WO2014036899A1 - 用于触控面板的盖板结构及其制造方法与触控面板 - Google Patents

用于触控面板的盖板结构及其制造方法与触控面板 Download PDF

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Publication number
WO2014036899A1
WO2014036899A1 PCT/CN2013/082277 CN2013082277W WO2014036899A1 WO 2014036899 A1 WO2014036899 A1 WO 2014036899A1 CN 2013082277 W CN2013082277 W CN 2013082277W WO 2014036899 A1 WO2014036899 A1 WO 2014036899A1
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WIPO (PCT)
Prior art keywords
touch panel
substrate
connecting lines
sensing electrode
sensing electrodes
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PCT/CN2013/082277
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English (en)
French (fr)
Inventor
江耀诚
严建斌
吴德发
陈�峰
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宸鸿科技(厦门)有限公司
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Publication of WO2014036899A1 publication Critical patent/WO2014036899A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/169—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes
    • G06F1/1692—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes the I/O peripheral being a secondary touch screen used as control interface, e.g. virtual buttons or sliders
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
    • G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
    • G06F3/03547—Touch pads, in which fingers can move on a surface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1043—Subsequent to assembly
    • Y10T156/1044—Subsequent to assembly of parallel stacked sheets only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Definitions

  • the present invention relates to touch technology, and in particular to a touch panel structure for a touch panel, a manufacturing method thereof, and a touch panel for use thereof.
  • Touch panels have been widely used in electronic products such as household goods, communication devices and electronic information devices, and gradually replace physical keyboards, mice, etc. as input interfaces for various electronic products, providing an efficient operation interface.
  • the touch panel usually includes a protective cover for providing a direct touch operation to the touch sensor of the touch panel. And for aesthetic design, the surface of the protective cover further forms a shielding layer to shield non-transparent components such as peripheral conductive lines of the touch panel. However, due to the design of the shielding layer, the surface of the protective cover is formed with a height drop, which will affect the production yield and product quality of the touch panel.
  • FIG. 1A is a schematic cross-sectional view of a conventional touch panel.
  • the touch panel of FIG. 1A is a solution that is adhered, for example, by using a protective cover 102 and a touch sensor 103.
  • the bonding surface of the protective cover 102 is provided with a shielding layer 104, and the protective cover 102 is further passed through the optical adhesive 106 to be attached to the touch sensor 103.
  • the bonding air bubbles 108 generated during the bonding are not easily excluded.
  • FIG. 1B is a schematic cross-sectional view of another conventional touch panel.
  • the touch panel of FIG. 1B is a solution for directly forming the sensing electrode layer 124 originally formed on another substrate on the protective cover 102.
  • the shielding layer 104 is formed on the protective cover 102 first, the sensing electrode layer 124 is formed on the protective cover 102 and the shielding layer 104 in compliance.
  • the mask layer 104 formed first easily generates impurities in a high temperature environment and affects the characteristics of the sensing electrode layer 124.
  • the sensing electrode layer 124 is easily broken or interrupted at the junction 130 of the protective cover 102 and the shielding layer 104 to form an open circuit.
  • the invention improves the cover structure of the touch panel, so that the cover structure provides a flat surface to fit the touch sensor or form the sensing electrode layer, thereby improving the production yield and product quality of the touch panel.
  • a cover structure for a touch panel includes: a substrate; and a shielding layer embedded in the substrate, and the shielding area of the shielding layer defines the touch A non-visible area of the panel.
  • the substrate is a strengthened substrate.
  • the material of the shielding layer comprises any one or combination of ink, carbon paste, and graphite.
  • a method for manufacturing a cover structure is provided.
  • the cover structure is used for a touch panel.
  • the manufacturing method includes the steps of: providing a shielding layer on a first transparent plate and a first Between the two transparent plates, wherein the shielding area of the shielding layer defines an invisible area of the touch panel; heating and softening the first transparent plate and the second transparent plate to make the first transparent plate and the second The transparent sheet is melted into a substrate; and the substrate is shaped.
  • the step of the manufacturing method includes strengthening the shaped substrate.
  • first transparent plate and the second transparent plate are plates of the same material.
  • the heating step is heated to exceed the material conversion temperature of the first transparent plate and the second transparent plate to soften the first transparent plate and the second transparent plate.
  • the sizing step uses a mold pressurization method to shape and fix the shape of the substrate.
  • a touch panel includes: a substrate; a shielding layer embedded in the substrate; and the shielding area of the shielding layer defines a non-visible of the touch panel And a sensing electrode layer formed on at least one surface of the substrate.
  • the substrate is a strengthened substrate.
  • the sensing electrode layer includes a sensing electrode matrix and a signal line, wherein the signal line is electrically connected to the sensing electrode matrix, and correspondingly located in the non-visible area.
  • the sensing electrode matrix further includes a plurality of first sensing electrodes arranged along a first axial direction and a plurality of second sensing electrodes arranged along a second axial direction, wherein the first sensing electrodes and the first sensing electrodes The second sensing electrodes are insulated from each other.
  • each of the first sensing electrodes includes a plurality of first conductive units and a plurality of first connecting lines, and the two adjacent first conductive units in the first axial direction are a connecting line connected and electrically connected;
  • each of the second sensing electrodes includes a plurality of second conductive units and a plurality of second connecting lines, and two adjacent second conductive lines in the second axial direction The unit is connected and electrically connected by the second connecting line; wherein the first connecting line and the second connecting line form an interlace.
  • the sensing electrode layer further includes: an insulating layer disposed between each of the first connecting lines and each of the second connecting lines; and a protective layer disposed on the a sensing electrode, the second sensing electrode, and the signal line.
  • a touch panel includes: a substrate; a shielding layer embedded in the substrate; and the shielding area of the shielding layer defines a non-visible of the touch panel And a touch sensor that is attached to a surface of the substrate through an optical adhesive.
  • the substrate is a strengthened substrate.
  • the touch sensor further includes: a carrier substrate; and a sensing electrode layer formed on at least one surface of the carrier substrate, and includes a sensing electrode matrix and a signal line, wherein the signal line
  • the sensing electrode matrix is electrically connected and correspondingly located in the non-visible area.
  • the sensing electrode matrix further includes a plurality of first sensing electrodes arranged along a first axial direction and a plurality of second sensing electrodes arranged along a second axial direction, wherein the first sensing electrodes and the first sensing electrodes The second sensing electrodes are insulated from each other.
  • each of the first sensing electrodes includes a plurality of first conductive units and a plurality of first connecting lines, and the two adjacent first conductive units in the first axial direction are a connecting line connected and electrically connected;
  • each of the second sensing electrodes includes a plurality of second conductive units and a plurality of second connecting lines, and two adjacent second conductive lines in the second axial direction The unit is connected and electrically connected by the second connecting line; wherein the first connecting line and the second connecting line form an interlace.
  • the sensing electrode layer further includes: an insulating layer disposed between each of the first connecting lines and each of the second connecting lines; and a protective layer disposed on the a sensing electrode, the second sensing electrode, and the signal line.
  • FIGS. 1A and 1B are schematic cross-sectional views showing a touch panel of a prior art.
  • 2A-2D are cross-sectional views showing a method of fabricating a cover structure in various stages of fabrication in accordance with an embodiment of the present invention.
  • 3A and 3B are respectively a cross-sectional view and a top view of a touch panel according to an embodiment of the invention.
  • 4A and 4B are respectively a cross-sectional view and a top view of a touch panel according to another embodiment of the present invention.
  • FIGS. 2A-2D are cross-sectional views showing the cover structure at various stages of manufacture in accordance with an embodiment of the present invention.
  • the cover structure of the embodiment is used for a touch panel and is used as a protective cover of the touch panel (Cover) Lens), and defines a visible area V of the touch panel and a non-visible area NV.
  • a first transparent sheet 202A is first provided.
  • the first transparent plate 202A of the embodiment is designed by using a transparent glass plate, for example, and has a thickness of about 0.1 to 0.7. Mm and its glass transition temperature (glass transition The temperature) can be about 450 to 800 °C.
  • the material of the first transparent plate 202A may be made of a material of a thermoplastic material, such as acrylic, which is not limited by the present invention.
  • a shielding layer 204 is formed on the first transparent plate 202A.
  • the shielding layer 204 may be formed of a light shielding material having an optical density value of not more than 7, and the material of the shielding layer 204 may be any one or combination of ink, carbon paste, and graphite sheet. In terms of color, the shielding layer 204 may be, for example, black or other. Color design. It is worth mentioning that the shielding layer 204 of the present embodiment belongs to a high heat resistant material, and can still not be deformed and qualitatively changed when the temperature exceeds the material conversion temperature of the first transparent plate 202A.
  • the layout area of the shielding layer 204 of the embodiment is a non-visible area NV defining a touch panel for shielding peripheral conductive lines in the non-visible area NV of the touch panel.
  • Non-transparent component the shielding layer 204 may be formed in a peripheral region or other region of the surface of the first transparent plate 202A according to design requirements, and formed into a square, elongated, L-shaped, ⁇ -shaped or any other pattern. In this way, in the structure of the touch panel, other regions of the non-visible area NV defined corresponding to the layout area of the shielding layer 204 can be defined as the visible area V.
  • the thickness of the shielding layer 204 may be 1/100 to 1/10 of the thickness of the first transparent plate 202A, for example, about 7 to 10 Mm.
  • a second transparent plate 202B is disposed on the shielding layer 204 such that the shielding layer 204 is formed between the first transparent plate 202A and the second transparent plate 202B.
  • the region of the visible area V of the touch panel between the first transparent plate 202A and the second transparent plate 202B at the present stage has a gap 210.
  • the second transparent sheet 202B of the present embodiment is designed using the same material as the first transparent sheet 202A, thereby having the same material transition temperature.
  • the thickness of the second transparent plate 202B may also be the same thickness as the first transparent plate 202A (for example, 0.1 to 0.7) Mm).
  • the first transparent plate 202A and the second transparent plate 202B are heated to at least exceed their material conversion temperatures to soften the first transparent plate 202A and the second transparent plate 202B, and further the first transparent plate 202A.
  • the second transparent plate 202B is mutually fused into a substrate 220; the substrate 220 is then cooled and shaped to complete the article.
  • the melting process allows the softened first transparent plate 202A and the second transparent plate 202B to conformally fill the gap 210 formed between the two and cover the shielding layer 204 such that the shielding layer 204 is embedded in the substrate 220.
  • the first transparent plate 202A and the second transparent plate 202B do not need to be bonded by any adhesive colloid, and the shielding layer 204 is completely covered by the molten substrate 220.
  • the first transparent plate 202A and the second transparent plate 202B may be carried in a mold (not shown) having a flat bearing surface, and in the melting stage.
  • the shape of the substrate 220 is molded and fixed by a mold pressurization method, whereby the substrate 220 is fixed after cooling.
  • the formed substrate 220 can have a flat surface after cooling and setting by the pressurization of the mold having the flat bearing surface.
  • the process illustrated in FIGS. 2A through 2D can be further performed in a vacuum environment to avoid bubble generation during the melting process and to ensure the quality of the substrate 220.
  • the substrate 220 prepared in the embodiment is used as a cover structure of the touch panel, the substrate 220 can be further strengthened in the process to provide a harder protection. .
  • the strengthening step can be accomplished using a chemical ion exchange enhancement.
  • 3A and 3B are respectively a cross-sectional view and a top view of a touch panel according to an embodiment of the invention.
  • the touch panel of this embodiment includes a substrate 220 , a shielding layer 204 embedded in the substrate 220 , and a sensing electrode layer 324 formed on at least one surface of the substrate 220 .
  • the position in which the shielding layer 204 is embedded in the substrate 220 is not limited by the present invention, and may be embedded in the substrate 220 and located in the peripheral area or other areas, for example, in the embodiment of the cover structure.
  • the pattern of the shielding layer 204 is also not limited.
  • This embodiment belongs to the use of photolithography (Photolithography) A touch panel solution in which the sensing electrode layer 324 is formed directly on the flat lower surface of the substrate 220.
  • the substrate 220 is further a reinforced substrate 220 for simultaneously providing the sensing electrode layer 324 and the protective sensing electrode layer 324 in the structure of the touch panel for the user to touch. effect.
  • the sensing electrode layer 324 of this embodiment includes a sensing electrode matrix 324S and a signal line 328.
  • the signal line 328 is electrically connected to the sensing electrode matrix 324S, and corresponding to the non-visible area NV defined by the shielding layer 204 routing area, for transmitting the sensing electrode matrix 324S and other circuit components (not shown). Signal between.
  • other regions of the non-visible area NV defined corresponding to the layout area of the shielding layer 204 may be defined as the visible area V.
  • the sensing electrode matrix 324S includes a plurality of first sensing electrodes 324V arranged along a first axis and a plurality of second sensing electrodes 324H arranged along a second axis, wherein the first sensing electrodes 324V And the second sensing electrodes 324H are insulated from each other.
  • each of the first sensing electrodes 324V includes a plurality of first conductive units 324VA and a plurality of first connecting lines 324VB, wherein the first two adjacent first conductive units 324VA in the first axial direction are connected by the first connections
  • the line 324VB is connected and electrically connected
  • each second sensing electrode 324H includes a plurality of second conductive units 324HA and a plurality of second connecting lines 324HB, wherein the adjacent two second conductive units 324HA in the second axial direction are
  • the second connection lines 324HB are connected and electrically connected.
  • the first connection line 324VB and the second connection line 324HB are staggered.
  • the sensing electrode layer 324 further includes an insulating layer 326 and a protective layer 330.
  • the insulating layer 326 is disposed between each of the first connecting lines 324VB and each of the second connecting lines 324HB for electrically isolating the first sensing electrodes 324V and the second sensing electrodes 324H.
  • the protective layer 330 is disposed on the first sensing electrode 324V, the second sensing electrode 324H, and the signal line 328 for protecting the first sensing electrode 324V, the second sensing electrode 324H, and the signal line 328 from physical or chemical changes. Thereby, the first sensing electrode 324V and the second sensing electrode 324H corresponding to the visible area V of the touch panel can provide the function of touch sensing.
  • sensing electrode layer 324 described in this embodiment is only one example of a solution for directly forming the sensing electrode layer 324 on the substrate 220, and is not intended to limit the present invention, and is in the spirit of the present invention. Any modifications within the scope are within the scope of protection of the present invention.
  • the shielding layer 204 is embedded in the substrate 220 (eg, the shielding layer 204 does not contact the upper surface and the lower surface of the substrate 220), the substrate 220 can provide a flat bearing surface to form the sensing electrode layer. 324, the opportunity for the sensing electrode layer 324 to be disconnected is reduced, and there is no need to worry that the shielding layer 204 affects the sensing electrode layer 324 when the high-temperature process of the sensing electrode layer 324 is generated, thereby effectively improving the production yield of the touch panel. And product quality.
  • the non-visible area NV defined by the touch panel through the shielding layer 204 layout region can also smoothly shield the peripheral non-transparent components such as the signal line 328 of the sensing electrode layer 324.
  • FIG. 4A and 4B are schematic cross-sectional views and a top view of a touch panel according to another embodiment of the present invention.
  • the touch panel of the present embodiment includes a substrate 220, a shielding layer 204 embedded in the substrate 220, and a touch sensor 450 adhered to a surface of the substrate 220 through an optical adhesive 440.
  • the optical adhesive 440 can be, for example, a glue material using a liquid glue or a solid glue film.
  • the embodiment belongs to a touch panel solution for bonding the touch sensor 450 to the substrate 220 having a flat surface, and in an embodiment, the substrate 220 is more The reinforced substrate 220 is provided to protect the touch sensor 450 in the structure of the touch panel for the user to touch the operation.
  • the touch sensor 450 includes a carrier substrate 422 and a sensing electrode layer 424.
  • the carrier substrate 422 can be made of glass or polyester film.
  • the sensing electrode layer 424 is formed on at least one surface of the carrier substrate 422 and includes a sensing electrode matrix 424S and a signal line 428.
  • the signal line 428 is electrically connected to the sensing electrode matrix 424S, and corresponding to the non-visible area NV defined by the shielding layer 204 routing area, for transmitting the sensing electrode matrix 424S and other circuit components (not shown). Signal between.
  • the sensing electrode matrix 424S includes a plurality of first sensing electrodes 424V arranged along a first axis and a plurality of second sensing electrodes 424H arranged along a second axis.
  • the first sensing electrode 424V and the second sensing electrode 424H are insulated from each other, so that the first sensing electrode 424V and the second sensing electrode 424H corresponding to the visible area V of the touch panel can provide a function of touch sensing.
  • first sensing electrode 424V and the second sensing electrode 424H of the sensing electrode layer 424 of the present embodiment are respectively formed on the upper surface 422 ′ and the lower surface 422 ′′ of the carrier substrate 422 such that the first sensing electrode 424V
  • the second sensing electrode 424H is electrically isolated from the carrier substrate 422.
  • each of the first sensing electrodes 424V includes a plurality of first conductive units 424VA and a plurality of first connecting lines 424VB, in the first axial direction.
  • each second sensing electrode 424H includes a plurality of second conductive units 424HA and a plurality of second connecting lines 424HB, the second axis
  • the two adjacent second conductive units 424HA are connected and electrically connected by the second connecting lines 424HB, wherein the first connecting lines 424VB and the second connecting lines 424HB are staggered.
  • the sensing electrodes of the sensing electrode layer 424 are formed on the upper and lower surfaces 422', 422" of the carrier substrate 422, respectively.
  • the sensing electrode layer 424 can form different sensing electrodes on the same surface of the carrier substrate 422 and pass through the insulating layer, as in the aspect of the sensing electrode layer 324 shown in FIG. 3A and FIG. 3B.
  • the sensing electrodes are electrically insulated from each other, and the sensing electrodes, the insulating layer and the signal lines are protected by the protective layer.
  • the structure of the sensing electrode layer 424 described in this embodiment is only for convenience of describing and explaining the whole of the touch panel. The architecture is not intended to limit the invention.
  • the substrate 220 can provide a flat bearing surface to the touch sensor 450.
  • the bonding is performed to reduce the residual of the bonding bubbles generated during the bonding, effectively improving the production yield and product quality of the touch panel, and since the surface of the substrate 220 does not need to be formed with any external shielding layer, there is no need to The overall thickness of the touch panel can be further reduced in consideration of the height of the external shielding layer.
  • the non-visible area NV defined by the masking layer 204 in the masking layer 204 can smoothly shield the non-transparent peripheral components such as the signal line 428 of the sensing electrode layer 424 of the touch sensor 450.

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  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
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Abstract

一种用于触控面板的盖板结构，以及上述盖板结构的制造方法和应用此盖板结构的触控面板。其中上述盖板结构包括：一基板（220）；及一遮蔽层（204），埋设于该基板（220）内，并且该遮蔽层（204）的布设区域定义出该触控面板的一非可视区（NV）。

Description

用于触控面板的盖板结构及其制造方法与触控面板 技术领域
本发明有关于触控技术，且特别是有关于一种用于触控面板的盖板结构及其制造方法与其应用的触控面板。
背景技术
触控面板已被广泛用于家庭用品、通讯装置及电子信息装置等电子产品，逐渐取代实体键盘、鼠标等来作为各类电子产品的输入界面，提供有效率的操作界面。
触控面板通常包含一保护盖板，用来提供给使用者直接触碰操作而达到保护触控面板的触控传感器的效果。并且为了美观设计，保护盖板的表面进一步会形成一遮蔽层以遮蔽触控面板的外围导电线路等非透明组件。然而，由于遮蔽层的设计，导致保护盖板的表面会形成有高度落差，这将影响触控面板的生产良率及产品质量。
举例而言，请参见图1A，为习知技术触控面板的剖面架构示意图。图1A的触控面板是例如采用一保护盖板102及一触控传感器103贴合的解决方案。如图所示，保护盖板102的贴合面设有遮蔽层104，并且保护盖板102进一步透过光学胶106来与触控传感器103贴合。但由于遮蔽层104在保护盖板102上所形成的高度H，使得贴合时所产生的贴合气泡108不易排除。
请参见图1B，为另一习知技术触控面板的剖面架构示意图。图1B的触控面板是采用将原本需形成于另一基板的感测电极层124直接制作于保护盖板102的解决方案。然而，由于遮蔽层104是先形成于保护盖板102上，使得感测电极层124是顺应性形成于保护盖板102及遮蔽层104上。如此一来，由于感测电极层124需经过高温制程，因此先形成的遮蔽层104容易在高温环境下产生杂质而影响感测电极层124特性。此外，由于遮蔽层104在保护盖板102上所形成的高度H’，让感测电极层124在保护盖板102与遮蔽层104的接面处130容易破裂或中断而形成断路。
发明内容
本发明透过触控面板的盖板结构的改良，让盖板结构提供平坦的表面来贴合触控传感器或形成感测电极层，藉此以提高触控面板的生产良率及产品质量。
依据本发明的一实施例，提供一种用于触控面板的盖板结构，其包括：一基板；及一遮蔽层，埋设于此基板内，并且此遮蔽层的布设区域定义出此触控面板的一非可视区。
进一步的，所述基板为一经强化的基板。
进一步的，所述遮蔽层的材料包含油墨、碳浆、石墨的任一或组合。
依据本发明的另一实施例，提供一种盖板结构的制造方法，此盖板结构用于一触控面板，此制造方法的步骤包括：设置一遮蔽层于一第一透明板材及一第二透明板材之间，其中此遮蔽层的布设区域定义出此触控面板的一非可视区；加热软化此第一透明板材及此第二透明板材，使此第一透明板材及此第二透明板材熔融成一基板；及定型此基板。
进一步的，所述制造方法的步骤包括强化所述定型后的基板。
进一步的，所述第一透明板材及所述第二透明板材为相同材质的板材。
进一步的，所述加热步骤加热至超过所述第一透明板材及所述第二透明板材的材料转化温度，以软化所述第一透明板材及所述第二透明板材。
进一步的，所述定型步骤采用模具加压方式来塑造及固定所述基板的形状。
依据本发明的又一实施例，亦提供一种触控面板，包括：一基板；一遮蔽层，埋设于此基板内，并且此遮蔽层的布设区域定义出此触控面板的一非可视区；以及一感测电极层，形成于此基板的至少一表面。
进一步的，所述基板为一经强化的基板。
进一步的，所述感测电极层包括一感测电极矩阵及一信号线路，其中所述信号线路电性连接所述感测电极矩阵，并且对应位于所述非可视区。
进一步的，所述感测电极矩阵进一步包括复数条沿一第一轴向排列的第一感应电极及复数条沿一第二轴向排列的第二感应电极，其中所述第一感应电极与所述第二感应电极彼此绝缘。
进一步的，每一所述第一感应电极包括复数个第一导电单元和复数个第一连接线，且所述第一轴向上的相邻两个所述第一导电单元藉由所述第一连接线相连并电性连接；每一所述第二感应电极包括复数个第二导电单元和复数个第二连接线，且所述第二轴向上的相邻两个所述第二导电单元藉由所述第二连接线相连并电性连接；其中所述第一连接线和所述第二连接线形成交错。
进一步的，所述感测电极层进一步包括：一绝缘层，设置于交错的每一所述第一连接线及每一所述第二连接线之间；及一保护层，设置于所述第一感应电极、所述第二感应电极及所述信号线路上。
依据本发明的再一实施例，更提供一种触控面板，包括：一基板；一遮蔽层，埋设于此基板内，并且此遮蔽层的布设区域定义出此触控面板的一非可视区；以及一触控传感器，透过一光学胶来贴合于此基板的一表面。
进一步的，所述基板为一经强化的基板。
进一步的，所述触控传感器进一步包括：一承载基板；及一感测电极层，形成于所述承载基板的至少一表面，并且包含一感测电极矩阵及一信号线路，其中所述信号线路电性连接所述感测电极矩阵，并且对应位于所述非可视区。
进一步的，所述感测电极矩阵进一步包括复数条沿一第一轴向排列的第一感应电极及复数条沿一第二轴向排列的第二感应电极，其中所述第一感应电极与所述第二感应电极彼此绝缘。
进一步的，每一所述第一感应电极包括复数个第一导电单元和复数个第一连接线，且所述第一轴向上的相邻两个该些第一导电单元藉由所述第一连接线相连并电性连接；每一所述第二感应电极包括复数个第二导电单元和复数个第二连接线，且所述第二轴向上的相邻两个所述第二导电单元藉由所述第二连接线相连并电性连接；其中所述第一连接线和所述第二连接线形成交错。
进一步的，所述感测电极层进一步包括：一绝缘层，设置于交错的每一所述第一连接线及每一所述第二连接线之间；及一保护层，设置于所述第一感应电极、所述第二感应电极及所述信号线路上。
附图说明
图1A及图1B显示习知技术的触控面板的剖面架构示意图。
图2A至图2D图显示依据本发明的实施例的盖板结构的制造方法于各制造阶段的剖面示意图。
图3A及图3B分别显示依据本发明的一实施例的触控面板的剖面示意图及上视示意图。
图4A及图4B分别显示依据本发明的另一实施例的触控面板的剖面示意图及上视示意图。
具体实施方式
图2A至图2D显示依照本发明一实施例的盖板结构于各制造阶段的剖面示意图。本实施例的盖板结构是用于一触控面板，用来做为触控面板的一保护盖板(Cover Lens)，并且定义出触控面板的一可视区V及一非可视区NV。参见图2A，首先提供一第一透明板材202A。本实施例的第一透明板材202A是例如采用一透明玻璃板的设计，其厚度可约为0.1～0.7 mm，并且其玻璃转化温度(glass transition temperature)可约为450～800℃。在本发明的另一实施例中，第一透明板材202A的材料更可采用热塑性塑料的材质的设计，例如：压克力，在此并非为本发明所限制。
接着，参见图2B，形成遮蔽层204于第一透明板材202A上。遮蔽层204可由光密度值不大于7的遮光材料形成，并且遮蔽层204的材料可为油墨、碳浆、石墨片的任一或组合，在颜色方面，遮蔽层204则可例如采用黑色或其他颜色的设计。值得一提的是，本实施例的遮蔽层204是属于高耐热材料，可在温度超过第一透明板材202A的材料转化温度时仍不产生形变及质变。
更进一步说明的是，本实施例的遮蔽层204的布设区域即是定义出触控面板的非可视区NV，用来遮蔽触控面板中对应位于非可视区NV中的外围导电线路等非透明组件。在实际应用上，遮蔽层204可依设计需求而形成于第一透明板材202A的表面的外围区域或其他区域，并形成为方框、长条形、L形、ㄇ形或其他任意图案。如此一来，在触控面板的结构上，相对应于遮蔽层204的布设区域所定义出的非可视区NV的其他区域即可定义为可视区V。此外，遮蔽层204的厚度可为第一透明板材202A的厚度的1/100～1/10，例如约7~10 μm。
接着，参见图2C，设置一第二透明板材202B于遮蔽层204上，使得遮蔽层204是形成于第一透明板材202A及第二透明板材202B之间。此外，由于遮蔽层204的厚度所致，让现阶段在第一透明板材202A及第二透明板材202B之间位于触控面板的可视区V的区域是具有一间隙210。本实施例的第二透明板材202B是采用与第一透明板材202A相同的材料来设计，藉以具有相同的材料转化温度。此外，第二透明板材202B的厚度也可采用与第一透明板材202A相同的厚度(例如0.1～0.7 mm )。
最后，参见图2D，对第一透明板材202A及第二透明板材202B进行加热至至少超过其材料转化温度，以软化第一透明板材202A及第二透明板材202B，并进而使第一透明板材202A及第二透明板材202B相互熔融成一基板220；随后再让基板220冷却定型以完成制品。其中，熔融过程让软化的第一透明板材202A及第二透明板材202B顺应性地填补之间原本形成的间隙210并包覆遮蔽层204，使得遮蔽层204是埋设于基板220中。换句话说，第一透明板材202A及第二透明板材202B之间不需透过任何黏着性胶体来进行贴合，并且遮蔽层204是完全被熔融而成的基板220所包覆。
更具体来讲，在本实施例的制作盖板结构的过程中，第一透明板材202A及第二透明板材202B可以是承载于具平坦承载面的模具(图未示)中，并且在熔融阶段时，采用模具加压方式来塑造及固定基板220的形状，进而得以在冷却之后定型基板220。其中，由于软化的第一透明板材202A及第二透明板材202B具有高度的可塑性，因此透过具平坦承载面的模具的加压方式可以让所形成的基板220在冷却定型之后具有平坦的表面。在一实施例中，图2A至2D图所示的制程可进一步在真空环境中进行，以避免熔融过程中产生气泡而更确保基板220的质量。
进一步说明的是，由于本实施例所制成的基板220是用来做为触控面板的盖板结构，因此在制程上更可包括强化前述定型后的基板220，以提供更坚硬的保护作用。在一实施例中，所述的强化步骤可以采用化学离子交换的强化方式来实现。
以下是进一步说明前述的盖板结构应用于触控面板的各种实施例，并且在下列的实施例中所称的方位“上”及“下”，仅是用来表示相对的位置关系，对于本说明书的图式而言，触控面板的上方较接近观看者，而下方则较远离观看者。
参见图3A及图3B，分别显示依照本发明一实施例的触控面板的剖面示意图及上视示意图。本实施例的触控面板包括基板220、埋设于基板220内的遮蔽层204及形成于基板220的至少一表面的感测电极层324。其中，本实施例遮蔽层204埋设于基板220中的位置并非为本发明所限制，可例如是前述盖板结构的实施例的态样而埋设于基板220内而位于外围区域或其他区域的位置，并且遮蔽层204的图案也并无加以限制。本实施例是属于利用光微影制程(Photolithography Process)或印刷制程来将感测电极层324直接形成于基板220的平坦下表面的触控面板解决方案。此外，在一实施例中，基板220更可是经强化的基板220，用以在触控面板的架构中同时提供承载感测电极层324以及保护感测电极层324而供使用者触碰操作的作用。
本实施例的感测电极层324包括一感测电极矩阵324S及一信号线路328。其中，信号线路328电性连接感测电极矩阵324S，并且对应位于遮蔽层204布设区域所定义出的非可视区NV，用来传递感测电极矩阵324S与其他电路组件(图未显示)之间的信号。附带一提的是，在触控面板的结构上，相对应于遮蔽层204的布设区域所定义出的非可视区NV的其他区域即可定义为可视区V。
进一步的，感测电极矩阵324S包含复数条沿一第一轴向排列的第一感应电极324V及复数条沿一第二轴向排列的第二感应电极324H，其中所述的第一感应电极324V及所述的第二感应电极324H彼此绝缘。更具体来讲，每一第一感应电极324V包括复数个第一导电单元324VA及复数个第一连接线324VB，其中第一轴向上的相邻两第一导电单元324VA由该些第一连接线324VB相连并电性连接；每一第二感应电极324H包括复数个第二导电单元324HA及复数个第二连接线324HB，其中第二轴向上的相邻两第二导电单元324HA由该些第二连接线324HB相连并电性连接。其中，第一连接线324VB及第二连接线324HB形成交错。
更具体而言，感测电极层324更包括一绝缘层326及一保护层330。绝缘层326设置于交错的每一第一连接线324VB及每一第二连接线324HB之间，用来电性隔绝第一感应电极324V及第二感应电极324H。保护层330设置于第一感应电极324V、第二感应电极324H及信号线路328上，用来保护第一感应电极324V、第二感应电极324H及信号线路328避免产生物理或化学变化。藉此，对应位于触控面板的可视区V中的第一感应电极324V及第二感应电极324H即可提供触控感测的功能。
本实施例所描述的感测电极层324的架构仅是将感测电极层324直接形成于基板220上的解决方案的其中之一实例，并非用来限制本发明，凡在本发明的精神和范围内，作任意的修改，均属于本发明的保护范围。
承上所述，本实施例由于遮蔽层204是埋设于基板220内(如遮蔽层204未接触至基板220的上表面及下表面)，基板220可提供平坦的承载表面来形成感测电极层324，降低感测电极层324发生断路的机会，并且不需担心遮蔽层204在通过感测电极层324的高温制程时产生杂质影响感测电极层324，有效地提升触控面板的生产良率及产品质量。此外，触控面板通过遮蔽层204布设区域所定义出的非可视区NV亦可顺利来遮蔽感测电极层324的信号线路328等外围非透明组件。
参见图4A及图4B，分别显示依照本发明另一实施例的触控面板的剖面示意图及上视示意图。本实施例的触控面板包括基板220、埋设于基板220内的遮蔽层204及透过一光学胶440来贴合于基板220的一表面的触控传感器450。其中，光学胶440可例如是采用液态胶或固态胶膜的胶材。相较于图3A及图3B的实施例，本实施例是属于将触控传感器450与具有平坦表面的基板220贴合的触控面板解决方案，并且在一实施例中，基板220更可是经强化的基板220，用以在触控面板的架构中提供保护触控传感器450以供使用者触碰操作的作用。
触控传感器450包含承载基板422及感测电极层424。其中，承载基板422可为玻璃或聚酯薄膜的材质。感测电极层424形成于承载基板422的至少一表面，并且包含一感测电极矩阵424S及一信号线路428。其中，信号线路428电性连接感测电极矩阵424S，并且对应位于遮蔽层204布设区域所定义出的非可视区NV，用来传递感测电极矩阵424S与其他电路组件(图未示)之间的信号。
进一步的，感测电极矩阵424S包含复数条沿一第一轴向排列的第一感应电极424V及复数条沿一第二轴向排列的第二感应电极424H。其中，第一感应电极424V及第二感应电极424H彼此绝缘，让对应位于触控面板的可视区V中的第一感应电极424V及第二感应电极424H得以提供触控感测的功能。
更具体来讲，本实施例的感测电极层424的第一感应电极424V及第二感应电极424H是分别形成于承载基板422的上表面422’及下表面422”，使得第一感应电极424V及第二感应电极424H是透过承载基板422来形成电性隔绝。此外，每一第一感应电极424V包括复数个第一导电单元424VA及复数个第一连接线424VB，第一轴向上的相邻两第一导电单元424VA藉由该些第一连接线424VB相连并电性连接；每一第二感应电极424H包括复数个第二导电单元424HA及复数个第二连接线424HB，第二轴向上的相邻两第二导电单元424HA藉由该些第二连接线424HB相连并电性连接。其中，第一连接线424VB及第二连接线424HB形成交错。
值得一提的是，本实施例感测电极层424的架构除了如上所述的是将不同轴向的感应电极分别形成于承载基板422的上、下表面422’、422”之外，在另外的实施例中，感测电极层424更可如图3A及图3B所示的感测电极层324的态样，将不同轴向的感应电极形成于承载基板422的同一表面，并通过绝缘层来使感应电极之间彼此电性隔绝，以及通过保护层来保护感应电极、绝缘层及信号线路。本实施例所描述的感测电极层424的架构仅是方便描述及说明触控面板的整体架构，并非用来限制本发明。
承上所述，本实施例由于遮蔽层204是埋设于基板220内(如遮蔽层204未接触至基板220的上表面及下表面)，基板220可提供平坦的承载表面来与触控传感器450进行贴合，减少贴合时所产生的贴合气泡的残留，有效地提升触控面板的生产良率及产品质量，并且由于基板220表面不需再形成有任何外部遮蔽层，因此不需再考虑外部遮蔽层的高度而可进一步缩减触控面板的整体厚度。此外，触控面板通过遮蔽层204布设区域所定义出的非可视区NV亦可顺利来遮蔽触控传感器450的感测电极层424的信号线路428等非透明外围组件。
虽然本发明已以数个较佳实施例揭露如上，然其并非用以限定本发明，任何所属技术领域中具有通常知识者，在不脱离本发明的精神和范围内，当可作任意的更动与润饰，因此本发明的保护范围当视权利要求所界定者为准。

Claims (20)

  1. 一种用于触控面板的盖板结构，其特征在于，包括：
    一基板；及
    一遮蔽层，埋设于该基板内，并且该遮蔽层的布设区域定义出该触控面板的一非可视区。
  2. 根据权利要求1所述的用于触控面板的盖板结构，其特征在于，该基板为一经强化的基板。
  3. 根据权利要求1所述的用于触控面板的盖板结构，其特征在于，该遮蔽层的材料包含油墨、碳浆、石墨的任一或组合。
  4. 一种用于触控面板的盖板结构的制造方法，其特征在于，该制造方法的步骤包括：
    设置一遮蔽层于一第一透明板材及一第二透明板材之间，其中该遮蔽层的布设区域定义出该触控面板的一非可视区；
    加热软化该第一透明板材及该第二透明板材，使该第一透明板材及该第二透明板材熔融成一基板；及
    冷却定型该基板。
  5. 根据权利要求4所述的用于触控面板的盖板结构的制造方法，其特征在于，进一步包括强化该定型后的基板。
  6. 根据权利要求4所述的用于触控面板的盖板结构的制造方法，其特征在于，该第一透明板材及该第二透明板材为相同材质的板材。
  7. 根据权利要求6所述的用于触控面板的盖板结构的制造方法，其特征在于，该加热步骤加热至超过该第一透明板材及该第二透明板材的材料转化温度，以软化该第一透明板材及该第二透明板材。
  8. 根据权利要求7所述的用于触控面板的盖板结构的制造方法，其特征在于，该定型步骤采用模具加压方式来塑造及固定该基板的形状。
  9. 一种触控面板，其特征在于，包括：
    一基板；
    一遮蔽层，埋设于该基板内，并且该遮蔽层的布设区域定义出该触控面板的一非可视区；以及
    一感测电极层，形成于该基板的至少一表面。
  10. 根据权利要求9所述的触控面板，其特征在于，该基板为一经强化的基板。
  11. 根据权利要求9所述的触控面板，其特征在于，该感测电极层包括一感测电极矩阵及一信号线路，其中该信号线路电性连接该感测电极矩阵，并且对应位于该非可视区。
  12. 根据权利要求11所述的触控面板，其特征在于，该感测电极矩阵进一步包括复数条沿一第一轴向排列的第一感应电极及复数条沿一第二轴向排列的第二感应电极，其中该些第一感应电极与该些第二感应电极彼此绝缘。
  13. 根据权利要求12所述的触控面板，其特征在于，每一该些第一感应电极包括复数个第一导电单元和复数个第一连接线，且该第一轴向上的相邻两个该些第一导电单元藉由该些第一连接线相连并电性连接；每一该些第二感应电极包括复数个第二导电单元和复数个第二连接线，且该第二轴向上的相邻两个该些第二导电单元藉由该些第二连接线相连并电性连接；其中该些第一连接线和该些第二连接线形成交错。
  14. 根据权利要求13所述的触控面板，其特征在于，该感测电极层进一步包括：
    一绝缘层，设置于交错的每一该些第一连接线及每一该些第二连接线之间；及
    一保护层，设置于该些第一感应电极、该些第二感应电极及该信号线路上。
  15. 一种触控面板，其特征在于，包括：
    一基板；
    一遮蔽层，埋设于该基板内，并且该遮蔽层的布设区域定义出该触控面板的一非可视区；以及
    一触控传感器，透过一光学胶来贴合于该基板的一表面。
  16. 根据权利要求15所述的触控面板，其特征在于，该基板为一经强化的基板。
  17. 根据权利要求15所述的触控面板，其特征在于，该触控传感器进一步包括：
    一承载基板；及
    一感测电极层，形成于该承载基板的至少一表面，并且包含一感测电极矩阵及一信号线路，其中该信号线路电性连接该感测电极矩阵，并且对应位于该非可视区。
  18. 根据权利要求17所述的触控面板，其特征在于，该感测电极矩阵进一步包括复数条沿一第一轴向排列的第一感应电极及复数条沿一第二轴向排列的第二感应电极，其中该些第一感应电极与该些第二感应电极彼此绝缘。
  19. 根据权利要求18所述的触控面板，其特征在于，每一该些第一感应电极包括复数个第一导电单元和复数个第一连接线，且该第一轴向上的相邻两个该些第一导电单元藉由该些第一连接线相连并电性连接；每一该些第二感应电极包括复数个第二导电单元和复数个第二连接线，且该第二轴向上的相邻两个该些第二导电单元藉由该些第二连接线相连并电性连接；其中该些第一连接线和该些第二连接线形成交错。
  20. 根据权利要求19所述的触控面板，其特征在于，该感测电极层进一步包括：
    一绝缘层，设置于交错的每一该些第一连接线及每一该些第二连接线之间；及
    一保护层，设置于该些第一感应电极、该些第二感应电极及该信号线路上。
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