WO2014040309A1 - 液晶面板磨边机 - Google Patents

液晶面板磨边机 Download PDF

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Publication number
WO2014040309A1
WO2014040309A1 PCT/CN2012/081711 CN2012081711W WO2014040309A1 WO 2014040309 A1 WO2014040309 A1 WO 2014040309A1 CN 2012081711 W CN2012081711 W CN 2012081711W WO 2014040309 A1 WO2014040309 A1 WO 2014040309A1
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WO
WIPO (PCT)
Prior art keywords
grinding wheel
liquid crystal
crystal panel
integral
cutting edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2012/081711
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English (en)
French (fr)
Inventor
陈信华
黄正明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US13/805,060 priority Critical patent/US20140080384A1/en
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Publication of WO2014040309A1 publication Critical patent/WO2014040309A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/14—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of optical work, e.g. lenses, prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass

Definitions

  • the invention relates to the technical field of liquid crystal panel manufacturing, and in particular to an edger for grinding a liquid crystal panel.
  • a TFT-side substrate G1 and a CF-side substrate G2 which are oppositely disposed, are bonded together to form a mother board M in which liquid crystal is sealed, and then
  • the unit display panel U is divided into one unit as shown in FIG. 2, and the liquid crystal display panel is manufactured through these processes.
  • the TFT-side substrate G1 generally includes a glass substrate, a thin film transistor for driving a liquid crystal formed on the glass substrate, and a terminal region for external connection
  • the CF-side substrate G2 generally includes a glass substrate and a color formed on the glass substrate. Filter.
  • the mother board M is generally divided into unit display panels U by a cutting device having a cutter wheel.
  • the two cutter wheels C1, C2 are respectively pressed against the corresponding positions on the TFT side substrate G1 and the CF side substrate G2 and relatively moved, thereby scribed a scribe groove on each of the substrates.
  • the cutting is performed by applying a force along the scribe groove or applying heat steam to cut, thereby completely dividing the mother board M into each unit display panel U, and then transporting the separated unit display panel U by the robot. Go to the subsequent process.
  • a pair of cutter wheels C1 and C2 are used to simultaneously cut the mother board M from the upper and lower directions.
  • One of the cutter wheels C1 is pressed against the TFT side substrate G1 away from the CF side substrate G2.
  • the other cutter wheel C2 is pressed against the side of the CF-side substrate G2 away from the TFT-side substrate G1 and is substantially aligned with the cutter wheel C1.
  • the two cutter wheels are controlled to operate simultaneously, for example, while rotating in opposite directions to form a full cutting plane P on the display panel U, thereby separating the adjacent two unit display panels U. As shown in FIG.
  • the full-cut surface P includes a first cut surface P1 formed on the TFT-side substrate G1 and a second cut surface P2 formed on the CF-side substrate G2; in an ideal state, P1 and P2 are aligned. At the same level.
  • the TFT side substrate G2 configured to have the terminal region formed on one of the sides
  • the edge of the cutting edge of each of the cutting edges is ground by grinding the edge of the cutting edge of the display panel U by using an edger.
  • the existing edger is only used to effect the cornering of the cutting edge of the display panel U.
  • the cutter wheel C1 corresponding to the TFT side substrate G1 and the cutter wheel C2 corresponding to the CF side substrate G2 are generally not completely aligned.
  • the cutter wheel C1 or the cutter wheel C2 is affected by the voltage fluctuation or bears the mother board.
  • the mesa of the M is vibrated due to external factors, which easily causes the foreign matter B as shown in FIG. 7 to remain on the full-cut surface of the display panel, resulting in poor cutting quality, which requires more time in the subsequent process of the display panel.
  • the display panel performs a grinding operation to eliminate foreign matter B, which reduces the production efficiency of the display panel.
  • a primary object of the present invention is to provide an edger for aiming at the corner cutting of a liquid crystal panel while achieving a full-cut surface of the liquid crystal panel.
  • the invention provides a liquid crystal panel edger for grinding a liquid crystal panel, the edger comprising a lead grinding wheel assembly and an integral grinding wheel assembly, the angled grinding wheel assembly corresponding to a cutting edge of the liquid crystal panel, The cutting edge is subjected to a cornering process to grind off a sharp portion of the cutting edge, the integral grinding wheel assembly corresponding to the full cutting surface of the liquid crystal panel, and the full cutting surface is shaped to eliminate the existence of the full cutting surface Step difference and foreign matter.
  • the cutting edge includes a first cutting edge formed on the TFT side substrate of the liquid crystal panel and a second cutting edge formed on the CF side substrate of the liquid crystal panel, the lead grinding wheel assembly including the first The grinding wheel set, the first grinding wheel set includes a first grinding wheel and a second grinding wheel respectively corresponding to the first cutting edge and the second cutting edge.
  • the first grinding wheel and the second grinding wheel are arranged offset from each other in a pushing direction of the liquid crystal panel.
  • the angled grinding wheel assembly further comprises at least one second grinding wheel set for further grinding a corresponding cutting edge of the liquid crystal panel processed by the first grinding wheel set, each of the second grinding wheel sets comprising a third grinding wheel corresponding to the first cutting edge and disposed in parallel with the first grinding wheel, the fourth grinding wheel corresponding to the second cutting edge and parallel to the second grinding wheel Interval setting.
  • the first grinding wheel and the third grinding wheel rotate in the same direction
  • the second grinding wheel and the fourth grinding wheel rotate in the same direction and are combined with the first grinding wheel and/or the third rotating grinding wheel.
  • the direction of rotation is reversed.
  • the full-cut surface includes a first cut surface formed on a TFT-side substrate of the liquid crystal panel and a second cut surface formed on a CF-side substrate of the liquid crystal panel, the integer-shaped grinding wheel assembly including adjacent
  • the lead grinding wheel assembly is disposed to respectively correspond to the first forming surface of the first cutting surface and the second cutting surface, and the first integral grinding wheel is configured to eliminate the existence between the first cutting surface and the second cutting surface
  • the step is such that the first cutting surface and the second cutting surface are maintained at the same level.
  • the integral grinding wheel assembly further comprises at least one second integral grinding wheel, the at least one second integral grinding wheel being arranged in parallel with the first integral grinding wheel for aligning the first integral grinding wheel
  • the first cut surface and the second cut surface that have been processed are further shaped.
  • the outer surfaces of the first integral grinding wheel and the at least one second integral grinding wheel are coated with an abrasive layer.
  • the outer diameter of the at least one second integral grinding wheel is larger than the outer diameter of the first integral grinding wheel.
  • control assembly coupled to the lead grinding wheel assembly and the integral grinding wheel assembly for controlling movement of the angled grinding wheel assembly and the integral grinding wheel assembly to correspond to the liquid crystal panel The cutting edge and the full cutting surface of the desired grinding process.
  • the present invention also provides another edger for polishing a liquid crystal panel, the liquid crystal panel being formed with at least one cutting edge and at least one full cutting surface, wherein the edger comprises a first grinding wheel And the first integral grinding wheel, the first grinding wheel set corresponding to the cutting edge and the angled processing of the cutting edge, the first integral grinding wheel corresponding to the full cutting surface, the whole cutting surface is shaped to eliminate The step difference and foreign matter on the full cutting surface.
  • the cutting edge includes a first cutting edge formed on the TFT side substrate of the liquid crystal panel and a second cutting edge formed on the CF side substrate of the liquid crystal panel, the first grinding wheel group including respectively And corresponding to the first cutting edge and the second cutting edge and respectively performing the first grinding wheel and the second grinding wheel on the first cutting edge and the second cutting edge.
  • the first grinding wheel and the second grinding wheel are arranged offset from each other in a pushing direction of the liquid crystal panel.
  • the first grinding wheel and the second grinding wheel rotate in opposite directions.
  • the edger further includes at least one second grinding wheel set disposed in parallel with the first grinding wheel set, the second grinding wheel set and the first grinding wheel set mutually in a propelling direction of the liquid crystal panel
  • the staggered arrangement performs further grinding processing on the corresponding cutting edge processed by the first grinding wheel set.
  • the full-cut surface includes a first cut surface formed on the TFT side substrate of the liquid crystal panel and a second cut surface formed on the liquid crystal panel CF side substrate, the first integral grinding wheel pair
  • the first cutting surface and the second cutting surface are processed such that the first cutting surface and the second cutting surface are flush with each other.
  • the outer surface of the first integral grinding wheel is coated with an abrasive layer.
  • the edger further comprises at least one second integral grinding wheel, the second integral grinding wheel is arranged in parallel with the first integral grinding wheel, and is used for shaping the first integral grinding wheel.
  • the first cutting surface and the second cutting surface are further processed.
  • the outer diameter of the second integral grinding wheel is larger than the outer diameter of the first integral grinding wheel.
  • the edger further includes a control assembly coupled to the first grinding wheel set and the first integral grinding wheel for controlling movement of the first grinding wheel set and the first integral grinding wheel to Corresponding to the cutting edge and the full cutting surface of the liquid crystal panel required for grinding.
  • a control assembly coupled to the first grinding wheel set and the first integral grinding wheel for controlling movement of the first grinding wheel set and the first integral grinding wheel to Corresponding to the cutting edge and the full cutting surface of the liquid crystal panel required for grinding.
  • the edging machine provided by the invention can be arranged at the same time by placing the integral grinding wheel assembly adjacent to the leading angle grinding wheel assembly, so that when the angled grinding wheel assembly performs the angle guiding processing on the cutting edge of the liquid crystal panel, the integral grinding wheel assembly can simultaneously
  • the full-cut surface of the liquid crystal panel is shaped to eliminate the step difference and the foreign matter on the full-cut surface, so that the edger can simultaneously perform the chamfering process of the cutting edge of the liquid crystal panel and the integral processing of the full-cut surface. In this way, it is not necessary to reshape the liquid crystal panel of the lead angle processing, which reduces the manpower and material force required for the integral processing of the liquid crystal panel, and improves the productivity of the liquid crystal panel.
  • FIG. 1 is a schematic view showing cutting of a CF side substrate and a TFT side substrate by using two cutter wheels to form a unit display panel;
  • FIG. 2 is a schematic structural view of a unit display panel formed by cutting with a cutter wheel shown in FIG. 1;
  • FIG. 3 and FIG. 4 are schematic diagrams showing a structure in which a CF side substrate is cut to expose a terminal region of a TFT side substrate in the prior art
  • FIG. 5 is a schematic diagram showing the dislocation setting of two cutter wheels for cutting the CF side substrate and the TFT side substrate in the prior art
  • FIG. 6 is a schematic structural view of a unit display panel formed by cutting a cutter wheel shown in FIG. 5;
  • FIG. 7 is a schematic structural view showing the presence of foreign matter on the cutting surface of the unit display panel
  • FIG. 8 is a schematic structural view of a guide grinding wheel assembly and an integral grinding wheel assembly of an edger according to a preferred embodiment of the present invention
  • Figure 9 is another perspective view of the angled grinding wheel assembly and the integral grinding wheel assembly shown in Figure 8.
  • FIG. 10 is a schematic view showing the machining of the non-full-cut surface of the liquid crystal panel by the angled grinding wheel assembly and the integral grinding wheel assembly shown in FIG. 8.
  • FIG. 10 is a schematic view showing the machining of the non-full-cut surface of the liquid crystal panel by the angled grinding wheel assembly and the integral grinding wheel assembly shown in FIG. 8.
  • FIG. 8 is a schematic structural view of a guide grinding wheel assembly and an integral grinding wheel assembly of an edger 100 according to a preferred embodiment of the present invention
  • FIG. 9 is a lead grinding wheel assembly shown in FIG.
  • the liquid crystal panel 200 includes a corresponding TFT side substrate 210 and a CF side substrate 220.
  • the TFT side substrate 210 includes a glass substrate, a thin film transistor for driving the liquid crystal formed on the glass substrate, and a terminal region for external connection
  • the CF side substrate 220 includes a glass substrate and color filter formed on the glass substrate. sheet.
  • the liquid crystal panel 200 is further formed with four cutting edges 230 and at least one full cutting surface 240.
  • the cutting edge 230 includes a first cutting edge 231 formed on the TFT side substrate 210 and a TFT side substrate 220.
  • the upper second cutting edge 232 includes a first cutting surface 241 formed on the TFT side substrate 210 and a second cutting surface 242 formed on the CF side substrate 220.
  • the edger 100 is used for grinding the edge of the liquid crystal panel 200 , including cornering the cutting edge 230 of the liquid crystal panel 200 to eliminate the sharp portion on the corresponding cutting edge 230 , and the liquid crystal panel 200 .
  • the full cut surface 240 is shaped to eliminate the step and foreign matter present on the corresponding full cut surface 240.
  • the edger 100 includes a lead grinding wheel assembly 110, an integral grinding wheel assembly 120, and a control assembly (not shown).
  • the lead grinding wheel assembly 110 corresponds to each cutting edge 230 of the liquid crystal panel 200 for performing angle forming processing on each cutting edge 230 to grind off the sharp portion on each cutting edge 230; the integral grinding wheel assembly 120 corresponds to the needs of the liquid crystal panel 200
  • the full-cut surface 240 for the shaping process is used for the step difference existing between the first cutting surface 241 and the second cutting surface 242, and simultaneously grinding the foreign matter existing on the first cutting surface 241 or the second cutting surface 242, Such as protrusions and the like.
  • the control assembly is coupled to the angled grinding wheel assembly 110 and the integral grinding wheel assembly 120 for controlling the advancement direction and travel distance of the angled grinding wheel assembly 110 and the integral grinding wheel assembly 120.
  • the angled grinding wheel assembly 110 includes a first grinding wheel set 111.
  • the first grinding wheel set 111 includes a first grinding wheel 111a and a second grinding wheel 111b.
  • the first grinding wheel 111a corresponds to the first cutting edge 231 of each cutting edge 230 for cornering the first cutting edge 231 to eliminate the sharp portion on the first cutting edge 231;
  • the second grinding wheel 111b corresponds to each cutting A second cutting edge 232 of the edge 230 is used to grind the second cutting edge 232 to eliminate sharp portions on the second cutting edge 232.
  • the second grinding wheel 111b is offset from the first grinding wheel 111a in the advancing direction of the liquid crystal panel 200.
  • the angled grinding wheel assembly 110 further includes a second grinding wheel set 112 spaced apart from the first grinding wheel set 111 for the first cutting edge 231 and the second cutting edge 232 that have been initially ground. Further grinding is performed to improve the quality of the grinding.
  • the second grinding wheel set 112 includes a third grinding wheel 112a and a fourth grinding wheel 112b.
  • the third grinding wheel 112a is disposed in parallel with the first grinding wheel 111a and coincides with the first grinding wheel 111a, and corresponds to the first cutting edge 231 of the TFT side substrate 210 for the first cutting edge 231 processed by the first grinding wheel 111a. Further grinding is performed.
  • the fourth grinding wheel 112a is disposed in parallel with the second grinding wheel 111b and coincides with the second grinding wheel 111b, and both correspond to the second cutting edge 232 of the CF side substrate 220 for the second cutting edge 232 that has been ground through the second grinding wheel 111a. Further grinding is carried out.
  • the angled grinding wheel assembly 110 is not limited to the case in this embodiment. In some embodiments, if the grinding quality of the liquid crystal panel 200 is not high, the angled grinding wheel assembly 110 may include only the first grinding wheel set 111; or, in other embodiments, such as the grinding quality of the liquid crystal panel 200. When the requirements are high, the angled grinding wheel assembly 110 can include a plurality of second grinding wheel sets 112 to effect repeated grinding of the first cutting edge 231 and the second cutting edge 232.
  • the integer grinding wheel assembly 120 includes a first integral grinding wheel 121 and a second integral grinding wheel 122.
  • the first integral grinding wheel 121 is disposed in parallel with the angled grinding wheel assembly 110, and its outer surface is coated with an abrasive layer 121a.
  • the outer surface of the abrasive layer 121a of the first integral grinding wheel 121 corresponds to the full-cut surface of the liquid crystal panel 200, that is, the full-cut surface 240 on the liquid crystal panel 200 that needs to be finished, for grinding the full-cut surface 240.
  • the difference between the first cutting surface 241 and the second cutting surface 242 is such that the first cutting surface 241 and the second cutting surface 242 can be on the same horizontal surface, and at the same time grinding the first cutting surface 241 and the second Foreign matter on the cutting surface 242, such as a protrusion or the like.
  • the second integral grinding wheel 122 is disposed in parallel with the first integral grinding wheel 121 for further processing the first cutting surface 241 and the second cutting surface 242 which have been processed by the first integral grinding wheel 121 to improve the processing quality.
  • the outer diameter of the second integral grinding wheel 122 is larger than the outer diameter of the first integral grinding wheel 121, and the outer side thereof is also coated with the abrasive layer 122a.
  • the integral grinding wheel assembly 120 is not limited to the case in this embodiment.
  • the number of integer grinding wheels included in the integral grinding wheel assembly 120 can be adjusted according to the cutting condition of the first cutting surface 241 and the second cutting surface 242. For example, if the step difference between the first cutting surface 241 and the second cutting surface 242 is more obvious, or if there is more foreign matter on the first cutting surface 241 or the second cutting surface 242, the integer grinding wheel assembly 120 may include multiple The second type of grinding wheel 122; or alternatively, when the step difference between the first cutting surface 241 and the second cutting surface 242 is not obvious, or the foreign matter on the first cutting surface 241 or the second cutting surface 242 is small, the integer The grinding wheel assembly 120 can also have only the first integral grinding wheel 121.
  • the number of cutting edges 230 that need to be subjected to the angle forming process is constant, and the number of full cutting faces 240 that need to use the edger 100 to eliminate the step difference is correspondingly changed. Specifically, the sum of the number of the full-cut faces 240 that are subjected to the finishing process by the edger 100 and the number of the edges of the TFT-side substrate 210 on which the terminal regions are exposed is required to be cut by the liquid crystal panel 200.
  • the number of edges 240 is the same. For example, as shown in FIG.
  • the liquid crystal panel 200 configured to expose the terminal region only on one edge of the TFT-side substrate 210, that is, for the liquid crystal panel 200 having only three full-cut faces 240
  • the edger 100 since there is a certain distance between the second cutting surface 242 and the first cutting surface 241 on the non-full cutting surface, there is no step difference between the two cutting surfaces, so it is not necessary to eliminate the use of the edger 100.
  • the step difference between the two cutting faces, and only the edger 100 performs the cornering process on the cutting edge 230 of the liquid crystal panel 200.
  • the edger 100 can simultaneously eliminate foreign matter on the TFT-side substrate 210 during the process of the lead-angle processing.
  • the control assembly is coupled to the lead grinding wheel assembly 110 and the integral grinding wheel assembly 120 for adjusting the position of the angled grinding wheel assembly 110 and the integral grinding wheel assembly 120, and the control of the leading angle grinding wheel assembly 110 and the integral grinding wheel assembly 120 to move to the corresponding liquid crystal
  • the cutting edge 230 on the panel 200 that requires grinding is processed.
  • the liquid crystal panel 200 When the cutting edge of the liquid crystal panel 200 is subjected to the corner forming process by the edger 100, the liquid crystal panel 200 can be placed on the conveying device, and the first cutting edge 231 of the cutting edge 230 which requires the corner forming process corresponds to the first
  • the first grinding wheel 111a of the grinding wheel set 111 and the third grinding wheel 112a of the second grinding wheel set 112 are such that the second cutting edge 232 of the cutting edge 230 requiring the angled processing corresponds to the second grinding wheel 111b and the fourth grinding wheel 112b, so that
  • the first cutting surface 241 and the second cutting surface 242 of the full-cut surface 240 that need to be processed are corresponding to the outer surfaces of the first integral grinding wheel 121 and the second integral grinding wheel 122, respectively.
  • the position of each grinding wheel in the angled grinding wheel assembly 110 and the integral grinding wheel assembly 120 can be finely adjusted by the control assembly, so that the angled grinding wheel assembly 110 and the integral grinding wheel assembly 120 can accurately perform the liquid crystal panel 200. Grinding processing. Then, the conveying device operates to drive the liquid crystal panel 200 to move forward in the Y direction shown in FIG. 9, and the angled grinding wheel assembly 110 simultaneously starts to operate to grind the first cutting edge 231 and the second cutting edge 232 of the corresponding cutting edge 230. Processing to grind off the sharp portions of the first cutting edge 231 and the second cutting edge 232.
  • the outer surfaces of the first grinding wheel 111a and the second grinding wheel 111b generate a frictional force with the first cutting edge 231 and the second cutting edge 232, respectively, thereby driving the liquid crystal panel 200 along the X direction shown in FIG.
  • a predetermined distance such that the first cutting edge 231 and the second cutting edge 232 that are ground by the angled grinding wheel assembly 110 are controlled to have a predetermined width in the X direction.
  • the first grinding wheel 111a and the second grinding wheel 111b can be prevented from grinding the thickness of the corresponding cutting edge 230 to Zero causes the liquid crystal panel 200 to be unable to move in the X direction by the angled grinding wheel assembly 110.
  • the second grinding wheel set 112 also starts to operate and further the first cutting edge 231 and the second cutting edge 232 that have been ground by the first grinding wheel set 111. machining.
  • the integral grinding wheel assembly 120 also starts to operate to shape the first cutting surface 241 and the second cutting surface 242 of the full cutting surface 240 that the liquid crystal panel 200 needs to be finished. Since the outer surface of the abrasive layer 121a of the first integral grinding wheel 121 of the integer grinding wheel assembly 120 is pressed against the first cutting surface 241 and the second cutting surface 242, after the first integral grinding wheel 121 starts to operate, the first The abrasive layer 121a of the shaping wheel 121 can grind off the step between the first cutting surface 241 and the second cutting surface 242, and at the same time grind off the foreign matter on the first cutting surface 241 or the second cutting surface 242, such as a protrusion. Wait.
  • the liquid crystal panel 200 is kept moving in the Y direction, and the first cutting surface 241 and the second cutting surface 242 are moved to the corresponding second integral grinding wheel 122 through the grinding processing of the first integral grinding wheel 121. Since the outer diameter of the second integral grinding wheel 122 is larger than the outer diameter of the first integral grinding wheel 121, the extending distance of the second integral grinding wheel 122 in the X direction is greater than the extending distance of the first integral grinding wheel 121 in the X direction.
  • the second shaping wheel 122 can further shape the first cutting surface 241 and the second cutting surface 242.
  • the edger 100 of the present invention by placing the integer grinding wheel assembly 120 adjacent to the angled grinding wheel assembly 110, causes the angled grinding wheel assembly 110 to conduct a cornering process on the corresponding cutting edge 230 of the liquid crystal panel 200.
  • the grinding wheel assembly 120 can simultaneously shape the corresponding full-cut surface 240 of the liquid crystal panel 200 to eliminate the step difference and the foreign matter between the first cutting surface 241 and the second cutting surface 242, so that the edger 100 can simultaneously
  • the cutting edge chamfering processing of the liquid crystal panel 200 and the shaping processing of the full cutting surface are realized.
  • the edger 100 can realize the shaping processing of the first cutting surface 241 of the TFT-side substrate 210 while achieving the angular processing of the cutting edge 230 to eliminate Foreign matter on the first cutting surface 241.
  • the liquid crystal panel 200 of the lead angle processing is not required to be reshaped, and the manpower and material force required for the integral processing of the liquid crystal panel 200 are reduced, and the productivity of the liquid crystal panel 200 is improved.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Liquid Crystal (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Description

液晶面板磨边机
技术领域
本发明涉及液晶面板制造技术领域，尤其涉及一种对液晶面板进行研磨加工的磨边机。
背景技术
参考图1，在现有的液晶面板的制作过程中，通常采用相对设置的两张大面积基板，即TFT侧基板G1及CF侧基板G2，粘贴在一起而形成封入了液晶的母板M，然后分割为如图2所示的一个一个的单位显示面板U，经过这些工序来制造液晶显示面板。其中，TFT侧基板G1通常包括玻璃基板及形成于玻璃基板上的驱动液晶的薄膜晶体管及用于进行外部连接的端子区域，而CF侧基板G2则通常包括玻璃基板及形成于玻璃基板上的彩色滤光片。
如图1中所示，现有技术中，通常利用具有切刀轮的切割装置将母板M分割为单位显示面板U。在该过程中，两个切刀轮C1、C2分别抵压在TFT侧基板G1和CF侧基板G2上的对应位置并且相对移动，由此在各个基板上刻出划线槽。然后，沿着划线槽施力进行切断或者施加加热蒸汽进行切断，由此将母板M彻底分割为每个单位显示面板U，而后再利用机器人将分离后的一个一个的单位显示面板U输送到后续工序。
在具体的制作过程中，通常都是采用一对切刀轮C1、C2从上下两个方向同时对母板M进行切割，其中一个切刀轮C1抵压在TFT侧基板G1远离CF侧基板G2的一侧上，另一个切刀轮C2抵压在CF侧基板G2远离TFT侧基板G1的一侧上并且大致与切刀轮C1相对齐。然后，控制该两个切刀轮同时运作，例如，同时以相反方向转动，以在显示面板U上形成全切割面P，从而将相邻的两个单位显示面板U相分离。如图2所示，该全切割面P包括形成于TFT侧基板G1上的第一切割面P1及形成于CF侧基板G2上的第二切割面P2；理想状态下，P1与P2相对齐，处于同一水平面上。而后，如图3及图4所示，在下一道工序中，通常需要利用切刀轮C2对单位显示面板U上的CF侧基板G2进行进一步切割，以使TFT侧基板G1上的端子区域T可显露出来。对于被配置为在其中一个边上形成有端子区域的TFT侧基板G2而言，通常只需对CF侧基板G1的一个边进行切割以使端子区域显露出来。也即，对于被配置为其中一个边上形成有端子区域的显示面板而言，全切割面P的数量为3个。
当显示面板U的端子区域加工完毕之后，通过需要利用磨边机对显示面板U的切割边缘进行导角加工，以磨削掉各切割边缘上锋利的部分。然而，现有的磨边机仅用于实现对显示面板U的切割边缘进行导角加工。而另一方面，如图5所示，受限于现有的切割装置的切割精度，对应TFT侧基板G1的切刀轮C1及对应CF侧基板G2的切刀轮C2通常无法完全相对齐，导致从母板M上分离出来的单位显示面板U中，显示面板U的全切割面P上存在有如图6所示的段差的现象，此时，TFT侧基板G1的切割面P1与CF侧基板G2的切割面P2无法相对齐。如此，在显示面板U后续的制程中，需要额外增加人员操作磨边机对显示面板进行复磨以消除段差现象，导致产能下降。
另外，在上述对母板M进行切割以分离出一个一个的单位显示面板U的过程中，由于一些突发情况，例如，切刀轮C1或切刀轮C2由于受电压波动影响或承受母板M的台面因外界因素发生颤动，容易导致显示面板的全切割面上残留有如图7所示的异物B，导致切割品质不佳，使得在显示面板的后续制程中需要花费更多的时间来对显示面板进行研磨操作以消除掉异物B，降低了显示面板的制作效率。
发明内容
本发明的主要目的是提供一种磨边机，旨在对液晶面板的切割边缘进行导角加工的同时实现对液晶面板的全切割面的整型加工。
本发明提供一种液晶面板磨边机，用于对液晶面板进行研磨加工，该磨边机包括导角砂轮组件及整型砂轮组件，该导角砂轮组件对应该液晶面板的切割边缘，对该切割边缘进行导角加工以磨削掉该切割边缘上锋利的部分，该整型砂轮组件对应该液晶面板的全切割面，对该全切割面进行整型加工以消除该全切割面上存在的段差及异物。
优选地，该切割边缘包括形成于所述液晶面板的TFT侧基板上的第一切割边缘及形成于所述液晶面板的CF侧基板上的第二切割边缘，所述导角砂轮组件包括第一砂轮组，所述第一砂轮组包括分别对应该第一切割边缘及该第二切割边缘的第一砂轮及第二砂轮。
优选地，所述第一砂轮及所述第二砂轮在所述液晶面板的推进方向上相互错开设置。
优选地，所述导角砂轮组件还包括至少一个第二砂轮组，用于对经过第一砂轮组加工的该液晶面板的对应切割边缘进行进一步的研磨加工，各所述第二砂轮组包括第三砂轮及第四砂轮，所述第三砂轮对应所述第一切割边缘且与所述第一砂轮平行间隔设置，所述第四砂轮对应所述第二切割边缘且与所述第二砂轮平行间隔设置。
优选地，所述第一砂轮及所述第三砂轮的转动方向相同，所述第二砂轮及所述第四砂轮的转动方向相同并与所述第一砂轮和/或所述第三转动砂轮的转动方向相反。
优选地，所述全切割面包括形成所述液晶面板的TFT侧基板上的第一切割面及形成于所述液晶面板的CF侧基板上的第二切割面，所述整型砂轮组件包括邻近该导角砂轮组件设置并分别对应该第一切割面及该第二切割面的第一整型砂轮，该第一整型砂轮用于消除该第一切割面及该第二切割面之间存在的段差以使该第一切割面及该第二切割面保持在同一水平面上。
优选地，所述整型砂轮组件还包括至少一个第二整型砂轮，所述至少一个第二整型砂轮与所述第一整型砂轮平行间隔设置，用于对经过第一整型砂轮整型加工过的该第一切割面及该第二切割面进行进一步的整型加工。
优选地，所述第一整型砂轮及所述至少一个第二整型砂轮的外表面上涂覆有磨料层。
优选地，所述至少一个第二整型砂轮的外径大于所述第一整型砂轮的外径。
优选地，还包括控制组件，该控制组件连接至所述导角砂轮组件及所述整型砂轮组件，用于控制所述导角砂轮组件及所述整型砂轮组件移动至对应所述液晶面板所需研磨加工的该切割边缘及该全切割面。
本发明还提供了另一种磨边机，用于对液晶面板进行研磨加工，所述液晶面板形成有至少一个切割边缘及至少一个全切割面，其特征在于，该磨边机包括第一砂轮组及第一整型砂轮，该第一砂轮组对应该切割边缘并对该切割边缘进行导角加工，该第一整型砂轮对应该全切割面，对该全切割面进行整型加工以消除该全切割面上的段差及异物。
优选地，所述切割边缘包括形成于所述液晶面板的TFT侧基板上的第一切割边缘及形成于所述液晶面板的CF侧基板上的第二切割边缘，所述第一砂轮组包括分别对应该第一切割边缘及该第二切割边缘并分别对该第一切割边缘及该第二切割边缘进行导角加工的第一砂轮及第二砂轮。
优选地，所述第一砂轮及所述第二砂轮在所述液晶面板的推进方向上相互错开设置。
优选地，所述第一砂轮及所述第二砂轮的转动方向相反。
优选地，所述磨边机还包括至少一个与所述第一砂轮组平行设置的第二砂轮组，所述第二砂轮组与所述第一砂轮组在所述液晶面板的推进方向上相互错开设置，对经过所述第一砂轮组加工的对应切割边缘进行进一步的研磨加工。
优选地，所述全切割面包括形成于所述液晶面板的TFT侧基板上的第一切割面及形成于所述液晶面板CF侧基板上的第二切割面，所述第一整型砂轮对该第一切割面及该第二切割面进行加工而使该第一切割面及该第二切割面相互平齐。
优选地，所述第一整型砂轮的外表面上涂覆有磨料层。
优选地，所述磨边机还包括至少一个第二整型砂轮，该第二整型砂轮与所述第一整型砂轮平行间隔设置，用于对经过该第一整型砂轮整型加工过的该第一切割面及该第二切割面进行进一步的整型加工。
优选地，所述第二整型砂轮的外径大于所述第一整型砂轮的外径。
优选地，所述磨边机还包括控制组件，该控制组件连接至第一砂轮组及所述第一整型砂轮，用于控制所述第一砂轮组及所述第一整型砂轮移动至对应所述液晶面板所需研磨加工的该切割边缘及该全切割面。
本发明所提供的磨边机，通过将整型砂轮组件设置于邻近导角砂轮组件之处，使得在导角砂轮组件对液晶面板的切割边缘进行导角加工时，整型砂轮组件可同时对液晶面板的全切割面进行整型加工，以消除全切割面上存在段差以及异物，从而使得磨边机可同时实现对液晶面板的切割边缘倒角加工及全切割面的整型加工。如此，则无需对导角加工的液晶面板进行再次的整型加工，减少了对液晶面板进行整型加工所需的人力及物力，提高了液晶面板的产能。
附图说明
图1为现有技术中利用两切刀轮对CF侧基板及TFT侧基板进行切割以形成单位显示面板的示意图；
图2为利用图1所示切刀轮切割形成后的单位显示面板的结构示意图；
图3及图4为现有技术中对CF侧基板进行切割以显露出TFT侧基板的端子区域的结构示意图；
图5为现有技术中对CF侧基板及TFT侧基板进行切割的两切刀轮错位设置示意图；
图6为图5所示的切刀轮所切割形成的单位显示面板的结构示意图；
图7为单位显示面板的切割面上存在有异物的结构示意图；
图8为本发明较佳实施例的磨边机的导角砂轮组件及整型砂轮组件的结构示意图；
图9为图8所示的导角砂轮组件及整型砂轮组件的另一角度示意图；
图10为图8所示的导角砂轮组件及整型砂轮组件对液晶面板的非全切割面进行加工的示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
请参照图8及图9，其中，图8为本发明较佳实施例的磨边机100的导角砂轮组件及整型砂轮组件的结构示意图；图9为图8所示的导角砂轮组件及整型砂轮组件的另一角度示意图，液晶面板200包括对应设置的TFT侧基板210及CF侧基板220。TFT侧基板210包括玻璃基板及形成于该玻璃基板上的用于驱动液晶的薄膜晶体管及用于进行外部连接的端子区域，CF侧基板220则包括玻璃基板及形成于玻璃基板上的彩色滤光片。此外，液晶面板200上还形成有四个切割边缘230及至少一个全切割面240，其中，所述切割边缘230包括形成于TFT侧基板210上的第一切割边缘231及形成于TFT侧基板220上的第二切割边缘232，所述全切割面240包括形成于TFT侧基板210上的第一切割面241及形成于CF侧基板220上的第二切割面242。
结合图9，磨边机100用于对液晶面板200的边缘进行研磨加工，包括对液晶面板200的切割边缘230进行导角加工以消除对应的切割边缘230上的锋利部分，以及对液晶面板200的全切割面240进行整型加工以消除对应的全切割面240上存在的段差与异物。
磨边机100包括导角砂轮组件110、整型砂轮组件120及控制组件（图未示）。导角砂轮组件110对应液晶面板200的各切割边缘230，用于对各切割边缘230进行导角加工以磨削掉各切割边缘230上的锋利部分；整型砂轮组件120对应液晶面板200的需要进行整型加工的全切割面240，用于第一切割面241及第二切割面242之间存在的段差，并同时磨削掉第一切割面241或第二切割面242上存在的异物，如突起等。控制组件则连接至导角砂轮组件110及整型砂轮组件120，用于控制导角砂轮组件110及整型砂轮组件120的推进方向及移动距离。
具体而言，在本实施例中，导角砂轮组件110包括第一砂轮组111。第一砂轮组111包括第一砂轮111a及第二砂轮111b。其中，第一砂轮111a对应各切割边缘230的第一切割边缘231，用于对第一切割边缘231进行导角加工，以消除第一切割边缘231上的锋利部分；第二砂轮111b对应各切割边缘230的第二切割边缘232，用于对第二切割边缘232进行研磨以消除第二切割边缘232上的锋利部分。第二砂轮111b在液晶面板200的推进方向上与第一砂轮111a相互错开。
进一步地，在本实施例中，导角砂轮组件110还包括与第一砂轮组111间隔设置的第二砂轮组112，用于对已经过初磨的第一切割边缘231及第二切割边缘232进行进一步的研磨，从而提高研磨质量。第二砂轮组112包括第三砂轮112a及第四砂轮112b。第三砂轮112a与第一砂轮111a平行间隔设置，且与第一砂轮111a一致，均对应TFT侧基板210的第一切割边缘231，用于对经过第一砂轮111a加工过的第一切割边缘231进行进一步的研磨加工。第四砂轮112a与第二砂轮111b平行间隔设置，且与第二砂轮111b一致，均对应CF侧基板220的第二切割边缘232，用于对经过第二砂轮111a研磨过的第二切割边缘232进行进一步的研磨。
可以理解，导角砂轮组件110并不局限于本实施例中的情况。在一些实施例中，如对液晶面板200的研磨质量要求不高时，导角砂轮组件110可以仅包括第一砂轮组111；或者，在另一些实施例中，如对液晶面板200的研磨质量要求较高时，导角砂轮组件110可以包括多个第二砂轮组112，以实现对第一切割边缘231及第二切割边缘232的反复研磨加工。
整型砂轮组件120包括第一整型砂轮121及第二整型砂轮122。第一整型砂轮121与导角砂轮组件110平行间隔设置，且其外表面上涂覆有磨料层121a。第一整型砂轮121的磨料层121a的外表面对应液晶面板200的全切割面，也即，液晶面板200上需要进行整型加工的全切割面240，用于磨削掉该全切割面240的第一切割面241与第二切割面242之间存在的段差，从而使得第一切割面241与第二切割面242可位于同一水平面上，并同时磨削掉第一切割面241及第二切割面242上的异物，如突起等。第二整型砂轮122与第一整型砂轮121平行间隔设置，用于对已经过第一整型砂轮121加工的第一切割面241及第二切割面242进行进一步的加工，以提高加工质量。在本实施例中，第二整型砂轮122的外径大于第一整型砂轮121的外径，且其外侧上同样涂覆有磨料层122a。
可以理解，整型砂轮组件120并不局限于本实施例中的情况。在其他实施例中，可根据第一切割面241及第二切割面242的切割情况而调整整型砂轮组件120所包括的整型砂轮的数量。例如，若第一切割面241与第二切割面242之间的段差现象较明显，或者第一切割面241或第二切割面242上的异物较多时，整型砂轮组件120可包括多个第二整型砂轮122；亦或者，当第一切割面241与第二切割面242之间的段差现象不明显，或者第一切割面241或第二切割面242上的异物较少时，整型砂轮组件120也可以只具有第一整型砂轮121。
需要说明的是，对于不同类型的液晶面板200，其需要进行导角加工的切割边缘230的数量不变，而其需要利用磨边机100进行消除段差的全切割面240的数量则相应有变化。具体而言，需要利用磨边机100进行整型加工的全切割面240的数量与液晶面板200的TFT侧基板210上露出端子区域的边缘数量的总和与液晶面板200需要进行导角加工的切割边缘240的数量一致。例如，如图10所示，对于被配置为仅在TFT侧基板210的一个边缘上显露出端子区域的液晶面板200而言，也即，对于仅具有三个全切割面240的液晶面板200而言，由于在非全切割面上，第二切割面242与第一切割面241之间具有一定的间距，两切割面之间不存在有段差的现象，因此，无需利用磨边机100消除该两切割面之间的段差，而仅磨边机100对液晶面板200的该切割边缘230进行导角加工。当然，在其他实施例中，若仅在TFT侧基板210的两个边缘上配置端子区域的话，由于此时液晶面板200的全切割面240的数量为两个，因此，需要利用磨边机100进行导角加工的切割边缘230的数量为四个，而需要利用磨边机100进行消除段差的全切割面240的数量仅为两个。当然，需要说明的是，如图10所示，即使对应于液晶面板200的非全切割面，磨边机100亦可在进行导角加工的过程中同时实现消除TFT侧基板210上的异物。
控制组件连接至导角砂轮组件110及整型砂轮组件120，用于调整导角砂轮组件110及整型砂轮组件120的位置，实现控制导角砂轮组件110及整型砂轮组件120移动至对应液晶面板200上需要进行研磨加工的切割边缘230处。
利用磨边机100对液晶面板200的切割边缘进行导角加工时，可将液晶面板200放置于传送装置上，并令其需要进行导角加工的切割边缘230的第一切割边缘231对应第一砂轮组111的第一砂轮111a及第二砂轮组112的第三砂轮112a，令其需要进行导角加工的切割边缘230的第二切割边缘232对应第二砂轮111b及第四砂轮112b，令其需要进行整型加工的全切割面240的第一切割面241及第二切割面242分别对应第一整型砂轮121及第二整型砂轮122的外表面。在该过程中，可通过控制组件对导角砂轮组件110及整型砂轮组件120中的各个砂轮的位置进行微调，从而使得导角砂轮组件110及整型砂轮组件120可对液晶面板200进行精确的研磨加工。而后，传送装置运作以带动液晶面板200沿图9中所示的Y方向前进移动，导角砂轮组件110同时开始运转以对对应的切割边缘230第一切割边缘231及第二切割边缘232进行研磨加工，以磨削掉第一切割边缘231及第二切割边缘232上的锋利部分。在该过程中，第一砂轮111a及第二砂轮111b的外表面分别与第一切割边缘231及第二切割边缘232之间产生摩擦力，从而带动液晶面板200沿图9中所示的X方向靠近导角砂轮组件110一预设距离，如此，可实现控制被导角砂轮组件110所研磨到的第一切割边缘231及第二切割边缘232在X方向上具有预设的宽度。由于第一砂轮组111中的两个砂轮在液晶面板200的推进方向，也即Y方向相互错开，因此，可避免第一砂轮111a及第二砂轮111b将该对应的切割边缘230的厚度研磨至零而使得液晶面板200无法在导角砂轮组件110的作用下沿X方向移动。当液晶面板200沿Y方向移动至对应第二砂轮组112时，第二砂轮组112亦开始运转并对经过了第一砂轮组111研磨的第一切割边缘231及第二切割边缘232进行进一步的加工。
同时，整型砂轮组件120亦开始运转以对液晶面板200需要进行整型加工的全切割面240的第一切割面241及第二切割面242进行整型加工。由于整型砂轮组件120的第一整型砂轮121的磨料层121a的外表面抵压至第一切割面241及第二切割面242，因此，当第一整型砂轮121开始运转之后，第一整型砂轮121的磨料层121a可磨削掉第一切割面241及第二切割面242之间的段差，并同时磨削掉第一切割面241或第二切割面242上的异物，例如突起等。在该过程中，液晶面板200保持沿Y方向移动前进，令第一切割面241及第二切割面242上经过第一整型砂轮121的磨削加工处移动至对应第二整型砂轮122。由于第二整型砂轮122的外径大于第一整型砂轮121的外径，因此，第二整型砂轮122在X方向的延伸距离大于第一整型砂轮121在X方向上的延伸距离，使得第二整型砂轮122可对第一切割面241及第二切割面242进行进一步的整型加工。
本发明的磨边机100，通过将整型砂轮组件120设置于邻近导角砂轮组件110之处，使得在导角砂轮组件110对液晶面板200的对应的切割边缘230进行导角加工时，整型砂轮组件120可同时对液晶面板200上对应的全切割面240进行整型加工，以消除第一切割面241及第二切割面242之间的段差及异物，从而使得磨边机100可同时实现对液晶面板200的切割边缘倒角加工及全切割面的整型加工。另外，即使对应于液晶面板200的非全切割面，磨边机100亦可在实现对切割边缘230进行导角加工的同时实现对TFT侧基板210的第一切割面241的整型加工以消除第一切割面241上的异物。如此，则无需对导角加工的液晶面板200进行再次的整型加工，减少了对液晶面板200进行整型加工所需的人力及物力，提高了液晶面板200的产能。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种液晶面板磨边机，用于对液晶面板进行研磨加工，其特征在于，该磨边机包括导角砂轮组件及整型砂轮组件，该导角砂轮组件对应该液晶面板的切割边缘，对该切割边缘进行导角加工以磨削掉该切割边缘上锋利的部分，该整型砂轮组件对应该液晶面板的全切割面，对该全切割面进行整型加工以消除该全切割面上存在的段差及异物。
  2. 如权利要求1所述的磨边机，其特征在于，该切割边缘包括形成于所述液晶面板的TFT侧基板上的第一切割边缘及形成于所述液晶面板的CF侧基板上的第二切割边缘，所述导角砂轮组件包括第一砂轮组，所述第一砂轮组包括分别对应该第一切割边缘及该第二切割边缘的第一砂轮及第二砂轮。
  3. 如权利要求2所述的磨边机，其特征在于，所述第一砂轮及所述第二砂轮在所述液晶面板的推进方向上相互错开设置。
  4. 如权利要求3所述的磨边机，其特征在于，所述导角砂轮组件还包括至少一个第二砂轮组，用于对经过第一砂轮组加工的该液晶面板的对应切割边缘进行进一步的研磨加工，各所述第二砂轮组包括第三砂轮及第四砂轮，所述第三砂轮对应所述第一切割边缘且与所述第一砂轮平行间隔设置，所述第四砂轮对应所述第二切割边缘且与所述第二砂轮平行间隔设置。
  5. 如权利要求4所述的磨边机，其特征在于，所述第一砂轮及所述第三砂轮的转动方向相同，所述第二砂轮及所述第四砂轮的转动方向相同并与所述第一砂轮和/或所述第三转动砂轮的转动方向相反。
  6. 如权利要求1任一项所述的磨边机，其特征在于，所述全切割面包括形成所述液晶面板的TFT侧基板上的第一切割面及形成于所述液晶面板的CF侧基板上的第二切割面，所述整型砂轮组件包括邻近该导角砂轮组件设置并分别对应该第一切割面及该第二切割面的第一整型砂轮，该第一整型砂轮用于消除该第一切割面及该第二切割面之间存在的段差以使该第一切割面及该第二切割面保持在同一水平面上。
  7. 如权利要求6所述的磨边机，其特征在于，所述整型砂轮组件还包括至少一个第二整型砂轮，所述至少一个第二整型砂轮与所述第一整型砂轮平行间隔设置，用于对经过第一整型砂轮整型加工过的该第一切割面及该第二切割面进行进一步的整型加工。
  8. 如权利要求7所述的磨边机，其特征在于，所述第一整型砂轮及所述至少一个第二整型砂轮的外表面上涂覆有磨料层。
  9. 如权利要求7所述的磨边机，其特征在于，所述至少一个第二整型砂轮的外径大于所述第一整型砂轮的外径。
  10. 如权利要求6所述的磨边机，其特征在于，还包括控制组件，该控制组件连接至所述导角砂轮组件及所述整型砂轮组件，用于控制所述导角砂轮组件及所述整型砂轮组件移动至对应所述液晶面板所需研磨加工的该切割边缘及该全切割面。
  11. 一种磨边机，用于对液晶面板进行研磨加工，所述液晶面板形成有至少一个切割边缘及至少一个全切割面，其特征在于，该磨边机包括第一砂轮组及第一整型砂轮，该第一砂轮组对应该切割边缘并对该切割边缘进行导角加工，该第一整型砂轮对应该全切割面，对该全切割面进行整型加工以消除该全切割面上的段差及异物。
  12. 如权利要求11所述的磨边机，其特征在于，所述切割边缘包括形成于所述液晶面板的TFT侧基板上的第一切割边缘及形成于所述液晶面板的CF侧基板上的第二切割边缘，所述第一砂轮组包括分别对应该第一切割边缘及该第二切割边缘并分别对该第一切割边缘及该第二切割边缘进行导角加工的第一砂轮及第二砂轮。
  13. 如权利要求12所述的磨边机，其特征在于，所述第一砂轮及所述第二砂轮在所述液晶面板的推进方向上相互错开设置。
  14. 如权利要求13所述的磨边机，其特征在于，所述第一砂轮及所述第二砂轮的转动方向相反。
  15. 如权利要求12所述的磨边机，其特征在于，所述磨边机还包括至少一个与所述第一砂轮组平行设置的第二砂轮组，所述第二砂轮组与所述第一砂轮组在所述液晶面板的推进方向上相互错开设置，对经过所述第一砂轮组加工的对应切割边缘进行进一步的研磨加工。
  16. 如权利要求11所述的磨边机，其特征在于，所述全切割面包括形成于所述液晶面板的TFT侧基板上的第一切割面及形成于所述液晶面板CF侧基板上的第二切割面，所述第一整型砂轮对该第一切割面及该第二切割面进行加工而使该第一切割面及该第二切割面相互平齐。
  17. 如权利要求16所述的磨边机，其特征在于，所述第一整型砂轮的外表面上涂覆有磨料层。
  18. 如权利要求16所述的磨边机，其特征在于，所述磨边机还包括至少一个第二整型砂轮，该第二整型砂轮与所述第一整型砂轮平行间隔设置，用于对经过该第一整型砂轮整型加工过的该第一切割面及该第二切割面进行进一步的整型加工。
  19. 如权利要求18所述的磨边机，其特征在于，所述第二整型砂轮的外径大于所述第一整型砂轮的外径。
  20. 如权利要求16所述的磨边机，其特征在于，所述磨边机还包括控制组件，该控制组件连接至第一砂轮组及所述第一整型砂轮，用于控制所述第一砂轮组及所述第一整型砂轮移动至对应所述液晶面板所需研磨加工的该切割边缘及该全切割面。
PCT/CN2012/081711 2012-09-17 2012-09-21 液晶面板磨边机 Ceased WO2014040309A1 (zh)

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