protective layer 14 is a laminate of two or more layers and is bluish due to interference is adopted. Also good. Further, the protective layer 14 may be formed of a material including a material that makes the entire protective layer 14 bluish.
  • the transparent conductive film 20 according to the present embodiment is provided with the protective layer 14 for protecting the transparent conductive part 12, the non-conductive part 13, and the wiring 10, but the first laminated structure.
  • the transmitted hue b * of the portion where the wirings 10 and 11 are not provided is suppressed to 1.5 or less. Therefore, according to the present embodiment, it is possible to realize a transparent electrode film excellent in optical characteristics while protecting the transparent conductive portion 12, the nonconductive portion 13, and the wiring 10.
  • the transparent conductive film 20 shown in FIGS. 1 and 2 can be used as a constituent member of a touch panel.
  • the protective layer 14 improves the scratch resistance, is excellent in optical characteristics such as high transmittance and high transparency, and the transparent conductive portions 8 and 9 are not conspicuous.
  • the touch panel can be realized.
  • ⁇ Transparent conductive layer forming step> First, a thin film of a material for forming the transparent conductive layers 8 and 9 is formed on the transparent substrate 21, and the transparent conductive portion 12 and the non-conductive portion 13 are formed by patterning the thin film.
  • Formation of the thin film using the forming material of the transparent conductive layers 8 and 9 may use a suitable thin film forming method according to the forming material of the transparent conductive layers 8 and 9.
  • a suitable thin film forming method for example, (1) coating methods such as screen printing and ink jet printing, (2) magnetron sputtering methods, physical vacuum deposition methods (PVD) such as EB deposition methods that irradiate accelerated electron beams, chemical vapor deposition methods (CVD), A vapor deposition method such as the above may be used.
  • PVD physical vacuum deposition methods
  • CVD chemical vapor deposition methods
  • ITO when ITO is used as the material of the transparent conductive portion, it is preferable to use the vapor deposition method because the ITO film tends to improve the charge density and the conductivity when the ITO thin film is formed by the vapor deposition method. .
  • the pattern formation with respect to the thin film of the forming material of the transparent conductive layers 8 and 9 may use a suitable patterning method according to the forming material of the transparent conductive layers 8 and 9.
  • a pattern may be formed on the thin film by forming an etchant mask corresponding to a desired pattern on the thin film and immersing it in an etchant solution.
  • etchant solution for example, ferric chloride solution, aqua regia, hydrochloric acid, oxalic acid, etc. may be used as the etchant solution.
  • ⁇ Wiring formation process> Next, a thin film of a material for forming the wirings 10 and 11 is formed, and the wirings 10 and 11 connected to the transparent conductive portion are formed.
  • Formation of the thin film using the forming material of the wirings 10 and 11 may use a suitable thin film forming method according to the forming material of the wirings 10 and 11. For example, (1) coating methods such as screen printing and ink jet printing, (2) physical vacuum vapor deposition (PVD) such as EB vapor deposition with irradiation of accelerated electron beam, chemical vapor deposition (CVD), etc.
  • the vapor phase film forming method may be used.
  • the wiring forming material thin film may be patterned to form a plurality of wirings in one layer.
  • the pattern formation with respect to the thin film of the forming material of the wirings 10 and 11 may use a suitable patterning method according to the material selected for the wirings 10 and 11.
  • a pattern may be formed on the thin film by forming an etchant mask corresponding to a desired pattern on the thin film and immersing it in an etchant solution.
  • etchant solution for example, ferric chloride solution, aqua regia, hydrochloric acid, oxalic acid and the like may be used.
  • ⁇ Protective layer forming step> a thin film of a material for forming the protective layer 14 is formed, and the protective layer 14 is formed so as to cover the transparent conductive portion 12, the nonconductive portion 13, and the wiring 10.
  • the thin film formation using the forming material of the protective layer 14 may use a suitable thin film forming method according to the material selected for the protective layer 14. For example, (1) a coating method such as screen printing or inkjet printing, or (2) a bonding method such as laminating may be used.
  • the transparent conductive layer and the wiring need to be formed on both sides of the transparent substrate 21, the transparent conductive layer is formed on both sides of the transparent substrate 21 in each of the transparent conductive layer forming step and the wiring formability step. And wiring.
  • the order of thin film formation and pattern formability in each step is appropriately determined according to the thin film formation method and patterning method employed.
  • the optical adjustment layers 22 and 23 are formed by sequentially forming the thin films of the high refractive index layers 4 and 5 and the thin films of the low refractive index layers 6 and 7 in order from the transparent substrate 21 side by a known multilayer thin film forming method. Can be formed.
  • the film bases 15 and 16 may be bonded together via the optical adhesive layer 17.
  • the protective layer 14 may be formed before the film substrates 15 and 16 are bonded, or may be formed after the bonding.
  • FIG. 4 is a schematic cross-sectional view showing an example of the transparent conductive film according to the second embodiment.
  • the transparent conductive film 30 according to the present embodiment further includes an optical adhesive layer 31 and a cover glass 32 on the surface opposite to the surface on which the protective layer 14 is provided in the transparent conductive film 20 according to the first embodiment.
  • An acrylic resin, a silicone resin, or a rubber resin can be used for the optical adhesive layer 31.
  • the optical adhesive layer 31 may be an adhesive having UV absorption performance or a film-like or liquid adhesive.
  • the transparent substrate 21 with which the transparent conductive film 30 is provided the optical adjustment layers 22 and 23 (high refractive index layers 4 and 5, low refractive index layers 6 and 7), transparent conductive layers 8 and 9 (transparent conductive portion 12, non-conductive)
  • the part 13), the wirings 10 and 11, and the protective layer 14 are the same as those described in the first embodiment (FIG. 1), and thus the repeated description is omitted.
  • FIG. 5 is a schematic sectional view showing a modification of the transparent conductive film according to the second embodiment.
  • the transparent conductive film 30 according to the modified example is different from the example shown in FIG. 4 in that the same base material 24 described in FIG. 3 is used as the base material of the transparent substrate 21. Since this base material 24 has already been described in the modification of the first embodiment, a description thereof will be omitted.
  • the portion where the transparent substrate 21, the optical adjustment layers 22 and 23, the transparent conductive layers 8 and 9, and the protective layer 14 are stacked is a first layer.
  • a portion where the optical adhesive layer 31 and the cover glass 32 are laminated is called a second laminated structure.
  • the transmitted hue b * of light transmitted through the first stacked structure and the second stacked structure is 2.5 or less.
  • the transmitted hue b * is b * when the color of transmitted light is expressed in the L * a * b * color system (D65 light source, 2 ° field of view).
  • the entire transparent conductive film is yellowish. End up. If a transparent conductive film having a transmission hue b * of greater than 2.5 is used for the touch panel, the screen becomes yellowish and the image quality deteriorates.
  • a structure in which the protective layer 14 is a laminate of two or more layers and is bluish due to interference is adopted. Also good. Further, the protective layer 14 may be formed of a material including a material that makes the entire protective layer 14 bluish.
  • the transmitted hue b * of light transmitted through the first and second laminated structures is preferably ⁇ 3.0 or more. Further, the transmission hue b * of the first laminated structure is more preferably 0 or more and 2.0 or less. In this case, the transparent electrode film 20 can be further suppressed from being colored.
  • the transparent conductive film 30 according to the second embodiment is formed on the transparent substrate 21 according to the manufacturing method described in the first embodiment, on the optical adjustment layers 22 and 23, the transparent conductive layers 8 and 9, the wirings 10 and 11, After the protective layer 14 is formed, the cover glass 32 can be produced by attaching the cover glass 32 to the surface opposite to the protective layer 14 via the optical adhesive layer 31.
  • the protective layer 14 for protecting the transparent conductive portion 12, the nonconductive portion 13, and the wiring 10 is provided on one side of the transparent conductive film 30 according to the present embodiment, and on the other side. Is covered with an optical adhesive layer 31.
  • the transmission hue b * of the laminated portion (that is, the portion where the wirings 10 and 11 are not provided) of the first laminated structure and the second laminated structure described above is suppressed to 2.5 or less. Therefore, according to the present embodiment, it is possible to realize a transparent electrode film excellent in optical characteristics while protecting the transparent conductive portion 12, the nonconductive portion 13, and the wiring 10.
  • the transparent conductive film 30 shown in FIGS. 4 and 5 can be used as a constituent member of the touch panel.
  • the protective layer 14 improves the scratch resistance, is excellent in optical characteristics such as high transmittance and high transparency, and the transparent conductive portions 8 and 9 are not conspicuous.
  • the touch panel can be realized.
  • Example 1 First, a resin was applied to both surfaces of a base material to form a lower hard coat layer and an upper hard cord layer.
  • a polyethylene terephthalate film (PET) having a thickness of 50 ⁇ m was used as the substrate.
  • the film thickness of the lower hard coat layer was 1.5 ⁇ m.
  • the film thickness of the upper hard cord layer was 1.5 ⁇ m.
  • a high refractive index layer was formed on the upper hard coat layer.
  • the material used for the high refractive index layer was niobium oxide (Nb 2 O 5 ). Further, magnetron sputtering was used to form the high refractive index layer.
  • a low refractive index layer was formed on the high refractive index layer.
  • Silicon oxide was used as the material for the low refractive index layer.
  • magnetron sputtering was used to form the low refractive index layer.
  • a transparent conductive pattern electrode was formed on the low refractive index layer.
  • the material used for the transparent conductive pattern electrode was indium tin oxide (ITO) containing 5 wt% of tin oxide.
  • the transparent conductive pattern electrode was formed by forming an ITO thin film by magnetron sputtering, forming an etchant mask corresponding to the pattern by screen printing, and immersing in an etchant solution.
  • the pattern width of the transparent conductive portion was 5 mm, and the pattern width of the non-conductive portion was 70 ⁇ m.
  • a ferric chloride solution was used as the etchant solution.
  • the material used for the wiring was copper.
  • the lower layer wiring was formed by forming a copper thin film by magnetron sputtering, forming an etchant mask corresponding to the pattern by screen printing, and immersing in an etchant solution. At this time, a sodium persulfate aqueous solution was used as the etchant solution.
  • the wiring pattern of the lower layer wiring was a wiring pattern connected to the line pattern which is the pattern of the transparent conductive portion.
  • a protective layer was formed so as to cover the transparent conductive portion, the nonconductive portion, and the wiring.
  • the material used for the protective layer was an acrylic resin.
  • a micro gravure coater was used to form the protective layer, and the thickness of the protective layer was 1.0 ⁇ m.
  • the transparent conductive film which concerns on Embodiment 1 was manufactured through the above process.
  • the optical film thickness of each layer of the high refractive index layer / low refractive index layer / transparent conductive portion included in the produced transparent conductive film was as follows. High refractive index layer: 12 nm, Low refractive index layer: 74 nm, Transparent conductive part: 40 nm
  • a transparent conductive film according to Comparative Example 1 was formed by forming a hard coat layer, a high refractive index layer, a low refractive index layer, a transparent conductive part, a non-conductive part, and a wiring on the base material under the same conditions as in Example 1. .
  • the protective layer was not provided on the transparent conductive film of Comparative Example 1.
  • Example 1 and Comparative Example 1 the total light transmittance (JIS-K7105), the transmitted hue b * expressed in the L * a * b * color system (D65 light source, field of view 2 °), scratch test, pencil A hardness test (JIS-K5600) was performed.
  • the total light transmittance (JIS-K7105) of the conductive pattern region (region without wiring) of the transparent conductive film of Example 1 is 90.6%, the transmitted hue b * is 1.5, and the yellowness is small.
  • a transparent conductive film having high transmittance and high transparency and in which the pattern of the transparent conductive portion was not conspicuous was obtained.
  • the transparent conductive film of Example 1 was not scratched even in the pencil hardness test (pencil hardness H, 500 g load).
  • the total light transmittance (JIS-K7105) of the conductive pattern region (region without wiring) of the transparent conductive film of Comparative Example 1 was 90.0%, the transmitted hue b * was 1.8, and yellowish I was tinged. Further, in the transparent conductive film of the comparative example, scratches were confirmed in the pencil hardness test (pencil hardness H, 500 g load).
  • Example 2 After forming a hard coat layer, a high refractive index layer, a low refractive index layer, a transparent conductive portion, a nonconductive portion, a wiring and a protective layer on the substrate under the same conditions as in Example 1, the surface opposite to the protective layer A transparent conductive film according to Example 2 was obtained by pasting a cover glass having a thickness of 500 ⁇ m through an optical adhesive layer having a thickness of 100 ⁇ m.
  • ⁇ Comparative Example 2> After forming a hard coat layer, a high refractive index layer, a low refractive index layer, a transparent conductive part, a non-conductive part and a wiring on the base material under the same conditions as in Example 1, the thickness is passed through an optical adhesive layer having a thickness of 100 ⁇ m.
  • a transparent conductive film according to Comparative Example 2 was obtained by laminating a 500 ⁇ m cover glass. The protective layer was not provided on the transparent conductive film of Comparative Example 2.
  • Example 2 and Comparative Example 2 the total light transmittance (JIS-K7105), the transmitted hue b * expressed in the L * a * b * color system (D65 light source, field of view 2 °), scratch test, pencil A hardness test (JIS-K5600) was performed.
  • the total light transmittance (JIS-K7105) of the conductive pattern region (region without wiring) of the transparent conductive film of Example 2 is 90.6%, the transmitted hue b * is 2.5, and the yellowness is small.
  • a transparent conductive film having high transmittance and high transparency and in which the pattern of the transparent conductive portion was not conspicuous was obtained.
  • the transparent conductive film of Example 1 was not scratched even in the pencil hardness test (pencil hardness H, 500 g load).
  • the total light transmittance (JIS-K7105) of the conductive pattern region (region without wiring) of the transparent conductive film of Comparative Example 1 was 90.0%, the transmitted hue b * was 3.0, and yellowish I was tinged. Further, in the transparent conductive film of the comparative example, scratches were confirmed in the pencil hardness test (pencil hardness H, 500 g load).
  • the transparent conductive film of the present invention can be used in a wide range of fields using a capacitive touch panel.
  • a capacitive touch panel For example, ATMs of financial institutions, electronic devices (copy machines, fax machines, car navigation systems, other home appliances, etc.), portable information terminals (mobile phones, smartphones, tablet PCs, etc.), electronic book terminals, portable game terminals, portable music players, vending machines It can be used for a touch panel constituting an operation panel of a machine.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

La présente invention concerne un film conducteur transparent dans lequel des sections conductrices transparentes, des sections non conductrices et un câblage sont adéquatement protégés et qui présente d'excellentes performances optiques. Le film conducteur transparent (20) d'après la présente invention comprend : un substrat transparent (21) ; des couches d'ajustement optique (22 et 23) situées sur les deux surfaces dudit substrat transparent ; des couches conductrices transparentes (8 et 9) situées sur le dessus desdites couches d'ajustement optique ; un câblage (10 et 11) raccordé auxdites couches conductrices transparentes (8 et 9) ; et une couche de protection (14) qui recouvre une couche conductrice transparente et un câblage. Ladite couche de protection (14) a une épaisseur comprise entre 1 et 50 µm, limites comprises. Les parties du film conducteur transparent (20) ne comportant aucun câblage (10 ou 11) ont une teinte de transmission (b*) inférieure ou égale à 1,5.
PCT/JP2013/005588 2012-09-24 2013-09-20 Film conducteur transparent, son procédé de fabrication et écran tactile WO2014045595A1 (fr)

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CN201380048490.6A CN104641332A (zh) 2012-09-24 2013-09-20 透明导电膜、透明导电膜的制造方法以及触摸面板
JP2014536607A JPWO2014045595A1 (ja) 2012-09-24 2013-09-20 透明導電膜、透明導電膜の製造方法およびタッチパネル

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CN104966551A (zh) * 2015-05-30 2015-10-07 汕头万顺包装材料股份有限公司 一种表面镀铜的ito导电膜
CN106775073A (zh) * 2016-12-02 2017-05-31 东莞市平波电子有限公司 一种传感器玻璃加钢化玻璃结构触摸屏及其制备方法
TWI643114B (zh) * 2018-01-08 2018-12-01 友達光電股份有限公司 觸控顯示面板及其修補方法

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