WO2013135080A1 - 监测溶液加工能力的方法及装置、刻蚀系统 - Google Patents

监测溶液加工能力的方法及装置、刻蚀系统 Download PDF

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Publication number
WO2013135080A1
WO2013135080A1 PCT/CN2012/086224 CN2012086224W WO2013135080A1 WO 2013135080 A1 WO2013135080 A1 WO 2013135080A1 CN 2012086224 W CN2012086224 W CN 2012086224W WO 2013135080 A1 WO2013135080 A1 WO 2013135080A1
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Prior art keywords
monitoring
solution
workpiece
transmitted light
intensity
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PCT/CN2012/086224
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English (en)
French (fr)
Inventor
王灿
郭炜
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京东方科技集团股份有限公司
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Publication of WO2013135080A1 publication Critical patent/WO2013135080A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59—Transmissivity

Definitions

  • Embodiments of the present invention relate to a method and apparatus for monitoring solution processing capabilities, and an etching system. Background technique
  • the development and etching processes are commonly used in the production of thin film transistor liquid crystal displays (TFT-LCDs).
  • the developing process is a process in which an exposed photoresist pattern is placed in a developing solution to etch a metal film in accordance with the developed photoresist pattern to obtain a desired metal pattern.
  • the developer/etching solution required for the development/etching process is usually recycled, and the concentration of the developing/etching liquid may decrease with the production process or with the production. It may be contaminated, which will result in a decrease in the processing ability of the developer/etching solution. If it is not replaced in time or a new developer/etching solution is added, it is easy to cause insufficient development/etching, that is, underdeveloping/under etching occurs. Therefore, in the actual production process, the developer/etching solution needs to be monitored in real time, and a new developer/etching solution is replaced or added according to the monitoring result to ensure the development/etching effect.
  • the monitoring methods currently used are calculated by monitoring certain physical or chemical properties of the developer/etching solution, such as conductivity. If the monitored value is outside the range that satisfies the development/etching effect, replace the developer/etching solution.
  • the above monitoring method cannot truly and effectively evaluate the processing ability of the developing solution/etching liquid, that is, it is impossible to truly and effectively analyze whether the processing ability of the developing solution/etching liquid can satisfy the requirements of the process, thereby easily causing a developing effect/ Poor etching effect or waste of developer/etching solution.
  • the embodiments of the present invention provide a method, device and system for monitoring the processing ability of a solution according to the above-mentioned defects existing in the prior art, which can monitor whether the processing capability of the solution satisfies the process requirements in real time and accurately, thereby improving the processing of the solution. The effect, while avoiding the waste of the solution.
  • One aspect of the invention provides a method of monitoring the processing ability of a solution for use in a solution Monitoring the processing capability of the solution in a flowing water production line for etching a workpiece, comprising the steps of: illuminating the workpiece to be processed with light at a set position of the flowing water production line of the workpiece to be etched; The intensity of the transmitted light transmitted through the workpiece to be processed at a fixed position; and whether the processing capability of the solution satisfies the process requirements based on the intensity of the transmitted light transmitted through the workpiece.
  • the manner of evaluating whether the processing capability of the solution satisfies the process requirements may include: the intensity of the transmitted light includes a lower limit monitoring intensity of the transmitted light, a lower limit for monitoring the processing capability of the solution; and comparing the transmitted light a lower limit monitoring intensity and a lower limit of the intensity of the preset standard transmitted light. If the lower limit monitoring intensity of the transmitted light is less than or equal to a lower limit of the intensity of the predetermined standard transmitted light, it indicates that the processing capability of the solution is biased Low; or, according to the lower limit monitoring intensity of the transmitted light, the lower limit of the transmitted light is obtained, and the lower limit of the transmitted light is compared with the lower limit of the transmittance of the preset standard transmitted light.
  • the lower limit monitoring transmittance of the transmitted light is less than or equal to the lower limit of the transmittance of the predetermined standard transmitted light, indicating that the processing ability of the solution is low.
  • the manner of evaluating whether the processing capability of the solution satisfies the process requirements may include: the intensity of the transmitted light further includes an upper limit monitoring intensity of the transmitted light, an upper limit for monitoring the processing ability of the solution; comparing the transmission The upper limit of the intensity of the light and the upper limit of the intensity of the preset standard transmitted light, if the upper limit monitoring intensity of the transmitted light is greater than the upper limit of the intensity of the predetermined standard transmitted light, indicating that the processing capability of the solution is high Or, according to the upper limit monitoring intensity of the transmitted light, obtaining an upper limit monitoring transmittance of light, comparing an upper limit of the transmitted light with an upper limit of a transmittance of a predetermined standard transmitted light, if the transmission The upper limit monitoring transmittance of light is greater than the upper limit of the transmittance of the predetermined standard transmitted light, indicating that the processing ability of the solution is high.
  • Another aspect of the present invention also provides a monitoring device for monitoring the processing ability of a solution for monitoring whether the processing capability of the solution satisfies the process requirements, including an optical monitoring unit and an analysis unit, on a flow production line in which the solution corrodes the workpiece to be processed. .
  • An optical monitoring unit configured to obtain a intensity of transmitted light transmitted through the workpiece to be processed at a set position of the flowing water production line of the solution to etch the workpiece, and obtain the obtained workpiece through the workpiece
  • the intensity signal of the transmitted light is sent to the analysis unit;
  • the analyzing unit calculates whether the processing capability of the solution satisfies the process requirement according to the received intensity signal of the transmitted light transmitted through the workpiece to be processed by the optical monitoring unit.
  • the optical monitoring unit may include a light emitting device and a light receiving device, wherein the light emitting device is disposed opposite to the light receiving device on both sides of the workpiece, the light a transmitting device for emitting light toward a surface of the workpiece to be processed; the light receiving device for collecting a transmitted light transmitted by the light emitting device and transmitted through the workpiece to be processed An intensity signal of the transmitted light of the workpiece to be processed is sent to the analysis unit.
  • the analyzing unit may include: a signal receiving subunit for receiving an intensity signal of the transmitted light transmitted from the processed workpiece obtained from the optical monitoring unit; and a calculating subunit A method for evaluating whether a processing capability of the solution satisfies a process requirement based on an intensity signal of transmitted light from the signal receiving subunit; a signal emission subunit for emitting a corresponding solution processing according to a result of the calculation of the calculation subunit A signal with low or high power.
  • Still another aspect of the present invention provides an etching system including an etching liquid tank, a monitoring device, and a conveying system for processing a workpiece, the etching liquid tank for storing an etching liquid, and the monitoring device for monitoring the Whether the processing capability of the etching liquid satisfies the process requirements, the transmission system is used to transport the workpiece to be processed during the etching process, and the monitoring device uses the above-mentioned monitoring device for monitoring the processing capability of the solution.
  • the etching system may further include a supply device for replacing or adding an etching liquid according to a monitoring result of the monitoring device.
  • the etching system may include two of said monitoring devices, the two or more monitoring devices being disposed at different locations on the flow production line of the workpiece being machined, respectively for monitoring the lower and upper limits of the solution processing capability.
  • the etching system can be used in a development process or an etching process.
  • FIG. 1 is a structural block diagram of a monitoring device for monitoring a processing capability of a solution provided by the invention
  • FIG. 2 is a schematic structural view of an etching system provided by the present invention.
  • FIG. 3 is a schematic structural view of another etching system provided by the present invention. detailed description
  • the method for monitoring the processing ability of the solution provided by the embodiment includes the following steps.
  • step slO the workpiece to be processed is irradiated with light at a set position of the flow production line where the solution is corroded by the workpiece.
  • the solution used can be selected according to the specific processing requirements. For example, if a developing process is performed, the solution selects a developing solution; if an etching process is performed, the solution selects an etching solution.
  • the workpiece to be processed may be a substrate for processing a TFT-LCD, or a substrate for use in fabricating other products such as a circuit board. These workpieces can be transparent or translucent to facilitate inspection; for different machined workpieces, the evaluation criteria taken during subsequent inspection steps are adjusted accordingly.
  • step s20 the intensity of the transmitted light transmitted through the workpiece to be processed at the set position is obtained.
  • Step s30 evaluating whether the processing capability of the solution satisfies the process requirement based on the intensity of the transmitted light transmitted through the workpiece.
  • the method for evaluating whether the processing capability of the solution satisfies the process requirement may be the intensity of the transmitted light, or the transmittance of the transmitted light may be calculated first by the intensity of the transmitted light and the intensity of the incident light (transmitted light). The intensity / intensity of the incident light), then the transmittance of the transmitted light.
  • the step of assessing whether the processing capability of the solution satisfies the process requirements may include monitoring a lower limit of the processing capability of the solution, that is, evaluating the lower limit monitoring intensity of the transmitted light.
  • the lower limit monitoring intensity of the transmitted light when comparing the lower limit monitoring intensity of the transmitted light with the lower limit of the intensity of the preset standard transmitted light, if the lower limit monitoring intensity of the transmitted light is less than or equal to the lower limit of the intensity of the preset standard transmitted light, This indicates that the processing ability of the solution is low.
  • the reason for the low solution processing capacity may be that the concentration of the solution is low or the solution has failed.
  • the lower limit of the transmitted light is obtained, and the lower limit of the transmitted light is compared with the lower limit of the transmittance of the predetermined standard transmitted light.
  • the lower limit monitoring transmittance of the transmitted light is less than or equal to the lower limit of the transmittance of the predetermined standard transmitted light, indicating that the solution processing ability is low.
  • the step of evaluating whether the processing capability of the solution satisfies the process requirements may further comprise monitoring an upper limit of the processing capability of the solution, i.e., evaluating the upper limit monitoring intensity of the transmitted light.
  • the processing capability of the solution is high.
  • the upper limit of the transmitted light is obtained according to the upper limit of the transmitted light to monitor the transmittance, and the upper limit of the transmitted light is compared with the upper limit of the transmittance of the predetermined standard transmitted light, if the upper limit of the transmitted light is transmitted through The rate is greater than the upper limit of the transmittance of the predetermined standard transmitted light, indicating that the processing ability of the solution is high.
  • the transmittance of the transmitted light of the solution constantly changes due to the continuous consumption of the active component of the solution, the formation of by-products, etc., that is, the transmittance and the degree of corrosion of the transmitted light. Corresponding. Therefore, the processing state of the solution to the workpiece to be processed can be easily obtained by the intensity ⁇ of the transmitted light transmitted through the workpiece. If it is known at a certain position on the production line that the workpiece being machined does not reach the corresponding ideal processing condition, it indicates that the processing capability of the solution cannot meet the processing requirements.
  • the failure to achieve the desired processing conditions is mainly due to the low processing capacity of the corrosive solution, resulting in a lag in processing conditions, ie less corrosion and insufficient extent, so new solutions need to be replaced or added. If it is known that the workpiece being processed is too early to reach a certain processing condition at a certain position on the flowing water production line, it indicates that the solution processing capability is too high, and excessive etching may occur at the end of the production line.
  • the method for monitoring the processing ability of the solution provided by the embodiment, which is added by real-time monitoring
  • the intensity of the transmitted light of the workpiece is used to evaluate whether the processing capability of the solution satisfies the process requirements, and it can intuitively and accurately reflect the actual force of the workpiece being processed. According to the working condition, the processing capability of the solution can be accurately judged, and the processing ability of the solution can be adjusted according to the judgment result, thereby avoiding waste of the solution due to erroneous judgment.
  • Embodiments of the present invention also provide a monitoring device for monitoring the processing capability of a solution for monitoring whether the processing capability of the solution satisfies the process requirements at a set position of the flowing water production line for etching the workpiece to be processed.
  • FIG. 1 is a structural block diagram of a monitoring device for monitoring a solution processing capability provided by the invention.
  • the monitoring device for monitoring solution processing capability of this embodiment includes an optical monitoring unit 1 and an analysis unit 2.
  • the optical monitoring unit 1 is configured to obtain the intensity of the transmitted light transmitted through the workpiece to be processed at a set position of the solution flow surface of the workpiece to be processed, and obtain the intensity of the transmitted light transmitted through the workpiece to be processed.
  • the signal is sent to the analysis unit 2.
  • the optical monitoring unit 1 may include a light emitting device 11 and a light receiving device 12 which are disposed opposite to the light receiving device 12 on both sides of the workpiece to be processed.
  • the light emitting device 11 is for emitting light toward the workpiece to be processed.
  • the light-emitting device 11 can use a light source such as an incandescent lamp, an LED lamp, or a laser emitter.
  • the light receiving means 12 is for collecting the transmitted light which is emitted from the light emitting device 11 and transmitted through the workpiece to be processed, and transmits a signal of the intensity of the transmitted light transmitted through the workpiece to be processed to the analyzing unit 2.
  • the analyzing unit 2 calculates whether the processing capability of the solution satisfies the process requirement based on the intensity signal of the transmitted light transmitted through the workpiece to be processed obtained by the received optical monitoring unit 1.
  • the analyzing unit 2 may include a signal receiving subunit 21, a calculating subunit 22, and a signal transmitting subunit 23.
  • the signal receiving subunit 21 is configured to receive an intensity signal of the transmitted light transmitted from the processed workpiece obtained from the optical monitoring unit 1.
  • the calculation subunit 22 is configured to evaluate whether the processing capability of the solution satisfies the process requirements based on the intensity signal of the transmitted light from the signal receiving unit 21.
  • the calculation subunit 22 evaluates whether the processing capability of the solution is the same as the evaluation method in the method for monitoring the processing ability of the above solution, and will not be described again here.
  • the signal transmitting sub-unit 23 is configured to issue a corresponding solution processing capability to a bias or a high signal according to the calculation result of the calculating sub-unit 22.
  • the monitoring device for monitoring the processing capability of the solution may further include a moving unit (not shown) such as a base station or the like.
  • the optical monitoring unit 1 can be arranged on the mobile unit. By means of the mobile unit, the optical monitoring unit 1 can be placed at a desired position according to different processing environments or processing techniques, thereby increasing the flexibility of use of the optical monitoring unit 1, and even the entire monitoring device.
  • the monitoring device for monitoring the processing capability of the solution provided by the embodiment is to evaluate whether the processing capability of the solution satisfies the process requirement by the intensity of the transmitted light transmitted through the workpiece to be processed in real time, and can be processed intuitively and accurately.
  • the actual processing condition of the workpiece can thereby accurately determine the processing capability of the solution, and adjust the processing ability of the solution according to the judgment result, thereby avoiding waste of the solution due to erroneous judgment.
  • Embodiments of the present invention also provide an etching system that uses the monitoring device provided in this embodiment to monitor the use of the etching solution.
  • 2 is a schematic structural view of an etching system provided by the present invention.
  • the etching system of this embodiment includes an etchant tank 41, a monitoring device 42, a supply device 43, a nozzle 46, and a transfer device 44 for transporting the workpiece to be processed.
  • the etching solution tank 41 is used for storing the etching liquid
  • the monitoring device 42 is for monitoring whether the processing ability of the etching liquid in the etching liquid tank 41 satisfies the process requirements.
  • the supply device 43 is in communication with the etching solution tank 41 for replacing or adding the etching liquid according to the monitoring result of the monitoring device 42.
  • Transfer device 44 is used to transport the workpiece being processed during the etching process.
  • the nozzle 46 is in communication with the etching solution tank 41 through a pipe for spraying the etching liquid on the surface of the workpiece to be processed.
  • the monitoring device 42 is disposed on the flowing water production line of the workpiece to be processed, and the light emitting device 11 and the light receiving device 12 are disposed opposite to each other on the upper and lower sides of the workpiece 45 to be processed.
  • the light emitting device 11 emits light
  • the light receiving device 12 collects the light transmitted through the workpiece 45, and collects the light.
  • the intensity signal of the transmitted light transmitted through the workpiece 45 is transmitted to the analysis unit 2, and the analysis unit 2 evaluates whether the processing capability of the solution satisfies the process requirements based on the intensity signal of the transmitted light, and the solution processing capability is low or high.
  • the processing capability signal is sent to the supply device 43, and the supply device 43 replaces/adds a new engraved liquid to the etching solution tank 41 in response to a processing capability signal having a low or high solution processing capability.
  • a monitoring device 42 may be disposed on the flowing water production line of the workpiece 45 to be processed, and the monitoring device 42 uses the monitoring device for monitoring the processing capability of the solution provided by the embodiment, and the processing of the etching solution is monitored by the monitoring device. Whether the capability can meet the requirements of etching, so as to timely adjust the processing ability of the etching liquid in the etching liquid tank 41, thereby improving the etching effect.
  • the etching system of this embodiment can also be used to implement a development process. A developer is placed in the etching solution tank 41. During the development process, the photoresist peeling off (for example, removing) may change significantly during a certain period of time.
  • the photoresist does not significantly fall off, so the transmitted light is transmitted.
  • the rate is low and the change is not obvious.
  • the photoresist has substantially fallen off, and the transmittance of transmitted light has not changed significantly.
  • two monitoring devices 42 which are described in Fig. 3, may be disposed on the flowing water production line of the workpiece 45 to be processed.
  • One monitoring device 42 is used to monitor the lower limit of solution processing capability and the other monitoring device 42 is used to monitor the upper limit of solution processing capability.
  • the etching system provided by the embodiment provides the real-time monitoring of the transmitted light transmitted through the workpiece by the monitoring device provided by the embodiment, and evaluates whether the processing capability of the etching liquid satisfies the process requirements according to the intensity of the transmitted light. .
  • the etching system can intuitively and accurately reflect the actual processing condition of the workpiece to be processed, and thus can accurately determine the processing capability of the etching liquid, and then adjust the processing capability of the etching liquid according to the judgment result, thereby It is possible to avoid waste of etching liquid due to erroneous judgment.

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Abstract

一种监测溶液加工能力的方法及装置、刻蚀系统，该监测溶液加工能力的方法用于在溶液腐蚀被加工工件的流水生产线中监测所述溶液的加工能力是否满足工艺要求，包括以下步骤：在所述溶液腐蚀所述被加工工件的流水生产线的设定位置上，用光线照射所述被加工工件；获得设定位置处透过所述被加工工件的透射光的强度；根据透过所述被加工工件的透射光的强度评估所述溶液的加工能力是否满足工艺要求。该方法能够直观、准确地反应溶液的加工能力状况，从而可以避免因错误的判断而导致溶液的浪费。

Description

监测溶液加工能力的方法及装置、 刻蚀系统 技术领域
本发明的实施例涉及一种监测溶液加工能力的方法及装置、 刻蚀系统。 背景技术
显影和刻蚀工艺是薄膜晶体管液晶显示器（TFT-LCD )生产过程中常用 的加工方法。 显影工艺是将已曝光的光刻胶图样放入显影液中使图样显现出 来的工艺， 刻蚀工艺是使金属膜按照显影后的光刻胶图样刻蚀， 以获得所需 金属图样。
对于显影系统 /刻蚀系统而言， 显影工艺 /刻蚀工艺所需的显影液 /刻蚀液 通常是循环使用的，显影 ^/刻蚀液的浓度会随着生产过程而下降或随着生产 而可能被污染， 这将导致显影液 /刻蚀液的加工能力下降。 如果不及时的更换 或添加新的显影液 /刻蚀液， 则容易造成显影 /刻蚀不充分， 即出现欠显影 /欠 刻蚀现象。 因此， 在实际的生产过程中， 需要对显影液 /刻蚀液进行实时的监 测， 并根据监测结果更换或添加新的显影液 /刻蚀液， 以确保显影 /刻蚀的效 果。
目前所釆用的监测方法是通过对显影液 /刻蚀液的某些物理或化学性质， 如电导率， 进行监测而计算获得。 如果监测值超出能够满足显影 /刻蚀效果的 范围时， 更换显影液 /刻蚀液。 然而， 上述监测方法不能真实有效地对显影液 /刻蚀液的加工能力进行评估， 即不能真实有效地分析显影液 /刻蚀液的加工 能力是否能够满足工艺的要求， 从而容易造成显影效果 /刻蚀效果的不良， 或 者造成显影液 /刻蚀液的浪费。 发明内容
本发明的实施例针对现有技术中存在的上述缺陷， 提供一种监测溶液加 工能力的方法、 装置和系统， 可以实时、 准确地监测溶液的加工能力是否满 足工艺要求， 从而可以提高溶液的加工效果， 同时避免溶液的浪费。
本发明的一个方面提供了一种监测溶液加工能力的方法， 其用于在溶液 腐蚀被加工工件的流水生产线中监测所述溶液的加工能力， 包括以下步骤： 在所述溶液腐蚀所述被加工工件的流水生产线的设定位置上， 用光线照射所 述被加工工件； 获得设定位置处透过所述被加工工件的透射光的强度； 根据 透过所述被加工工件的透射光的强度评估所述溶液的加工能力是否满足工艺 要求。
对于该方法， 例如， 评估所述溶液的加工能力是否满足工艺要求的方式 可以包括： 所述透射光的强度包括透射光的下限监测强度， 用于监测溶液加 工能力的下限； 比较所述透射光的下限监测强度与预设的标准透射光的强度 的下限， 若所述透射光的下限监测强度小于或等于所述预设的标准透射光的 强度的下限， 则表明所述溶液的加工能力偏低； 或者， 根据所述透射光的下 限监测强度获得透射光的下限监测透过率， 比较所述透射光的下限监测透过 率与预设的标准透射光的透过率的下限， 若所述透射光的下限监测透过率小 于或等于所述预设的标准透射光的透过率的下限， 则表明所述溶液的加工能 力偏低。
对于该方法， 例如， 评估所述溶液的加工能力是否满足工艺要求的方式 可以包括： 所述透射光的强度还包括透射光的上限监测强度， 用于监测溶液 加工能力的上限； 比较所述透射光的上限监测强度与预设的标准透射光的强 度的上限， 若所述透射光的上限监测强度大于所述预设的标准透射光的强度 的上限， 则表明所述溶液的加工能力偏高； 或者， 根据所述透射光的上限监 测强度获得光的上限监测透过率， 比较所述透射光的上限监测透过率与预设 的标准透射光的透过率的上限， 若所述透射光的上限监测透过率大于所述预 设的标准透射光的透过率的上限， 则表明所述溶液的加工能力偏高。
本发明的另一个方面还提供一种监测溶液加工能力的监测装置， 其用于 在溶液腐蚀被加工工件的流水生产线上监测所述溶液的加工能力是否满足工 艺要求， 包括光学监控单元和分析单元。
光学监控单元， 用于在所述溶液腐蚀所述被加工工件的流水生产线的设 定位置上， 获得透过所述被加工工件的透射光的强度， 并将获得的透过所述 被加工工件的透射光的强度信号发送至分析单元；
分析单元， 根据接收到的所述光学监控单元获得的透过所述被加工工件 的透射光的强度信号计算所述溶液的加工能力是否满足工艺要求。 对于该监测装置， 例如， 所述光学监控单元可以包括光发射装置和光接 受装置， 其中， 所述光发射装置与所述光接受装置相对地设置在所述被加工 工件的两侧， 所述光发射装置用于朝向所述被加工工件表面发出光； 所述光 接受装置用于釆集由所述光发射装置发出的透过所述被加工工件的透射光， 并将其获得的透过所述被加工工件的透射光的强度信号发送至所述分析单 元。
对于该监测装置， 例如， 所述分析单元可以包括： 信号接收子单元， 其 用于接收来自所述光学监控单元获得的透过所述被加工工件的透射光的强度 信号； 计算子单元， 其用于根据来自所述信号接收子单元的透射光的强度信 号评估所述溶液的加工能力是否满足工艺要求； 信号发射子单元， 其用于根 据所述计算子单元计算的结果发出相应的溶液加工能力偏低或偏高的信号。
本发明的再一个方面还提供一种刻蚀系统， 包括刻蚀液罐、 监测装置以 及被加工工件的传输系统， 所述刻蚀液罐用于储存刻蚀液， 监测装置用于监 测所述刻蚀液的加工能力是否满足工艺要求， 所述传输系统用于在刻蚀过程 中传输被加工工件，所述监测装置釆用上述的监测溶液加工能力的监测装置。
该刻蚀系统， 例如， 还可以包括供给装置， 所述供给装置用于根据所述 监测装置的监测结果更换或添加刻蚀液。
该刻蚀系统， 例如， 可以包括两个所述监测装置， 所述两个以上个监测 装置设置在被加工工件的流水生产线上的不同位置， 分别用于监测溶液加工 能力的下限和上限。
例如， 所述的刻蚀系统可以用于显影工艺或者刻蚀工艺。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为发明提供的监测溶液加工能力的监测装置的结构框图；
图 2为本发明提供的刻蚀系统的结构简图； 以及
图 3为本发明提供的另一刻蚀系统的结构简图。 具体实施方式
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例的附图，对本发明实施例的技术方案进行清楚、 完整地描述。显然， 所描述的实施例是本发明的一部分实施例， 而不是全部的实施例。 基于所描 述的本发明的实施例， 本领域普通技术人员在无需创造性劳动的前提下所获 得的所有其他实施例， 都属于本发明保护的范围。
除非另作定义， 此处使用的技术术语或者科学术语应当为本发明所属领 域内具有一般技能的人士所理解的通常意义。 "一个" 或者 "一" 等类似词 语也不表示数量限制， 而是表示存在至少一个。 "包括" 或者 "包含" 等类 似的词语意指出现在 "包括" 或者 "包含" 前面的元件或者物件涵盖出现在 "包括" 或者 "包含" 后面列举的元件或者物件及其等同， 并不排除其他元 件或者物件。 "连接" 或者 "相连" 等类似的词语并非限定于物理的或者机 械的连接， 而是可以包括电性的连接， 不管是直接的还是间接的。 "上" 、 "下" 、 "左" 、 "右" 等仅用于表示相对位置关系， 当被描述对象的绝对 位置改变后， 则该相对位置关系也可能相应地改变。
本实施例提供的监测溶液加工能力的方法包括如下步骤。
步骤 slO, 在溶液腐蚀被加工工件的流水生产线的设定位置上， 用光线 照射所述被加工工件。
所使用的溶液可以根据具体的加工要求进行选择。 例如， 如果实施显影 工艺， 则溶液选择显影液； 如果实施刻蚀工艺， 则溶液选择刻蚀液。 被加工 工件可以是加工 TFT-LCD时的基板， 也可以是用于制作其它产品 （如电路 板） 时所釆用的基板。 这些被加工工件可以是透明或半透明的从而利于进行 检测； 对于不同的加工工件， 在后续的检测步骤之中釆取的评估标准也要相 应地调整。
步骤 s20, 获得设定位置处透过所述被加工工件的透射光的强度。
步骤 s30, 根据透过所述被加工工件的透射光的强度评估所述溶液的加 工能力是否满足工艺要求。
本实施例评估所述溶液的加工能力是否满足工艺要求的方式可以是比对 透射光的强度， 也可以是首先通过透射光的强度和入射光的强度计算出透射 光的透过率（透射光的强度 /入射光的强度） ， 然后比对透射光的透过率。 在步骤 s30中， 评估所述溶液的加工能力是否满足工艺要求的步骤可以 包括监测溶液加工能力的下限， 即评估透射光的下限监测强度。
例如， 在比较所述透射光的下限监测强度与预设的标准透射光的强度的 下限时， 若所述透射光的下限监测强度小于或等于所述预设的标准透射光的 强度的下限， 则表明所述溶液的加工能力偏低。 造成溶液加工能力偏低的原 因可能是溶液的浓度偏低或溶液已失效。
或者例如， 首先根据所述透射光的下限监测强度获得透射光的下限监测 透过率， 再比较所述透射光的下限监测透过率与预设的标准透射光的透过率 的下限， 若所述透射光的下限监测透过率小于或等于所述预设的标准透射光 的透过率的下限， 则表明所述溶液加工能力偏低。
优选地， 在步骤 s30中， 评估所述溶液的加工能力是否满足工艺要求的 步骤还可以包括监测溶液加工能力的上限， 即评估透射光的上限监测强度。
例如， 在比较透射光的上限监测强度与预设的标准透射光的强度的上限 时， 若透射光的上限监测强度大于预设的标准透射光的强度的上限， 则表明 溶液的加工能力偏高；
或者例如， 根据透射光的上限监测强度获得光的上限监测透过率， 比较 透射光的上限监测透过率与预设的标准透射光的透过率的上限， 若透射光的 上限监测透过率大于预设的标准透射光的透过率的上限， 则表明溶液的加工 能力偏高。
由于被加工工件在被溶液腐蚀的过程中， 由于溶液的有效成分被不断消 耗、 副产物生成等原因， 溶液的透射光的透过率不断地发生变化， 即透射光 的透过率与腐蚀程度相对应。 因此， 通过透过被加工工件的透射光的强度艮 容易获得溶液对被加工工件的加工状况。 如果在流水生产线上某一设定位置 得知被加工工件没有达到对应的理想加工状况， 则表明溶液的加工能力不能 满足加工要求。 加工状况未能达到理想的加工状况主要是由于腐蚀溶液的加 工能力较低， 导致加工状况滞后， 即腐蚀量较少、 程度不够， 因此需要更换 或添加新的溶液。 如果在流水生产线上某一设定位置得知被加工工件过早达 到某一加工状况， 则表明所述溶液加工能力偏高， 从而到生产线的终点时会 造成过度刻蚀。
本实施例提供的监测溶液加工能力的方法， 其是通过实时监测透过被加 工工件的透射光的强度来评估溶液的加工能力是否满足工艺要求， 其能够直 观、 准确地反应被加工工件的实际力。工状况， 由此可以准确地判断溶液的加 工能力状况， 并根据该判断结果对溶液的加工能力进行调整， 从而避免因错 误的判断而导致溶液的浪费。
本发明的实施例还提供一种监测溶液加工能力的监测装置， 用于在腐蚀 被加工工件的流水生产线的设定位置上监测溶液的加工能力是否满足工艺要 求。 图 1为发明提供的监测溶液加工能力的监测装置的结构框图。 请参阅图 1 ,该实施例的监测溶液加工能力的监测装置包括光学监控单元 1和分析单元 2。
光学监控单元 1 , 用于在溶液腐蚀被加工工件表面流水生产线的设定位 置上， 获得透过被加工工件的透射光的强度， 并将其获得的透过被加工工件 的透射光的强度的信号发送至分析单元 2。
光学监控单元 1可以包括光发射装置 11和光接受装置 12, 光发射装置 11与光接受装置 12相对地设置在被加工工件的两侧。
光发射装置 11用于朝向被加工工件发出光。 光发射装置 11可以釆用如 白炽灯、 LED灯、 激光发射器等光源。
光接受装置 12用于釆集由光发射装置 11发出且透过被加工工件的透射 光，并将其获得的透过被加工工件的透射光的强度的信号发送至分析单元 2。
分析单元 2, 根据接收到的光学监控单元 1获得的透过被加工工件的透 射光的强度信号计算溶液的加工能力是否满足工艺要求。
分析单元 2可以包括信号接收子单元 21、 计算子单元 22和信号发射子 单元 23。
信号接收子单元 21 ,用于接收来自光学监控单元 1获得的透过被加工工 件的透射光的强度信号。
计算子单元 22, 用于根据来自信号接收单元 21的透射光的强度信号评 估溶液的加工能力是否满足工艺要求。计算子单元 22评估溶液的加工能力是 否满足工艺要求与上述监测溶液加工能力的方法中的评估方法相同， 这里不 再赘述。
信号发射子单元 23 , 用于根据计算子单元 22的计算结果发出相应的溶 液加工能力偏氏或偏高的信号。 另外，监测溶液加工能力的监测装置还可以包括移动单元（图中未示出）， 例如基台等。 光学监控单元 1可以设置在移动单元上。 借助移动单元可以将 光学监控单元 1根据不同的加工环境或加工工艺设置在所需的位置， 从而提 高光学监控单元 1、 乃至整个监测装置的使用灵活性。
本实施例提供的监测溶液加工能力的监测装置， 其是通过实时监测到的 透过被加工工件的透射光的强度来评估溶液的加工能力是否满足工艺要求， 其能够直观、 准确地反应被加工工件的实际加工状况， 由此可以准确地判断 溶液的加工能力状况， 并根据该判断结果对溶液的加工能力进行调整， 从而 可以避免因错误的判断而导致溶液的浪费。
本发明的实施例还提供一种刻蚀系统， 其釆用本实施例提供的监测装置 来监测刻蚀液的使用状况。 图 2为本发明提供的刻蚀系统的结构简图。 请参 阅图 2, 该实施例的刻蚀系统包括刻蚀液罐 41、 监测装置 42、 供给装置 43、 喷嘴 46以及传输被加工工件的传输装置 44。 刻蚀液罐 41用于储存刻蚀液， 监测装置 42用于监测刻蚀液罐 41内刻蚀液的加工能力是否满足工艺要求。 供给装置 43与刻蚀液罐 41连通，用于根据监测装置 42的监测结果来更换或 添加刻蚀液。 传输装置 44是用于在刻蚀过程中传输被加工工件的。 喷嘴 46 通过管路与刻蚀液罐 41连通， 用于将刻蚀液喷洒在被加工工件的表面。
本实施例中，监测装置 42设置在被加工工件的流水生产线上，且光发射 装置 11和光接受装置 12相对地设置在被加工工件 45的上下两侧。在刻蚀过 程中， 当传输装置 44将被加工工件传输至监测装置 42位置时， 光发射装置 11发出光， 同时光接受装置 12釆集透过被加工工件 45的光， 并将釆集到的 透过被加工工件 45的透射光的强度信号传输至分析单元 2, 由分析单元 2根 据透射光的强度信号评估溶液的加工能力是否满足工艺要求， 并将溶液加工 能力偏低或偏高的加工能力信号发送至供给装置 43 , 供给装置 43根据溶液 加工能力偏低或偏高的加工能力信号相应地向刻蚀液罐 41 内更换 /添加新的 刻独液。
本实施例中，在被加工工件 45的流水生产线上可以设置有监测装置 42, 该监测装置 42釆用本实施例提供的监测溶液加工能力的监测装置，借助该监 测装置监测刻蚀液的加工能力是否可以满足刻蚀的要求， 从而及时对刻蚀液 罐 41内刻蚀液的加工能力进行调整， 进而提高刻蚀的效果。 本实施例的刻蚀系统也可以用于实施显影工艺。在刻蚀液罐 41内装入显 影液。 在显影的过程中， 光刻胶的脱落（例如去除）会在某一特定时间段有 明显的变化， 换言之， 在显影的初期， 光刻胶不会发生明显的脱落， 因此透 射光的透过率较低， 而且变化不明显。 另一方面， 在显影的后期， 光刻胶已 经基本脱落， 透射光的透过率也无不明显变化。
需要说明的是，在本实施例刻蚀系统中，在被加工工件 45的流水生产线 上可以设置两个监测装置 42, 如图 3所述。 一个监测装置 42用于监测溶液 加工能力的下限，另一个监测装置 42用于监测溶液加工能力的上限。借助两 个监测装置监测刻蚀液的加工能力是否可以满足刻蚀的要求， 可以更准确地 监测刻蚀液罐 41内刻蚀液的加工能力，以便及时对刻蚀液进行调整，从而提 高刻蚀系统的刻蚀效果。
本实施例提供的刻蚀系统， 借助本实施例提供的监测装置实时监测到的 透过被加工工件的透射光的强度， 并根据透射光的强度来评估刻蚀液的加工 能力是否满足工艺要求。 该刻蚀系统能够直观、 准确地反应被加工工件的实 际加工状况， 并由此可以准确地判断刻蚀液的加工能力状况， 才艮据该判断结 果对刻蚀液的加工能力进行调整， 从而可以避免因错误的判断而导致刻蚀液 的浪费。
以上所述仅是本发明的示范性实施方式， 而非用于限制本发明的保护范 围， 本发明的保护范围由所附的权利要求确定。

Claims

权利要求书
1. 一种监测溶液加工能力的方法，用于在溶液腐蚀被加工工件的流水生 产线中监测所述溶液的加工能力， 包括以下步骤：
在所述溶液腐蚀所述被加工工件的流水生产线的设定位置上， 用光线照 射所述被加工工件；
获得设定位置处透过所述被加工工件的透射光的强度；
根据透过所述被加工工件的透射光的强度评估所述溶液的加工能力是否 满足工艺要求。
2. 根据权利要求 1所述的监测溶液加工能力的方法， 其中， 评估所述溶 液的加工能力是否满足工艺要求的方式包括：
所述透射光的强度包括透射光的下限监测强度， 用于监测溶液加工能力 的下限；
比较所述透射光的下限监测强度与预设的标准透射光的强度的下限； 或 者，
根据所述透射光的下限监测强度获得透射光的下限监测透过率， 比较所 述透射光的下限监测透过率与预设的标准透射光的透过率的下限。
3. 根据权利要求 2所述的监测溶液加工能力的方法， 其中， 评估所述溶 液的加工能力是否满足工艺要求的方式包括为：
所述透射光的强度还包括透射光的上限监测强度， 用于监测溶液加工能 力的上限；
比较所述透射光的上限监测强度与预设的标准透射光的强度的上限； 或者， 根据所述透射光的上限监测强度获得光的上限监测透过率， 比较 所述透射光的上限监测透过率与预设的标准透射光的透过率的上限。
4. 一种监测溶液加工能力的监测装置，其用于在溶液腐蚀被加工工件的 流水生产线上监测所述溶液的加工能力， 包括光学监控单元和分析单元， 所述光学监控单元用于在所述溶液腐蚀所述被加工工件的流水生产线的 设定位置上， 获得透过所述被加工工件的透射光的强度， 并将获得的透过所 述被加工工件的透射光的强度信号发送至分析单元；
分析单元根据接收到的所述光学监控单元获得的透过所述被加工工件的 透射光的强度信号计算所述溶液的加工能力是否满足工艺要求。
5. 根据权利要求 4所述的监测溶液加工能力的监测装置， 其中， 所述光 学监控单元包括光发射装置和光接受装置， 所述光发射装置与所述光接受装 置相对地设置在所述被加工工件的两侧，
所述光发射装置用于朝向所述被加工工件表面发出光；
所述光接受装置用于釆集由所述光发射装置发出的透过所述被加工工件 的透射光， 并将其获得的透过所述被加工工件的透射光的强度信号发送至所 述分析单元。
6. 根据权利要求 4所述的监测溶液加工能力的监测装置， 其中， 所述分 析单元包括：
信号接收子单元， 其用于接收来自所述光学监控单元获得的透过所述被 加工工件的透射光的强度信号；
计算子单元， 其用于根据来自所述信号接收子单元的透射光的强度信号 评估所述溶液的加工能力是否满足工艺要求；
信号发射子单元， 其用于根据所述计算子单元计算的结果发出相应的溶 液加工能力偏低或偏高的信号。
7. 一种刻蚀系统，包括刻蚀液罐、监测装置以及被加工工件的传输系统， 其中， 所述刻蚀液罐用于储存刻蚀液， 监测装置用于监测所述刻蚀液的 加工能力是否满足工艺要求， 所述传输系统用于在刻蚀过程中传输被加工工 件，
其中， 所述监测装置釆用权利要求 5-6所述的监测溶液加工能力的监测 装置。
8. 根据权利要求 7所述的刻蚀系统， 还包括供给装置， 所述供给装置用 于根据所述监测装置的监测结果更换或添加刻蚀液。
9. 根据权利要求 7所述的刻蚀系统， 包括两个所述监测装置， 所述两个 以上个监测装置设置在被加工工件的流水生产线上的不同位置， 分别用于监 测溶液加工能力的下限和上限。
10. 根据权利要求 8-9任意一项所述的刻蚀系统， 其中， 所述的刻蚀系 统用于显影工艺。
PCT/CN2012/086224 2012-03-16 2012-12-07 监测溶液加工能力的方法及装置、刻蚀系统 WO2013135080A1 (zh)

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