WO2014041865A1 - Plaque en alliage de cuivre présentant d'excellentes propriétés électroconductrices et d'excellentes propriétés de relaxation en contrainte - Google Patents

Plaque en alliage de cuivre présentant d'excellentes propriétés électroconductrices et d'excellentes propriétés de relaxation en contrainte Download PDF

Info

Publication number
WO2014041865A1
WO2014041865A1 PCT/JP2013/067269 JP2013067269W WO2014041865A1 WO 2014041865 A1 WO2014041865 A1 WO 2014041865A1 JP 2013067269 W JP2013067269 W JP 2013067269W WO 2014041865 A1 WO2014041865 A1 WO 2014041865A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper alloy
mass
less
alloy sheet
mpa
Prior art date
Application number
PCT/JP2013/067269
Other languages
English (en)
Japanese (ja)
Inventor
波多野　隆紹
明宏 柿谷
Original Assignee
Jx日鉱日石金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx日鉱日石金属株式会社 filed Critical Jx日鉱日石金属株式会社
Publication of WO2014041865A1 publication Critical patent/WO2014041865A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent

Definitions

  • the present invention relates to a copper alloy plate and electronic parts for energization or heat dissipation, and in particular, electronic devices such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc. mounted on electric machines / electronic devices, automobiles, etc.
  • the present invention relates to a copper alloy plate used as a component material and an electronic component using the copper alloy plate.
  • copper alloys suitable for use in high current electronic parts such as high current connectors and terminals used in electric vehicles, hybrid cars, etc., or in heat dissipation electronic parts such as liquid crystal frames used in smartphones and tablet PCs.
  • the present invention relates to a plate and an electronic component using the copper alloy plate.
  • Parts such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, heat sinks, etc., that transmit electricity or heat are built into automobiles, electrical equipment, electronic devices, etc., and these parts are made of copper alloy. It is used. Here, electrical conductivity and thermal conductivity are in a proportional relationship. In recent years, with the miniaturization of electronic components, the cross-sectional area of the copper alloy in the current-carrying part tends to be small. When the cross-sectional area becomes small, heat generation from the copper alloy when energized increases. In addition, some electronic parts used in an electric vehicle and a hybrid electric vehicle that are remarkably growing, such as a connector of a battery part, allow a very high current to flow, and heat generation of a copper alloy during energization is a problem.
  • a deflection is given to the copper alloy plate, and a contact force at the contact is obtained by a stress generated by the deflection.
  • the stress that is, the contact force is reduced due to the stress relaxation phenomenon, and the contact electric resistance is increased. Therefore, in order to cope with the problem of heat generation, the copper alloy is required to be superior in conductivity so that the amount of heat generation is reduced, and further to be excellent in stress relaxation characteristics so that the contact force does not decrease even if heat is generated.
  • a heat radiating component called a liquid crystal frame is used for a liquid crystal of a smartphone or a tablet PC.
  • a Cu—Fe—P alloy is known as a copper alloy having a relatively high conductivity and strength and can be manufactured at low cost.
  • JIS alloy number C1921 Cu—0.1 mass% Fe—0.03 mass
  • % P C1940
  • Cu-2.4 mass% Fe-0.1 mass% P-0.1 mass% Zn Cu-2.4 mass% Fe-0.1 mass% P-0.1 mass% Zn
  • Patent Documents 1 to 5 disclose techniques for improving Cu—Fe—P based alloys.
  • the stress relaxation characteristics of copper alloys can be improved by adding specific alloy elements.
  • the element having a remarkable stress relaxation improving effect include Zr and Ti.
  • these elements are extremely active, some of them are oxidized during ingot melting. When this oxide is caught in an ingot, the surface of the product is damaged or the material being rolled is cut.
  • the improvement of the stress relaxation characteristic by adding the alloy element generally causes a significant increase in the manufacturing cost of the copper alloy.
  • an object of the present invention is to provide a copper alloy having high strength, high conductivity, and excellent stress relaxation characteristics.
  • the Cu—Fe—P system is inexpensive and excellent in conductivity and strength.
  • An object is to improve the stress relaxation characteristics of the alloy.
  • another object of the present invention is to provide a method for producing the copper alloy plate and an electronic component suitable for large current use or heat radiation use.
  • a manufacturing method comprising: (A) In the recrystallization annealing before the final cold rolling, the furnace crystal temperature is set to 350 to 800 ° C., and the average crystal grain size of the copper alloy sheet is adjusted to 50 ⁇ m or less, (B) In the final cold rolling, the total workability is 25 to 99%, the rolling work per pass is 20% or less, (C) In the strain relief annealing, a continuous annealing furnace is used, the furnace temperature is set to 300 to 700 ° C., the tension applied to the copper alloy sheet in the furnace is set to 1 to 5 MPa, and the copper alloy sheet is passed through, .2% yield strength is reduced by 10-50 MPa, The method for producing a copper alloy sheet according to any one of (1) to (6), wherein
  • a copper alloy plate having high strength, high conductivity, and excellent stress relaxation characteristics, a manufacturing method thereof, and an electronic component suitable for high current use or heat dissipation use.
  • This copper alloy can be suitably used as a material for electronic parts such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, heat sinks, etc., especially for electronic parts that carry a large current or a large amount of heat. It is useful as a material for electronic parts that dissipate the energy
  • the present invention will be described below.
  • (Characteristic) In this invention aims at adjusting the electrical conductivity and 0.2% yield strength of a copper alloy board to 65% IACS or more and 330MPa or more, respectively. If the electrical conductivity is 65% IACS or more, heat generation during energization is reduced, and a reduction in contact force due to stress relaxation is reduced. In addition, if the 0.2% proof stress is 330 MPa or more, it can be said that the material has a strength necessary for a material for a component that conducts a large current or a material for a component that dissipates a large amount of heat. Regarding stress relaxation characteristics, the stress relaxation rate when 80% stress of 0.2% proof stress is applied and held at 150 ° C.
  • the stress relaxation rate of a normal Cu—Fe—P alloy is about 70 to 80%. By making this 50% or less, even if a large current is applied after processing the connector, the contact force decreases. Increase in contact electrical resistance is unlikely to occur, and creep deformation is unlikely to occur even if heat and external force are applied simultaneously after processing into a heat sink.
  • the copper alloy plate of the present invention having the above characteristics is suitable for use in high-current electronic components.
  • the Fe concentration is 0.01 to 0.5 mass%, and the P concentration is 0.01 to 0.3 mass%. When Fe exceeds 0.5 mass%, it becomes difficult to obtain a conductivity of 65% IACS or more. When Fe is less than 0.01% by mass, it becomes difficult to obtain a 0.2% proof stress of 330 MPa or more.
  • P is added to the copper alloy of the present invention. P has the effect of deoxidizing the molten metal in the alloy manufacturing process. Further, by forming a compound with Fe, there is an effect of increasing the conductivity and strength of the alloy.
  • the ratio (% Fe /% P) between the mass% concentration of Fe (% Fe) and the mass% concentration of P (% P) is adjusted to 1 to 6, preferably 2 to 5. By adjusting% Fe /% P in this way, higher conductivity can be obtained.
  • Sn has the effect of promoting work hardening of the alloy during rolling and improving the strength of the alloy. Further, although not as much as Zr and Ti described above, Sn also has an effect of improving stress relaxation characteristics. When Sn exceeds 0.5% by mass, the decrease in conductivity is increased. In order to acquire the effect of Sn addition, it is preferable to make the addition amount of Sn 0.001 mass% or more. A more preferable Sn concentration range is 0.005 to 0.3% by mass, and a further preferable Sn concentration range is 0.01 to 0.1% by mass.
  • the amount of Zn added is preferably 0.001% by mass or more.
  • a more preferable range of Zn concentration is 0.01 to 0.5% by mass. Since it is difficult to form an oxide in molten copper, Zn does not deteriorate the manufacturability and quality of the alloy as long as it is added at a concentration of 1% by mass or less.
  • the Cu—Fe—P alloy of the present invention may contain one or more of Ag, Co, Ni, Cr, Mn, Mg, Si and B in order to improve strength and heat resistance. it can.
  • the total addition amount is 2% by mass or less, more preferably 0.5% by mass or less, and still more preferably 0.8%. It is limited to 1% by mass or less.
  • I (111) / I (311) By adjusting I (111) / I (311) to 5.0 or less, preferably 2.0 or less on the rolled surface of the product, the stress relaxation characteristics are improved.
  • I (111) and I (311) are diffraction integrated intensities of the (111) plane and the (311) plane obtained in the thickness direction using the X-ray diffraction method, respectively.
  • I (111) / I (311) exceeds 5.0, the stress relaxation rate exceeds 50%.
  • the lower limit of I (111) / I (311 ) is not limited in terms of the stress relaxation characteristics improved, I (111) / I ( 311) typically takes a value of more than 0.01.
  • the thickness of the product is preferably 0.1 to 2.0 mm. If the thickness is too thin, the cross-sectional area of the current-carrying part will decrease and heat generation will increase during energization, making it unsuitable as a material for connectors that carry large currents, and because it will deform with a slight external force, etc. It is also unsuitable as a material. On the other hand, if the thickness is too thick, bending becomes difficult. From such a viewpoint, a more preferable thickness is 0.2 to 1.5 mm. When the thickness is in the above range, the bending workability can be improved while suppressing heat generation during energization.
  • the copper alloy plate according to the embodiment of the present invention is suitably used for applications of electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc. used in electric / electronic devices, automobiles, etc.
  • electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, heat sinks, etc. used in electric / electronic devices, automobiles, etc.
  • high-current electronic components such as connectors and terminals for large currents used in electric vehicles, hybrid vehicles, etc.
  • electronic components for heat dissipation such as liquid crystal frames used in smartphones and tablet PCs Useful for.
  • recrystallization annealing part or all of the rolling structure is recrystallized. Further, by annealing under appropriate conditions, Fe or a compound of Fe and P is precipitated, and the electrical conductivity of the alloy is increased. In the recrystallization annealing before the final cold rolling, the average crystal grain size of the copper alloy sheet is adjusted to 50 ⁇ m or less. If the average crystal grain size is too large, it will be difficult to adjust the 0.2% yield strength to 330 MPa or more.
  • the conditions for recrystallization annealing before final cold rolling are determined based on the target crystal grain size after annealing and the target product conductivity.
  • annealing may be performed using a batch furnace or a continuous annealing furnace with the furnace temperature set at 350 to 800 ° C.
  • the heating time may be appropriately adjusted within the range of 30 minutes to 30 hours at a furnace temperature of 350 to 600 ° C.
  • a continuous annealing furnace the heating time may be appropriately adjusted within the range of 5 seconds to 10 minutes at a furnace temperature of 450 to 800 ° C.
  • higher conductivity can be obtained with the same crystal grain size.
  • the total workability of final cold rolling and the workability per pass are controlled.
  • the total processing degree R is 25 to 99%. If R is too small, it becomes difficult to adjust the 0.2% proof stress to 330 MPa or more. When R is too large, the edge of the rolled material may be broken.
  • the degree of processing r per pass is 20% or less. If r is too large increases I (111) / I (311 ), the path that r is more than 20% among all paths include even one I a (111) / I (311) 5.0 It becomes difficult to adjust to the following.
  • the strain relief annealing of the present invention is performed using a continuous annealing furnace.
  • the material In the case of a batch furnace, the material is heated in a coiled state, so that the material undergoes plastic deformation during the heating and the material is warped. Therefore, the batch furnace is not suitable for the strain relief annealing of the present invention.
  • the temperature in the furnace is set to 300 to 700 ° C., the heating time is appropriately adjusted in the range of 5 seconds to 10 minutes, and the 0.2% proof stress ( ⁇ ) after the stress relief annealing is 0 before the stress relief annealing. Adjust to a value 10 to 50 MPa lower, preferably 15 to 45 MPa lower than 2% proof stress ( ⁇ 0 ). Thereby, Kb which was low in the final cold rolling is sufficiently increased. If ( ⁇ 0 ⁇ ) is too small or too large, Kb does not rise sufficiently, and it becomes difficult to obtain the relationship of Kb ⁇ ( ⁇ 100).
  • the tension applied to the material in the continuous annealing furnace is adjusted to 1 to 5 MPa, more preferably 1 to 4 MPa. If the tension is too large, it becomes difficult to adjust I (111) / I (311) to 5.0 or less. Further, the increase in Kb tends to be insufficient. On the other hand, if the tension is too small, the material in the passing plate of the annealing furnace may come into contact with the furnace wall, and the surface or edge of the material may be damaged.
  • annealing before final cold rolling a batch furnace is used, the heating time is 5 hours, the furnace temperature is adjusted in the range of 350 to 700 ° C, and the crystal grain size and conductivity after annealing are adjusted. Changed.
  • the crystal grain size after annealing a cross section perpendicular to the rolling direction was subjected to chemical corrosion after mirror polishing, and the average crystal grain size was determined by a cutting method (JIS H0501 (1999)).
  • the total workability and the workability per pass were controlled. Moreover, the 0.2% yield strength of the material after final cold rolling was calculated
  • strain relief annealing using a continuous annealing furnace the furnace temperature was 500 ° C., the heating time was adjusted between 1 second and 15 minutes, and the 0.2% proof stress after annealing was variously changed. In addition, various tensions were added to the material in the furnace. In some cases, strain relief annealing was not performed. The following measurement was performed on the material in the process of manufacturing and the material after strain relief annealing.
  • the alloy element concentration of the material after strain relief annealing was analyzed by ICP-mass spectrometry.
  • sample No. 13B specified in JIS Z2241 was taken so that the tensile direction was parallel to the rolling direction, and pulled in parallel with the rolling direction in accordance with JIS Z2241. Tests were performed to determine 0.2% yield strength.
  • test piece was taken from the material after strain relief annealing so that the longitudinal direction of the test piece was parallel to the rolling direction, and the conductivity at 20 ° C. was measured by a four-terminal method in accordance with JIS H0505.
  • the X-ray diffraction integrated intensity of the (111) plane and (311) plane was measured in the thickness direction with respect to the surface of the material after strain relief annealing.
  • RINT 2500 manufactured by Rigaku Corporation was used as the X-ray diffractometer, and measurement was performed with a Cu tube bulb at a tube voltage of 25 kV and a tube current of 20 mA.
  • Table 1 shows the evaluation results.
  • the expression “ ⁇ 10 ⁇ m” in the crystal grain size after the final recrystallization annealing indicates that all of the rolling structure is recrystallized and the average crystal grain size is less than 10 ⁇ m, and that only a part of the rolling structure is recrystallized. Both cases of crystallization are included.
  • the Fe concentration is adjusted to 0.01 to 0.5 mass%, the P concentration is adjusted to 1/6 times to 1 time the Fe concentration, and the crystal grain size is adjusted to 50 ⁇ m or less in the recrystallization annealing before the final cold rolling.
  • the total workability is adjusted to 25 to 99%, the workability per pass is adjusted to 20% or less, and the material is passed through the continuous annealing furnace at a tension of 1 to 5MPa in strain relief annealing.
  • the relationship of Kb ⁇ ( ⁇ 100) and the relationship of I (111) / I (311) ⁇ 5.0 are obtained.
  • a conductivity of 65% IACS or higher, a 0.2% proof stress of 330 MPa or higher, and a stress relaxation rate of 50% or lower were achieved.
  • Comparative Examples 1 and 2 were not subjected to strain relief annealing, and the stress relaxation rate was extremely large.
  • Comparative Examples 3 to 5 although strain relief annealing was performed, the material tension in the furnace exceeded 5 MPa, so I (111) / I (311) exceeded 5.0, and the comparatively high tension In (5), ( ⁇ Kb) also exceeded 100.
  • the stress relaxation rate of Comparative Examples 3 to 5 exceeded 50%.
  • Comparative Example 10 the total degree of work in the final cold rolling was less than 25%, and in Comparative Example 11, the crystal grain size after recrystallization annealing before the final cold rolling exceeded 50 ⁇ m.
  • the 0.2% proof stress was less than 330 MPa.
  • Comparative Example 12 since the Fe concentration was less than 0.01% by mass, the 0.2% proof stress after strain relief annealing was less than 330 MPa. In Comparative Example 13, the Fe concentration exceeded 0.5 mass%, and in Comparative Examples 14 and 15, the P concentration was out of the range of 1/6 to 1 times the Fe concentration, so the conductivity was less than 65% IACS. It was.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

L'invention concerne une plaque en alliage de cuivre présentant une résistance élevée, d'excellentes propriétés électroconductrices et d'excellentes propriétés de relaxation en contrainte. L'invention concerne également un procédé de production de la plaque en alliage de cuivre, ainsi qu'un composant électronique destiné à être utilisé avec un courant de forte intensité et un composant électronique à dissipation thermique faisant appel à ladite plaque en alliage de cuivre. Cette plaque en alliage de cuivre comprend : 0,01-0,5 % en masse de Fe ; P à raison de 1/6 à 1 fois, en % en masse, la concentration de Fe en % en masse ; du cuivre, le complément étant constitué d'impuretés inévitables. La plaque en alliage de cuivre est caractérisée en ce que : sa conductivité électrique est supérieure ou égale à 65 % IACS ; sa limite conventionnelle d'élasticité à 0,2 % est supérieure ou égale à 330 MPa ; et son taux de relaxation en contrainte, après qu'elle a été maintenue à 150 °C pendant 1 000 heures, tout en subissant une contrainte de 80 % de la limite conventionnelle d'élasticité à 0,2 %, est inférieur ou égal à 50 %.
PCT/JP2013/067269 2012-09-12 2013-06-24 Plaque en alliage de cuivre présentant d'excellentes propriétés électroconductrices et d'excellentes propriétés de relaxation en contrainte WO2014041865A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012-200663 2012-09-12
JP2012200663 2012-09-12
JP2013106504A JP2014074223A (ja) 2012-09-12 2013-05-20 導電性及び応力緩和特性に優れる銅合金板
JP2013-106504 2013-05-20

Publications (1)

Publication Number Publication Date
WO2014041865A1 true WO2014041865A1 (fr) 2014-03-20

Family

ID=50277999

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/067269 WO2014041865A1 (fr) 2012-09-12 2013-06-24 Plaque en alliage de cuivre présentant d'excellentes propriétés électroconductrices et d'excellentes propriétés de relaxation en contrainte

Country Status (3)

Country Link
JP (1) JP2014074223A (fr)
TW (1) TW201413013A (fr)
WO (1) WO2014041865A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115537597A (zh) * 2022-09-20 2022-12-30 重庆川仪自动化股份有限公司 一种负电阻温度系数的锰铜合金和制备方法及用途

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6113061B2 (ja) * 2013-11-25 2017-04-12 Ｊｘ金属株式会社 導電性、耐応力緩和特性および成形加工性に優れる銅合金板
JP6360363B2 (ja) * 2014-06-18 2018-07-18 株式会社Uacj 銅合金管

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006083465A (ja) * 2004-08-17 2006-03-30 Kobe Steel Ltd 曲げ加工性を備えた電気電子部品用銅合金板
JP2006200036A (ja) * 2004-12-24 2006-08-03 Kobe Steel Ltd 曲げ加工性及び耐応力緩和特性を備えた銅合金
JP2008045204A (ja) * 2006-07-21 2008-02-28 Kobe Steel Ltd 酸化膜密着性に優れた電気電子部品用銅合金板
WO2012026610A1 (fr) * 2010-08-27 2012-03-01 古河電気工業株式会社 Feuille d'alliage de cuivre et procédé de fabrication de celle-ci
JP2012167310A (ja) * 2011-02-11 2012-09-06 Kobe Steel Ltd 電気・電子部品用銅合金及びＳｎめっき付き銅合金材

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006083465A (ja) * 2004-08-17 2006-03-30 Kobe Steel Ltd 曲げ加工性を備えた電気電子部品用銅合金板
JP2006200036A (ja) * 2004-12-24 2006-08-03 Kobe Steel Ltd 曲げ加工性及び耐応力緩和特性を備えた銅合金
JP2008045204A (ja) * 2006-07-21 2008-02-28 Kobe Steel Ltd 酸化膜密着性に優れた電気電子部品用銅合金板
WO2012026610A1 (fr) * 2010-08-27 2012-03-01 古河電気工業株式会社 Feuille d'alliage de cuivre et procédé de fabrication de celle-ci
JP2012167310A (ja) * 2011-02-11 2012-09-06 Kobe Steel Ltd 電気・電子部品用銅合金及びＳｎめっき付き銅合金材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115537597A (zh) * 2022-09-20 2022-12-30 重庆川仪自动化股份有限公司 一种负电阻温度系数的锰铜合金和制备方法及用途
CN115537597B (zh) * 2022-09-20 2023-07-28 重庆川仪自动化股份有限公司 一种负电阻温度系数的锰铜合金和制备方法及用途

Also Published As

Publication number Publication date
TW201413013A (zh) 2014-04-01
JP2014074223A (ja) 2014-04-24

Similar Documents

Publication Publication Date Title
JP5847787B2 (ja) 導電性及び応力緩和特性に優れる銅合金板
JP5380621B1 (ja) 導電性及び応力緩和特性に優れる銅合金板
JP6270417B2 (ja) 導電性及び応力緩和特性に優れる銅合金板
JP5470483B1 (ja) 導電性及び応力緩和特性に優れる銅合金板
WO2015022789A1 (fr) Plaque d'alliage de cuivre excellente en termes de conductivité et de coefficient de flexion au pliage
JP5427971B1 (ja) 導電性及び曲げたわみ係数に優れる銅合金板
JP6128976B2 (ja) 銅合金および高電流用コネクタ端子材
JP5632063B1 (ja) 銅合金板、並びに、それを備える大電流用電子部品及び放熱用電子部品
JP6328380B2 (ja) 導電性及び曲げたわみ係数に優れる銅合金板
JP5467163B1 (ja) 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法
JP2017155340A (ja) 導電性及び応力緩和特性に優れる銅合金板
JP5892974B2 (ja) 導電性及び応力緩和特性に優れる銅合金板
WO2014041865A1 (fr) Plaque en alliage de cuivre présentant d'excellentes propriétés électroconductrices et d'excellentes propriétés de relaxation en contrainte
JP2017066532A (ja) 導電性及び応力緩和特性に優れる銅合金板
JP6207539B2 (ja) 銅合金条およびそれを備える大電流用電子部品及び放熱用電子部品
JP2017002407A (ja) 導電性及び応力緩和特性に優れる銅合金板
JP5449595B1 (ja) 導電性及び曲げたわみ係数に優れる銅合金板
JP5620025B2 (ja) 導電性及び応力緩和特性に優れる銅合金板
JP5352750B1 (ja) 導電性及び曲げたわみ係数に優れる銅合金板
JP2017179503A (ja) 強度及び導電性に優れる銅合金板
JP2014055347A (ja) 導電性及び応力緩和特性に優れる銅合金板
JP2014205864A (ja) 導電性及び応力緩和特性に優れる銅合金板
JP2014208868A (ja) 銅合金および高電流用コネクタ端子材

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13837564

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13837564

Country of ref document: EP

Kind code of ref document: A1