WO2014030492A1 - Capteur de force inertiel - Google Patents

Capteur de force inertiel Download PDF

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Publication number
WO2014030492A1
WO2014030492A1 PCT/JP2013/070267 JP2013070267W WO2014030492A1 WO 2014030492 A1 WO2014030492 A1 WO 2014030492A1 JP 2013070267 W JP2013070267 W JP 2013070267W WO 2014030492 A1 WO2014030492 A1 WO 2014030492A1
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WO
WIPO (PCT)
Prior art keywords
inertial force
force sensor
vibrators
sensor
angular velocity
Prior art date
Application number
PCT/JP2013/070267
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English (en)
Japanese (ja)
Inventor
健悟 鈴木
青野　宇紀
金丸　昌敏
雅秀 林
Original Assignee
日立オートモティブシステムズ株式会社
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Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Publication of WO2014030492A1 publication Critical patent/WO2014030492A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733—Structural details or topology
    • G01C19/574—Structural details or topology the devices having two sensing masses in anti-phase motion

Definitions

  • the present invention relates to an inertial force sensor that detects inertial force such as acceleration and angular velocity by a change in capacitance, and more particularly to a vibration isolation structure of the sensor.
  • Patent Document 1 describes a structure that appropriately achieves both an elastic function and an assembling property in an angular velocity sensor in which an angular velocity sensor element is mounted and held on a package via an adhesive as an elastic member.
  • Patent Document 2 describes a structure in which two vibrating bodies are nested in an acceleration sensor using a piezoelectric body.
  • Patent Document 1 it is possible to attenuate disturbance vibration, which is unnecessary vibration from the outside, by causing an adhesive material, which is an elastic material, to function as a vibration isolation member.
  • an adhesive material which is an elastic material
  • the problem remains that the adhesive is fixed and it is difficult to attenuate disturbance vibration.
  • an object of the present invention is to provide an inertial force sensor capable of attenuating disturbance vibration inside the sensor element when disturbance vibration is applied.
  • the object is to be held by the mass body via the fixing portion, the mass body held by the fixing portion via the first beam having flexibility, and the second beam having flexibility.
  • a vibrating body the mass body is disposed inside the fixed portion, the vibrating body is disposed inside the mass body, and the first beam is less rigid than the second beam.
  • an inertial force sensor configured to detect an inertial force based on the displacement of the vibrating body.
  • the inertial force sensor which can suppress the disturbance vibration applied from the outside of a sensor can be provided in an inertial force sensor by forming a vibration proof structure inside a sensor element.
  • a vibration proof structure inside a sensor element.
  • FIG. 1 is a bird's eye view of an angular velocity sensor according to a first embodiment of the present invention.
  • the top view of the angular velocity sensor which is 1st Example of this invention 1 is a conceptual diagram of an anti-vibration function of an angular velocity sensor according to a first embodiment of the present invention 1 is a schematic sectional view of an angular velocity sensor according to a first embodiment of the present invention. 1 is a schematic sectional view of an angular velocity sensor module according to a first embodiment of the present invention.
  • FIG. 1 is a bird's-eye view of the angular velocity sensor according to the first embodiment.
  • FIG. 2 is a plan view of the angular velocity sensor, and
  • FIG. 3 is a conceptual diagram of an image stabilization function of the angular velocity sensor.
  • 4 is a schematic cross-sectional view taken along the line A-A ′ in FIG.
  • FIG. 5 is a mounting sectional view of the angular velocity sensor.
  • the angular velocity sensor in this example used a bonded substrate in which an insulating layer 13 was sandwiched between an active layer substrate 11 and a support substrate 12.
  • the two vibrators 14a and 14b constituting the vibrating body of the angular velocity sensor have a structure in which a region other than the fixing portions 16a to 16d is floated from the support substrate 12 by the thickness of the insulating layer 13. Although not shown, the two vibrators 14a and 14b are vibrated by the excitation means. First beams 15a to 15d made of four beams are extended to the fixing portions 16a to 16d, and the mass body 1 is held. The mass body 1 is extended with second beams 2a to 2d composed of four beams, and holds the vibrators 14a and 14b.
  • the mass body 1 and the vibrators 14a and 14b are supported so as to be able to vibrate in the in-plane direction, and have a structure that vibrates according to the applied angular velocity.
  • the first beams 15a to 15d and the second beams 2a to 2d have a role of a spring mechanism.
  • the vibrators 14a and 14b receive an angular velocity, the vibrators 14a and 14b are displaced by the inertial force generated in the vibrators 14a and 14b. The original position is restored by the spring force of the two beams 2a to 2d.
  • the vibrators 14a and 14b include movable electrodes 17a and 17b in a direction orthogonal to the vibration direction.
  • the movable electrodes 17a and 17b are displaced in conjunction with the vibrators 14a and 14b.
  • the mass body 1 is provided with detection electrodes 21a and 21b so as to face the movable electrodes 17a and 17b, and the displacement of the vibrators 14a and 14b due to the application of inertial force can be detected as a change in capacitance.
  • the vibrators 14 a and 14 b are connected to each other by a mechanical link 18. Between the vibrators 14 a and 14 b, both vibration energies are transferred through the mechanical link 18.
  • Angular velocity sensor is used for camera shake prevention function, body posture control function, car navigation, etc., camera shake prevention DC-200Hz, body posture control DC-50Hz, car navigation DC-10Hz It is necessary to measure the angular velocity of the frequency band. As described above, in order to accurately observe the behavior at a low frequency with the angular velocity sensor, it is necessary to suppress disturbance vibration at a frequency higher than that in the use frequency band. As shown in FIGS. 1 to 3, the rigidity of the first beams 15a to 15d and the second beams 2a to 2d are different, and the second beams 2a to 2d are more rigid than the first beams 15a to 15d. Is getting bigger.
  • the first beams 15a to 15d having small rigidity are arranged outside the second beams 2a to 2d having large rigidity. External vibration propagates from the fixed portions 16a to 16d and propagates to the vibrators 14a and 14b for measuring the angular velocity. Therefore, as described above, since the frequency band necessary for measuring the angular velocity is low, the first beams 15a to 15d have the effect of a low-pass filter that suppresses high-frequency vibration. In addition, the resonance frequency of the low-pass filter is designed to be separated from the frequency with large disturbance vibration in consideration of the external environment.
  • the rigidity of the first beams 15a to 15d is set to a rigidity of 10 kHz or more which is the excitation frequency of the angular velocity sensor, and the rigidity of the second beams 2a to 2d is set to a rigidity having a low-pass filter function of 1 kHz or less.
  • the support substrate 12 and the fixing portions 16a to 16d are insulated by sandwiching the insulating layer 13 therebetween.
  • the vibrators 14a and 14b are provided with a plurality of trench through holes 19 that are used when the insulating layer 13 is subjected to sacrificial layer etching. This is necessary to float the vibrators 14a and 14b from the support substrate 12 so that they can be vibrated in the plane. Further, it is necessary to facilitate the sacrificial layer etching.
  • the shapes of the fixing portions 16a to 16d are preferably made as large as possible so that the vibrators 14a and 14b are not separated from the support substrate 12.
  • the shape of the through hole 19 is a square.
  • the movement of gas molecules between the sealing portion 3 and the outside is limited by covering the mass body 1 with a cover 22.
  • borosilicate glass was used for the lid 22.
  • Borosilicate glass is a glass that enables anodic bonding with silicon.
  • the sealing frame 25 formed on the lid 22 and the active layer substrate 11 is bonded using anodic bonding.
  • a step 24 having a depth that does not adhere is formed.
  • a gas adsorbent 23 is provided on the bottom surface of the step 24. Gas molecules (outgas) and moisture generated when the sealing frame 25 and the lid 22 are joined, and gas molecules existing before joining or inside the sealing portion 3 are adsorbed by the gas adsorbent 23.
  • the gas adsorbent 23 makes it possible to reduce the inflow of gas molecules and moisture from the outside over a long period of time, and assists in maintaining the internal pressure of the sealing portion 3.
  • a zirconia-based one is suitable, and has a characteristic of adsorbing at least part or all of moisture, oxygen, hydrogen, carbon dioxide, nitrogen and the like.
  • the through wirings 20a to 20d of the present embodiment have a structure in which the through wirings 20a to 20d are not cracked or peeled off even when a thermal shock is applied.
  • the angular velocity sensor includes a sensor element 6, a semiconductor integrated circuit 29, a mold resin 4, and a lead frame 33.
  • the sensor element 6 and the semiconductor integrated circuit 29 are stacked and mounted to improve the miniaturization and mountability.
  • the semiconductor integrated circuit 29 and the sensor element 6 are bonded with an adhesive 32.
  • the adhesive material 32 is a silicon-based adhesive material having a low Young's modulus.
  • the periphery of the sensor element 6 and the semiconductor integrated circuit 29 is fixed with a mold resin 4. By enclosing the sensor element 6 and the semiconductor integrated circuit 29 with the mold resin 4, the influence of dust and moisture from the outside on the sealing portion 3 is suppressed, and by fixing the wire 30, electrical leakage between the wires 30. Is prevented from occurring.
  • the sensor element 6 and the semiconductor integrated circuit 29 are electrically connected. That is, they are electrically connected by wire bonding via a wire 30 of gold or aluminum.
  • the wire 30 connects the through wirings 20 a to 20 d formed on the support substrate 12 and the electrodes of the semiconductor integrated circuit 29.
  • a lead frame 33 is installed under the semiconductor integrated circuit 29, and the semiconductor integrated circuit 29 and the lead frame 33 are electrically connected by wire bonding.
  • the mold resin 4 is provided with a lead frame 33 so that the sensor element 6 and the semiconductor integrated circuit 29 are electrically connected to the outside.
  • the lead frame 33 is made of a normal lead frame material such as 42 alloy.
  • the angular velocity sensor of this embodiment can suppress disturbance vibration because the sensor element 6 has a vibration isolation structure.
  • FIG. 6 is a bird's-eye view of the angular velocity sensor of the second embodiment.
  • FIG. 7 is a plan view of the upper electrode bonding side
  • FIG. 8 is a schematic cross-sectional view taken along the line AA ′ in FIG.
  • FIG. 9 is a mounting sectional view of the angular velocity sensor.
  • the angular velocity sensor in this embodiment includes a lower electrode substrate 150 as a first substrate, a sensor substrate 160 as a second substrate, and an upper electrode substrate 170 as a third substrate. Composed.
  • the lower electrode substrate 150 uses the active layer 123, the lower electrodes 102a and 102b, the active layer hermetic frame 103, the lower electrode active layer fixing portions 117a and 117b, which are fixing portions, the lower electrode active layer wirings 118a and 118b, and the vibrating body. It comprises a displaceable area 122, upper electrode active layer fixing portions 104a and 104b, and vibrator active layer fixing portions 116a to 116d.
  • the sensor substrate 160 uses the sensor layer 124, the mass body 141, the mass body support beams 142a to 142d, the vibrators 105a and 105b, the sensor layer fixing portions 119a to 119d, the vibrator support beams 120a to 120d, and the upper electrode sensor layer fixing.
  • the upper electrode substrate 170 uses an upper active layer 125, and upper electrodes 111a and 111b, an upper active layer hermetic frame 112, upper active layer fixing portions 110a and 110b for upper electrodes, upper active layer fixing portions 131a to 131d for vibrators, It comprises a vibrating body displaceable area 132 and lower electrode upper active layer fixing portions 109a and 109b.
  • a bonded substrate in which the insulating layer 130 is sandwiched between the active layer 123 including the lower electrodes 102a and 102b and the support substrate 101 is used as the lower electrodes 102a and 102b.
  • the active layer 123 and the support substrate 101 are electrically insulated.
  • the lower electrodes 102a and 102b, the upper electrode active layer fixing portions 104a and 104b, the vibrator active layer fixing portions 116a to 116d, and the active layer hermetic frame 103 are electrically insulated by a space, and the adjacent structures are mixed. There is no.
  • the vibrator active layer fixing portions 116a to 116d are connected to sensor layer fixing portions 119a to 119d for fixing the vibrators 105a and 105b.
  • the lower electrode active layer fixing portions 117a and 117b are connected to the lower electrode sensor layer fixing portions 107a and 107b, and the upper electrode active layer fixing portions 104a and 104b are connected to the upper electrode sensor layer fixing portions 106a and 106b. Connected. Since the silicon substrate is used for each of the substrates in which the connected portions are formed, since there is no difference in the linear expansion coefficient because of the same material, the strain generated with the temperature change is small. Direct connection is used for connection, and the bonding interface has a resistance value equivalent to that of the fixed portion, so the sensitivity does not decrease.
  • the mass body 141 and the mass body support beams 142a to 142d, the vibrators 105a and 105b, and the vibrator support beams 120a to 120d are formed above the vibrator body displaceable area 122, and include an active layer including lower electrodes 102a and 102b.
  • the structure is lifted from 123.
  • the vibrating body displaceable area 122 is dug down, and the flying distance of the vibrators 105a and 105b and the lower electrodes 102a and 102b is equal to the distance between the sensor layer 124 and the upper surface of the vibrating body displaceable area 122.
  • the vibrator support beams 120a to 120d may be folded beams instead of straight beams.
  • the vibrators 105a and 105b are constructed by four vibrator support beams 120a to 120d at the ends of the vibrators 105a and 105b, and are respectively in the x and y directions which are in-plane directions and the z direction which is an out-of-plane direction. It is supported so that it can vibrate.
  • the vibrators 105a and 105b are fixed to the vibrating body active layer fixing parts 116a to 116d by sensor layer fixing parts 119a to 119d extending at the ends of the vibrator supporting beams 120a to 120d.
  • ⁇ 120d has a role of a spring mechanism.
  • the vibrators 105a and 105b receive out-of-plane acceleration and angular velocity
  • the vibrators 105a and 105b are displaced by the inertial force generated in the vibrators 105a and 105b.
  • the original position is restored by the spring force of the vibrator support beams 120a to 120d.
  • the vibrator support beams 120a to 120d vibrate in conjunction with the vibrators 105a and 105b.
  • the vibrators 105a and 105b are connected to each other by a mechanical link 135. Between the vibrators 105a and 105b, vibration energy of both is exchanged through the mechanical link 135.
  • the angular velocity sensor is used for camera shake prevention function, body posture control function, car navigation, etc.
  • camera shake prevention is DC-200Hz
  • body posture control is DC-50Hz
  • car navigation is DC-10Hz. It is necessary to measure the angular velocity of the frequency band.
  • the mass support beams 142a to 142d and the vibrator support beams 120a to 120d have different rigidity, and the vibrator support beams 120a to 120d are larger than the mass support beams 142a to 142d.
  • Mass body support beams 142a to 142d having small rigidity are arranged outside the vibrator support beams 120a to 120d having large rigidity. External vibration propagates from the sensor layer fixing portions 119a to 119d and propagates to the vibrators 105a and 105b for measuring the angular velocity. Therefore, as described above, since the frequency band necessary for measuring the angular velocity is low, the mass support beams 142a to 142d have the effect of a low-pass filter that suppresses high-frequency vibration. In addition, the resonance frequency of the low-pass filter is designed to be separated from the frequency with large disturbance vibration in consideration of the external environment.
  • the mass support beams 142a to 142d have a rigidity of 10 kHz or more, which is the excitation frequency of the angular velocity sensor, and the vibrator support beams 120a to 120d have a rigidity having a low-pass filter function of 1 kHz or less.
  • the vibrators 105a and 105b have a function of a movable electrode in a range facing the lower electrodes 102a and 102b.
  • the lower electrodes 102a and 102b were formed in a size different from that of the vibrators 105a and 105b.
  • the lower electrodes 102a and 102b have a larger structure than the vibrators 105a and 105b.
  • the vibrators 105a and 105b, the sensor layer hermetic frame 108, and the upper electrode sensor layer fixing portions 106a and 106b are electrically insulated by a space, and there is no cross line between adjacent structures.
  • the upper electrodes 111 a and 111 b are bonded substrates in a state where the upper insulating layer 134 is sandwiched between the upper active layer 125 including the upper electrodes 111 a and 111 b and the upper support substrate 113. It was used. Thereby, the upper active layer 125 and the upper support substrate 113 are electrically insulated.
  • the upper electrodes 111a and 111b, the lower electrode upper active layer fixing portions 109a and 109b, and the upper active layer hermetic frame 112 are electrically insulated by a space, and there is no cross-talk between adjacent structures.
  • the upper active layer fixing portions 109a and 109b for the lower electrode, the upper active layer fixing portions 110a and 110b for the upper electrode, and the upper active layer fixing portions 131a to 131d for the vibrator are electrically connected to the electrode pad 115 on the surface of the upper support substrate 113. It is connected to the.
  • the electrode pads 115 are all formed on the same surface. For this reason, it is easy to use a BGA (Ball Grid Array) which is a kind of sensor or integrated circuit package, which is suitable for high-density mounting.
  • the upper electrodes 111a and 111b are also configured to face the vibrators 105a and 105b, and are formed in a size different from that of the vibrators 105a and 105b.
  • the upper electrode when the movable portion vibrates in the x and y directions which are in-plane directions, when the vibrators 105a and 105b operate so as to move off the upper portions of the upper electrodes 111a and 111b, the upper electrode This is to prevent the capacitance with 111a and 111b from being lowered and measured to appear to be displaced in the z direction.
  • the upper electrodes 111a and 111b have a larger structure than the vibrators 105a and 105b, and the lower electrodes 102a and 102b and the upper electrodes 111a and 111b have the same size.
  • the vibrators 105a and 105b have a function of a movable electrode in a range facing the upper electrodes 111a and 111b.
  • the signals detected by the lower electrodes 102a and 102b reach the lower electrode active layer fixing portions 117a and 117b.
  • This signal is transmitted to the lower electrode sensor layer fixing portions 107a and 107b through the bonding interface between the lower electrode active layer fixing portions 117a and 117b and the lower electrode sensor layer fixing portion 107, and the lower electrode sensor layer fixing portions 107a and 107b and the lower electrode.
  • Lower electrode external electrodes 114a connected to the lower electrode upper active layer fixing portions 109a and 109b to the lower electrode upper active layer fixing portions 109a and 109b through the bonding interfaces of the electrode upper active layer fixing portions 109a and 109b.
  • the signal can be detected up to 114b without attenuation.
  • a signal from the sensor to the outside is transmitted through the electrode pad 115.
  • the sensor When the sensor is applied with an angular velocity around the x axis that is out of the plane of the substrate, the two vibrators 105a and 105b transmit and receive vibration energy through the mechanical link 135, and in the z axis direction that is out of plane by the Coriolis force. Displaces in the opposite direction.
  • the vibrator 105a When the vibrator 105a is displaced in the direction approaching the lower electrode 102a, the capacitance between the vibrator 105a and the lower electrode 102a increases. In this case, the vibrator 105a is displaced in a direction away from the upper electrode 111a, so that the capacitance between the vibrator 105a and the upper electrode 111a decreases. At the same time, the vibrator 105b constructed by the vibrator 105a and the mechanical link 135 is displaced in the direction away from the lower electrode 102b by the Coriolis force, so that the capacitance between the vibrator 105b and the upper electrode 111b decreases.
  • the distance between the vibrating body displaceable area 122 and the vibrators 105a and 105b and the upper vibrating body displaceable area 132 and the vibrators 105a and 105b are the same. Therefore, when the capacitance change of the lower electrode 102a and the upper electrode 111b increases with the same value, the capacitance change of the lower electrode 102b and the upper electrode 111a also decreases with the same value. Utilizing this fact, it is possible to amplify the sensitivity by differentially amplifying the capacitance changes of the lower electrodes 102a and 102b and the upper electrodes 111a and 111b.
  • the capacitance change of the lower electrode 102a and the lower electrode 102b increases with the same value
  • the capacitance change of the upper electrode 111a and the upper electrode 111b also decreases with the same value.
  • acceleration and angular velocity can be separated.
  • the vibrating body displaceable area 122 and the upper vibrating body displaceable area 132 are formed by wet etching, and the gap between the vibrators 105a and 105b can be controlled in nanometer order. Thereby, the sensitivity variation for every sensor can be suppressed and it can set to an optimal value.
  • the internal space in which the vibrators 105a and 105b exist is isolated from the outside by the active layer hermetic frame 103, the sensor layer hermetic frame 108, and the upper active layer hermetic frame 112.
  • the environment around the vibrators 105a and 105b is stable, and it is possible to suppress the sticking of the second vibrating parts 105a and 105b due to dust and moisture from the outside, and the sensitivity fluctuation due to the pressure fluctuation due to gas inflow.
  • the angular velocity sensor includes a sensor element 206, a semiconductor integrated circuit 229, a mold resin 204, and a lead frame 233.
  • the sensor element 206 and the semiconductor integrated circuit 229 are stacked and mounted to improve miniaturization and mountability.
  • the semiconductor integrated circuit 229 and the sensor element 206 are bonded with an adhesive 232.
  • the adhesive 232 is a silicon-based adhesive having a low Young's modulus.
  • the periphery of the sensor element 206 and the semiconductor integrated circuit 229 is fixed with a mold resin 204. Surrounding the sensor element 206 and the semiconductor integrated circuit 229 with the mold resin 204 suppresses the influence of dust and moisture from the outside, and fixing the wires 230 prevents electrical leakage between the wires 230. It is out.
  • the sensor element 206 and the semiconductor integrated circuit 229 are electrically connected. That is, they are electrically connected by wire bonding through a gold or aluminum wire 230.
  • the wire 230 connects the through wirings 220 a to 220 d formed in the sensor element 206 and the electrodes of the semiconductor integrated circuit 229.
  • a lead frame 233 is installed under the semiconductor integrated circuit 229, and the semiconductor integrated circuit 229 and the lead frame 233 are electrically connected by wire bonding.
  • the mold resin 204 is provided with a lead frame 233 for electrically connecting the sensor element 206 and the semiconductor integrated circuit 229 to the outside.
  • the lead frame 233 is made of a normal lead frame material such as 42 alloy.
  • the angular velocity sensor of the present embodiment can suppress disturbance vibration because the sensor element 206 has a vibration-proof structure.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)

Abstract

L'invention vise à produire un capteur de force inertiel rendant possible d'atténuer des vibrations de perturbation dans un intérieur d'élément de capteur quand les vibrations de perturbation agissent. A cet effet, la présente invention porte sur un capteur de force inertiel, lequel capteur est caractérisé en ce qu'il comprend une partie ancrée, un corps de masse maintenu par la partie ancrée par l'intermédiaire d'une première poutre souple, et un corps vibrant maintenu par le corps de masse par l'intermédiaire d'une seconde poutre souple, le corps de masse étant disposé sur l'intérieur de la partie ancrée, le corps vibrant étant disposé sur l'intérieur du corps de masse, et la première poutre étant moins rigide que la seconde poutre.
PCT/JP2013/070267 2012-08-22 2013-07-26 Capteur de force inertiel WO2014030492A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-182839 2012-08-22
JP2012182839A JP2014041033A (ja) 2012-08-22 2012-08-22 慣性力センサ

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WO2014030492A1 true WO2014030492A1 (fr) 2014-02-27

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6416704B2 (ja) * 2015-06-22 2018-10-31 日立オートモティブシステムズ株式会社 樹脂封止型センサ装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120266A (ja) * 1993-10-27 1995-05-12 Sumitomo Precision Prod Co Ltd 振動ジャイロセンサー
JPH11271064A (ja) * 1998-03-23 1999-10-05 Murata Mfg Co Ltd 角速度センサ
JP2010256362A (ja) * 2010-06-11 2010-11-11 Torex Semiconductor Ltd 半導体センサー装置およびその製造方法
JP2010276367A (ja) * 2009-05-26 2010-12-09 Denso Corp 加速度角速度センサ
JP2011203127A (ja) * 2010-03-25 2011-10-13 Toyota Central R&D Labs Inc 角速度センサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120266A (ja) * 1993-10-27 1995-05-12 Sumitomo Precision Prod Co Ltd 振動ジャイロセンサー
JPH11271064A (ja) * 1998-03-23 1999-10-05 Murata Mfg Co Ltd 角速度センサ
JP2010276367A (ja) * 2009-05-26 2010-12-09 Denso Corp 加速度角速度センサ
JP2011203127A (ja) * 2010-03-25 2011-10-13 Toyota Central R&D Labs Inc 角速度センサ
JP2010256362A (ja) * 2010-06-11 2010-11-11 Torex Semiconductor Ltd 半導体センサー装置およびその製造方法

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