WO2013149519A1 - 一种集成nfc天线的薄膜晶体管显示器 - Google Patents

一种集成nfc天线的薄膜晶体管显示器 Download PDF

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Publication number
WO2013149519A1
WO2013149519A1 PCT/CN2013/071448 CN2013071448W WO2013149519A1 WO 2013149519 A1 WO2013149519 A1 WO 2013149519A1 CN 2013071448 W CN2013071448 W CN 2013071448W WO 2013149519 A1 WO2013149519 A1 WO 2013149519A1
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WIPO (PCT)
Prior art keywords
nfc antenna
film transistor
thin film
integrated
display
Prior art date
Application number
PCT/CN2013/071448
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English (en)
French (fr)
Inventor
李建华
陈学彬
Original Assignee
信利半导体有限公司
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Publication date
Application filed by 信利半导体有限公司 filed Critical 信利半导体有限公司
Priority to US14/389,239 priority Critical patent/US9543637B2/en
Publication of WO2013149519A1 publication Critical patent/WO2013149519A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/3433—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using light modulating elements actuated by an electric field and being other than liquid crystal devices and electrochromic devices
    • G09G3/344—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using light modulating elements actuated by an electric field and being other than liquid crystal devices and electrochromic devices based on particles moving in a fluid or in a gas, e.g. electrophoretic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2266—Supports; Mounting means by structural association with other equipment or articles used with computer equipment disposed inside the computer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
    • H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
    • H04B5/24—Inductive coupling
    • H04B5/26—Inductive coupling using coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/60—Circuit arrangements for operating LEDs comprising organic material, e.g. for operating organic light-emitting diodes [OLED] or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2370/00—Aspects of data communication
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements

Definitions

  • the present invention relates to the field of near field communication technologies, and in particular, to a thin film transistor display with an integrated NFC antenna.
  • NFC Near Field Communication
  • the antenna of the existing NFC product is mainly used on one side of the battery or on the inside of the outer casing.
  • the method is generally on a PCB (Printed Circuit Board) or FPC (Flexible Printed Circuit).
  • the wire is made of a metal wire, and then the PCB or FPC containing the wire is attached to the battery or the casing.
  • the main disadvantages are: The battery and the casing are often repeatedly disassembled, which makes the wiring of the NFC antenna easy to wear or the problem of misalignment, which eventually causes the antenna signal to deteriorate and affect the function of the NFC product.
  • the antenna of the NFC product is generally located inside the outer casing of the electronic product. If the metal material is selected as the outer casing, the propagation of the NFC signal is affected, and the outer casing of the electronic product is limited in selecting a solid metal material.
  • TFT-LCD thin film transistor liquid crystal display
  • LCD liquid crystal display
  • the TFT-LCD panel can be seen as a layer of liquid crystal sandwiched between two glass substrates.
  • the glass substrate has a color filter on it, and the lower glass has a transistor mounted thereon.
  • a current passes through the transistor, an electric field changes, causing the liquid crystal molecules to deflect, thereby changing the polarity of the light, and then using a polarizer to determine the brightness of the pixel (Pixel).
  • each pixel is composed of three colors of red, blue and green. These red, blue and green color pixels form an image on the panel.
  • the wiring portion is easily worn or misaligned, thereby causing a problem that the antenna signal quality is deteriorated. And it limits the choice of the outer casing of the electronic product.
  • the process of producing the thin film transistor display with the ability to integrate the NFC antenna, it is necessary to design a new thin film transistor display integrated with the NFC antenna to solve the above problem.
  • the present invention aims to provide a thin film transistor display with an integrated NFC antenna, which can prevent the antenna wiring from being worn or misaligned, and is beneficial to ensure the quality of the antenna signal.
  • an electronic product equipped with the TFT-LCD described above transmits signals from the front surface of the display, and is not limited by the NFC antenna when selecting the casing selection.
  • the technical solution provided by the present invention is: a thin film transistor display integrated with an NFC antenna, the NFC antenna being disposed on a display screen of the thin film transistor display, wherein the NFC interface is equipped with an output line of the display screen, And connected to the control panel of the display.
  • the display screen comprises an upper substrate, a color filter layer, a transparent conductive layer, a liquid crystal layer, a TFT array and a lower substrate, and the NFC antenna is connected to the TFT array.
  • the NFC antenna is disposed on an inner side surface of the upper substrate and located in a black matrix region of the filter layer, and an insulating protective layer is disposed between the NFC antenna and the transparent conductive layer.
  • the NFC antenna is disposed on an outer side surface of the upper substrate, and an insulating protective layer is disposed on an outer side of the NFC antenna.
  • the NFC antenna is disposed on an inner side surface of the lower substrate and located in a surrounding area i of the TFT array.
  • the NFC antenna is disposed on an outer side surface of the lower substrate.
  • the NFC antenna is connected to the leads of the TFT array by a conductive material and directed onto the output line of the display screen or directly onto the output line of the display screen.
  • the NFC antenna is a multi-turn wire made of a conductive material.
  • the NFC antenna uses silver, copper, aluminum low resistivity traces.
  • the multi-twisted wire is matched to the outer contour of the product to form an annular winding.
  • the multi-twisted wire is wound in a rectangular or circular shape.
  • the thin film transistor display integrated with the NFC antenna of the present invention directly uses the NFC antenna on the thin film transistor display. Since the NFC interface is equipped with the output line of the display screen, it is connected to the control board, and is fixed after installation. It is not often disassembled, which avoids problems such as poor signal quality and poor reception of the NFC antenna in the prior art due to interface wear and misalignment.
  • a solution is provided to facilitate reception of NFC signals from the display surface of the display or when it is necessary to receive NFC signals from the display surface of the display.
  • the electronic product equipped with the TFT-LCD described above transmits signals from the front side of the display, and is not limited by the NFC antenna when selecting the housing material.
  • FIG. 1 is a front elevational view showing a mounting position of an NFC antenna on a TFT display screen in Embodiment 1 of a thin film transistor display integrated with an NFC antenna according to the present invention
  • FIG. 2 is a side view showing the mounting structure of the NFC antenna of the first embodiment of the thin film transistor display integrated with the NFC antenna of the present invention
  • FIG. 3 is a side view of the NFC antenna mounting structure of the second embodiment of the thin film transistor display integrated with the NFC antenna of the present invention
  • FIG. 4 is a side view of the NFC antenna mounting structure of the third embodiment of the thin film transistor display integrated with the NFC antenna of the present invention
  • Fig. 5 is a side view showing the mounting structure of the NFC antenna of the fourth embodiment of the thin film transistor display integrated with the NFC antenna of the present invention.
  • the basic idea of the present invention is that an NFC antenna is disposed on the display screen of the thin film transistor display, wherein the NFC interface carries the output line of the display screen and is connected to the control board of the display screen.
  • the display screen S of the thin film transistor display integrated with the NFC antenna is viewed from the top of the human eye from the top of the human eye, and includes an upper substrate 1, a color filter layer 2, an ITO (indium tin oxide) layer (or other transparent conductive layer).
  • An NFC antenna 3 is arranged under the area.
  • the specific location of the NFC antenna 3 is as shown in FIG. 2.
  • the NFC antenna 3 is disposed on the inner side of the upper substrate 1 and located under the black matrix region (BM layer) of the filter layer 2, and is in the NFC antenna 3 and An insulating protective layer 4 is disposed between the ITO layers 6.
  • the NFC antenna 3 is connected to the leads of the TFT array 8 via conductive silver paste 5 or other conductive material and directed onto the output line of the display screen or directly onto the output line of the display screen.
  • the NFC antenna 3 is made of a metal (such as silver, copper, aluminum) or other low-resistivity material (such as carbon) to make a multi-turn ⁇ , and through the conductive 4 ⁇ 5 and TFT P train 8 connection.
  • the multi-twisted turn is rectangularly wound, or circularly wound, or other annular wrap that matches the contour of the display product; wherein a layer is placed on the inner side of the multi-twisted display Transparent ferrite material to enhance magnetic field induction. This type of routing can be done using existing equipment without the need for additional investment.
  • an antenna matching circuit (not shown) electrically connected to the NFC antenna 3 is provided.
  • the antenna matching circuit includes a charging and discharging module and a resistance blocking module, and the charging and discharging module is connected to the resistance module, wherein: the charging The discharge module is a capacitor connected in parallel or in series; the resistance module is a parallel or series resistor.
  • the charging The discharge module is a capacitor connected in parallel or in series; the resistance module is a parallel or series resistor.
  • the NFC antenna mounting structure of the second embodiment of the thin film transistor display integrated with the NFC antenna of the present invention is shown.
  • the NFC antenna 3 is disposed on the outer surface of the upper substrate 1, and an insulating protective layer 4 is disposed outside the NFC antenna 3.
  • the NFC antenna 3 is made of a metal (silver, copper, aluminum) trace, and is connected to the TFT by a conductive silver paste 5 or other conductive material.
  • the leads of array 8 are routed to the output lines of the display or directly to the output lines of the display.
  • Other structures are the same as those in the first embodiment, and will not be described again.
  • the NFC antenna mounting structure of the third embodiment of the thin film transistor display integrated with the NFC antenna of the present invention is shown.
  • the NFC antenna 3 is disposed on an inner side surface of the lower substrate 9 and is located in a surrounding area of the TFT array 8.
  • Other structures are the same as those of the first embodiment and the second embodiment, and will not be described again.
  • the NFC antenna mounting structure of the fourth embodiment of the thin film transistor display integrated with the NFC antenna of the present invention is shown.
  • the NFC antenna 3 is disposed on the outer side surface of the lower substrate 9 and is connected to the lead of the TFT array 8 through a conductive silver paste 5 or other conductive material and guided to the output line of the display screen, or directly guided to the On the output line of the display screen, an insulating protective layer 4 is disposed on the outer side of the NFC antenna 3.
  • Other structures are the same as those in the first embodiment, and will not be described again.
  • the above embodiment of the present invention directly uses the NFC antenna 3 on the thin film transistor display, and the NFC interface is equipped with an output line of the display screen, which is connected to the control board (not shown), and is fixed after installation, and is not frequently disassembled.
  • the problems of the NFC antenna in the prior art due to interface wear and misalignment caused by misalignment are avoided.
  • a solution is provided to facilitate reception of NFC signals from the display surface of the display, or when it is necessary to receive NFC signals from the display surface of the display.
  • the electronic product equipped with the TFT-LCD described above transmits signals from the front side of the display, and is not limited by the NFC antenna when selecting the housing.
  • the thin-film transistor display integrated with the NFC antenna of the present invention combines the functions of the display screen and the NFC antenna into one, and is more competitive in the market.

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Abstract

一种集成NFC天线（3）的薄膜晶体管显示器，该NFC天线（3）设置于该薄膜晶体管显示器的显示屏（S）上，其中NFC接口搭载该显示屏（S）的输出线路，并连接到该显示屏（S）的控制主板上。该薄膜晶体管显示器将显示屏（S）和NFC天线（3）功能合二为一，将NFC天线（3）直接做在薄膜晶体管显示器上，可避免NFC天线接口磨损，对位不准引起的信号质量变差、接收失灵问题，同时也有利于天线接收和发送信号，保证通信的畅通。

Description

一种集成 NFC天线的薄膜晶体管显示器
本申请要求于 2012 年 04 月 06 日提交中国专利局、 申请号为 201220145136.8、 名称为 "一种显示屏 "和于 2012年 7月 5 日提交中国专利局、 申请号为 201210232617.7、 发明名称为 "一种集成 NFC天线的薄膜晶体管显 示器"的中国专利申请的优先权， 其全部内容通过引用结合在本申请中。
技术领域
本发明涉及近场通信技术领域， 尤其涉及一种集成 NFC天线的薄膜晶体 管显示器。
背景技术
NFC ( Near Field Communication , 近场通信 )技术是今后电子产品的一种 必备技术， 市场庞大。 现有 NFC产品的天线主要是做在电池的某一面， 或者 贴在外壳的里面， 采用的方式一般为在 PCB ( Printed Circuit Board, 印刷电路 板)或 FPC ( Flexible Printed Circuit, 软性线路板 )上以金属走线做成线圏， 然 后将此含有线圏的 PCB板或 FPC贴在电池或者外壳上。 其缺点主要有： 电池 与外壳经常反复拆装， 这样就使得 NFC天线的接线处容易磨损或者出现对位 不准的问题， 最终造成天线信号变差，影响 NFC产品功能的使用。 另夕卜， NFC 产品的天线一般位于电子产品的外壳里面，如果选择金属材料做外壳，会影响 NFC信号的传播， 限制了电子产品外壳在选材时， 选择坚固的金属材料。
例如，很多装配有 NFC天线和薄膜晶体管（ Thin film transistor liquid crystal display, 常筒称为 TFT-LCD )的电子产品就存在上述问题。 其中 TFT-LCD使用 薄膜晶体管技术改善影像品质， 是一种主动式矩阵 LCD, 被应用在电视、 平面 显示器及投影机上， TFT-LCD面板可视为两片玻璃基板中间夹着一层液晶，上 层的玻璃基板上有彩色滤光片 （ Color Filter ) 、 而下层的玻璃则有晶体管镶嵌 于其上。 当电流通过晶体管时产生电场变化， 造成液晶分子偏转， 藉以改变光 线的偏极性， 再利用偏光片决定画素（Pixel )的明暗状态。 此外， 上层玻璃因 与彩色滤光片贴合， 形成每个画素（Pixel )各包含红蓝绿三颜色， 这些发出红 蓝绿色彩的画素便构成了面板上的影像画面。 鉴于装配有 NFC天线和薄膜晶体管显示器的电子产品的 NFC天线设置方 式不尽合理， 其接线处容易磨损或者对位不准， 由此造成天线信号质量变差的 问题。并且限制了电子产品的外壳选择范围，而生产薄膜晶体管显示器过程中， 具备集成 NFC天线的能力，有必要设计一种新的集成了 NFC天线的薄膜晶体 管显示器， 以解决上述问题。
发明内容
有鉴于此，本发明目的在于提供一种集成 NFC天线的薄膜晶体管显示器， 可防止天线接线处磨损或者对位不准， 有利于保证天线信号的质量。 另外， 装 配了上述的 TFT-LCD的电子产品， 从显示器的正面传递信号， 在选择外壳选 材时， 不受 NFC天线的限制。
为解决以上技术问题， 本发明提供的技术方案是： 一种集成 NFC天线的 薄膜晶体管显示器， 该 NFC天线设置于该薄膜晶体管显示器的显示屏上， 其 中的 NFC接口搭载该显示屏的输出线路， 并连接到该显示屏的控制主板上。
较优地， 该显示屏依次包括上基板、 彩色滤光层、 透明导电层、 液晶层、 TFT阵列及下基板， 该 NFC天线连接至该 TFT阵列。
较优地， 该 NFC天线设置于该上基板的内侧面上且位于该滤光层的黑色 矩阵区域， 并在该 NFC天线与该透明导电层之间布设绝缘保护层。
较优地， 该 NFC天线设置于该上基板的外侧面上， 并在该 NFC天线的外 侧布设绝缘保护层。
较优地， 该 NFC天线设置于该下基板的内侧面上， 并位于该 TFT阵列的 四周区 i或。
较优地， 该 NFC天线设置于该下基板的外侧面上。
较优地， 该 NFC天线通过导电材料连接至该 TFT阵列的引线上且引导到 该显示屏的输出线路上， 或直接引导到该显示屏的输出线路上。
较优地， 该 NFC天线为以导电材料走线方式制成的多匝线圏。
较优地， 该 NFC天线采用银、 铜、 铝类低电阻率走线。
较优地， 该多匝线圏呈与产品外轮廓线相匹配环形绕制。 较优地， 该多匝线圏呈矩形绕制或圓形绕制。
较优地， 在该多匝线圏偏显示器内部的一面覆盖一层透明的铁氧体材料。 与现有技术相比，本发明集成 NFC天线的薄膜晶体管显示器将 NFC天线 直接做在薄膜晶体管显示器上， 由于 NFC接口搭载显示屏的输出线路， 其连 接到控制主板上， 安装后是固定不动的， 不经常拆装，避免了现有技术中 NFC 天线由于接口磨损及对位不准引起的信号质量变差、 接收失灵等问题。 另夕卜， 为方便从显示器显示面接收 NFC信号，或必须从显示器显示面接收 NFC信号 时提供解决方案。 此外， 装配了上述的 TFT-LCD的电子产品， 从显示器的正 面传递信号， 在选择外壳选材时， 不受 NFC天线的限制。
附图说明
图 1是本发明集成 NFC天线的薄膜晶体管显示器实施例一中 NFC天线在 TFT显示屏上的安装位置正视图；
图 2是本发明集成 NFC天线的薄膜晶体管显示器实施例一的 NFC天线安 装结构侧视图；
图 3是本发明集成 NFC天线的薄膜晶体管显示器实施例二的 NFC天线安 装结构侧视图；
图 4是本发明集成 NFC天线的薄膜晶体管显示器实施例三的 NFC天线安 装结构侧视图；
图 5是本发明集成 NFC天线的薄膜晶体管显示器实施例四的 NFC天线安 装结构侧视图。
图 1~图 5中， 有关附图标记为：
1、 上基板； 2、 彩色滤光层； 3、 NFC天线； 4、 绝缘保护层； 5、 导电银 浆； 6、 ITO层； 7、 液晶层、 8、 TFT阵列； 9、 下基板。
具体实施方式
本发明的基本构思是， NFC天线设置于该薄膜晶体管显示器的显示屏上， 其中的 NFC接口搭载该显示屏的输出线路，并连接到该显示屏的控制主板上。
为了使本领域的技术人员更好地理解本发明的技术方案，下面结合附图和 具体实施例对本发明作进一步的详细说明。
实施例一
同时参见图 1、 图 2, 表示本发明集成 NFC天线的薄膜晶体管显示器实施 例一的 NFC天线安装结构。 该集成 NFC天线的薄膜晶体管显示器的显示屏 S自 人眼方向自上往下看， 依次包括上基板 1、 彩色滤光层 2、 ITO (氧化铟锡） 层（或其它的透明导电层） 6、 液晶层 7、 TFTP车歹I 8及下基板 9, 其中该彩色 滤光层 2的黑色矩阵（BM, Black Matrix, 目的是防止色纯度的低下， 多使用 低反射的多层铬薄膜制作） 区域下布设 NFC天线 3。
其中 NFC天线 3的具体位置如图 2所示， 该 NFC天线 3设置于上基板 1 的内侧面上且位于该滤光层 2的黑色矩阵区域（BM层） 下， 并在该 NFC天 线 3与该 ITO层 6之间布设绝缘保护层 4。 该 NFC天线 3通过导电银浆 5或 其它导电材料连接至该 TFT阵列 8的引线上且引导到该显示屏的输出线路上， 或直接引导到该显示屏的输出线路上。 同时， 该 NFC天线 3以金属（如银、 铜、 铝）或其它低电阻率材料（如碳）走线的方式做成多匝线圏， 并通过导电 4艮浆 5与 TFT P车列 8连接。 该多匝线圏呈矩形绕制， 或圓形绕制， 或其它与 显示器产品外形轮廓相匹配的环形绕制；其中在该多匝线圏偏显示器内部的一 面上加有（覆盖）一层透明的铁氧体材料， 以增强磁场感应强度。 这种走线方 式， 采用现有设备上就可以做到， 不用新增投资。
此外， 设有与该 NFC 天线 3 电连接的天线匹配电路 (图未示出）， 该天 线匹配电路包括充放电模块和抗阻模块， 该充放电模块与该抗阻模块相连， 其 中：该充放电模块为并联或串联的电容；该抗阻模块为并联或串联电阻。由此， 通过设置天线匹配电路， 实现 NFC天线 3的功率匹配。
实施例二
同时参见图 1、 图 3,表示本发明集成 NFC天线的薄膜晶体管显示器实施 例二的 NFC天线安装结构。 该 NFC天线 3设置于上基板 1的外侧面上， 并在 该 NFC天线 3的外侧布设绝缘保护层 4。 该 NFC天线 3以金属 (银、铜、 铝） 走线的方式做成多匝线圏， 并通过导电银浆 5或其它导电材料连接至该 TFT 阵列 8的引线上且引导到该显示屏的输出线路上，或直接引导到该显示屏的输 出线路上。 其它结构与实施例一相同， 不再赘述。
实施例三
同时参见图 1、 图 4,表示本发明集成 NFC天线的薄膜晶体管显示器实施 例三的 NFC天线安装结构。 该 NFC天线 3设置于该下基板 9的内侧面上， 并 位于该 TFT阵列 8的四周区域。 其它结构与前述实施例一、 二相同， 不再赘 述。
实施例四
同时参见图 1、 图 5,表示本发明集成 NFC天线的薄膜晶体管显示器实施 例四的 NFC天线安装结构。 该 NFC天线 3设置于该下基板 9的外侧面上， 并 通过导电银浆 5或其它导电材料连接至该 TFT阵列 8的引线上且引导到该显 示屏的输出线路上， 或直接引导到该显示屏的输出线路上； 该 NFC天线 3的 外侧布设绝缘保护层 4。 其它结构与实施例一相同， 不再赘述。
本发明的以上实施例将 NFC天线 3直接做在薄膜晶体管显示器上，其 NFC 接口搭载显示屏的输出线路， 连接到控制主板（图未示出 )上， 安装后固定不 动， 不经常拆装， 避免了现有技术中 NFC天线由于接口磨损及对位不准引起 的信号接收失灵等问题。 另外， 为方便从显示器显示面接收 NFC信号， 或必 须从显示器显示面接收 NFC 信号时提供解决方案。 此外， 装配了上述的 TFT-LCD 的电子产品， 从显示器的正面传递信号， 在选择外壳选材时， 不受 NFC天线的限制。
本发明这种集成了 NFC天线的薄膜晶体管显示器，将显示屏和 NFC天线 功能合二为一， 在市场上更有竟争力。
以上仅是本发明的优选实施方式，应当指出的是， 上述优选实施方式不应 视为对本发明的限制， 本发明的保护范围应当以权利要求所限定的范围为准。 对于本技术领域的普通技术人员来说，在不脱离本发明的精神和范围内，还可 以做出若干改进和润饰， 这些改进和润饰也应视为本发明的保护范围。

Claims

权 利 要 求
I、 一种集成 NFC天线的薄膜晶体管显示器， 其特征在于， 该 NFC天线 设置于该薄膜晶体管显示器的显示屏上， 其中的 NFC接口搭载该显示屏的输 出线路， 并连接到该显示屏的控制主板上。
2、如权利要求 1所述的集成 NFC天线的薄膜晶体管显示器，其特征在于， 该显示屏依次包括上基板、 彩色滤光层、 透明导电层、 液晶层、 TFT阵列及下 基板， 该 NFC天线连接至该 TFT阵列。
3、如权利要求 2所述的集成 NFC天线的薄膜晶体管显示器，其特征在于， 该 NFC天线设置于该上基板的内侧面上且位于该滤光层的四周的黑色遮光区 域， 并在该 NFC天线与该透明导电层之间布设绝缘保护层。
4、如权利要求 2所述的集成 NFC天线的薄膜晶体管显示器，其特征在于， 该 NFC天线设置于该上基板的外侧面上，并在该 NFC天线的外侧布设绝缘保 护层。
5、如权利要求 2所述的集成 NFC天线的薄膜晶体管显示器，其特征在于， 该 NFC天线设置于该下基板的内侧面上， 并位于该 TFT阵列的四周区域。
6、如权利要求 2所述的集成 NFC天线的薄膜晶体管显示器，其特征在于， 该 NFC天线设置于该下基板的外侧面上。
7、如权利要求 2~6任一项所述的集成 NFC天线的薄膜晶体管显示器， 其 特征在于， 该 NFC天线通过导电材料连接至该 TFT阵列的引线上且引导到该 显示屏的输出线路上， 或直接引导到该显示屏的输出线路上。
8、 如权利要求 1所述的集成 NFC天线的薄膜晶体管显示器， 该 NFC天 线为以导电材料走线方式制成的多匝线圏。
9、如权利要求 8所述的集成 NFC天线的薄膜晶体管显示器，其特征在于， 该多匝线圏呈与产品外轮廓线相匹配环形绕制。
10、 如权利要求 8~9任一项所述的集成 NFC天线的薄膜晶体管显示器， 其 特征在于， 在该多匝线圏偏显示器内部的一面覆盖一层透明的铁氧体材料。
II、 如权利要求 8~9任一项所述的集成 NFC天线的薄膜晶体管显示器， 其 特征在于， 该多匝线圏呈矩形绕制或圓形绕制。
12、 如权利要求 8~9任一项所述的集成 NFC天线的薄膜晶体管显示器, 其特征在于， 该 NFC天线采用银、 铜、 铝类低电阻率走线。
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