WO2014006794A1 - ランプ及び照明装置 - Google Patents
ランプ及び照明装置 Download PDFInfo
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- WO2014006794A1 WO2014006794A1 PCT/JP2013/001732 JP2013001732W WO2014006794A1 WO 2014006794 A1 WO2014006794 A1 WO 2014006794A1 JP 2013001732 W JP2013001732 W JP 2013001732W WO 2014006794 A1 WO2014006794 A1 WO 2014006794A1
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- lighting
- led
- lamp
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
- H05B45/18—Controlling the intensity of the light using temperature feedback
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/37—Converter circuits
- H05B45/3725—Switched mode power supply [SMPS]
- H05B45/382—Switched mode power supply [SMPS] with galvanic isolation between input and output
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
- H05B45/56—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits involving measures to prevent abnormal temperature of the LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/37—Converter circuits
- H05B45/3725—Switched mode power supply [SMPS]
- H05B45/385—Switched mode power supply [SMPS] using flyback topology
Definitions
- the present invention relates to a lamp and a lighting device using a semiconductor light emitting element such as a light emitting diode (LED) as a light source.
- a semiconductor light emitting element such as a light emitting diode (LED) as a light source.
- an LED lamp a lamp using high-efficiency long-life LED (hereinafter referred to as an LED lamp) has been proposed as a bulb-shaped LED lamp replacing a incandescent lamp.
- a mounting substrate on which a large number of LEDs are mounted is attached to the other end of the case provided with a base at one end, and a lighting circuit unit receiving power from the base and lighting the LED is accommodated in the case.
- the LED generates heat by lighting up (emitting light). If this heat causes the LED to excessively heat up, the light emission efficiency of the LED may be reduced or the life of the LED may be shortened. From such a thing, various measures are taken in order to prevent the excessive temperature rise of LED during lighting.
- Patent Document 2 a heat dissipation groove is provided on the surface of a metal case so that the heat transmitted from the mounting substrate to the case during lighting can be efficiently released.
- the case is used as a heat sink.
- JP 2006-313717 A JP, 2010-003580, A
- An object of the present invention is to provide a lamp and a lighting device of a novel configuration that can cope with weight reduction without causing an increase in thermal load on the lighting circuit unit.
- a lamp includes a base for receiving power, a cylindrical case with the base mounted at one end, a base for closing the other end of the case, and A semiconductor light emitting element mounted on the surface located on the outer side of the base, a globe covering the semiconductor light emitting element and mounted on the other end side of the case, received in the case and receiving power via the mouthpiece
- a lighting circuit unit for lighting the semiconductor light emitting element, the case is made of a resin material, and the lighting circuit unit is a current in the forward direction in which the junction temperature of the semiconductor light emitting element during rated lighting is 100.degree.
- a current equal to or less than a value is supplied to the semiconductor light emitting element.
- a lighting device includes a lamp and a lighting fixture for mounting the lamp and lighting the lamp, and the lamp has the above configuration.
- the case since the case is made of a resin material, the case can be made lighter than when made of a metal material.
- a current equal to or less than the forward current at which the junction temperature of the semiconductor light emitting device during rated lighting is 100 ° C. is supplied to the semiconductor light emitting device, the temperature of the semiconductor light emitting device does not excessively rise. Therefore, the heat load on the lighting circuit unit in the case does not increase either.
- FIG. 1 It is the front view which notched some LED lamps in 1st Embodiment. It is a top view of the LED module in 1st Embodiment. It is a top view of a base in a 1st embodiment. It is a front view of a base in a 1st embodiment. It is a longitudinal cross-sectional view of the case in 1st Embodiment. It is a figure which shows the example of mounting of the LED lamp in 1st Embodiment. It is a circuit block diagram in the Example of the LED lamp in 1st Embodiment. It is sectional drawing of the illuminating device in 2nd Embodiment. It is a top view of the LED module concerning modification 1 It is a top view of the LED module concerning modification 2.
- FIG. 1 It is a top view of the LED module concerning modification 2.
- FIG. 16 is a plan view of an LED module according to a third modification.
- FIG. 21 is a cross-sectional view of a base according to Modified Example 4; It is a figure explaining modification 5, (a) is a top view of a LED module with which a pedestal concerning modification 5 is equipped, and (b) is a sectional view of a pedestal concerning modification 5.
- FIG. It is a figure explaining the modification 6, and is a perspective view which removed a glove. It is explanatory drawing of the base which concerns on the modification 6.
- FIG. It is an expanded view of a LED module.
- the lamp according to one aspect of the present invention includes a base for power reception, a cylindrical case with the base mounted at one end, a base that closes the other end of the case, and a surface located outside the base.
- a lighting circuit unit is provided, the case is made of a resin material, and the lighting circuit unit is configured such that a current equal to or less than a forward current value at which a junction temperature of the semiconductor light emitting element during rated lighting becomes 100.degree. Supply to the light emitting element.
- the other end of the case is thermally connected to the base, and the temperature of the portion of the base thermally connected to the other end of the case during the rated lighting is 85 ° C. or less is there.
- a lighting device includes a lamp and a lighting device mounted and lit with the lamp, wherein the lamp is the lamp having the above configuration.
- the LED lamp 1 is, as shown in FIG. 1, a base 3 for receiving power, a cylindrical case 5 with the base 3 mounted at one end, and a base mounted to the case 5 in a state of closing the other end of the case 5 A pedestal 7, an LED module 9 mounted on the main surface (surface located on the outer side) opposite to one end of the case 5 in the base 7, and a glove mounted on the other end side of the case 5 covering the LED module 9 And a lighting circuit unit 13 for supplying power to the LED module 9 using power received from the base 3 and housed in the case 5.
- Component configuration (1) LED module 9
- FIG. 2 is a plan view of the LED module in the first embodiment.
- the LED module 9 includes a mounting substrate 21 and a plurality of LEDs 23 (see FIG. 2) which are semiconductor light emitting elements.
- the LEDs 23 are so-called bare chips, and are mounted on the mounting substrate 21 via bumps, for example.
- the LED module 9 is equipped with the sealing body 25 which seals LED23.
- the mounting substrate 21 has a disk shape.
- the mounting board 21 is a so-called printed board, and has a wiring pattern for connecting the plurality of LEDs 23 in a predetermined connection form.
- the mounting substrate 21 is made of a glass epoxy material, a resin material, a ceramic material or the like.
- the LED 23 emits light of a desired wavelength. At this time, heat is involved.
- the plurality of LEDs 23 are arranged in a matrix. The number of LEDs 23 in a row is different from the number of LEDs 23 in other rows adjacent in the column direction depending on the row.
- the LED 23 is mounted on the wiring pattern of the mounting substrate 21 via bumps and electrically connected, for example, the LED is die-bonded to the mounting substrate and electrically connected to the wiring pattern by a metal wire. It is also good.
- the sealing body 25 is for preventing moisture from intruding into the LED 23.
- a resin material or the like is used as the sealing body 25.
- the wavelength conversion material is mixed in a base material such as a resin material used for the sealing body 25.
- the LED module 9 is mounted on the base 7.
- the mounting substrate 21 is mounted in the recess 31 on the upper surface of the base 7 so as to be fitted.
- the mounting is performed by a method using screws (screwing), a method using engaging means (engaging), a method using an adhesive, a combination of these, and the like.
- an adhesive is used.
- the base 7 comprises an end wall 33 and a peripheral wall 35 as also shown in FIGS. 1, 3 and 4.
- a resin material of PET polyethylene terephthalate
- This resin material is excellent in heat resistance.
- the end wall 33 will be described.
- the surface (upper surface) of the end wall 33 corresponds to the upper surface on which the above-described recess 31 is formed.
- a mounting portion for mounting the LED module 9 is present on the surface of the end wall 33.
- the end wall 33 has a recess 31 for holding (preventing movement) the LED module 9 during mounting.
- the end wall 33 has two through holes 39 for the connection cable 37 that connects the LED module 9 and the lighting circuit unit 13.
- the peripheral wall 35 of the base 7 will be described. As shown in FIGS. 1 and 4, the peripheral wall 35 is provided with fixing means for fixing the lighting circuit unit 13.
- a method using a screw, a method using an adhesive, a method using an engagement means, a method combining these, or the like can be used.
- the engagement means is used.
- FIG. 4 only the circuit board 61 is shown by a broken line in order to show the lighting circuit unit 13 mounted on the base 7.
- Fixing of the lighting circuit unit 13 is performed by using the board supporting portion 41 supporting the circuit board 61 of the lighting circuit unit 13 from the end wall 33 side and the board engaging portion 43 engaging with the surface of the circuit board 61 on the base 3 side.
- a pair of contact portions 45 that contact the peripheral edge of the circuit board 61 are formed.
- the peripheral wall 35 is provided with attachment means for attaching the base 7 to the case 5.
- the mounting means here uses two methods, one using an adhesive and the other using an engaging means. Although two methods are used here, either one may be used or another method (for example, a method using a screw) may be used.
- the peripheral wall 35 has a flange portion 47 extending in the radial direction over the entire circumference at the end edge which is the outer periphery and on the opening side (the side opposite to the end wall 33).
- the ridge portion 47 extending around the entire circumference prevents the leakage (flowing-down) of the adhesive 85 disposed between the peripheral wall 35 and the case 5 as shown in FIG.
- the collar part 47 is engaged with the engaging part 55 (refer FIG. 5) of case 5, and is also an engaging part by the side of the base 7. As shown in FIG.
- the collar portion 47 is provided with a rotation restricting means 49 for restricting the rotation of the base 7 with respect to the case 5.
- the rotation restricting means 49 is constituted by a pair of restricting convex portions 49 a and 49 b formed on the left and right sides of the position corresponding to the engaging portion 55 of the case 5.
- FIG. 5 is a longitudinal sectional view of the case in the first embodiment.
- the case 5 has a cone shape, and a cylindrical portion with a large opening (hereinafter, simply referred to as “large diameter cylindrical portion”) 51 fits over the peripheral wall 35 of the base 7.
- a cap 3 as shown in FIG. 1 is attached to a small-diameter cylindrical portion (hereinafter simply referred to as “small diameter cylindrical portion”) 53 having an opening.
- small diameter cylindrical portion 53 having an opening.
- an engagement portion 55 engaged with a collar portion (engagement portion) 47 formed on the peripheral wall 35 of the base 7 is opposed to the central axis of the case 5 A pair is formed.
- 5 shows the longitudinal cross section of the case 5, only one engaging portion 55 appears.
- An attachment means for attaching the base 3 is provided on the outer periphery of the small diameter cylindrical portion 53.
- the mounting means can be performed by a method of using an adhesive, a method of using a screw, a method of using a caulking, a method of combining these, or the like.
- the base 3 is a screw (Edison) type, A screw method using the shell portion 71 of the base 3 is adopted.
- the outer periphery of the small diameter cylindrical portion 53 is a screw portion 57 screwed to the shell portion 71 of the mouthpiece 3.
- Lighting circuit unit 13 includes a circuit board 61 and various electronic components 63 and 65, as shown in FIG.
- the lighting circuit unit 13 includes a rectifier circuit that rectifies commercial power (AC) received through the base 3 and a smoothing circuit that smoothes the rectified DC power.
- the smoothed DC power is converted into a predetermined voltage by a step-up / step-down circuit, if necessary.
- the circuit board 61 includes an insulating plate, a wiring pattern, and connection terminals.
- the insulating plate here is in the form of a disc as a whole.
- the rectifier circuit is constituted by a diode bridge, and the smoothing circuit is constituted by a capacitor.
- These electronic components 63 and 65 are mounted on the circuit board 61. Although the electronic components are present in addition to the reference numerals “63” and “65”, only the transformer 63 and the electrolytic capacitor 65 are indicated for convenience of the drawing.
- the lighting circuit unit 13 and the base 3 are connected by a wiring cable.
- Base 3 The base 3 has a function as a mounting unit for mounting the LED lamp 1 to a lighting fixture, and a function as a power receiving unit for receiving power from a socket of the lighting fixture.
- the base 3 is of the same type as the base used for general light bulbs.
- the base 3 is, for example, an Edison type (screwed type), and includes a shell portion 71, an eyelet portion 73, and an insulating portion 75 for securing insulation between the shell portion 71 and the eyelet portion 73.
- (6) Glove 11 The globe 11 has a function of protecting the LED module 9. For this reason, the glove 11 is attached to the case 5 in a state of covering the LED module 9.
- the glove 11 is made of a translucent material. Examples of usable translucent materials include glass materials and resin materials.
- the glove 11 is, for example, the same type A as the bulb of a compact fluorescent lamp.
- the glove 11 is attached to the case 5 and the base 7.
- a method using a screw, a method using an adhesive, a method using an engagement means, and the like can be used.
- the open end 81 of the glove 11 is inserted into the gap between the peripheral wall 35 of the base 7 and the case 5, and is fixed by the adhesive 85.
- the LED module 9 emits white light by using the LED 23 that emits blue light and phosphor particles that wavelength-converts blue light to yellow light. Phosphor particles as a wavelength conversion material are mixed in the sealing body 25.
- FIG. 6 is a view showing an implementation example of the LED lamp.
- the LED lamp 1 three LED groups ("20 LEDs" in the drawing) in which twenty LEDs 23 are connected in series are connected in parallel.
- the lighting circuit unit 13 is configured such that the forward voltage Vf of each LED 23 is 3 [V] and the forward current If is 87.5 [mA].
- a voltage of 60 [V] is applied to one LED group to emit a light flux of about 550 [lm], and a light flux of 1650 [lm] is emitted as the LED module 9.
- the lighting state at this time is rated lighting, and the junction temperature Tj of each LED is about 100 [° C.].
- the power supplied to the LED module 9 is determined by the relationship between the actual junction temperature Tj of the LED 23 at this time and the forward current / forward voltage (this is necessary). If you do, create a lamp with a different number of LEDs and perform similar tests to determine the power).
- the temperature of the base 7 to which the LED module 9 is attached is 100 ° C. or less, and the temperature of the case 5 connected to the base 7 is 85 ° C. or less. Materials can be used.
- the twenty LEDs 23 constituting one LED group are mounted in three rows of six, eight and six, and by repeating this three rows three times, the 60 LEDs 23 are It is connected by 20 straight and 3 parallel. That is, the 60 LEDs 23 are divided into 9 rows, of which the second, fifth and eighth rows in the row direction (direction orthogonal to the rows) are composed of eight LEDs 23 and the other The row is composed of six LEDs 23.
- the LED 23 is a square of 390 ⁇ m ⁇ 390 ⁇ m in plan view, and has a height of 520 ⁇ m.
- the distance A between adjacent LEDs 23 in the direction of six or eight in one row of each LED group is 1.6 [mm], and the distance B between adjacent rows is 2.0 [mm] ( See Figure 2).
- FIG. 7 is a circuit configuration diagram of the LED lamp in the embodiment.
- the LED lamp 1 converts the power received via the base 3 into a predetermined power and supplies it to the LED module 9.
- the lighting circuit unit 13 converts the received power into a predetermined power.
- the lighting circuit unit 13 includes a rectifier circuit 101, smoothing circuits 103 and 105, and a power conversion circuit 107.
- the rectifier circuit 101 converts the alternating current received through the base 3 into a direct current.
- the rectifier circuit 101 is configured of a diode bridge composed of four diodes.
- the smoothing circuit 103 smoothes the rectified pulse flow.
- the smoothing circuit 103 is configured of an electrolytic capacitor 65.
- the power conversion circuit 107 is a step-down circuit.
- the step-down circuit includes a transformer 63, a switching element 111, and an IC unit 113, and is a so-called isolated flyback converter.
- the transformer 63 has a primary coil and a secondary coil, and the number of turns of each other is determined by the voltage value to be converted.
- the switching element 111 is for turning on / off the current flowing through the primary coil, and is turned on / off by a signal from the IC unit 113.
- the signal from the IC unit 113 is a rectangular signal, and the current of the primary coil is adjusted by changing the duty ratio.
- a direct current corresponding to the primary coil is output to the secondary coil.
- the smoothing circuit 105 smoothes the direct current output from the secondary coil, and the capacitor 115 is used.
- a voltage of 60 V and a current of 262.5 mA are applied to the LED module 9 from commercial power. It can be supplied.
- Second Embodiment In the first embodiment, in particular, an LED lamp has been described, but the present invention can also be applied to a lighting apparatus using the LED lamp.
- the LED lamp 1 according to the first embodiment is attached to a lighting fixture (which is a downlight type) will be described.
- FIG. 8 is a schematic view of a lighting device according to a second embodiment.
- the lighting device 201 is attached to, for example, the ceiling 202 and used.
- the illuminating device 201 is equipped with the LED lamp 1 and the lighting fixture 203 which mounts the LED lamp 1 and makes it light / extinguish, as shown in FIG.
- the lighting fixture 203 includes, for example, a fixture body 205 attached to the ceiling 202 and a cover 207 attached to the fixture body 205 and covering the LED lamp 1.
- the cover 207 is an open type in which the lower surface is open here, and has a reflective film 211 on its inner surface that reflects the light emitted from the LED lamp 1 in a predetermined direction (here, the lower side).
- the fixture body 205 includes a socket 209 to which the base 3 of the LED lamp 1 is attached (screwed), and the LED lamp 1 is supplied with power via the socket 209.
- the lighting fixture here is an example, and for example, the lighting fixture may have a closed cover without the open cover 207, or the posture in which the LED lamp faces sideways (LED lamp
- the lighting apparatus may be illuminated in a posture in which the central axis of the LED lamp is horizontal) or in an inclined posture (in which the central axis of the LED lamp is inclined with respect to the central axis of the lighting apparatus).
- the lighting device is a direct attachment type in which the lighting fixture is mounted in contact with the ceiling or wall, but it is an embedded type in which the lighting fixture is mounted in a state of being embedded in the ceiling or wall It may be a hanging type that can be hung from the ceiling by an electric cable of a lighting fixture.
- the lighting apparatus here lights one mounted LED lamp 1, it may be such that a plurality of, for example, three LED lamps are mounted.
- the structure of this invention was demonstrated based on 1st and 2nd embodiment, this invention is not limited to the said embodiment.
- the LED lamp according to the first embodiment or the partial configuration of the illumination device according to the second embodiment and the configuration according to the following modification may be combined as appropriate. .
- LED Lamp The LED lamp described in the first embodiment constitutes an envelope with the base 3, the case 5 and the globe 11, and the overall shape of the envelope is the same as the A type of the bulb-type fluorescent lamp .
- the LED lamp may be another type of bulb-type fluorescent lamp, for example G type.
- the overall shape of the LED lamp may be close to that of a light bulb, or may be completely different from that of the light bulb.
- resin materials that can be used as the material of the case include PBT (polybutylene terephthalate), epoxy resin, silicone resin, plastic, polyvinyl chloride resin, acrylic resin, and the like.
- the LED module 9 is fixed with the adhesive 85 to the peripheral wall 35 of the base 7 on which the LED module 9 is mounted, and is in direct contact with the peripheral wall 35 of the base 7
- the inner circumferential surface of the case and the peripheral wall of the base may be configured directly. Even in this case, the junction temperature of the LED during steady lighting is set to 100 ° C. or lower (a forward current of 100 ° C. or lower is supplied), so the case temperature is also 100 ° C. ] It does not become more than, It can comprise with a resin material.
- the case of the first embodiment does not have grooves (so-called heat dissipating fins) capable of increasing the surface area on the outer peripheral surface, but may have grooves. Thereby, the heat dissipation characteristics can be improved.
- Shape The case 5 in the first embodiment has a shape having the large diameter cylindrical portion 51, the small diameter cylindrical portion 53 and the inclined cylindrical portion 54, that is, a part of the portion not covered by the mouthpiece 3 There is a straight pipe in the large diameter cylindrical portion 51. However, it may have other shapes.
- the portion not covered by the base may have a straight tubular shape (in this case, there is a step between the large diameter cylindrical portion and the small diameter cylindrical portion), and it is inclined. (In this case, the large-diameter cylindrical portion does not exist only in the inclined cylindrical portion).
- the semiconductor light emitting element is the LED 23. However, for example, it may be an LD (laser diode), and an EL element (electric luminescence element ) May be. Also in this case, the junction temperature during rated lighting of the semiconductor light emitting element serving as the heat source may be lower than the temperature at which the resin material used for the case or the base is discolored.
- the LEDs 23 are arranged substantially in a matrix on the mounting substrate 21.
- the form of the arrangement (hereinafter also referred to as the arrangement form) is not particularly limited, and may be another arrangement form.
- the arrangement form there are, for example, a matrix shape in which the angle at which the row direction and the column direction intersect is at an angle other than 90 degrees, or an annular shape such as an annular ring or a polygonal ring.
- positioned LED cyclically is demonstrated as the modification 1.
- FIG. 9 is a plan view of the LED module according to the first modification.
- the LED module 301 includes a mounting substrate 303, a plurality of LEDs 305, and a sealing body.
- illustration of the sealing body is omitted in order to explain the arrangement of the LEDs 305.
- the mounting substrate 303 has a wiring pattern 307 for connecting a plurality of, in this case, 60 LEDs 305 in a predetermined connection form.
- a plurality of, in this case, three, LEDs 305 are arranged concentrically.
- the LEDs 305 are mounted on each concentric circle at equal intervals in the circumferential direction, and the intervals between the LEDs 305 mounted on concentric circles are different between concentric circles (different concentric circles) adjacent in the radial direction. That is, all the LEDs 305 on each concentric circle are mounted at intervals (angles) of 18 degrees in the circumferential direction.
- the three concentric circles are in a positional relationship in which they are equally spaced in the radial direction.
- the LEDs 305 arranged on the first and third concentric circles from the center side of the mounting substrate 303 are located on the same radial direction (straight line), and the center side
- the LEDs 305 arranged on the second circumference are circumferentially offset by a half pitch (9 degrees).
- LEDs 305 are mounted on each concentric circle, and a total of 60 LEDs 305 are mounted on the mounting substrate 303.
- One concentric 20 LEDs 305 are connected in series, and this series connected LED group is connected in parallel with other radially adjacent LED group.
- twenty series and three parallel circuits are provided.
- the wiring pattern 307 has 20 LEDs 305 connected in series on each concentric circle, and has a connection pattern 307a for connecting adjacent LED groups in parallel, and a terminal portion 307b for connecting to the lighting circuit unit side. (1-3) Spacing In the first embodiment and the first modification, the spacing between adjacent LEDs is constant (the angle is constant in the circumferential direction, and the spacing is constant in the radial direction). However, the spacing between adjacent LEDs may not be constant, may change with a certain regularity, or may change without regularity.
- FIG. 10 is a plan view of the LED module according to the second modification.
- the LED module 351 includes a mounting substrate 353, a plurality of LEDs 355, and a sealing body. Also in FIG. 10, illustration of the sealing body is omitted in order to explain the distance between the LEDs.
- the mounting substrate 353 has a wiring pattern 357 for connecting a plurality of, in this case, 60 LEDs 355 in a 20-series 3-parallel connection form.
- a plurality of the LEDs 355 are arranged concentrically in this case as well.
- the regularity is such that the number of LEDs 355 mounted on the concentric circle increases from the concentric circle located inside closer to the center to the concentric circle located on the outside, etc.
- the LEDs 355 are mounted at intervals.
- the three concentric circles do not change in the radial direction as they move from the inside to the outside, but may change.
- LEDs 355 are mounted at equal intervals in the circumferential direction on the innermost concentric circle 359a. Twenty LEDs 355 are mounted at equal intervals in the circumferential direction on the middle concentric circle 359b. Twenty-five LEDs 355 are mounted at equal intervals in the circumferential direction on the outermost concentric circle 359c.
- the wiring pattern 357 connects 20 LEDs 355 in series across three concentric circles, and a connection pattern 357a for connecting adjacent LED groups in parallel, and a terminal portion 357b for connecting to the lighting circuit unit side.
- the LED 23 is a bare chip type, but may be another type.
- Other types include a shell type and an SMD type (surface mounting type).
- an LED module mounting an SMD type LED will be described as a third modification.
- FIG. 11 is a plan view of the LED module according to the third modification.
- the LED module 401 includes a mounting substrate 403 and a plurality of SMDs 405.
- the SMD 405 is mounted on the wiring pattern 407 of the mounting substrate 403 via a bump and is electrically connected.
- One SMD 405 includes five bare chip type LEDs and is sealed by a sealing body. Five LEDs are connected in series.
- the SMDs 405 are, as shown in FIG. 11, arranged in an annular shape (one circular shape). More specifically, they are mounted on the mounting substrate 403 at equal intervals (same angles) in the circumferential direction.
- the wiring pattern 407 has a connection portion 407 a for connecting a plurality of SMDs 405 and a terminal portion 407 b for connection to the lighting circuit unit side.
- the plurality of SMDs 405 are arranged in a single ring shape, but may be, for example, arranged in multiple ring shapes such as double (multiple concentric circles), or the first It may be arranged in a matrix as in the embodiment of. Furthermore, the mounting intervals of the plurality of SMDs may or may not be constant. That is, the SMD may be implemented as in the first modification or the second modification.
- the mounting board 21 in the first embodiment has a circular disk shape in plan view. However, the mounting substrate may have another shape, for example, a polygon such as a triangle or a quadrangle, an oval shape, or an annular shape in plan view. Further, the number of mounting substrates is not limited to one, and may be two or more.
- the thickness of the mounting substrate 21 is constant, it may be partially thick or thin.
- the portion of the mounting substrate on which an LED, an SMD, and the like (hereinafter, referred to as “LED and the like”) may be thickened. More specifically, when the LED or the like is mounted in an annular shape, the portion corresponding to the circumference may be thickened. Thereby, the heat storage in the part which has mounted the LED etc. can be suppressed.
- Sealing Body In the first embodiment, one sealing body 25 seals all the LEDs 23. However, the sealing body only needs to seal the LED, and the form is not relevant.
- one LED may be sealed (the number of LEDs is the same as the number of encapsulants), and a predetermined number of LEDs of all the LEDs may be sealed. It may be sealed by the body.
- the LED module 9 emits white light by using the LED 23 that emits blue light and phosphor particles that convert the wavelength of blue light, for example, semiconductor light emission of ultraviolet light emission It may be a combination of a device and phosphor particles of each color that emits light of three primary colors (red, green and blue).
- the wavelength conversion material a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used. 4.
- the Edison-type base 3 is used, but other types, for example, a pin type (specifically, G-type such as GY, GX, etc.) may be used.
- die 3 was attached to (joined) the case 5 by screwing with the screw part 57 of the case 5 using the screw of the shell part 71, the case by other methods It may be joined with Other methods include adhesive bonding, caulking bonding, press-in bonding, and the like, and two or more of these methods may be combined. 5.
- the glove 11 is of A type, but may be of another type, for example, of a G type, an R type, or the like, or a shape completely different from the shape of a light bulb etc. It is also good.
- the inner surface of the glove is not particularly described, for example, a diffusion process (for example, a process with silica or a white pigment) for diffusing light emitted from the LED module 9 may be performed.
- a diffusion process for example, a process with silica or a white pigment
- the glove may be made of a translucent material, and, for example, transparency and opacity are not particularly relevant.
- the glove 11 is integral (made as one piece), but may be, for example, a combination (joined) of a plurality of members. 6.
- the mounting portion of the LED module 9 is thinner at the end wall 33 of the base 7.
- the mounting portion may be thicker, or the portion other than the mounting portion may be thicker. It is also good.
- the base where the part to which the LED module 9 is attached is thick is referred to as the fourth modification, and the base where the part other than the part where the LED module is attached is thick is described as the fifth modification.
- the mounting portion refers to a portion of the base in contact with the LED module.
- FIG. 12 is a cross-sectional view of a base according to a fourth modification.
- the base 451 includes an end wall 453 and a peripheral wall 455 as in the case of the base 7 in the first embodiment. Although the lower portion of the peripheral wall 455 is not shown in FIG. 12, the configuration of the peripheral wall 455 is the same as the peripheral wall 35 of the base 7 of the first embodiment, and the description thereof is omitted here.
- the end wall 453 has a thick portion 457 at its central portion.
- the surface of the thick portion 457 is a mounting portion 459 for mounting the LED module (9).
- the mounting portion 459 is recessed at the center of the thick portion 457, and the slide of the LED module (9) is restricted.
- FIG. 13 is a view for explaining the fifth modification, (a) is a plan view of the LED module mounted on the base according to the fifth modification, and (b) is a cross section of the base according to the fifth modification FIG.
- the LED module 471 shown in (a) of FIG. 13 is mounted on the base 473 as shown in (b) of FIG.
- the LED module 471 has an opening 475 at the center and has an annular shape in plan view. Specifically, the opening 475 has a substantially circular shape in a plan view, and the LED module 471 has an annular shape.
- the LED module 471 includes a mounting substrate 477, a plurality of LEDs 479 (see (b) in FIG. 13), and a sealing body 481.
- the mounting substrate 477 has an annular shape.
- the mounting substrate 477 has a wiring pattern on its surface.
- the wiring pattern has a connection portion for connecting the plurality of LEDs 479 in a predetermined connection form, and a terminal portion 485 for connection of the wiring 483 from the lighting circuit unit.
- the connection portion is covered by the sealing body 481, and as shown in (a) of FIG. 13, only the terminal portion 485 appears outside.
- the sealing body 481 is provided in an annular shape with respect to the mounting substrate 477.
- the form, number, and connection form of the LEDs are not particularly limited.
- the base 473 has an end wall 491 as in the first embodiment.
- the end wall 491 has an overhang 493 that projects into the opening 475 of the LED module 471, as shown in FIG. 13 (b).
- the overhang portion 493 is thicker than the mounting portion 495 to which the LED module 471 is mounted.
- a through hole 497 through which the wiring 483 from the lighting circuit unit side passes is provided in the overhang portion 493.
- FIG. 14 is a view for explaining the sixth modification, and is a perspective view with the glove removed, FIG. 15 is an explanatory view of a base according to the sixth modification, and FIG. 16 is a developed view of the LED module is there.
- the LED lamp 501 is, as shown in FIG. 14, the base 3, the case 5, the base 503, the LED module 505, the globe not shown, the lighting circuit accommodated in the case 5 and not appearing in FIG. It has a unit.
- the structure of the LED lamp 501 which concerns on the modification 6 differs in the base 503 and the LED module 505 with respect to the LED lamp 1 which concerns on 1st Embodiment.
- the base 503 and the LED module 505 will be described below.
- the base 503 has a plurality of mounting surfaces on which the LED module 505 is mounted. In this example, there are 17 mounting surfaces. As shown in FIG. 15, the base 503 has a polygonal frustum shape, here, a shape close to an octagonal frustum, and a mounting surface is formed on the circumferential surface thereof.
- the base 503 has a cylindrical tubular portion 507, a lid portion 509 for closing the upper end of the tubular portion 507, and an outer shell projecting outward from the lower end of the cylindrical portion 507. And a unit 511.
- the cylindrical portion 507 has an octagonal cross-sectional shape.
- the cylindrical portion 507 is composed of an octagonal cylindrical portion 507a and an octagonal pyramidal portion 507b, and a total of 16 surfaces of the peripheral surfaces are mounting surfaces.
- the lid portion 509 has an octagonal shape when viewed from above, and has a through hole 513 at its center.
- the outer surface of the lid portion 509 is a mounting surface on which the LED module 505 (LED 527) is mounted in a region excluding the through hole 513.
- the outer collar portion 511 abuts on the inner circumferential surface of the case 5 when the base 503 is inserted into the case 5 from the outer collar portion 511 side.
- the LED module 505 is mounted on a mounting surface formed on the outer peripheral surface of the base 503, as shown in FIG. Since there are a plurality of mounting surfaces (17 surfaces) of the base 503, a so-called flexible substrate having flexibility is used for the mounting substrate 515 of the LED module 505.
- the mounting substrate 515 before mounting has a shape similar to the mounting surface when the base 503 is expanded as shown in FIG. Specifically, the mounting substrate 515 has a central portion 517 located at the center of the imaginary circle, and a plurality (eight) extending portions 519 radially extending from the central portion 517 at intervals in the circumferential direction. It consists of The central portion 517 has a through window 517 a corresponding to the through hole 513 of the base 503 at the center thereof.
- the mounting substrate 515 has a flexible insulating plate 521 and a wiring pattern 523 formed on the surface of the insulating plate 521.
- the wiring pattern 523 is for connecting the LEDs 527 in a predetermined connection form (for example, series, parallel, series-parallel, etc.).
- a connector 525 for electrically connecting the wiring pattern 523 and the lighting circuit unit, and a plurality of LEDs 527 are provided on the surface of the mounting substrate 515.
- the wiring connecting the wiring pattern 523 and the lighting circuit unit is drawn out from the inside of the base 503 using the through window 517 a of the mounting substrate 515 and the through hole 513 of the base 503.
- the plurality of LEDs 527 are mounted on the surface of the mounting substrate 515 so as to be located on the mounting surfaces of the base 513.
- the LEDs 527 shown in FIGS. 14 and 16 are sealed by a sealing body.
- Lighting Circuit Unit (1) Circuit Configuration
- the lighting circuit unit 13 in the embodiment includes the rectifier circuit 101, the smoothing circuits 103 and 105, and the power conversion circuit 107, and uses a step-down circuit as a power conversion circuit (voltage conversion circuit). .
- a step-down circuit as a power conversion circuit (voltage conversion circuit).
- another circuit may be used as the power conversion circuit.
- Other circuits include a buck-boost circuit, a constant current circuit, a constant voltage circuit, and the like. When the voltage applied to the LED is higher than the commercial input voltage, the booster circuit is used.
- the booster circuit there is, for example, a circuit using a transformer.
- this is the distance between the back surface of the end wall 33 of the base 7 and the circuit board 61 of the lighting circuit unit 13 (“c” in FIG. 1). The larger the), the smaller the influence on the lighting circuit unit of the heat of the LED 23 during lighting.
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Abstract
Description
<第1の実施形態>
以下、本発明をLEDランプに適用させた場合における実施形態を図1から図7を用いて説明する。
1.全体構成
図1は、第1の実施形態におけるLEDランプの一部を切り欠いた正面図である。
2.部品構成
(1)LEDモジュール9
図2は、第1の実施形態におけるLEDモジュールの平面図である。
(2)基台7
図3は、第1の実施形態における基台の平面図であり、図4は、第1の実施形態における基台の正面図である。
(3)ケース5
図5は、第1の実施形態におけるケースの縦断面図である。
口金3のシェル部71を利用したネジ方法を採用している。具体的には、小径筒部53の外周が、口金3のシェル部71と螺合するネジ部57となっている。
(4)点灯回路ユニット13
点灯回路ユニット13は、図1に示すように、回路基板61と各種の電子部品63,65とを含む。点灯回路ユニット13は、口金3を介して受電した商用電力(交流)を整流する整流回路と、整流された直流電力を平滑化する平滑回路とを備える。平滑された直流電力は、必要があれば、昇圧・降圧回路等により所定の電圧へと変換される。
(5)口金3
口金3は、LEDランプ1を照明器具に装着するための装着手段としての機能と、照明器具のソケットから受電するための受電手段としての機能を有する。口金3は、一般電球に用いられている口金と同タイプのものが利用される。口金3は、例えばエジソンタイプ(ねじ込みタイプ)であり、シェル部71と、アイレット部73と、シェル部71とアイレット部73との絶縁性を確保するための絶縁部75とからなる。
(6)グローブ11
グローブ11は、LEDモジュール9を保護する機能を有する。このため、グローブ11は、LEDモジュール9を被覆する状態でケース5に装着される。なお、グローブ11は、透光性材料により構成されている。使用可能な透光性材料としては、例えば、ガラス材料や樹脂材料等がある。
3.具体的な構成について
LEDモジュール9は、青色光を出射するLED23と、青色光を黄色光に波長変換する蛍光体粒子とを利用することで白色光を出射する。波長変換材料としての蛍光体粒子は封止体25に混入されている。
<第2の実施形態>
第1の実施形態では、特に、LEDランプについて説明したが、本発明は、上記LEDランプを利用した照明装置にも適用できる。
<変形例>
以上、本発明の構成を、第1及び第2の実施形態に基づいて説明したが、本発明は上記実施形態に限られない。例えば、第1の実施形態に係るLEDランプや第2の実施形態に係る照明装置の部分的な構成および下記の変形例に係る構成を、適宜組み合わせてなるLEDランプや照明装置であってもよい。
1.LEDランプ
第1の実施形態で説明したLEDランプは、口金3、ケース5及びグローブ11で外囲器を構成し、その外囲器の全体形状が電球型蛍光ランプのAタイプと同じであった。しかしながら、LEDランプは、電球型蛍光ランプの他のタイプ、例えば、Gタイプであってもよい。
2.ケース
(1)材料
ケースの材料として利用できる樹脂材料としては、例えば、PBT(ポリブチレンテレフタレート)、エポキシ樹脂、シリコン樹脂、プラスチック、塩化ビニール樹脂、アクリル樹脂等がある。
(2)基台との関係
第1の実施形態では、LEDモジュール9が載置される基台7の周壁35に対して接着剤85で固定され、基台7の周壁35と直接接触していなかったが、ケースの内周面と基台の周壁とが直接するような構成であってもよい。この場合でも定常点灯中のLEDのジャンクション温度が100[℃]以下に設定されている(100[℃]以下となるような順電流が供給されている。)ので、ケースの温度も100[℃]以上になることはなく、樹脂材料によって構成することができる。
(3)形状
第1の実施形態でのケース5は、大径筒部51と小径筒部53と傾斜筒部54とを有するような形状、つまり、口金3によって覆われていない部分の一部が大径筒部51で直管状をしていた。しかしながら、他の形状であってもよい。
3.LEDモジュール
(1)半導体発光素子
(1-1)種類
第1の実施形態では、半導体発光素子はLED23であったが、例えば、LD(レーザダイオード)であってもよく、EL素子(エレクトリックルミネッセンス素子)であってもよい。この場合も、熱源となる半導体発光素子における定格点灯中のジャンクション温度がケースや基台に使用する樹脂材料が変色する温度よりも低くなるようにすればよい。
(1-2)配置
第1の実施形態では、LED23は実装基板21上に略行列状で配置されていたが、LEDの発光中の温度を100[℃]以下であれば、複数のLEDの配置の形態(以下、配置形態ともいう。)は特に限定されるものではなく、他の配置形態でもよい。他の配置形態としては、例えば、行方向と列方向とが交差する角度を90[度]以外の角度にしたような行列状、円環状や多角環状等の環状等がある。
(1-3)間隔
第1の実施形態及び変形例1では、隣接するLEDの間隔が一定であった(周方向では角度が一定であり、径方向には間隔が一定である。)。しかしながら、隣接するLEDの間隔は、一定でなくてもよく、一定の規則性で変化してもよいし、規則性なしで変化してもよい。
(1-4)タイプ
第1の実施形態では、LED23はベアチップタイプであったが、他のタイプでもよい。他のタイプとしては、砲弾タイプやSMDタイプ(表面実装型)がある。以下、SMDタイプのLEDを実装したLEDモジュールを変形例3として説明する。
(2)実装基板
第1の実施形態での実装基板21は平面視において円形状をした円板状をしている。しかしながら、実装基板は、平面視において、他の形状、例えば、三角形、四角形等の多角形、楕円形状、環状等であってもよい。また、実装基板数も1個に限定するものでなく、2個以上の複数個であってもよい。
(3)封止体
第1の実施形態では、1つの封止体25はすべてのLED23を封止している。しかしながら、封止体は、LEDを封止できればよく、その形態は関係ない。例えば、1つのLEDに対して封止するようにしてもよい(LEDの数と封止体の数とが同じである。)し、全てのLEDのうち、所定数のLEDを1つの封止体により封止するようにしてもよい。
(4)その他
LEDモジュール9は、青色光を出射するLED23と、青色光を波長変換する蛍光体粒子とを利用することで白色光を出射するようにしていたが、例えば、紫外線発光の半導体発光素子と三原色(赤色、緑色、青色)に発光する各色蛍光体粒子とを組み合わせたものでもよい。
4.口金
第1の実施形態では,エジソンタイプの口金3を利用したが、他のタイプ、例えば、ピンタイプ(具体的にはGY、GX等のGタイプである。)を利用してもよい。
5.グローブ
第1の実施形態では、グローブ11をAタイプとしたが、他のタイプ、例えばGタイプ、Rタイプ等の形状であってもよいし、電球等の形状と全く異なるような形状であってもよい。
6.基台
第1の実施形態では、基台7の端壁33は、LEDモジュール9の装着部分が薄くなっていたが、装着部分を厚くするようにしてもよいし、装着部分以外を厚くしてもよい。以下、LEDモジュール9を装着する部分が厚い基台を変形例4とし、LEDモジュールを装着する部分以外の部分が厚い基台を変形例5としてそれぞれ説明する。なお、装着部分とは、基台においてLEDモジュールと接触する部分をさす。
(1)変形例4
図12は、変形例4に係る基台の断面図である。
(2)変形例5
図13は、変形例5を説明する図であり、(a)は変形例5に係る基台に装着されるLEDモジュールの平面図であり、(b)は変形例5に係る基台の断面図である。
(3)変形例6
図14は、変形例6を説明する図であり、グローブを外した斜視図であり、図15は、変形例6に係る基台の説明図であり、図16は、LEDモジュールの展開図である。
7.点灯回路ユニット
(1)回路構成
実施例での点灯回路ユニット13は、整流回路101、平滑回路103,105、電力変換回路107を備え、電力変換回路(電圧変換回路)として、降圧回路を用いた。しかしながら、電力変換回路として他の回路を用いてもよい。他の回路としては昇降圧回路、定電流回路、定電圧回路等がある。また、商用入力電圧よりも、LEDへの印加電圧が高い場合には、昇圧回路を用いることとなる。昇圧回路としては、例えばトランスを使用する回路等がある。
(2)配置
第1の実施形態では、特に説明しなかったが、基台7の端壁33の裏面と、点灯回路ユニット13の回路基板61との間隔(図1の「c」である。)は大きいほど、点灯中のLED23の熱の点灯回路ユニットへの影響が小さい。
3 口金
7 基台
9 LEDモジュール
11 グローブ
13 点灯回路ユニット
23 LED
Claims (3)
- 受電用の口金と、
前記口金が一端に装着された筒状のケースと、
前記ケースの他端を塞ぐ基台と、
前記基台の外側に位置する面に実装された半導体発光素子と、
前記半導体発光素子を覆い前記ケースの他端側に装着されたグローブと、
前記ケース内に収容され且つ前記口金を介して受電して前記半導体発光素子を点灯させる点灯回路ユニットと
を備え、
前記ケースは、樹脂材料からなり、
前記点灯回路ユニットは、定格点灯中における前記半導体発光素子のジャンクション温度が100℃となる順方向の電流値以下の電流を、前記半導体発光素子に供給する
ことを特徴とするランプ。
- 前記ケースの他端部は、前記基台と熱的に接続し、
前記定格点灯中において、前記基台における前記ケースの他端部と熱的に接続する部分の温度が85℃以下である
ことを特徴とする請求項1に記載のランプ。
- ランプと、前記ランプを装着して点灯させる照明器具とを備える照明装置において、
前記ランプは、請求項1又は2に記載のランプである
ことを特徴とする照明装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201390000512.7U CN204300727U (zh) | 2012-07-05 | 2013-03-14 | 灯及照明装置 |
JP2013525050A JP5379335B1 (ja) | 2012-07-05 | 2013-03-14 | ランプ及び照明装置 |
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JP2015207383A (ja) * | 2014-04-17 | 2015-11-19 | 住友電気工業株式会社 | Led照明装置及びled照明装置の製造方法 |
JP6137061B2 (ja) * | 2014-06-11 | 2017-05-31 | 三菱電機株式会社 | 発光装置 |
JP6392637B2 (ja) * | 2014-11-07 | 2018-09-19 | 住友電工プリントサーキット株式会社 | Ledモジュール及びled照明器具 |
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JP2011138749A (ja) * | 2009-02-04 | 2011-07-14 | Panasonic Corp | ランプ |
JP2012014900A (ja) * | 2010-06-30 | 2012-01-19 | Stanley Electric Co Ltd | 照明装置 |
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EP2309168B1 (en) * | 2008-07-07 | 2015-09-23 | Panasonic Intellectual Property Management Co., Ltd. | Bulb-type lighting source |
JP5623833B2 (ja) * | 2010-09-03 | 2014-11-12 | パナソニック株式会社 | ランプ |
JP5546437B2 (ja) * | 2010-12-09 | 2014-07-09 | カルソニックカンセイ株式会社 | 発光ダイオードの駆動制御方法 |
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- 2013-03-14 JP JP2013525050A patent/JP5379335B1/ja active Active
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JP2011138749A (ja) * | 2009-02-04 | 2011-07-14 | Panasonic Corp | ランプ |
JP2012014900A (ja) * | 2010-06-30 | 2012-01-19 | Stanley Electric Co Ltd | 照明装置 |
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JP2014029866A (ja) | 2014-02-13 |
CN204300727U (zh) | 2015-04-29 |
JP5432411B2 (ja) | 2014-03-05 |
JP2014063751A (ja) | 2014-04-10 |
JP5938748B2 (ja) | 2016-06-22 |
JPWO2014006794A1 (ja) | 2016-06-02 |
JP5379335B1 (ja) | 2013-12-25 |
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