WO2014022635A1 - Slab laser and amplifier and method of use - Google Patents
Slab laser and amplifier and method of use Download PDFInfo
- Publication number
- WO2014022635A1 WO2014022635A1 PCT/US2013/053166 US2013053166W WO2014022635A1 WO 2014022635 A1 WO2014022635 A1 WO 2014022635A1 US 2013053166 W US2013053166 W US 2013053166W WO 2014022635 A1 WO2014022635 A1 WO 2014022635A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- slab
- slab crystal
- laser
- crystal
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/0604—Crystal lasers or glass lasers in the form of a plate or disc
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/0606—Crystal lasers or glass lasers with polygonal cross-section, e.g. slab, prism
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02115—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material being carbon, e.g. alpha-C, diamond or hydrogen doped carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02181—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing hafnium, e.g. HfO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02183—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing tantalum, e.g. Ta2O5
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02194—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing more than one metal element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0071—Beam steering, e.g. whereby a mirror outside the cavity is present to change the beam direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/0615—Shape of end-face
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0619—Coatings, e.g. AR, HR, passivation layer
- H01S3/0621—Coatings on the end-faces, e.g. input/output surfaces of the laser light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08018—Mode suppression
- H01S3/08022—Longitudinal modes
- H01S3/08027—Longitudinal modes by a filter, e.g. a Fabry-Perot filter is used for wavelength setting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08086—Multiple-wavelength emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08095—Zig-zag travelling beam through the active medium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/0915—Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/0915—Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light
- H01S3/092—Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light of flash lamp
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/0915—Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light
- H01S3/092—Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light of flash lamp
- H01S3/093—Processes or apparatus for excitation, e.g. pumping using optical pumping by incoherent light of flash lamp focusing or directing the excitation energy into the active medium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
- H01S3/162—Solid materials characterised by an active (lasing) ion transition metal
- H01S3/1623—Solid materials characterised by an active (lasing) ion transition metal chromium, e.g. Alexandrite
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
- H01S3/162—Solid materials characterised by an active (lasing) ion transition metal
- H01S3/1625—Solid materials characterised by an active (lasing) ion transition metal titanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/163—Solid materials characterised by a crystal matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/163—Solid materials characterised by a crystal matrix
- H01S3/1631—Solid materials characterised by a crystal matrix aluminate
- H01S3/1633—BeAl2O4, i.e. Chrysoberyl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/163—Solid materials characterised by a crystal matrix
- H01S3/1631—Solid materials characterised by a crystal matrix aluminate
- H01S3/1636—Al2O3 (Sapphire)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/163—Solid materials characterised by a crystal matrix
- H01S3/1666—Solid materials characterised by a crystal matrix borate, carbonate, arsenide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2308—Amplifier arrangements, e.g. MOPA
- H01S3/2316—Cascaded amplifiers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
- H01S3/2308—Amplifier arrangements, e.g. MOPA
- H01S3/2325—Multi-pass amplifiers, e.g. regenerative amplifiers
- H01S3/2333—Double-pass amplifiers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1223—Basic optical elements, e.g. light-guiding paths high refractive index type, i.e. high-contrast waveguides
Definitions
- This application relates generally to the field of Lasers and Laser Amplifiers. More specifically, the application relates to solid state laser amplifiers in the form of a slab which are pumped optically by lamps and where the laser beam enters through a Brewster angle facet and experiences multiple face to face bounces due to total internal reflection before exiting through the same face as that the beam entered.
- Krypton arc flash or arc lamps discharging a spectrum of blackbody and line emission photons that were subsequently reflected as evenly as possible onto the adjacent faces of the Neodymium doped Yitrium Aluminum Garnet slab.
- This gain element selectively absorbed portions of this energy. This energy excited the Neodymium atoms into an elevated energy state from which the laser beam was generated or amplified.
- the limiting efficiency for the existing lamp pumped designs are primarily in two areas. First is the inefficiency due to the fact that the emitting spectrum from the pump lamps typically does not match the excitation spectrum of the laser crystal material. Second is in the inefficiency of the beam extraction from the gain material due to having the beam pass through no more than twice and incompletely fill the gain material.
- a transverse face-pumped, lamp-driven slab laser and amplifier design with a face to face beam propagation scheme.
- a TIR (total internal reflection) end bounce redirects the amplified radiation back out the same input facet, but in a different angular direction, making the presented design practical to use in a larger system, if desired.
- laser device comprising: a slab crystal, and a cavity filter material provided on at least one side of the slab crystal for receiving light energy from a light source, such that the cavity filter material converts the light energy received at a first frequency band into light energy at a second frequency band that is absorbed by the slab crystal.
- the slab crystal is adapted to receive an incident light beam into one end of the slab crystal at one angle and also emits an amplified laser beam from the one end at either an angle different than the one angle or emits the amplified laser beam linearly shifted from the incident light beam after absorbing the light energy at the second frequency.
- a laser device comprising: a slab crystal; a light source providing light energy including an ultraviolet frequency band; and a cavity filter material including terbium fluoride doped with samarium that is provided on at least one side of the slab crystal for receiving the light energy from the light source, and for converting the light energy at the first ultraviolet frequency band into light energy at a second frequency band of visible light for absorption by the slab crystal for amplifying a laser beam.
- the above slab crystal is adapted to emit the amplified laser beam from an end not including the back reflecting surface.
- laser device comprising: a slab crystal; a light source providing light energy including a portion in an ultraviolet frequency band and a portion in a visible light frequency band; and a cavity filter material transparent to the visible light frequency band and that is provided on at least one side of the slab crystal for receiving the light energy from the light source, and for converting the light energy at the first ultraviolet frequency band into light energy at a converted frequency band less than the ultraviolet frequency band for absorption by the slab crystal.
- the light source and the cavity filter material of the above laser are arranged such that at least a part of the portion of the light energy in the visible light frequency band is transmitted through the cavity filter to the slab crystal, and the slab crystal is adapted to absorb both a portion of the part of the light energy in the visible frequency band transmitted through the cavity filter and also to absorb a portion of the light energy at the converted frequency band for amplifying a laser beam for emitting from the slab laser.
- a laser device comprising: a slab crystal; a light source providing light energy at a first frequency band; a cavity filter material provided on at least one side of the slab crystal for receiving a portion of the light energy from the light source, and for converting at least some of the portion of the light energy at the first frequency band into light energy at a second frequency band for at least partial absorption by the slab crystal; a plurality of elastic holders for holding components of the device while allowing for thermal expansion of one or more the components of the device; and a coolant circulation system for circulating a coolant in the device for cooling the device, such that the slab crystal is adapted to emit an amplified laser beam from an end of the slab crystal.
- an example laser device comprising: a slab crystal having a front face that forms a point provided at an acute angle with respect to a bottom of the slab crystal for receiving an incident light beam provided at a first angle with respect to the front face, the slab crystal also having a back wall that is provided at a back angle that is not 90 degrees with respect to the bottom of the slab crystal; a light source providing light energy including a portion in first frequency band and a portion in a second frequency band; and a cavity filter material transparent to the first light frequency band and that is provided on the top or the bottom of the slab crystal for receiving the light energy from the light source, and for converting the light energy at the first frequency band into light energy at a converted frequency band for at least partial absorption by the slab crystal.
- the light source and the cavity filter material of the above laser are arranged such that at least part of the portion of the light energy in the second light frequency band is transmitted through the cavity filter to the slab crystal, and furthermore the slab crystal is adapted for amplifying a laser beam for emitting from the slab crystal by absorbing both a portion of the part of the light energy in the second frequency band transmitted through the cavity filter, and is by absorbing a portion of the light energy at the converted frequency band.
- the acute angle and the back angle are chosen such that the amplified laser beam is emitted from the front face of the slab crystal at an angle that is different than the first angle such that the incident light beam entering the slab crystal is not coincident with the amplified laser beam emitted from the slab crystal.
- the deposited material can be a dopant, or a layer of material such as diamond or diamond-like-carbon, for example.
- FIG. 1 is a schematic drawing of an external view of one example embodiment of the invention.
- FIG. 2 is a schematic drawing showing two layers of a filter cavity material that are provided on both sides of slab laser material
- FIG. 3 is a schematic drawing of an end view of the example embodiment of the invention of Fig. 1 showing a relation between the laser slab, two cavity filters, pump lamps, a ceramic reflector, and an external case;
- FIG. 4 is a schematic drawing of another example embodiment adding an external water manifold for cooling
- FIG. 5 is a schematic drawing of a general cross-section geometry of a laser slab of the example embodiment
- FIG. 6 is a schematic drawing of a path of the on-axis laser beam entering and leaving the amplifier slab of an example embodiment
- FIG. 7 A is a schematic drawing of an effect of displacing a laser beam to get separation of an exit beam from the entrance beam for the example embodiment
- FIG. 7B is a schematic drawing of an effect of displacing a plurality of laser beams for the example embodiment shown in Fig. 7A;
- FIG. 8A and 8B are schematic drawings showing an effect of varying an angle of a wedge at the front of the laser slab in the example embodiment
- FIG. 9 is a schematic drawing of an example arrangement for providing an entrance and an exit beam in different directions beam for the example embodiment
- FIGs. 10A and 10B are schematic drawings showing example separation of the exit beam from the entrance beam by varying the angle of an end reflecting surface in the example embodiment
- FIG. 11 is a schematic drawing showing an interior structure of one section of an example amplifier chain using a large slab laser crystal and adding more pump lamps;
- FIG. 12 is a schematic drawing showing a cross section of one of the amplifiers in a chain showing how the laser beam enters and exits the gain material;
- FIG. 13 is a schematic drawing showing an example of combining a plurality of the amplifiers of Fig. 12 in series to provide very high laser output powers
- FIG. 14 is a schematic drawing showing an example arrangement for manufacturing components using one or more slab lasers.
- FIG. 15 is a schematic drawing showing an example sample setup for the example arrangement of Fig. 14.
- the pulse of laser light to be generated or amplified passes through the same piece of gain material at least four times (not the normal two times) in each round trip inside the laser slab. Under the conditions of energy extraction efficiency being -60% per pass, this would result in, e.g., about 97% of the stored energy in the laser slab being extracted. This feature contributes to the higher efficiency of the example device.
- a further example embodiment is the use of pump lamps that use metal or metal halide alloys, which produce more photons in a usable spectrum than previous lamp designs based on noble gases.
- Cavity fluorescent filters have also been employed that convert the non-useful portion of the lamp output (in the ultraviolet portion of the spectrum for the Mercury arc lamps and Indium Iodide plus Thallium Iodide lamps for the Ti Sapphire laser) to useful pump bands at a rather high efficiency.
- the presented lamp pumped designs will have power output levels that exceed the diode pumped versions of these lasers for the same size.
- the efficiency of the visible light output (635-670 nm and 680.4 nm red light) from pump lasers utilized for Alexandrite devices operate at, e.g., approximately 20% efficiency conversion.
- the frequency doubled Nd lasers, which output 532 nm green light, used to pump Titanium Sapphire's green absorption band also operate at about 20% electrical to optical conversion efficiency.
- the electrical to optical efficiency of metal arc and metal halide arc lamps are both near 70-73%.
- This improvement and architecture can be used to amplify pulsed or continuous wave laser beams to very high power levels with a system efficiency that has an upper limit approaching forty percent.
- the per head output is expected to be in the 6.5-15.5 kW range for the head design presented for Alexandrite (for Titanium the range is ⁇ 3.6kW), but the designs are not limited to these power levels.
- FIG. 1 shows a schematic of the general configuration of one example embodiment of this invention.
- the ends of the slab crystal 1 and of the six pump lamps 2 extend outside of the housing 3.
- the housing allows for liquid cooling through slots 4. These slots 4 enter a water manifold external to the housing 3 as will be discussed later.
- FIG. 2 shows where cavity filter slabs 5 reside inside the housing on both sides of the laser slab crystal 1.
- the purpose of the cavity filter slabs 5 is to convert the ultra-violet portion of the light emitted from the pump lamps 2 into the visible spectrum where it is more readily absorbed by the slab laser crystal 1 material.
- FIG. 3 shows a schematic of an end view of the example embodiment showing the primary elements inside the general casing.
- the center of the structure is the laser slab crystal 1 surrounded on top and bottom by the cavity filter slabs 5 with gaps 8'.
- the six lamps 2 used to pump the laser crystal 1 are provided outside the cavity filter slabs 5.
- Surrounding these components are four ceramic reflectors 6 which are encased in a housing 7, which can be made of stainless steel.
- the housing 7 in FIG. 3 can be the same type as the housing 3 in FIG. 1, but that is not a requirement.
- a coolant such as cooling water, which flows to cool the lamps 2 and the slab crystal 1.
- FIG. 4 shows an example embodiment providing water manifolds 10 used to cool the laser.
- Two manifolds 10 cover slots 9 that extend through the external case 7 and through the ceramic reflectors 6'. Water is made to flow in opposite directions through the two slots 9 and through the gaps 8' to cool the central laser slab 1. Water also flows in a separate circuit in the axial direction (in the direction of the pump lamps 2 in Figs. 2 and 3) in gaps 8 to cool the pump lamps 2.
- the temperatures of the cooling water for the slab laser crystal 1 and for the pump lamps 2 can be different, since they are on separate circuits (described below) which allow for the slab to operate at an efficient temperature that is higher than that of the lamps.
- holes 11 drilled or otherwise provided in the ceramic reflectors 6' which are placed every few inches along the length of the laser slab 1 and the cavity filter slabs 5. These holes allow for silicon rubber or Teflon bumpers to be used to support the respective slabs and to absorb differences in thermal expansion as the laser elements heat up and thus expand.
- the silicon forms a water seal to keep the water between the slab laser crystal 1 and the cavity filter slabs 5 separate from the different temperature water that is cooling the pump lamps 2.
- the slab laser crystal 1 is comprised of Chromium doped Alexandrite (CriBeA ⁇ C ⁇ ), but in another example the slab laser crystal can be comprised of Titanium doped Sapphire.
- the bulk of the slab crystal is made up of the doped material. But it could also subsequently be processed with un-doped sections of Alexandrite crystal (BeA ⁇ C ⁇ ) or for the Ti Sapphire, clear undoped Sapphire on the edges and ends via diffusion bonding to produce clear caps.
- the purpose of the clear cap sections is to reduce the lens distortion due to thermal gradients produced at high pumping powers. These clear caps reduce the distortion effect by a factor of three as the undoped portion has no heat load from left over or un-extracted energy from the gain material.
- the preferred crystal growth method to produce the laser slab crystal would be via the classic Heat Exchange Method (HEM).
- HEM Heat Exchange Method
- This crystal growth technology produces inclusion-free crystals for either of the example gain materials.
- damage free power limits of, e.g. , up to 23 gigawatts per square centimeter can be realized for the Alexandrite material (with similar power handling capability results for the Sapphire material as well).
- Alexandrite crystals can be produced with a power limit of, e.g., 1-1.5 gigawatts per square centimeter radiance for 1 nanosecond pulse lengths.
- a reflective coating such as of silicon dioxide measuring about a micron thick, can be applied to the sides and possibly the edges to act as a reflector for the amplified laser light and to protect the seals where they may overlap a bounce site.
- the diffusion bonded clear caps can be omitted from the sides and the slab crystal can be enclosed on the sides inside the alumina ceramic cavity reflector with the added design element that a dielectric mirror coating be applied to the two sides and the end of the crystal to facilitate the desired reflections of the amplifying beam. This variation would permit a single seal, compressed around the body of the crystal.
- Example pump lamps 2 can utilize Mercury filled (e.g., with a 7 Torr Argon co- fill) clear polished sapphire envelopes or clear fused silica envelopes. Particularly when Sapphire is utilized, Kovar, which is a high nickel alloy that can be used in such lamps as it has a nearly matching expansion coefficient and can be brazed to the envelope using industrially standard techniques. Tungsten electrodes are brazed to the Kovar and are the electrodes establishing the arc in the Mercury.
- Mercury filled e.g., with a 7 Torr Argon co- fill
- Kovar which is a high nickel alloy that can be used in such lamps as it has a nearly matching expansion coefficient and can be brazed to the envelope using industrially standard techniques.
- Tungsten electrodes are brazed to the Kovar and are the electrodes establishing the arc in the Mercury.
- the lamps built and energized in such a manner have an efficiency of, e.g., about 72% for Mercury and, e.g., about 70% for Thallium Iodide.
- These example lamps are best driven with a high frequency AC power supply.
- Such power supplies are commercially available and are referred to as ballasts, with operating frequencies of 40-100 kHz.
- the lamp is sized by choosing the waste heat removal rate (e.g., 240 W/cm surface area using de-ionized water), and scaling to a useful size. For example, a lamp with a bore diameter of about 4.5 mm running at about 135 V/cm will pass about 5.8 amps.
- lamps 1 foot long can be run, e.g., as high as 35 KW or about 1000 watts per cm. However, for long life, the power is reduced to -400 watts per cm and the length is shortened. Normal practice is to use a 6 mm diameter fused clear quartz with, e.g. , a 2 mm bore with an arc that is about 8-15 cm long.
- Example cavity filter slabs 5 as shown in FIGs. 1-3 are each made up of a rectangular block crystal comprised of Terbium Fluoride (TbF 3 ) doped with -0.1% Samarium, which has absorption bands that encompass most of the ultra-violet spectrum.
- TbF 3 Terbium Fluoride
- the transfer of energy to the Samarium ion is a nearly lossless non-radiation transfer via the crystal matrix.
- the crystal then fluoresces at near the 595 nm peak absorption band of the Alexandrite crystal, converting otherwise wasted UV energy to useful visible light and thereby increases the pump efficiency of the system.
- the spectral output of Mercury lamps at this power level is approximately 1/3 in the UV.
- the use of the cavity filter slabs to recycle as much of the UV radiation energy as possible is desirable for increased efficiency.
- the Terbium Fluoride filter slabs reduce the amount of UV radiation that impinges on the Alexandrite crystal. That radiation, over time, would likely damage the crystal and reduce its transparency which, in turn, limits its usefulness and thus the useful life of the laser device.
- Other crystal designs are feasible to use for the cavity filter slabs as well. These include (but are not limited to) Terbium Garnet with Titanium doped Sapphire gain material; Terbium, Cerium, Titanium doped YALO; Gadolinium, Gallium, Terbium, Cerium , Samarium doped YAG; Terbium Fluoride doped with Samarium; and Terbium-Samarium doped Yttrium Lithium Fluoride. Each has its own specific advantages. Most are less efficient than Terbium Fluoride doped with Samarium, but the oxide crystals can handle higher power input levels with the offset that greater heat would be left behind due to lower conversion efficiency.
- the example ceramic cavity reflector 6, 6' as shown in FIG. 4 can be comprised of a non-degrading ceramic including, for example, a high purity AI 2 O 3 (Alumina) composition.
- the component can be finished with a sealing glaze that allows for a water tight seal on its edges via compressed silicon rubber seal, preferably white or clear.
- the cavity reflector 6 is designed to reflect the light (radiation) from the lamps 2 back into the device to be utilized.
- This reflector 6 is preferably made of an inert (thermally, chemically, and radiation) substance, such as the ceramic material described above.
- the arrangement of the cavity reflectors 6, 6' resembles a rectangular tube with two rectangular slots at each end to facilitate water flow in the open space 8 along the length of the lamps 2. This also cools one face of the cavity filter 5. Additionally, there are square reflector end caps at each end of the pump chamber, in which there are holes allowing the lamps to pass through. There is a separate seal compression plate to allow O-ring seals, of silicon rubber, to be compressed against the lamp walls and the reflector end. At one end there is a rectangular hole for the laser slab to fit through and be sealed via compression O-ring and seal plate.
- FIG. 5 shows the side view of the general shape of the example slab laser crystal 1.
- the shape is defined by a slab width 12, a slab length 13 as measured from the midpoint of each end, a wedge angle acting as a Brewster optical window 14 for the face where the incident and exit beams pass through, and an angle 15 for the reflecting end of the crystal. All four of these parameters are interconnected in the example embodiments, and the slab laser crystal 1 should have a specific set of these parameters for desired functioning.
- FIG. 6 shows a preferred example situation where the reflecting angle 15 is provided at 90 degrees and the entrance angle is set by the Brewster angle (for example, the Brewster angle for Alexandrite C axis is 60.06 degrees so the wedge angle 14 of the entrance surface is 29.94 degrees), then the desired slab length is uniquely related to the slab width.
- the length should be such that the beam center impinges on the corner of the slab at the reflecting end so that the exit beam is also on the center line.
- the incident and exit beam 16 are always co-linear.
- the light 20 from the pump lamps enters the top and bottom faces of the slab while the source laser light enters, and the amplified laser light exits, via the Brewster angle surface.
- the exit beam is also displaced in the opposite direction. This is shown in FIG. 7A, where the single incident beam 16 is halfway between the centerline and the edge of the entrance window. Then, if the incident beam (or plurality of beams) is only half of the size of the window as shown by 17 in FIG. 7B, then the exit beam 17' is physically separate from the incident beam 17.
- This configuration solves the problem of the separation of the beams, but limits the beam cross sectional area to be less than half of the size of the slab face.
- the front wedge angle 14 is not necessarily required to be set to the complement of the Brewster Angle as in the previous figures. As the angle of the wedge changes, the internal reflection angles of the beam 16 inside the slab changes, and the number of reflections for a given total length changes. Two examples of other incident wedge angles that work for the same length and width are shown in FIGs. 8A and 8B. In the first example of FIG. 8A, the wedge angle 14 is 37.6 degrees, and in the second example of FIG. 8B the wedge angle 14' is 46.2 degrees. It is possible to find a slab length that will work for a wide range of angles. In all such cases, however, the incident and exit beams are on top of each other (coincident) in the opposite directions.
- preferred example embodiments provide for the reflecting surface at the end of the slab to be at an angle different than 90 degrees.
- FIGs. 10A, 10B for two example angles 15 and 15'.
- the end angle 15 is at 88.25 degrees, and this results in the exit beam being separated by 9.41 degrees from the on axis input beam.
- the angle 15' is 91.80 degrees, and the exit beam is separated by 13.50 degrees from the input beam.
- Other angles can be used depending upon the ratio of slab length to slab width, and these two are only shown as examples. This configuration has the desirable features of separating the input and exit beams and allowing for the full aperture to be filled with the incident beam.
- FIG. 11 Another example design using the same materials and general arrangement discussed above but with a slightly different architecture is partially shown in FIG. 11. This variation would permit scaling to much higher power levels.
- the crystal axis is laterally rotated such that the B axis is along the 30 cm dimension.
- a single cavity filter slab 25 that lies between the pump lamps 22 and the laser gain material 21.
- FIG. 12 shows a cross section of the example of one of the segments 30 of an example laser amplifier chain, where the segment 30 incorporates the structure in FIG. 11.
- This figure shows the laser amplifier slab 21, the cavity filter slab 25, and the array of pump lamps 22. Also shown is the ceramic cavity reflector 26 which covers only one side of the amplifier slab 21, and a stainless steel case 27. The cavity reflector 26 is designed to reflect the light
- This reflector 26 is preferably made of an inert (thermally, chemically, and radiation) substance, such as a high alumina ceramic, for example.
- the gaps between the amplifier slab 21 and the cavity filter 25 allows for the passage of cooling water as before, and the space around the pump lamps 22 also allows for a separate circuit of cooling water.
- the slabs are held in place by seals 29 that keep the water circuits separate and allow for the thermal expansion of the parts as the temperature increases.
- FIG. 12 Also shown in FIG. 12 is the path of the amplified laser beam.
- the center of the beam is shown by a solid line 16 as it impinges on the surface of the gain crystal 21 at the Brewster Angle.
- the beam refracts (changes angle) as it crosses the surface, is totally reflected off the back surface, and exits at the Brewster Angle.
- the beam is wide, as indicated by the dashed lines 16' and 16" and traverses through the gain medium twice (in and out).
- FIG. 13 shows how the amplifier stages 30 could be combined into an amplifier chain to result in an amplified beam of extremely high power.
- the laser beam 16 alternately passes through each one of the amplifier stages 30 on each side of the beam path. Between each amplifier stage, there is a reflecting surface 31 which traps the pump lamp photons in a cavity until they are absorbed by the laser gain material.
- the laser amplifier could be constructed using the example lasers discussed with respect to FIGs. 1-4. As the power level increases along the amplifier chain, the amplifiers could change in design to the example configuration shown in FIGs. 11-13. The result is a very high power beam at higher efficiencies than previously possible, up to power handling limit of the exemplified gain materials grown via the HEM method.
- the laser beam is expanded in cross section so this architecture presents a large surface area slab for the beam to interact with. The size of the head is limited only by the size of the HEM furnace producing the boule, from which the slab crystal is cut.
- this configuration is made in a 15 cm high by 30 cm long active slab that is 1 cm thick, utilizing a beam cross section of ⁇ 15 cm x 15 cm, it would generate a beam with an enormous amount of peak and average power in a simple and relatively small device.
- the optimum pump lamp size is likely limited to ⁇ 15 cm in length or 6 Kilowatts of power for 6mm diameter 2mm bore envelopes. This limit is due to the 20% heat deposited in the electrodes (corresponding to 10% each end if operated on an AC waveform input).
- the electrode acting as an Anode gets the heat deposition, which occurs on each half cycle. This heat load is manageable in 6 mm diameter quartz tube with a long life. Different dimensions will have different heat removal characteristics and hence different lifetimes.
- the lamp would be constructed with the electrode sections entering at 90 degree arms with the 15 cm arc section between them in an abbreviated "U" configuration.
- This type of lamp would be mounted in staggered parallel sockets through the back reflector such that rows shown in FIG. 11 would be replaced with arrays.
- the arrangement could be such as to achieve uniform pump light intensity with either Thallium Iodide or Mercury arc lamps used with either Alexandrite (Mercury lamp) or Titanium Sapphire (Thallium Iodide lamp) laser slabs.
- a variation of the above described designs is to use Thallium Iodide along with Mercury as the fill in the arc lamp (this changes the spectrum of the pump light, reference Patent 7,061,182 that is incorporated by reference, which if modified to include cooling capability and have higher power loading, could be used as the pump light source to provide a longer lifetime at the cost of lower efficiencies).
- Another option is to use Indium Iodide as the fill inside the sapphire lamps with the Titanium doped sapphire (Ti: AI 2 O 3 ) as the laser slab gain medium.
- Ti: AI 2 O 3 Titanium doped sapphire
- a cavity filter would also be desirable for use as the lamp produces UV light.
- a cavity filter could be avoided for this (Hg/Ar + Thallium Iodide) configuration, since the lamp has an output of 71% at mostly 535 nm. This is a band which is almost at the peak of the Ti: AI 2 O 3 absorption band.
- PLD Physical Deposition
- a second beam at a higher repetition rate (e.g., 312.5 kHz) from a Titanium laser operated as an ultra- fast laser is directed at the in-transit plume of ionic atomic deposition material. This double laser use would greatly improve the quality of the produced films as any ejected particulate matter would be completely converted to atomic ionized matter by the second laser.
- An extension of this same technology and materials would be reusable heat shield vehicle skin materials, which would be lighter and stronger than current materials combinations.
- At the microscopic level of this same technology would be the PLD deposition of layers of semiconductor materials with subsequent removal of specific areas with subsequent deposition of other semiconductor materials to make a device.
- An illustrative example would be to manufacture diode laser boules with which to make inexpensive diode lasers as one example.
- This would be representative of Micro-electronic circuit or Micro Electro Mechanical devices or MEMs, as this high power pulsed laser technology when used in conjunction with frequency or harmonic conversion devices, would permit generation of previously unheard of power levels in short frequency portions of the spectrum, thereby permitting direct microelectronic device manufacture.
- This technology would be particularly useful for manufacturing Diamond-Like Carbon (DCL) -Microelectronic devices as another example.
- a further example is the depositing of a Boron Arsenide material as a heat spreader material for semiconductor heat control. In this area of application this laser could also be used as an enhanced ion emitter for very high speed molecular beam epitaxy manufacturing machines. This would be in addition to or replacement of the high voltage ion source guns in commercially available machines.
- the use of the Q switched source and the mode locked source (options utilizing nanosecond length pulses, and even picosecond or less pulse lengths acting on the ion source then the ion beam for super atomization would achieve beam currents that would be limited only by the target devices boules ability to accrete the deposited ions into a usable structure rather than being an inherent deposition thickness limit such as 1-10 microns per hour to millimeter or centimeter per hour thicknesses.
- DLC Diamond-Like Carbon
- DLC layers have at least four features that make them important for commercial applications.
- DLC has the desirable feature of being extremely hard, and a surface that is coated with DLC will virtually never show any wear.
- DLC layers have very high thermal conductivity (several times higher than copper) which make them ideal for use as thermal spreaders to remove heat from any surface to which it is attached.
- DLC layers are electrically insulating and have very high breakdown voltage (-10,000 volts per micron thickness).
- Fourth DLC has a very low coefficient of thermal expansion, permitting its use as a substrate for fabricating integrated circuits and microelectronic devices with extremely high operating power as the DLC would conduct the heat of operation away from compact monolithic stacked circuit structures.
- they can be used to provide effective electrical insulation with relatively thin layers or thick wafers/ slabs and stacked monolithic architectured blocks for use in many high voltage or otherwise high electric field density applications, including electrical capacitors for energy storage.
- DLC insulation applied to copper or aluminum wire used in manufacture of various products would permit a DLC insulated device to operate at higher temperatures than are possible with polymer insulation materials.
- the operating temperature limit for conventional polymer- insulated wire devices is about 200 degrees C.
- the DLC coating would function up to its graphitization temperature which begins near 400 degrees C.
- the combination of DLC's thermal conductivity, very low coefficient of thermal expansion, and voltage insulation permits devices to be built that are several times smaller in physical size than their polymer insulated counterparts and yet would still operate at the same power levels..
- DLC coatings created by Pulsed Laser Deposition have been demonstrated on small samples, but the barrier to larger scale commercial applications has been the lack of availability of low cost, higher power lasers like the slab laser disclosed herein.
- PLD Pulsed Laser Deposition
- One implementation is to use the Alexandrite and or Titanium laser, such as of a design disclosed herein, to produce high average power Q switch and or ultrafast pulses being directed at the donor sputter target, with a Titanium Sapphire version producing about 312,500 KHz or greater pulse speeds being used at the same time and being directed at the plume (thus super pulverizing, atomizing and ionizing it) while it is in flight to the substrate.
- This method can be used for any sputter material, and is not limited to graphite as source material.
- Another useful commercial application is in the production of low cost solar cells or integrated circuits by PLD.
- Virtually any material can be deposited on any substrate in any order and thickness with computer controlled deposition and removal of atomic amounts large or small of deposited material.
- the barrier to commercial applications has been the availability of a low cost high power laser source.
- any of the lasers disclosed herein can be used to enable the economical high speed generation of high efficiency multi-layer PV (photo-voltaic) films such as Silicon, Germanium, Gallium Arsenide on Germanium, Gallium Nitride, Gallium Indium Nitride, Gallium Phosphide or any other Gallium Alloy , Included is the claim that any existing semiconductor alloy currently in existence that has been produced by sputtering, Chemical Vapor or ion deposition on any substrate material can be produced with the described laser system or dual laser systems. This technology which would include the high speed large area manufacture of Graphene- a one atom thick sheet of Carbon atoms in single layer or multiple layer configurations grown into a specific shape part.
- PV films can be grown on suitable thermoplastic fabric or foil surfaces. This would provide a path for flexible PV arrays at low manufacturing cost compared to conventional MOCVD (metal organic chemical vapor deposition) methods.
- MOCVD metal organic chemical vapor deposition
- High power lasers have a number of applications in the areas of welding and/or cutting.
- the Q switched version of the slab laser would permit steel plates to be cut that are several to tens of inches thick at accelerated speeds. 20 kW C0 2 lasers are currently being used in shipyards, but 100 kW lasers are rare and very expensive. This would not likely be the case for the slab laser systems as disclosed herein, which can be made more economically.
- a single or combination laser source such as the described pulsed and or continuous wave (such as exemplified by 8,220,0965) used in conjunction as a high powered laser system can also be used for tunneling and/or underground excavation.
- the use of a continuous and/or Q switched pulse train beam as a combined architecture, would permit slicing the rock face of a target excavation into thick vertical slabs. If a rectangular section under the slices were to be excavated for the use of an articulated conveyor belt material removal system, and then the cutting beam were to then be directed horizontally several feet above this space on each vertical slice then after the horizontal slices were made then the weight of the slabs of rock, would at some point break the rock free to fall onto an articulated conveyor belt system.
- the pulse length of the lasers can be important to their application. The longer a pulse length of a laser, the more likely that the material being vaporized will contain undesirable particles in the plume. This may happen even with pulses that are several billionths, or nanoseconds, long. However, as one approaches a trillionth of a second long pulse, the atomic relaxation time is approached and this tends to limit the ability of the material to transfer heat energy to adjacent atoms, thus clumps tend to not cool enough to permit accretion and this enhances atomization and reduces particle contamination. That is one reason an explosive can be machined with an ultrafast system and not with a Q-Switched system, with an ultrashort or ultrafast pulse the heat of vaporization leaves with the plume.
- the power scaling law for damage thresholds is the 1 ⁇ 2 power or square root of the pulse length difference, on that basis a 5 GW/cm radiance level for a 1 ns long pulse, would withstand, e.g., 156 MW for a 1 picosecond long pulse.
- the actual pulse length is about 1 ⁇ 2 a nanosecond long and is compressed in a grating pair so as to chirp or spectrally overlap the spectral components. That brings up another problem with ultrafast amplifiers: the speed of light is usually different for different colors in most optical materials, which leads to "dispersion" where the 500 picosecond blue section travels slower than the 500 picosecond red section of the pulse itself. This is one of the most important reasons the average power output of most systems is limited for ultrafast systems and is typically provided under 100 watts.
- An example state of the art system costs $300k, is cooled with liquid nitrogen, and needs a Q switched, frequency doubled pump laser that is 5 times more powerful to get the 100 watts in order to drive it, thus producing a system that is, e.g., about $500k.
- the cost to get 3,600 watts out of the disclosed Ti Sapphire amplifier is in the order of, e.g., about $100,000 at the time of this writing.
- the reason that the manufacturer made the described 100 watt ultrafast system was that it did produce science, of which films of interest were made that Metal Oxide Chemical Vapor Deposition (MOCVD) could not.
- MOCVD Metal Oxide Chemical Vapor Deposition
- a solid state pulse compression technology based on directing a dispersed pulse through a series of high refractive index glass prisms that are arrayed in an antiparallel configuration could be utilized to correct this problem.
- the physical distance is longer for the slower waveform (higher frequency) through the glass and shorter for the faster waveform (lower frequency) the path length difference in air verses glass allows the slow frequency to be compensated by this strategy so it is back where it positionally was in the pulse, as it entered the amplifier.
- This architecture provides a stack that has a mirror at the end of the beam path such that the light is bounced back through the prism stack.
- These stacked prisms can be provided about the size of an amplifier head or longer, which is useful to provide a dispersion compensation head or heads next to the actual power head or heads.
- Figure 14 shows a pulse from the source in a first seed laser 40 through the amplifier 42 and mirrors 48, 47 to its end point in the process chamber 45 and then we will repeat this for a second seed laser41.
- the first seed laser 40 acts as a seed for the ultrafast amplifier chain 42.
- the pulse-length frequency and repetition rate is defined in this component according to the desired application. For example, it can produce a 1 ⁇ 2 nanosecond pulse, with this pulse having, e.g., a 100 nm wide bandwidth 750nm to 850 nm, with pulses of, e.g., 312,500 per second being emitted.
- the florescence output bandwidth of Titanium Sapphire produces light from 650 nm to 1 lOOnm at the same rates as mentioned, allowing operation of the laser at those frequencies, where desirable.
- the amplifier chain can comprise of a series array of amplifier modules such as shown in fig 1 for an example module, where the pulse is introduced into the gain crystal of Titanium Sapphire, as shown in FIGs. 2 & 10A and 10B.
- the laser beam propagates from face to face (FIG. 10A & 10B) as it traverses the crystal from end to end and back again, though it will enter and exit at different angles for separation purposes, it is being amplified and dispersed because the speed of light for the red component is faster than the blue component. This causes those sections which are each still 1 ⁇ 2 ns long, to be delayed relative to each other and effectively lengthens the pulse.
- the pulse Upon exiting the first slab, the pulse can be directed into a dispersion compensator or compressor, (described below) which will reverse the displacement effect of the gain crystal such that the now amplified pulse is back to being 1 ⁇ 2 ns long,. This is repeated for each amplification stage until the desired power level is reached, at which point the pulse is compressed with the same kind and design of compensator but the architecture and size is perhaps larger to accommodate the higher energy levels.
- the compression device can be built to produce a pulse that is 5,000 times shorter by a process called chirping. This is where the blue and red sections are translated in time such that they partially extremely overlap and portions of the tail and leading edges of the different colors have been separated such that they destructively interfere, this effect leaves the un overlapped section in the center of the pulse that is at the 1 picosecond length level but does not decrease the energy content of the pulse.
- the final compression stage would be located in the first amplifier 42 housing at the end of an included amplifier chain to output beam 51.
- the emitted beam 51 would proceed to the first beam splitter 48, where a portion 51' of the ultrafast pulse energy would be reflected down to the process or sample chamber 45 to thermalize a substance into the particles in the plume 58 of figure 15. the other portion of beam 51
- the splitter 45 enters the tripler module 44, where a fraction of the pulse energy is converted, e.g., into photons of 1/3 wavelength or 266nm. These photons and this portion of the pulse is directed onto turning mirror 47, where the 1 picosecond 266 nm light pulse 52, is directed onto the sample being coated in the sample chamber 45, as shown in FIG. 15 sample 59. This is where the UV photons displace electrons from the surface of the sample 59 and photo-ionize the surface, thus enhancing the coating quality and speed.
- second seed laser 41 generates a beam 53 with, e.g., a 50ns long pulse that has up to 100 nm bandwidth, at a rate of 13,333 pulses per second (pulse width, repetition rate and bandwidth are chosen by coating engineer to optimize process).
- This beam 53 is directed into the amplifier chain 43 , where the pulse is increased in energy content and exits the amplifier chain 43 via beam path 54 to another mirror 47, where it is directed onto the source material in the sample chamber 45.
- the source sample 57 is shown in FIG. 15, which is to be vaporized and become the atomized plume 58.
- FIG.14 shows an example component architecture for the layout of a real world PLD laser source generator that incorporates both the Alexandrite MOPA and the
- Titanium Sapphire MOPA systems described herein. Each has a corresponding seed laser or Master oscillator, 40, 41, which can be a Ti Sapphire and an Alexandrite master oscillator, respectively.
- a master oscillator defines the coherence length, pulse frequency, pulse length and repetition rate for each amplifier chain.
- seed 40 is the ultrafast seed laser, which would produce approximately 1 ⁇ 2 nanosecond (or less) pulses with about 100 nm bandwidth (750nm- 850nm) (or a narrower bandwidth) that was, e.g., repeated about every3.2 (or less) or 312,500 times per second (or more). It would most likely be mode locked in (a method of producing very short duration very coherent seed pulse) in order to achieve these short pulses.
- seed 41 would be a source for the Alexandrite amplifier chain 43, and it would produce Q switched, e.g., 50 ns +/-20 ns pulses with a 100 nm or less bandwidth, every, e.g., 75 or 13,333 times per second.
- the bandwidth is a desirable feature for an ultrafast laser, as the pulse length is compressed up to 6000 times by overlapping the spectral components of the blue components and the red components to destructively interfere in the timeframe of each individual pulse. This effect is possible because of the coherence length of the seed pulse (in which the peaks and valleys of the photon's amplitude waves are lined up like marching soldiers).
- Beam 52 is the photo-ionizing, e.g., 266 nm ultraviolet beam portion illuminating the sample 59.
- the larger portion that thermalizes or atomizes the plume 58 is via beam 51, and the higher average power, lower repetition rate Alexandrite beam 54 is illuminating the ion source 57.
- the particulars of optimization via angles of incidence irradiance levels on plume, source and substrate are within the film engineer's discretion. All of these parameters are variable by changing the
- semiconductor manufacture doping and/or depositing layers on semiconductor substrates as workpieces
- desirable materials such as diamond or DLC.
- MOPA Master Oscillator Power Amplifier
- Each type of gain material has characteristics that favor generation of complimentary pulse lengths and energy levels.
- the Alexandrite MOPA is best utilized generating, e.g., 1-200 nanosecond long pulses, often called Q Switched, in its repetitive pulse train, whereas the Titanium Sapphire MPOA preferentially generates sub-nanosecond pulse lengths that would be suitable for compression to the sub picosecond pulse lengths, often called ultrafast.
- Anti-parallel grating compression or Active mirror prism compression systems would be utilized. Alternately, a Stimulated Brillion
- Scattering mirror could be used with the compression prisms such that wavefront distortions would be corrected simultaneously.
- a PLD system designer could utilize the two different types of lasers described herein in the same coater system.
- Each type of laser is tunable, so within a standard mirror coating bandwidth, which is typically ⁇ 10% of the centerline frequency, both could easily operate at separate but distinct output frequencies that both would produce polarized outputs.
- High reflectivity polarization beam splitters or mirrors would be used to combine or separate both beams-most likely at the source.
- the Titanium Sapphire crystal has a fluorescence lifetime that is, e.g., about 3.2 vs. the Alexandrite that at typical amplifier design system operating temperature, is, e.g., about 75 though it does have a fluorescence lifetime that ranges from, e.g., 1.5 milliseconds at subfreezing temperatures to, e.g., 75 at 150 degrees Centigrade. This relates to output power and extraction efficiency as the emission cross section changes for Alexandrite at different temperatures. If a gain medium is charged to saturation, a designer can extract a pulse and recharge the gain crystal within this time frame or faster.
- Ti Sapphire lasers are typically pumped, e.g., with 5-200 ns though the average is 50ns+/-20ns, green laser pulses and often the gain section of the Ti Sapphire crystal is saturated so it becomes super radiant.
- the gain crystal will produce a much shorter pulse ( ⁇ 2-5ns) without any special approach, like adding a Q switch and associated electronics. Alternately if you want much longer pulses such as in welders that are milliseconds long, pump energy should be added at a rate sufficient to charge the gain material over multiples of that fluorescence timeframe, so in fact they are being run at quasi-CW during the pulse.
- the disclosed design takes advantage of the fact that amplifiers don't need to be charged or pumped to levels that would allow them to run as oscillators, though the Alexandrite device could operate as an oscillator, if desired.
- the lasers are just charged at whatever level the lamps (in the disclosed design) will permit-but because the lamp emission is used as efficiently as disclosed, the amplifiers can have a pulse sent through them to extract that stored energy between the fluorescent timeframe.
- the real world PLD system design will direct the ultrafast and/or Q switched pulse trains onto the plume (FIG.15 item 51) and perhaps have a Portion of said beam or beams up converted, in harmonic generators, (FIG.14 item 44) to reach the short wave UV spectrum so that a designer will have the option to direct the optical power levels and frequencies of interest upon and irradiate the intended plume and or substrate (FIG.15 items 51 & 54) such that the atomic clumps or particles will be atomized and, ionized or removed and the surface of the substrate being coated will also be photo ionized (and have electrons knocked off) such that this state will increase the accretion rate and structured atomic assembly.
- the temperature dependent emission cross section relates to extraction efficiency, and the damage threshold levels will need to be carefully designed and kept to levels safely under this limit, as the active gain volume in the design favors very high energy content pulse trains that could cause damage if components in the laser path are damaged or disturbed.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13824767.1A EP2880722B1 (en) | 2012-08-03 | 2013-08-01 | Slab laser and amplifier and method of use |
| CN201380046502.1A CN104604049B (zh) | 2012-08-03 | 2013-08-01 | 板条激光器和放大器以及其使用方法 |
| RU2015102528A RU2650807C9 (ru) | 2012-08-03 | 2013-08-01 | Слэб-лазер и усилитель и способ использования |
| US14/418,500 US9287112B2 (en) | 2011-08-04 | 2013-08-01 | Slab laser and amplifier and method of use |
| JP2015525585A JP6415435B2 (ja) | 2012-08-03 | 2013-08-01 | スラブレーザおよび増幅器ならびに使用方法 |
| BR112015002090-9A BR112015002090B1 (pt) | 2012-08-03 | 2013-08-01 | dispositivo de laser, sistema para a amplificação de luz, dispositivo de amplificação de laser, e sistema para a transferência de um material de um primeiro objeto a um segundo objeto |
| EP17152815.1A EP3185373B1 (en) | 2012-08-03 | 2013-08-01 | Slab laser and amplifier |
| CA2879746A CA2879746A1 (en) | 2012-08-03 | 2013-08-01 | Slab laser and amplifier and method of use |
| IN970DEN2015 IN2015DN00970A (enExample) | 2012-08-03 | 2013-08-01 | |
| US15/068,950 US9525262B2 (en) | 2011-08-04 | 2016-03-14 | Slab laser and amplifier and method of use |
| US15/348,321 US20170070022A1 (en) | 2011-08-04 | 2016-11-10 | Slab laser and amplifier and method of use |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/566,144 | 2012-08-03 | ||
| US13/566,144 US9246299B2 (en) | 2011-08-04 | 2012-08-03 | Slab laser and amplifier |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/566,144 Continuation US9246299B2 (en) | 2011-08-04 | 2012-08-03 | Slab laser and amplifier |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US14/418,500 A-371-Of-International US9287112B2 (en) | 2011-08-04 | 2013-08-01 | Slab laser and amplifier and method of use |
| US15/068,950 Continuation US9525262B2 (en) | 2011-08-04 | 2016-03-14 | Slab laser and amplifier and method of use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2014022635A1 true WO2014022635A1 (en) | 2014-02-06 |
Family
ID=49548573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2013/053166 Ceased WO2014022635A1 (en) | 2011-08-04 | 2013-08-01 | Slab laser and amplifier and method of use |
Country Status (9)
| Country | Link |
|---|---|
| US (5) | US9246299B2 (enExample) |
| EP (2) | EP2880722B1 (enExample) |
| JP (2) | JP6415435B2 (enExample) |
| CN (1) | CN104604049B (enExample) |
| BR (1) | BR112015002090B1 (enExample) |
| CA (1) | CA2879746A1 (enExample) |
| IN (1) | IN2015DN00970A (enExample) |
| RU (1) | RU2650807C9 (enExample) |
| WO (1) | WO2014022635A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2569904C1 (ru) * | 2014-06-25 | 2015-12-10 | Владимир Валентинович Павлов | Лазерное устройство с пластинчатым оптическим элементом |
| US10329659B2 (en) * | 2014-08-29 | 2019-06-25 | National Institute Of Advanced Industrial Science And Technology | Method for laser deposition of organic material film or organic-inorganic composite material film, and laser deposition apparatus |
| WO2021141882A1 (en) * | 2020-01-06 | 2021-07-15 | Battelle Energy Alliance, Llc | Solid state nuclear pumped lasing sensors for in pile reactor power and flux measurement, direct energy conversion, and related methods |
Families Citing this family (121)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9986663B2 (en) * | 2013-01-29 | 2018-05-29 | The United States Of America, As Represented By The Secretary Of The Navy | High thermal conductivity materials for thermal management applications |
| KR102193150B1 (ko) * | 2013-12-27 | 2020-12-21 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 증착량 제어 방법 |
| KR102192983B1 (ko) * | 2014-01-15 | 2020-12-21 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 증착 속도 산출 방법 |
| CN106536336B (zh) | 2014-05-16 | 2019-04-12 | 迪根特技术公司 | 用于载具底盘的模块化成形节点及其使用方法 |
| EP3164260B1 (en) | 2014-07-02 | 2021-07-28 | Divergent Technologies, Inc. | Vehicle chassis |
| US10220471B2 (en) | 2015-10-14 | 2019-03-05 | Lawrence Livermore National Security, Llc | Spatter reduction laser scanning strategy in selective laser melting |
| EP3368314A4 (en) | 2015-10-30 | 2019-05-01 | Seurat Technologies, Inc. | MULTIFUNCTIONAL INGESTER SYSTEM FOR GENERATIVE MANUFACTURING |
| US11701819B2 (en) | 2016-01-28 | 2023-07-18 | Seurat Technologies, Inc. | Additive manufacturing, spatial heat treating system and method |
| US11148319B2 (en) * | 2016-01-29 | 2021-10-19 | Seurat Technologies, Inc. | Additive manufacturing, bond modifying system and method |
| DE102016108474A1 (de) | 2016-05-09 | 2017-11-09 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Festkörper, Laserverstärkungssystem und Festkörperlaser |
| WO2017204358A1 (ja) * | 2016-05-27 | 2017-11-30 | 富士フイルム株式会社 | 固体レーザ装置 |
| US10173255B2 (en) | 2016-06-09 | 2019-01-08 | Divergent Technologies, Inc. | Systems and methods for arc and node design and manufacture |
| CN106602391B (zh) * | 2016-12-09 | 2019-04-30 | 中国人民解放军海军航空工程学院 | 一种具备波前畸变自校正能力的板条激光模块 |
| US10759090B2 (en) | 2017-02-10 | 2020-09-01 | Divergent Technologies, Inc. | Methods for producing panels using 3D-printed tooling shells |
| US11155005B2 (en) | 2017-02-10 | 2021-10-26 | Divergent Technologies, Inc. | 3D-printed tooling and methods for producing same |
| US12251884B2 (en) | 2017-04-28 | 2025-03-18 | Divergent Technologies, Inc. | Support structures in additive manufacturing |
| US10898968B2 (en) | 2017-04-28 | 2021-01-26 | Divergent Technologies, Inc. | Scatter reduction in additive manufacturing |
| JP7208162B2 (ja) | 2017-05-11 | 2023-01-18 | シューラット テクノロジーズ,インク. | 付加製造最適化のためのパターン化された光の固体ルーティング |
| CN115464159B (zh) | 2017-05-11 | 2024-07-16 | 速尔特技术有限公司 | 用于增材制造的图案化光的开关站射束路由 |
| US10703419B2 (en) | 2017-05-19 | 2020-07-07 | Divergent Technologies, Inc. | Apparatus and methods for joining panels |
| US11358337B2 (en) | 2017-05-24 | 2022-06-14 | Divergent Technologies, Inc. | Robotic assembly of transport structures using on-site additive manufacturing |
| US11123973B2 (en) | 2017-06-07 | 2021-09-21 | Divergent Technologies, Inc. | Interconnected deflectable panel and node |
| US10919230B2 (en) | 2017-06-09 | 2021-02-16 | Divergent Technologies, Inc. | Node with co-printed interconnect and methods for producing same |
| US10781846B2 (en) | 2017-06-19 | 2020-09-22 | Divergent Technologies, Inc. | 3-D-printed components including fasteners and methods for producing same |
| US10994876B2 (en) | 2017-06-30 | 2021-05-04 | Divergent Technologies, Inc. | Automated wrapping of components in transport structures |
| US11022375B2 (en) | 2017-07-06 | 2021-06-01 | Divergent Technologies, Inc. | Apparatus and methods for additively manufacturing microtube heat exchangers |
| US10895315B2 (en) | 2017-07-07 | 2021-01-19 | Divergent Technologies, Inc. | Systems and methods for implementing node to node connections in mechanized assemblies |
| US10751800B2 (en) | 2017-07-25 | 2020-08-25 | Divergent Technologies, Inc. | Methods and apparatus for additively manufactured exoskeleton-based transport structures |
| US10940609B2 (en) | 2017-07-25 | 2021-03-09 | Divergent Technologies, Inc. | Methods and apparatus for additively manufactured endoskeleton-based transport structures |
| US10605285B2 (en) | 2017-08-08 | 2020-03-31 | Divergent Technologies, Inc. | Systems and methods for joining node and tube structures |
| US10357959B2 (en) | 2017-08-15 | 2019-07-23 | Divergent Technologies, Inc. | Methods and apparatus for additively manufactured identification features |
| US11306751B2 (en) | 2017-08-31 | 2022-04-19 | Divergent Technologies, Inc. | Apparatus and methods for connecting tubes in transport structures |
| US10960611B2 (en) | 2017-09-06 | 2021-03-30 | Divergent Technologies, Inc. | Methods and apparatuses for universal interface between parts in transport structures |
| US11292058B2 (en) | 2017-09-12 | 2022-04-05 | Divergent Technologies, Inc. | Apparatus and methods for optimization of powder removal features in additively manufactured components |
| US10814564B2 (en) | 2017-10-11 | 2020-10-27 | Divergent Technologies, Inc. | Composite material inlay in additively manufactured structures |
| US10668816B2 (en) | 2017-10-11 | 2020-06-02 | Divergent Technologies, Inc. | Solar extended range electric vehicle with panel deployment and emitter tracking |
| US10752986B2 (en) * | 2017-10-30 | 2020-08-25 | Savannah River Nuclear Solutions, Llc | Method of manufacturing a three-dimensional carbon structure |
| US11786971B2 (en) | 2017-11-10 | 2023-10-17 | Divergent Technologies, Inc. | Structures and methods for high volume production of complex structures using interface nodes |
| US10926599B2 (en) | 2017-12-01 | 2021-02-23 | Divergent Technologies, Inc. | Suspension systems using hydraulic dampers |
| US11110514B2 (en) | 2017-12-14 | 2021-09-07 | Divergent Technologies, Inc. | Apparatus and methods for connecting nodes to tubes in transport structures |
| US11085473B2 (en) | 2017-12-22 | 2021-08-10 | Divergent Technologies, Inc. | Methods and apparatus for forming node to panel joints |
| US11534828B2 (en) | 2017-12-27 | 2022-12-27 | Divergent Technologies, Inc. | Assembling structures comprising 3D printed components and standardized components utilizing adhesive circuits |
| US11420262B2 (en) | 2018-01-31 | 2022-08-23 | Divergent Technologies, Inc. | Systems and methods for co-casting of additively manufactured interface nodes |
| US10751934B2 (en) | 2018-02-01 | 2020-08-25 | Divergent Technologies, Inc. | Apparatus and methods for additive manufacturing with variable extruder profiles |
| US11224943B2 (en) | 2018-03-07 | 2022-01-18 | Divergent Technologies, Inc. | Variable beam geometry laser-based powder bed fusion |
| US11267236B2 (en) | 2018-03-16 | 2022-03-08 | Divergent Technologies, Inc. | Single shear joint for node-to-node connections |
| US11254381B2 (en) | 2018-03-19 | 2022-02-22 | Divergent Technologies, Inc. | Manufacturing cell based vehicle manufacturing system and method |
| US11872689B2 (en) | 2018-03-19 | 2024-01-16 | Divergent Technologies, Inc. | End effector features for additively manufactured components |
| US11408216B2 (en) | 2018-03-20 | 2022-08-09 | Divergent Technologies, Inc. | Systems and methods for co-printed or concurrently assembled hinge structures |
| US11613078B2 (en) | 2018-04-20 | 2023-03-28 | Divergent Technologies, Inc. | Apparatus and methods for additively manufacturing adhesive inlet and outlet ports |
| US11214317B2 (en) | 2018-04-24 | 2022-01-04 | Divergent Technologies, Inc. | Systems and methods for joining nodes and other structures |
| US10682821B2 (en) | 2018-05-01 | 2020-06-16 | Divergent Technologies, Inc. | Flexible tooling system and method for manufacturing of composite structures |
| US11020800B2 (en) | 2018-05-01 | 2021-06-01 | Divergent Technologies, Inc. | Apparatus and methods for sealing powder holes in additively manufactured parts |
| US11389816B2 (en) | 2018-05-09 | 2022-07-19 | Divergent Technologies, Inc. | Multi-circuit single port design in additively manufactured node |
| US10691104B2 (en) | 2018-05-16 | 2020-06-23 | Divergent Technologies, Inc. | Additively manufacturing structures for increased spray forming resolution or increased fatigue life |
| US11590727B2 (en) | 2018-05-21 | 2023-02-28 | Divergent Technologies, Inc. | Custom additively manufactured core structures |
| US11441586B2 (en) | 2018-05-25 | 2022-09-13 | Divergent Technologies, Inc. | Apparatus for injecting fluids in node based connections |
| US11035511B2 (en) | 2018-06-05 | 2021-06-15 | Divergent Technologies, Inc. | Quick-change end effector |
| US11292056B2 (en) | 2018-07-06 | 2022-04-05 | Divergent Technologies, Inc. | Cold-spray nozzle |
| CN108963740B (zh) * | 2018-07-09 | 2019-08-09 | 北京空间机电研究所 | 一种板条固体激光器泵浦增益模块 |
| US11269311B2 (en) | 2018-07-26 | 2022-03-08 | Divergent Technologies, Inc. | Spray forming structural joints |
| US10836120B2 (en) | 2018-08-27 | 2020-11-17 | Divergent Technologies, Inc . | Hybrid composite structures with integrated 3-D printed elements |
| US11433557B2 (en) | 2018-08-28 | 2022-09-06 | Divergent Technologies, Inc. | Buffer block apparatuses and supporting apparatuses |
| US11826953B2 (en) | 2018-09-12 | 2023-11-28 | Divergent Technologies, Inc. | Surrogate supports in additive manufacturing |
| US11072371B2 (en) | 2018-10-05 | 2021-07-27 | Divergent Technologies, Inc. | Apparatus and methods for additively manufactured structures with augmented energy absorption properties |
| US11260582B2 (en) | 2018-10-16 | 2022-03-01 | Divergent Technologies, Inc. | Methods and apparatus for manufacturing optimized panels and other composite structures |
| US12115583B2 (en) | 2018-11-08 | 2024-10-15 | Divergent Technologies, Inc. | Systems and methods for adhesive-based part retention features in additively manufactured structures |
| US12194536B2 (en) | 2018-11-13 | 2025-01-14 | Divergent Technologies, Inc. | 3-D printer with manifolds for gas exchange |
| US11504912B2 (en) | 2018-11-20 | 2022-11-22 | Divergent Technologies, Inc. | Selective end effector modular attachment device |
| USD911222S1 (en) | 2018-11-21 | 2021-02-23 | Divergent Technologies, Inc. | Vehicle and/or replica |
| US12011873B2 (en) | 2018-12-14 | 2024-06-18 | Seurat Technologies, Inc. | Additive manufacturing system for object creation from powder using a high flux laser for two-dimensional printing |
| US11529741B2 (en) | 2018-12-17 | 2022-12-20 | Divergent Technologies, Inc. | System and method for positioning one or more robotic apparatuses |
| US10663110B1 (en) | 2018-12-17 | 2020-05-26 | Divergent Technologies, Inc. | Metrology apparatus to facilitate capture of metrology data |
| US11449021B2 (en) | 2018-12-17 | 2022-09-20 | Divergent Technologies, Inc. | Systems and methods for high accuracy fixtureless assembly |
| WO2020132215A1 (en) | 2018-12-19 | 2020-06-25 | Seurat Technologies, Inc. | Additive manufacturing system using a pulse modulated laser for two-dimensional printing |
| US11885000B2 (en) | 2018-12-21 | 2024-01-30 | Divergent Technologies, Inc. | In situ thermal treatment for PBF systems |
| US12378643B2 (en) | 2019-01-18 | 2025-08-05 | Divergent Technologies, Inc. | Aluminum alloys |
| JP7341673B2 (ja) * | 2019-02-27 | 2023-09-11 | 三菱重工業株式会社 | レーザ装置 |
| US11203240B2 (en) | 2019-04-19 | 2021-12-21 | Divergent Technologies, Inc. | Wishbone style control arm assemblies and methods for producing same |
| US12314031B1 (en) | 2019-06-27 | 2025-05-27 | Divergent Technologies, Inc. | Incorporating complex geometric features in additively manufactured parts |
| US12280554B2 (en) | 2019-11-21 | 2025-04-22 | Divergent Technologies, Inc. | Fixtureless robotic assembly |
| CN112886378A (zh) * | 2019-11-29 | 2021-06-01 | 山东大学 | 一种590nm波段拉曼倍频光源泵浦的翠绿宝石被动锁模激光器 |
| US11912339B2 (en) | 2020-01-10 | 2024-02-27 | Divergent Technologies, Inc. | 3-D printed chassis structure with self-supporting ribs |
| US11590703B2 (en) | 2020-01-24 | 2023-02-28 | Divergent Technologies, Inc. | Infrared radiation sensing and beam control in electron beam additive manufacturing |
| US12194674B2 (en) | 2020-02-14 | 2025-01-14 | Divergent Technologies, Inc. | Multi-material powder bed fusion 3-D printer |
| US11479015B2 (en) | 2020-02-14 | 2022-10-25 | Divergent Technologies, Inc. | Custom formed panels for transport structures and methods for assembling same |
| US11884025B2 (en) | 2020-02-14 | 2024-01-30 | Divergent Technologies, Inc. | Three-dimensional printer and methods for assembling parts via integration of additive and conventional manufacturing operations |
| US12203397B2 (en) | 2020-02-18 | 2025-01-21 | Divergent Technologies, Inc. | Impact energy absorber with integrated engine exhaust noise muffler |
| CN111293579B (zh) * | 2020-02-21 | 2021-07-27 | 中国航空制造技术研究院 | 一种用于板条激光晶体的双面水冷装置 |
| US11421577B2 (en) | 2020-02-25 | 2022-08-23 | Divergent Technologies, Inc. | Exhaust headers with integrated heat shielding and thermal syphoning |
| US11535322B2 (en) | 2020-02-25 | 2022-12-27 | Divergent Technologies, Inc. | Omni-positional adhesion device |
| US12337541B2 (en) | 2020-02-27 | 2025-06-24 | Divergent Technologies, Inc. | Powder bed fusion additive manufacturing system with desiccant positioned within hopper and ultrasonic transducer |
| US11413686B2 (en) | 2020-03-06 | 2022-08-16 | Divergent Technologies, Inc. | Methods and apparatuses for sealing mechanisms for realizing adhesive connections with additively manufactured components |
| WO2021207548A1 (en) * | 2020-04-10 | 2021-10-14 | Seurat Technologies, Inc. | High throughput additive manufacturing system supporting absorption of amplified spontaneous emission in laser amplifiers |
| US12088055B2 (en) * | 2020-04-10 | 2024-09-10 | Seurat Technologies, Inc. | Fluid edge cladding for spectroscopic absorption of laser emissions and amplified spontaneous emission |
| KR20230035571A (ko) | 2020-06-10 | 2023-03-14 | 디버전트 테크놀로지스, 인크. | 적응형 생산 시스템 |
| US11850804B2 (en) | 2020-07-28 | 2023-12-26 | Divergent Technologies, Inc. | Radiation-enabled retention features for fixtureless assembly of node-based structures |
| US11806941B2 (en) | 2020-08-21 | 2023-11-07 | Divergent Technologies, Inc. | Mechanical part retention features for additively manufactured structures |
| EP4210899A4 (en) | 2020-09-08 | 2024-09-25 | Divergent Technologies, Inc. | ASSEMBLY SEQUENCE GENERATION |
| US12103008B2 (en) | 2020-09-22 | 2024-10-01 | Divergent Technologies, Inc. | Methods and apparatuses for ball milling to produce powder for additive manufacturing |
| US12220819B2 (en) | 2020-10-21 | 2025-02-11 | Divergent Technologies, Inc. | 3-D printed metrology feature geometry and detection |
| US12162074B2 (en) | 2020-11-25 | 2024-12-10 | Lawrence Livermore National Security, Llc | System and method for large-area pulsed laser melting of metallic powder in a laser powder bed fusion application |
| US12311612B2 (en) | 2020-12-18 | 2025-05-27 | Divergent Technologies, Inc. | Direct inject joint architecture enabled by quick cure adhesive |
| US12083596B2 (en) | 2020-12-21 | 2024-09-10 | Divergent Technologies, Inc. | Thermal elements for disassembly of node-based adhesively bonded structures |
| US12226824B2 (en) | 2020-12-22 | 2025-02-18 | Divergent Technologies, Inc. | Three dimensional printer with configurable build plate for rapid powder removal |
| US11872626B2 (en) | 2020-12-24 | 2024-01-16 | Divergent Technologies, Inc. | Systems and methods for floating pin joint design |
| US11947335B2 (en) | 2020-12-30 | 2024-04-02 | Divergent Technologies, Inc. | Multi-component structure optimization for combining 3-D printed and commercially available parts |
| US11928966B2 (en) | 2021-01-13 | 2024-03-12 | Divergent Technologies, Inc. | Virtual railroad |
| US12459377B2 (en) | 2021-01-19 | 2025-11-04 | Divergent Technologies, Inc. | Energy unit cells for primary vehicle structure |
| US12249812B2 (en) | 2021-01-19 | 2025-03-11 | Divergent Technologies, Inc. | Bus bars for printed structural electric battery modules |
| RU2757834C1 (ru) * | 2021-01-28 | 2021-10-21 | Акционерное Общество "Наука И Инновации" | Съемная кассета для усилительного модуля |
| US20220288689A1 (en) | 2021-03-09 | 2022-09-15 | Divergent Technologies, Inc. | Rotational additive manufacturing systems and methods |
| CN117545616A (zh) | 2021-04-23 | 2024-02-09 | 戴弗根特技术有限公司 | 从表面和中空3d打印部件内移除支撑物和其他材料 |
| US12138772B2 (en) | 2021-04-30 | 2024-11-12 | Divergent Technologies, Inc. | Mobile parts table |
| US12365965B2 (en) | 2021-07-01 | 2025-07-22 | Divergent Technologies, Inc. | Al—Mg—Si based near-eutectic alloy composition for high strength and stiffness applications |
| US11865617B2 (en) | 2021-08-25 | 2024-01-09 | Divergent Technologies, Inc. | Methods and apparatuses for wide-spectrum consumption of output of atomization processes across multi-process and multi-scale additive manufacturing modalities |
| CN113991397B (zh) * | 2021-10-28 | 2023-06-27 | 河北工业大学 | 一种固体激光阵列放大器 |
| CN118202555A (zh) | 2021-11-02 | 2024-06-14 | 戴弗根特技术有限公司 | 电机节点 |
| US12152629B2 (en) | 2022-01-25 | 2024-11-26 | Divergent Technologies, Inc. | Attachment structure having a connection member with multiple attachment features |
| CN114779373B (zh) * | 2022-03-14 | 2024-03-26 | 清华大学 | 光功率分束器及其制备方法 |
| CN119275690A (zh) * | 2024-12-09 | 2025-01-07 | 厦门纽立特电子科技有限公司 | 一种高功率板条激光放大器 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4220158A1 (de) * | 1992-06-19 | 1993-12-23 | Battelle Institut E V | Verfahren zur selektiven Abscheidung von Aluminiumstrukturen aus der Gasphase |
| RU8168U1 (ru) * | 1997-11-28 | 1998-10-16 | Валерий Геннадиевич Полушкин | Активный лазерный элемент с волноводным режимом работы |
| US6347101B1 (en) * | 1998-04-16 | 2002-02-12 | 3D Systems, Inc. | Laser with absorption optimized pumping of a gain medium |
| EP1566865A2 (en) * | 2004-02-19 | 2005-08-24 | National Institute of Information and Communications Technology Incorporated Administrative Agency | Slab type solid-state laser medium and slab type nonlinear optical medium each using light path formed by multiple reflection caused by three reflecting surfaces |
| EP1646117A2 (en) * | 2000-05-30 | 2006-04-12 | Northrop Grumman Corporation | Optical amplifier comprising an end pumped zig-zag slab gain medium |
Family Cites Families (76)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3631362A (en) | 1968-08-27 | 1971-12-28 | Gen Electric | Face-pumped, face-cooled laser device |
| US3633126A (en) | 1969-04-17 | 1972-01-04 | Gen Electric | Multiple internal reflection face-pumped laser |
| US3766490A (en) * | 1972-03-14 | 1973-10-16 | Us Army | Lu:nd:yag laser system and material |
| AU1363076A (en) * | 1976-05-04 | 1977-11-10 | Ward H | Laser amplification |
| US4734917A (en) * | 1985-12-31 | 1988-03-29 | General Electric Company | Fluorescent converter pumped cavity for laser system |
| US4769823A (en) | 1985-12-31 | 1988-09-06 | General Electric Company | Laser system with trivalent chromium doped aluminum tungstate fluorescent converter |
| US4794616A (en) * | 1985-12-31 | 1988-12-27 | General Electric Company | Laser system with solid state fluorescent converter matrix having distributed fluorescent converter particles |
| US4838243A (en) | 1987-04-17 | 1989-06-13 | Stephen Kuber | Chimney cleanout tee cap lock |
| US4858243A (en) * | 1987-06-12 | 1989-08-15 | Raycon Corporation | Laser pumping cavity |
| JP2586110B2 (ja) * | 1988-06-30 | 1997-02-26 | 三菱電機株式会社 | 固体レーザ装置 |
| IL87370A (en) | 1988-08-08 | 1992-03-29 | Electro Optics Ind Ltd | Laser pumping cavity |
| JPH03190293A (ja) | 1989-12-20 | 1991-08-20 | Hoya Corp | スラブ型レーザ媒体 |
| JPH04137573A (ja) | 1990-09-27 | 1992-05-12 | Hoya Corp | コンポジットスラブレーザ媒体及びレーザ装置 |
| US5659567A (en) * | 1992-02-19 | 1997-08-19 | Roberts; Rosemary Szewjkowski | Microwave-driven UV light source and solid-state laser |
| JPH05254879A (ja) * | 1992-03-06 | 1993-10-05 | Seiko Epson Corp | 蛍光ガラス及びそれを用いたレーザー装置 |
| JPH06125125A (ja) * | 1992-05-12 | 1994-05-06 | Mitsubishi Electric Corp | 固体レーザ装置 |
| US5299220A (en) | 1992-09-08 | 1994-03-29 | Brown David C | Slab laser |
| US5305345A (en) | 1992-09-25 | 1994-04-19 | The United States Of America As Represented By The United States Department Of Energy | Zigzag laser with reduced optical distortion |
| US5581573A (en) * | 1993-04-15 | 1996-12-03 | Fuji Electric Co., Ltd. | Solid-state laser device with diffused-light excitation, and integrating sphere |
| JPH06350171A (ja) * | 1993-04-15 | 1994-12-22 | Fuji Electric Co Ltd | 固体レーザ装置および積分球 |
| WO1994024734A1 (en) | 1993-04-21 | 1994-10-27 | The Commonwealth Of Australia | Diode pumped slab laser |
| US5394427A (en) | 1994-04-29 | 1995-02-28 | Cutting Edge Optronics, Inc. | Housing for a slab laser pumped by a close-coupled light source |
| US5553092A (en) * | 1994-05-17 | 1996-09-03 | Alliedsignal Inc. | Solid state laser with integral optical diffuser plate to homogenize optical pumping |
| US5479430A (en) | 1995-02-07 | 1995-12-26 | The Board Of Trustees Of The Leland Stanford Junior University | Protective coating for solid state slab lasers |
| JPH0927646A (ja) * | 1995-07-12 | 1997-01-28 | Hitachi Ltd | スラブレーザ |
| DE19541020A1 (de) | 1995-11-03 | 1997-05-07 | Daimler Benz Ag | Laserverstärkersystem |
| JPH09199781A (ja) * | 1996-01-16 | 1997-07-31 | Nec Corp | レーザ増幅器 |
| US5832016A (en) | 1997-01-29 | 1998-11-03 | Northrop Grumman Corporation | Slab laser assembly |
| US6014391A (en) | 1997-12-19 | 2000-01-11 | Raytheon Company | Thermally improved slab laser pump cavity apparatus with integral concentrator and method of making same |
| JPH11220191A (ja) * | 1998-01-29 | 1999-08-10 | Miyachi Technos Corp | 固体レーザ装置 |
| US6134258A (en) * | 1998-03-25 | 2000-10-17 | The Board Of Trustees Of The Leland Stanford Junior University | Transverse-pumped sLAB laser/amplifier |
| JP3154689B2 (ja) * | 1998-05-26 | 2001-04-09 | 三菱重工業株式会社 | 半導体レーザ励起スラブ固体レーザ装置 |
| US6219361B1 (en) | 1999-06-21 | 2001-04-17 | Litton Systems, Inc. | Side pumped, Q-switched microlaser |
| US6356575B1 (en) | 1999-07-06 | 2002-03-12 | Raytheon Company | Dual cavity multifunction laser system |
| US6373866B1 (en) | 2000-01-26 | 2002-04-16 | Lumenis Inc. | Solid-state laser with composite prismatic gain-region |
| US6738399B1 (en) | 2001-05-17 | 2004-05-18 | The United States Of America As Represented By The United States Department Of Energy | Microchannel cooled edge cladding to establish an adiabatic boundary condition in a slab laser |
| US7065121B2 (en) | 2001-07-24 | 2006-06-20 | Gsi Group Ltd. | Waveguide architecture, waveguide devices for laser processing and beam control, and laser processing applications |
| US20030138021A1 (en) | 2001-10-25 | 2003-07-24 | Norman Hodgson | Diode-pumped solid-state thin slab laser |
| CN100379684C (zh) * | 2002-04-26 | 2008-04-09 | 住友电气工业株式会社 | 制造氧化物超导薄膜的方法 |
| US7065109B2 (en) * | 2002-05-08 | 2006-06-20 | Melles Griot Inc. | Laser with narrow bandwidth antireflection filter for frequency selection |
| TWI270918B (en) * | 2003-05-27 | 2007-01-11 | Ip2H Ag | Light source and method for supplying a transport function to a chemical element in a light source |
| US7257302B2 (en) * | 2003-06-03 | 2007-08-14 | Imra America, Inc. | In-line, high energy fiber chirped pulse amplification system |
| US7520790B2 (en) * | 2003-09-19 | 2009-04-21 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of display device |
| JP4754795B2 (ja) * | 2003-09-19 | 2011-08-24 | 株式会社半導体エネルギー研究所 | 表示装置及び表示装置の作製方法 |
| US7388895B2 (en) | 2003-11-21 | 2008-06-17 | Tsinghua University | Corner-pumping method and gain module for high power slab laser |
| US7376160B2 (en) | 2003-11-24 | 2008-05-20 | Raytheon Company | Slab laser and method with improved and directionally homogenized beam quality |
| JP2005294625A (ja) * | 2004-04-01 | 2005-10-20 | Sony Corp | 成膜装置 |
| US7123634B2 (en) | 2004-05-07 | 2006-10-17 | Northrop Grumman Corporation | Zig-zag laser amplifier with polarization controlled reflectors |
| US7039087B2 (en) | 2004-05-13 | 2006-05-02 | The United States Of America As Represented By The Department Of The Army | End pumped slab laser cavity |
| US7879410B2 (en) * | 2004-06-09 | 2011-02-01 | Imra America, Inc. | Method of fabricating an electrochemical device using ultrafast pulsed laser deposition |
| GB0418333D0 (en) | 2004-08-17 | 2004-09-22 | Cambridge Display Tech Ltd | Enhanced emission of light from organic light emitting diodes |
| US7280571B2 (en) | 2004-11-23 | 2007-10-09 | Northrop Grumman Corporation | Scalable zig-zag laser amplifier |
| US7590160B2 (en) | 2004-11-26 | 2009-09-15 | Manni Jeffrey G | High-gain diode-pumped laser amplifier |
| US7505499B2 (en) | 2004-12-15 | 2009-03-17 | Panasonic Corporation | Slab laser amplifier with parasitic oscillation suppression |
| US8599898B2 (en) | 2004-12-22 | 2013-12-03 | Universal Laser Systems, Inc. | Slab laser with composite resonator and method of producing high-energy laser radiation |
| FI20050216A0 (fi) * | 2005-02-23 | 2005-02-23 | Ruuttu Jari | Menetelmä valmistaa timanttia, muita jalokiviä, kuten safiiria, rubiinia jne. ja suorittaa näillä pinnoituksia sekä suorittaa pinnoituksia muilla aineilla, kuten boriideillä, oksideillä, nitrideillä jne. |
| US7542489B2 (en) | 2005-03-25 | 2009-06-02 | Pavilion Integration Corporation | Injection seeding employing continuous wavelength sweeping for master-slave resonance |
| JP2006307251A (ja) * | 2005-04-27 | 2006-11-09 | Kobe Univ | ダイヤモンドライクカーボン薄膜の作製方法 |
| US7386019B2 (en) * | 2005-05-23 | 2008-06-10 | Time-Bandwidth Products Ag | Light pulse generating apparatus and method |
| JP4883503B2 (ja) | 2005-06-21 | 2012-02-22 | 独立行政法人情報通信研究機構 | 多重光路の固体スラブレーザロッドまたは非線形光学結晶を用いたレーザ装置 |
| US7391558B2 (en) | 2005-10-19 | 2008-06-24 | Raytheon Company | Laser amplifier power extraction enhancement system and method |
| US7860142B2 (en) * | 2006-02-07 | 2010-12-28 | Raytheon Company | Laser with spectral converter |
| KR20070117738A (ko) * | 2006-06-09 | 2007-12-13 | 삼성전자주식회사 | 표시기판의 리페어 방법 및 이에 의해 리페어된 표시기판 |
| US7929579B2 (en) | 2006-08-02 | 2011-04-19 | Cynosure, Inc. | Picosecond laser apparatus and methods for its operation and use |
| US20080089369A1 (en) | 2006-10-16 | 2008-04-17 | Pavilion Integration Corporation | Injection seeding employing continuous wavelength sweeping for master-slave resonance |
| US20080116183A1 (en) * | 2006-11-21 | 2008-05-22 | Palo Alto Research Center Incorporated | Light Scanning Mechanism For Scan Displacement Invariant Laser Ablation Apparatus |
| RU2346380C1 (ru) * | 2007-07-17 | 2009-02-10 | Общество с ограниченной ответственностью "Мармирус" | Емкостной генератор тока |
| EP2065485B1 (en) * | 2007-11-21 | 2011-05-18 | OTB Solar B.V. | Method and system for continuous or semi-continuous laser deposition. |
| US7633979B2 (en) | 2008-02-12 | 2009-12-15 | Pavilion Integration Corporation | Method and apparatus for producing UV laser from all-solid-state system |
| JP5305758B2 (ja) | 2008-06-30 | 2013-10-02 | 株式会社東芝 | 半導体発光装置 |
| US7822091B2 (en) | 2008-07-14 | 2010-10-26 | Lockheed Martin Corporation | Inverted composite slab sandwich laser gain medium |
| JP4910010B2 (ja) | 2009-03-24 | 2012-04-04 | 株式会社東芝 | 半導体発光装置 |
| TWM370095U (en) | 2009-06-30 | 2009-12-01 | Acpa Energy Conversion Devices Co Ltd | Wave length modulating apparatus for light source |
| EP2621736A4 (en) * | 2010-10-01 | 2016-03-02 | Intelligent Material Solutions Inc | MORPHOLOGICAL AND SIZE-UNIFORM MONODISPERSION PARTICLES AND THEIR FORMED SELF-ASSEMBLY |
| US8908737B2 (en) | 2011-04-04 | 2014-12-09 | Coherent, Inc. | Transition-metal-doped thin-disk laser |
| US8774236B2 (en) | 2011-08-17 | 2014-07-08 | Veralas, Inc. | Ultraviolet fiber laser system |
-
2012
- 2012-08-03 US US13/566,144 patent/US9246299B2/en not_active Expired - Fee Related
-
2013
- 2013-08-01 BR BR112015002090-9A patent/BR112015002090B1/pt not_active IP Right Cessation
- 2013-08-01 RU RU2015102528A patent/RU2650807C9/ru active
- 2013-08-01 EP EP13824767.1A patent/EP2880722B1/en active Active
- 2013-08-01 WO PCT/US2013/053166 patent/WO2014022635A1/en not_active Ceased
- 2013-08-01 IN IN970DEN2015 patent/IN2015DN00970A/en unknown
- 2013-08-01 US US14/418,500 patent/US9287112B2/en not_active Expired - Fee Related
- 2013-08-01 EP EP17152815.1A patent/EP3185373B1/en active Active
- 2013-08-01 CA CA2879746A patent/CA2879746A1/en not_active Abandoned
- 2013-08-01 JP JP2015525585A patent/JP6415435B2/ja not_active Expired - Fee Related
- 2013-08-01 CN CN201380046502.1A patent/CN104604049B/zh not_active Expired - Fee Related
-
2015
- 2015-10-23 US US14/921,285 patent/US10777960B2/en not_active Expired - Fee Related
-
2016
- 2016-03-14 US US15/068,950 patent/US9525262B2/en not_active Expired - Fee Related
- 2016-11-10 US US15/348,321 patent/US20170070022A1/en not_active Abandoned
-
2018
- 2018-05-15 JP JP2018093437A patent/JP6743087B2/ja not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4220158A1 (de) * | 1992-06-19 | 1993-12-23 | Battelle Institut E V | Verfahren zur selektiven Abscheidung von Aluminiumstrukturen aus der Gasphase |
| RU8168U1 (ru) * | 1997-11-28 | 1998-10-16 | Валерий Геннадиевич Полушкин | Активный лазерный элемент с волноводным режимом работы |
| US6347101B1 (en) * | 1998-04-16 | 2002-02-12 | 3D Systems, Inc. | Laser with absorption optimized pumping of a gain medium |
| EP1646117A2 (en) * | 2000-05-30 | 2006-04-12 | Northrop Grumman Corporation | Optical amplifier comprising an end pumped zig-zag slab gain medium |
| EP1566865A2 (en) * | 2004-02-19 | 2005-08-24 | National Institute of Information and Communications Technology Incorporated Administrative Agency | Slab type solid-state laser medium and slab type nonlinear optical medium each using light path formed by multiple reflection caused by three reflecting surfaces |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2569904C1 (ru) * | 2014-06-25 | 2015-12-10 | Владимир Валентинович Павлов | Лазерное устройство с пластинчатым оптическим элементом |
| US10329659B2 (en) * | 2014-08-29 | 2019-06-25 | National Institute Of Advanced Industrial Science And Technology | Method for laser deposition of organic material film or organic-inorganic composite material film, and laser deposition apparatus |
| WO2021141882A1 (en) * | 2020-01-06 | 2021-07-15 | Battelle Energy Alliance, Llc | Solid state nuclear pumped lasing sensors for in pile reactor power and flux measurement, direct energy conversion, and related methods |
| US12205729B2 (en) | 2020-01-06 | 2025-01-21 | Battelle Energy Alliance, Llc | Sensor assemblies and nuclear reactor systems comprising doped solid-state lasing media for use in determining an operating characteristic of a nuclear reactor, and related methods |
Also Published As
| Publication number | Publication date |
|---|---|
| RU2650807C9 (ru) | 2018-09-06 |
| US9525262B2 (en) | 2016-12-20 |
| CN104604049A (zh) | 2015-05-06 |
| US9246299B2 (en) | 2016-01-26 |
| BR112015002090B1 (pt) | 2021-05-25 |
| US20150311064A1 (en) | 2015-10-29 |
| IN2015DN00970A (enExample) | 2015-06-12 |
| US20160043524A1 (en) | 2016-02-11 |
| US10777960B2 (en) | 2020-09-15 |
| JP2018164090A (ja) | 2018-10-18 |
| RU2650807C2 (ru) | 2018-04-17 |
| EP2880722A4 (en) | 2016-04-27 |
| EP3185373B1 (en) | 2021-04-07 |
| JP6743087B2 (ja) | 2020-08-19 |
| CA2879746A1 (en) | 2014-02-06 |
| JP2015528217A (ja) | 2015-09-24 |
| RU2015102528A (ru) | 2016-09-20 |
| JP6415435B2 (ja) | 2018-10-31 |
| EP2880722A1 (en) | 2015-06-10 |
| US20130301662A1 (en) | 2013-11-14 |
| US9287112B2 (en) | 2016-03-15 |
| US20170070022A1 (en) | 2017-03-09 |
| EP2880722B1 (en) | 2019-10-09 |
| BR112015002090A2 (pt) | 2017-07-04 |
| CN104604049B (zh) | 2019-08-13 |
| EP3185373A1 (en) | 2017-06-28 |
| US20160211637A1 (en) | 2016-07-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9525262B2 (en) | Slab laser and amplifier and method of use | |
| US20090274189A1 (en) | Scalable thermally efficient pump diode systems | |
| WO2010145855A1 (en) | Monolithic, side pumped solid-state laser and method for operating the same | |
| US20110069731A1 (en) | Scalable thermally efficient pump diode assemblies | |
| Hein et al. | POLARIS: an all diode-pumped ultrahigh peak power laser for high repetition rates | |
| EP1816713A2 (en) | Laser with spectral converter | |
| EP0167746B1 (fr) | Generateur laser a gaz | |
| CN110036542A (zh) | 利用单模或低阶模光纤激光器基于超低量子缺陷泵浦方案的大功率稀土掺杂晶体放大器 | |
| TW200415612A (en) | Multiple-disk laser system | |
| WO1987004870A1 (en) | A compact slab laser oscillator-amplifier system | |
| US20070133643A1 (en) | Effective excitation, optical energy extraction and beamlet stacking in a multi-channel radial array laser system | |
| EP2102949B1 (en) | Scalable thermally efficient pump diode systems | |
| US4504955A (en) | Low voltage operation of arc discharge devices | |
| Tcheremiskine et al. | Initiation techniques and the vacuum-ultraviolet-radiation efficiency of a stabilized multichannel surface discharge | |
| Koechner | Optical pump systems | |
| Batishche et al. | A powerful, repetitively pulsed 1444-nm Nd: YAG laser | |
| Topfer et al. | Scaling laser-diode pumped solid-state amplifiers to the petawatt level | |
| Dowell | Advances in cathodes for high-current rf photoinjectors | |
| Konovalov et al. | Wide-aperture electric-discharge XeCl lasers | |
| Liu et al. | Q-switched all-solid-state lasers and application in processing of thin-film solar cell | |
| Sauerbrey | J. Hein, MC Kaluza, R. Bödefeld, M. Siebold, S. Podleska, and | |
| Comaskey et al. | High average power diode pumped solid state lasers for CALIOPE |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13824767 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 2879746 Country of ref document: CA |
|
| ENP | Entry into the national phase |
Ref document number: 2015525585 Country of ref document: JP Kind code of ref document: A |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 14418500 Country of ref document: US |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2013824767 Country of ref document: EP |
|
| ENP | Entry into the national phase |
Ref document number: 2015102528 Country of ref document: RU Kind code of ref document: A |
|
| REG | Reference to national code |
Ref country code: BR Ref legal event code: B01A Ref document number: 112015002090 Country of ref document: BR |
|
| ENP | Entry into the national phase |
Ref document number: 112015002090 Country of ref document: BR Kind code of ref document: A2 Effective date: 20150129 |