WO2014010404A1 - 太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法 - Google Patents

太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法 Download PDF

Info

Publication number
WO2014010404A1
WO2014010404A1 PCT/JP2013/067310 JP2013067310W WO2014010404A1 WO 2014010404 A1 WO2014010404 A1 WO 2014010404A1 JP 2013067310 W JP2013067310 W JP 2013067310W WO 2014010404 A1 WO2014010404 A1 WO 2014010404A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive adhesive
solar cell
solar
fluorene
electrode
Prior art date
Application number
PCT/JP2013/067310
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
幸一 中原
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR20157003029A priority Critical patent/KR20150032572A/ko
Priority to CN201380035411.8A priority patent/CN104412392A/zh
Publication of WO2014010404A1 publication Critical patent/WO2014010404A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C08G18/6666—Compounds of group C08G18/48 or C08G18/52
    • C08G18/6692—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/34
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a conductive adhesive for solar cells, a solar cell module, and a manufacturing method thereof.
  • Solar cells are expected as a new energy source because they directly convert clean and inexhaustible sunlight into electricity.
  • the solar cell is used, for example, as a solar cell module in which a plurality of solar cells are connected via tab wires.
  • a type in which solder is applied to the surface of the copper wire has been used.
  • the electrode of the photovoltaic cell and the tab wire were connected via solder.
  • solder connection since a high temperature is required for solder connection, the panel of the light receiving surface is cracked or warped, and a short circuit due to solder that has leaked out (leaked) from the tab wire has occurred, causing problems.
  • a conductive adhesive has been used as a connection material instead of solder.
  • a solar battery module in which a surface electrode of a solar battery cell and a tab wire are connected via a conductive adhesive has been proposed (see, for example, Patent Document 1).
  • this proposed technique has a problem that it is difficult to achieve both high adhesion between the solar battery cell and the tab wire and high connection reliability.
  • the present invention relates to a solar cell conductive adhesive capable of achieving both high adhesion between solar cells and tab wires and high connection reliability, and a solar cell using the solar cell conductive adhesive.
  • An object is to provide a battery module and a manufacturing method thereof.
  • a conductive adhesive for solar cells comprising at least a fluorene-type phenoxy resin, a fluorene-type epoxy resin, a curing agent, and conductive particles.
  • a conductive adhesive for solar cells comprising at least a fluorene-type phenoxy resin, a fluorene-type epoxy resin, a curing agent, and conductive particles.
  • a conductive adhesive for solar cells comprising at least a fluorene-type phenoxy resin, a fluorene-type epoxy resin, a curing agent, and conductive particles.
  • ⁇ 3> The conductive adhesive for solar cells according to any one of ⁇ 1> to ⁇ 2>, wherein the content of the conductive particles is 2% by mass to 25% by mass.
  • the storage elastic modulus at ⁇ 40 ° C. after curing is 3.0 ⁇ 10 9 Pa to 4.1 ⁇ 10 9 Pa, and the storage elastic modulus at 170 ° C. after curing is 1.9 ⁇ .
  • ⁇ 5> The temperature of the main dispersion tan ⁇ peak after curing is 190 ° C.
  • the main dispersion tan ⁇ peak value after curing is 0.40 or more.
  • It is a conductive adhesive for solar cells.
  • a solar battery cell having an electrode, a tab wire, and a cured product of a conductive adhesive, The electrode of the solar battery cell and the tab wire are connected using a cured product of the conductive adhesive, The solar cell module, wherein the conductive adhesive is a solar cell conductive adhesive according to any one of ⁇ 1> to ⁇ 6>.
  • the conductive adhesive is connected so that the electrode and the tab wire are connected via a cured product formed by curing the conductive adhesive by heating.
  • the above-mentioned problems can be solved and the object can be achieved, and the solar cell can achieve both high adhesion between the solar cell and the tab wire and high connection reliability.
  • a conductive adhesive, a solar cell module using the solar cell conductive adhesive, and a method for manufacturing the solar cell module can be provided.
  • FIG. 1 is a schematic top view showing an example of a thin film solar cell module.
  • FIG. 2 is an exploded perspective view showing an example of a crystalline solar cell module.
  • FIG. 3 is a schematic cross-sectional view showing an example of a crystalline solar cell module.
  • FIG. 4 is a schematic top view of a solar battery cell model.
  • the conductive adhesive for solar cells of the present invention contains at least a fluorene type phenoxy resin, a fluorene type epoxy resin, a curing agent, and conductive particles, and further contains other components as necessary.
  • the said electrically conductive adhesive for solar cells is used in order to connect the electrode and tab wire of a photovoltaic cell.
  • the fluorene type phenoxy resin is not particularly limited as long as it is a phenoxy resin having a fluorene skeleton, and can be appropriately selected according to the purpose.
  • Fluorene is an aromatic hydrocarbon having a tricyclic structure and is represented by the following structural formula (1).
  • the fluorene skeleton means a divalent organic group containing the fluorene.
  • Examples of the fluorene skeleton include a divalent fluorene group in which two hydrogen atoms at the 9-position of the fluorene are eliminated.
  • fluorene-type phenoxy resin examples include (i) a phenoxy resin obtained by a reaction between a polyhydric phenol having a fluorene skeleton and an epihalohydrin, (ii) a polyhydric phenol having a fluorene skeleton, and a bifunctional epoxy compound. And (iii) a phenoxy resin obtained by reaction of a diglycidyl ether of a polyhydric phenol having a fluorene skeleton with another polyhydric phenol.
  • Examples of the polyhydric phenol having a fluorene skeleton include compounds represented by the following general formula (1).
  • the ring Z 1 and the ring Z 2 are the same or different and each represents an aromatic hydrocarbon ring
  • R 1a , R 1b , R 2a and R 2b are the same or different and are substituents.
  • k1 and k2 are the same or different and each represents an integer of 0 to 4, m1 and m2 each represents 0 or an integer of 1 or more, and n1 and n2 each represents 0 or an integer of 1 or more.
  • the plurality of R 1a , R 1b , R 2a and R 2b may be the same or different from each other.
  • n1 + n2 is 2 or more.
  • N1 is preferably 1, and n2 is preferably 1.
  • Examples of the aromatic hydrocarbon ring include a benzene ring and a naphthalene ring.
  • substituent include an alkyl group having 1 to 6 carbon atoms.
  • Examples of the alkyl group having 1 to 6 carbon atoms include a methyl group and an ethyl group.
  • Examples of the compound represented by the general formula (1) include 9,9-bis (hydroxyphenyl) fluorene, 9,9-bis (alkyl-hydroxyphenyl) fluorene, and the like.
  • Examples of the 9,9-bis (hydroxyphenyl) fluorene include 9,9-bis (4-hydroxyphenyl) fluorene (a compound represented by the following structural formula (2)).
  • Examples of the 9,9-bis (alkyl-hydroxyphenyl) fluorene include 9,9-bis (4-hydroxy-3-methylphenyl) fluorene and 9,9-bis (4-hydroxy-3,5-dimethyl). Phenyl) fluorene and the like.
  • epihalohydrin examples include epichlorohydrin.
  • the bifunctional epoxy compound is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin.
  • Examples of the other polyhydric phenols include bisphenol A, bisphenol F, and bisphenol S.
  • the method for producing the fluorene type phenoxy resin is not particularly limited and may be appropriately selected depending on the intended purpose.
  • a known method for producing a phenoxy resin can be referred to.
  • a method for producing the fluorene type phenoxy resin for example, a method for producing a phenoxy resin described in JP-A-2008-255308 can be referred to.
  • the fluorene type phenoxy resin may be a commercially available product.
  • FX293 made by Nippon Steel Chemical Co., Ltd.
  • FX280S made by Nippon Steel Chemical Co., Ltd.
  • the content of the fluorene type phenoxy resin is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 10% by mass to 40% by mass, and more preferably 20% by mass to 30% by mass.
  • the content is less than 10% by mass, the adhesiveness may decrease, and when it exceeds 40% by mass, the connection reliability may decrease.
  • the content is within the more preferable range, it is advantageous in that both adhesiveness and connection reliability are more excellent.
  • the fluorene type epoxy resin is not particularly limited as long as it is an epoxy resin having a fluorene skeleton, and can be appropriately selected according to the purpose.
  • fluorene type epoxy resin examples include (iv) an epoxy resin obtained by a reaction between the polyhydric phenol having the fluorene skeleton and the epihalohydrin, (v) a polyhydric phenol having the fluorene skeleton, and the bifunctional compound. Epoxy resin obtained by reaction with a functional epoxy compound, (vi) epoxy resin obtained by reaction of diglycidyl ether of polyhydric phenol having the fluorene skeleton with the other polyhydric phenol, and the like.
  • a phenoxy resin and an epoxy resin can be manufactured using the same raw material, and can be manufactured separately by controlling reaction conditions (for example, mixture ratio).
  • the method for producing the fluorene type epoxy resin is not particularly limited and may be appropriately selected depending on the intended purpose.
  • a known method for producing an epoxy resin can be referred to.
  • the method for producing the fluorene type epoxy resin for example, the method for producing an epoxy resin described in JP2012-102228A can be referred to.
  • the fluorene type epoxy resin may be a commercially available product.
  • the commercially available products include Oxol CG50 (manufactured by Osaka Gas Chemical Co., Ltd.) and Oxol CG500 (manufactured by Osaka Gas Chemical Co., Ltd.).
  • the content of the fluorene type epoxy resin is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 10% by mass to 40% by mass, and more preferably 20% by mass to 30% by mass.
  • the content is less than 10% by mass, the connection reliability may be lowered, and when it exceeds 40% by mass, the adhesiveness may be lowered.
  • the content is within the more preferable range, it is advantageous in that both adhesiveness and connection reliability are more excellent.
  • the mass ratio (A: B) between the fluorene type phenoxy resin (A) and the fluorene type epoxy resin (B) is not particularly limited and may be appropriately selected depending on the intended purpose. : 3.0 to 3.0: 1.0 is preferable, and 1.0: 1.5 to 1.5: 1.0 is more preferable.
  • the mass ratio (A: B) if the ratio of the fluorene-type phenoxy resin (A) is smaller than the preferable range, the adhesiveness may be reduced.
  • the mass ratio (A: B) the When the ratio of the fluorene type phenoxy resin (A) is larger than the preferable range, the connection reliability may be lowered. When the mass ratio (A: B) is within the more preferable range, it is advantageous in that both adhesion and connection reliability are more excellent.
  • ⁇ Curing agent> There is no restriction
  • the imidazole curing agent include 2-ethyl 4-methylimidazole.
  • the anionic curing agent include organic amines.
  • the cationic curing agent include a sulfonium salt, an onium salt, and an aluminum chelating agent. Of these, imidazole curing agents are preferred.
  • the curing agent is a curing agent that reacts with an epoxy group of the fluorene type epoxy resin or a curing agent that initiates polymerization of the epoxy group.
  • the content of the curing agent is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 10% by mass to 50% by mass, more preferably 20% by mass to 40% by mass, and 25% by mass. From 35% by weight is particularly preferred.
  • the said silver coat copper powder is copper powder which covered at least one part of the surface with silver.
  • connection reliability is further improved.
  • the silver-coated copper powder is such that at least a part of the surface of the copper powder is coated with silver.
  • the silver-coated copper powder may be one in which the entire surface of the copper powder is coated with silver, or a part of the surface of the copper powder may be coated with silver.
  • the silver is coated unevenly over the entire copper powder surface while exposing the copper powder surface in places rather than the silver being unevenly distributed on a part of the copper powder surface. It is preferable that By coating without uneven distribution, silver-coated copper powder with uniform conductivity can be obtained.
  • the coated silver is in a state of adhering to the surface of the copper powder in the form of dots or meshes.
  • the silver-coated copper powder may be coated with a fatty acid.
  • a fatty acid By covering the silver-coated copper powder with the fatty acid, the surface of the silver-coated copper powder is smoothed.
  • a stearic acid etc. are mentioned.
  • the silver ion solution is added to the dispersion to promote the reduction reaction, and further, the reducing agent is added to completely reduce and precipitate the silver powder on the surface of the copper powder.
  • a method of depositing a film for example, see JP-A-1-119602.
  • a method in which silver is coated on the surface of copper particles by a substitution reaction between silver ions and metallic copper in an organic solvent-containing solution containing silver ions see, for example, JP-A-2006-161081).
  • the copper powder processed into flakes is heat treated to oxidize the copper powder surface, and then the copper powder is removed from the copper powder surface in an alkaline solution and washed with water, and then the copper powder surface in an acidic solution. Then, the oxide is pickled and washed with water, and then a reducing agent is added to the acidic solution in which the copper powder is dispersed to adjust the pH to prepare a copper powder slurry.
  • the silver ion solution is continuously added to the copper powder slurry.
  • a method of forming a silver layer on the surface of copper powder by electroless displacement plating and reduction type electroless plating for example, see JP 2010-174411 A). Among these, the method [5] is preferable.
  • the average particle diameter of the conductive particles is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 1 ⁇ m to 50 ⁇ m, more preferably 3 ⁇ m to 30 ⁇ m, and particularly preferably 5 ⁇ m to 20 ⁇ m.
  • the average particle diameter can be measured by, for example, a particle size distribution measuring device (Microtrac MT3100, manufactured by Nikkiso Co., Ltd.).
  • the content of the conductive particles is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 2% by mass to 25% by mass, more preferably 2% by mass to 15% by mass, and 2% by mass. % To 10% by mass is more preferable, and 3.5% to 6.5% by mass is particularly preferable.
  • the content is less than 2% by mass, the connection reliability may be lowered, and when it exceeds 25% by mass, the adhesiveness and the connection reliability may be lowered.
  • the content is within the particularly preferable range, it is advantageous in that adhesiveness and connection reliability are more excellent.
  • the other components are not particularly limited and may be appropriately selected depending on the purpose.
  • silane coupling agents for example, silane coupling agents, rubbers, fillers, softeners, accelerators, anti-aging agents, organic solvents, ion catchers Agents and the like.
  • the content of the other components is not particularly limited and can be appropriately selected depending on the purpose.
  • the temperature (Tg) of the main dispersion tan ⁇ peak after curing of the conductive adhesive for solar cells is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 190 ° C. or higher, preferably 190 ° C. to 225 ° C is more preferable, and 193 ° C to 215 ° C is particularly preferable. Connection reliability may fall that the said temperature is less than 190 degreeC.
  • the main dispersion tan ⁇ peak value after curing of the conductive adhesive for solar cells is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 0.40 or more, preferably 0.40 to 0.00. 50 is more preferable, and 0.45 to 0.50 is particularly preferable.
  • the storage elastic modulus at ⁇ 40 ° C. after curing of the conductive adhesive for solar cells is not particularly limited and may be appropriately selected depending on the intended purpose. 10 9 Pa to 4.1 ⁇ 10 9 Pa is preferable. The storage elastic modulus at ⁇ 40 ° C. after curing is considered as a physical quantity related to adhesion. The storage elastic modulus at 170 ° C. after curing of the conductive adhesive for solar cells is not particularly limited and may be appropriately selected depending on the intended purpose. From the viewpoint of connection reliability, 1.9 ⁇ 10 8 Pa to 2.2 ⁇ 10 8 Pa is preferable. The storage elastic modulus at 170 ° C. after curing is considered as a physical quantity related to connection reliability.
  • the temperature (Tg) of the main dispersion tan ⁇ peak after curing of the conductive adhesive for solar cell, the main dispersion tan ⁇ peak value, the storage elastic modulus at ⁇ 40 ° C., and the storage elastic modulus at 170 ° C. are, for example, It can be measured by this method.
  • a conductive adhesive film having an average thickness of 20 ⁇ m is formed on the peeled PET using the conductive adhesive for solar cells. Subsequently, the conductive adhesive film is placed in a heating furnace at 200 ° C. and heated for 30 minutes to cure the conductive adhesive film and obtain a cured product.
  • the cured product is peeled off from the peeled PET, cut into a 3.5 mm ⁇ 0.4 mm strip, and used as a measurement sample.
  • a dynamic viscoelasticity measuring device (frequency 11 Hz)
  • the measurement sample is heated from ⁇ 60 ° C. to 200 ° C. at a heating rate of 3 ° C./min.
  • the main dispersion tan ⁇ peak value, the temperature at which the main dispersion tan ⁇ peak appears, the storage elastic modulus at ⁇ 40 ° C., and the storage elastic modulus at 170 ° C. are obtained.
  • the dynamic viscoelasticity measuring device include DDV-01FP (manufactured by ORIENTEC).
  • the solar cell conductive adhesive may be in the form of a liquid or a film.
  • the solar battery module of the present invention has at least a solar battery cell, a tab wire, and a cured product of a conductive adhesive, and, if necessary, a sealing resin, a moisture-proof backsheet, a glass plate, etc. It has other members.
  • the tab wire and the electrode of the solar battery cell are connected using a cured product of the conductive adhesive.
  • the said conductive adhesive is the said conductive adhesive for solar cells of this invention.
  • the solar battery cell is not particularly limited as long as it has electrodes, and can be appropriately selected according to the purpose.
  • the solar battery cell has at least a photoelectric conversion element as a photoelectric conversion unit, a finger electrode, and a bus bar electrode. Furthermore, it has other members as required.
  • Examples of the solar battery cell include a thin film solar battery cell and a crystalline solar battery cell.
  • Examples of the thin film solar cell include an amorphous silicon solar cell, a CdS / CdTe solar cell, a dye-sensitized solar cell, an organic thin film solar cell, a microcrystalline silicon solar cell (tandem solar cell). Cell).
  • Examples of the crystalline solar battery cell include a single crystal silicon solar battery cell and a polycrystalline silicon solar battery cell.
  • the solar battery cell may have a bus bar-less structure without a bus bar electrode. There is no restriction
  • the finger electrode is an electrode that collects electricity generated in the photoelectric conversion unit.
  • the finger electrode is formed on the solar battery cell in a direction substantially orthogonal to the tab line.
  • the bus bar electrode is an electrode that further collects electricity collected by the finger electrodes and transmits the electricity to the tab wire.
  • the bus bar electrode is an electrode that further collects electricity collected by the finger electrodes and transmits the electricity to the tab wire.
  • electricity is directly transmitted from the finger electrode to the tab wire.
  • the tab line is not particularly limited as long as it is a line that electrically connects adjacent solar cells, and can be appropriately selected according to the purpose. There is no restriction
  • the sealing resin is not particularly limited and may be appropriately selected depending on the purpose.
  • ethylene / vinyl acetate copolymer (EVA), ethylene / vinyl acetate / triallyl isocyanurate (EVAT) examples include polyvinyl butyrate (PVB), polyisobutylene (PIB), silicone resin, polyurethane resin, and the like.
  • ⁇ Dampproof back sheet> There is no restriction
  • PET polyethylene terephthalate
  • Al aluminum
  • PET aluminum
  • Al polyethylene
  • PE polyethylene
  • Glass plate> There is no restriction
  • the solar cell module may be a thin film solar cell module using the thin film solar cell or a crystalline solar cell module using the crystal solar cell.
  • FIG. 1 is a schematic top view showing an example of a thin-film solar cell module 200.
  • thin-film solar cells 32 made of thin-film photoelectric conversion elements are arranged in series on a substrate 38 in a planar direction.
  • the surface electrode (not shown) of the thin film solar cell 32c at one end and the surface electrode (not shown) of the thin film solar cell 32d at the other end are provided with a conductive adhesive layer (not shown).
  • a tab wire 3 for power extraction is connected.
  • FIG. 2 is an exploded perspective view showing an example of a crystalline solar cell module.
  • the crystalline solar cell module 1 includes strings 4 in which a plurality of crystalline solar cells 2 are connected in series by tab wires 3 serving as interconnectors, and further includes a matrix 5 in which a plurality of strings 4 are arranged.
  • the solar cell module 1 is laminated together with a matrix 5 sandwiched between sealing resin sheets 6 and a front cover 7 provided on the light receiving surface side and a moisture-proof back sheet 8 provided on the back surface side. Is done.
  • the crystalline solar cell module 1 is formed by attaching a metal frame 9 such as aluminum around the periphery.
  • each crystalline solar cell 2X, 2Y, 2Z of the crystalline solar cell module has a crystalline photoelectric conversion element 10 made of a silicon substrate.
  • the crystalline photoelectric conversion element 10 is provided with a bus bar electrode 11 serving as a surface electrode on the light receiving surface side and a finger electrode 12 serving as a collecting electrode formed in a direction substantially orthogonal to the bus bar electrode 11.
  • the crystalline photoelectric conversion element 10 is provided with an Al back electrode 13 made of aluminum on the back side opposite to the light receiving surface. Then, the bus bar electrode 11 on the surface of the solar battery cell 2 and the Al back electrode 13 of the adjacent solar battery cell 2 are electrically connected by the tab wire 3, thereby constituting the strings 4 connected in series. .
  • the connection between the tab wire 3 and the bus bar electrode 11 and the connection between the tab wire 3 and the Al back electrode 13 are performed by, for example, the conductive adhesive film 17.
  • the manufacturing method of the solar cell module of the present invention includes at least a disposing step, a covering step, a pressing step, and a heating step, and further includes other steps as necessary.
  • the manufacturing method of the solar cell module of this invention can be used suitably for manufacture of the said solar cell module of this invention.
  • the conductive adhesive is connected to the electrode and the tab wire via a cured product formed by curing the conductive adhesive by heating on the electrode of the solar battery cell. And if it is the process of arrange
  • Examples of the solar battery cell include the solar battery cell exemplified in the description of the solar battery module of the present invention.
  • Examples of the tab lines include the tab lines exemplified in the description of the solar cell module of the present invention.
  • the said conductive adhesive is the said conductive adhesive for solar cells of this invention.
  • the conductive adhesive may be in a liquid form or a film form.
  • a film-like conductive adhesive (conductive adhesive film) slit to the same width as the bus bar electrode is placed on the bus bar electrode of the solar battery cell. Subsequently, a copper foil (tab wire) having the same width as the bus bar electrode is placed on the conductive adhesive film.
  • positioning process can be performed by the above.
  • a tab line with an adhesive layer having the same width as the bus bar electrode of the solar battery cell is prepared.
  • the tab line with the adhesive layer is, for example, a film-like conductive adhesive (conductive adhesive film) is placed on a copper foil, and the copper foil on which the conductive adhesive film is placed is connected to the bus bar electrode of the solar battery cell. It is obtained by slitting to the same width.
  • the tab line with the adhesive layer is placed on the bus bar electrode of the solar battery cell so that the bus bar electrode and the adhesive layer of the tab line with the adhesive layer are in contact with each other.
  • positioning process can be performed by the above.
  • the covering step is not particularly limited as long as it is a step of covering the solar battery cell with a sealing resin and further covering the sealing resin with either a moisture-proof backsheet or a glass plate. Can be selected as appropriate.
  • the above solar cell module manufacturing method is preferably performed using a decompression laminator.
  • the method using the reduced pressure laminator can be carried out with reference to the method described in JP 2010-283059 A, for example.
  • the sealing resin, the moisture-proof backsheet, and the glass plate are not particularly limited and can be appropriately selected according to the purpose.
  • examples thereof include a sealing resin, the moisture-proof backsheet, and the glass plate.
  • the pressing step is not particularly limited as long as it is a step of pressing either the moisture-proof backsheet or the glass plate, and can be appropriately selected according to the purpose.
  • the pressure to press and the time to press are arbitrary.
  • the heating step is not particularly limited as long as it is a step of heating the heating stage on which the solar battery cell is placed, and can be appropriately selected according to the purpose.
  • the sealing resin can be heated by heating the heating stage. Further, the conductive adhesive can be heated.
  • the heating temperature in the heating step is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 50 ° C to 250 ° C, more preferably 100 ° C to 200 ° C.
  • sealing may be insufficient.
  • the heating temperature exceeds 250 ° C., the organic resin contained in the conductive adhesive, the sealing resin, or the like may be thermally decomposed. is there.
  • the heating temperature is within the more preferable range, it is advantageous in terms of sealing reliability.
  • the heating time in the heating step is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 1 second to 1 hour, more preferably 5 seconds to 30 minutes, and particularly preferably 10 seconds to 20 minutes. preferable. If the heating time is less than 1 second, sealing may be insufficient. When the heating time is within the particularly preferable range, it is advantageous in terms of sealing reliability.
  • the order of starting the pressing step and the heating step is not particularly limited and may be appropriately selected depending on the purpose.
  • the solar cell By performing the pressing step and the heating step, the solar cell can be sealed, and the electrode of the solar cell and the tab wire can be connected via a cured product of the conductive adhesive. .
  • the solar cell module of the present invention is manufactured. Further, for example, the solar cell module of the present invention can be manufactured by forming a matrix in which a plurality of strings in which a plurality of solar cells are directly connected are arranged and sealing the matrix.
  • the average thickness is a value obtained by measuring the thickness of 10 arbitrary points to be measured and averaging them.
  • the average width is a value obtained by measuring the widths of arbitrary 10 points to be measured and averaging them.
  • the 500 g of this flaky copper powder was heat-treated in the atmosphere at 250 ° C. for 5 minutes (oxidation treatment). Thereafter, the oxidized copper powder was added to a mortar and coarsely crushed. 500 g of this copper powder was added to 1,000 mL of a 1% by mass potassium hydroxide aqueous solution and stirred for 20 minutes, followed by primary decantation treatment, and further 1,000 mL of pure water was added and stirred for several minutes.
  • a sixth decantation treatment was performed, and 2,500 mL of a 1% by mass sodium potassium tartrate aqueous solution was added and stirred for several minutes to form a copper slurry.
  • a dilute sulfuric acid or potassium hydroxide solution was added to the copper slurry to adjust the pH of the copper slurry to 3.5 to 4.5.
  • 500 g of the silver-coated copper powder obtained as described above was placed in a tubular furnace and heat-treated at 200 ° C. for 30 minutes in a reducing atmosphere under a hydrogen stream (3.0 L / min to 3.5 L / min).
  • the heat-treated silver-coated copper powder was pulverized in a mortar.
  • 500 g of the crushed silver-coated copper powder was dispersed in 1,000 mL of a 0.5% by mass isopropyl stearate solution and stirred for 30 minutes.
  • Example 1 ⁇ Production of solar cell module model> -Production of conductive adhesive film- 25 parts by mass of fluorene type phenoxy resin (FX293, manufactured by Nippon Steel Chemical Co., Ltd.), 25 parts by mass of fluorene type epoxy resin (Oxol CG50, manufactured by Osaka Gas Chemical Co., Ltd.), acrylic rubber (Taisan Resin SGP3, manufactured by Nagase ChemteX Corporation) 15 parts by mass, curing agent (imidazole-based curing agent, NovaCure HX3941HP, manufactured by Asahi Kasei E-Materials Co., Ltd.), and conductive particles (silver-coated copper powder obtained in Production Example 1, average particle size 10 ⁇ m) 5 masses Parts were mixed to prepare a conductive adhesive composition.
  • fluorene type phenoxy resin FX293, manufactured by Nippon Steel Chemical Co., Ltd.
  • Fluorene type epoxy resin Oxol CG50, manufactured by Osaka Gas Chemical
  • the obtained conductive adhesive composition was applied onto a polyethylene terephthalate film (release film) having a thickness of 50 ⁇ m whose surface was subjected to a release treatment.
  • a conductive adhesive film having an average thickness of 25 ⁇ m was obtained.
  • a copper foil was produced by laminating the conductive adhesive film on a copper foil (average thickness 150 ⁇ m) and laminating the conductive adhesive film. Subsequently, the copper foil on which the conductive adhesive film was laminated was slit to an average width of 1.5 mm to produce a tab wire with an adhesive layer.
  • a glass substrate on which a finger electrode 12 as shown in FIG. 4 and a pattern with a bus bar electrode 11 substantially orthogonal to the finger electrode 12 was formed was produced.
  • a silver paste was screen-printed and fired on a glass substrate (length 64 mm ⁇ width 64 mm ⁇ thickness 2.8 mm) to form a pattern of finger electrodes 12 and bus bar electrodes 11 as shown in FIG.
  • the average width of the finger electrodes was 100 ⁇ m.
  • the average width of the bus bar electrode was 2 mm.
  • the obtained solar cell model with tab wires was covered with a sealing resin, and the sealing resin was further covered with a moisture-proof backsheet.
  • a sealing resin an ethylene / vinyl acetate copolymer having a thickness of 500 ⁇ m was used.
  • a PET film was used for the back sheet.
  • sealing with the sealing resin was performed using a reduced pressure laminator. Specifically, vacuuming was performed at 100 ° C. for 5 minutes, followed by laminating at a press time of 5 minutes and 0.1 MPa, and then curing in an oven at 155 ° C. for 45 minutes.
  • a solar cell module model was obtained.
  • Example preparation A conductive adhesive film having an average thickness of 20 ⁇ m was formed on the peeled PET. Subsequently, the conductive adhesive film was placed in a heating furnace at 200 ° C. and heated for 30 minutes to cure the conductive adhesive film, thereby obtaining a cured product. The cured product was peeled from the peeled PET and cut into a 3.5 mm ⁇ 0.4 mm strip to obtain a measurement sample. Main dispersion tan ⁇ peak when the measurement sample was heated from ⁇ 60 ° C.
  • Table 1 shows the mass ratio of the fluorene type phenoxy resin and the fluorene type epoxy resin while maintaining the total amount (50 parts by mass) of the fluorene type phenoxy resin and the fluorene type epoxy resin in the production of the conductive adhesive film of Example 1.
  • a conductive adhesive film, a solar cell model with a tab line, and a solar cell module model were produced and evaluated in the same manner as in Example 1 except that the mass ratio was changed to that described in. The results are shown in Table 1.
  • Example 6 In the production of the conductive adhesive film of Example 1, while maintaining the blending amounts of 25 parts by mass of fluorene type phenoxy resin, 25 parts by mass of fluorene type epoxy resin, 15 parts by mass of acrylic rubber, and 30 parts by mass of curing agent, The conductive adhesive film and the tab wire were the same as in Example 1 except that the blending amount of the conductive particles was changed so that the content of the conductive particles in the conductive adhesive composition was the content shown in Table 1. An attached solar cell model and a solar cell module model were prepared and evaluated. The results are shown in Table 1.
  • Table 2 shows the mass ratio of the fluorene type phenoxy resin and the fluorene type epoxy resin while maintaining the total amount (50 parts by mass) of the fluorene type phenoxy resin and the fluorene type epoxy resin in the production of the conductive adhesive film of Example 1.
  • a conductive adhesive film, a solar cell model with a tab line, and a solar cell module model were produced and evaluated in the same manner as in Example 1 except that the mass ratio was changed to that described in. The results are shown in Table 2.
  • Example 10 In the production of the conductive adhesive film of Example 1, while maintaining the blending amounts of 25 parts by mass of fluorene type phenoxy resin, 25 parts by mass of fluorene type epoxy resin, 15 parts by mass of acrylic rubber, and 30 parts by mass of curing agent, The conductive adhesive film and the tab wire were the same as in Example 1 except that the blending amount of the conductive particles was changed so that the content of the conductive particles in the conductive adhesive composition was the content shown in Table 2. An attached solar cell model and a solar cell module model were prepared and evaluated. The results are shown in Table 2.
  • Example 12 In the production of the conductive adhesive film of Example 1, a conductive adhesive film and a tab were obtained in the same manner as in Example 1 except that the fluorene type phenoxy resin was changed to a fluorene type phenoxy resin (FX280S, manufactured by Nippon Steel Chemical Co., Ltd.). A solar cell model with a line and a solar cell module model were prepared and evaluated. The results are shown in Table 2.
  • Example 13 In the production of the conductive adhesive film of Example 1, a conductive adhesive film was obtained in the same manner as in Example 1 except that the fluorene type epoxy resin was changed to a fluorene type epoxy resin (Ocsol CG500, manufactured by Osaka Gas Chemical Co., Ltd.). A solar cell model with a tab line and a solar cell module model were prepared and evaluated. The results are shown in Table 2.
  • Example 14 In the production of the conductive adhesive film of Example 1, except that the conductive particles were changed to nickel particles (HCA-1, manufactured by Inco), the conductive adhesive film and the sun with tab wire were the same as in Example 1. A battery cell model and a solar cell module model were produced and evaluated. The results are shown in Table 2.
  • Example 6 Comparative Examples 1 to 6
  • the conductive adhesive film, the solar cell model with tab wire, and the solar cell A module model was created and evaluated. The results are shown in Table 3.
  • the bisphenol type phenoxy resin used in Comparative Examples 1, 5 and 6 is PKHH (manufactured by InChem).
  • the fluorene type phenoxy resin used in Comparative Examples 2 to 4 is FX293 (manufactured by Nippon Steel Chemical Co., Ltd.).
  • the fluorene type epoxy resin used in Comparative Example 1 is Oxol CG50 (manufactured by Osaka Gas Chemical Co., Ltd.).
  • the naphthalene type epoxy resin used in Comparative Examples 2 and 6 is HP4710 (manufactured by DIC Corporation).
  • the phenol novolac type epoxy resin used in Comparative Example 3 is N540 (manufactured by DIC Corporation).
  • the bisphenol A type epoxy resin used in Comparative Examples 4 and 5 is YL980 (manufactured by Mitsubishi Chemical Corporation).
  • the mass ratio (A: B) of the fluorene type phenoxy resin (A) and the fluorene type epoxy resin (B) is extremely excellent in both adhesiveness and connection reliability. It was confirmed that 1.5: 1.0 was particularly preferable (for example, see Examples 1, 8 and 9). It was confirmed that the content of the conductive particles is particularly preferably 2 to 10 parts by mass because both the adhesiveness and the connection reliability are very excellent (see, for example, Examples 1, 10 and 11). ). As a kind of electroconductive particle, since both adhesiveness and connection reliability were very excellent, it has confirmed that a silver coat copper powder was especially preferable (for example, refer Example 1). On the other hand, in Comparative Examples 1 to 6 using a resin that is not a fluorene type as either phenoxy resin or epoxy resin, at least one of adhesiveness and connection reliability was insufficient (evaluation criterion “ ⁇ ”). .
  • the solar cell module of the present invention is excellent in adhesiveness and connection reliability, it can be particularly suitably used for a solar cell module that requires durability.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Photovoltaic Devices (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Conductive Materials (AREA)
PCT/JP2013/067310 2012-07-09 2013-06-25 太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法 WO2014010404A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR20157003029A KR20150032572A (ko) 2012-07-09 2013-06-25 태양 전지용 도전성 접착제, 및 태양 전지 모듈, 및 그의 제조 방법
CN201380035411.8A CN104412392A (zh) 2012-07-09 2013-06-25 太阳能电池用导电性粘接剂以及太阳能电池模块及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012153656A JP5877133B2 (ja) 2012-07-09 2012-07-09 太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法
JP2012-153656 2012-07-09

Publications (1)

Publication Number Publication Date
WO2014010404A1 true WO2014010404A1 (ja) 2014-01-16

Family

ID=49915870

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/067310 WO2014010404A1 (ja) 2012-07-09 2013-06-25 太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法

Country Status (5)

Country Link
JP (1) JP5877133B2 (zh)
KR (1) KR20150032572A (zh)
CN (1) CN104412392A (zh)
TW (1) TW201410838A (zh)
WO (1) WO2014010404A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659079B (zh) * 2014-02-03 2019-05-11 日商迪睿合股份有限公司 Method for measuring reaction rate of acrylic adhesive and acrylic adhesive

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6175935B2 (ja) * 2013-06-25 2017-08-09 日立化成株式会社 太陽電池用接続材料、これを用いた太陽電池モジュール及びその製造方法
CN106018965B (zh) * 2016-05-16 2018-11-23 云南瑞博检测技术股份有限公司 一种光学玻璃上制备的精密电阻的检测方法
JP6438102B2 (ja) * 2017-10-19 2018-12-12 デクセリアルズ株式会社 接続体、及び接続体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135654A (ja) * 2006-11-29 2008-06-12 Sanyo Electric Co Ltd 太陽電池モジュール
WO2008152711A1 (ja) * 2007-06-13 2008-12-18 Hitachi Chemical Company, Ltd. 回路接続用フィルム状接着剤
JP2011032491A (ja) * 2010-11-09 2011-02-17 Sony Chemical & Information Device Corp 異方性導電フィルム
JP2012074288A (ja) * 2010-09-29 2012-04-12 Yokohama Rubber Co Ltd:The 導電性組成物および太陽電池セル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008135654A (ja) * 2006-11-29 2008-06-12 Sanyo Electric Co Ltd 太陽電池モジュール
WO2008152711A1 (ja) * 2007-06-13 2008-12-18 Hitachi Chemical Company, Ltd. 回路接続用フィルム状接着剤
JP2012074288A (ja) * 2010-09-29 2012-04-12 Yokohama Rubber Co Ltd:The 導電性組成物および太陽電池セル
JP2011032491A (ja) * 2010-11-09 2011-02-17 Sony Chemical & Information Device Corp 異方性導電フィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI659079B (zh) * 2014-02-03 2019-05-11 日商迪睿合股份有限公司 Method for measuring reaction rate of acrylic adhesive and acrylic adhesive

Also Published As

Publication number Publication date
KR20150032572A (ko) 2015-03-26
CN104412392A (zh) 2015-03-11
JP5877133B2 (ja) 2016-03-02
TW201410838A (zh) 2014-03-16
JP2014017368A (ja) 2014-01-30

Similar Documents

Publication Publication Date Title
JP5886588B2 (ja) 導電性接着剤、並びに、それを用いた太陽電池モジュール、及びその製造方法
JP6112187B2 (ja) 導電性接着剤、太陽電池及びその製造方法、並びに太陽電池モジュール
US8969706B2 (en) Adhesive tape and solar cell module using the same
CN102280161B (zh) 一种晶硅太阳能电池正面电极用导电浆料及其制备方法
JP5446420B2 (ja) 太陽電池モジュール及びその製造方法
CN108565041B (zh) 一种高电导耐焊接型低温银浆及其制备方法
JP5960408B2 (ja) 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法
JP5877133B2 (ja) 太陽電池用導電性接着剤、並びに太陽電池モジュール、及びその製造方法
CN109493992B (zh) 高附着力perc晶体硅太阳能电池用铝浆及其制备方法
CN109659068B (zh) 全铝背场晶体硅太阳能电池用低温固化型背面银浆
CN109390076B (zh) 全铝背场晶体硅太阳能电池用耐老化低温固化型背面银浆
WO2013031519A1 (ja) 太陽電池用導電性接着剤及びこれを用いた接続方法、太陽電池モジュール、太陽電池モジュールの製造方法
JP2016160415A (ja) 導電性組成物、太陽電池セルおよび太陽電池モジュール
CN103201854A (zh) 太阳能电池设备及其制造方法
TW201533920A (zh) 太陽電池、太陽電池模組、帶有電極的零件、半導體裝置及電子零件
CN109168323A (zh) 太阳能电池背面电极用糊组合物
JP2014017398A (ja) 太陽電池モジュール及びその製造方法
JP5844091B2 (ja) 導電性組成物、太陽電池セルおよび太陽電池モジュール
JP2016048807A (ja) 導電性接着剤、並びに、それを用いた太陽電池モジュール、及びその製造方法
JP2016178312A (ja) 太陽電池用導電性接着剤及びこれを用いた接続方法、太陽電池モジュール、太陽電池モジュールの製造方法
JP5692347B2 (ja) 導電接着剤
JP2016186842A (ja) 被覆導線、太陽電池セルおよび太陽電池モジュール
CN116913576B (zh) 导电浆料和异质结太阳能电池
CN108877988A (zh) 高性能晶硅太阳能背场铝浆料及其制备方法、和由其制备的晶硅太阳能电池
CN116913576A (zh) 导电浆料和异质结太阳能电池

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13816406

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20157003029

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 13816406

Country of ref document: EP

Kind code of ref document: A1