WO2014038320A1 - ガラス基板の研磨方法 - Google Patents
ガラス基板の研磨方法 Download PDFInfo
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- WO2014038320A1 WO2014038320A1 PCT/JP2013/070777 JP2013070777W WO2014038320A1 WO 2014038320 A1 WO2014038320 A1 WO 2014038320A1 JP 2013070777 W JP2013070777 W JP 2013070777W WO 2014038320 A1 WO2014038320 A1 WO 2014038320A1
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- WIPO (PCT)
- Prior art keywords
- polishing
- glass substrate
- grindstone
- abrasive grains
- glass
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/02—Wheels in one piece
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
Definitions
- the present invention relates to a method for polishing a glass substrate.
- display glasses such as cover glasses for protecting displays in portable devices such as mobile phones such as smartphones and personal digital assistants (PDAs).
- display glasses such as cover glasses for protecting displays in portable devices such as mobile phones such as smartphones and personal digital assistants (PDAs).
- PDAs personal digital assistants
- technology for reducing the thickness and weight of portable devices is required, and the display glass is becoming lighter and thinner.
- the strength is lowered. Therefore, a glass for display having higher strength than before is required.
- Patent Document 1 In order to ensure the strength of the glass substrate and display glass, a polishing method combining polishing using a chamfering machine and brush polishing is employed as disclosed in Patent Document 1, for example.
- Patent Document 1 has a problem in that a plurality of processes are combined, which makes the process complicated and costly.
- a method for polishing a glass substrate in which the processing steps are simple and the glass substrate can have sufficient strength.
- the second polishing grindstone includes polishing abrasive grains including cerium oxide abrasive grains having a particle diameter of 0.5 to 10 ⁇ m and diamond abrasive grains having a particle diameter of 0.5 to 10 ⁇ m, and an elastic modulus of 2.5 to 3 GPa.
- a bond made of a polyimide resin, A method for polishing a glass substrate is provided.
- the glass substrate to which the glass substrate polishing method of the present embodiment can be applied is not particularly limited, and includes, for example, a TFT (Thin Film Transistor) substrate, a PDP (Plasma Display Panel) glass substrate, and an FED (Field).
- TFT Thin Film Transistor
- PDP Plasma Display Panel
- FED Field
- the present invention can be applied to various glass substrates such as glass substrates for Emission Display), glass substrates for magnetic recording media, and cover glasses.
- the glass substrate of the glass substrate to which the glass substrate polishing method of the present embodiment can be applied is manufactured by a method such as a float method, a fusion method, a redraw method, or a press molding method.
- a method such as a float method, a fusion method, a redraw method, or a press molding method.
- the form is not limited in this respect.
- the glass substrate polishing method of the present embodiment can also be applied to chemically strengthened glass obtained by chemically strengthening a glass substrate.
- the glass base plate may be applied to chemically strengthened glass cut to a predetermined size for a desired use.
- the glass base plate is cut to a predetermined size for a desired use.
- the present invention may be applied to chemically strengthened chemically strengthened glass. After chemically strengthening a glass base plate, the method of cutting to a predetermined size for a desired application is usually compared with the method of cutting the glass base plate to a predetermined size for a desired application and then chemically strengthening. Although it has high productivity, it has a feature that cutting is technically difficult.
- Chemically tempered glass is glass in which the surface of the glass is ion-exchanged to form a surface layer in which compressive stress remains. Specifically, by ion exchange on the surface of the glass, ions having a small ion radius (for example, Li ions and Na ions) contained in the glass are replaced with ions having a large ion radius (for example, K ions). . Thereby, compressive stress remains on the surface of the glass, and the strength of the glass is improved.
- ions having a small ion radius for example, Li ions and Na ions
- FIG. 1 is a schematic diagram showing a thickness direction distribution of residual stress S of a glass plate after chemical strengthening.
- S1 is the maximum residual compressive stress of one surface layer (referred to as a surface layer) of the glass plate
- D1 is the thickness of the surface layer
- D2 is the thickness of the back surface layer
- D is the thickness of the glass plate
- T is the average residual tensile stress of the intermediate layer existing between the surface layer and the back surface layer.
- the compressive stress remaining in the front surface layer and the back surface layer tends to gradually decrease from the front surface and the back surface toward the inside.
- an intermediate layer in which a tensile stress remains is formed between the front surface layer and the back surface layer. At this time, the tensile stress remaining in the intermediate layer is substantially constant.
- FIG. 2 shows a schematic diagram for explaining the glass plate after chemical strengthening. More specifically, FIG. 2 (a) is a schematic diagram before cutting the glass plate after chemical strengthening, and FIG. 2 (b) is a schematic diagram after cutting the glass plate after chemical strengthening.
- the glass layer after chemical strengthening has a compressive stress layer on the front surface layer and the back surface layer, and between the front surface layer and the back surface layer.
- the existing intermediate layer is a tensile stress layer.
- the tensile stress layer is exposed on the surface of the cut surface.
- stress acts on the tensile stress layer of the glass plate after cutting it may be broken even with a smaller force than usual. Therefore, in the case of the embodiment in which the glass plate after chemical strengthening is cut, it is preferable that the glass substrate is polished by the glass substrate polishing method of the present embodiment, which will be described later, to have sufficient strength.
- the polishing wheel usually has polishing abrasive grains and a bond for fixing the polishing abrasive grains.
- polishing is performed using a polishing grindstone having polishing abrasive grains having an average particle size larger than that of the polishing grindstone used in the second polishing step described later.
- the average grain size of the abrasive grains used in the first polishing step is 5 to 10 ⁇ m (# 2000 in the grinding wheel count) or more.
- the type of abrasive grains of the polishing wheel that can be used in the first polishing step is not particularly limited, and for example, cerium oxide, silicon oxide, diamond, chromium oxide, aluminum oxide, zirconium, silicon carbide, and the like can be used.
- the electrodeposition grindstone formed by adhering a vitrified bond, a metal bond, a resin bond, an abrasive grain, etc. can be used. .
- the above-described first polishing grindstone is polished while changing the pressing force according to the shape of the main surface or end surface (outer peripheral side surface portion, outer peripheral chamfered portion, etc.) of the glass substrate.
- a sizing process is preferred.
- the dimensions of the glass are accurately measured by sizing polishing. It is preferable to perform polishing in advance because precise dimensional control is not necessary in the subsequent polishing in the second polishing step.
- outer peripheral side surface portion and the outer peripheral chamfered portion referred to here refer to all surfaces on the outer peripheral side of the glass plate that are not parallel to the main surface of the glass plate, and the shape thereof is a curved surface. Also good. In the first polishing step, chamfering and polishing may be performed simultaneously.
- polishing step Subsequent to the first polishing step described above, a second polishing step is performed as a finishing step.
- polishing is performed by mixing cerium oxide abrasive grains having an average particle diameter of 0.5 to 10 ⁇ m and diamond abrasive grains having an average particle diameter of 0.5 to 10 ⁇ m. Abrasive grains mixed with abrasive grains.
- the average particle size of the abrasive grains can be measured using, for example, a laser diffraction particle size measuring device.
- examples of the bond that can be used in the second polishing step include a polyimide resin having an elastic modulus of 2.5 to 3 GPa at 20 ° C.
- the elastic modulus of the bond can be measured using, for example, a dynamic viscoelasticity measuring device.
- a brush polishing method or a method of further polishing using a grindstone has been employed in order to further improve the strength.
- the brush polishing method has a problem that the conveyance of the glass substrate is complicated.
- the method of further polishing using a grindstone can be carried out only by exchanging the grindstone after the first step, but has a problem that the processing time becomes long and is not practical.
- the inventor of the present invention improves the strength of a glass substrate in a short time in a polishing method using a grindstone by using a grindstone using a polyimide resin having an elastic modulus of 2.5 to 3 GPa as a bond.
- a glass substrate having a bending strength of 500 MPa or more can be finished by polishing using the above-described polishing grindstone. If the elastic modulus is larger than the above-mentioned range, the treatment time becomes long. If the elastic modulus is smaller than the above-mentioned range, the life of the grinding wheel is shortened and it is not practical. In addition, a glass substrate having sufficient strength after polishing may not be obtained.
- the diamond abrasive grain content (V1) in the bond is preferably 10 vol% to 20 vol%, and the cerium oxide abrasive content (V2) in the bond is 5 vol% to 30 vol%. Is preferred.
- V1 is less than 10 vol% or V2 is less than 5 vol%, it may not be possible to secure a sufficient amount of polishing, so mechanical polishing with cerium oxide abrasive that performs polishing by chemical reaction
- the diamond abrasive grains for performing the above are contained in the predetermined ranges. Further, when the sum of V1 and V2 exceeds 30 vol%, the polishing performance as a polishing grindstone may be lowered. Therefore, it is more preferable to satisfy V1 + V2 ⁇ 30%.
- the second polishing step may be a fixed-size polishing step in which the second polishing grindstone described above is polished while changing the pressing force according to the shape of the main surface or end face of the glass substrate. It may be a constant pressure polishing step in which the second polishing grindstone is pressed against the main surface or end surface of the glass substrate with a constant force for polishing.
- the second polishing step it is preferable that polishing is performed until the surface roughness Ra of the main surface or the end surface of the glass substrate is 8 nm or less, depending on the type of the glass substrate to be used.
- polishing unit Next, an example of a polishing unit that can carry out the polishing method of this embodiment will be described. However, in the present embodiment, the first polishing step for polishing the glass substrate using the first polishing grindstone and the second polishing grindstone having an average particle size smaller than that of the first polishing grindstone are used.
- a second polishing step for polishing a glass substrate wherein the second polishing grindstone is a cerium oxide abrasive having an average particle size of 0.5 to 10 ⁇ m and a diamond having an average particle size of 0.5 to 10 ⁇ m
- the polishing unit is not limited to the following configuration as long as it includes abrasive grains including abrasive grains and a bond made of a polyimide resin having an elastic modulus of 2.5 to 3 GPa.
- first polishing step and the second polishing step may be polished using different polishing apparatuses. After the first polishing step, the first polishing grindstone is used as the second polishing grindstone. It is possible to change and polish with the same polishing apparatus.
- FIG. 3 shows a schematic diagram of an example of a polishing unit of the polishing apparatus of this embodiment.
- the polishing unit 100 is attached to the shaft 1 via a horizontal rotation arm (not shown) of a polishing apparatus main body (not shown).
- the shaft 1 is rotationally driven by a servo motor 2.
- a bearing 4 is arranged in a vertical direction, and a spindle 5 is pivotally supported.
- a grindstone 6 is attached to the front end of the spindle 5, and the rear end is coupled to a shaft of a drive motor 7 attached to the outside of the housing via pulleys 8 a and 8 b and a belt 9.
- the bearing 4 is mounted in the housing 3 through the slide guide 10 so as to be slidable in the horizontal direction. Further, the bearing 4 may be configured to be displaceable in the horizontal direction by expansion and contraction of a pneumatic cylinder (not shown).
- a tensioner 11 that presses the side surface is provided on the side surface of the belt 9. Along with the displacement of the bearing 4, the tensioner 11 is configured to absorb fluctuations in the length of the belt 9 that is stretched.
- Example 1 to Example 8 Next, an embodiment in which the outer peripheral chamfered portion of the glass plate is polished will be described with reference to examples.
- a present Example demonstrates the method of grind
- this Embodiment is not limited in this point.
- the polishing method of the present embodiment can be applied to a method of polishing the main surface, outer peripheral side surface, and the like of a glass substrate.
- Table 1 shows the conditions of the grinding wheel used in the second polishing step in Examples 1 to 8.
- Example 1 in Table 1 is the conditions for the polishing method of the present embodiment, and Examples 2 to 7 are conditions for the polishing method of the reference example.
- # 3000 has an average particle diameter of 4 to 8 ⁇ m
- # 2000 has an average particle diameter of 5 to 10 ⁇ m
- # 1000 has an average particle diameter of 14 to 22 ⁇ m
- the elastic modulus of the bond was measured at 21 ° C.
- the grinding stones of Examples 1 to 3 have a polishing abrasive grain 1 content of 20 wt% and the polishing abrasive grain 2 content of 5 wt%.
- the content is 25 wt%.
- FIG. 4 is a schematic view for explaining the polishing method of the present embodiment. More specifically, FIG. 4 is a diagram for explaining a method of polishing the outer peripheral chamfered portion of the glass plate 20 that is a base plate, and is a schematic view around the polishing grindstone 6 of FIG.
- An annular grinding groove 32 extending in the circumferential direction is formed on the outer peripheral surface 31 of the polishing grindstone 6.
- the wall surface portion of the grinding groove 32 corresponds to an abrasive grain portion.
- the polishing grindstone 6 used in the first polishing step has polishing abrasive grains having an average particle size larger than that of the polishing grindstone used in the subsequent second polishing step.
- a polishing grindstone 6 was attached, and the outer peripheral chamfered portion of the glass plate 20 was polished.
- a polishing grindstone having diamond abrasive grains having an average particle diameter of 14 to 22 ⁇ m and a bond of polyimide and metal is mounted, and the outer peripheral chamfered portion of the glass plate 20 is mounted. Polished.
- the polishing grindstone 6 is relatively moved along the outer edge of the glass plate 20 while being rotated around the center line of the polishing grindstone 6, and the outer peripheral chamfered portion of the glass plate 20 is polished by the wall surface of the grinding groove 32. At this time, it is preferable to advance the polishing by constant-size polishing in which the polishing grindstone 6 is polished while changing the pressing force according to the shape of the glass substrate.
- a cooling liquid such as water may be used.
- polishing wheel 6 was changed to the second polishing wheel 6 including the polishing grains and bonds shown in Table 1.
- polishing grindstone 6 is relatively moved along the outer edge of the glass plate 20 while being rotated around the center line of the polishing grindstone 6, and the outer peripheral chamfered portion of the glass plate 20 is ground to the grinding groove 32. Polish on the wall.
- polishing may be progressed by fixed-size polishing in which polishing is performed while changing the force for pressing the polishing grindstone 6 according to the shape of the glass substrate, and the second polishing grindstone is moved to the glass substrate with a constant force. Polishing may be carried out by constant pressure polishing in which pressing is applied to the surface.
- a cooling liquid such as water may be used during polishing.
- the polishing is advanced until the surface roughness Ra of the glass substrate is preferably 8 nm or less, and the polishing is finished.
- bending strength was measured by the 4-point bending test. Specifically, a chevron-type notch was formed at the center of a test piece having a thickness of 0.7 mm, a width of 50 mm, and a length of 100 mm. Using a Tensilon type strength tester, a bending test was conducted at a crosshead speed of 1 mm / min so that stable fracture occurred from the notch tip of the test piece supported at a span of 30 mm. The upper span in the 4-point bending test was 10 mm.
- Table 1 also shows the results of evaluation by the above-described evaluation method on the glass substrates obtained in Examples 1 to 8.
- the polishing methods of the reference examples of Examples 2 to 5 are not practical because the processing time (polishing time) required to obtain sufficient bending strength is long. Further, the glass substrates obtained by the polishing methods of Examples 6 to 8 have a large surface roughness and insufficient bending strength.
- the first polishing step of polishing the glass substrate using the first polishing grindstone, and the second polishing grindstone having an average particle size smaller than that of the first polishing grindstone are used.
- a second polishing step for polishing a glass substrate, wherein the second polishing wheel is a cerium oxide abrasive having an average particle size of 0.5 to 10 ⁇ m and a diamond having an average particle size of 0.5 to 10 ⁇ m By polishing the glass substrate by a polishing method including abrasive grains including abrasive grains and a bond made of a polyimide resin having an elastic modulus of 2.5 to 3 GPa, the glass substrate is sufficiently processed in a simple processing step. Can be given strong strength.
Abstract
Description
前記第1の研磨砥石よりも平均粒径が小さい第2の研磨砥石を用いて前記ガラス基板を研磨する第2の研磨工程と、
を有し、
前記第2の研磨砥石は、粒径が0.5~10μmの酸化セリウム砥粒及び粒径が0.5~10μmのダイヤモンド砥粒を含む研磨砥粒と、弾性率が2.5~3GPaであるポリイミド樹脂から成るボンドと、を含む、
ガラス基板の研磨方法が提供される。
2 サーボモータ
3 ハウジング
4 軸受
5 スピンドル
6 砥石
7 駆動モータ
8 プーリー
9 ベルト
10 スライドガイド
11 テンショナー
20 ガラス板
100 研磨ユニット
本実施の形態のガラス基板の研磨方法を適用することができるガラス基板としては、特に制限はなく、例えば、TFT(Thin Film Transistor)用基板、PDP(Plasma Display Panel)用ガラス基板、FED(Field Emission Display)用ガラス基板、磁気記録媒体用ガラス基板、カバーガラスなどの各種ガラス基板に適用することができる。
研磨砥石は、通常、研磨砥粒と該研磨砥粒を固定するボンドとを有する。第1の研磨工程では、後述する第2の研磨工程で使用する研磨砥石の研磨砥粒よりも、平均粒径が大きい研磨砥粒を有する研磨砥石を使用して研磨する。通常、第1の研磨工程で使用する研磨砥石の砥粒の平均粒径は5~10μm(砥石番手において♯2000)以上である。
上記した第1の研磨工程に続いて、仕上げの工程として第2の研磨工程を実施する。
次に、本実施形態の研磨方法を実施することができる研磨ユニットの例について説明する。しかしながら、本実施の形態では、ガラス基板を第1の研磨砥石を用いて研磨する第1の研磨工程と、前記第1の研磨砥石よりも平均粒径が小さい第2の研磨砥石を用いて前記ガラス基板を研磨する第2の研磨工程と、を有し、前記第2の研磨砥石は、平均粒径が0.5~10μmの酸化セリウム砥粒及び平均粒径が0.5~10μmのダイヤモンド砥粒を含む研磨砥粒と、弾性率が2.5~3GPaであるポリイミド樹脂から成るボンドと、を含むものであれば、下記構成の研磨ユニットに限定されない。
次に、ガラス板の外周面取り部を研磨する実施形態について、実施例を参照して説明する。なお、本実施例においては、ガラス板の外周面取り部を研磨する方法について説明するが、本実施の形態はこの点において限定されない。例えば、本実施形態の研磨方法は、ガラス基板の主表面や外周側面部などを研磨する方法などに応用することができる。
・曲げ強度
本実施形態において曲げ強度は、4点曲げ試験により測定した。具体的には、厚み0.7mm、幅50mm、長さ100mmの試験片の中央部にシェブロン型ノッチを形成した。テンシロン型強度試験装置を用いて、スパン30mmに支持した試験片のノッチ先端から安定破壊が起こるようにクロスヘッド速度1mm/分で曲げ試験を行った。なお、4点曲げ試験における上スパンは10mmとした。
ガラス基板の表面粗さは、触針式の表面粗さ計(Veeco社製Multimode V SPM-Nanoscope V controller)を用いて測定した。なお、測定値は、ガラス板から任意6箇所の表面粗さを測定し、その平均値で示した。
Claims (6)
- ガラス基板を第1の研磨砥石を用いて研磨する第1の研磨工程と、
前記第1の研磨砥石よりも平均粒径が小さい第2の研磨砥石を用いて前記ガラス基板を研磨する第2の研磨工程と、
を有し、
前記第2の研磨砥石は、平均粒径が0.5~10μmの酸化セリウム砥粒及び平均粒径が0.5~10μmのダイヤモンド砥粒を含む研磨砥粒と、弾性率が2.5~3GPaであるポリイミド樹脂から成るボンドと、を含む、
ガラス基板の研磨方法。 - 前記ボンド中における、前記ダイヤモンド砥粒の含有量は10vol%~20vol%であり、前記酸化セリウム砥粒の含有量は5vol%~30vol%である、
請求項1に記載のガラス基板の研磨方法。 - 前記ボンド中における、前記ダイヤモンド砥粒の含有量と前記酸化セリウム砥粒の含有量の和が30vol%以下である、請求項2に記載のガラス基板の研磨方法。
- 前記第1の研磨工程は、前記第1の研磨砥石を前記ガラス基板の形状に応じて押し付ける力を変化させながら研磨を行う定寸研磨工程であり、
前記第2の研磨工程は、前記第2の研磨砥石を一定の力で前記ガラス基板に押し付けて研磨を行う定圧研磨工程である、
請求項1乃至3のいずれか一項に記載のガラス基板の研磨方法。 - 前記第1の研磨工程は、前記第1の研磨砥石を前記ガラス基板の形状に応じて押し付ける力を変化させながら研磨を行う定寸研磨工程であり、
前記第2の研磨工程も、前記第2の研磨砥石を前記ガラス基板の形状に応じて押し付ける力を変化させながら研磨を行う定寸研磨工程である、
請求項1乃至3のいずれか一項に記載のガラス基板の研磨方法。 - 前記第2の研磨工程により前記ガラス基板の表面粗さRaを8nm以下にする、
請求項1乃至5のいずれか一項に記載のガラス基板の研磨方法。
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WO2018140421A1 (en) * | 2017-01-24 | 2018-08-02 | Corning Incorporated | Methods and apparatus for finishing edges of glass sheets |
WO2019187878A1 (ja) * | 2018-03-26 | 2019-10-03 | 日本電気硝子株式会社 | 板ガラスの製造方法および製造装置 |
JP2019166616A (ja) * | 2018-03-26 | 2019-10-03 | 日本電気硝子株式会社 | 板ガラスの製造方法および製造装置 |
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CN108883518B (zh) * | 2016-03-25 | 2020-01-07 | 阪东化学株式会社 | 研磨材 |
JP7074644B2 (ja) * | 2018-10-31 | 2022-05-24 | 信越化学工業株式会社 | 合成石英ガラス基板の研磨用研磨粒子の製造方法、並びに合成石英ガラス基板の研磨方法 |
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- 2013-07-31 JP JP2014534246A patent/JP6011627B2/ja not_active Expired - Fee Related
- 2013-07-31 WO PCT/JP2013/070777 patent/WO2014038320A1/ja active Application Filing
- 2013-07-31 CN CN201380039310.8A patent/CN104487395A/zh active Pending
- 2013-08-22 TW TW102130084A patent/TW201414575A/zh unknown
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018140421A1 (en) * | 2017-01-24 | 2018-08-02 | Corning Incorporated | Methods and apparatus for finishing edges of glass sheets |
WO2019187878A1 (ja) * | 2018-03-26 | 2019-10-03 | 日本電気硝子株式会社 | 板ガラスの製造方法および製造装置 |
JP2019166616A (ja) * | 2018-03-26 | 2019-10-03 | 日本電気硝子株式会社 | 板ガラスの製造方法および製造装置 |
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JP2019166617A (ja) * | 2018-03-26 | 2019-10-03 | 日本電気硝子株式会社 | 板ガラスの製造方法および製造装置 |
JP7022330B2 (ja) | 2018-03-26 | 2022-02-18 | 日本電気硝子株式会社 | 板ガラスの製造方法および製造装置 |
JP7022329B2 (ja) | 2018-03-26 | 2022-02-18 | 日本電気硝子株式会社 | 板ガラスの製造方法および製造装置 |
Also Published As
Publication number | Publication date |
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KR20150053745A (ko) | 2015-05-18 |
JP6011627B2 (ja) | 2016-10-19 |
CN104487395A (zh) | 2015-04-01 |
TW201414575A (zh) | 2014-04-16 |
JPWO2014038320A1 (ja) | 2016-08-08 |
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