WO2014005362A1 - 对玻璃基板进行烤焙处理的装置及方法 - Google Patents
对玻璃基板进行烤焙处理的装置及方法 Download PDFInfo
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- WO2014005362A1 WO2014005362A1 PCT/CN2012/079573 CN2012079573W WO2014005362A1 WO 2014005362 A1 WO2014005362 A1 WO 2014005362A1 CN 2012079573 W CN2012079573 W CN 2012079573W WO 2014005362 A1 WO2014005362 A1 WO 2014005362A1
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- support member
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- the invention relates to the technical field of glass substrate baking treatment, in particular to an apparatus and a method for baking a glass substrate.
- a pre-baked (Prebake) PI (Polyimide) liquid on a glass substrate is required.
- the baking method is to heat the glass substrate to 90 by using an infrared radiation glass substrate. Celsius, the solvent in the PI solution is evaporated to increase the concentration of PI.
- the support pin is generally used to support the glass substrate, but since the material of the support pin is not completely insulated, the contact area on the glass substrate (the area on the glass substrate that is in contact with the support member) is non-contact.
- the region (the region on the glass substrate that is not in contact with the support member) has a difference in the heat transfer rate, so that the glass substrate is unevenly heated, causing spots (Mura) on the glass substrate, which lowers the yield of the glass substrate.
- one is to use a material with better thermal insulation properties as a material for supporting the needle, so as to reduce the temperature of the region on the glass substrate and the contact pin and other regions.
- the second is to reduce the time for the support pin to contact the glass substrate in the same place by controlling the plurality of support pins to alternately support the glass substrate, that is, first use some support pins to support the glass substrate, and use other supports after a predetermined time.
- the needle supports the glass substrate.
- both of the above solutions cannot effectively prevent spots on the glass substrate because: the above two technical solutions cannot eliminate different areas on the glass substrate (the area on the glass substrate that is in contact with the support pin and the glass substrate does not The presence of a temperature difference between the areas in which the support pins are in contact; 2.
- the support pin supporting the glass substrate causes the pressure of the glass substrate to contact the support pin to be too large, thereby causing the glass substrate to deform and the glass substrate to be heated. Uneven, spots appear in the baking process;
- the support needle is needle-shaped, which is not conducive to maintaining the flatness of the glass substrate during the baking process, and it is easy to cause a halo on the glass substrate (Halo ) Area spots.
- An object of the present invention is to provide an apparatus for baking a glass substrate which can effectively prevent spots from appearing on a glass substrate.
- the present invention provides an apparatus for baking a glass substrate, comprising: a baking chamber for heating the glass substrate; a supporting member for supporting the glass substrate; and a temperature sensing a device for sensing a temperature of the glass substrate; a heating device for heating the support member; a cooling device for cooling the support member; and a temperature control device for receiving the device Determining temperature data transmitted by the temperature sensing device, and controlling the heating device to heat the support member according to the temperature data, or controlling the cooling device to cool the support member; the temperature sensing device
- the method includes: a first temperature sensor for sensing first temperature data of the glass substrate, the first temperature data is a temperature of a first region on the glass substrate; and a second temperature sensor for sensing Measuring second temperature data of the glass substrate, the second temperature data being a temperature of a second region on the glass substrate; the temperature sensing device and the temperature Braking means electrically connected; said temperature control means and said heating means and said cooling device is electrically connected; said baking chamber with an infrared heater for heating
- the temperature control device is further configured to compare the first temperature data and the second temperature data.
- the temperature control device in a case where the first temperature data is greater than the second temperature data, is further configured to control the heating device to perform the support member Heating; wherein the temperature control device is further configured to control the cooling device to cool the support member in a case where the first temperature data is smaller than the second temperature data.
- the method further includes: a third temperature sensor for sensing third temperature data of the support member, wherein the third temperature data is a temperature of the support member .
- the temperature control device is further configured to control the heating device and the cooling device according to the third temperature data.
- the temperature of the support member is adjusted such that the third temperature data coincides with the room temperature of the baking chamber.
- Another object of the present invention is to provide an apparatus for baking a glass substrate which can effectively prevent the occurrence of spots on the glass substrate.
- the present invention provides an apparatus for baking a glass substrate, comprising: a baking chamber for heating the glass substrate; and a supporting member for supporting the glass substrate; a temperature sensing device for sensing a temperature of the glass substrate; a heating device for heating the support member; a cooling device for cooling the support member; a temperature control device, And configured to receive temperature data sent by the temperature sensing device, and control the heating device to heat the support member according to the temperature data, or control the cooling device to cool the support member.
- the temperature sensing device includes: a first temperature sensor for sensing first temperature data of the glass substrate, the first temperature data being the a temperature of the first region on the glass substrate; and a second temperature sensor for sensing second temperature data of the glass substrate, the second temperature data being a temperature of the second region on the glass substrate.
- the temperature control device is further configured to compare the first temperature data and the second temperature data.
- the temperature control device in a case where the first temperature data is greater than the second temperature data, is further configured to control the heating device to perform the support member Heating; wherein the temperature control device is further configured to control the cooling device to cool the support member in a case where the first temperature data is smaller than the second temperature data.
- the method further includes: a third temperature sensor for sensing third temperature data of the support member, wherein the third temperature data is a temperature of the support member;
- the temperature control device is further configured to control the heating device and the cooling device to adjust the temperature of the supporting member according to the third temperature data, so that the first The three temperature data is consistent with the room temperature of the baking chamber.
- Another object of the present invention is to provide a method of baking a glass substrate which can effectively prevent the occurrence of spots on the glass substrate.
- the present invention provides a method for baking a glass substrate, comprising: a baking chamber, a supporting member, a temperature sensing device, a heating device, a cooling device, and a temperature control device.
- the method includes the steps of: (A) heating the glass substrate by the baking chamber; (B) sensing the temperature of the glass substrate by the temperature sensing device; (C) the temperature control device Receiving temperature data transmitted by the temperature sensing device, and controlling the heating device to heat the support member according to the temperature data, or controlling the cooling device to cool the support member.
- the temperature sensing device comprises: a first temperature sensor and a second temperature sensor; and the step (B) further comprises the following steps: (b1) Sensing a first temperature data of the glass substrate, the first temperature data being a temperature of a first region on the glass substrate; and (b2) sensing the glass substrate by the second temperature sensor The second temperature data is the temperature of the second region on the glass substrate.
- step (C) further comprises the step of: (c1) the temperature control device comparing the first temperature data and the second temperature data.
- the step (C) further includes the following steps: (c2) in the case where the first temperature data is greater than the second temperature data, the temperature control device Controlling the heating device to heat the support member; (c3) in a case where the first temperature data is smaller than the second temperature data, the temperature control device controls the cooling device to perform the support member cool down.
- the temperature sensing device further includes: a third temperature sensor; the step (C) further comprising the steps of: (c4) performing a glass substrate on the baking chamber Before heating, the third temperature sensor senses third temperature data of the support member, the third temperature data is a temperature of the support member, and the temperature control device controls the heating device according to the third temperature data And the cooling device adjusts a temperature of the support member such that the third temperature data coincides with a room temperature of the baking chamber.
- the present invention can dynamically learn the temperature of the glass substrate and the temperature of the supporting member in contact with the glass substrate by using the temperature sensor (the first temperature sensor, the second temperature sensor, and the third temperature sensor).
- the temperature value of each region on the entire glass substrate and the temperature value of the support member thereby obtaining the difference between the temperature of the glass substrate and the temperature of the support member, and controlling the heating device or the cooling device according to the difference, thereby dynamically controlling
- the temperature of the support member in contact with the glass substrate keeps the temperature of the glass substrate consistent with the temperature of the support member throughout the baking process, effectively preventing the occurrence of spots on the glass substrate.
- the technical solution of the present invention eliminates the conventional Needle spots that appear when the support pins support the glass substrate (Pin The phenomenon of Mura) and other speckles, in addition, the technical solution of the present invention also eliminates the phenomenon that the glass substrate is deformed by the supporting needle support, so that the glass substrate does not cause uneven heating due to deformation, and spots appear.
- the support member is not necessarily limited to a needle shape, so that the contact area of the support member with the glass substrate can be increased, thereby improving the flatness of the glass substrate during baking, and reducing the glass to some extent. The probability of occurrence of spots in the Halo region on the substrate.
- Figure 1 is a block diagram of an apparatus for baking a glass substrate in the present invention
- FIG. 2 is a block diagram of the temperature sensing device of Figure 1;
- FIG. 3 is a flow chart of a method for baking a glass substrate in the present invention.
- FIG. 4 is a flow chart showing the steps of the temperature sensing device of FIG. 3 sensing the temperature of the glass substrate and the temperature of the support member;
- Fig. 5 is a view showing the temperature change of the support member in the apparatus for baking the glass substrate of the present invention.
- FIG. 1 is a schematic block diagram of an apparatus for baking a glass substrate in the present invention.
- the apparatus for baking a glass substrate of the present invention includes a baking chamber 101, a support member 102, a temperature control device 105, a temperature sensing device 106, a heating device 103, and a cooling device 104.
- the temperature sensing device 106 is electrically connected to the temperature control device 105.
- the temperature control device 105 is electrically connected to the heating device 103 and the cooling device 104.
- the baking chamber 101 is for placing a glass substrate and heating the glass substrate. Specifically, the baking chamber 101 heats the glass substrate by an infrared heater (not shown).
- the support member 102 is disposed in the baking chamber 101 for supporting the glass substrate.
- the portion of the support member 102 that is in contact with the glass substrate may be needle-shaped or planar, and the support member 102 uses a thermal conductivity. Made of materials such as metal.
- a temperature sensing device 106 is placed in the baking chamber 101 for sensing the temperature of the glass substrate and the temperature of the support member 102.
- the temperature control device 105 is configured to receive the temperature data of the glass substrate sensed by the temperature sensing device 106 and the temperature data of the support member 102, and control the heating device 103 to heat the support member 102 according to the temperature data, or control the pair of the cooling device 104.
- the support member 102 is cooled.
- the heating device 103 is placed in the baking chamber 101, specifically, the heating device 103 is placed inside the support member 102 or on the surface of the support member 102, or coupled to the support member 102 for heating the support member 102.
- the cooling device 104 is placed within the roasting chamber 101, specifically, the cooling device 104 is placed inside the support member 102 or on the surface of the support member 102, or coupled to the support member 102 for cooling the support member 102.
- FIG. 2 is a block diagram of the temperature sensing device 106 of FIG.
- the temperature sensing device 106 of the present invention includes a first temperature sensor 201, a second temperature sensor 202, and a third temperature sensor 203.
- the first temperature sensor 201, the second temperature sensor 202, and the third temperature sensor 203 are all electrically connected to the temperature control device 105.
- the first temperature sensor 201 is disposed near the surface of the first region of the glass substrate (the region on the glass substrate that is not in contact with the support member 102).
- the first temperature sensor 201 may be an infrared temperature sensor disposed on the glass substrate.
- the sensor 201 transmits the first temperature data to the temperature control device 105.
- the second temperature sensor 202 is disposed near the surface of the second region of the glass substrate (the region on the glass substrate that is in contact with the support member 102), Specifically, the second temperature sensor 202 can also be an infrared temperature sensor disposed above the second region of the glass substrate (the region on the glass substrate that is in contact with the support member 102), which is kept at a certain distance from the glass substrate.
- the temperature for sensing the second region on the glass substrate (the region on the glass substrate in contact with the support member 102) is referred to as second temperature data, and the second temperature sensor 202 transmits the second temperature data to the temperature control device 105.
- the third temperature sensor 203 is disposed on the surface or inside of the support member 102. Specifically, the third temperature sensor 203 is a thermocouple. Of course, other types of temperature sensors, such as thermal resistors, etc., and the third temperature sensor 203 may be used. It is disposed on the support member 102 in the vicinity of a portion in contact with the glass substrate for sensing the temperature of the support member 102, which is recorded as the third temperature data, and the third temperature sensor 203 transmits the third temperature data to the temperature control device 105.
- the working principle of the apparatus for baking a glass substrate of the present invention is to use a temperature sensing device 106 to measure the temperature and the first region (glass) of the second region of the glass substrate (the region on the glass substrate that is in contact with the support member 102).
- the temperature of the region on the substrate that is not in contact with the support member 102 is sensed, and then the difference in temperature between the two regions is known by comparison, and the second region on the glass substrate is adjusted by controlling the heating device 103 or the cooling device 104 (glass
- the temperature of the region of the substrate that is in contact with the support member 102 is equal to the temperature of the first region (the region on the glass substrate that is not in contact with the support member 102).
- the temperature control device 105 controls The cooling device 104 cools the support member 102 until the temperatures of the two regions are equal, if the temperature of the second region on the glass substrate (the region on the glass substrate that is in contact with the support member 102) is smaller than the first region (on the glass substrate)
- the temperature control device 105 controls the heating device 103 to heat the support member 102 until the temperatures of the two regions are equal, without the temperature of the region in contact with the support member 102.
- the temperature of the second region on the glass substrate (the region on the glass substrate in contact with the support member 102) and the temperature of the first region (the region on the glass substrate not in contact with the support member 102) are kept in real time.
- the temperature control device 105 controls the cooling device 104 to cool the support member 102 until the third temperature data is equal to the first temperature data.
- the temperature control device 105 controls the heating device 103 to heat the support member 102 until the third temperature data is equal to the first temperature data.
- FIG. 3 is a flowchart of a method for baking a glass substrate in the present invention
- FIG. 4 is a temperature sensing device 105 of FIG. 3 sensing temperature of the glass substrate and the supporting member 102.
- Flow chart of the steps of the temperature In step 301, the room temperature of the baking chamber 101 is adjusted to 23 degrees Celsius, and the glass substrate is fed into the baking chamber 101.
- the glass substrate is supported using the support member 102.
- the baking chamber 101 heats the glass substrate.
- the temperature sensing device 106 senses the temperature of the glass substrate and the temperature of the support member 102, and transmits the temperature data of the glass substrate and the temperature data of the support member 102 to the temperature control device 105. Specifically, in step 401 shown in FIG.
- the first temperature sensor 201 senses the temperature of the first region on the glass substrate (the region on the glass substrate that is not in contact with the support member 102), and obtains the first temperature data, and the The first temperature data is sent to the temperature control device 105; in step 402, the second temperature sensor 202 senses the temperature of the second region on the glass substrate (the region on the glass substrate that is in contact with the support member 102) to obtain the second temperature data, and The second temperature data is sent to the temperature control device 105; in step 403, the third temperature sensor 203 senses the temperature of the support member 102, obtains third temperature data, and transmits the third temperature data to the temperature control device 105.
- the temperature control device 105 receives temperature data (first temperature data and second temperature data) of the glass substrate and temperature data (third temperature data) of the support member 102.
- the temperature control device 105 determines whether it is necessary to heat the support member 102, that is, whether the first temperature data is greater than the second temperature data, and if so, proceeds to step 308, otherwise proceeds to step 307.
- the temperature control device 105 determines whether it is necessary to cool the support member 102, that is, whether the first temperature data is smaller than the second temperature data, and if so, proceeds to step 309, otherwise, at the first temperature data and the second temperature data. If it is equal, the process proceeds to step 312.
- the temperature control device 105 determines whether the third temperature data is greater than the first temperature data, and if so, proceeds to step 309, otherwise, proceeds to step 308.
- the temperature control device 105 controls the heating device 103 to heat the support member 102, and during the heating, the temperature control device 105 performs step 310.
- the temperature control device 105 controls the cooling device 104 to cool the support member 102, and during the cooling process, the temperature control device 105 performs step 310.
- the temperature control device 105 determines whether the baking process of the glass substrate by the baking chamber 101 has ended. If yes, the process proceeds to step 311, otherwise, the process returns to step 304.
- the temperature control device 105 controls the cooling device 104 to cool the support member 102 and take out the glass substrate from the baking chamber 101.
- FIG. 5 is a schematic view showing temperature changes of the support member 102 in the apparatus for baking a glass substrate according to the present invention.
- the first glass substrate is placed on the support member 102 of the baking chamber 101, at which time the room temperature of the baking chamber 101 is 23 degrees Celsius, and the third temperature sensor 203 senses the support member 102 and The temperature of the portion where the glass substrate contacts, the third temperature data is obtained, and the temperature control device 105 controls the heating device 103 or the cooling device 104 according to the third temperature data to heat or cool the support member 102 such that the temperature of the support member 102 is At room temperature of 23 degrees Celsius, specifically, if the temperature value of the support member 102 is higher than 23 degrees Celsius, the temperature control device 105 continues to control the cooling device 104 to cool the support member 102 until the third temperature data is equal to 23 degrees Celsius, if the support member 102 The temperature value is lower than 23 degrees Celsius, and the temperature control device 105 controls the heating device 103 to heat the support
- the baking chamber 101 heats the glass substrate to raise the room temperature from 23 degrees Celsius to 90 degrees Celsius, and then maintains the room temperature at 90 degrees Celsius, during which the second temperature sensor 202 senses the glass substrate.
- the temperature of the second region (the region on the glass substrate that is in contact with the support member 102) obtains second temperature data
- the first temperature sensor 201 faces the first region on the glass substrate (the region on the glass substrate that is not in contact with the support member 102)
- the temperature is sensed to obtain first temperature data
- the temperature control device 105 compares the first temperature data with the second temperature data. If the first temperature data is greater than the second temperature data, the temperature control device 105 controls the heating device 103 to the support member 102.
- Heating is performed to heat the second region on the glass substrate (the region on the glass substrate that is in contact with the support member 102). If the first temperature data is smaller than the second temperature data, the temperature control device 105 controls the cooling device 104 to the support member. 102 is cooled to the second region on the glass substrate (the region on the glass substrate that is in contact with the support member 102) The cooling is performed so that the temperature of each region on the glass substrate is equal.
- the third temperature sensor 203 senses the temperature of the support member 102 to obtain third temperature data, and the temperature of the second region (the region on the glass substrate that is in contact with the support member 102) on the glass substrate and the first In the case where the temperatures of the regions (the regions on the glass substrate that are not in contact with the support member 102) are equal, that is, the first temperature data is equal to the second temperature data, and if the third temperature data is greater than the first temperature data, the temperature control device 105 controls The cooling device 104 cools the support member 102 until the third temperature data is equal to the first temperature data.
- the temperature control device 105 controls the heating device 103 to heat the support member 102 until The third temperature data is equal to the first temperature data.
- the baking chamber 101 cools the glass substrate to reduce the room temperature from 90 degrees Celsius to 23 degrees Celsius.
- the third temperature sensor 203 senses the temperature of the support member 102 to obtain third temperature data, and the temperature control device 105 controls the cooling device 104 to cool the support member 102 according to the third temperature data, so that the support member 102 is in the process.
- the temperature is kept constant in accordance with the temperature of each region of the glass substrate, the glass substrate which has been subjected to the baking treatment is taken out from the baking chamber 101, and the glass substrate which has not been subjected to the baking treatment is sent to the baking chamber 101.
- the operation of the T3 to T4 phase is similar to the operation of the T12 to T2 phase, and the operation of the next glass substrate can be completed by repeating the operation of the period from T1 to T3.
- the present invention uses the temperature sensing device 106 (the first temperature sensor 201, the second temperature sensor 202, and the third temperature sensor 203) to sense the temperature of each region on the glass substrate and the support in contact with the glass substrate.
- the temperature of the member 102 can thus dynamically know the temperature value of each region on the entire glass substrate and the temperature value of the support member 102, thereby obtaining the difference in temperature of each region on the glass substrate, and controlling the heating device according to the difference 103 or the cooling device 104, so that the temperature of the support member 102 in contact with the glass substrate can be dynamically controlled, the temperature of each region on the glass substrate is kept uniform throughout the baking process, and the spots on the glass substrate are effectively prevented, specifically
- the technical solution of the present invention eliminates the needle spot (Pin) which occurs when the conventional support pin supports the glass substrate.
- the support member of the present invention since the support member of the present invention is kept in line with the temperature of the glass substrate in real time, the support member of the present invention does not need to be formed into a needle shape, and conversely, the support member and the glass can be enlarged. Since the area of the substrate contact portion is such that the deformation of the glass substrate due to the conventional support pin support is eliminated, the glass substrate does not cause uneven heating due to deformation, and spots appear.
- the support member 102 is not necessarily limited to a needle shape, so that the contact area of the support member 102 and the glass substrate can be increased, thereby improving the flatness of the glass substrate during baking, and reducing to some extent. The probability of occurrence of spots in the halo region on the glass substrate.
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Abstract
本发明公开了一种对玻璃基板进行烤焙处理的装置，包括：烤焙室，支撑构件，温度传感装置，加热装置，冷却装置，温度控制装置。本发明还公开了一种对玻璃基板进行烤焙处理的方法。本发明能动态地控制与玻璃基板接触的支撑构件的温度，在整个烤焙过程中使玻璃基板的温度与支撑构件的温度保持一致，防止玻璃基板上出现斑点。
Description
本发明涉及玻璃基板烤焙处理的技术领域，特别涉及一种对玻璃基板进行烤焙处理的装置及方法。
传统的玻璃基板的生产制造过程中需要对玻璃基板上的PI（Polyimide，聚酰亚胺）液进行预烤焙（Prebake），烤焙的方式是利用红外线辐射玻璃基板，将玻璃基板加热到90摄氏度，使PI液中的溶剂蒸发，提高PI的浓度。在上述烤焙的过程中，一般会使用支撑针来支撑玻璃基板，但是由于支撑针的材质不是完全绝热的，因此玻璃基板上的接触区域（玻璃基板上与支撑构件接触的区域）与非接触区域（玻璃基板上没有与支撑构件接触的区域）存在导热速率的差别，使得玻璃基板受热不均，造成玻璃基板上出现斑点（Mura），降低了玻璃基板的良率。
为了防止玻璃基板上出现斑点，现有技术上有两种解决方案：一是采用绝热性能更好的材料来作为支撑针的材料，以减少玻璃基板上和支撑针接触的区域与其它区域的温度差；二是通过控制多个支撑针轮流（交替）支撑玻璃基板来减少支撑针与玻璃基板在同一个地方接触的时间，即首先使用一些支撑针支撑玻璃基板，在预定时间过后使用另一些支撑针支撑玻璃基板。
上述这两种解决方案都不能有效地防止玻璃基板上出现斑点，原因是：一、上述两种技术方案不能杜绝玻璃基板上不同区域（玻璃基板上与支撑针接触的区域以及玻璃基板上没有与支撑针接触的区域）之间温差的存在；二、上述两种技术方案中，支撑针支撑玻璃基板会使得玻璃基板与支撑针接触的区域压强过大，从而造成玻璃基板形变，使玻璃基板受热不均，在烤焙的过程中出现斑点；三、上述两种技术方案中，支撑针为针状，不利于保持玻璃基板在烤焙过程中的平坦度，容易造成玻璃基板上出现光环（Halo）区斑点。
因此，有必要提出一种新的技术方案，以解决玻璃基板上出现斑点的技术问题。
本发明的一个目的在于提供一种对玻璃基板进行烤焙处理的装置，其能有效防止玻璃基板上出现斑点。
本发明提供了一种对玻璃基板进行烤焙处理的装置，其包括：一烤焙室，用于对所述玻璃基板进行加热；一支撑构件，用于支撑所述玻璃基板；一温度传感装置，用于感测所述玻璃基板的温度；一加热装置，用于对所述支撑构件进行加热；一冷却装置，用于对所述支撑构件进行冷却；一温度控制装置，用于接收所述温度传感装置发送的温度数据，并根据所述的温度数据控制所述加热装置对所述支撑构件进行加热，或者控制所述冷却装置对所述支撑构件进行冷却；所述温度传感装置包括：一第一温度传感器，用于感测所述玻璃基板的第一温度数据，所述第一温度数据为所述玻璃基板上第一区域的温度；以及一第二温度传感器，用于感测所述玻璃基板的第二温度数据，所述第二温度数据为所述玻璃基板上第二区域的温度；所述温度传感装置与所述温度控制装置电性连接；所述温度控制装置与所述加热装置和所述冷却装置电性连接；所述烤焙室利用红外线加热器对所述玻璃基板进行加热。
在上述对玻璃基板进行烤焙处理的装置中，所述温度控制装置还用于对所述第一温度数据和所述第二温度数据进行比较。
在上述对玻璃基板进行烤焙处理的装置中，在所述第一温度数据大于所述第二温度数据的情况下，所述温度控制装置还用于控制所述加热装置对所述支撑构件进行加热；在所述第一温度数据小于所述第二温度数据的情况下，所述温度控制装置还用于控制所述冷却装置对所述支撑构件进行冷却。
在上述对玻璃基板进行烤焙处理的装置中，其还包括：一第三温度传感器，用于感测所述支撑构件的第三温度数据，所述第三温度数据为所述支撑构件的温度。
在上述对玻璃基板进行烤焙处理的装置中，在烤焙室对玻璃基板进行加热前，所述温度控制装置还用于根据所述第三温度数据控制所述加热装置和所述冷却装置对所述支撑构件的温度进行调节，使得所述第三温度数据与所述烤焙室的室温一致。
本发明的另一个目的在于提供一种对玻璃基板进行烤焙处理的装置，其能有效防止玻璃基板上出现斑点。
为解决上述问题，本发明提供了一种对玻璃基板进行烤焙处理的装置，包括：一烤焙室，用于对所述玻璃基板进行加热；一支撑构件，用于支撑所述玻璃基板；一温度传感装置，用于感测所述玻璃基板的温度；一加热装置，用于对所述支撑构件进行加热；一冷却装置，用于对所述支撑构件进行冷却；一温度控制装置，用于接收所述温度传感装置发送的温度数据，并根据所述的温度数据控制所述加热装置对所述支撑构件进行加热，或者控制所述冷却装置对所述支撑构件进行冷却。
在上述对玻璃基板进行烤焙处理的装置中，所述温度传感装置包括：一第一温度传感器，用于感测所述玻璃基板的第一温度数据，所述第一温度数据为所述玻璃基板上第一区域的温度；以及一第二温度传感器，用于感测所述玻璃基板的第二温度数据，所述第二温度数据为所述玻璃基板上第二区域的温度。
在上述对玻璃基板进行烤焙处理的装置中，所述温度控制装置还用于对所述第一温度数据和所述第二温度数据进行比较。
在上述对玻璃基板进行烤焙处理的装置中，在所述第一温度数据大于所述第二温度数据的情况下，所述温度控制装置还用于控制所述加热装置对所述支撑构件进行加热；在所述第一温度数据小于所述第二温度数据的情况下，所述温度控制装置还用于控制所述冷却装置对所述支撑构件进行冷却。
在上述对玻璃基板进行烤焙处理的装置中，还包括：一第三温度传感器，用于感测所述支撑构件的第三温度数据，所述第三温度数据为所述支撑构件的温度；在烤焙室对玻璃基板进行加热前，所述温度控制装置还用于根据所述第三温度数据控制所述加热装置和所述冷却装置对所述支撑构件的温度进行调节，使得所述第三温度数据与所述烤焙室的室温一致。
本发明的另一个目的在于提供一种对玻璃基板进行烤焙处理的方法，其能有效防止玻璃基板上出现斑点。
为解决上述问题，本发明提供了一种对玻璃基板进行烤焙处理的方法，包括：一烤焙室、一支撑构件、一温度传感装置、一加热装置、一冷却装置和一温度控制装置；所述方法包括以下步骤：（A）所述烤焙室对所述玻璃基板进行加热；（B）所述温度传感装置感测所述玻璃基板的温度；（C）所述温度控制装置接收所述温度传感装置发送的温度数据，并根据所述的温度数据控制所述加热装置对所述支撑构件进行加热，或者控制所述冷却装置对所述支撑构件进行冷却。
在上述对玻璃基板进行烤焙处理的方法中，所述温度传感装置包括：一第一温度传感器和一第二温度传感器；所述步骤（B）还包括以下步骤：（b1）所述第一温度传感器感测所述玻璃基板的第一温度数据，所述第一温度数据为所述玻璃基板上第一区域的温度；以及（b2）所述第二温度传感器感测所述玻璃基板的第二温度数据，所述第二温度数据为所述玻璃基板上第二区域的温度。
在上述对玻璃基板进行烤焙处理的方法中，所述步骤（C）还包括以下步骤：（c1）所述温度控制装置对所述第一温度数据和所述第二温度数据进行比较。
在上述对玻璃基板进行烤焙处理的方法中，所述步骤（C）还包括以下步骤：（c2）在所述第一温度数据大于所述第二温度数据的情况下，所述温度控制装置控制所述加热装置对所述支撑构件进行加热；（c3）在所述第一温度数据小于所述第二温度数据的情况下，所述温度控制装置控制所述冷却装置对所述支撑构件进行冷却。
在上述对玻璃基板进行烤焙处理的方法中，所述温度传感装置还包括：一第三温度传感器；所述步骤（C）还包括以下步骤：（c4）在烤焙室对玻璃基板进行加热前，第三温度传感器感测所述支撑构件的第三温度数据，所述第三温度数据为所述支撑构件的温度，所述温度控制装置根据所述第三温度数据控制所述加热装置和所述冷却装置对所述支撑构件的温度进行调节，使得所述第三温度数据与所述烤焙室的室温一致。
本发明相对现有技术，由于使用温度传感器（第一温度传感器、第二温度传感器和第三温度传感器）来感测玻璃基板的温度以及与玻璃基板接触的支撑构件的温度，因此能够动态地获知整块玻璃基板上各个区域的温度值以及支撑构件的温度值，从而得出玻璃基板的温度与支撑构件的温度的差值，同时根据该差值控制加热装置或者冷却装置，因此能动态地控制与玻璃基板接触的支撑构件的温度，在整个烤焙过程中使玻璃基板的温度与支撑构件的温度保持一致，有效地防止玻璃基板上出现斑点，具体说来，本发明的技术方案杜绝了传统的支撑针支撑玻璃基板时出现的针斑点（Pin
Mura）以及其他斑点的现象，另外，本发明的技术方案还杜绝了玻璃基板由于支撑针支撑造成的形变的现象，因此不会使玻璃基板因为形变造成受热不均，出现斑点。另外，在本发明的技术方案中，支撑构件不必限制为针状，因此可以增大支撑构件与玻璃基板的接触面积，从而提高玻璃基板在烤焙过程中的平坦度，一定程度上降低了玻璃基板上出现光环（Halo）区斑点出现的概率。
图1为本发明中对玻璃基板进行烤焙处理的装置的框图；
图2为图1中温度传感装置的框图；
图3为本发明中对玻璃基板进行烤焙处理的方法的流程图；
图4为图3中温度传感装置感测玻璃基板的温度和支撑构件的温度的步骤的流程图；
图5为本发明的对玻璃基板进行烤焙处理的装置中支撑构件温度变化的示意图。
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。
参考图1，图1为本发明中对玻璃基板进行烤焙处理的装置的原理框图。本发明的对玻璃基板进行烤焙处理的装置包括烤焙室101、支撑构件102、温度控制装置105、温度传感装置106、加热装置103和冷却装置104。温度传感装置106与温度控制装置105电性连接。温度控制装置105与加热装置103和冷却装置104电性连接。烤焙室101用于放置玻璃基板并对玻璃基板进行加热，具体地，烤焙室101利用红外线加热器（图中未示出）对玻璃基板进行加热。支撑构件102置于烤焙室101内，用于支撑玻璃基板，该支撑构件102与玻璃基板接触的部位可以是针状的，也可以是面状的，该支撑构件102使用导热性较好的材料制成，如金属等。温度传感装置106置于烤焙室101内，用于感测玻璃基板的温度和该支撑构件102的温度。温度控制装置105用于接收温度传感装置106感测的玻璃基板的温度数据和支撑构件102的温度数据，并根据这些温度数据控制加热装置103对支撑构件102进行加热，或者控制冷却装置104对支撑构件102进行冷却。加热装置103置于烤焙室101内，具体地，加热装置103置于支撑构件102的内部或者置于支撑构件102的表面，或者与支撑构件102耦合，用于对支撑构件102进行加热。冷却装置104置于烤焙室101内，具体地，冷却装置104置于支撑构件102的内部或者置于支撑构件102的表面，或者与支撑构件102耦合，用于对支撑构件102进行冷却。
参考图2，图2为图1中温度传感装置106的框图。本发明的温度传感装置106包括第一温度传感器201、第二温度传感器202和第三温度传感器203。该第一温度传感器201、第二温度传感器202和第三温度传感器203均与温度控制装置105电性连接。第一温度传感器201设置于玻璃基板的第一区域（玻璃基板上没有与支撑构件102接触的区域）表面附近，具体地，该第一温度传感器201可以为一红外线温度传感器，其设置在玻璃基板的上方或下方，其与玻璃基板保持一定的距离，用于感测玻璃基板的第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度，记为第一温度数据，第一温度传感器201将第一温度数据发送给温度控制装置105。第二温度传感器202设置于玻璃基板的第二区域（玻璃基板上与支撑构件102接触的区域）表面附近，
具体地，该第二温度传感器202也可以为一红外线温度传感器，其设置在玻璃基板的第二区域（玻璃基板上与支撑构件102接触的区域）的上方，其与玻璃基板保持一定的距离，用于感测玻璃基板上第二区域（玻璃基板上与支撑构件102接触的区域）的温度，记为第二温度数据，第二温度传感器202将第二温度数据发送给温度控制装置105。第三温度传感器203设置于支撑构件102的表面或内部，具体地，该第三温度传感器203为一热电偶，当然，也可以是其它类型的温度传感器，如热电阻等，第三温度传感器203设置于支撑构件102上，位于与玻璃基板接触的部位附近，用于感测支撑构件102的温度，记为第三温度数据，第三温度传感器203将第三温度数据发送给温度控制装置105。
本发明的对玻璃基板进行烤焙处理的装置的工作原理是：利用温度传感装置106对玻璃基板的第二区域（玻璃基板上与支撑构件102接触的区域）的温度和第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度进行感测，然后通过比较获知这两个区域的温度的差异，通过控制加热装置103或冷却装置104来调节玻璃基板上的第二区域（玻璃基板上与支撑构件102接触的区域）的温度，使之与第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度相等。具体地，若玻璃基板上的第二区域（玻璃基板上与支撑构件102接触的区域）的温度大于第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度，温度控制装置105控制冷却装置104对支撑构件102进行冷却，直至这两个区域的温度相等为止，若玻璃基板上的第二区域（玻璃基板上与支撑构件102接触的区域）的温度小于第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度，温度控制装置105控制加热装置103对支撑构件102进行加热，直至这两个区域的温度相等为止。从而使玻璃基板上的第二区域（玻璃基板上与支撑构件102接触的区域）的温度与第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度实时地保持一致。当第一温度数据与第二温度数据相等时，若第三温度数据大于第一温度数据，则温度控制装置105控制冷却装置104对支撑构件102进行冷却，直至第三温度数据等于第一温度数据为止，若第三温度数据小于第一温度数据，则温度控制装置105控制加热装置103对支撑构件102进行加热，直至第三温度数据等于第一温度数据为止。
请一并参考图3和图4，图3为本发明中对玻璃基板进行烤焙处理的方法的流程图，图4为图3中温度传感装置105感测玻璃基板的温度和支撑构件102的温度的步骤的流程图。在步骤301，将烤焙室101的室温调节为23摄氏度，将玻璃基板送入烤焙室101。在步骤302，使用支撑构件102对玻璃基板进行支撑。在步骤303，烤焙室101对玻璃基板进行加热。在步骤304，温度传感装置106感测玻璃基板的温度和支撑构件102的温度，并将玻璃基板的温度数据和支撑构件102的温度数据发送给温度控制装置105。具体地，在图4所示步骤401中，第一温度传感器201感测玻璃基板上第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度，得到第一温度数据，并将该第一温度数据发送给温度控制装置105；在步骤402，第二温度传感器202感测玻璃基板上第二区域（玻璃基板上与支撑构件102接触的区域）的温度，得到第二温度数据，并将该第二温度数据发送给温度控制装置105；在步骤403，第三温度传感器203感测支撑构件102的温度，得到第三温度数据，并将该第三温度数据发送给温度控制装置105。在步骤305，温度控制装置105接收玻璃基板的温度数据（第一温度数据和第二温度数据）和支撑构件102的温度数据（第三温度数据）。在步骤306，温度控制装置105判断是否需要对支撑构件102进行加热，即，第一温度数据是否大于第二温度数据，若是，则进入步骤308，否则进入步骤307。在步骤307，温度控制装置105判断是否需要对支撑构件102进行冷却，即，第一温度数据是否小于第二温度数据，若是，则进入步骤309，否则，在第一温度数据与第二温度数据相等的情况下进入步骤312。在步骤312，温度控制装置105判断第三温度数据是否大于第一温度数据，若是，则进入步骤309，否则，进入步骤308。在步骤308，温度控制装置105控制加热装置103对支撑构件102进行加热，在加热的过程中，温度控制装置105执行步骤310。在步骤309，温度控制装置105控制冷却装置104对支撑构件102进行冷却，在冷却的过程中，温度控制装置105执行步骤310。在步骤310，温度控制装置105判断烤焙室101对玻璃基板的烤焙处理是否已经结束，若是，则进入步骤311，否则，返回到步骤304。在步骤311，温度控制装置105控制冷却装置104对支撑构件102进行冷却，并将玻璃基板从烤焙室101中取出。
参考图5，图5为本发明的对玻璃基板进行烤焙处理的装置中支撑构件102温度变化的示意图。在T0至T1这个时间段，将第一片玻璃基板放置于烤焙室101的支撑构件102上，此时烤焙室101的室温为23摄氏度，第三温度传感器203感测支撑构件102上与玻璃基板接触的部位的温度，得到第三温度数据，温度控制装置105根据该第三温度数据控制加热装置103或冷却装置104，以对支撑构件102进行加热或冷却，使得支撑构件102的温度为室温23摄氏度，具体地，如果支撑构件102的温度值高于23摄氏度，则温度控制装置105继续控制冷却装置104对支撑构件102进行冷却，直至第三温度数据等于23摄氏度为止，如果支撑构件102的温度值低于23摄氏度，则温度控制装置105控制加热装置103对支撑构件102进行加热，直至第三温度数据等于23摄氏度为止。在T1至T2这个时间段，烤焙室101对玻璃基板进行加热，使室温从23摄氏度提升至90摄氏度，然后保持室温为90摄氏度，在此过程中，第二温度传感器202感测玻璃基板上第二区域（玻璃基板上与支撑构件102接触的区域）的温度，得到第二温度数据，第一温度传感器201对玻璃基板上第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度进行感测，得到第一温度数据，温度控制装置105比较第一温度数据和第二温度数据，若第一温度数据大于第二温度数据，则温度控制装置105控制加热装置103对支撑构件102进行加热，从而对玻璃基板上的第二区域（玻璃基板上与支撑构件102接触的区域）进行加热，若第一温度数据小于第二温度数据，则温度控制装置105控制冷却装置104对支撑构件102进行冷却，从而对玻璃基板上的第二区域（玻璃基板上与支撑构件102接触的区域）进行冷却，使得玻璃基板上每一个区域的温度均相等。在此过程中，第三温度传感器203对支撑构件102的温度进行感测，得到第三温度数据，在玻璃基板上第二区域（玻璃基板上与支撑构件102接触的区域）的温度与第一区域（玻璃基板上没有与支撑构件102接触的区域）的温度相等的情况下，即，第一温度数据等于第二温度数据，若第三温度数据大于第一温度数据，则温度控制装置105控制冷却装置104对支撑构件102进行冷却，直至第三温度数据等于第一温度数据为止，若第三温度数据小于第一温度数据，则温度控制装置105控制加热装置103对支撑构件102进行加热，直至第三温度数据等于第一温度数据为止。在T2至T3这个时间段，烤焙室101对玻璃基板进行降温，使室温从90摄氏度降至23摄氏度。第三温度传感器203对支撑构件102的温度进行感测，得到第三温度数据，温度控制装置105根据该第三温度数据控制冷却装置104对支撑构件102进行冷却，使得在此过程中支撑构件102的温度与玻璃基板的各个区域的温度保持一致，将已经经过烤焙处理的玻璃基板从烤焙室101中取出，并将未经过烤焙处理的玻璃基板送入烤焙室101。T3至T4阶段的操作与T12至T2阶段的操作类似，重复T1至T3这个时间段的操作即可完成下一片玻璃基板的烤焙处理。
相对现有技术，本发明由于使用温度传感装置106（第一温度传感器201、第二温度传感器202和第三温度传感器203）来感测玻璃基板上各个区域的温度以及与玻璃基板接触的支撑构件102的温度，因此能够动态地获知整块玻璃基板上各个区域的温度值以及支撑构件102的温度值，从而得出玻璃基板上各个区域的温度的差值，同时根据该差值控制加热装置103或者冷却装置104，因此能动态地控制与玻璃基板接触的支撑构件102的温度，在整个烤焙过程中使玻璃基板上各个区域的温度保持一致，有效地防止玻璃基板上出现斑点，具体说来，本发明的技术方案杜绝了传统的支撑针支撑玻璃基板时出现的针斑点（Pin
Mura）以及其他斑点的现象，另外，由于本发明的支撑构件实时地与玻璃基板的温度保持一致，因此，本发明的支撑构件不需要做成针状，相反，可以增大支撑构件上与玻璃基板接触部位的面积，因此本发明的技术方案杜绝了玻璃基板由于传统的支撑针支撑造成的形变的现象，因此不会使玻璃基板因为形变造成受热不均，出现斑点。另外，在本发明的技术方案中，支撑构件102不必限制为针状，因此可以增大支撑构件102与玻璃基板的接触面积，从而提高玻璃基板在烤焙过程中的平坦度，一定程度上降低了玻璃基板上出现光环（Halo）区斑点出现的概率。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。
Claims (15)
- 一种对玻璃基板进行烤焙处理的装置，其包括：一烤焙室，用于对所述玻璃基板进行加热；一支撑构件，用于支撑所述玻璃基板；一温度传感装置，用于感测所述玻璃基板的温度；一加热装置，用于对所述支撑构件进行加热；一冷却装置，用于对所述支撑构件进行冷却；一温度控制装置，用于接收所述温度传感装置发送的温度数据，并根据所述的温度数据控制所述加热装置对所述支撑构件进行加热，或者控制所述冷却装置对所述支撑构件进行冷却；所述温度传感装置包括：一第一温度传感器，用于感测所述玻璃基板的第一温度数据，所述第一温度数据为所述玻璃基板上第一区域的温度；以及一第二温度传感器，用于感测所述玻璃基板的第二温度数据，所述第二温度数据为所述玻璃基板上第二区域的温度；所述温度传感装置与所述温度控制装置电性连接；所述温度控制装置与所述加热装置和所述冷却装置电性连接；所述烤焙室利用红外线加热器对所述玻璃基板进行加热。
- 根据权利要求1所述的对玻璃基板进行烤焙处理的装置，其中所述温度控制装置还用于对所述第一温度数据和所述第二温度数据进行比较。
- 根据权利要求2所述的对玻璃基板进行烤焙处理的装置，其中在所述第一温度数据大于所述第二温度数据的情况下，所述温度控制装置还用于控制所述加热装置对所述支撑构件进行加热；在所述第一温度数据小于所述第二温度数据的情况下，所述温度控制装置还用于控制所述冷却装置对所述支撑构件进行冷却。
- 根据权利要求3所述的对玻璃基板进行烤焙处理的装置，其还包括：一第三温度传感器，用于感测所述支撑构件的第三温度数据，所述第三温度数据为所述支撑构件的温度。
- 根据权利要求4所述的对玻璃基板进行烤焙处理的装置，其中在烤焙室对玻璃基板进行加热前，所述温度控制装置还用于根据所述第三温度数据控制所述加热装置和所述冷却装置对所述支撑构件的温度进行调节，使得所述第三温度数据与所述烤焙室的室温一致。
- 一种对玻璃基板进行烤焙处理的装置，其包括：一烤焙室，用于对所述玻璃基板进行加热；一支撑构件，用于支撑所述玻璃基板；一温度传感装置，用于感测所述玻璃基板的温度；一加热装置，用于对所述支撑构件进行加热；一冷却装置，用于对所述支撑构件进行冷却；一温度控制装置，用于接收所述温度传感装置发送的温度数据，并根据所述的温度数据控制所述加热装置对所述支撑构件进行加热，或者控制所述冷却装置对所述支撑构件进行冷却。
- 根据权利要求6所述的对玻璃基板进行烤焙处理的装置，其中所述温度传感装置包括：一第一温度传感器，用于感测所述玻璃基板的第一温度数据，所述第一温度数据为所述玻璃基板上第一区域的温度；以及一第二温度传感器，用于感测所述玻璃基板的第二温度数据，所述第二温度数据为所述玻璃基板上第二区域的温度。
- 根据权利要求7所述的对玻璃基板进行烤焙处理的装置，其中所述温度控制装置还用于对所述第一温度数据和所述第二温度数据进行比较。
- 根据权利要求8所述的对玻璃基板进行烤焙处理的装置，其中在所述第一温度数据大于所述第二温度数据的情况下，所述温度控制装置还用于控制所述加热装置对所述支撑构件进行加热；在所述第一温度数据小于所述第二温度数据的情况下，所述温度控制装置还用于控制所述冷却装置对所述支撑构件进行冷却。
- 根据权利要求9所述的对玻璃基板进行烤焙处理的装置，其还包括：一第三温度传感器，用于感测所述支撑构件的第三温度数据，所述第三温度数据为所述支撑构件的温度；在烤焙室对玻璃基板进行加热前，所述温度控制装置还用于根据所述第三温度数据控制所述加热装置和所述冷却装置对所述支撑构件的温度进行调节，使得所述第三温度数据与所述烤焙室的室温一致。
- 一种对玻璃基板进行烤焙处理的方法，其包括：一烤焙室、一支撑构件、一温度传感装置、一加热装置、一冷却装置和一温度控制装置；所述方法包括以下步骤：（A）所述烤焙室对所述玻璃基板进行加热；（B）所述温度传感装置感测所述玻璃基板的温度；（C）所述温度控制装置接收所述温度传感装置发送的温度数据，并根据所述的温度数据控制所述加热装置对所述支撑构件进行加热，或者控制所述冷却装置对所述支撑构件进行冷却。
- 根据权利要求11所述的对玻璃基板进行烤焙处理的方法，其中所述温度传感装置包括：一第一温度传感器和一第二温度传感器；所述步骤（B）还包括以下步骤：（b1）所述第一温度传感器感测所述玻璃基板的第一温度数据，所述第一温度数据为所述玻璃基板上第一区域的温度；以及（b2）所述第二温度传感器感测所述玻璃基板的第二温度数据，所述第二温度数据为所述玻璃基板上第二区域的温度。
- 根据权利要求12所述的对玻璃基板进行烤焙处理的方法，其中所述步骤（C）还包括以下步骤：（c1）所述温度控制装置对所述第一温度数据和所述第二温度数据进行比较。
- 根据权利要求13所述的对玻璃基板进行烤焙处理的方法，其中所述步骤（C）还包括以下步骤：（c2）在所述第一温度数据大于所述第二温度数据的情况下，所述温度控制装置控制所述加热装置对所述支撑构件进行加热；（c3）在所述第一温度数据小于所述第二温度数据的情况下，所述温度控制装置控制所述冷却装置对所述支撑构件进行冷却。
- 根据权利要求14所述的对玻璃基板进行烤焙处理的方法，其中所述温度传感装置还包括：一第三温度传感器；所述步骤（C）还包括以下步骤：（c4）在烤焙室对玻璃基板进行加热前，第三温度传感器感测所述支撑构件的第三温度数据，所述第三温度数据为所述支撑构件的温度，所述温度控制装置根据所述第三温度数据控制所述加热装置和所述冷却装置对所述支撑构件的温度进行调节，使得所述第三温度数据与所述烤焙室的室温一致。
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| US10287581B2 (en) | 2011-04-04 | 2019-05-14 | Aadigen, Llc | Cell penetrating peptides for intracellular delivery of molecules |
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| CN103309090A (zh) * | 2013-06-20 | 2013-09-18 | 深圳市华星光电技术有限公司 | 用于紫外线硬化配向中支撑基板的装置及其方法 |
| KR101689058B1 (ko) * | 2014-03-07 | 2016-12-22 | 동우 화인켐 주식회사 | 착색 감광성 수지 조성물 및 이를 이용하는 컬러 필터 |
| CN107357141B (zh) * | 2017-07-28 | 2020-11-10 | 武汉华星光电技术有限公司 | 一种基板烘烤装置及方法 |
| CN108803260A (zh) * | 2018-06-01 | 2018-11-13 | 上海华力集成电路制造有限公司 | 曝光后烘焙装置及晶圆线宽优化方法 |
| CN110040974B (zh) * | 2019-04-29 | 2022-03-08 | 深圳市华星光电半导体显示技术有限公司 | 一种冷却装置 |
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| CN101231941A (zh) * | 2007-01-15 | 2008-07-30 | 应用材料股份有限公司 | 热处理腔中的晶圆支架的温度测量和控制 |
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| US6353209B1 (en) * | 1999-03-04 | 2002-03-05 | Board Of Trustees Of The Leland Stanford Junior University | Temperature processing module |
| JP2006302980A (ja) * | 2005-04-18 | 2006-11-02 | Dainippon Screen Mfg Co Ltd | 減圧乾燥装置 |
| JP5008147B2 (ja) * | 2008-06-05 | 2012-08-22 | 東京エレクトロン株式会社 | 減圧乾燥装置 |
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| KR20040020419A (ko) * | 2002-08-30 | 2004-03-09 | 삼성전자주식회사 | 베이크 장치 |
| CN1745332A (zh) * | 2003-01-30 | 2006-03-08 | 日本写真印刷株式会社 | 加热装置 |
| CN1973356A (zh) * | 2004-06-30 | 2007-05-30 | 英特尔公司 | 与晶片发射率无关的有效晶片温度控制的利用 |
| CN101231941A (zh) * | 2007-01-15 | 2008-07-30 | 应用材料股份有限公司 | 热处理腔中的晶圆支架的温度测量和控制 |
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| US10287581B2 (en) | 2011-04-04 | 2019-05-14 | Aadigen, Llc | Cell penetrating peptides for intracellular delivery of molecules |
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