WO2013189095A1 - 液晶基板切割装置及液晶基板切割方法 - Google Patents

液晶基板切割装置及液晶基板切割方法 Download PDF

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Publication number
WO2013189095A1
WO2013189095A1 PCT/CN2012/077681 CN2012077681W WO2013189095A1 WO 2013189095 A1 WO2013189095 A1 WO 2013189095A1 CN 2012077681 W CN2012077681 W CN 2012077681W WO 2013189095 A1 WO2013189095 A1 WO 2013189095A1
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WO
WIPO (PCT)
Prior art keywords
liquid crystal
cutting
crystal substrate
cutting line
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2012/077681
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English (en)
French (fr)
Inventor
柳珍
刘明
丁涛
朴孝政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/575,929 priority Critical patent/US8893598B2/en
Publication of WO2013189095A1 publication Critical patent/WO2013189095A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
    • Y10T83/041—By heating or cooling
    • Y10T83/0414—At localized area [e.g., line of separation]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/283—With means to control or modify temperature of apparatus or work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/525—Operation controlled by detector means responsive to work
    • Y10T83/541—Actuation of tool controlled in response to work-sensing means

Definitions

  • the present invention relates to a liquid crystal substrate cutting device and a liquid crystal substrate cutting method, and more particularly to a liquid crystal substrate cutting device and a liquid crystal substrate cutting method for use in the field of flat panel display manufacturing.
  • the ODF process includes a sealant coating step and a sealant curing step of forming a plurality of plastic frames.
  • the liquid crystal substrate dividing process generally requires cutting a large-sized liquid crystal substrate including a plurality of cured plastic frames into a plurality of small-sized liquid crystal substrates along a predetermined cutting line by using a cutting device.
  • the number of small-sized liquid crystal substrates obtained by the division is consistent with the number of plastic frames of the large-sized liquid crystal substrate.
  • the distance between adjacent curing frames is small.
  • a cutter wheel cutting module is generally used.
  • the cutter cutting module can be used to segment the large-sized liquid crystal substrate to ensure high cutting precision.
  • the glue is thicker or the injection speed is faster in the frame coating step, the width of the frame may reach or exceed the cutting line. It is affected by the coating method in the coating process of the sealant, for example, a continuous coating method is adopted between a plurality of adjacent plastic frames; or, the amount of glue at the corner position in the coating process of the sealant is difficult to control. And the phenomenon that adjacent curing frames are stuck to each other; the cutting line will pass through the blocking zone.
  • the cutter wheel cutting module touches the frame sealant of the above-mentioned plastic frame in the process of cutting the liquid crystal substrate along the cutting line, it is easy to cause an abnormality such as cutting off the cutting line or a crack of the liquid crystal substrate, thereby causing the product to be scrapped.
  • the technical problem to be solved by the present invention is to provide a liquid crystal substrate cutting device and a liquid crystal substrate cutting method for reducing product rejection rate.
  • a technical solution adopted by the present invention is: a liquid crystal substrate cutting device for cutting a liquid crystal substrate along a cutting line, the liquid crystal substrate cutting device comprising a heating member, a cutting member, an optical detecting member and a control system, and heating The heating temperature of the piece is 120 ⁇ 150 degrees; the optical detecting piece detects whether the cutting line is covered by the sealing frame along the cutting line, and the control system further controls the opening and closing of the heating piece according to the detection result of the optical detecting part; the heating piece is heated along the cutting line
  • the liquid crystal substrate softens the frame seal rubber covered on the cutting line, and the cutting member further cuts the liquid crystal substrate along the cutting line.
  • the heating device when the optical detecting component detects that the cutting line is covered by the sealant, the heating device is turned on by the control system to heat the sealant along the cutting line, and when the optical detecting component detects that the cutting line is not covered by the sealant, The control system turns off the heating element.
  • the liquid crystal substrate cutting device further comprises a base, the base moves along the cutting line, the optical detecting member, the heating member and the cutting member are both fixed to the base, and the heating member is located between the optical detecting member and the cutting member.
  • the heating member is any one or a combination of a laser heating element, an electric heating element, an infrared heating element, and a magnetic heating element.
  • a liquid crystal substrate cutting device for cutting a liquid crystal substrate along a cutting line
  • the liquid crystal substrate cutting device includes a heating member and a cutting member, and the heating member heats the liquid crystal along the cutting line.
  • the substrate softens the sealant covering the cutting line, and the cutting member further cuts the liquid crystal substrate along the cutting line.
  • the liquid crystal substrate cutting device further comprises an optical detecting member and a control system, and the optical detecting member detects whether the cutting line is covered by the sealant along the cutting line, and the control system further controls the opening and closing of the heating member according to the detection result of the optical detecting member.
  • the heating device when the optical detecting component detects that the cutting line is covered by the sealant, the heating device is turned on by the control system to heat the sealant along the cutting line, and when the optical detecting component detects that the cutting line is not covered by the sealant, The control system turns off the heating element.
  • the liquid crystal substrate cutting device further comprises a base, the base moves along the cutting line, the optical detecting member, the heating member and the cutting member are both fixed to the base, and the heating member is located between the optical detecting member and the cutting member.
  • the heating temperature of the heating member is 120 to 150 degrees.
  • the heating member is any one or a combination of a laser heating element, an electric heating element, an infrared heating element, and a magnetic heating element.
  • a liquid crystal substrate cutting method for cutting a liquid crystal substrate along a cutting line comprises the steps of: heating a liquid crystal substrate along a cutting line by using a heating member; The frame seal rubber covered on the cutting line is softened; the liquid crystal substrate is further cut along the cutting line by the cutting member.
  • the method further comprises: detecting, by the optical detecting member, along the cutting line whether the cutting line is covered by the sealant and passing the detection system according to the detection As a result, the opening and closing of the heating member is controlled.
  • the step of detecting whether the cutting line is covered by the sealant along the cutting line and controlling the opening and closing of the heating member according to the detection result by the control system comprises: the optical detecting component detecting that the cutting line is covered by the sealant, The heating element is turned on by the control system, and when the optical detecting member detects that the cutting line is not covered by the sealant, the heating element is turned off by the control system.
  • the heating temperature of the heating member is 120 to 150 degrees.
  • the liquid crystal substrate cutting device of the present invention is provided with heating elements for heating the liquid crystal substrate along the cutting line, so that the sealing frame rubber covered by the cutting line is softened, and the liquid crystal substrate can be accurately cut when the cutting member cuts the liquid crystal substrate.
  • a liquid crystal substrate is cracked due to an abnormal amount of the feed, which greatly reduces the scrap rate of the product.
  • Figure 1 is a bottom plan view of a liquid crystal substrate cutting device of the present invention
  • Figure 2 is a front elevational view of the liquid crystal substrate cutting device of Figure 1;
  • FIG. 3 is a schematic view of a liquid crystal substrate coated with a plurality of plastic frames
  • FIG. 4 is a flow chart showing a first embodiment of a method for cutting a liquid crystal substrate according to the present invention
  • Figure 5 is a flow chart showing a second embodiment of the liquid crystal substrate cutting method of the present invention.
  • a plurality of cured plastic frames 11 formed by the sealant 12 are disposed on the liquid crystal substrate 10, and the cut lines X and Y are respectively located between the adjacent columns and the adjacent rows of the plastic frames 11.
  • the liquid crystal substrate cutting device 100 includes a heating member 20 and a cutting member 30.
  • the heating member 20 heats the liquid crystal substrate 10 along the cutting line X or Y; the cutting member 30 further cuts the liquid crystal substrate 10 along the cutting line X or Y. If the cutting line X or Y is covered with the sealant 12, the heating of the heating member 20 softens the sealant 12 covered by the cut line X or Y, and the adhesive force of the softened sealant 12 is greatly reduced, which is favorable for the liquid crystal substrate. 10 for a smooth cut.
  • the liquid crystal substrate cutting device 100 further includes an optical detecting member 40 and a control system 50.
  • the optical detecting member 40 detects whether the cutting line X or Y is covered by the sealant 12 along the cutting line X or Y, and the control system 50 further controls the opening and closing of the heating member 20 based on the detection result of the optical detecting member 40.
  • the heating member 20 when the optical detecting member 40 detects that the cutting line X or Y is covered by the sealant 12, the heating member 20 is turned on by the control system 50, and the heating member 20 further heats the cutting line X of the portion covered by the sealant 12 or Y.
  • the heating member 20 is turned off by the control system 50, and the heating member 20 does not heat the cutting line X or Y which is not covered by the sealant 12 .
  • the heating member 20 is specifically turned on or off to ensure the smooth cutting of the liquid crystal substrate 10, and the energy consumption can be maximized.
  • the liquid crystal substrate cutting device 100 further includes a base 60.
  • the base 60 moves along the cutting line X or Y.
  • the optical detecting member 40, the heating member 20, and the cutting member 30 are all fixed to the base 60, and the heating member 20 is located at the center of the optical detecting member 40 and the cutting member 30.
  • the optical detecting member 40, the heating member 20, and the cutting member 30 are fixed by the base 60, the three moving speeds are synchronized.
  • the centers of the detecting portions (not shown) of the optical detecting member 40, the heating portions (not shown) of the heating member 20, and the cutting portions (not shown) of the cutting member 30 are located on the same straight line.
  • the base 60 moves along the cutting line X or Y
  • the centers of the detecting portion, the heating portion, and the cutting portion are sequentially moved along the cutting line X or Y, thereby detecting, heating, and cutting the cutting line X or Y.
  • the heating element 20 has a heating temperature range of 120 to 150 degrees.
  • the heating method of the heating member 20 is not limited in the present invention, and all the ways of heating and softening the sealant 12 are within the scope of the present invention.
  • the heating element 20 can be any one or combination of a laser heating element, an electric heating element, an infrared heating element, a magnetic heating element.
  • the present invention further provides a method of cutting a liquid crystal substrate for cutting a liquid crystal substrate along a cutting line X or Y.
  • a first embodiment of a method for cutting a liquid crystal substrate of the present invention includes the following steps:
  • the heating member 20 moves along the cutting line X or Y and heats the liquid crystal substrate 10.
  • the sealant 12 is heated by the heating member 20 and softened, which is advantageous for the cutting step of the liquid crystal substrate 10.
  • the heating element 20 has a heating temperature range of 120 to 150 degrees.
  • the liquid crystal substrate 10 is further cut along the cutting line X or Y by the cutting member 30.
  • the cutting member 30 cuts the liquid crystal substrate 10 along the heated cutting line X or Y.
  • the sealant 12 covered on the cutting line X or Y has been softened by heating, and the cutting step is secured.
  • a second embodiment of the method for cutting a liquid crystal substrate of the present invention includes the following steps: S31, detecting whether the cutting line X or Y is covered by the sealant 12 along the cutting line X or Y by the optical detecting member 40 and controlling by The system 50 controls the opening and closing of the heating member 20 based on the detection result.
  • the heating member 20 when the optical detecting member 40 detects that the cutting line X or Y is covered by the sealant 12, the heating member 20 is turned on by the control system 50, and the heating member 20 further heats the cutting line X of the portion covered by the sealant 12 or Y.
  • the heating member 20 is turned off by the control system 50, and the heating member 20 does not heat the cutting line X or Y which is not covered by the sealant 12 .
  • the liquid crystal substrate 10 is further cut along the cutting line X or Y by the cutting member 30.
  • the invention has the beneficial effects that the liquid crystal substrate cutting device 100 of the present invention is provided with the heating member 20 for heating the liquid crystal substrate 10 along the cutting line X or Y so that the sealing material 12 covered on the cutting line X or Y is 12 compared with the prior art.
  • the cutting member 30 cuts the liquid crystal substrate 10
  • the liquid crystal substrate 10 can be accurately cut without causing a crack phenomenon of the liquid crystal substrate 10 due to an abnormal amount of the feed amount, thereby greatly reducing the scrap rate of the product.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Liquid Crystal (AREA)

Description

液晶基板切割装置及液晶基板切割方法
【技术领域】
本发明涉及一种液晶基板切割装置及液晶基板切割方法，特别涉及用于平板显示器制造领域的液晶基板切割装置及液晶基板切割方法。
【背景技术】
在平板显示装置的制造过程中，包括ODF(one drop filling，液晶滴注制程)工序和紧接ODF工序之后的液晶基板分割工序。其中，ODF工序包括形成多个胶框的封框胶涂布步骤和封框胶固化步骤。液晶基板分割工序通常需要利用切割装置将包括多个固化的胶框的较大尺寸的液晶基板沿预设的切割线切割成多个小尺寸的液晶基板。一般情况下，分割得到的小尺寸液晶基板的数目与大尺寸液晶基板的胶框数目一致。为了节约成本，提高液晶基板的利用率，相邻的固化胶框之间的距离较小。
现有的液晶基板分割工序中的切割装置一般采用刀轮切割模组。采用刀轮切割模组对大尺寸的液晶基板进行分割过程中，能保证较高的切割精度。然而，若封框胶涂布步骤中胶口较粗或者注射速度较快，胶框的宽度较大可能会到达或超过切割线。受封框胶涂布步骤中涂布方式影响，例如，多个相邻的胶框之间采用一笔连涂的方式；或者，因封框胶涂布步骤中的转角位置处胶量不易控制，而出现相邻的固化胶框互相粘连在一起的现象；切割线将会经过该粘连区。当刀轮切割模组沿切割线切割液晶基板的过程中碰触到上述胶框的封框胶时，极易发生例如偏离切割线等切割异常或者液晶基板产生裂片等现象从而导致产品报废。
【发明内容】
本发明主要解决的技术问题是提供一种降低产品报废率的液晶基板切割装置及液晶基板切割方法。
为解决上述技术问题，本发明采用的一个技术方案是：一种液晶基板切割装置，用于沿切割线切割液晶基板，液晶基板切割装置包括加热件、切割件、光学检测件和控制系统，加热件的加热温度为120~150度；光学检测件沿切割线检测切割线是否被封框胶覆盖，控制系统进一步根据光学检测件的检测结果控制加热件的开启和关闭；加热件沿切割线加热液晶基板使切割线上覆盖的封框胶软化，切割件进一步沿切割线切割液晶基板。
其中，当光学检测件检测到切割线被封框胶覆盖，则由控制系统开启加热件，以沿切割线加热封框胶，当光学检测件检测到切割线未被封框胶覆盖，则由控制系统关闭加热件。
其中，液晶基板切割装置进一步包括底座，底座沿切割线移动，光学检测件、加热件和切割件均固定至底座，且加热件位于光学检测件和切割件之间。
其中，加热件是激光加热元件、电加热元件、红外加热元件以及磁加热元件中的任意一种或组合。
为解决上述技术问题，本发明采用的另一个技术方案是：一种液晶基板切割装置，用于沿切割线切割液晶基板，液晶基板切割装置包括加热件和切割件，加热件沿切割线加热液晶基板使切割线上覆盖的封框胶软化，切割件进一步沿切割线切割液晶基板。
其中，液晶基板切割装置进一步包括光学检测件和控制系统，光学检测件沿切割线检测切割线是否被封框胶覆盖，控制系统进一步根据光学检测件的检测结果控制加热件的开启和关闭。
其中，当光学检测件检测到切割线被封框胶覆盖，则由控制系统开启加热件，以沿切割线加热封框胶，当光学检测件检测到切割线未被封框胶覆盖，则由控制系统关闭加热件。
其中，液晶基板切割装置进一步包括底座，底座沿切割线移动，光学检测件、加热件和切割件均固定至底座，且加热件位于光学检测件和切割件之间。
其中，加热件的加热温度为120~150度。
其中，加热件是激光加热元件、电加热元件、红外加热元件以及磁加热元件中的任意一种或组合。
为解决上述技术问题，本发明采用的另一个技术方案是：一种液晶基板切割方法，用于沿切割线切割液晶基板，液晶基板切割方法包括以下步骤：利用加热件沿切割线加热液晶基板使切割线上覆盖的封框胶软化；利用切割件沿切割线进一步切割液晶基板。
其中，在利用加热件沿切割线加热液晶基板使切割线上覆盖的封框胶软化的步骤之前还包括：利用光学检测件沿切割线检测切割线是否被封框胶覆盖并通过控制系统根据检测结果控制加热件的开启和关闭。
其中，利用光学检测件沿切割线检测切割线是否被封框胶覆盖并通过控制系统根据检测结果控制加热件的开启和关闭的步骤包括：光学检测件检测到切割线被封框胶覆盖，则由控制系统开启加热件，当光学检测件检测到切割线未被封框胶覆盖，则由控制系统关闭加热件。
其中，加热件的加热温度为120~150度。
本发明的有益效果是： 与现有技术相比，本发明液晶基板切割装置设置沿切割线加热液晶基板的加热件，使切割线上覆盖的封框胶软化，进而切割件切割液晶基板时能准确切割液晶基板且不会发生因进刀量异常而使液晶基板产生裂片现象，从而大大降低产品的报废率。
【附图说明】
图1是本发明液晶基板切割装置的仰视图；
图2是图1所示液晶基板切割装置的主视图；
图3是涂布了多个胶框的液晶基板的示意图；
图4是本发明液晶基板切割方法第一实施例的流程图；
图5是本发明液晶基板切割方法第二实施例的流程图。
【具体实施方式】
下面结合附图和实施例对本发明进行详细说明。
请参照图1至图3， 一种液晶基板切割装置100，用于沿切割线X、Y切割液晶基板10。液晶基板10上设置多个用封框胶12形成的固化的胶框11，切割线X、Y分别位于相邻列和相邻排的胶框11之间。液晶基板切割装置100包括加热件20和切割件30。
加热件20沿切割线X或Y加热液晶基板10；切割件30进一步沿切割线X或Y切割液晶基板10。若切割线X或Y上覆盖有封框胶12，加热件20的加热使切割线X或Y上覆盖的封框胶12软化，软化后的封框胶12黏着力大大降低，有利于液晶基板10进行顺利切割。
本实施例中，液晶基板切割装置100进一步包括光学检测件40和控制系统50。光学检测件40沿切割线X或Y检测切割线X或Y是否被封框胶12覆盖，控制系统50进一步根据光学检测件40的检测结果控制加热件20的开启和关闭。
具体来说，当光学检测件40检测到切割线X或Y被封框胶12覆盖，则由控制系统50开启加热件20，加热件20进一步加热被封框胶12覆盖部分的切割线X或Y。当光学检测件40检测到切割线X或Y未被封框胶12覆盖，则由控制系统50关闭加热件20，加热件20不对未被封框胶12覆盖部分的切割线X或Y进行加热。加热件20有针对性地开启或关闭，保障液晶基板10顺利切割的同时，能最大限度地节约能耗。
本实施例中，液晶基板切割装置100进一步包括底座60。底座60沿切割线X或Y移动。光学检测件40、加热件20和切割件30三者均固定至底座60，且加热件20位于光学检测件40和切割件30的中心。
因光学检测件40、加热件20和切割件30三者通过底座60固定，故三者移动速度同步。实际应用中，光学检测件40的检测部（未标示）、加热件20的加热部（未标示）和切割件30的切割部（未标示）三者的中心位于同一直线上。当底座60沿切割线X或Y移动时，检测部、加热部和切割部三者的中心依次沿切割线X或Y移动，从而实现对切割线X或Y检测、加热和切割。
经多次试验证明，封框胶12被加热至120~150度时会变得柔软且黏性大大降低，且液晶基板10在该温度范围内不会产生形变或其它品质异变。因此，优选地，加热件20的加热温度区间为120~150度。
本发明对加热件20的加热方式不进行限定，所有能加热软化封框胶12的途径均在本发明的保护范围中。例如，加热件20可以是激光加热元件、电加热元件、红外加热元件、磁性加热元件中的任意一种或其组合。
本发明进一步提供一种液晶基板的切割方法，用于沿切割线X或Y切割液晶基板。请参照图4，本发明液晶基板的切割方法的第一实施例包括以下步骤：
S21，利用加热件20沿切割线X或Y加热液晶基板10使切割线X或Y上覆盖的封框胶12软化。
具体来说，本步骤中，加热件20沿切割线X或Y移动并加热液晶基板10。当液晶基板10的切割线X或Y上覆盖有封框胶12，则封框胶12被加热件20加热后软化，有利于液晶基板10切割步骤的进行。
经多次试验证明，封框胶12被加热至120~150度时会变得柔软且黏性大大降低，且液晶基板10在该温度范围内不会产生形变或其它品质异变。因此，优选地，加热件20的加热温度区间为120~150度。
S22，利用切割件30沿切割线X或Y进一步切割液晶基板10。
本步骤中，切割件30沿加热后的切割线X或Y切割液晶基板10。切割线X或Y上覆盖的封框胶12已经被加热软化，切割步骤得到了保障。
请参照图5，本发明液晶基板的切割方法的第二实施例包括以下步骤：S31，利用光学检测件40沿切割线X或Y检测切割线X或Y是否被封框胶12覆盖并通过控制系统50根据检测结果控制加热件20的开启和关闭。
S32，利用加热件20沿切割线X或Y加热液晶基板10使切割线X或Y上覆盖的封框胶12软化。
具体来说，当光学检测件40检测到切割线X或Y被封框胶12覆盖，则由控制系统50开启加热件20，加热件20进一步加热被封框胶12覆盖部分的切割线X或Y。当光学检测件40检测到切割线X或Y未被封框胶12覆盖，则由控制系统50关闭加热件20，加热件20不对未被封框胶12覆盖部分的切割线X或Y进行加热。
S33，利用切割件30沿切割线X或Y进一步切割液晶基板10。
本发明的有益效果是：与现有技术相比，本发明液晶基板切割装置100设置沿切割线X或Y加热液晶基板10的加热件20，使切割线X或Y上覆盖的封框胶12软化，进而切割件30切割液晶基板10时能准确切割液晶基板10且不会发生因进刀量异常而使液晶基板10产生裂片现象，从而大大降低产品的报废率。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (14)

  1. 一种液晶基板切割装置，用于沿切割线切割液晶基板，其特征在于，所述液晶基板切割装置包括加热件、切割件、光学检测件和控制系统，所述加热件的加热温度为120~150度；所述光学检测件沿所述切割线检测所述切割线是否被所述封框胶覆盖，所述控制系统进一步根据所述光学检测件的检测结果控制所述加热件的开启和关闭；所述加热件沿所述切割线加热所述液晶基板使所述切割线上覆盖的封框胶软化，所述切割件进一步沿所述切割线切割所述液晶基板。
  2. 根据权利要求1所述的液晶基板切割装置，其特征在于，当所述光学检测件检测到所述切割线被所述封框胶覆盖，则由所述控制系统开启所述加热件，以沿所述切割线加热所述封框胶，当所述光学检测件检测到所述切割线未被所述封框胶覆盖，则由所述控制系统关闭所述加热件。
  3. 根据权利要求1所述的液晶基板切割装置，其特征在于，所述液晶基板切割装置进一步包括底座，所述底座沿所述切割线移动，所述光学检测件、所述加热件和所述切割件均固定至所述底座，且所述加热件位于所述光学检测件和所述切割件之间。
  4. 根据权利要求1所述的液晶基板切割装置，其特征在于，所述加热件是激光加热元件、电加热元件、红外加热元件以及磁加热元件中的任意一种或组合。
  5. 一种液晶基板切割装置，用于沿切割线切割液晶基板，其特征在于，所述液晶基板切割装置包括加热件和切割件，所述加热件沿所述切割线加热所述液晶基板使所述切割线上覆盖的封框胶软化，所述切割件进一步沿所述切割线切割所述液晶基板。
  6. 根据权利要求5所述的液晶基板切割装置，其特征在于，所述液晶基板切割装置进一步包括光学检测件和控制系统，所述光学检测件沿所述切割线检测所述切割线是否被所述封框胶覆盖，所述控制系统进一步根据所述光学检测件的检测结果控制所述加热件的开启和关闭。
  7. 根据权利要求6所述的液晶基板切割装置，其特征在于，当所述光学检测件检测到所述切割线被所述封框胶覆盖，则由所述控制系统开启所述加热件，以沿所述切割线加热所述封框胶，当所述光学检测件检测到所述切割线未被所述封框胶覆盖，则由所述控制系统关闭所述加热件。
  8. 根据权利要求6所述的液晶基板切割装置，其特征在于，所述液晶基板切割装置进一步包括底座，所述底座沿所述切割线移动，所述光学检测件、所述加热件和所述切割件均固定至所述底座，且所述加热件位于所述光学检测件和所述切割件之间。
  9. 根据权利要求5所述的液晶基板切割装置，其特征在于，所述加热件的加热温度为120~150度。
  10. 根据权利要求5所述的液晶基板切割装置，其特征在于，所述加热件是激光加热元件、电加热元件、红外加热元件以及磁加热元件中的任意一种或组合。
  11. 一种液晶基板切割方法，用于沿切割线切割液晶基板，其特征在于，所述液晶基板切割方法包括以下步骤：
    利用加热件沿所述切割线加热所述液晶基板使所述切割线上覆盖的封框胶软化；
    利用切割件沿所述切割线进一步切割所述液晶基板。
  12. 根据权利要求11所述的液晶基板切割方法，其特征在于，在所述利用加热件沿所述切割线加热所述液晶基板使所述切割线上覆盖的封框胶软化的步骤之前还包括：
    利用光学检测件沿切割线检测所述切割线是否被所述封框胶覆盖并通过控制系统根据检测结果控制所述加热件的开启和关闭。
  13. 根据权利要求12所述的液晶基板切割方法，其特征在于，所述利用光学检测件沿切割线检测所述切割线是否被所述封框胶覆盖并通过控制系统根据检测结果控制所述加热件的开启和关闭的步骤包括：
    所述光学检测件检测到所述切割线被所述封框胶覆盖，则由所述控制系统开启所述加热件，当所述光学检测件检测到所述切割线未被所述封框胶覆盖，则由所述控制系统关闭所述加热件。
  14. 根据权利要求11所述的液晶基板切割方法，其特征在于，所述加热件的加热温度为120~150度。
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